200932505 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種電子裝置殼體及其製造方法。 【先前技術】 隨著移動通訊技術之發展，各式各樣之電子裝置如行動 電話等競相湧現，令消費者可隨時隨地充分享受移動技術帶 來之種種通訊便利，而這些電子裝置之附加功能如攝像功能 A 等又為人們提供了除通訊外之其他便利。 〇 在製造帶閃光燈之行動電話攝像頭時，行動電話殼體上 於所述閃光燈處開設有一安裝孔，在該安裝孔上需蓋設一透 明塑膠蓋體以保護内置閃光燈。習知行動電話殼體安裝孔上 蓋設塑膠蓋體之方法為將蓋體採用超聲波焊接或雙面膠黏 接之方式將所述蓋體結合於行動電話殼體上。採用超聲波焊 接之方式，焊接時容易出現蓋體及殼體焊接面熔結不均之現 象，造成產品之品質不穩定；而採用雙面膠黏接之方式，一 ❹ 方面難以達到黏接之強度要求，致使產品抗拉強度低，另一 方面雙面膠黏接之方式需增加雙面膠之成本及操作時之人 工成本，從而提高了產品之成本。 【發明内容】 鑒於此，有必要提供一種蓋體與殼體結合品質較好之電 子裝置殼體及其製造方法。 一種電子裝置殼體，其包括一基體及一蓋體，所述蓋體 以鐳射焊接之方式結合於所述基體上。 200932505 一種電子裝置殼體之製造方法，其包括以下步驟： 提供一基體及一蓋體，所述基體上開設有一安裝孔，所 述蓋體為透明蓋體； 將所述蓋體貼合於基體之安裝孔處； 提供一鐳射光源，該鐳射光源發出鐳射光束透過所述蓋 體投射於基體上； 所述鐳射光束將基體所需要焊接之部位熔融，將所述蓋 _ 體焊接於基體上。 〇 本發明電子裝置殼體之蓋體通過鐳射焊接之方式結合 於基體之安裝孔處，蓋體與基體之結合力強，產品抗跌落性 好、抗拉強度高，使用效果更佳。 【實施方式】 請參閱圖1至圖2，本發明電子裝置殼體100包括一基 體10及一設置於基體10上之蓋體20。 基體10可以係行動電話、照相機或其他電子裝置等具 © 有安裝孔之殼體，該安裝孔可以係電子裝置之閃光燈之安裝 孔或鏡頭安裝孔。基體10為一不透明之塑膠製品，其可以 通過注塑成型之方法製成。該塑膠材料可選自為聚丙烯、聚 乙烯、聚醯胺、聚氯乙烯、丙烯睛-苯乙烯-丁二烯共聚合物 等熱塑性塑膠。該基體10優選為丙烯睛-苯乙烯-丁二烯共聚 合物塑膠材料。 基體10上開設有一安裝孔101，基體10上圍繞該安裝 孔101形成有一結合帶103，該結合帶103凹陷於所述基體 200932505 10中。結合帶103距離基體10外表面之高度與所述蓋體20 之厚度相當。 蓋體20為一透明塑膠製品，該透明蓋體20 —方面可保 護產品之内置閃光燈，另一方面使閃光燈發出之光線可透過 該蓋體20而發揮其作用。蓋體20之材料可選自為聚甲基丙 烯酸曱酯、聚碳酸酯或聚苯乙烯等透明塑膠材料。製作時， 所述蓋體20之材料與基體10之材料熔融溫度相當。 A 請進一步參閱圖3,蓋體20包括一結合面201，該結合 ◎ 面201之周緣處形成有一結合區2011，該結合區2011之形 狀及大小與所述結合帶103相當。 再請參閱圖4，本發明電子裝置殼體100之製作方法， 將蓋體20之結合面201之結合區2011與基體10之結合帶 103相貼合。提供一鐳射光源（圖未示出），該鐳射光源發出 鐳射光束30，該鐳射光束30透過該蓋體20而聚焦於基體 10之結合帶103上，即可將基體10之結合帶103之表面局 Q 部熔融，使蓋體20焊接於基體10上。 可以理解，基體10亦可以為具有凹陷面結構之基體， 在基體10之凹陷面處形成一結合帶；蓋體20為橫截面為弧 形之蓋體，蓋體20之凹陷面之周緣處形成一結合區，將蓋 體20之結合區貼合於基體10之結合帶上，再進行鐳射焊接。 對本發明電子裝置殼體100進行了拉拔力測試、抗跌落 測試及抗冷熱衝擊性測試，測試結果及條件見表1，測試方 法如下： 200932505 拉拔力測試：妝士 試治具中，用壓碩:本f明電子裝置殼體100放入拉拔力測 之大」、。 4推蓋體2〇直至破壞，記錄該壓頭擠推力 抗跌洛測試.脸 中，測試儀帶動明電子裝置殼體_放入測試儀 电子裝置殼體1〇〇進行旋轉運動，使該殼 體100於〇.5m南度處每分鐘跌落13 :欠，共跌落180次；然 後再使該殼體1〇0於高度處每分鐘跌落12次，共跌落 ❹ 120次，完成後檢查該電子裝置殼體1〇〇。 抗冷熱衝擊性測試：首先將本發明電子裝置殼體1〇〇置 於-40°C測試室内保持2小時，然後轉移到85。(：測試室内再 保持2小時’轉移時間小於3分鐘。重複此步驟5次，迴圈 完成後立即檢查該電子裝置殼體100。 請參閱表1所示’本發明電子裝置殼體1〇〇之蓋體20 通過鐳射焊接之方式結合於基體10上，蓋體20與基體1〇 之間之拉拔力高、結合力強，抗跌落性好。 ❹ _____一表1 測試項目 測試結果 測試條件 拉拔力 100N 初始壓力3N，加壓速度l〇mm/min 抗跌落性 通過 0.5m高度每分鐘跌落13次，共跌 落180次’再於im高度每分鐘跌 落12次，共跌落12〇次 抗冷熱衝擊性 通過 1. -40°C〜，循環5次 200932505 【圖式簡單說明】 圖1係本發明較佳實施方式之電子裝置殼體之立體 組裝示意圖。 圖2係本發明較佳實施方式之電子裝置殼體之立體 分解示意圖。 圖3係圖2中蓋體之另一視角立體示意圖。 圖4係圖1中沿IV-IV方向之剖視放大圖。 【主要元件符號說明】 ❹ 電子裝置殼體 100 基體 10 蓋體 20 安裝孔 101 結合帶 103 結合面 201 結合區 2011 鐳射光束 30 11200932505 IX. Description of the Invention: [Technical Field] The present invention relates to an electronic device housing and a method of manufacturing the same. [Prior Art] With the development of mobile communication technology, various electronic devices such as mobile phones have emerged, enabling consumers to fully enjoy the communication convenience brought by mobile technology anytime and anywhere, and the additional functions of these electronic devices. For example, the camera function A and the like provide people with other conveniences besides communication. 〇 When manufacturing a mobile phone camera with a flash, a mounting hole is formed in the flash phone housing, and a transparent plastic cover is required on the mounting hole to protect the built-in flash. The cover of the conventional mobile phone housing is provided by attaching the cover to the mobile phone casing by ultrasonic welding or double-sided adhesive bonding. Ultrasonic welding is adopted, which is prone to uneven welding of the welding surface of the cover and the casing, resulting in unstable quality of the product; and the double-sided adhesive bonding method makes it difficult to achieve the bonding strength in one aspect. The requirement is that the tensile strength of the product is low, and on the other hand, the method of double-sided adhesive bonding needs to increase the cost of the double-sided adhesive and the labor cost during operation, thereby increasing the cost of the product. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide an electronic device housing having a good combination of a cover body and a housing, and a method of manufacturing the same. An electronic device housing includes a base body and a cover body, and the cover body is coupled to the base body by laser welding. 200932505 The manufacturing method of the electronic device housing comprises the following steps: providing a base body and a cover body, wherein the base body defines a mounting hole, the cover body is a transparent cover body; and the cover body is attached to the base body Providing a laser light source, the laser light source emits a laser beam and is projected onto the substrate through the cover body; the laser beam melts a portion of the base body to be welded, and the cover body is welded to the base body. The cover body of the electronic device casing of the present invention is bonded to the mounting hole of the base body by means of laser welding, and the bonding force between the cover body and the base body is strong, and the product has good drop resistance, high tensile strength and better use effect. [Embodiment] Referring to FIG. 1 to FIG. 2, an electronic device housing 100 of the present invention includes a base 10 and a cover 20 disposed on the base 10. The base 10 can be a mobile phone, a camera or other electronic device, such as a housing having a mounting hole, which can be a mounting hole or a lens mounting hole of the flash of the electronic device. The base 10 is an opaque plastic article which can be formed by injection molding. The plastic material may be selected from the group consisting of thermoplastics such as polypropylene, polyethylene, polyamide, polyvinyl chloride, acrylonitrile-styrene-butadiene copolymer. The substrate 10 is preferably a acrylonitrile-styrene-butadiene copolymer plastic material. A mounting hole 101 is defined in the base 10, and a binding tape 103 is formed on the base 10 around the mounting hole 101. The bonding tape 103 is recessed in the base body 200932505 10. The height of the bonding tape 103 from the outer surface of the base 10 is comparable to the thickness of the cover 20. The cover 20 is a transparent plastic product which protects the built-in flash of the product, and the light emitted from the flash can be transmitted through the cover 20. The material of the cover 20 may be selected from transparent plastic materials such as polymethyl methacrylate, polycarbonate or polystyrene. At the time of manufacture, the material of the cover 20 is equivalent to the melting temperature of the material of the substrate 10. A. Referring to FIG. 3, the cover 20 includes a joint surface 201. The joint ◎ has a joint area 2011 formed at the periphery of the surface 201. The joint area 2011 has a shape and a size corresponding to the joint belt 103. Referring to FIG. 4, in the manufacturing method of the electronic device casing 100 of the present invention, the bonding region 2011 of the bonding surface 201 of the cover 20 is bonded to the bonding tape 103 of the substrate 10. A laser source (not shown) is provided. The laser source emits a laser beam 30. The laser beam 30 is transmitted through the cover 20 to the bonding tape 103 of the substrate 10, thereby bonding the surface of the bonding tape 103 of the substrate 10. The Q portion is melted, and the lid body 20 is welded to the base 10. It can be understood that the base body 10 can also be a base body having a concave surface structure, and a joint belt is formed at the concave surface of the base body 10; the cover body 20 is a cover body having a curved cross section, and the periphery of the concave surface of the cover body 20 is formed. In a bonding zone, the bonding area of the cover 20 is attached to the bonding tape of the substrate 10, and then laser welding is performed. The pullout force test, the drop resistance test and the cold shock resistance test of the electronic device housing 100 of the present invention are performed. The test results and conditions are shown in Table 1. The test method is as follows: 200932505 Pull force test: used in the tester Pressing the master: The electronic device housing 100 is placed in the drawing force. 4Push the cover 2〇 until it breaks, record the indenter thrust thrust drop test. In the face, the tester drives the electronic device housing _ into the tester electronics housing 1〇〇 to make a rotary motion to make the shell 100 〇 〇 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 The housing is 1 〇〇. Anti-cold thermal shock test: The electronic device housing 1 of the present invention was first placed in a -40 ° C test chamber for 2 hours and then transferred to 85. (: The test chamber is kept for another 2 hours. The transfer time is less than 3 minutes. This step is repeated 5 times, and the electronic device housing 100 is inspected immediately after the loop is completed. Please refer to Table 1 for the electronic device housing 1 of the present invention. The cover body 20 is bonded to the base body 10 by laser welding, and the drawing force between the cover body 20 and the base body 1〇 is high, the bonding force is strong, and the drop resistance is good. ❹ _____ Table 1 Test item test result test Conditional drawing force 100N Initial pressure 3N, pressurizing speed l〇mm/min Anti-dropping falls 13 times per minute through 0.5m height, drops a total of 180 times' and then falls 12 times per minute at im height, a total of 12 times FIG. 1 is a schematic perspective view of an electronic device housing according to a preferred embodiment of the present invention. FIG. 2 is a preferred embodiment of the present invention. FIG. Fig. 3 is a perspective view showing another embodiment of the cover body of Fig. 2. Fig. 4 is an enlarged cross-sectional view taken along line IV-IV of Fig. 1. [Description of main components] ❹ Electronic device housing 100 Cover mounting hole 10 20 101 2011 Laser beam 201 binding binding binding zone 103 surface 3011