CN111836462B

CN111836462B - Wearable device

Info

Publication number: CN111836462B
Application number: CN202010769323.2A
Authority: CN
Inventors: 刘幕俊
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2020-08-03
Filing date: 2020-08-03
Publication date: 2022-02-01
Anticipated expiration: 2040-08-03
Also published as: CN111836462A

Abstract

The embodiment of the application provides a wearable device, wearable device includes: a housing; and the flexible circuit board comprises a base material layer, a circuit layer and a first protective layer, wherein the circuit layer is arranged between the base material layer and the first protective layer, the hardness of the first protective layer is greater than that of the base material layer, and the flexible circuit board is molded in the shell. The casing of wearing formula equipment is generally uneven, if the whole crooked or have the flexion of great region of casing, the flexible circuit board of wearing formula equipment need correspond the casing setting when the casing is moulded plastics, and the flexible circuit board is crooked to be set up in the casing promptly, and the flexible circuit board needs to have certain bendability. Set up first protective layer on the circuit layer of flexible circuit board, can strengthen flexible circuit board's whole hardness, be difficult to the fold when making flexible circuit board mould plastics in the casing, the circuit on protection flexible circuit board's circuit layer is difficult to the fracture.

Description

Wearable device

Technical Field

The application relates to the technical field of electronics, in particular to wearable equipment.

Background

Along with the development of intelligent technology, the applied fields of wearable equipment are more and more, and the wearable equipment is more and more popular with users, so that great convenience is brought to the life and work of the users. But the wiring of the flexible circuit board of the wearable device is prone to breaking problems.

Disclosure of Invention

The embodiment of the application provides a wearable device, can improve the cracked problem of flexible circuit board's among the wearable device circuit.

The embodiment of the application provides a wearable equipment, it includes:

a housing; and

the flexible circuit board, the flexible circuit board includes substrate layer, circuit layer and first protective layer, the circuit layer set up in the substrate layer with between the first protective layer, the hardness of first protective layer is not less than the hardness of substrate layer, the flexible circuit board mould plastics in the casing.

In this application embodiment, the casing of wearing formula equipment is generally the unevenness, if the whole crooked or have the flexion of great region of casing, the flexible circuit board of wearing formula equipment need correspond the casing setting when the casing is moulded plastics, and the flexible circuit board is crooked to be set up in the casing promptly, and the flexible circuit board needs to have certain bendability. Set up first protective layer on the circuit layer of flexible circuit board, can strengthen flexible circuit board's whole hardness, be difficult to the fold when making flexible circuit board mould plastics in the casing, the circuit on protection flexible circuit board's circuit layer is difficult to the fracture.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly introduced below. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.

Fig. 1 is a schematic structural diagram of a wearable device provided in an embodiment of the present application.

Fig. 2 is a partial schematic view of the wearable device shown in fig. 1.

Fig. 3 is a schematic view of a first stacking structure of the flexible circuit board shown in fig. 2.

Fig. 4 is a schematic diagram of a second stacking structure of the flexible circuit board shown in fig. 2.

Fig. 5 is a schematic view of a third stacked structure of the flexible circuit board shown in fig. 2.

Fig. 6 is a schematic diagram of a fourth stacked structure of the flexible circuit board shown in fig. 2.

Fig. 7 is a schematic view of a partial structure of the housing and the flexible circuit board in the wearable device shown in fig. 2.

Fig. 8 is another schematic structural diagram of a portion of the housing and the flexible circuit board of the wearable device shown in fig. 2.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The embodiment of the application provides a wearable device, and the wearable device can be one of equipment such as intelligent glasses, intelligent bracelet and intelligent helmet.

Referring to fig. 1, fig. 1 is a schematic structural diagram of a wearable device according to an embodiment of the present disclosure. Fig. 1 illustrates smart glasses as an example, and the wearable device 100 includes a housing 120, and the housing 120 serves as an integral frame of the wearable device 100. Referring to fig. 2, fig. 2 is a partial schematic view of the wearable device shown in fig. 1, and it should be noted that fig. 2 only shows a part of the housing and a part of the flexible circuit board. The wearable device 100 further includes a Flexible Printed Circuit (FPC) 140, and the FPC 140 is mounted to the housing 120. The flexible printed circuit board 140 may be a flexible printed circuit board with high reliability, which is made of a polyester film as a base material, and the flexible printed circuit board 140 has the characteristics of high wiring density, light weight, thin thickness, good bending property, and the like.

Referring to fig. 3, fig. 3 is a schematic view of a first stacking structure of the flexible circuit board shown in fig. 2. The flexible circuit board 140 includes a substrate layer 142, a circuit layer 144 and a first protective layer 146, the circuit layer 144 is disposed between the substrate layer 142 and the first protective layer 146, the hardness of the first protective layer 146 is not less than the hardness of the substrate layer 142, and the flexible circuit board 140 is injection-molded on the housing 120.

The housing 120 of the wearable device 100 is generally uneven, for example, the housing 120 is entirely curved or has a curved portion 1224 with a larger area, the flexible circuit board 140 of the wearable device 100 needs to be disposed corresponding to the housing 120 when being injection-molded on the housing 120, that is, the flexible circuit board 140 is disposed on the housing 120 in a curved manner, and the flexible circuit board 140 needs to have a certain flexibility.

In the related technology, the thickness of the flexible circuit board is very thin, the flexibility is very good, and the slender strip-shaped flexible circuit board is plugged into the shell evenly and difficultly, so that the flexible circuit board is easy to bend and warp. The molten plastic or other thermosetting materials are difficult to completely fill the periphery of the flexible circuit board during injection molding, so that air bubbles, cavities and the like are generated around the flexible circuit board. In addition, the circuit layer of the flexible circuit board is generally provided with the adhesive and the covering film, the temperature is up to 200-300 ℃ during injection molding, the adhesive and the covering film are softened and wrinkled at high temperature, the circuit of the circuit layer can be pulled by the force of the wrinkles, the stress is not released, and the circuit fracture phenomenon is easy to occur in a stress area in the later use process.

In this embodiment, the first protection layer 146 is disposed on the circuit layer 144 of the flexible circuit board 140, and the hardness of the first protection layer 146 is not less than that of the base material layer 142, so that the overall hardness of the flexible circuit board 140 can be enhanced, and the flexible circuit board 140 is not easily wrinkled when being injected into the housing 120, that is, when the flexible circuit board 140 is plugged into the inside of the housing 120, the flexible circuit board 140 can be attached to the housing 120, i.e., the flexible circuit board 140 can be uniformly plugged, and the flexible circuit board 140 is not easily bent or warped. In addition, in the injection molding process, the first protection layer 146 protects the circuit layer 144, that is, the first protection layer 146 isolates the molten high-temperature plastic or other thermosetting materials from the circuit layer 144, so that the adhesive and the cover film on the surface layer of the circuit layer 144 are not softened and wrinkled, and thus the circuit of the circuit layer 144 of the flexible circuit board 140 is protected from being easily broken. In other embodiments, the first protective layer is provided to protect the circuit layer, and the adhesive and the cover film may not be provided.

The first protection layer 146 may be flexible and have a certain hardness, and the material of the first protection layer 146 may be selected according to the requirement. Illustratively, the material of the first protective layer 146 may be Polyimide (PI). Polyimide's high temperature resistant reaches more than 400 degrees centigrade, and the temperature is 200 degrees centigrade to 300 degrees centigrade during the time of moulding plastics, and polyimide's first protective layer is high temperature resistant to be higher than the temperature when moulding plastics, and protection circuit layer 144 that polyimide's first protective layer can be fine does not influence the characteristic of self simultaneously, and polyimide's first protective layer can not become soft fold etc. promptly. The material of the first protective layer 146 may also be other materials, such as a pyromellitic polyimide, a thermoplastic polyimide, or a biphenyl polyimide.

Because the thickness of the wearable device 100 is generally small, i.e., the thickness of the housing 120 is small, the thickness of the flexible circuit board 140 is correspondingly small, and the thickness of the flexible circuit board 140 may be between 300 micrometers and 400 micrometers for better injection molding of the flexible circuit board 140 to the housing 120.

The first protection layer 146 of the flexible circuit board 140 needs to have a certain thickness to make the flexible circuit board 140 have a suitable hardness, i.e. the flexible circuit board 140 can be bent and has a certain hardness, so that the flexible circuit board 140 will not bend and warp when being plugged into the housing 120. Illustratively, the thickness of the first protective layer 146 may be between 100 microns and 200 microns, and the first protective layer 146 with such a thickness may provide the flexible circuit board 140 with a proper hardness.

Referring to fig. 4, fig. 4 is a schematic diagram of a second stacking structure of the flexible circuit board shown in fig. 2. It is understood that the first protective layer 146 can be connected to the circuit layer 144 through the first adhesive layer 145, and the first protective layer 146 and the circuit layer 144 can be well adhered and fixed through the first adhesive layer 145. For example, a layer of adhesive may be coated on the circuit layer 144, and then the first protective layer 146 is disposed on the adhesive, and the first adhesive layer is cured to form the first adhesive layer 145, and the first protective layer 146 and the circuit layer 144 are simultaneously fixed by adhesion. In another example, a first adhesive layer 145 may be further disposed on the circuit layer 144, the first adhesive layer 145 is a double-sided adhesive, a first protective layer 146 is further disposed on the first adhesive layer 145, and the first protective layer 146 and the circuit layer 144 are bonded and fixed by the first adhesive layer 145.

For a better understanding of the present solution, the following is exemplified. For example, the total thickness of the substrate layer 142 and the circuit layer 144 of the flexible circuit board 140 is 130 micrometers, the first glue layer 145 with the thickness of 20 micrometers and the first protection layer 146 with the thickness of 150 micrometers are arranged on the side of the circuit layer 144 away from the substrate layer 142, and the thickness of the whole flexible circuit board 140 reaches 300 micrometers, so that the flexible circuit can be bent and has proper hardness. It should be noted that the thickness of the first protection layer 146 may also be other values, such as 100 microns, 125 microns, 175 microns, or 200 microns, and correspondingly, the thickness of the entire flexible circuit board 140 may be 250 microns, 275 microns, 325 microns, or 350 microns.

Referring to fig. 5, fig. 5 is a schematic diagram of a third stacked structure of the flexible circuit board shown in fig. 2. The flexible circuit board 140 may further include a second protection layer 148, where the second protection layer 148 is disposed on a side of the substrate layer 142 facing away from the circuit layer 144. That is, the flexible circuit board 140 includes a first protective layer 146, a circuit layer 144, a base material layer 142, and a second protective layer 148, which are sequentially disposed, and the first protective layer 146 and the second protective layer 148 are disposed on both sides of the flexible circuit board 140 to protect the circuit layer 144 from both sides.

Wherein the thickness of the flexible circuit board 140 may be between 300 microns and 400 microns. The thickness of the first protective layer 146 is between 50 microns and 100 microns and the thickness of the second protective layer 148 is between 50 microns and 100 microns. The thicknesses of the first protective layer 146 and the second protective layer 148 may be the same. The same thickness of the first passivation layer 146 and the second passivation layer 148 facilitates process setup, and the same process setup allows the first passivation layer 146 and the second passivation layer 148 to be obtained. For example, the first passivation layer 146 is 75 microns and the second passivation layer 148 is 75 microns, or the first passivation layer 146 is 85 microns, the second passivation layer 148 is 85 microns, etc.

The thicknesses of the first protective layer 146 and the second protective layer 148 may also be different, because the first protective layer 146 and the second protective layer 148 are located on different sides of the flexible circuit board 140 and are located at different positions when being injection-molded on the housing 120, and the thicknesses of the first protective layer 146 and the second protective layer 148 may be different, for example, the first protective layer 146 is 80 micrometers, the second protective layer 148 is 70 micrometers, or the first protective layer 146 is 85 micrometers, the second protective layer 148 is 65 micrometers, and the like.

Referring to fig. 6, fig. 6 is a schematic diagram of a fourth stacked structure of the flexible circuit board shown in fig. 2. As can be appreciated, the second protective layer 148 is connected to the circuit layer 144 by a second glue layer 147. The second adhesive layer 147 can bond and fix the second protective layer 148 and the substrate layer 142 well. For example, a layer of adhesive may be coated on the substrate layer 142, and then the second protective layer 148 is disposed on the adhesive, and the second adhesive layer 147 is formed after the second adhesive layer is cured, and the second protective layer 148 and the substrate layer 142 are adhered and fixed at the same time. In another example, a second adhesive layer 147 may be disposed on the substrate layer 142, the second adhesive layer 147 is a double-sided adhesive, a second protective layer 148 is further disposed on the second adhesive layer 147, and the second protective layer 148 and the substrate layer 142 are bonded and fixed by the second adhesive layer 147.

For a better understanding of the present solution, the following is exemplified. For example, the total thickness of the substrate layer 142 and the circuit layer 144 of the flexible circuit board 140 is 130 micrometers, the first glue layer 145 with the thickness of 20 micrometers and the first protection layer 146 with the thickness of 75 micrometers are arranged on the side of the circuit layer 144 away from the substrate layer 142, the second glue layer 147 with the thickness of 20 micrometers and the second protection layer 148 with the thickness of 75 micrometers are arranged on the side of the substrate layer 142 away from the circuit layer 144, and the thickness of the whole flexible circuit board 140 reaches 3220 micrometers, so that the flexible circuit board can be bent and has proper hardness. It should be noted that the thickness of the first protection layer 146 may also be other values, such as 100 microns, 125 microns, 175 microns, or 200 microns.

The material of the second passivation layer 148 can be the same as the material of the first passivation layer 146, so that the first passivation layer 146 and the second passivation layer 148 can be obtained by the same processing machine, and the raw material does not need to be replaced, thereby facilitating the manufacturing process. And more material types do not need to be purchased, stored and used, and the purchasing and storing pressure is smaller. Meanwhile, the materials of the two sides of the flexible circuit board 140 are the same, so that the flexible circuit board 140 has more uniform performance.

It should be noted that, in addition to the circuit layer disposed on the side of the substrate layer facing the first protection layer, another circuit layer may be disposed on the side of the substrate layer facing the second protection layer, that is, two circuit layers are disposed on two sides of the substrate layer, respectively, so that more circuits are disposed in a limited space. The second protective layer may protect another circuit layer.

Referring to fig. 7, fig. 7 is a schematic view of a partial structure of the housing and the flexible circuit board of the wearable device shown in fig. 2. The housing 120 has a groove 122, and the flexible circuit board 140 is molded in the groove 122. Specifically, can fill in recess 122 with flexible circuit board 140 earlier, then mould plastics fused plastic or other thermosetting material and fill up recess 122, because flexible circuit board 140 can have certain hardness in the crooked while, flexible circuit board 140 can laminate recess 122 bottom setting, the warpage of buckling is difficult to appear in flexible circuit board 140, mould plastics fused plastic or other thermosetting material can set up on flexible circuit board 140 and fill up recess 122, be difficult to appear the bubble cavity etc..

Referring to fig. 8, fig. 8 is a schematic structural view of another portion of the housing and the flexible circuit board of the wearable device shown in fig. 2. Wherein the housing 120 includes a bottom portion 1222 forming a bottom edge of the recess 122, the bottom portion 1222 having a bent portion 1224, the flexible circuit board 140 being bent along the bent portion 1224. Because the housing 120 of the wearable device 100, such as smart glasses, is irregular, the bottom edge 1222 of the housing 120 that forms the bottom edge of the recess 122 has a curved portion 1224, and the flexible circuit board 140 needs to be curved along the curved portion 1224 and fit to the bottom edge of the recess 122.

Illustratively, referring to fig. 1, the wearable device 100 is a pair of smart glasses, the housing 120 of the smart glasses includes a frame 162, a left glasses leg 164 and a right glasses leg 168, the left glasses leg 164 and the right glasses leg 168 are respectively connected to two sides of the frame 162, a functional module may be disposed inside the left glasses leg 164 and the right glasses leg 168, a functional module may also be disposed inside the frame 162, the functional module inside the frame 162 is electrically connected to the functional module inside the left glasses leg 164 and the right glasses leg 168 through a flexible circuit board 140, the overall structure of the frame 162 is an irregular structure, the area of the frame 162 where the flexible circuit board 140 can be disposed is very small, therefore, the groove 122 of the frame 162 for disposing the flexible circuit board 140 has a bending portion 1224, even a bending portion 1224 that is continuous and is bent in different directions, the flexible circuit board 140 needs to follow the bending portion of the groove 122 and fit on the bottom edge of the groove 122, for subsequent injection molding.

In some embodiments, the frame 162 may not be provided with a functional module, but a flexible circuit board is provided in the frame for connecting the functional modules inside the left and right temples 164 and 168. Also, the overall structure of the frame 162 is irregular, the area of the frame 162 where the flexible circuit board 140 can be arranged is very small, the groove 122 of the frame 162 for arranging the flexible circuit board 140 has a bending portion 1224, and even a bending portion 1224 that is continuous and bends in different directions, and the flexible circuit board 140 needs to follow the bending portion 1224 of the groove 122 and stick to the bottom edge of the groove 122 for subsequent injection molding.

In some smart glasses, in order to fit the wearing habit of the user, the overall structure of the left and right temples is also irregular, and the area where the flexible circuit board can be disposed in the left and right temples is very small. Therefore, the groove for arranging the flexible circuit board on the left or right glasses leg has a bending part, even a continuous bending part which is bent towards different directions, and the flexible circuit board needs to be bent along with the bending part of the groove and attached to the bottom edge of the groove so as to facilitate subsequent injection molding.

It should be noted that the smart glasses can be used as a visual intelligent auxiliary device of the mobile terminal, for example, the smart glasses can display information such as time, weather, number of steps taken during exercise and the like to the user, and specifically, the information can be displayed on the lenses of the smart glasses and displayed to the user. The intelligent glasses can also provide functions of arrival reminding, timing alarm clock, voice call, backlog reminding and the like, a user can obtain instant messages, answer voice calls and the like through the intelligent glasses without holding the mobile terminal, and the mobile terminal can be placed in a pocket or a bag all the time without being taken out for operation. And a display interface of the mobile terminal, such as a main interface, a notification bar, an application program interface and the like of the mobile terminal, can be acquired through the glasses.

The intelligent glasses can be further integrated with a voice module, the voice module can realize voice recognition and voice control functions, for example, according to the display of the voice control intelligent glasses, voice is obtained, a translation function (convenient for a user to communicate with foreigners) is implemented, and audio (such as music, broadcast and the like) can be played.

The intelligent glasses can be integrated with a positioning module, realize a navigation function according to the positioning module, display navigation information such as map or road guide on the lenses, and can be superposed with live-action images to realize the function of increasing the real display. The user does not need to look at the mobile terminal in a head-down manner, and can go forward according to the navigation information displayed by the lens. In addition, navigation voice can be played through voice dialing, and navigation is assisted.

The intelligent glasses can be further integrated with a touch module, and the function module of the intelligent glasses can be controlled through the touch module. Such as answering a voice call, turning off an alarm clock, adjusting volume, etc.

The lens of intelligence glasses can be sunglasses lens, and intelligence glasses not only have stronger intelligent function, still have better outward appearance and practicality. It is understood that when the lens can realize the display function, the lens can be a special lens, such as a super-thin flexible display screen with high light transmittance.

In the description of the present application, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

The above disclosure provides many different embodiments or examples for implementing different structures of the application. The components and arrangements of specific examples are described above to simplify the present disclosure. Of course, they are merely examples and are not intended to limit the present application.

The wearable device provided by the embodiment of the application is described in detail above. The principles and implementations of the present application are described herein using specific examples, which are presented only to aid in understanding the present application. Meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims

1. A wearable device, comprising:

the shell is provided with a groove and comprises a bottom edge part forming the bottom edge of the groove, and the bottom edge part is provided with a bent part; and

the flexible circuit board comprises a substrate layer, a first circuit layer, a second circuit layer, a first protective layer, a second protective layer, a first adhesive layer and a second adhesive layer, wherein the second protective layer is arranged on one side, deviating from the first circuit layer, of the substrate layer;

when the flexible circuit board is plugged into the groove, the flexible circuit board is bent along the bent part and attached to the bottom edge part, and the groove is filled with injection molding molten plastic or other thermosetting materials, so that the flexible circuit board is injected into the groove.

2. The wearable device according to claim 1, wherein the material of the first protective layer is polyimide.

3. The wearable device of claim 1, wherein the flexible circuit board has a thickness between 300 and 400 microns.

4. The wearable device of claim 3, wherein the first protective layer has a thickness of between 50 and 100 microns and the second protective layer has a thickness of between 50 and 100 microns.

5. The wearable device of claim 1, wherein the second protective layer is the same material as the first protective layer.