TW200934661A - Stiffener and flexible printed circuit board with the same - Google Patents

Stiffener and flexible printed circuit board with the same Download PDF

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Publication number
TW200934661A
TW200934661A TW97105339A TW97105339A TW200934661A TW 200934661 A TW200934661 A TW 200934661A TW 97105339 A TW97105339 A TW 97105339A TW 97105339 A TW97105339 A TW 97105339A TW 200934661 A TW200934661 A TW 200934661A
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Taiwan
Prior art keywords
layer
reinforcing plate
circuit board
reinforcing
flexible circuit
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Application number
TW97105339A
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English (en)
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TWI364365B (en
Inventor
Yung-Wei Lai
Cheng-Wei Kuo
Shing-Tza Liou
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Foxconn Advanced Tech Inc
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Priority to TW97105339A priority Critical patent/TWI364365B/zh
Priority to US12/144,260 priority patent/US7985482B2/en
Publication of TW200934661A publication Critical patent/TW200934661A/zh
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Publication of TWI364365B publication Critical patent/TWI364365B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/42—Alternating layers, e.g. ABAB(C), AABBAABB(C)
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/546—Flexural strength; Flexion stiffness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/714—Inert, i.e. inert to chemical degradation, corrosion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31725—Of polyamide

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Laminated Bodies (AREA)

Description

200934661 九、發明說明： '【發明所屬之技術領域】 * 本發明涉及軟性電路板技術領域，特別涉及一種補強 板及包括該補強板之補強軟性電路板。 【先前技術】 隨著折疊行動電話與滑蓋行動電話等可折疊電子產品 之不斷發展，具有輕、薄、短、小以及可彎折特性之軟性 ® 印刷電路板（Flexible Printed Circuit Board，FPCB)被廣泛應 用於電子產品中，以實現不同電路之間之電性連接。為了 獲得具有更好撓折性能之FPCB，改善FPCB所用基膜材料 之撓折性能成為研究熱點。請參見文獻Electrical Insulation Maganize, Volume 5, Issue 1, Jan.-Feb.，1989 Papers: 15-23, “Applications of Polyimide Films to the Electrical and Electronic Industries in Japan” 。 0 為滿足可折疊電子產品多功能化之設計需求，安裝於 FPCB表面之電子元器件之數量亦相應增加。惟，與硬性電 路板相比，FPCB機械強度小、承載能力低，於使用過程中， 如表面貼裝工藝（Surface Mount Technology，SMT )中安 裝電子器件時，FPCB易龜裂或受損，無法承載較大重量或 較多數量之電子器件，阻礙可折疊電子產品向多功能化之 發展。目前，如圖1所示，業界一般將由聚隨亞胺 (Polyimide，PI)材料製成之加強片110藉由由環氧樹脂 製成之膠黏層120壓合於軟性基板130表面，以製作具有 7 200934661 較高承載能力之補強FPCB10。惟，PI與環氧樹脂之熱膨服 係數（Coefficient of Thermal Expansion’ CET)不同，於a .合膠黏層120與加強片丨1〇於軟性基板13〇過程中，包= PI之加強片110與包含環氧樹脂膠黏層12〇加熱時，兩層 之膨脹與收縮程度不同，容易引起補強FPCB10發生翹曲， 增加後續表面貼裝電子元器件之難度。 0【發明内容】 有鑑於此，提供一種補強板及包括該補強板之補強軟 性電路板，以增加軟性電路板之機械強度，並避免軟性電 路板發生輕曲實屬必要。 以下將以複數實施例說明一種補強板及包括該補強板 之補強軟性電路板。 該補強板，其由至少一層聚醯亞胺層與至少一層聚醯 ㈣亞胺層交替排列形成。該聚㈣醯亞胺層由聚酿胺醯 亞胺材料組成，該聚醯胺醯亞胺材料之結構通式A為：
"中Ar及Ar為芳香環取代基，n大於或等於卜 _ °亥補強軟性電路板，其包括軟性電路板及貼合於軟性 電路板之補強板。該補強板由至少一層聚醯亞胺層與至少 200934661 一層聚胺隨亞胺層交替排列形成，該聚醯胺醯亞胺層由 聚酿胺醯亞胺材料組成’該聚醯胺醯亞胺材料之結構通式a
其中Ar及Ar’為芳香環取代基，η大於或等於1。 ❹ 义 與先前技術相比，該補強板採用具有結構通式A之聚 醯胺醯亞胺層製作，由於該聚醯胺醯亞胺之熱膨脹係數與 聚醯亞胺之熱膨脹係數相近，即聚醯胺醯亞胺與聚醯亞胺 文熱後之膨脹與收縮率相近。因此，包括該補強板之軟性 電路板不容易發生翹曲’提高了結構穩定性，方便後續製 程之操作。 〇【實施方式】 下面將結合附圖及複數實施例對本技術方案實施例提 供之補強板及包括該補強板之補強軟性電路板作進一步詳 細說明。 由於補強板之實際厚度很薄，且沿寬度方向上具有相 同之結構’為清楚表明補強板之結構，以下將結合補強板 局部剖面放大圖詳細說明補強板之結構（如圖2、圖3及圖 4所示）。相同地，亦採用局部剖面放大圖說明補強軟性電 路板之結構（如圖5及圖6所示），以方便理解。 200934661 請參閱圖2，本技術方案第一實施例提供之補強板2〇， 用於貼合於軟性電路板，以提高軟性電路板之機械性能。 該補強板20由至少一層PI層210與至少一層聚醯胺醯亞 胺（Polyamideimide，PAI)層 220 交替排列形成。ρι 層 2 j 〇 之層數為N，PAI層220之層數為Μ。.根據電路板之不同設 計需要，ΡΙ層210之層數Ν與ΡΑΙ層220之層數Μ之數值 可相等或不相等’因此補強板20之相對兩最外側可能同時 為ΡΙ層210、或同時為ραι層220或一側為？1層21〇而另 一側為ΡΑΙ層220。該補強板20厚度為25# m〜250# m。 其中，？1層210厚度為25//111〜75//111，或者伙1層22〇厚 度為25#m〜75#m，可根據設計需要決定耵層21〇厚度與 PAI層220厚度’只要滿足補強板20之總厚度為25 # m〜25〇 # m即可。 本實施例中’該補強板20為包括三層PI層21〇與兩 層PAI層220之五層複合補強板，即：n=3，M=2。該pAl ❹層220位於兩層PI層210之間，用於黏結相鄰兩？1層21〇, 以形成補強板20。該補強板20之最外侧為ρι声2丨〇。兮 最外側之PI層210用於與軟性電路板貼合。當然，補強板 20包括PI層210及PAI層22〇之層數不限，可根據^同設 計需要來決定，只要N=M+1 (即··最外側為ρι層21〇)即 "5J" 〇 該PAI層220自PAI材料組成，該pAI材料之結構通 式A為： 200934661 Η
X Ο η c — Ν—Ar'- *>ν Λ η 其中Ar及Αγ為芳香環取代基，例如：
^\cjX 阳、叫〜<^-、0^CNs〇望丄 © β „AT . 專，η大於或等於1() —,亥PAIJT猎由二胺單體與苯三甲酸野反應得到含 胺基二羧酸早體’即二醯亞胺二羧酸單體；然後與， 體進行縮聚反應獲得。當然，pAI亦可藉 ^ π 口西制稽由具他方法製備潜 侍，/、要1備之ΡΑΙ具有結構通式Α即可。 該ΡΑΙ材料之結構通式Α之分子鍵上包含芳香族酿亞 胺基團。該芳香族醯亞胺基團同樣亦存在於？1材料之分子 鍵上’因此PAI材料具有與PI材料相似之性能。例如，良 ❹好之可撓折性、耐熱性及耐化學藥品之性能，且pAi材才= 之熱膨脹係數為22xl〇·6〜33xl0-6K-i，其與ρι材料之熱膨脹 係數相近。另外’該PAI材料炫融狀態時流動性好，並具 有較好之黏結力，因此，於加熱由pAI層22〇黏結ρι層2⑺ 製作之補強板20時，pa：[材料與^材料之膨脹與收縮程度 趨於一致，可避免補強板20發生翹曲。 請參閱圖3，本技術方案第二實施例提供之補強板3〇 之結構與本技術方案第一實施例提供之補強板2〇結構相 同’區別在於’ PI層310之層數為n與PAI層320之層數 200934661 ，為Μ相同，即M=N。本實施例f，補強板％為包括兩声 • PI一層一 310與兩層pAI層32〇之四層複合補強板，即: Μ N 2此時，該補強板30之相對兩最外側為一側為ρί 層3】0,另一側為ΡΑΙ層320。該最外側之打層31〇或ρΑί 層320均可用於與軟性電路板貼合。 請參閱圖4’本技術方案第三實施例提供之補強板4〇 之結構與本技術方案第一實施例提供之補強板20結構相 ❹同區別在於，ΡΙ層410之層數為Ν與ΡΑΙ層420之層數 為Μ之關係、為M=N+卜本實施例中，補強板⑽包括一層 Π層410及貼合於？1層41〇相對兩側面之兩層伙〗層“ο曰， 即· M—2 ’ N=：1。該補強板40之相對兩最外側同時為PAI 層42^。該最外側之PAI層42〇用於與軟性電路板貼合。 請參閱圖5，以包括本技術方案第一實施例提供之補強 板20之軟性電路板為例介紹本技術方案第四實施例提供之 補強軟性電路板50，其包括軟性電路板510、補強板20以 ©及膠黏層520。該軟性電路板51〇係由覆金屬基材經過一系 歹J製作工藝’如製作線路、導通孔、貼附保護膜或電鑛等 工藝’製作而成之單面或雙面之單層或多層電路基板。該 軟性電路板510具有-補強面511，用於與補強板2〇貼合。 該補強板2 〇藉由膠黏層5 2 〇貼合於軟性電路板5 i 〇之
補強面5U。本實施例中，位於補強板20之最外側之為PI 層210。該PI層21G經膠黏層520貼合於軟性電路板51〇 之補強面511。 該膠黏層520厚度為25#m〜7〇#m。本實施例中，膠 12 200934661
黏層520由PAI材料組成，該pAI材料之結構通式八為：
其中Ar及Ar’為芳香環取代基，例如：
ch4
\jX 等，n大於或等於j。 PAI材料熔融狀態時流動性好，具有較好之黏結力，且 PAI材料之熱膨脹係數為22xl〇-6〜33χΚΓ6Κ-ι。同理可知， 錯由膠黏層520黏結軟性電路板51〇與補強板2〇製作之補 強軟性電路板50於加熱時，膠黏層52〇之pAi材料與補強 板20之PI材料之膨脹與收縮程度趨於—致，可避免補強 軟性電路板50發生翹曲。 ❿ 彳理解，補強軟性電路板亦可為包括第二實施例提 i、之補強板30或第二貫施例提供之補強板4〇之軟性電路 板510，以增加軟性電路板510之機械強度。 月，閱圖6以包括本技術方案第一實施例提供之補強 板20之軟性電路板為例介紹本技術方案第五實施例提供之 補強，J·生電路板6G ’其結構與補強軟性電路板％之結構相 似區別在於補強板20直接貼合於軟性電路板6丨〇形成補 強軟性電路板60，而沒有使用膝黏劑。該軟性電路板610 之補強面011與補強板2〇接觸並貼合。 13 200934661 本實施例中’位於補強板20之最外側之為？1層21〇。 pi層熔融狀態時流動性較好’亦具有黏結 =側之…可起膠黏劑咖 軟性電路板610貼合。 〃、 可理解’補強軟性電路板60亦可為包括第二實 供之補強板30或第三實施例提供之補強板4〇之軟性 板610，以增加軟性電路板61〇之機械強度。 书 〇 此外，PAI材料與PI材料均具有黏性，pAi材料 ^力較Η材料之黏結力更佳。因此，為保證㈣軟性電路 會發生剝離或分層，優選地，使用ΡΑΙ材料製作最 綜上所述，本發明確已符合發明專利之要件， 提出專利申請。惟，以上所述者僅為本發明之較佳實施又方 式γ自不能以此限制本案之申請專利範圍。舉凡熟悉本 技藝之人士援依本發明之精神所作之等效修飾或變化，比 ©應涵蓋於以下申請專利範圍内。 白 【圖式簡單說明】 圖2 面放大圖 圖1係先前技術提供之補強FPCB之剖面圖 係本技術方㈣-實施例提供之補強板之局部^ 圖3係本技術方案第二實 面放大圖。 細*例&供之補強板之局部剖 之補強板之局部剖 圖4係本技術方案第三實施例提供 面放大圖。 14 200934661 圖5係本技術方案第四實施例提供之補強軟性 之局部剖面放大圖。 圖6係本技術方案第 之局部剖面放大圖。 五實施例提供之補強軟性 電路板 電路板 【主要元件符號說明】 補強FPCB ©加強片 膠黏層 軟性基板 補強板 Π層 PAI層 補強軟性電路板 &十生電路板 ❹補強面 10 110 120 ， 520 130 20 ， 30 ， 40 210 ， 310 ， 410 220 ， 320 ， 420 50，60 510 ， 610 511 > 611 15

Claims (1)

  1. 200934661 十、申請專利範圍： 1. 一種補強板’其改進在於，其由至少一層聚醯亞胺層與至 少一層聚臨胺醯亞胺層交替排列形成，該聚醯胺醯亞胺層 由聚酸胺醯亞胺材料組成，該聚醯胺醯亞胺材料之結構通 式A為： Η 0 丨: --Ν —C ❹
    -Ar—Ο- -<3- 八 N C η 其中Ar及Ar為芳香環取代基，η大於或等於1。 2. 如申3月專利範圍帛i項所述之補強板，其巾，該補強板厚 度為25//m〜250以m。 3. 如申請專利範圍第2項所述之補強板，其中，該聚酿亞胺 層之厚度為25 // m〜75 # m。 4·如申請專利範圍第2項所述之補強板，其中，該聚酿胺酿 ❾亞胺層之厚度為25# m〜75 /z m。 5. ”請專利範圍第1項所述之補強板，其中，該聚醯胺醯 亞胺之熱膨脹係數為22χ1〇·6~33χ1〇_6κ」。 7. 16 200934661 補強板藉由膠黏層貼合於軟性電路板，該膠黏屉 θ田λ灵酸 酿亞胺材料組成’該聚醯胺醯亞胺材料之結構通式 牧 r ^ ^ J A 為： η 〇 y γ ' N Ar '、 -i—C_YY，C\ /CVX 彳 H lXc“〇-N\c/Qi 11 其中AU Ar，為芳香環取代基，n大於或等於1。 ， 9·如申料職_8項所述 膠黏層之聚醯㈣亞胺之熱膨脹係 1〇.如申請專利範圍第8項所述之 該膠黏層厚度為25# m〜70 #ιη。 人性電路板，其中，
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TWI401450B (zh) * 2010-01-11 2013-07-11 Zhen Ding Technology Co Ltd 軟性電路板之檢測方法

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TWI711349B (zh) 2019-06-28 2020-11-21 連展科技股份有限公司 可撓電路板

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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