CN112904666A - High aspect ratio microstructure array mold core, processing device and manufacturing method - Google Patents

High aspect ratio microstructure array mold core, processing device and manufacturing method Download PDF

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Publication number
CN112904666A
CN112904666A CN202110088329.8A CN202110088329A CN112904666A CN 112904666 A CN112904666 A CN 112904666A CN 202110088329 A CN202110088329 A CN 202110088329A CN 112904666 A CN112904666 A CN 112904666A
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CN
China
Prior art keywords
mold core
aspect ratio
fixing block
high aspect
microstructure
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CN202110088329.8A
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Chinese (zh)
Inventor
胡满凤
邹超鹏
石凯
李伟
童俊
沈伟明
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Foshan University
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Foshan University
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Priority to CN202110088329.8A priority Critical patent/CN112904666A/en
Publication of CN112904666A publication Critical patent/CN112904666A/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22DCASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D19/00Casting in, on, or around objects which form part of the product
    • B22D19/04Casting in, on, or around objects which form part of the product for joining parts

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

The application relates to a high aspect ratio microstructure array mold core, a processing device and a manufacturing method. The application the high aspect ratio micro-structure array mold core of convenient installation include: the mold comprises microstructures, a mold core shell, magnets and fixing columns, wherein the microstructures are arranged in an array; the bottom end of the microstructure is fixed on the fixing column; the fixed column is sleeved in the mold core shell; enabling a part of the structure of the microstructure to be arranged in the core shell, and enabling another part of the structure to be exposed out of the core shell; the magnet is placed on the bottom surface inside the mold core shell, and the magnet is placed at one end of the fixing column. The application the high aspect ratio micro-structure array mold core of convenient installation have simple structure with low costs and simple to operate's advantage.

Description

High aspect ratio microstructure array mold core, processing device and manufacturing method
Technical Field
The present invention relates to a mold core and a manufacturing method thereof, and more particularly, to a high aspect ratio microstructure array mold core, a processing apparatus and a manufacturing method thereof.
Background
The microstructure can endow the surface of the material with some special functional characteristics, brings great additional value, and can be widely used in the aspects of chips, photovoltaics, automobiles, medical treatment, machinery and the like. For example, microlens array optical structures are important micro-optical devices, and optical components such as optical fibers are arranged with high precision by relying on deep microlens arrays. In addition, the microneedle structure array with the high depth-width ratio provides a novel painless, efficient and safe medical means for the medical field, has wide development prospects in the fields of accurate drug injection, clinical monitoring, biochemical detection and the like, and can proliferate and culture stem cells in the high-depth-width micropore microreactor. The high aspect ratio micropore array product is produced in large scale, hot stamping or injection molding micro forming is carried out by depending on the high aspect ratio microstructure array mold core, but the processing of the mold core usually needs long-time complex procedures, the traditional processing methods such as milling and grinding are difficult to achieve the precision processing of the high aspect ratio, and the aspect ratio of the microstructure is difficult to adjust. Therefore, the processing equipment or the processing method of the microstructure in the prior art has the problems of high cost and complex process.
Disclosure of Invention
Based on this, the present application aims to provide a high aspect ratio microstructure array mold core, a processing device and a manufacturing method, which have the advantages of simple structure, low cost and convenient assembly.
In one aspect of the application, a high aspect ratio microstructure array mold core is provided, which comprises a microstructure, a mold core housing, a magnet and a fixing column,
the top ends of the plurality of microstructures are arranged in an array;
the bottom end of the microstructure is fixed on the fixing column;
the fixed column is sleeved in the mold core shell; enabling a part of the structure of the microstructure to be arranged in the core shell, and enabling another part of the structure to be exposed out of the core shell;
the magnet is placed on the bottom surface inside the mold core shell, and the magnet is placed at one end of the fixing column.
The application the high aspect ratio micro-structure array mold core of convenient installation, simple structure, it is convenient to make, the installation is easy, with low costs.
Further, the fixing column comprises an upper fixing block and a lower fixing block, the upper fixing block is stacked on the lower fixing block, and the upper fixing block and the lower fixing block are respectively nested in the mold core shell;
the bottom end of the microstructure is embedded into the upper fixed block;
the magnet is placed between the lower fixing block and the mold core shell.
Further, the microstructures comprise microcapillaries or microneedles;
the bottom end of the microcapillary tube is embedded into the upper fixed block; alternatively, the bottom ends of the microneedles are embedded in the upper fixing block.
Furthermore, the metal interlayer is arranged between the upper fixing block and the lower fixing block.
Further, the micro-structure is a micro-cylinder, the bottom end of the micro-cylinder is embedded into the upper fixing block, and the bottom end of the micro-cylinder abuts against the metal interlayer.
Further, the microstructures are arranged in parallel and evenly or in a staggered mode, and the top ends of the microstructures are aligned.
Further, the top surface formed by a plurality of the microstructures is inclined and is inclined relative to the bottom surface of the fixing column.
On the other hand of this application provides a processingequipment with high aspect ratio micro-structure array mold core, including hot press unit and above-mentioned arbitrary scheme the high aspect ratio micro-structure array mold core of convenient installation, the high aspect ratio micro-structure array mold core of this convenient installation is installed hot press unit is last.
In another aspect of the application, a method for manufacturing a high aspect ratio microstructure array mold core convenient to install is provided, wherein a magnet is placed at the bottom in a mold core shell, a liquid or semisolid fixing agent is poured into the mold core shell and covers the magnet, and the magnet is cooled to form a lower fixing block;
when the lower fixed block is solidified, pouring a liquid or semisolid fixing agent into the mold core shell and placing the liquid or semisolid fixing agent above the lower fixed block; inserting the microstructures in array arrangement into the fixing agent;
cooling causes the fixing agent to solidify and form an upper fixing block, and the microstructure is fixedly nested in the upper fixing block.
Further, the fixing agent is gypsum or tin powder.
For a better understanding and practice, the present application is described in detail below with reference to the accompanying drawings.
Drawings
FIG. 1 is a front view of an exemplary high aspect ratio microstructure array mandrel of the present application;
FIG. 2 is a cross-sectional view taken along plane A-A of the structure shown in FIG. 1;
FIG. 3 is a front view of another exemplary high aspect ratio microstructured array mandrel of the present application;
FIG. 4 is a side view of the structure shown in FIG. 3;
fig. 5 is a cross-sectional view taken along plane B-B of the structure shown in fig. 4.
Detailed Description
In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be considered limiting of the present application. In the description of the present application, "a plurality" means two or more unless otherwise specified.
FIG. 1 is a front view of an exemplary high aspect ratio microstructure array mandrel of the present application; FIG. 2 is a cross-sectional view taken along plane A-A of the structure shown in FIG. 1; FIG. 3 is a front view of another exemplary high aspect ratio microstructured array mandrel of the present application; FIG. 4 is a side view of the structure shown in FIG. 3; fig. 5 is a cross-sectional view taken along plane B-B of the structure shown in fig. 4.
Referring to fig. 1-5, an exemplary mold core of an array of high aspect ratio microstructures of the present application includes microstructures 40, a mold core housing 10, a magnet 20 and a fixing post,
the top ends of the plurality of microstructures 40 are arranged in an array;
the bottom end of the microstructure 40 is fixed on the fixing column;
the fixed column is sleeved in the mold core shell 10; so that a part of the microstructure 40 is arranged in the core shell 10 and another part of the microstructure is exposed out of the core shell 10;
the magnet 20 is placed on the bottom surface inside the core housing 10, and the magnet 20 is placed on one end of the fixing post.
In some preferred embodiments, the core shell 10 is a barrel-shaped structure having a "U" shaped cross-section.
In some preferred embodiments, the fixing posts comprise an upper fixing block 31 and a lower fixing block 32, the upper fixing block 31 is stacked on the lower fixing block 32, and the upper fixing block 31 and the lower fixing block 32 are respectively nested in the core shell 10;
the bottom end of the microstructure 40 is embedded in the upper fixing block 31;
the magnet 20 is placed between the lower fixing block 32 and the core housing 10.
In some preferred embodiments, the microstructures 40 comprise microcapillaries or microneedles;
the bottom end of the microcapillary tube is embedded into the upper fixing block 31; alternatively, the bottom end of the microneedle is embedded in the upper fixing block 31.
In some preferred embodiments, a metal spacer 50 is further included, and the metal spacer 50 is disposed between the upper fixing block 31 and the lower fixing block 32.
In some preferred embodiments, the microstructures 40 are micro-cylinders, the bottom ends of which are embedded in the upper fixing block 31 and the bottom ends of which abut on the metal spacer layer 50.
In some preferred embodiments, the microstructures 40 are arranged in parallel, or staggered, and the tips of the microstructures 40 are aligned.
In some preferred embodiments, the top surface of the plurality of microstructures 40 is beveled and inclined with respect to the bottom surface of the mounting posts.
In some preferred embodiments, the magnets 20 comprise high temperature resistant magnets 20 or powerful magnets 20.
In some preferred embodiments, the core shell 10 is a copper material.
In connection with the above examples, two preferred embodiments of the present application:
firstly, the microstructure 40 is a microneedle (or a microcapillary tube), the fixing agent for forming the fixing column is gypsum powder, the fixing column is obtained by adding water into the gypsum powder and solidifying, the fixing column is divided into two layers, the bottom layer is a lower fixing block 32, the top layer is an upper fixing block 31, the lower fixing block 32 is used for fixing the magnet 20, and the upper fixing block 31 is used for fixing the microneedle. The top surfaces of the microneedles are flush and the array mold core made in this example is used for non-conducting conditions.
Secondly, the microstructures 40 are micro-cylinders, the fixing agent for forming the fixing columns is made of tin powder, the tin powder is heated, liquefied, cooled and solidified to obtain the fixing columns, the fixing columns are divided into two layers, and the metal interlayer 50 is arranged between the two layers of structures. The lower fixing block 32 is wrapped and attached to the magnet 20, the metal interlayer 50 is placed on the top surface of the lower fixing block 32, the upper fixing block 31 is placed above the metal interlayer 50, and the micro-cylinders are nested in the upper fixing block 31. The bottom ends of the micro-cylinders are abutted against the metal interlayer 50, the top surfaces of the micro-cylinders are flush, even the top surfaces of the micro-cylinders are inclined relative to the bottom surface of the fixed column, and the array mold core manufactured by the example is mainly used for conducting electricity.
The application is exemplary for a processingequipment with high aspect ratio micro-structure array mold core, including hot press unit and above-mentioned arbitrary scheme the high aspect ratio micro-structure array mold core of convenient installation, the high aspect ratio micro-structure array mold core of this convenient installation is installed on the hot press unit.
Further, the hot-pressing device may be a flat plate hot-pressing apparatus or an injection molding machine, etc.
In the manufacturing method of the conveniently-installed high-aspect-ratio microstructure array mold core, the magnet 20 is placed at the bottom in the mold core shell 10, the liquid or semisolid fixing agent is poured into the mold core shell 10 and covers the magnet 20, and the lower fixing block 32 is formed after cooling;
after the lower fixing block 32 is solidified, pouring a liquid or semisolid fixing agent into the mold core shell 10 and placing the liquid or semisolid fixing agent above the lower fixing block 32; and inserting the microstructures 40 arranged in an array into the fixing agent;
cooling causes the fixing agent to solidify and form the upper fixing block 31, and the microstructures 40 are fixedly nested in the upper fixing block 31.
In some preferred embodiments, the fixing agent is gypsum or tin powder.
In some preferred embodiments, the method for manufacturing the high-aspect-ratio microstructure array mold core convenient to install is used for manufacturing the high-aspect-ratio microstructure array mold core in any scheme.
In some preferred embodiments, the curing agent is gypsum powder, which is mixed with water to form a liquid or fluid state, poured into the mold core shell 10 and cured to form the fixing post. The mixing ratio of the gypsum powder to the water is 10:1-10: 6.
In some preferred embodiments, the fixing agent is tin powder, the tin powder is heated to obtain liquid tin liquid, the tin liquid is cooled and solidified to obtain the lower fixing block 32, the metal interlayer 50 is placed on the lower fixing block 32, then the tin powder is placed on the metal interlayer 50, the tin powder is heated and placed into the micro-cylinder, and after the tin liquid is cooled and the upper fixing block 31 is formed, the upper fixing block 31 is tightly wrapped at the bottom end of the micro-cylinder. Further, the heating temperature was 250 ℃.
In some preferred embodiments, the micro-mechanism is placed vertically into the fixed post, or the microstructures 40 are placed obliquely with respect to the fixed post.
In some preferred embodiments, after the micro-cylinders are fixed to the upper fixing block 31, the top surfaces of the plurality of micro-cylinders are cut by a wire, so that a micro-cylinder array having a certain inclination is manufactured.
The working principle of the exemplary high aspect ratio micro-structure array mold core of the application is as follows:
the core shell 10 is placed on a hot press, and the core shell 10 is magnetically attracted to the hot press by the magnet 20. The microarray formed by the top surface of the micro needle or the micro cylinder is pushed by a hot pressing device to be extruded on the surface of the workpiece, so that the porous microarray is formed on the surface of the workpiece, and the surface structure with the microarray is further formed on the surface of the workpiece. Therefore, the method can be applied to a plurality of scenes, and further has good practical value and market value.
The high aspect ratio microstructure array mold core, the processing device and the manufacturing method have the advantages of simple structure, low cost, convenience in operation and the like, the array formed by the microstructures 40 can reach a very high aspect ratio, and the array formed by the microstructures 40 is high in aspect ratio and can be adjusted freely; the method is suitable for manufacturing and processing application scenes of various micro arrays such as a micro-needle array, a micro-cylinder array, a capillary array and the like. In addition, the magnetic iron can be conveniently fixed at any position of the processing device through the attraction of the magnet 20, and compared with the prior art, a mold core clamp system is omitted, so that economic benefits are brought.
The high aspect ratio microstructure array mold core is suitable for hot stamping, injection molding of glass, polymer and other products such as micropore arrays, microneedle arrays, microgroove arrays and the like.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application.

Claims (10)

1. The utility model provides a high aspect ratio micro-structure array mold core which characterized in that: comprises a microstructure, a mold core shell, a magnet and a fixed column,
the top ends of the plurality of microstructures are arranged in an array;
the bottom end of the microstructure is fixed on the fixing column;
the fixed column is sleeved in the mold core shell; enabling a part of the structure of the microstructure to be arranged in the core shell, and enabling another part of the structure to be exposed out of the core shell;
the magnet is placed on the bottom surface inside the mold core shell, and the magnet is placed at one end of the fixing column.
2. The easy-to-install high aspect ratio microstructure array mold core of claim 1, wherein: the fixing column comprises an upper fixing block and a lower fixing block, the upper fixing block is stacked on the lower fixing block, and the upper fixing block and the lower fixing block are respectively nested in the mold core shell;
the bottom end of the microstructure is embedded into the upper fixed block;
the magnet is placed between the lower fixing block and the mold core shell.
3. The easy-to-install high aspect ratio microstructure array mold core of claim 2, wherein: the microstructures comprise microcapillaries or microneedles;
the bottom end of the microcapillary tube is embedded into the upper fixed block; alternatively, the bottom ends of the microneedles are embedded in the upper fixing block.
4. The easy-to-install high aspect ratio microstructure array mold core of claim 2, wherein: the metal interlayer is arranged between the upper fixing block and the lower fixing block.
5. The easy-to-install high aspect ratio microstructure array mold core of claim 4, wherein: the microstructure is a micro-cylinder, the bottom end of the micro-cylinder is embedded into the upper fixed block, and the bottom end of the micro-cylinder is abutted to the metal interlayer.
6. The easy-to-install high aspect ratio microstructured array mold core of any of claims 3-5, further comprising: the microstructures are arranged in parallel and evenly or in a staggered mode, and the top ends of the microstructures are aligned.
7. The easy-to-install high aspect ratio microstructure array mold core of claim 5, wherein: the top surface formed by a plurality of the microstructures forms an inclined surface and inclines relative to the bottom surface of the fixed column.
8. The utility model provides a processingequipment with high aspect ratio micro-structure array mold core which characterized in that: the easily-installed high-aspect-ratio microstructure array mold core comprises a hot pressing device and the easily-installed high-aspect-ratio microstructure array mold core as claimed in any one of claims 1 to 7, wherein the easily-installed high-aspect-ratio microstructure array mold core is installed on the hot pressing device.
9. A method for manufacturing a high aspect ratio microstructure array mold core convenient to install is characterized in that: placing a magnet at the bottom in a mold core shell, pouring a liquid or semisolid fixing agent into the mold core shell, covering the magnet, and cooling to form a lower fixing block;
when the lower fixed block is solidified, pouring a liquid or semisolid fixing agent into the mold core shell and placing the liquid or semisolid fixing agent above the lower fixed block; inserting the microstructures in array arrangement into the fixing agent;
cooling causes the fixing agent to solidify and form an upper fixing block, and the microstructure is fixedly nested in the upper fixing block.
10. The method for manufacturing the high aspect ratio microstructure array mold core convenient to install according to claim 9, wherein the method comprises the following steps: the fixing agent is gypsum or tin powder.
CN202110088329.8A 2021-01-22 2021-01-22 High aspect ratio microstructure array mold core, processing device and manufacturing method Pending CN112904666A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113520986A (en) * 2021-06-16 2021-10-22 暨南大学 Random curved surface polymer microneedle array and preparation method thereof

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200924945A (en) * 2007-12-12 2009-06-16 Kainan High School Of Commerce And Industry Mold with micro-structures
JP2010029634A (en) * 2008-07-01 2010-02-12 Kosumedei Seiyaku Kk Microneedle array and method for manufacturing the same
CN101670611A (en) * 2009-10-15 2010-03-17 上海交通大学 Preparation method for preparing plaster mold of transdermal micro needle array
CN201998538U (en) * 2011-03-04 2011-10-05 陆金强 Multifunctional thermoprinting machine
US20120300220A1 (en) * 2011-05-25 2012-11-29 International Business Machines Corporation Technique for verifying the microstructure of lead-free interconnects in semiconductor assemblies
CN104117136A (en) * 2014-07-04 2014-10-29 清华大学 Metal micro-needle array with medicine grooves and micro-needle percutaneous dosing patch and device
CN105366917A (en) * 2015-12-16 2016-03-02 湘潭大学 Technological method for assisting in die forming of microstructural thin glass element through tin liquor
CN105523707A (en) * 2015-12-31 2016-04-27 华南理工大学 Microstructure hard alloy die and hot-pressing micro molding manufacturing method thereof
CN106669025A (en) * 2017-01-12 2017-05-17 清华大学 Hollow metal microneedle array, syringe needle, syringe and prefilled syringe
US20190217071A1 (en) * 2016-08-18 2019-07-18 Nolax Ag Method for removing tattoos, and use of a microneedle patch in a method for removing tattoos
CN110849845A (en) * 2019-11-19 2020-02-28 佛山科学技术学院 Device and method for on-line detection and control of micro-forming of composite microstructure array
CN210282650U (en) * 2018-09-07 2020-04-10 佛山市石湾陶瓷工业研究所有限公司 Powder stamping production system of quick assembling die assembly

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200924945A (en) * 2007-12-12 2009-06-16 Kainan High School Of Commerce And Industry Mold with micro-structures
JP2010029634A (en) * 2008-07-01 2010-02-12 Kosumedei Seiyaku Kk Microneedle array and method for manufacturing the same
CN101670611A (en) * 2009-10-15 2010-03-17 上海交通大学 Preparation method for preparing plaster mold of transdermal micro needle array
CN201998538U (en) * 2011-03-04 2011-10-05 陆金强 Multifunctional thermoprinting machine
US20120300220A1 (en) * 2011-05-25 2012-11-29 International Business Machines Corporation Technique for verifying the microstructure of lead-free interconnects in semiconductor assemblies
CN104117136A (en) * 2014-07-04 2014-10-29 清华大学 Metal micro-needle array with medicine grooves and micro-needle percutaneous dosing patch and device
CN105366917A (en) * 2015-12-16 2016-03-02 湘潭大学 Technological method for assisting in die forming of microstructural thin glass element through tin liquor
CN105523707A (en) * 2015-12-31 2016-04-27 华南理工大学 Microstructure hard alloy die and hot-pressing micro molding manufacturing method thereof
US20190217071A1 (en) * 2016-08-18 2019-07-18 Nolax Ag Method for removing tattoos, and use of a microneedle patch in a method for removing tattoos
CN106669025A (en) * 2017-01-12 2017-05-17 清华大学 Hollow metal microneedle array, syringe needle, syringe and prefilled syringe
CN210282650U (en) * 2018-09-07 2020-04-10 佛山市石湾陶瓷工业研究所有限公司 Powder stamping production system of quick assembling die assembly
CN110849845A (en) * 2019-11-19 2020-02-28 佛山科学技术学院 Device and method for on-line detection and control of micro-forming of composite microstructure array

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
杨聚朋;刘惠兰;冯丽爽;王琪伟;杨照华;: "超高宽深比结构氮化硅波导的研究", 半导体光电, no. 04, 15 August 2017 (2017-08-15), pages 478 - 482 *
罗剑敏;袁华栋;金成滨;张文魁;黄辉;甘永平;陶新永;: "SnS@Ti_3C_2复合材料的制备及其储锂性能研究", 现代技术陶瓷, no. 01, 15 February 2017 (2017-02-15), pages 71 - 78 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113520986A (en) * 2021-06-16 2021-10-22 暨南大学 Random curved surface polymer microneedle array and preparation method thereof

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