KR101769749B1 - Manufacturing method of double-sided pattern with horizontally controlled-refractive index and double-sided pattern thereby - Google Patents

Manufacturing method of double-sided pattern with horizontally controlled-refractive index and double-sided pattern thereby Download PDF

Info

Publication number
KR101769749B1
KR101769749B1 KR1020150185329A KR20150185329A KR101769749B1 KR 101769749 B1 KR101769749 B1 KR 101769749B1 KR 1020150185329 A KR1020150185329 A KR 1020150185329A KR 20150185329 A KR20150185329 A KR 20150185329A KR 101769749 B1 KR101769749 B1 KR 101769749B1
Authority
KR
South Korea
Prior art keywords
pattern
double
stamp
polymer substrate
sided
Prior art date
Application number
KR1020150185329A
Other languages
Korean (ko)
Other versions
KR20170075900A (en
Inventor
박형호
정상현
김창주
김강호
박경호
박원규
Original Assignee
(재)한국나노기술원
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (재)한국나노기술원 filed Critical (재)한국나노기술원
Priority to KR1020150185329A priority Critical patent/KR101769749B1/en
Publication of KR20170075900A publication Critical patent/KR20170075900A/en
Application granted granted Critical
Publication of KR101769749B1 publication Critical patent/KR101769749B1/en

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/007—After-treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/06—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain multicolour or other optical effects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/02—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber
    • B05D7/04—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber to surfaces of films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2201/00—Polymeric substrate or laminate
    • B05D2201/02—Polymeric substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2502/00—Acrylic polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2503/00—Polyurethanes

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a method of manufacturing a double-sided pattern having a controlled refractive index in a horizontal direction and a double-sided pattern produced by the method, and a first stamp on which a microstructure pattern and an align key are formed, A first step of engraving the polymer substrate with a first pattern which is opposite in phase to the microstructure pattern of the first stamp and displaying an alignment mark; and a step of separating the first stamp from the polymer substrate imprinted with the first pattern A second step of forming a first pattern on the polymer substrate, a second step of applying a fluid material on the polymer substrate on which the first pattern is formed, and forming a lower pattern opposite to the first pattern on the lower side of the fluid material And a second stamp on which a microstructure pattern and an align key are formed, is placed on the applied fluid material, and a pressing process is performed A second step of separating the second stamp from the fluid material imprinted with the upper pattern to form a flowable material on the polymer substrate, And a second step of aligning the alignment mark of the second stamp with the alignment mark displayed on the polymer substrate, and then aligning the alignment mark of the second stamp on the flexible material, And controlling the pressing force of the second stamp applied in the horizontal direction of the fluid material so as to control the refractive index of the second stamp in the horizontal direction and controlling the refractive index in the horizontal direction, Let the pattern be its technical point. Thus, the present invention can simultaneously form a double-sided pattern by a simple process, and in particular, by using an alignment mark in a hot forming and an imprint process, it is possible to provide a double-sided pattern in which the refractive index in the horizontal direction is controlled, It can be easily transferred to a substrate or a thin film and can be utilized in various fields.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a double-sided pattern having a controlled refractive index in a horizontal direction and a double-

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a double-sided pattern and a double-sided pattern produced thereby, and a double-sided pattern having a controlled refractive index in a horizontal direction can be simultaneously formed by a simple process. A double-sided pattern having a refractive index controlled in a horizontal direction which can be applied to various fields, and a double-sided pattern produced thereby.

2. Description of the Related Art In recent years, studies have been actively made on a fabrication method for forming various types of patterns in accordance with the trend of high integration and miniaturization of electronic devices, and these patterns are formed in the form of fine (nano or micro) .

In particular, the microstructures can be formed of various materials such as metals, non-metals, dielectrics, semiconductors, magnetic materials, and the like, and they are used variously in optical, electrical, and magnetic devices by controlling their sizes and shapes.

Generally, the formation of such a microstructure pattern has been performed by a thin film deposition, patterning and etching process on a substrate. However, it is difficult to obtain uniform and aligned microstructures due to adhesion or deformation between microstructure patterns, There were complications.

Accordingly, Applicant has made various attempts to obtain a microstructure. Korean Patent Application No. 10-2008-0098598 (Method for forming metal nanostructure and metal nanostructure formed by the method), Application No. 10-2011- 0073391 (Aligned nanostructures with three-dimensional structure using imprint lithography and lift-off process and method for manufacturing the same), Application No. 10-2011-0117471 (Production of refractive index-controlled multilayer nanostructure using imprint lithography and lift- No. 10-2011-0135977 (a method for manufacturing a three-dimensional nanostructure using imprint lithography, and a three-dimensional nanostructure produced thereby), and the like have been filed.

However, such microstructures generally exhibit a cross-sectional pattern pattern in which a pattern is formed on a substrate. Therefore, studies on double-side patterns related to the present invention are rare.

In general, an injection molding process is in progress to form a double-sided microstructure. A mold for such an injection molding process is formed between an upper core and a lower core, and an upper core and a lower core, and is composed of a cavity into which molten microstructure material is injected.

When the molten microstructure material is injected into the cavity and molding, curing and cooling are completed, the upper and lower cores are separated and the formed microstructure is ejected.

However, this method has a problem in that the shape and dimension of the actual pattern are likely to be deformed by the variables such as temperature and pressure during the microstructure forming process, and breakage of the microstructure occurs during the separation of the core and the ejection process .

This problem becomes more prominent particularly when a nano-scale microstructure is manufactured, and also it is very difficult to manufacture a metal mold having a nano-scale microstructure.

In addition, a method of fabricating a pattern in which the refractive index in the vertical direction is controlled by adjusting the composition of the material is known in the manufacture of such a microstructure, but it is difficult to control the refractive index of the microstructure in the horizontal direction.

SUMMARY OF THE INVENTION The present invention is directed to a method for manufacturing a double-sided pattern having a refractive index controlled in a horizontal direction capable of simultaneously forming a double-sided pattern whose refractive index is controlled in a horizontal direction by a simple process such as hot forming and imprinting, The present invention has been made to solve the above problems.

According to an aspect of the present invention, there is provided a method of manufacturing a microstructure, comprising: positioning a first stamp having a microstructure pattern and an align key on a polymer substrate and hot forming the microstructure pattern; A first step of stamping the first pattern and displaying an alignment mark; a second step of separating the first stamp from the polymer substrate imprinted with the first pattern to form a first pattern on the polymer substrate; A third step of applying a fluid material on the polymer substrate on which the first pattern is formed and forming a lower pattern opposite to the first pattern on the lower surface of the fluid material; And a second stamp on which an align key is formed are placed and pressed, and a curing process is performed to form an image on the upper surface of the fluid material in a phase opposite to the microstructure pattern of the second stamp And a fifth step of separating the second stamp from the fluid material imprinted with the upper pattern to form a double-sided pattern made of a fluid material on the polymer substrate, The fourth step includes aligning the alignment mark on the polymer substrate and the alignment mark of the second stamp, and positioning the second stamp on the flexible material to align the alignment mark of the second stamp applied in the horizontal direction of the flexible material Wherein the refractive index is controlled in a horizontal direction and the refractive index is controlled in a horizontal direction, and the pressing force is controlled. The present invention also provides a two-sided pattern manufactured by the method.

It is preferable that the first stamp is made of any one of silicon (Si), silicon oxide (SiO 2 ), quartz, nickel (Ni), copper (Cu) , An anti-stiction surface treatment process is preferably performed.

The polymer substrate of the first step may be a polymer substrate such as a polycarbonate (PC), a polyethylene naphthalate (PEN), a polynorbornene (PN), a polyacrylate, a polyvinyl alcohol alcohol, PVA), polyimide (PI), polyethylene terephthalate (PET), polyethersulfone (PES), polystyrene (PS), polypropylene (PP) (PE), polyvinylchloride (PVC), polyamide (PA), polybutyleneterephthalate (PBT), polymethyl methacrylate (PMMA) and polydimethylsiloxane PDMS).

The hot forming in the first step may be performed at a temperature higher than the glass transition temperature of the polymer substrate, and the pressure applied is preferably 1.5 to 50 bar.

It is preferable that the fluid material in the third step is any one of a photocurable resin composition, a thermosetting resin composition, a natural curing resin composition, a transparent resin composition, a conductive paste and a photosensitive metal-organic precursor, The application of the fluid material is preferably implemented by any one of dropping, spray coating, spin coating and printing.

It is preferable that the second stamp is made of any one of silicon (Si), silicon oxide (SiO 2 ), quartz, nickel (Ni), copper (Cu), glass and a polymer, , PDMS (Polydimethylsiloxane), PUA (Polyurethane acrylate), ETFE (Ethylene tetrafluoroethylene), PFA (Perfluoroalkyl acrylate), PFPE (Perfluoropolyether) and PTFE (Polytetrafluoroethylene).

In addition, it is preferable that an anti-stiction surface treatment process is performed on the second stamp in the fourth step.

The curing step of the fourth step may be implemented by a photocuring method of irradiating the fluid material with ultraviolet rays for 5 seconds to 1 hour while pressing the second stamp or irradiating the microwave for 5 seconds to 1 hour, And the heat is applied to the fluid material while pressurizing the second stamp at a temperature in the range of 50 DEG C to 200 DEG C for 15 seconds to 1 hour.

In addition, after the fifth step, it is preferable that the photomask having the alignment mark is aligned on the polymer substrate having the double-sided pattern formed thereon, and ultraviolet rays or heat are irradiated to a part of the area on the double-

Preferably, the method further comprises the step of transferring the polymer substrate having the double-sided pattern formed of the fluid material to the different substrate or thin film using the transfer tape after the fifth step, (Polycarbonate) (PC), or any one of inorganic substrates such as silicon (Si), gallium arsenide (GaAs), gallium phosphorus (GaP), gallium arsenide (GaAsP), SiC, GaN, ZnO, MgO, sapphire, quartz, , Polyethylene naphthalate (PEN), polynorbornene (PN), polyacrylate, polyvinyl alcohol (PVA), polyimide (PI), polyethylene terephthalate terephthalate (PET), polyethersulfone (PES), polystyrene (PS), polypropylene (PP), polyethylene (PE), polyvinylchloride It is preferably a polymer substrate of any one of polyamide (PA), polybutylene tererephthalate (PBT), polymethyl methacrylate (PMMA), and polydimethylsiloxane (PDMS).

The transferring step may be performed by providing the transfer tape in the form of a roll to transfer the two-sided pattern of the transfer tape to the different substrate or thin film, bringing the transfer tape into contact with the dissimilar substrate or thin film, It is preferable that the double-side pattern of the transfer tape is transferred to the different substrate or the thin film.

It is also preferable to transfer the double-side pattern onto the different substrate or thin film, and then transfer the double-side pattern to another different substrate or thin film.

Here, it is preferable that an adhesion promoter surface treatment process is performed on the dissimilar substrate or the thin film upper portion before the transfer step after the fifth step.

In addition, it is preferable that the application of the fluid material in the third step adjusts the thickness of the interlayer between the lower pattern and the upper pattern according to the thickness adjustment for applying the fluid material, and the upper pattern and the lower pattern The thickness of the interlayer film is preferably 10 nm to 100 mu m.

Meanwhile, it is preferable that the double-sided pattern is formed of any one of a composite structure in which a nanostructure, a microstructure, a nano-structure, and a microstructure are complexly formed.

The upper and lower patterns of the double-sided pattern may be formed in any one of a horn shape, a columnar shape, a spherical shape, and a semi-spherical shape, and these shapes are preferably formed in a convex or concave shape.

The present invention can simultaneously form a double-sided pattern by a simple process and can provide a double-sided pattern in which the refractive index in the horizontal direction is controlled by using an alignment key in a hot forming and an imprint process, It can be easily transferred to a thin film, so that it can be utilized in various fields.

In addition, a double-sided pattern in which the refractive index is controlled in the horizontal direction by the difference in pressure applied to the double-sided pattern by the second stamp can be formed, and ultraviolet rays or heat can be locally applied to a part of the double- It is possible to additionally control the refractive index in the horizontal direction.

In addition, it is easy to mold the microstructure as well as the nanostructure or composite structure by using the hot stamping process using the first stamp and the polymer substrate, the application of the fluid material, and the imprint process using the second stamp, A high-quality pattern can be realized when a microstructure is formed.

Also, there is an effect of solving the shape and size deformation of the actual pattern, breakage of the micro-nano structure, and difficulty of manufacturing the nano-structured metal mold, which are the problems of the injection molding used in the past.

Figs. 1 and 2 are schematic views of a method of manufacturing a double-sided pattern according to the present invention. Fig.
FIG. 3 and FIG. 4 are photographs of a pattern according to an embodiment of the present invention. FIG.
5 is a graph showing a refractive index change of a Zr-organic precursor thin film according to an ultraviolet time (irradiation amount) according to an embodiment of the present invention.
6 is a graph showing a change in refractive index of a Ti-organic precursor thin film according to ultraviolet time (irradiation dose) according to an embodiment of the present invention.

The present invention can simultaneously form a double-sided pattern by a simple process, and can provide a double-sided pattern in which the refractive index in the horizontal direction is controlled by using an alignment key in a hot forming and an imprint process, Sided pattern capable of being easily transferred to a thin film.

In the present invention, the lower pattern is formed by hot embossing lithography using a polymer substrate, and the upper pattern is formed by ultraviolet (UV), microwave, or thermal imprint lithography Thus, a double-sided pattern can be formed at the same time by a simple process, and then transferred to a substrate or a thin film of a different kind, so that it can be utilized in various fields.

In addition, it is also possible to transfer the double-side pattern onto the different substrate or thin film, and then transfer the double-side pattern to another different substrate or thin film, thereby changing the upper and lower sides of the microstructure pattern of the double- It can be used variously according to the purpose of the double-sided pattern.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. FIGS. 1 and 2 are schematic views of a method for manufacturing a double-sided pattern according to the present invention. FIGS. 3 and 4 are photographs of a pattern according to an embodiment of the present invention. FIG. 6 is a graph showing changes in refractive index of a Ti-organic precursor thin film according to ultraviolet time (irradiation amount) according to an embodiment of the present invention. FIG. 6 is a graph showing a change in refractive index of a Zr- Fig.

FIG. 1 (a) is a schematic view for producing a lower pattern of a double-sided pattern according to the present invention, FIG. 1 (b) is a schematic view for producing an upper pattern, 1 is a schematic view showing a process of transferring a double-side pattern onto a substrate or a thin film of a different type using a polymer substrate having a double-sided pattern formed of a material as a transfer tape. 2 (b) is a schematic view showing a process of forming a lower pattern and an upper pattern, and FIG. 2 (b) To improve the refractive index change ratio.

1, a method for manufacturing a double-sided pattern according to the present invention includes a first stamp 20 having a microstructure pattern 21 and an align key 22 formed on a polymer substrate 10, And the first pattern 11 which is opposite in phase to the microstructure pattern 21 of the first stamp 20 is stamped on the polymer substrate 10 to form the first pattern 11, A second step of separating the first stamp 20 from the polymer substrate 10 on which the first pattern 11 is imprinted and molding the first pattern 11 on the polymer substrate 10, (30) is applied on the polymer substrate (10) on which the first pattern (11) is formed, and the lower pattern (31a) opposite to the first pattern (11) And a second stamp 40 on which the microstructure pattern 41 and the align key 42 are formed is placed on the applied fluid material 30, A fourth step of engraving an upper side pattern 31b opposite to the microstructure pattern 41 of the second stamp 40 on the side surface of the fluid material 30 by performing a curing process, And a fifth step of separating the second stamp (40) from the fluid material (30) to form a double-sided pattern (31) of a fluid material (30) on the polymer substrate (10) The fourth step aligns the alignment mark 22 displayed on the polymer substrate 10 and the alignment mark 42 of the second stamp 40 and then aligns the second stamp 40 Is controlled so as to control the pressing force of the second stamp (40) applied in the horizontal direction of the fluid material (30).

First, in the first step, a first stamp 20 having a microstructure pattern 21 formed thereon is placed on a polymer substrate 10 and hot-formed to thermally mold the microstructure pattern 21 of the first stamp 20 (FIG. 1 (a) and FIG. 2 (a)), the first pattern 11, which is opposite in phase to the structure pattern 21, is imprinted.

An align key 22 is displayed on the first stamp 20 and an alignment mark 22 is formed on the polymer substrate 10 during hot forming of the polymer substrate 10. [ Display. The alignment mark 22 displayed on the polymer substrate 10 is aligned with the alignment mark 42 of the second stamp 40 to be described later so as to control the pressing force applied in the horizontal direction of the fluid material 30. [ to be.

That is, the first stamp 20 is placed on the polymer substrate 10, and the first stamp 20 is formed on the polymer substrate 10 by applying a predetermined heat and pressure to the polymer substrate 10 by hot forming, for example, hot embossing lithography 20 so that the reverse phase of the microstructure pattern 21 of the alignment marks 20 is imprinted.

The microstructure of the present invention may be formed of a nano-structure of nanosize, a micro-structure of micro-size, or a complex structure in which patterns of nano-size or micro-size are repeatedly or irregularly arranged, The structure pattern 21 refers to such a microstructure repeatedly formed.

In addition, the microstructure may be formed in a variety of shapes such as a circular shape or a polygonal shape, or may be formed in a variety of shapes, such as a horn shape, a column shape, a spherical shape, and a semi-spherical shape. This is accomplished by properly processing the shape of the stamp to imprint the pattern.

Meanwhile, it is preferable that the pressure is in the range of 1.5 bar to 50 bar when heated at a temperature higher than the glass transition temperature of the polymer substrate 10 during the hot forming.

That is, after the polymer substrate 10 is glass-transferred, the microstructure pattern 21 of the first stamp 20 is impressed on the polymer substrate 10, and at least the glass of the polymer substrate 10 It is difficult to form the microstructure pattern 21 of the first stamp 20 on the polymer substrate 10 at a too low pressure, and it is difficult to form the microstructure pattern 21 of the first stamp 20 on the polymer substrate 10 The shape of the microstructure pattern 21 of the first stamp 20 imprinted on the polymer substrate 10 may be distorted at an excessively high pressure so that the microstructure pattern 21 of the first stamp 20 may be deformed at a temperature higher than the glass transition temperature of the polymer substrate 10, It is preferable to pressurize within a range of 50 bar.

Accordingly, the first stamp 20 has the microstructure pattern 21 formed on one surface thereof. The first stamp 20 is made of a hard material to facilitate the stamping of the microstructure pattern 21 on the glass transition polymer substrate 10, The microstructure pattern 21 of the first stamp 20 is imprinted on the glass transition polymer substrate 10 by pressing the glass transition polymer substrate 10 while pressing the glass transition polymer substrate 10 at a constant pressure.

When the microstructure pattern 21 of the first stamp 20 is imprinted on the polymer substrate 10, a pattern imprinted on the polymer substrate 10 is transferred to the microstructure pattern of the first stamp 20 21), which is referred to as a first pattern 11.

In a specific embodiment, the first stamp 20 is made of one of silicon (Si), silicon oxide (SiO 2 ), quartz, nickel (Ni), copper (Cu) , And the microstructure pattern 21 is formed on one surface, and is made of a hard material as described above.

On the other hand, an anti-stiction surface treatment process is preferably performed on the first stamp 20.

This is accomplished by performing a surface treatment process to prevent adhesion on the upper surface of the first stamp 20, that is, the surface on which the microstructure pattern 21 is formed, to separate the polymer substrate 10, which is hot formed by the first stamp 20 So that it can be easily performed.

Here, the anti-stick surface treatment step may be performed by coating the upper surface of the first stamp 20 with an anti-sticking material or by performing a separate hydrophobic treatment on the upper surface of the first stamp 20, 21 can be easily separated from each other.

Examples of the anti-adhesion material include octadecyltrichlorosilane (OTS), 1H, 1H, 2H, 2H-perfluorodecyltrichlorosilane (FDTS), tridecafluoro-1,1,2,2-tetra-hydroctyltrichlorosilane (FOTS), dichlorodimethylsilane carbon (DLC) may be used.

The hydrophobic treatment on the upper surface of the first stamp 20 may be performed by depositing a hydrophobic substance on the upper surface of the first stamp 20, coating a hydrophobic substance, or performing plasma treatment on the upper surface of the first stamp 20, Adhesion on the surface of the first stamp 20 is prevented so that separation of the polymer substrate 10 is facilitated.

The polymer substrate 10 may be made of a transparent or opaque polymeric material and may be formed of polycarbonate (PC), polyethylene naphthalate (PC), or the like depending on the use and purpose of the double- (PEN), polynorbornene (PN), polyacrylate, polyvinyl alcohol (PVA), polyimide (PI), polyethylene terephthalate (PET) Polyethersulfone (PES), Polystyrene (PS), Polypropylene (PP), Polyethylene (PE), Polyvinylchloride (PVC), Polyamide (PA) Any one of polybutyleneterephthalate (PBT), polymethyl methacrylate (PMMA), and polydimethylsiloxane (PDMS) may be used.

In the second step according to the present invention, the first stamp 20 is separated from the polymer substrate 10 on which the first pattern 11 is imprinted, and the first pattern 20 is formed on the polymer substrate 10 11 (Fig. 1 (a), Fig. 2 (a)).

That is, after the microstructure pattern 21 of the first stamp 20 is stamped on the glass substrate 10 after the hot forming process in the first step is completed, after cooling the microstructure pattern 21, the first stamp The first pattern 11 which is opposite to the microstructure pattern 21 of the first stamp 20 is formed on the polymer substrate 10 by separating the microstructure 20 from the microstructure pattern 21 on the polymer substrate 10.

The reversed phase of the first pattern 11, that is, the microstructure pattern 21 of the first stamp 20, is formed by applying a fluid material 30 to be described later on the polymer substrate 10 on which the first pattern 11 is formed. The pattern of one side of the double-sided pattern 31 according to the present invention is realized.

A third step according to the present invention is a method of manufacturing a semiconductor device including a step of applying a fluid material 30 on a polymer substrate 10 on which the first pattern 11 is formed to form a lower pattern 31a Is formed on the lower surface of the fluid material 30 (Fig. 1 (b) and Fig. 2 (b)).

The flowable material 30 is a portion on which the double-sided pattern 31 according to the present invention is formed. The flowable material 30 is subjected to hot embossing lithography and ultraviolet rays, And patterning the same or different microstructures by wave or hot imprint lithography (UV, Microwave, or thermal imprint lithography) to form the double-sided pattern 31. [

Here, the application of the fluid material 30 is carried out by applying a pattern (double-sided pattern 31) corresponding to the microstructure pattern 21 of the first stamp 20 according to the thickness adjustment for applying the fluid material 30, The thickness of the interlayer film 31c of the reversed pattern (the upper side pattern 31b of the double-side pattern 31) of the microstructure pattern 41 of the second stamp 40 can be adjusted And the thickness of the interlayer film 31c between the upper and lower patterns 31b and 31a of the double-sided patterns 31 is adjusted to 10 nm to 100 μm by controlling the thickness of the fluid material 30 desirable. This is achieved by adjusting the double-sided pattern 31 according to the intended use or purpose of the present invention.

Such a fluid material 30 is formed by forming a resin microstructure by using resins such as a photocurable resin composition, a thermosetting resin composition, a natural curing resin composition and a transparent resin composition according to the application to which the double-sided pattern 31 is applied Or a composition comprising a metal such as a conductive paste and a photosensitive metal-organic precursor to form a microstructure composed of a metal or a metal oxide. Depending on the material of the double-sided pattern, it can be applied to various optical, electrical, and magnetic devices.

The photosensitive metal-organic precursor layer may include at least one selected from the group consisting of lithium, beryllium, boron, sodium, magnesium, aluminum, silicon, indium, S, K, Ca, Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Ge, As, Se, Rb, Sr, Y, (Zr), niobium (Nb), molybdenum (Mo), ruthenium (Ru), rhodium (Rh), indium (In), tin (Sn), tellurium (Te), antimony (Sb) (Ir), lanthanum (La), cerium (Ce), praseodymium (Pr), neodymium (Nd), promethium (Pm), gadolinium (Gd), hafnium (Hf), tantalum , Lead (Pb), bismuth (Bi), polonium (Po), or uranium (U).

Also, the photosensitive metal-organic precursor layer may be formed of a material selected from the group consisting of Ethylhexanoate, Acetylacetonate, Dialkyldithiocarbamates, Carboxylic acids, Carboxylates, Pyridine, Diamines, Arsines, Diarsines, Phosphines, Diphosphines, Butoxide, Isopropoxide, Ethoxine, It is also possible to use a combination of two or more of the following: Ethoxide, Chloride, Acetate, Carbonyl, Carbonate, Hydroxide, Arenas, Beta-Diketonate ), 2-Nitrobenzaldehyde, or Acetate Dihydrate. The organic ligand may be at least one of the following:

Also, the photosensitive metal-organic precursor layer may be formed of at least one selected from the group consisting of hexane, 4-methyl-2-pentanone, ketone, methyl isobutyl ketone, methyl ethyl ketone, water, methanol, ethanol, (Such as dimethyl sulfoxide (DMSO), dimethylformamide (DMF), N-methylpyrrolidone, acetone, acetonitrile, tetrahydrofuran (THF), isopropanol, And may be produced using at least one solvent selected from the group consisting of n-butanol, n-butanol, 2-methoxyethanol, n-butanol,

The application of the fluid material 30 in the third step may be performed by dropping, spray coating, spin coating or printing on the polymer substrate 10 on which the first pattern 11 is formed The lower pattern 31a, which is opposite to the first pattern 11, is formed on the lower surface of the fluid material 30.

That is, the first pattern 11 is formed on the polymer substrate 10 by the first stamp 20 and the fluid material 30 is applied on the polymer substrate 10 on which the first pattern 11 is formed And the lower pattern 31a, which is opposite to the first pattern 11, is formed on the lower surface of the fluid material 30 naturally.

In the fourth step according to the present invention, the second stamp 40 having the microstructure pattern 41 formed thereon is placed on the applied fluid material 30, and the microstructure 40 is pressed, (FIG. 1 (b) and FIG. 2 (b)) on the upper surface of the microstructure pattern 41 of the first stamp 40 and the upper surface of the microstructure pattern 41 of the second stamp 40.

The second stamp 40 has an align key 42 formed thereon and aligned with the alignment key 22 displayed on the polymer substrate 10 and then placed on the fluid material 30 So that the pressing force of the second stamp 40 applied in the horizontal direction of the fluid material 30 is controlled.

Specifically, a fluid material 30 is coated on the polymer substrate 10 and the alignment mark 22 of the second stamp 40 is aligned with the alignment mark 22 displayed on the polymer substrate 10 A microstructure of the second stamp 40 on the side of the flowable material 30 is formed by using an ultraviolet, microwave or a thermal transfer process (e.g., UV, microwave or thermal imprint lithography) So that the reverse phase of the pattern 41 is imprinted.

Here, the pressing force of the second stamp 40 aligned through the alignment marks 22 and 42 is adjusted in the horizontal direction of the fluid material 30 so that the flowable material 30 The lower and upper patterns 31a and 31b are formed on the lower and upper surfaces of the upper and lower substrates 30 and 30, respectively.

In other words, when the center point of the lower pattern 31a is matched with the center point of the upper pattern 31b, the fluid material 30 trapped between the two patterns is subjected to a relatively greater pressure as compared with other positions, There is a localized region where the refractive index is increased.

Therefore, the double-sided pattern 31 in which the high-refractive index area is formed intensively by the shapes of both patterns and the low-refractive index area is formed in the other areas and the refractive index is controlled in the horizontal direction .

On the other hand, in the fourth step, the second stamp 40 is formed with the microstructure pattern 41 of the same shape and size as the microstructure pattern 21 of the first stamp 20 on one surface, and a microstructure pattern 41 to customer specification may be formed, unlike the first stamp 20, a hard silicon (Si), silicon oxide (SiO 2), quartz (quartz), nickel (Ni), copper (Cu) , A rigid material such as glass, or a flexible material such as a polymer.

That is, when the second stamp 40 is positioned on the upper side of the fluid material 30 and applies a predetermined pressure, the microstructure pattern 41 of the second stamp 40 can be imprinted on the fluid material 30 It is sufficient if there is enough material.

Here, the polymer may be formed by using any one of PDMS (Polydimethylsiloxane), PUA (Polyurethane acrylate), ETFE (Ethylene tetrafluoroethylene), PFA (Perfluoroalkyl acrylate), PFPE (Perfluoropolyether) and PTFE (Polytetrafluoroethylene) ) Can be produced.

Also, it is preferable that an anti-stiction surface treatment process is performed on the upper portion of the second stamp 40, like the first stamp 20.

This is because the second stamp 40 is subjected to a surface treatment process to prevent adhesion on the upper surface of the second stamp 40, that is, the surface on which the microstructure pattern 41 is formed, so that the separation of the second stamp 40 after imprinting by the second stamp 40 So that it can be easily performed.

Here, the anti-stick surface treatment process is the same as that in the first stamp 20, and will not be described.

On the other hand, the curing step may be performed by irradiating the fluid material 30 with ultraviolet light for 5 seconds to 1 hour while pressing the second stamp 40, or by photocuring method for irradiating the microwave for 5 seconds to 1 hour Or by applying a heat to the fluid material 30 at a temperature in the range of 50 ° C to 200 ° C for 15 seconds to 1 hour while pressing the second stamp 40 .

In the fifth step according to the present invention, the second stamp 40 is separated from the upper surface of the flowable material 30 in which the upper pattern is stamped, and the second stamp 40 is formed on the polymer substrate 10, (See Fig. 1 (b) and Fig. 2 (b)).

That is, when the microstructure pattern 41 of the second stamp 40 is imprinted on the fluid material 30 through the ultraviolet ray, microwave, or hot imprint process in the fourth step, after completion of the imprinting, 2 stamp 40 is separated from the fluid material 30 so that the lower side pattern 31a which is a reverse phase of the first pattern 11 of the polymer substrate 10 and the lower side pattern 31b which is opposite phase of the first pattern 11 on the upper and lower sides of the fluid material 30, The upper side pattern 31b which is a reverse phase of the microstructure pattern 41 of the two stamps 40 is realized so that the double side pattern 31 made of the flowable material 30 is formed on the polymer substrate 10.

In other words, the lower pattern 31a on the polymer substrate 10 is embodied in the same pattern as the microstructure pattern 21 of the first stamp 20, and the upper pattern 31b is formed on the microstructure pattern 21 of the second stamp 40 There is a feature that a pattern which is opposite in phase to the structure pattern 41 is implemented.

2 (b), the photomask 70 on which the alignment mark 22 is formed is aligned on the polymer substrate 10 on which the double-sided pattern 31 is formed, and the double-sided pattern 31 ) Is irradiated with ultraviolet rays or heat to form a double-sided pattern 31 whose refractive index is controlled in the horizontal direction.

That is, the photomask 70 is aligned on the polymer substrate 10 so that ultraviolet rays or heat can be additionally irradiated onto the polymer substrate 10 having the double-sided pattern 31 formed thereon, A part of the area of the double-sided pattern 31 becomes a high refractive index area as compared with other areas.

 Here, the alignment mark 71 formed on the photomask 70 and the alignment mark 22 displayed on the polymer substrate 10 are aligned so that ultraviolet rays or heat are irradiated to an accurate region on the both-side pattern 31 , The rate of change of the refractive index of the double-sided pattern 31 in the horizontal direction becomes clearer.

That is, in the fourth step, the double-sided pattern 31 whose refractive index is controlled in the horizontal direction by the difference in the pressing force of the second stamp 40 can be formed. Further, after the fifth step, It is possible to control the refractive index in an additional horizontal direction by irradiating ultraviolet rays or heat to a part of the region of the double-side pattern 31 locally using the photomask 70. [

During the curing process by the second stamp 40, the imprinting process is performed at a temperature or an energy level that does not completely cure. Then, when the ultraviolet ray or heat is irradiated by the photomask 70, Is performed under the condition that curing is carried out, so that the rate of change of the refractive index in the horizontal direction is made higher or improved.

That is, in order to prevent complete curing in the curing process by the second stamp 40, it is necessary to apply a temperature or energy higher than the temperature or energy at which the fluid material 30 is completely cured and less than the critical curing temperature or energy, And the curing by the photomask 70 is performed by irradiating ultraviolet rays or heat at a temperature higher than the full curing dose so as to complete the curing.

As described above, the present invention can realize a double-sided pattern in which the refractive index is controlled in the horizontal direction due to the pressure difference of the second stamp applied to the fluid material in accordance with the double-sided pattern shape, The mask is placed on the polymer substrate on which the double-sided pattern is formed of the fluid material so that the refractive index of the region on the double-sided pattern irradiated with ultraviolet rays or heat is further increased and the rate of change of the refractive index in the horizontal direction is further improved.

In addition, a double-sided pattern made of a fluid material and having a controlled refractive index in a horizontal direction can be formed on such a polymer substrate to be used for various optical, electrical, and magnetic devices using a flexible polymer substrate.

On the other hand, the polymer substrate 10 having the double-sided pattern 31 whose refractive index is controlled in the horizontal direction made of the fluid material 30 is used as the transfer tape 60 to transfer the double-side pattern 31 to the different substrate or thin film (Fig. 1 (c), Fig. 2 (c)).

In other words, the double-sided pattern 31 made of the flowable material 30 formed on the polymer substrate 10 may be transferred to a different substrate or thin film depending on the use of the double-sided pattern 31 whose refractive index is controlled in the horizontal direction, In this sense, the polymer substrate 10 formed with the double-sided pattern 31 whose refractive index is controlled in the horizontal direction and made of the fluid material 30 may be used as the transfer tape 60.

Here, the different types of substrates may be any one of silicon (Si), gallium arsenide (GaAs), gallium arsenide (GaP), gallium arsenide (GaAsP), SiC, GaN, ZnO, MgO, sapphire, quartz, Or an inorganic substrate or a polycarbonate (PC), a polyethylene naphthalate (PEN), a polynorbornene (PN), a polyacrylate, a polyvinyl alcohol (PVA) Polyimide (PI), Polyethylene terephthalate (PET), Polyethersulfone (PES), Polystyrene (PS), Polypropylene (PP), Polyethylene (PDMS), such as polyvinyl chloride (PVC), polyamide (PA), polybutyleneterephthalate (PBT), polymethyl methacrylate (PMMA) and polydimethylsiloxane pole A reamer substrate or the like can be used.

In the transferring step, the transfer tape 60 is provided in the form of a roll to transfer the transfer tape 60 to the different substrate or the thin film 50, or the transfer tape 60 and the different substrate After the thin film 50 is contacted, the double-side pattern 31 can be transferred to the dissimilar substrate or the thin film 50 using the transfer tape 60 while being pressed using a roller.

Meanwhile, it is preferable that an adhesion promoter surface treatment process is performed on the dissimilar substrate or the thin film 50 before the transfer step after the fifth step. That is, a promoter resin for adhesion enhancement may be applied to efficiently transfer the dye onto the different substrate, an oxide layer may be coated on the different substrate or thin film 50, or a plasma surface treatment may be performed, The wettability of the surface of the substrate or the thin film 50 is improved so that the transfer of the double-side pattern 31 having the refractive index controlled in the horizontal direction made of the flowable material 30 can be efficiently performed.

As the promoter resin, hexamethyldisilzane (HMDS), acryloxypropyl methyl dichlorosilane (APMDS), 3-glycidoxypropyltrimethoxysilane (GPTS), aminopropyltriethoxysilane (APTS), aminoalkyltrimethoxysilane (ATS), 3-aminopropyltriethoxysilane APTES), and Oxygen plasma treatment.

As described above, when the two-sided patterned fluid material on the polymer substrate according to the present invention is transferred to the dissimilar substrate, the lower pattern of the two-sided patterns is formed on the upper pattern of the two-sided patterns on the different substrate, And is formed in the lower pattern of the patterns.

In addition, it is also possible to transfer the double-side pattern onto the different substrate or thin film, and then transfer the double-side pattern to another different substrate or thin film, thereby changing the upper and lower sides of the microstructure pattern of the double- It can be used variously according to the use of double-sided pattern.

Hereinafter, embodiments of the present invention will be described. FIGS. 3 and 4 are schematic views of an embodiment of the present invention and photographs of patterns according to each embodiment.

3 is a view illustrating a first pattern 11 and an alignment mark 22 formed on a polymer substrate 10 according to an embodiment of the present invention. Is formed on the polymer substrate 10.

First, a Si stamp (first stamp 20) having a line width of 7 mu m, a pitch of 80 mu m, a line width of 7 mu m and a pitch of 250 mu m and an alignment mark 22 was formed as the microstructure pattern 21, A 200 [mu] m thick PC [Polycarbonate] sheet (having a polymer transition temperature of 145 [deg.] C) was contacted with the polymer substrate 10 on the top of the micro patterned Si stamp and maintained at a pressure of 30 bar for 5 minutes while heating at 175 [ .

Thereafter, the Si stamp and the PC sheet were demolded. The micro pattern on which the 7 탆 line depressed, which is a reverse phase of the microstructure pattern (microsize pattern) 41 on the Si stamp, was stamped on the PC sheet as shown in FIG. 4, Ink 22 is displayed.

As shown in FIG. 4, after the UV (curable) resin composition was dropped on the top of the PC sheet on which the 7 탆 line of FIG. 3 was stamped, the same microstructure pattern was formed, but the negative / (Second stamp 40) having the alignment mark 42 formed thereon is aligned and contacted with the alignment mark 22 displayed on the polymer substrate 10, and ultraviolet rays Was irradiated for 3 minutes to cure the photocurable resin composition and to demold it to observe the reverse phase of the microstructure pattern 41 of the different kinds of Si stamps.

That is, it can be confirmed that a high-refractive index region is formed in a portion intensively pressed by both patterns, and a relatively low-refractive index region is formed in other regions, thereby realizing a double-sided pattern in which the refractive index is controlled in the horizontal direction.

5 and 6 are views for observing changes in refractive index when ultraviolet light is irradiated when a photosensitive metal-organic precursor is used as a flowable material. FIG. 5 is a graph showing changes in ultraviolet time (irradiation amount) according to an embodiment of the present invention FIG. 6 shows a refractive index change of a Ti-organic precursor thin film according to an ultraviolet time (irradiation amount) according to an embodiment of the present invention.

FIG. 5 is a schematic view showing a method of synthesizing a photosensitive Zr-organic precursor resin using zirconium (VI) 2-ethylhexanoate [Zr (VI) 2-ethylhexanoate, Strem Co., USA) and hexane (Hexanes, Aldrich Co., The prepared photosensitive Zr-organic precursor resin was spin-coated on the Si substrate at 3000 rpm for 60 seconds and irradiated with ultraviolet rays at 0, 10, 30, and 50 minutes, respectively. , And the refractive index change with respect to the wavelength for various ultraviolet irradiation times is shown in Fig.

As shown in FIG. 5, when the wavelength of 365 nm was used as a reference, it was found that the refractive index was increased by about 0.05 (1.55 1.60) when the ultraviolet was irradiated for 50 minutes, compared with the film not irradiated with ultraviolet rays.

FIG. 6 is a cross-sectional view illustrating a method of synthesizing a photosensitive Ti-organic precursor resin using titanium (VI) (n-butoxide) 2 (2-ethylhexanoate) 2 [Ti (VI) (normal-butoxide) 2 (2-ethylhexanoate) 2 [(2-ethylhexanoate)] was synthesized by mixing a certain amount of titanium Ti (VI) (n-butoxide) 4, Aldrich Co., USA], 2 (2-ethylhexanoate) (2-ethylhexanoic acid, Aldrich Co., USA) and hexane were placed in a round-bottomed flask and evaporated and condensed for 72 hours using a rotary evaporator to obtain titanium (VI) The resultant photosensitive Ti-organic precursor resin was spin-coated on a Si substrate at 3000 rpm for 60 seconds, and irradiated with ultraviolet rays at 0, 10, 30, and 30 minutes, respectively. 50 It was investigated, showing a variation in refractive index to the wavelength for different ultraviolet irradiation times in FIG.

As shown in FIG. 6, when the wavelength of 365 nm was used as a reference, the refractive index was increased by about 0.15 (1.63 1.78) in comparison with the film not irradiated with ultraviolet rays when irradiated with ultraviolet rays for 50 minutes.

5 and 6, it is confirmed that the refractive index of the fluid material can be controlled by adjusting the ultraviolet time (irradiation amount).

As described above, according to the present invention, a double-sided pattern can be simultaneously formed by a simple process. In particular, a double-sided pattern in which the refractive index in the horizontal direction is controlled can be provided by using an alignment key in a hot forming and an imprint process, So that it can be easily transferred to the substrate or the thin film.

In addition, it is possible not only to realize a double-sided pattern in which the refractive index is controlled in the horizontal direction due to the pressure difference of the second stamp applied to the fluid material according to the shape of the double-sided pattern, but also to use a photomask The refractive index of the region on the double-sided pattern irradiated with ultraviolet rays or heat can be further increased, and the rate of change of the refractive index in the horizontal direction can be further improved.

The lower pattern is formed by hot embossing lithography using a polymer substrate and the upper pattern is formed by ultraviolet (UV), microwave, or thermal imprint lithography Thus, a double-sided pattern can be formed at the same time by a simple process, and then transferred to a substrate or a thin film of a different kind, so that it can be used in various fields.

In addition, it is also possible to transfer the double-side pattern onto the different substrate or thin film, and then transfer the double-side pattern to another different substrate or thin film, thereby changing the upper and lower sides of the microstructure pattern of the double- And can be utilized variously according to the use of the double-sided pattern.

10: Polymer substrate 11: First pattern
20: First stamp 21: Microstructure pattern
22: Alliance 30: Fluid material
31: double-sided pattern 31a: lower pattern
31b: upper pattern 31c: interlayer film
40: second stamp 41: microstructure pattern
42: Alliqua 50: heterogeneous substrate or thin film
60: Transfer tape 70: Photomask
71: Allainki

Claims (24)

A first stamp on which a pattern of a microstructure and an align key are formed is placed on a polymer substrate and hot formed to imprint a first pattern which is opposite in phase to the microstructure pattern of the first stamp on the polymer substrate, A first step of displaying an image;
A second step of separating the first stamp from the polymer substrate on which the first pattern is stamped and forming a first pattern on the polymer substrate;
A third step of applying a fluid material on the polymer substrate on which the first pattern is formed and forming a lower pattern opposite to the first pattern on the lower side of the fluid material;
A second stamp on which a microstructure pattern and an align key are formed is placed on the applied fluid material and a pressing process is performed to perform a hardening process so that a reversed phase of the microstructure pattern of the second stamp A fourth step of imprinting the upper pattern; And
And a fifth step of separating the second stamp from the fluid material imprinted with the upper pattern to form a double-sided pattern made of a fluid material on the polymer substrate,
In the fourth step,
Aligning the alignment mark displayed on the polymer substrate and the alignment mark of the second stamp, and then placing the second stamp on the fluid material to control the pressing force of the second stamp applied in the horizontal direction of the fluid material Wherein the refractive index is controlled in a horizontal direction. The method according to claim 1,
Wherein the refractive index is controlled by any one of silicon (Si), silicon oxide (SiO 2 ), quartz, nickel (Ni), copper (Cu) and glass. The method according to claim 1, wherein, in the first step of the first step,
Characterized in that an anti-stiction surface treatment process is performed. The method according to claim 1, wherein the polymer substrate of the first step comprises:
Polycarbonate (PC), polyethylene naphthalate (PEN), polynorbornene (PN), polyacrylate, polyvinyl alcohol (PVA), polyimide ), Polyethylene terephthalate (PET), polyethersulfone (PES), polystyrene (PS), polypropylene (PP), polyethylene (PE), polyvinylchloride Characterized in that it is any one of polyvinyl chloride (PVC), polyamide (PA), polybutyleneterephthalate (PBT), polymethyl methacrylate (PMMA) and polydimethylsiloxane Wherein the refractive index is controlled in a direction perpendicular to the first direction. The method according to claim 1, wherein the first-
Wherein the polymer substrate is heated at a temperature higher than the glass transition temperature of the polymer substrate and the pressure applied is 1.5 to 50 bar. The method according to claim 1, wherein the fluid material in the third step comprises:
A method for producing a double-sided pattern having a controlled refractive index in a horizontal direction, characterized by being any one of a photocurable resin composition, a thermosetting resin composition, a natural curing resin composition, a transparent resin composition, a conductive paste and a photosensitive metal-organic precursor. The method according to claim 1, wherein the application of the fluid material in the third step comprises:
Wherein the method is implemented by any one of dropping, spray coating, spin coating, and printing. The method according to claim 1,
A method for manufacturing a double-sided pattern having a controlled refractive index in the horizontal direction, which is fabricated from any one of silicon (Si), silicon oxide (SiO 2 ), quartz, nickel (Ni), copper Way. 9. The method of claim 8,
A pattern of a double-sided pattern having a refractive index controlled in the horizontal direction, which is one of PDMS (Polydimethylsiloxane), PUA (Polyurethane acrylate), ETFE (Ethylene Tetrafluoroethylene), PFA (Perfluoroalkyl acrylate), PFPE (Perfluoropolyether) and PTFE Gt; The method according to claim 1, wherein, in the upper portion of the second stamp of the fourth step,
Characterized in that an anti-stiction surface treatment process is performed. The method according to claim 1, wherein the curing step of the fourth step comprises:
Wherein the first stamp is irradiated with ultraviolet rays for 5 seconds to 1 hour while the second stamp is pressed while the microwave is irradiated for 5 seconds to 1 hour. A method for manufacturing a double-sided pattern. The method according to claim 1, wherein the curing step of the fourth step comprises:
And the heat is applied to the fluid material while pressing the second stamp at a temperature ranging from 50 ° C to 200 ° C for 15 seconds to 1 hour. A method for manufacturing a double-sided pattern. The method according to claim 1, further comprising, after the fifth step,
Wherein the photomask having the alignment mark is aligned on the polymer substrate on which the double-sided pattern is formed, and ultraviolet rays or heat are irradiated to a part of the area on the double-sided pattern. The method according to claim 1, further comprising, after the fifth step,
Further comprising the step of transferring the double-sided pattern onto a different substrate or thin film using the polymer substrate having the double-sided pattern formed thereon as a transfer tape. The method according to claim 14,
Wherein the inorganic substrate is at least one of silicon (Si), gallium arsenide (GaAs), gallium phosphide (GaP), gallium arsenide (GaAsP), SiC, GaN, ZnO, MgO, sapphire, quartz,
Or polycarbonate (PC), polyethylene naphthalate (PEN), polynorbornene (PN), polyacrylate, polyvinyl alcohol (PVA), polyimide (PI), polyethylene terephthalate (PET), polyethersulfone (PES), polystyrene (PS), polypropylene (PP), polyethylene (PE) a polymer substrate of any one of polyvinylchloride (PVC), polyamide (PA), polybutylene tererephthalate (PBT), polymethyl methacrylate (PMMA), and polydimethylsiloxane Wherein the refractive index is controlled in a horizontal direction. 15. The method according to claim 14,
Wherein the transfer tape is provided in the form of a roll to transfer the double-sided pattern of the transfer tape to the different substrate or the thin film, wherein the refractive index is controlled in the horizontal direction. 15. The method according to claim 14,
Wherein the double-sided pattern of the transfer tape is transferred onto the dissimilar substrate or the thin film while pressing the transfer tape and the dissimilar substrate or the thin film by using a roller. 15. The method according to claim 14, wherein the double-sided pattern is transferred onto the different substrate or thin film, and then the double-sided pattern is further transferred onto another different substrate or thin film. . 15. The method according to claim 14, wherein before the transfer step after the fifth step,
Wherein a surface treatment process of an adhesion promoter is performed on the different substrate or thin film. The method according to claim 1, wherein the application of the fluid material in the third step comprises:
Wherein the thickness of the interlayer between the lower pattern and the upper pattern is adjusted according to the thickness adjustment for applying the fluid material. 21. The method of claim 20,
Wherein the thickness of the interlayer between the upper and lower patterns of the double-sided patterns is 10 nm to 100 탆. The method according to claim 1, wherein the double-
Nanostructures, microstructures,
Wherein the refractive index control layer is formed of any one of a composite structure in which a nano structure and a micro structure are complexly formed. A double-sided pattern having a refractive index controlled in the horizontal direction, which is produced by the method for producing a double-sided pattern according to any one of claims 1 to 22. 24. The method according to claim 23, wherein the upper and lower patterns of the double-
Wherein each of the convex portions is formed in one of a horn shape, a columnar shape, a spherical shape, and a semi-spherical shape, and these shapes are formed in a convex or concave shape.
KR1020150185329A 2015-12-23 2015-12-23 Manufacturing method of double-sided pattern with horizontally controlled-refractive index and double-sided pattern thereby KR101769749B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020150185329A KR101769749B1 (en) 2015-12-23 2015-12-23 Manufacturing method of double-sided pattern with horizontally controlled-refractive index and double-sided pattern thereby

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150185329A KR101769749B1 (en) 2015-12-23 2015-12-23 Manufacturing method of double-sided pattern with horizontally controlled-refractive index and double-sided pattern thereby

Publications (2)

Publication Number Publication Date
KR20170075900A KR20170075900A (en) 2017-07-04
KR101769749B1 true KR101769749B1 (en) 2017-08-22

Family

ID=59357376

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150185329A KR101769749B1 (en) 2015-12-23 2015-12-23 Manufacturing method of double-sided pattern with horizontally controlled-refractive index and double-sided pattern thereby

Country Status (1)

Country Link
KR (1) KR101769749B1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102029928B1 (en) * 2017-12-28 2019-10-08 (재)구미전자정보기술원 Fabrication method of polymer film-based micro mirror array using organic patterning
US10705268B2 (en) 2018-06-29 2020-07-07 Applied Materials, Inc. Gap fill of imprinted structure with spin coated high refractive index material for optical components

Also Published As

Publication number Publication date
KR20170075900A (en) 2017-07-04

Similar Documents

Publication Publication Date Title
US8486753B2 (en) Patterning method of metal oxide thin film using nanoimprinting, and manufacturing method of light emitting diode
CN102470565B (en) Resin mold for imprinting and method for producing same
EP2950330B1 (en) Light-transmitting imprinting mold and method for manufacturing large-area mold
US7994053B2 (en) Patterning method of metal oxide thin film using nanoimprinting, and manufacturing method of light emitting diode
US8168107B2 (en) Method of forming a pattern using nano imprinting and method of manufacturing a mold to form such a pattern
TWI335490B (en) Nano-imprinting process
US20050159019A1 (en) Method for manufacturing large area stamp for nanoimprint lithography
US20150283743A1 (en) Base mold and method of fabricating mold
KR101235360B1 (en) Manufacturing method of ceramic template having fine pattern
KR101565835B1 (en) Fabrication method of replication mold, fine structures using the same and its applications thereof.
KR101022506B1 (en) Pattern transfer method of nanoimprint lithography using shadow evaportation and nanotransfer printing
KR101769749B1 (en) Manufacturing method of double-sided pattern with horizontally controlled-refractive index and double-sided pattern thereby
EP2138896B1 (en) Nano imprinting method and apparatus
KR101575879B1 (en) Patterning method using reversal imprint process
EP3619160B1 (en) Methods for micro and nano fabrication by selective template removal
US20180120696A1 (en) Tool surface nano-structure patterning process
KR20110024881A (en) Manufacturing method of a master mold for forming micro pattern on a film applied to outside of appliances and manufacturing apparatus and method of the film using the master mold and appliances to which the micro pattern film is applied
KR101846236B1 (en) Manufacturing method of double-sided pattern and Transfer tape using double-sided pattern thereby
WO2017073370A1 (en) Film mold and imprinting method
KR101663629B1 (en) metal or metal oxide asymmetric nanostructures using variable shaped imprint stamp
TW201617195A (en) Method for the production of an optical glass element
KR101681753B1 (en) Manufacturing method of metal oxide complex structure using meta-thermal imprinting and photolithography
KR101357087B1 (en) Method for Manufacturing 3-dimensional Nanostructures by Imprint Lithography and 3-dimensional Nanostructures thereby
KR101673971B1 (en) Manufacturing method of metal oxide complex structure using meta-UV imprinting and photolithography
KR101205826B1 (en) Fabrication method of new stamps with various pattern shapes or dimensions using one stamp

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right