200924945 九、發明說明： 【發明所屬之技術領域】 本案係指一種模具，特別是一種適用於製造具微結構裝置的 模具。 【先如技術】 目前用來製作具微結構裝置的模具，皆使用金屬或半導體材 料作為基材’再經過微顯影_刻讀膜等製程，以完成具有微 ❺、，構的模具。此微結構模具可用來熱壓印一些高分子材料，例如： 壓克力（即 Polymethyl methacryiate，pMMA)、聚碳酸酯 (Polycarbonate，PC)等’以生產出由高分子材料組成而具微結構的 衣置。微結構裝置的應用領域甚廣，例如：液晶顯示器的背光板 中的導光板、用於光纖通訊的光波導裝置及細裝置、薄膜電晶 體的電路板的製造等。 、 然而由於微結構的高低起伏通常在微米尺寸，甚至接近奈米 ⑩尺寸，因此當此微結構模具的平坦度未能同時達到微米尺寸的要 寺便谷易每成壓印後的微結構裝置，常會有部分因未接觸到 微結構模具*無法出酬要_結構_，或雜翻 圖樣的深度不足等料良品。通常這些機構的尺寸精密度對產 4終的光學性能或電性能辟独，因此也常造成產品良率偏 :微：:及產品售價偏高的情況。隨著科技的發展， 趫、的需求也將越來越微小化’而上述問題也將會越來 越嚴重，亟待解決。 ^ 5 200924945 為了解決上述問題，本發明提出嶄新的概念與解決方法，能 有效解決上述問題，大幅提高微結構裝置的生產良率，並顯著地 降低生產成本。 【發明内容】 本發明提供一種用於製造具微結構裝置的模具，及其製造方 ' 法及使用方法。 本案之目的為提供一種模具，適用於製造具微結構的 ❹ 裝置，包括一微結構層，具有彈性，其包括一第一表面以 及具有一微結構的一第二表面；一流體層，位於該微結構 層的該第一表面之上；一外框，位於該流體層四週，圍住 該流體層，並與該微結構層相緊密連接；以及一覆蓋層， 位於該流體層之上，且與該外框相緊密連接，以使該流體 層密封於該微結構層、該外框及該覆蓋層之中。 根據上述構想，其中該微結構層的材料為一彈性高分 ©子材料。 根據上述構想，其中該彈性高分子材料為聚二曱基矽 氧烧。 根據上述構想，其中該微結構層與該外框係一體成型。 根據上述構想，其中該覆蓋層包含一磁性材料。 根據上述構想，其中該磁性材料係内含於該覆蓋層中。 根據上述構想’其中該磁性材料係塗佈於該覆盖層的 一表面。 6 200924945 根據上述構想，其中該覆蓋層的材料為彈性高分子材 料。 根據上述構想，其中該彈性高分子材料為聚二曱基矽 氧烷。 根據上述構想，其中該覆蓋層的材料為硬性材料。 Ο200924945 IX. INSTRUCTIONS: [Technical field to which the invention pertains] This case refers to a mold, particularly a mold suitable for manufacturing a microstructured device. [Previously as technology] At present, molds for fabricating micro-structured devices are made of metal or semiconductor materials as substrates, and then micro-developed-imprinted films are used to complete the molds with micro-turns and structures. The microstructured mold can be used to hot stamp some polymer materials, such as: Polymethyl methacryiate (pMMA), polycarbonate (Polycarbonate, PC), etc. to produce a microstructure composed of a polymer material. Clothing. Microstructure devices are widely used in applications such as light guides in backlights for liquid crystal displays, optical waveguide devices for optical fiber communication, and thin devices, and the manufacture of circuit boards for thin film transistors. However, since the height of the microstructure is usually in the micron size, even close to the nano 10 size, when the flatness of the microstructure mold fails to reach the micron size at the same time, the micro-structure device after the imprinting is easy. Often, there will be some parts that are not exposed to the microstructured mold * can not be paid for _ structure _, or the depth of the pattern is insufficient. Usually, the dimensional precision of these mechanisms is unique to the optical performance or electrical performance of the final product, and therefore often results in a product yield bias: micro:: and the product price is high. With the development of science and technology, the demand for sputum will become more and more miniaturized, and the above problems will become more and more serious and urgently need to be resolved. ^ 5 200924945 In order to solve the above problems, the present invention proposes a new concept and solution, which can effectively solve the above problems, greatly improve the production yield of the microstructured device, and significantly reduce the production cost. SUMMARY OF THE INVENTION The present invention provides a mold for manufacturing a microstructured device, and a method of manufacturing the same. The object of the present invention is to provide a mold suitable for fabricating a microstructured crucible device comprising a microstructured layer having elasticity comprising a first surface and a second surface having a microstructure; a fluid layer located therein Above the first surface of the microstructure layer; an outer frame surrounding the fluid layer, surrounding the fluid layer and closely connected to the microstructure layer; and a cover layer over the fluid layer, and The outer frame is tightly coupled to seal the fluid layer between the microstructure layer, the outer frame and the cover layer. According to the above concept, the material of the microstructure layer is an elastic high score © sub-material. According to the above concept, the elastic polymer material is polydimercapto oxime. According to the above concept, the microstructure layer is integrally formed with the outer frame. According to the above concept, the cover layer comprises a magnetic material. According to the above concept, the magnetic material is contained in the cover layer. According to the above concept, wherein the magnetic material is applied to a surface of the cover layer. 6 200924945 According to the above concept, the material of the cover layer is an elastic polymer material. According to the above concept, the elastic polymer material is polydioxanoxane. According to the above concept, the material of the cover layer is a hard material. Ο
本案之另一目的為提供一種模具的製造方法，其步驟 已括提供具有一微結構的基板；覆蓋一高分子材料前驅 物於4基板上；固化該高分子材料前驅物，以形成一高分 子材料層’其包括—第—表面以及具有—微結構的一第二 表面，形成一流體層於該高分子材料層的該第一表面之 上，以及形成一覆蓋層於該流體層之上。 根據上述構想，其中覆蓋一高分子材料前驅物於該基 ，上的步驟’更包括使該高分子材料前驅物的巾央部分的 冋度低於其邊緣的高度’以使後續形成的該高分子材料層 的4第-表面的中央部分的高度低於其邊緣的高度。 ，據上述構想’其中流體層係形成於該高分子材料層 的该第一表面的該中央部分。 根據上述構想，其巾該成—覆蓋層於該流體層之上的 的今括使該覆盍層與該高分子材料層的該第一表面 的5亥邊緣相緊密連接。 的該Ϊ據ί述構想’其中形成—流體層於該高分子材料層 與該高分二步驟’更包括提供-外框;使該外框 刀子材枓層的四週外緣相緊密連接，並使該外框的 7 200924945 高度高於該高分子材料層的高度；以及形成該流體層於該 高分子材料層的該第一表面之上，並位於該外框之中。 根據上述構想，其中形成一覆蓋層於該流體層之上的 " 步驟，更包括使該覆蓋層與該外框相緊密連接。 本案之又一目的為提供一種模具的使用方法，其步驟 包括提供一高分子材料前驅物；將上述的模具置於該高分 ' 子材料前驅物之上，其中該模具中的該微結構層的具有該 微結構的該第二表面與該高分子材料前驅物接觸；朝該高 © 分子材料前驅物的方向施一壓力於該模具；固化該高分子 材料前驅物，以形成一向分子材料板，使該焉分子材料板 脫離該模具。 根據上述構想，其中該壓力為一磁力。 根據上述構想，其中該磁力的產生方法為，將一永久 磁鐵或一電磁鐵置於該高分子材料前驅物的下方。 根據上述構想，其中該壓力為一重力或一機械力。 ® 【實施方式】 本發明將藉由下述之較佳實施例並配合圖示，作進一步之詳 細說明。 〔第一實施例〕 第一圖(A)為本發明第一實施例之模具的示意圖；第一圖(B) 為本發明第一實施例之模具的剖面圖，即為第一圖(A)沿虛線方向 切開的剖面圖。請同時參照第一圖(A)及第一圖(B)，模具10中的 8 200924945 微結構層110的第二表面112具有微結構，且微結構層11〇具有 彈性，其材料可為彈性高分子材料，例如聚二甲基石夕氧燒 等。流體層130則位於微結構層11〇的第一表面114的上方，且 四週有外框140包圍。在本實施例中，微結構層11〇與外框14〇 為一體成型，可使用相同材料。在流體層13〇的上方，則有覆蓋 層120，且覆蓋層120的邊緣與外框14〇緊密連接，以使流體層 130中的流體被密封在微結構層11〇、覆蓋層12〇及外框14〇之中 而不會外流。 覆蓋層120的材料中可以内含或掺雜磁性材料，例如 鐵粉等，並均勻分散。另外也可以將磁性材料塗佈在覆蓋 層120的表面。覆蓋層12〇可以具有彈性，也可以是硬性 的。若覆蓋層120具有彈性，則可選用彈性高分子材料， 例如·聚一曱基石夕氧烧（p〇lydimethyl sii〇xane，即pDMS)、 聚氨基甲酸乙酯（polyurethane ’即PU)、丁二烯-苯乙烯橡 膠（butadiene-styrene rubber, BSR)、天然橡膠（即聚異戊二 歸 polyisoprene)等。 由於微結構層110具有彈性，因此本實施例的模具在壓 印時，可以解決傳統硬性模具因平坦度未達精密要求，所產生壓 印出來的產品有局部區域未出現微結構圖案的不良品的問題。同 時本實施例的流體層130位於微結構層110及覆蓋層12〇之間， 當從覆蓋層120上方施壓進行壓印時，因為流體層13〇中的流體 會均勻分散壓力，所以可以進一步改善壓印結果，使壓印出來的 產品具有完整的微結構圖案。由於微結構層11〇不可太軟，以免 9 200924945 影響微結構圖案絲的精密度，因此選擇材料時，須選擇適當彈 .性係數的材料。一般而言，相同高分子材質，可藉由^整田其 ,交聯密度（crosslinking density)，或加入硬性添加物的多寡 等’來調整其彈性係數(即軟硬度）。 另外值得注意的是，微結構層、外框與贿層的材料通常是 選擇熱固雖_setting)高分子材料，而非熱_&__ 南分子调。熱_高分子獅—旦固化後，再加高溫也不會溶 化’可避免壓印時須加熱，而出現模具本身軟化或溶化的問題。 〔第二實施例〕 第二圖為本發明第二實施例之模具2G的剖面圖。請參照第二 圖，其。中微結構層210的第二表面212具有微結構，微結構層21〇 具有彈性’其材料可為彈性高分子材料，例如聚二甲基矽氧 烷等。流體層230則位於微結構層21〇的第一表面214的上方， 而在流體層230的上方，則有覆蓋層22〇。在本實施例中，微結構 層210、流體層230與覆蓋層220皆被外框240所包圍，且外框 ^ 240分別與微結構層210及覆蓋層220緊密連接，以使流體層23〇 中的流體被密封在微結構層21〇、覆蓋層22〇及外框24〇之中而不 會外流。 本實施例的覆蓋層220的材料也可以如第一實施例所 述，掺有或塗有磁性材料。覆蓋層22〇可以具有彈性，也可 以疋硬性的，其材料的選擇可如第一實施例所述。 本實施例與第一實施例的結構相近’主要差別在於：第一實 施例的微結構層110與外框14〇為一體成型’而本實施例的外框 200924945 240則外加而包住微結構層210、流體層230與覆蓋層220。因此 本實施例具有與第一實施例相同的優點，可以解決傳統硬性模具 所產生的問題。 〔第三實施例〕 第三圖為本發明第三實施例之模具3〇的剖面圖。舉例來說， 3月參如、第二圖’其中微結構層310的第二表面312具有微結構， 微結構層310具有彈性，其材料可為彈性高分子材料，例如聚 二曱基矽氧烷等。流體層330則位於微結構層310的第一表面 314的上方。在本實施例中，微結構層31〇與流體層33〇的四週被 外框34〇所包圍，且微結構層310與外框340緊密連接。在流體 層330的上方，則有覆蓋層320，且覆蓋層320的邊緣與外框340 緊检連接，以使流體層330中的流體被密封在微結構層31〇、覆蓋 層320及外框340之中而不會外流。 、本實施例的覆蓋層320的材料也可以如第一實施例所 ❹ 述’掺有或塗有磁性材料。覆蓋層32〇可以具有彈性，也可 以是硬^生的，其材料的選擇可如第一實施例所述。 本實施例與第二實施例的結構相近，主要差別在於：第二實 Η的外忙24G為外加而包住微結構層21()、流體層挪與覆苗層 220。本實施例的外框谓則僅外加而包住微結構層與: 330，而未包住覆蓋㈣〇。覆蓋層320則位於流體層规與夕卜; :二之上二因此本貫施例具有與第一實施例相同的優點，可以解決 傳.，、充硬性模具所產生的問題。 、 11 200924945 〔第四貫施例〕 材施例提供第-實施财的模具㈣造方法，此模具可以 2綠印而生產出具有微結構的裝置。第邮為本實施例之模具 k方法過程中的模具及治具的剖_。請參照第四圖，首先， 提供具有微結構的基板，例如是铸體或金屬材料基板，經 過微顯影製程’以產生所想要的微結構_於其表面。接著，將 南分子前驅物430倒在此微結構_的表面，均勻覆蓋住此微結 構圖案。為避免高分子前驅物流級结構基板，可將微結構的基 板先置入内σ卩底稍微結構基板大小相當的容器㈣中，並固定 微結構基板420於容器的内部底部，然後再將高分子前驅物 430倒入容器410中。 一此高分子前驅物430可包含高分子單體、募聚物、起始劑、 又耳U催化^添加劑、溶劑等，此配方可以適當選擇及調配， 以於後續產生具有想要的物理、化學性㈣高分子材料。 接下來，可以選擇治具，其腳略小於容器的内緣， 再將此治具45G懸人容器41G中，並適當調整治具的高度， 以將部分高分子前驅物43G擠入純㈣與容器之間的空隙， 以於後續形成外框140，如第四圖所示。 然後’固化此高分子前驅物㈣，以形成具有微結構的高分子 材料層440。此高分子材料層44〇包括一體成型的微結構層ιι〇及 外框140。固化的方法，一般有熱固化、光固化、座氣固化、A劑 B劑混合固化等’端視所選擇的高分子前驅物的種_定。例如 選擇聚二甲基魏烧⑽Ms)，則可將其A劑B劑混合均勻， 200924945 再立即倒入刖述的容器中，並適當加熱(例如可加熱至6〇。〇)，以 加速固化速率、縮短固化時間。 固化完成之後’將固化的高分子材料層440從微結構基板420 上脫離，此時高分子材料層440便具有微結構圖案。若原來微結 構基板420的微結構圖案是公模，則所產生的高分子材料層44〇 上的微結構圖案便是母模，反之亦然。 接下來’在尚分子材料層440的外框140部分所包圍的内部， 倒滿流體，以形成流體層130。然後，在流體層13〇上方配置覆蓋 ❹ 層120,並使覆蓋層120與在高分子材料層44〇的外框14〇部分緊 密結合，以使流體層130中的流體密封於高分子材料層44〇與覆 盍層120之間。此時’便完成如第—實施例中的具有微結構的模 具。 〔第五實施例〕 本實施例提供第二實施例中的模具的使用方法，當然此方法 亦可適用於第一實施例及第三實施例中的模具。 ❹帛五圖為本實關之模具仙方法财巾賴具及治具的垂 直剖面圖。請同時參照第二圖⑷及第五圖，首先將高材料 520(例如壓克力）置於治具51〇中加熱至稍高於熔點，使之熔化並 形成均勻平坦面，接著以第二實施例中的模具2 的 ㈣壓在高分娜20的表面上，如第五圖，然二= 璃軟化溫度(Glass Transition Temperature, Tg)以下，再移開模具 20，此時高分子材料52〇便固化成具有微結構的產品。由^模具 20的微結構層210是使用略有彈性的材料，且模具2〇又具有流體 13 200924945 ’所㈣力m的分餘钱微 出來的微結構產品，不會有硬性模具 =使得騎 級），所產生局部未完整接觸到微結構模常須達微米 微結構圓樣的問題。 、，，，、’精確出現所要的 知上所述’本案提供—種微結構模具、其製造方法及 方法，可大幅提昇微結構產品的生產良率。 ”使用 本案得由熟悉本技藝之人士任顧思而為諸般修飾， 脫如附申請專利範圍所欲保護者。 …' 不Another object of the present invention is to provide a method for manufacturing a mold, which comprises the steps of providing a substrate having a microstructure; covering a polymer material precursor on the 4 substrate; curing the polymer material precursor to form a polymer The material layer 'includes a first surface and a second surface having a microstructure to form a fluid layer over the first surface of the polymeric material layer and to form a cover layer over the fluid layer. According to the above concept, the step of covering a polymer material precursor on the substrate further comprises: making the temperature of the central portion of the precursor of the polymer material lower than the height of the edge thereof to make the subsequent formation high. The height of the central portion of the 4th-surface of the molecular material layer is lower than the height of its edge. According to the above concept, a fluid layer is formed in the central portion of the first surface of the polymer material layer. According to the above concept, the cover layer of the cover layer over the fluid layer is such that the cover layer is closely connected to the edge of the first surface of the polymer material layer. The method of forming a fluid layer in the polymer material layer and the high-division two-step further includes providing a frame; the outer edge of the outer layer of the outer layer of the blade material is closely connected, and The height of the outer frame 7 200924945 is higher than the height of the polymer material layer; and the fluid layer is formed on the first surface of the polymer material layer and located in the outer frame. According to the above concept, the " step of forming a cover layer over the fluid layer further comprises closely bonding the cover layer to the outer frame. A further object of the present invention is to provide a method of using a mold, the method comprising the steps of: providing a polymer material precursor; placing the mold on the high-division 'sub-material precursor, wherein the microstructure layer in the mold The second surface having the microstructure is in contact with the polymer material precursor; applying a pressure to the mold toward the high molecular material precursor; curing the polymer material precursor to form a molecular material sheet The 焉 molecular material sheet is detached from the mold. According to the above concept, wherein the pressure is a magnetic force. According to the above concept, the magnetic force is generated by placing a permanent magnet or an electromagnet under the precursor of the polymer material. According to the above concept, the pressure is a gravity or a mechanical force. ® [Embodiment] The present invention will be further described in detail by the following preferred embodiments and the accompanying drawings. [First Embodiment] Fig. 1(A) is a schematic view showing a mold according to a first embodiment of the present invention; and Fig. 1(B) is a cross-sectional view showing a mold according to a first embodiment of the present invention, which is a first figure (A) ) A section cut along the direction of the dotted line. Referring to both the first figure (A) and the first figure (B), the second surface 112 of the 8 200924945 microstructure layer 110 in the mold 10 has a microstructure, and the microstructure layer 11 has elasticity, and the material thereof may be elastic. A polymer material such as polydimethyl oxalate or the like. The fluid layer 130 is then over the first surface 114 of the microstructure layer 11 and surrounded by an outer frame 140. In the present embodiment, the microstructure layer 11 is integrally formed with the outer frame 14A, and the same material can be used. Above the fluid layer 13〇, there is a cover layer 120, and the edge of the cover layer 120 is closely connected to the outer frame 14〇 such that the fluid in the fluid layer 130 is sealed on the microstructure layer 11〇, the cover layer 12 and The outer frame 14 is in the middle and does not flow out. The material of the cover layer 120 may contain or be doped with a magnetic material such as iron powder or the like and uniformly dispersed. Alternatively, a magnetic material may be coated on the surface of the cover layer 120. The cover layer 12 can be either elastic or rigid. If the cover layer 120 has elasticity, an elastic polymer material such as p〇lydimethyl sii〇xane (pDMS), polyurethane (PU), and dibutyl may be used. Butadiene-styrene rubber (BSR), natural rubber (ie polyisoprene). Since the microstructure layer 110 has elasticity, when the mold of the embodiment is embossed, the conventional rigid mold can be solved because the flatness is not up to the precise requirement, and the embossed product has a defective product in a partial region without a microstructure pattern. The problem. At the same time, the fluid layer 130 of the present embodiment is located between the microstructure layer 110 and the cover layer 12A. When the pressure is applied from above the cover layer 120, the fluid in the fluid layer 13〇 can uniformly disperse the pressure, so further Improve the imprint results so that the imprinted product has a complete microstructure pattern. Since the microstructure layer 11 is not too soft, so as to avoid the influence of the precision of the microstructure pattern yarn on 200924945, when selecting materials, it is necessary to select a material with a suitable elastic coefficient. In general, the same polymer material can be adjusted by its elasticity, crosslinking density, or the amount of hard additives added thereto (i.e., softness). It is also worth noting that the materials of the microstructure layer, the outer frame and the brim layer are usually selected as thermosetting _setting) polymer materials, rather than heat _&__ south molecular tone. The heat _ polymer lion will not melt when it is cured, and it will not be heated when it is embossed, and the mold itself will be softened or melted. [Second Embodiment] Fig. 2 is a cross-sectional view showing a mold 2G according to a second embodiment of the present invention. Please refer to the second figure, which. The second surface 212 of the mesostructure layer 210 has a microstructure, and the microstructure layer 21 has elasticity. The material may be an elastic polymer material such as polydimethyloxane or the like. The fluid layer 230 is located above the first surface 214 of the microstructure layer 21A, and above the fluid layer 230, there is a cover layer 22〇. In this embodiment, the microstructure layer 210, the fluid layer 230 and the cover layer 220 are all surrounded by the outer frame 240, and the outer frame 240 is closely connected to the microstructure layer 210 and the cover layer 220, respectively, so that the fluid layer 23〇 The fluid in the fluid is sealed in the microstructure layer 21〇, the cover layer 22〇, and the outer frame 24〇 without flowing out. The material of the cover layer 220 of this embodiment may also be doped or coated with a magnetic material as described in the first embodiment. The cover layer 22 can be elastic or rigid, and the material can be selected as described in the first embodiment. The present embodiment is similar to the structure of the first embodiment. The main difference is that the microstructure layer 110 of the first embodiment is integrally formed with the outer frame 14〇, and the outer frame 200924945 240 of the present embodiment is applied to enclose the microstructure. Layer 210, fluid layer 230 and cover layer 220. Therefore, this embodiment has the same advantages as the first embodiment, and can solve the problems caused by the conventional rigid mold. [Third Embodiment] Fig. 3 is a cross-sectional view showing a mold 3 of a third embodiment of the present invention. For example, in March, the second figure ‘where the second surface 312 of the microstructure layer 310 has a microstructure, the microstructure layer 310 has elasticity, and the material thereof may be an elastic polymer material, such as polyfluorene-based oxygen. Alkane, etc. Fluid layer 330 is then over the first surface 314 of microstructure layer 310. In the present embodiment, the periphery of the microstructure layer 31 and the fluid layer 33 is surrounded by the outer frame 34, and the microstructure layer 310 is closely connected to the outer frame 340. Above the fluid layer 330, there is a cover layer 320, and the edge of the cover layer 320 is closely connected to the outer frame 340 such that the fluid in the fluid layer 330 is sealed to the microstructure layer 31, the cover layer 320 and the outer frame. 340 without going out. The material of the cover layer 320 of the present embodiment may also be doped or coated with a magnetic material as described in the first embodiment. The cover layer 32 can be either elastic or rigid, and the material can be selected as described in the first embodiment. This embodiment is similar to the structure of the second embodiment, and the main difference is that the external busy 24G of the second embodiment is applied to enclose the microstructure layer 21 (), the fluid layer and the seed coating layer 220. The outer frame of this embodiment only adds and encloses the microstructure layer with: 330, but does not enclose the cover (four). The cover layer 320 is located on the fluid layer gauge and the second layer. Therefore, the present embodiment has the same advantages as the first embodiment, and can solve the problems caused by the transfer mold. , 11 200924945 [Fourth embodiment] The material example provides a mold-making method of the first implementation, which can produce a microstructured device by 2 green printing. The first part is the section of the mold and the jig in the process of the mold k method of the embodiment. Referring to the fourth figure, first, a substrate having a microstructure, such as a cast or metal substrate, is provided, which is subjected to a micro-developing process to produce a desired microstructure. Next, the south molecular precursor 430 is poured onto the surface of the microstructure to uniformly cover the microstructure pattern. In order to avoid the polymer precursor flow-level structural substrate, the microstructured substrate may be first placed in a container (4) having a size corresponding to the inner σ卩 bottom and the structural substrate is fixed, and the microstructure substrate 420 is fixed at the inner bottom of the container, and then the polymer is The precursor 430 is poured into the container 410. The polymer precursor 430 may comprise a polymer monomer, a merging agent, an initiator, an urethane catalyst, a solvent, etc., and the formulation may be appropriately selected and formulated to subsequently produce a desired physics. Chemical (four) polymer materials. Next, the fixture can be selected, the foot is slightly smaller than the inner edge of the container, and the fixture 45G is suspended in the container 41G, and the height of the fixture is appropriately adjusted to squeeze part of the polymer precursor 43G into the pure (four) and The gap between the containers is such that the outer frame 140 is subsequently formed, as shown in the fourth figure. Then, the polymer precursor (4) is cured to form a polymer material layer 440 having a microstructure. The polymer material layer 44 includes an integrally formed microstructure layer ιι and an outer frame 140. The curing method generally includes thermal curing, photocuring, seat gas curing, A-agent B-mixing curing, etc., depending on the type of polymer precursor selected. For example, if you choose polydimethyl Wei (10) Ms), you can mix the agent A and evenly. In 200924945, immediately pour it into the container, and heat it properly (for example, it can be heated to 6 〇.〇) to accelerate the curing. Rate, shorten cure time. After the curing is completed, the cured polymer material layer 440 is detached from the microstructure substrate 420, and the polymer material layer 440 has a microstructure pattern. If the microstructure pattern of the original microstructure substrate 420 is a male mold, the resulting microstructure pattern on the polymer material layer 44 is the master mold, and vice versa. Next, inside the portion surrounded by the outer frame 140 portion of the molecular material layer 440, the fluid is filled to form the fluid layer 130. Then, the cover layer 120 is disposed above the fluid layer 13〇, and the cover layer 120 is tightly bonded to the outer frame 14〇 portion of the polymer material layer 44〇 to seal the fluid in the fluid layer 130 to the polymer material layer. Between 44 〇 and the cover layer 120. At this time, the microstructured mold as in the first embodiment is completed. [Fifth Embodiment] This embodiment provides a method of using the mold in the second embodiment, and of course, the method can also be applied to the molds of the first embodiment and the third embodiment. The five figures are the vertical cross-sections of the molds and fixtures of the molds. Please refer to the second figure (4) and the fifth figure at the same time. First, the high material 520 (for example, acrylic) is placed in the jig 51 加热 to be heated slightly above the melting point to melt and form a uniform flat surface, followed by a second The (4) of the mold 2 in the embodiment is pressed on the surface of the high-density 20, as in the fifth figure, and the glass transition temperature (Tg) is lower than the glass transition temperature (Tg), and then the mold 20 is removed. The sputum solidifies into a product having a microstructure. The microstructure layer 210 of the mold 20 is made of a slightly elastic material, and the mold 2 has a micro-structured product of fluid 13 200924945 '(4) force m, which does not have a hard mold = makes riding Level), the problem of local incomplete contact with the microstructured mold often has to reach the micro-microstructure circle. , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , "The use of this case has been modified by people who are familiar with the art, and is removed from the scope of the patent application. ...'
【圖式簡單說明】 第一圖(A)為本發明第一實施例之模具的示意圖。 第一圖(B)為本發明第一實施例之模具的垂直剖面圖。 第二圖為本發明第二實施例之模具的垂直剖面圖。 第三圖為本發明第三實施例之模具的垂直剖面圖。 ❷ 第四圖為本發明第四實施例之模具製造方法過程中的模具及治 具的垂直剖面圖。 第五圖為本發明第五實施例之模具使用方法過程中的模具及治 具的垂直剖面圖。 【主要部分代表符號說明】 10、20、30 :模具 110、210、310 :微結構層 112、212、312 :第二表面 J4 200924945 114、214、314 :第一表面 120、220、320、420 :覆蓋層 • 130、230、330、430 :流體層 * 140、240、340 :外框 410 :容器 420 :基板 430 :高分子前驅物 450、510 :治具 φ 520:高分子材料BRIEF DESCRIPTION OF THE DRAWINGS The first drawing (A) is a schematic view of a mold according to a first embodiment of the present invention. The first drawing (B) is a vertical sectional view of the mold of the first embodiment of the present invention. The second figure is a vertical sectional view of a mold of a second embodiment of the present invention. The third figure is a vertical sectional view of a mold according to a third embodiment of the present invention. ❷ The fourth figure is a vertical sectional view of a mold and a tool in the process of manufacturing a mold according to a fourth embodiment of the present invention. Fig. 5 is a vertical sectional view showing a mold and a tool in a process of using a mold according to a fifth embodiment of the present invention. [Main portion representative symbol description] 10, 20, 30: mold 110, 210, 310: microstructure layer 112, 212, 312: second surface J4 200924945 114, 214, 314: first surface 120, 220, 320, 420 : Cover layer • 130, 230, 330, 430: fluid layer * 140, 240, 340: outer frame 410: container 420: substrate 430: polymer precursor 450, 510: jig φ 520: polymer material
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