JP5877685B2 - Enclosure for electronic equipment - Google Patents

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JP5877685B2
JP5877685B2 JP2011233600A JP2011233600A JP5877685B2 JP 5877685 B2 JP5877685 B2 JP 5877685B2 JP 2011233600 A JP2011233600 A JP 2011233600A JP 2011233600 A JP2011233600 A JP 2011233600A JP 5877685 B2 JP5877685 B2 JP 5877685B2
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frame
elastic member
mold
electronic device
display board
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JP2013093398A (en
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知彦 桑原
知彦 桑原
信幸 昼間
信幸 昼間
敏嗣 矢嶋
敏嗣 矢嶋
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Shin Etsu Polymer Co Ltd
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Shin Etsu Polymer Co Ltd
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本発明は、電子機器の外側を構成する電子機器用筐体に関する。 The present invention relates to electronics housing constituting an outer electronic appliance.

電子機器は、一般的に、その外側を覆う筐体に窓部を形成し、当該窓部に表示部に相当する透明板を固定し、当該透明板を通じて様々な表示を実現する。電子機器に対する様々な要求が高まる中、電子機器の防水性および薄型化に対する要求も高くなってきている。電子機器の防水を図る場合、電子機器の表示部は、筐体と異なる材料を接続して構成されることから、少なくともその接続部分の防水を図る必要がある。表示部の防水を図る技術は、その一例として、特許文献1に開示されている。   In general, an electronic device forms a window portion in a casing that covers the outside thereof, a transparent plate corresponding to the display portion is fixed to the window portion, and various displays are realized through the transparent plate. As various demands for electronic devices increase, the demand for waterproofness and thinning of electronic devices has also increased. When waterproofing an electronic device, since the display unit of the electronic device is configured by connecting a material different from that of the housing, at least the connection portion needs to be waterproofed. A technique for waterproofing the display unit is disclosed in Patent Document 1 as an example.

ここで、従来から公知の典型的な表示部の防水構造を説明する。図11は、従来の電子機器の外側を構成する筐体の斜視図を示す。図12は、そのL−L線断面図およびその一部Mの拡大図を示す。筐体20は、筐体20の主要構成体であるフレーム20aと、その表側の面を貫通して形成される表示用の窓部21の裏側から固定される透明な表示板22とを備える。表示板22は、窓部21より若干広い面積で形成されており、窓部21の外周囲の裏側に、弾性接着層23を介して接着固定されている。   Here, a conventionally known typical waterproof structure of a display unit will be described. FIG. 11 is a perspective view of a housing constituting the outside of a conventional electronic device. FIG. 12 shows a sectional view taken along line LL and an enlarged view of a part M thereof. The housing 20 includes a frame 20a that is a main component of the housing 20, and a transparent display plate 22 that is fixed from the back side of the display window portion 21 that is formed through the front surface. The display panel 22 is formed with an area slightly larger than the window portion 21, and is bonded and fixed to the back side of the outer periphery of the window portion 21 via an elastic adhesive layer 23.

特開2009−141210号公報JP 2009-141210 A

しかし、フレーム20aと表示板22とをその厚さ方向に重ねると、電子機器の総厚が増し、薄型化の障害になる。また、表示板22とフレーム20aの窓部21とを同一平面に配置して、両者21,22の端面同士を接着剤若しくは弾性部材にて接続する方法も考えられるが、端面同士の接続では接着強度が低くなり、表示板22が窓部21から脱落し、あるいは接着剤若しくは弾性部材の一部が剥がれることによって防水性の低下を招く危険性がある。   However, if the frame 20a and the display panel 22 are stacked in the thickness direction, the total thickness of the electronic device increases, which becomes an obstacle to thinning. Further, a method of arranging the display plate 22 and the window portion 21 of the frame 20a on the same plane and connecting the end faces of the both 21 and 22 with an adhesive or an elastic member is conceivable. There is a risk that the strength is lowered and the display panel 22 is dropped from the window portion 21 or a part of the adhesive or the elastic member is peeled off, resulting in a decrease in waterproofness.

本発明は、上記のような要求および問題に鑑みてなされたものであって、電子機器の薄型化お高い防水性を備える電子機器用筐体を提供することを目的とする。   The present invention has been made in view of the above demands and problems, and an object of the present invention is to provide an electronic device casing having a thin electronic device and a high waterproof property.

上記目的を達成するための本発明の一形態は、電子機器の外側を覆う電子機器用筐体であって、筐体用のフレームと、フレームを貫通する窓部に配置される透明な表示板と、窓部の内側端面と表示板とを連接する弾性部材とを備え、表示板の裏面と窓部の外側に位置するフレームの裏面とを面一に形成し、弾性部材によって表示板における表側の面の外周囲の少なくとも一部を覆っている電子機器用筐体である。   To achieve the above object, one embodiment of the present invention is an electronic device casing that covers the outside of an electronic device, and includes a frame for the casing and a transparent display plate disposed in a window that penetrates the frame. And an elastic member that connects the inner end face of the window portion and the display plate, the back surface of the display plate and the back surface of the frame located outside the window portion are formed flush with each other, and the front side of the display plate is formed by the elastic member It is the housing | casing for electronic devices which covers at least one part of the outer periphery of the surface of this.

また、本発明の別の形態は、さらに、表示板の裏面と、フレームの裏面と、弾性部材の裏面とを面一に形成している電子機器用筐体である。   Another embodiment of the present invention is an electronic device casing in which the back surface of the display panel, the back surface of the frame, and the back surface of the elastic member are formed flush with each other.

また、本発明の別の形態は、さらに、弾性部材がフレームの少なくとも表側の面を覆っている電子機器用筐体である。   Another embodiment of the present invention is an electronic device casing in which the elastic member further covers at least the front surface of the frame.

また、本発明の一形態は、電子機器の外側を構成し、筐体用のフレームと、フレームを貫通する窓部に配置される透明な表示板と、窓部の内側端面と表示板とを連接する弾性部材とを備える電子機器用筐体の製造方法であって、フレームを、弾性部材の成形用金型を構成する第一金型にセットするフレームセット工程と、表示板の裏面と窓部の外側に位置するフレームの裏面とを面一に保持するように、窓部の直下に位置する第一金型に表示板を配置する表示板配置工程と、フレームおよび表示板を配置した第一金型の上から、表示板の表側の面との間に空間を形成するための凹部を備える第二金型を配置する金型セット工程と、第一金型と第二金型との間に形成される空間であって、表示板と窓部との隙間および表示板の表側の面と凹部との隙間を少なくとも含む空間に、弾性部材を形成するためのエラストマー組成物を供給するエラストマー供給工程と、エラストマー組成物を硬化する硬化工程と、硬化工程後に、表示板の表側の面において、その外周囲の一部を残して、その外周囲より内方の弾性部材を取り除き、表示板の外周囲より内方を露出する露出工程と、を含む電子機器用筐体の製造方法である。   In one embodiment of the present invention, an electronic apparatus includes an outer frame, a frame for a housing, a transparent display plate disposed in a window portion penetrating the frame, an inner end surface of the window portion, and a display plate. A method for manufacturing a casing for an electronic device comprising a connecting elastic member, a frame setting step for setting a frame on a first mold constituting a molding die for the elastic member, a back surface of a display plate, and a window A display plate disposing step of disposing the display plate in the first mold located directly under the window so that the back surface of the frame located outside the portion is flush with the first, and a first disposing the frame and the display plate A mold setting step of disposing a second mold having a recess for forming a space between the top surface of the display plate and the front surface of the display board; and a first mold and a second mold A space formed between the display plate and the window, and the front surface and the recess of the display plate An elastomer supply step for supplying an elastomer composition for forming an elastic member into a space including at least a gap, a curing step for curing the elastomer composition, and the outer periphery on the front surface of the display board after the curing step And an exposure step of removing the inner elastic member from the outer periphery and exposing the inner portion from the outer periphery of the display panel.

また、本発明の別の形態は、さらに、エラストマー供給工程では、第一金型と第二金型との間に形成される空間であって、表示板と窓部との隙間、表示板の表側の面と凹部との隙間および第二金型とフレームの表側の面との隙間を少なくとも含む空間に、弾性部材を形成するためのエラストマー組成物を供給する電子機器用筐体の製造方法である。   Further, another form of the present invention is a space formed between the first mold and the second mold in the elastomer supply step, wherein the gap between the display plate and the window portion, A method for manufacturing a casing for an electronic device that supplies an elastomer composition for forming an elastic member in a space including at least a gap between a front side surface and a recess and a gap between a second mold and a front side surface of a frame. is there.

また、本発明の別の形態は、さらに、表示板配置工程の前若しくは後に、表示板の表側の面に、表側の面と弾性部材との間に介在する離型層を配置する離型層配置工程をさらに含み、露出工程では、外周囲より内方の弾性部材と共に離型層を取り除く電子機器用筐体の製造方法である。   Another embodiment of the present invention further provides a release layer in which a release layer interposed between the front side surface and the elastic member is arranged on the front side surface of the display plate before or after the display plate arranging step. It is a manufacturing method of the housing | casing for electronic devices which further includes an arrangement | positioning process and removes a release layer with an elastic member inside from an outer periphery in an exposure process.

本発明によれば、電子機器の薄型化および高い防水性を図ることができる。   According to the present invention, the electronic device can be thinned and highly waterproof.

図1は、電子機器の一部を構成する第一実施形態に係る電子機器用筺体と、それと組み合わせる電子機器本体とを分解した一部分解斜視図を示す。FIG. 1: shows the partial exploded perspective view which decomposed | disassembled the housing for electronic devices which concerns on 1st embodiment which comprises some electronic devices, and the electronic device main body combined with it. 図2は、図1に示す電子機器用筺体のA−A線断面図およびその一部Bの拡大断面図を示す。2 shows a cross-sectional view taken along line AA of the housing for an electronic device shown in FIG. 1 and an enlarged cross-sectional view of a part B thereof. 図3は、図1に示す電子機器用筺体の製造工程の一部を示す。FIG. 3 shows a part of the manufacturing process of the electronic device casing shown in FIG. 図4は、図3に示す工程に続く工程および第一金型上のフレームのC−C線断面図を示す。FIG. 4 shows a cross-sectional view taken along the line CC of the frame on the first mold and the process following the process shown in FIG. 図5は、図4に示す工程に続く工程および金型内外のD−D線断面図を示す。FIG. 5 shows a process subsequent to the process shown in FIG. 4 and a cross-sectional view taken along the DD line inside and outside the mold. 図6は、図5に示す工程に続く工程、成形後のE−E線断面図、当該E−E線断面図中の一部E’の拡大図および弾性部材の一部を除去後のF−F線断面図を示す。FIG. 6 shows a step subsequent to the step shown in FIG. 5, a cross-sectional view taken along line EE after molding, an enlarged view of part E ′ in the cross-sectional view taken along line EE, and F after removing a part of the elastic member. -F line sectional drawing is shown. 図7は、電子機器の一部を構成する第二実施形態に係る電子機器用筺体の斜視図を示す。FIG. 7 is a perspective view of an electronic device casing according to a second embodiment that constitutes a part of the electronic device. 図8は、図7に示す電子機器用筺体のG−G線断面図およびその一部Hの拡大断面図を示す。FIG. 8 shows a cross-sectional view taken along line GG of the housing for electronic equipment shown in FIG. 7 and an enlarged cross-sectional view of a part H thereof. 図9は、第一金型と第二金型との間に配置したフレームに弾性部材を形成する工程を説明する図であり、成形直後の金型の斜視図および金型内外の一部のI−I線断面図を示す。FIG. 9 is a diagram for explaining a process of forming an elastic member on a frame disposed between the first mold and the second mold, and is a perspective view of the mold immediately after molding and a part of the inside and outside of the mold. A sectional view taken along line II is shown. 図10は、図9に示す工程に続く工程、成形後のJ−J線断面図および弾性部材の一部を除去後のK−K線断面図を示す。FIG. 10 shows a step following the step shown in FIG. 9, a cross-sectional view taken along the line JJ after molding, and a cross-sectional view taken along the line KK after removing a part of the elastic member. 図11は、従来の電子機器の表側を構成する筐体の斜視図を示す。FIG. 11 is a perspective view of a housing constituting the front side of a conventional electronic device. 図12は、図11に示す筐体のL−L線断面図およびその一部Mの拡大図を示す。12 shows an LL line cross-sectional view of the housing shown in FIG. 11 and an enlarged view of a part M thereof.

次に、本発明に係る電子機器用筐体の好適な実施形態について、図面を参照しながら説明する。以下の実施の形態では、電子機器として携帯通信端末を例に挙げて説明するが、電子機器はそれに限定されず、携帯型音楽再生装置、小型テレビ受像器、リモートコントローラなどでも良い。 Next, a preferred embodiment of an electronic device casing according to the present invention will be described with reference to the drawings. In the following embodiments, a portable communication terminal will be described as an example of an electronic device. However, the electronic device is not limited thereto, and may be a portable music player, a small television receiver, a remote controller, or the like.

<第一実施形態>
1.電子機器用筺体の構造
図1は、電子機器の一部を構成する第一実施形態に係る電子機器用筺体と、それと組み合わせる電子機器本体とを分解した一部分解斜視図を示す。
<First embodiment>
1. Structure of Electronic Device Housing FIG. 1 is a partially exploded perspective view in which an electronic device housing according to a first embodiment constituting a part of the electronic device and an electronic device main body combined therewith are disassembled.

第一実施形態に係る電子機器用筺体(以後、単に「筺体」と称する)2は、電子機器1の外側を覆うトレイの形状を呈する。筺体2は、回路基板やバッテリーを備える電子機器本体3側の段差端面4で当接し、その厚さ方向にて電子機器本体3と嵌め込み可能に構成されている。筺体2は、その主要構成体である筺体2用のフレーム2aと、透明なガラス若しくは樹脂にて好適に構成される表示板5と、表示板5とフレーム2aとの隙間にあって両者5,2aを連接する弾性部材6とを備える。フレーム2aは、その表側の面を貫通する矩形形状の窓部9を備える。表示板5は、窓部9よりも僅かに小さく形成されている。   The electronic device casing (hereinafter simply referred to as “enclosure”) 2 according to the first embodiment has a shape of a tray that covers the outside of the electronic apparatus 1. The housing 2 is configured to come into contact with the stepped end surface 4 on the electronic device main body 3 side including a circuit board and a battery, and can be fitted into the electronic device main body 3 in the thickness direction. The casing 2 has a frame 2a for the casing 2 which is a main component of the casing 2, a display board 5 suitably formed of transparent glass or resin, and a gap between the display board 5 and the frame 2a. And an elastic member 6 connected to 2a. The frame 2a includes a rectangular window portion 9 penetrating the front surface. The display board 5 is formed slightly smaller than the window portion 9.

フレーム2aは、樹脂、金属あるいはセラミックスから好適に製造できる。フレーム2aを樹脂にて製造する場合、ポリカーボネート(PC)、ポリアミド(PA)、ポリエチレンテレフタレート(PET)、ポリブチレンテレフタレート(PBT)、アクリロニトリル・ブタジエン・スチレン共重合(ABS)樹脂などを好適に用いることができる。フレーム2aに、無機フィラーあるいは有機フィラーを分散させても良い。表示板5は、透明であれば、ガラス以外に、透明性に優れるアクリル樹脂にて構成することもできる。ここで、「透明」とは、表示板5を通して筺体2の裏側の表示を視認できる程度以上の光透過性を意味しており、有色透明、無色透明の他、半透明をも含むように広義に解釈される。弾性部材6は、好適には、フレーム2aおよび表示板5よりも柔軟性に富むエラストマーから成り、熱可塑性エラストマー、熱硬化性エラストマー、天然ゴム等から好適に構成でき、特に、熱硬化性樹脂の一種であるシリコーン系エラストマーを好適に用いることができる。弾性部材6の別の材料としては、例えば、スチレン系エラストマー、オレフィン系エラストマー、ウレタン系エラストマーを用いることもできる。さらに、弾性部材6に、無機フィラーあるいは有機フィラーを分散させても良い。   The frame 2a can be suitably manufactured from resin, metal or ceramics. When the frame 2a is manufactured from resin, polycarbonate (PC), polyamide (PA), polyethylene terephthalate (PET), polybutylene terephthalate (PBT), acrylonitrile / butadiene / styrene copolymer (ABS) resin, etc. are preferably used. Can do. An inorganic filler or an organic filler may be dispersed in the frame 2a. If the display board 5 is transparent, it can also be comprised with the acrylic resin which is excellent in transparency other than glass. Here, “transparent” means a light transmittance that is higher than a level at which the display on the back side of the housing 2 can be visually recognized through the display board 5, and is broadly defined to include translucent in addition to colored transparent and colorless transparent. To be interpreted. The elastic member 6 is preferably made of an elastomer that is more flexible than the frame 2a and the display board 5, and can be preferably made of a thermoplastic elastomer, a thermosetting elastomer, natural rubber, or the like. One type of silicone elastomer can be suitably used. As another material of the elastic member 6, for example, a styrene elastomer, an olefin elastomer, or a urethane elastomer can be used. Further, an inorganic filler or an organic filler may be dispersed in the elastic member 6.

図2は、図1に示す電子機器用筺体のA−A線断面図およびその一部Bの拡大断面図を示す。   2 shows a cross-sectional view taken along line AA of the housing for an electronic device shown in FIG. 1 and an enlarged cross-sectional view of a part B thereof.

表示板5は、好適には、フレーム2aの厚さよりも少し薄い厚さにて構成されている。筺体2を幅50〜70mm、長さ100〜120mm、高さ3〜8mmの薄厚の直方体の形状に構成する場合において、表示板5の好適な厚さは、一例として0.5〜1.0mmである。また、フレーム2aの好適な厚さは、0.6〜2.5mmである。なお、フレーム2aの厚さと表示板5の厚さを同一(例えば、両方とも0.5mm)とすることもできる。表示板5は、その裏面と、フレーム2aの窓部9の外周囲の裏面とが面一になるように、窓部9内に配置されている。弾性部材6は、窓部9と表示板5との隙間を充填し、かつ表示板5の外周囲を覆うように、フレーム2aに固着されている。弾性部材6の裏面を、表示板5の裏面およびフレーム2aの窓部9の外周囲の裏面と共に面一になるように形成される方が、筺体2の裏面を平面化してより薄型化を図る観点で、なお好ましい。弾性部材6は、表示板5の外周囲を、その全周に亘って被覆する被覆部7を備えているので、表示板5との接触面積を大きくすることができる。その結果、フレーム2aと表示板5とをより強固に接続することができる。また、表示板5と弾性部材6との間に、易接着性のプライマーを介在させることによって、さらに強固な接着を実現できる。被覆部7の厚さは、フレーム2aの厚さと表示部5の厚さの差とほぼ等しくなるようにすると、フレーム2aから弾性部材6の被覆部7までを平面にすることができ、電子機器1のユーザが使用する際に指を引っ掛けるのを防止できる。   The display board 5 is preferably configured to have a thickness slightly smaller than the thickness of the frame 2a. In the case where the casing 2 is formed in the shape of a thin rectangular parallelepiped having a width of 50 to 70 mm, a length of 100 to 120 mm, and a height of 3 to 8 mm, a suitable thickness of the display panel 5 is 0.5 to 1.0 mm as an example. It is. Moreover, the suitable thickness of the flame | frame 2a is 0.6-2.5 mm. Note that the thickness of the frame 2a and the thickness of the display board 5 may be the same (for example, both are 0.5 mm). The display board 5 is arrange | positioned in the window part 9 so that the back surface and the back surface of the outer periphery of the window part 9 of the flame | frame 2a may become flush | level. The elastic member 6 is fixed to the frame 2 a so as to fill a gap between the window portion 9 and the display plate 5 and cover the outer periphery of the display plate 5. If the back surface of the elastic member 6 is formed so as to be flush with the back surface of the display board 5 and the back surface of the outer periphery of the window portion 9 of the frame 2a, the back surface of the housing 2 is flattened to make it thinner. From the viewpoint, it is still preferable. Since the elastic member 6 includes the covering portion 7 that covers the outer periphery of the display plate 5 over the entire circumference, the contact area with the display plate 5 can be increased. As a result, the frame 2a and the display board 5 can be more firmly connected. Further, by interposing an easy-adhesive primer between the display panel 5 and the elastic member 6, stronger adhesion can be realized. If the thickness of the covering portion 7 is substantially equal to the difference between the thickness of the frame 2a and the thickness of the display portion 5, the area from the frame 2a to the covering portion 7 of the elastic member 6 can be made flat, and the electronic device It is possible to prevent one user from catching a finger when using it.

2.電子機器用筺体の製造方法
図3は、図1に示す電子機器用筺体の製造工程の一部を示す。図4は、図3に示す工程に続く工程および第一金型上のフレームのC−C線断面図を示す。図5は、図4に示す工程に続く工程および金型内外のD−D線断面図を示す。図6は、図5に示す工程に続く工程、成形後のE−E線断面図、当該E−E線断面図中の一部E’の拡大図および弾性部材の一部を除去後のF−F線断面図を示す。
2. Method for Manufacturing Electronic Device Housing FIG. 3 shows a part of the manufacturing process of the electronic device housing shown in FIG. 1. FIG. 4 shows a cross-sectional view taken along the line CC of the frame on the first mold and the process following the process shown in FIG. FIG. 5 shows a process subsequent to the process shown in FIG. 4 and a cross-sectional view taken along the DD line inside and outside the mold. FIG. 6 shows a step subsequent to the step shown in FIG. 5, a cross-sectional view taken along line EE after molding, an enlarged view of part E ′ in the cross-sectional view taken along line EE, and F after removing a part of the elastic member -F line sectional drawing is shown.

筺体2は、図3から図6までの各工程を順に実行することによって、好適に製造できる。ここでは、フレーム2aとしてPC樹脂を、弾性部材6としてシリコーンゴムを用いる例で説明する。まず、図3に示すように、表示板5の表側の面に、離型層の一例としての保護フィルム8を貼る(離型層配置工程)。保護フィルム8は、弾性部材6の硬化前の未加硫状態のシリコーンゴム組成物を表示板5上に供給した際に、表示板5と当該組成物とが固着するのを防止し、その後工程において当該組成物を表示板5から剥離しやすくするためのフィルムである。保護フィルム8は、好適には、成形時の加熱温度(100℃程度)に耐えられる材料、例えば、PET、ポリイミド(PI)、ポリエチレンナフタレート(PEN)、ポリフェニレンサルファイド(PPS)等の樹脂から構成される。保護フィルム8は、表示板5の外周囲を全周に亘って露出可能なように、表示板5よりも小さく形成される。後の工程において、露出した部分に形成される弾性部材6をフレーム2a側に残す一方で、保護フィルム8上の弾性部材6をフレーム2aから除去するためである。   The housing 2 can be preferably manufactured by sequentially executing the steps from FIG. 3 to FIG. 6. Here, an example in which PC resin is used as the frame 2a and silicone rubber is used as the elastic member 6 will be described. First, as shown in FIG. 3, a protective film 8 as an example of a release layer is pasted on the front surface of the display board 5 (release layer arranging step). The protective film 8 prevents the display board 5 and the composition from adhering to each other when the unvulcanized silicone rubber composition before the elastic member 6 is cured is supplied onto the display board 5. The film for facilitating peeling of the composition from the display board 5. The protective film 8 is preferably made of a material that can withstand the heating temperature (about 100 ° C.) during molding, for example, a resin such as PET, polyimide (PI), polyethylene naphthalate (PEN), polyphenylene sulfide (PPS), and the like. Is done. The protective film 8 is formed smaller than the display board 5 so that the outer periphery of the display board 5 can be exposed over the entire circumference. This is for removing the elastic member 6 on the protective film 8 from the frame 2a while leaving the elastic member 6 formed in the exposed portion on the frame 2a side in a later step.

溶融したPC樹脂を金型内に充填して、冷却による硬化後に金型を開き、PC樹脂製のフレーム2aを製造する。次に、成形用金型を構成する第一金型10上に形成された突出領域であって当該フレーム2aの内側の容積および形状にほぼ等しい突出領域に、フレーム2aを被せるようにセットする(フレームセット工程)。この状態において、フレーム2aの窓部9は、当該突出領域の天面上に開口している。次に、表示板5の裏面と窓部9の外側に位置するフレーム2aの裏面とを面一に保持するように、窓部9の直下に位置する第一金型10の突出領域上に表示板5を配置する(表示板配置工程)。保護フィルム8を貼った表示板5は、保護フィルム8側を上にして配置される。表示板5を窓部9内に置いた状態のフレーム2aおよび第一金型10は、図4に示す通りである。この状態にて、図5に示すように、フレーム2aの上から、第一金型10と同じく成形用金型を構成する第二金型11を被せる(金型セット工程)。第二金型11は、保護フィルム8とほぼ同じ形状および同じ大きさにて、下面から内方に向かって窪む凹部12を備える。第一金型10と第二金型11を型締めすると、表示板5とその外周を囲む窓部9との隙間、第二金型11の下面と表示板5との隙間、保護フィルム8と凹部12との隙間が生じる。これらの隙間から構成される空間に弾性部材6を形成できるように、その材料となるシリコーンゴム組成物を表示板5上に供給する(エラストマー供給工程)。次に、金型を加熱して、当該組成物を硬化させる(硬化工程)。その結果、金型を開くと、図6に示すように、保護フィルム8上に突出部13を有する弾性部材6にて表示部5とフレーム2aとを接続した成形体が得られる。   The melted PC resin is filled into the mold, and after being cured by cooling, the mold is opened to manufacture the PC resin frame 2a. Next, the projecting region formed on the first mold 10 constituting the molding die 10 is set so as to cover the projecting region substantially equal to the inner volume and shape of the frame 2a. Frame setting process). In this state, the window portion 9 of the frame 2a is opened on the top surface of the protruding region. Next, it displays on the protrusion area | region of the 1st metal mold | die 10 located directly under the window part 9 so that the back surface of the display board 5 and the back surface of the flame | frame 2a located in the outer side of the window part 9 may be hold | maintained flush. The board 5 is arranged (display board arrangement process). The display board 5 with the protective film 8 attached is arranged with the protective film 8 side up. The frame 2a and the first mold 10 with the display board 5 placed in the window 9 are as shown in FIG. In this state, as shown in FIG. 5, the second mold 11 constituting the molding mold is covered on the frame 2 a similarly to the first mold 10 (mold setting step). The second mold 11 has a recess 12 that is recessed inward from the lower surface in substantially the same shape and size as the protective film 8. When the first mold 10 and the second mold 11 are clamped, the gap between the display plate 5 and the window portion 9 surrounding the outer periphery thereof, the gap between the lower surface of the second mold 11 and the display plate 5, the protective film 8 and A gap with the recess 12 is generated. A silicone rubber composition as the material is supplied onto the display board 5 so that the elastic member 6 can be formed in a space constituted by these gaps (elastomer supply step). Next, the mold is heated to cure the composition (curing step). As a result, when the mold is opened, as shown in FIG. 6, a molded body in which the display portion 5 and the frame 2a are connected by the elastic member 6 having the protruding portion 13 on the protective film 8 is obtained.

次に、突出部13を表示板5から除去する。突出部13を除去しやすいように、図6のE−E断面図中の一部E’の拡大図に示すように、弾性部材6の突出部13の裾野部分に切り込みを形成して薄肉部13aを残すように成形しても良い。また、薄肉部13aの有無を問わず、当該除去は、手作業にて行う他、如何なるカッティングツールによって行っても良い。突出部13を除去すると、その裏側の保護フィルム8も突出部13と一体となって表示板5から剥がれる(露出工程)。その結果、保護フィルム8の領域を露出し、その外側から窓部9までを弾性部材6にて充填した状態の筺体2を得ることができる。   Next, the protrusion 13 is removed from the display panel 5. In order to easily remove the protruding portion 13, as shown in the enlarged view of a part E ′ in the EE cross-sectional view of FIG. 6, a cut portion is formed in the skirt portion of the protruding portion 13 of the elastic member 6 to form a thin-walled portion. You may shape | mold so that 13a may be left. In addition, the removal may be performed manually or with any cutting tool regardless of the presence or absence of the thin portion 13a. When the protruding portion 13 is removed, the protective film 8 on the back side is also peeled off from the display board 5 together with the protruding portion 13 (exposure process). As a result, it is possible to obtain the casing 2 in a state where the region of the protective film 8 is exposed and the elastic member 6 fills the area from the outside to the window portion 9.

筺体2は、上述のように、図3から図6までの各工程を順に実行することによって製造されるため、以下のメリットを有する。第一金型10の突出領域の上面と第二金型11の下面との間で表示板5を挟まずに、第二金型11と表示板5との間に隙間を確保して、弾性部材6形成用のシリコーンゴム組成物を当該隙間に供給するようにしているので、弾性部材6の成形工程において、表示板5を割ってしまう危険性を低減できる。特に、表示板5の厚さにバラツキがある場合にも、凹部12の深さを当該バラツキよりも大きく設計することにより、第二金型11の下面が表示板5を圧接して割ってしまうような事態を解消することができる。なお、第一金型10と第二金型11との型締め時の圧力を減らして、表示板5を割らないようにすることも考えられるが、その場合には、シリコーンゴム組成物が表示板5の外周囲から内部方向に流れ込み、表示板5の表側の面にバリが発生しやすくなり、当該バリの除去に労力を要する。上述の製造方法は、そのような労力を不要とする。また、弾性部材6は、一旦、表示板5と窓部9との隙間の他、表示板5の表側の面を覆うように形成され、その後、表示に必要な領域を覆う突出部13のみを除去して形成されるため、表示板5とフレーム2aとを確実にシールできる。特に、表示板5の表側の面の外周囲を覆う被覆部7の存在は、当該確実なシールを実現するのに寄与する。さらに、保護フィルム8を表示板5上に貼り、その上からシリコーンゴム組成物を供給し、その硬化後に、保護フィルム8と一緒に突出部13を除去するようにしているので、シリコーンゴム組成物から表示板5を適切に保護でき、かつ突出部13を除去しやすくなる。保護フィルム8を貼ることに代えて、離型剤を表示板5上に塗布するようにしても良い。加えて、表示板5を、弾性部材6を介してフレーム2aに一体化することによって、電子機器1の組立工程の簡素化、部品管理の効率化を図ることもできる。   As described above, the housing 2 is manufactured by sequentially performing the steps from FIG. 3 to FIG. 6, and thus has the following merits. The display plate 5 is not sandwiched between the upper surface of the projecting region of the first mold 10 and the lower surface of the second mold 11, and a gap is secured between the second mold 11 and the display plate 5, and elasticity is maintained. Since the silicone rubber composition for forming the member 6 is supplied to the gap, the risk of breaking the display board 5 in the molding process of the elastic member 6 can be reduced. In particular, even when the thickness of the display plate 5 varies, by designing the depth of the recess 12 to be larger than the variation, the lower surface of the second mold 11 is pressed against the display plate 5 and breaks. Such a situation can be resolved. In addition, it is possible to reduce the pressure at the time of clamping with the 1st metal mold | die 10 and the 2nd metal mold | die 11, and not to break the display board 5, In that case, a silicone rubber composition is displayed. It flows from the outer periphery of the plate 5 inward, and burrs are likely to occur on the front surface of the display plate 5, which requires labor to remove the burrs. The manufacturing method described above eliminates such labor. In addition, the elastic member 6 is formed so as to cover the surface on the front side of the display board 5 in addition to the gap between the display board 5 and the window portion 9, and thereafter, only the protruding portion 13 that covers the area necessary for display is provided. Since it is formed by removing, the display plate 5 and the frame 2a can be reliably sealed. In particular, the presence of the covering portion 7 that covers the outer periphery of the front surface of the display board 5 contributes to the realization of the reliable seal. Furthermore, since the protective film 8 is stuck on the display board 5, the silicone rubber composition is supplied from above, and the cured part 13 is removed together with the protective film 8 after the curing, the silicone rubber composition Therefore, it is possible to appropriately protect the display plate 5 and to easily remove the protruding portion 13. Instead of applying the protective film 8, a release agent may be applied on the display board 5. In addition, by integrating the display board 5 into the frame 2a via the elastic member 6, the assembly process of the electronic device 1 can be simplified and the efficiency of component management can be improved.

<第二実施形態>
次に、本発明に係る電子機器用筐体の第二実施形態について説明する。第二実施形態において、第一実施形態にて説明した構成については、図面上において同一の符号を付し、適宜、その説明を省略する。
<Second embodiment>
Next, a second embodiment of the electronic device casing according to the present invention will be described. In the second embodiment, the configuration described in the first embodiment is denoted by the same reference numeral in the drawing, and the description thereof is omitted as appropriate.

1.電子機器用筺体の構造
図7は、電子機器の一部を構成する第二実施形態に係る電子機器用筺体の斜視図を示す。
1. Structure of Electronic Device Housing FIG. 7 is a perspective view of the electronic device housing according to the second embodiment constituting a part of the electronic device.

第二実施形態に係る筺体2が第一実施形態に係るそれと異なる点は、弾性部材6がフレーム2aの少なくとも表側の面を被覆する表面被覆部14を有することである。図7に示すように、筺体2は、表示板5の中央にある表示領域を除き、表面被覆部14にて覆われている。   The difference between the housing 2 according to the second embodiment and that according to the first embodiment is that the elastic member 6 has a surface covering portion 14 that covers at least the front surface of the frame 2a. As shown in FIG. 7, the casing 2 is covered with a surface covering portion 14 except for the display area in the center of the display board 5.

図8は、図7に示す電子機器用筺体のG−G線断面図およびその一部Hの拡大断面図を示す。   FIG. 8 shows a cross-sectional view taken along line GG of the housing for electronic equipment shown in FIG. 7 and an enlarged cross-sectional view of a part H thereof.

弾性部材6は、表示板5と窓部9との隙間から表示板5の表側の面の外周囲を覆う被覆部7を形成する他、フレーム2aの少なくとも表側の面を覆う表面被覆部14を形成する。表面被覆部14は、電子機器1を使用するユーザに、持ちやすさを含み良好な触感を与えるのに有効に寄与する。また、被覆部7と表面被覆部14とは略面一となっているため、電子機器1の使用時に、指などが引っ掛かるのを防止できる。この実施形態では、表面被覆部14は、フレーム2aの表側の面および側面のみを覆っているが、フレーム2aの開口端、さらには開口端から内側の面まで延出して形成されていても良い。また、表面被覆部14は、フレーム2aの側面を覆わず、表側の面の大部分を占める天面のみを覆っていても良い。   The elastic member 6 forms a covering portion 7 that covers the outer periphery of the front side surface of the display plate 5 from a gap between the display plate 5 and the window portion 9, and also has a surface covering portion 14 that covers at least the front side surface of the frame 2a. Form. The surface covering portion 14 effectively contributes to giving a good tactile sensation including ease of holding to the user who uses the electronic apparatus 1. Moreover, since the coating | coated part 7 and the surface coating | coated part 14 are substantially flush, when using the electronic device 1, it can prevent that a finger | toe etc. are caught. In this embodiment, the surface covering portion 14 covers only the front surface and the side surface of the frame 2a, but it may be formed to extend from the opening end of the frame 2a and further from the opening end to the inner surface. . Further, the surface covering portion 14 may cover only the top surface that occupies most of the front side surface without covering the side surface of the frame 2a.

2.電子機器用筺体の製造方法
第二実施形態に係る筺体2は、第一実施形態と同様、図3および図4に基づいて説明した工程と同じ工程を経る。したがって、当該同じ工程の説明を省略し、第一実施形態と異なるその後の工程について説明する。
2. Manufacturing method of housing for electronic device The housing 2 according to the second embodiment undergoes the same processes as those described based on FIGS. 3 and 4 as in the first embodiment. Therefore, description of the same process is omitted, and subsequent processes different from the first embodiment will be described.

図9は、第一金型と第二金型との間に配置したフレームに弾性部材を形成する工程を説明する図であり、成形直後の金型の斜視図および金型内外の一部のI−I線断面図を示す。図10は、図9に示す工程に続く工程、成形後のJ−J線断面図および弾性部材の一部を除去後のK−K線断面図を示す。   FIG. 9 is a diagram for explaining a process of forming an elastic member on a frame disposed between the first mold and the second mold, and is a perspective view of the mold immediately after molding and a part of the inside and outside of the mold. A sectional view taken along line II is shown. FIG. 10 shows a step following the step shown in FIG. 9, a cross-sectional view taken along the line JJ after molding, and a cross-sectional view taken along the line KK after removing a part of the elastic member.

第一実施形態に係る筺体2の製造方法と同様、表示板5に保護フィルム8を貼り、その表示板5を窓部9内の第一金型10上に配置した後(表示板配置工程)、図9に示すように、フレーム2aの上から、第一金型10と同じく金型を構成する第二金型11を被せる(金型セット工程)。第二金型11は、保護フィルム8とほぼ同じ形状および同じ大きさにて、下面から内方に向かって窪む凹部15を備えると共に、凹部15の外側の領域において、フレーム2aの表側の面との間にも隙間を有するように構成されている。第一金型10と第二金型11を型締めすると、表示板5とその外周を囲む窓部9との隙間、第二金型11の下面と表示板5との隙間、保護フィルム8と凹部15との隙間および第二金型11の下面とフレーム2aとの隙間が生じる。これらの隙間から構成される空間に弾性部材6を形成できるように、その材料となるシリコーンゴム組成物を表示板5上に供給する(エラストマー供給工程)。次に、金型を加熱して、当該組成物を硬化させる(硬化工程)。その結果、金型を開くと、図10に示すように、保護フィルム8上に突出部13を有すると共にフレーム2aの表側の面および側面を被覆する表面被覆部14を有する弾性部材6にて、表示部5とフレーム2aとを接続した成形体が得られる。   After the protective film 8 is affixed to the display board 5 and the display board 5 is arranged on the first mold 10 in the window portion 9 as in the method for manufacturing the casing 2 according to the first embodiment (display board arrangement process). As shown in FIG. 9, the second mold 11 constituting the mold is covered from the top of the frame 2a in the same manner as the first mold 10 (mold setting step). The second mold 11 has a recess 15 that is substantially the same shape and the same size as the protective film 8 and that is recessed inward from the lower surface, and in the region outside the recess 15, the surface on the front side of the frame 2 a It is comprised so that it may also have a clearance gap between. When the first mold 10 and the second mold 11 are clamped, the gap between the display plate 5 and the window portion 9 surrounding the outer periphery thereof, the gap between the lower surface of the second mold 11 and the display plate 5, the protective film 8 and A gap between the recess 15 and a gap between the lower surface of the second mold 11 and the frame 2a are generated. A silicone rubber composition as the material is supplied onto the display board 5 so that the elastic member 6 can be formed in a space constituted by these gaps (elastomer supply step). Next, the mold is heated to cure the composition (curing step). As a result, when the mold is opened, as shown in FIG. 10, the elastic member 6 having the protruding portion 13 on the protective film 8 and the surface covering portion 14 covering the front surface and the side surface of the frame 2a, A molded body in which the display unit 5 and the frame 2a are connected is obtained.

次に、突出部13を表示板5から除去する。突出部13を除去しやすいように、第一実施形態と同様、弾性部材6の突出部13の裾野部分に切り込みを形成して薄肉部13aを残すように成形しても良い。突出部13を除去すると、その裏側の保護フィルム8も突出部13と一体となって表示板5から剥がれる(露出工程)。その結果、保護フィルム8の領域を露出し、その外側から窓部9までを覆い、さらにはそこから連続してフレーム2aの表側の面および側面をも弾性部材6にて被覆した状態の筺体2を得ることができる。   Next, the protrusion 13 is removed from the display panel 5. In order to easily remove the protruding portion 13, similarly to the first embodiment, a cut may be formed in the skirt portion of the protruding portion 13 of the elastic member 6 so as to leave the thin portion 13 a. When the protruding portion 13 is removed, the protective film 8 on the back side is also peeled off from the display board 5 together with the protruding portion 13 (exposure process). As a result, the housing 2 in a state in which the region of the protective film 8 is exposed, covers from the outside to the window portion 9, and further, the surface and the side surface of the frame 2a are continuously covered with the elastic member 6. Can be obtained.

<その他の実施形態>
以上、本発明の好適な実施形態について説明してきたが、本発明は、上述の実施形態に限定されるものではなく、例えば、以下に説明するように変更実施可能である。
<Other embodiments>
The preferred embodiments of the present invention have been described above, but the present invention is not limited to the above-described embodiments, and can be modified as described below, for example.

例えば、弾性部材6は、表示板5における表側の面の外周囲を全周に亘って覆っているが、当該外周囲の少なくとも一部を、例えば、表示板5の幅方向に位置する長辺側のみ、あるいは短辺側のみを覆っていても良い。また、弾性部材6の裏面は、表示板5の裏面およびフレーム2aの裏面に対して面一に形成されず、表示板5およびフレーム2aの各裏面よりも表側に向かって窪んでいても良い。また、露出工程では、突出部13と共に保護フィルム8を取り除かず、突出部13と保護フィルム8とを別々に取り除くようにしても良い。また、表示板5を第一金型10の突出領域上に配置した後に、表示板5の表側の面に、離型層の配置(保護フィルム8の貼付や離型剤の塗布)を行っても良い。   For example, the elastic member 6 covers the outer periphery of the front side surface of the display board 5 over the entire circumference, and at least a part of the outer periphery is, for example, a long side positioned in the width direction of the display board 5 Only the side or only the short side may be covered. Further, the back surface of the elastic member 6 is not formed flush with the back surface of the display plate 5 and the back surface of the frame 2a, and may be recessed toward the front side from the back surfaces of the display plate 5 and the frame 2a. In the exposure process, the protrusion 13 and the protective film 8 may not be removed together with the protrusion 13 and the protective film 8 may be removed separately. Further, after disposing the display board 5 on the protruding region of the first mold 10, the release layer is disposed on the front surface of the display board 5 (the protective film 8 is applied or the release agent is applied). Also good.

本発明は、例えば、表示板の外周から防水を図ることのできる電子機器に利用することができる。   The present invention can be used, for example, in an electronic device that can be waterproofed from the outer periphery of the display panel.

1 電子機器
2 筺体(電子機器用筐体)
2a フレーム
8 保護フィルム(離型層の一例)
9 窓部
5 表示板
6 弾性部材
10 第一金型(成形用金型の一部)
11 第二金型(成形用金型の一部)
12 凹部
13 突出部(内方の弾性部材)
15 凹部
1 Electronic equipment 2 Housing (enclosure for electronic equipment)
2a Frame 8 protective film (an example of a release layer)
9 Window 5 Display Panel 6 Elastic Member 10 First Mold (Part of Molding Mold)
11 Second mold (part of mold for molding)
12 recessed part 13 protrusion part (inner elastic member)
15 recess

Claims (2)

電子機器の外側を覆う電子機器用筐体であって、
筐体用のフレームと、
前記フレームを貫通する窓部に配置され、前記フレームよりも厚さの薄い透明な表示板と、
前記窓部の内側端面と前記表示板とを連接する弾性部材と、
を備え、
前記表示板の裏面と前記窓部の外側に位置する前記フレームの裏面とを面一に形成し、
前記弾性部材は、前記表示板における表側の面の外周囲の少なくとも一部を覆っており、
前記表示板の裏面と、前記フレームの裏面と、前記弾性部材の裏面とを面一に形成しており、
さらに、前記表示板の外周囲を被覆する前記弾性部材から成る被覆部を、前記フレームの表側の面と面一にしていることを特徴とする電子機器用筐体。
An electronic device casing that covers the outside of the electronic device,
A frame for the housing;
A transparent display board that is disposed in a window that penetrates the frame and is thinner than the frame;
An elastic member connecting the inner end face of the window and the display plate;
With
The back surface of the display plate and the back surface of the frame located outside the window portion are formed flush with each other,
The elastic member covers at least a part of the outer periphery of the front side surface of the display board;
The back surface of the display board, the back surface of the frame, and the back surface of the elastic member are formed flush with each other,
Furthermore, the housing | casing for electronic devices characterized by making the coating | coated part which consists of the said elastic member which coat | covers the outer periphery of the said display board with the surface on the front side of the said frame.
電子機器の外側を覆う電子機器用筐体であって、
筐体用のフレームと、
前記フレームを貫通する窓部に配置され、前記フレームよりも厚さの薄い透明な表示板と、
前記窓部の内側端面と前記表示板とを連接する弾性部材と、
を備え、
前記表示板の裏面と前記窓部の外側に位置する前記フレームの裏面とを面一に形成し、
前記弾性部材は、前記表示板における表側の面の外周囲の少なくとも一部を覆っており、
前記表示板の裏面と、前記フレームの裏面と、前記弾性部材の裏面とを面一に形成しており、
前記フレームの表側の面を前記弾性部材で覆い、
さらに、前記表示板の外周囲を前記弾性部材にて被覆する被覆部、前記フレームの表側の面を覆う表面被覆部と面一にしていることを特徴とする電子機器用筐体。
An electronic device casing that covers the outside of the electronic device,
A frame for the housing;
A transparent display board that is disposed in a window that penetrates the frame and is thinner than the frame;
An elastic member connecting the inner end face of the window and the display plate;
With
The back surface of the display plate and the back surface of the frame located outside the window portion are formed flush with each other,
The elastic member covers at least a part of the outer periphery of the front side surface of the display board;
The back surface of the display board, the back surface of the frame, and the back surface of the elastic member are formed flush with each other,
Cover the front surface of the frame with the elastic member,
Further, the display panel outer periphery and the covering portion for covering at the elastic member, the electronic device housing, characterized in that the surface covering portion for covering the front surface in the flush of the frame.
JP2011233600A 2011-10-25 2011-10-25 Enclosure for electronic equipment Active JP5877685B2 (en)

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