200924551 九、發明說明 【發明所屬之技術領域】 本發明是有關於一種發光元件及其製造方法，且特別是 有關於一種發光二極體光條（LED Light Bar)及其製造方法。 【先前技術】 目前，在製作發光二極體光條時，均係先將發光二極體 晶片設置在封裝支架上，其中封裝支架上預設有突起之反射 蓋，而發光二極體晶片則位於反射蓋所圍成之内部區域。一 般而言，封裝支架上的突起反射蓋係在封裝支架製作時，同 時射出成型。再進行打線接合，接著進行封膠程序，以形成 封膠體包覆住發光二極體晶片與導線，並填入反射蓋與發光 二極體晶片之間的空隙之中，而形成發光二極體元件。接 著，利用表面黏著技術（Surface Mounted Technology ; SMT) 將發光二極體元件設置在印刷電路板的預設位置上。最後， 切割印刷電路板，而形成數條發光二極體光條。 然而，這樣的製程須進行多次的封膠程序，而使製程程 序太過繁複。而且，由於製程程序的繁雜，而需加入額外的 架構，如此一來，不僅導致製程成本提高，更造成發光二極 體光條之重量與尺寸的增加。 【發明内容】 因此，本發明之目的就是在提供一種發光二極體光條之 製造方法，其係直接將發光二極體晶片接合在電路板上，再 利用模製成型（Molding)方式製作發光二極體晶片的封膠體 200924551 ’、反射膠體。《，運用本發明之方法可省下製作支架之成 本、發光二極體元件之、、目彳4』、 別滅成本、發光二極體元件之捲帶成 本以及發光二極體元将：i 件之表面黏著封裝的成本，而可大大地 降低製程成本。 ％ 一本υ月之另—目的是在提供一種發光二極體光條，其發 光極體曰曰片係直接封裝載電路板上，因此可省掉封裝支 架。故，發光二極體光條的重量與尺寸均可獲得縮減。 、根據本卷明之上述目的，提出一種發光二極體光條之製 法，至少包括：提供-電路板；設置複數個發光二極體 晶於電路板之-表面上，並使這些發光二極體晶片與電路 連接；形成複數個封谬體分別覆蓋在前述之發光二極 體：片上;形成複數個反射勝體分別包圍在前述之封勝體之 側辨’ Μ及對電路板進行—切割步驟，以形成複數 極體先條。 * —BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to a light-emitting element and a method of fabricating the same, and more particularly to a light-emitting diode strip (LED Light Bar) and a method of fabricating the same. [Prior Art] At present, in the production of the light-emitting diode strips, the light-emitting diode chips are first disposed on the package holder, wherein the package holder is provided with a protruding reflective cover, and the light-emitting diode chip is Located in the inner area enclosed by the reflective cover. In general, the raised reflective cover on the package holder is simultaneously injection molded when the package holder is fabricated. Then, wire bonding is performed, and then a sealing process is performed to form a sealing body covering the LED substrate and the wire, and filling the gap between the reflective cover and the LED chip to form a light emitting diode. element. Next, the surface mount technology (SMT) is used to place the LED components at a predetermined position on the printed circuit board. Finally, the printed circuit board is cut to form a plurality of light-emitting diode strips. However, such a process requires multiple sealing procedures and makes the process too complicated. Moreover, due to the complexity of the process, additional architecture is required, which not only leads to an increase in process cost, but also an increase in the weight and size of the light-emitting diode strip. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a method of fabricating a light-emitting diode strip by directly bonding a light-emitting diode wafer to a circuit board and then using a molding method. Sealant of light-emitting diode wafer 200924551 ', reflective colloid. "Using the method of the present invention can save the cost of manufacturing the bracket, the light-emitting diode component, the target 4", the cost of the replacement, the cost of the coil of the light-emitting diode component, and the light-emitting diode element: i The surface of the piece adheres to the cost of the package, which greatly reduces the cost of the process. % Another month of the month - the purpose is to provide a light-emitting diode strip with a light-emitting diode that is directly packaged on the carrier board, thus eliminating the need for a package holder. Therefore, the weight and size of the light-emitting diode strip can be reduced. According to the above object of the present disclosure, a method for fabricating a light-emitting diode strip includes at least: providing a circuit board; arranging a plurality of light-emitting diodes on the surface of the circuit board, and causing the light-emitting diodes The chip is connected to the circuit; forming a plurality of sealing bodies respectively covering the light-emitting diodes: the sheet; forming a plurality of reflecting bodies respectively surrounding the side of the sealing body and performing the cutting step on the circuit board To form a complex polar body strip. * —
L ::本發明一較佳實施例，上述形成數個封膠體之步驟 二括.對一封膠材料進行-第-模製成型步驟；以及切 除^餘之封膠材料，以形成上述之封膠體。 之牛明之另—較佳實施例，上述形成數個反射膠體 之'=包括對一反射膠材料進行一第二模製成型步驟。 根據本發明之目的，提出一種發光二極體光條勺 括一電路板；複數個發光：極體日日日片設於電路板之^ 上’、中這些發光二極體晶片與電路板電性連# 膠想分別覆蓋在前述之發光二極雜晶片上;：及== 膠體分別包圍在前述之封膠體的侧邊。 射 依照本發明一較佳實施例’上述之封膠體係複數個螢光 200924551 膠體 依照本發明之另—起 體係複數個模製成型結構。、β 4之封膠體與反射膠 【實施方式】 本發明揭露一種發光二極體光制 本發明之敘述更加詳盡輿夂下、衣仏方法。為了使 圖至第6圖之圖式。參'%、下列描述並配合第1 〃 °月“、、第1圖至第6圖’其係緣示依照本發明-較佳實 施例的一種發光二極體光倏制 .疋條的衣私不意圖，其中第i圖至第 4圖係剖面示意圖，且第$圍 心口及弟5圖與ό圖係上視示意圖。在一示 範實施例中，製作如笫6々益， 衣弟6圖所不之發光二極體光條η2時， 可先提供電路板⑽，以供晶片設置於其上，其中此電路板 100上較佳已預先設置有所需之電路布局。在一實施例中， 此電路板100可採一般之印刷電路板。接下來，利用例如貼 合方式，設置數個發光二極體晶片104於電路板100之表面 102上的預設區域上，其中這些發光二極體晶片1〇4分散地 設置在電路板102之表面1〇2上，如第」圖之剖面圖所示。 待這些發光二極體晶片1〇4固定在電路板1〇2之表面ι〇2 上後’可利用常見之電性接合方式’來使發光二極體晶片 1 04與電路板1 〇〇電性連接。舉例而言，可利用打線接合 (Wire Bonding)或覆晶（Flip Chip)接合的方式，來將每個發 光二極體晶片104上之二不同電性電極分別與電路板1〇〇 上之對應接合墊予以電性連接。 接著，可利用例如模製成型（Molding)方式，形成數個 200924551 封膠體108分別霹罢/ @ Λ 刀J復盍在電路板1〇〇上之 i (M上。在一示範菅 有發先一極體晶片 覆签思“ 形成前述封膠體1⑽時，可弈 覆=封膠材料106於電路…表 = 封膠=⑽完全覆蓋住發光二極體晶片⑽ = 模具壓設在封膠材斜L 接者利用 /何科100上，以對此封躁 成型步驟，藉以在每個發光一極……06進仃拉製 ^ ^ ^ 一極體晶片104上大致塑造出 裝體的結構，而形成如篦 出封L: In a preferred embodiment of the present invention, the second step of forming a plurality of encapsulants comprises: performing a -first molding step on a piece of adhesive material; and cutting the remaining sealing material to form the above Sealing body. In the preferred embodiment, the above-described formation of a plurality of reflective colloids includes a second molding step of a reflective rubber material. According to the purpose of the present invention, a light-emitting diode strip includes a circuit board; a plurality of light-emitting elements: a pole body day and a day piece are disposed on the circuit board, and the light-emitting diode chip and the circuit board are electrically The splicing # glue is respectively covered on the above-mentioned luminescent dipolar wafer; and == the colloid is respectively surrounded by the side of the aforementioned sealing body. In accordance with a preferred embodiment of the present invention, the above-described encapsulating system has a plurality of phosphors. 200924551 Colloids In accordance with the present invention, a plurality of molding structures are provided. The sealing body and the reflective rubber of β 4 [Embodiment] The invention discloses a light-emitting diode light-making method, which is a more detailed description of the present invention. In order to make the figure to the figure of Figure 6. Referring to '%, the following description and in conjunction with the first 〃 ° ", the first figure to the sixth figure 'the lining of the light-emitting diode according to the present invention - a preferred embodiment of the 疋 的 的Private intent, in which the i-th to the fourth-figure are schematic cross-sectional views, and the first and second views of the circumstance and the dynasty are shown in the schematic diagram. In an exemplary embodiment, the production is as follows: 笫6々益, 衣弟6 In the case of the light-emitting diode strip η2, a circuit board (10) may be provided for the wafer to be placed thereon, wherein the circuit board 100 is preferably pre-configured with a desired circuit layout. The circuit board 100 can be used as a general printed circuit board. Next, a plurality of light emitting diode chips 104 are disposed on a predetermined area on the surface 102 of the circuit board 100 by, for example, a bonding method, wherein the light emitting diodes The polar body wafers 1〇4 are dispersedly disposed on the surface 1〇2 of the circuit board 102 as shown in the cross-sectional view of the first drawing. After the light-emitting diode wafers 1〇4 are fixed on the surface ι2 of the circuit board 1〇2, the LEDs can be electrically connected to the circuit board 1 by using a common electrical bonding method. Sexual connection. For example, wire bonding or flip chip bonding can be used to match the two different electrical electrodes on each of the LED chips 104 to the circuit board 1 The bond pads are electrically connected. Then, for example, a molding method can be used to form a plurality of 200924551 encapsulants 108, respectively, which are smashed on the circuit board 1 (i. The first one of the first body wafers is covered. When forming the above-mentioned encapsulant 1 (10), it can be covered = the sealing material 106 is in the circuit... Table = Sealing = (10) completely covering the LED wafer (10) = the mold is pressed on the sealing material The oblique L-connector utilizes /He Ke 100 to form the mounting structure for the sealing forming step, thereby substantially shaping the structure of the package on each of the light-emitting diodes. Forming a seal
制後，仍有部分之4+瞪# w , 再，、乂姨具I H t〇4 ^ 膠材科1G6留存在相鄰二發光二極體bb 片1 04之間的區域上。一给 曰曰 Α ^ 在汽把例中，封膠材料106可為— 般之透明膠體。在另—訾竑 有螢光粉之膠體。、1 ’封膠材料⑽可採用内摻 :著：封膠材料1〇6進行一道切割程序，以切除電路 之 '"面102上的多餘封膠材料106,而暴露出部分之 元成封勝材料10 6之切割後，即可 在電路板⑽之表S1G2上形成多個封膠體⑽，其中這些 封膠體1G8刀別對應包覆在發光二極體晶片⑽上，而相鄰 之一發光二極體晶片l〇4；^p弓目„ υ4之間則相隔一段間隔，如第3圖之 剖面圖所示。由於封膠材料 ^ 符斜106可為一般之透明膠體、或摻 有螢光粉之螢光膠體，囡μ [u此封膠體108可為一般透明封膠 體、或螢光膠體。 接下來可利用例如模製成型方式，形成數個反射勝體 <於電路板1GG之表面1G2上，並使這些模製成型結構 的反射膠體11 〇分別斟庵4^ 于應匕圍在發光二極體晶片1 〇4之封膠 體106的側邊，如第 _ 圖之纠面圖與第5圖之上視圖所示。 逆些包圍在發光二極體晶片1〇4之側邊的反射膠體HO可將 200924551 _朝側邊發出之光予以反射，使發 tv出之光大都能勒其出先面而從封谬體⑽ 發出。在一實施例中，反射勝體⑴可為白色夥體。完成： =體m之製作後，在電路板i00之表面ί〇2上之相鄰二 戶=7極體晶片，之間相隔—段苑離，如第5圖之上視圖 完成反射膠體uo之設置後，即可對電路板ι〇〇進行切 =驟，而將—排排的發光二極體晶片1〇4切割出來，而形 成夕個條狀的發光：極體純112，如第6圖之上視圖所 ::因此’在一發光二極體光條112中，主要由電路板刚、 數個排列在電路板1〇〇之表φ 1〇2上的發光二極體晶片 刚、分別對應包覆住所有發光：極體晶片1⑽之數個封膠 體108、以及分別對應包圍在所有發光二極體晶片之封 膠體108側邊的數個反射膠體11〇所組成。 ϋ '藉由將發k極體晶片直接封裝在電路板上，並利用模 製成型的方式來製作每個發光二極體晶片之封膠體鱼反射 勝體’可無需使用封裝支架、捲帶，亦可省下表面黏著封裝 程序。而且，彳直接在電路板上進行發光二極體晶片的測 試，而可省下發光二極體元件的測試程序。 由上述本發明之實施例可知，本發明之一優點就是因為 本發明之發光二極體光條之製造方法係直接將發光二極體 晶片接合在電路板上，再利用模製成型方式製作發光二極體 晶片的封膠體與反射膠體。因此，運用本發明之方法可省下 製作支架之成本、發光二極體元件之測試成本、發光二極體 元件之捲帶成本以及發光二極體元件之表面黏著封Z的成 200924551After the system, there is still a part of 4+瞪# w , and then, the cookware I H t〇4 ^ The glue material 1G6 remains in the area between the adjacent two light-emitting diodes bb piece 104. A given 曰曰 Α ^ In the steam cap example, the sealant material 106 can be a transparent colloid. In another 訾竑 there is a colloid of phosphor powder. 1 'sealing material (10) can be mixed with: sealing material 1〇6 for a cutting process to remove the excess sealing material 106 on the '" face 102 of the circuit, and expose part of the sealing After the cutting of the material 106, a plurality of sealing bodies (10) can be formed on the surface S1G2 of the circuit board (10), wherein the sealing bodies 1G8 are correspondingly coated on the LED wafer (10), and one of the adjacent ones is illuminated. The diode wafer l〇4; ^p bow „ υ 4 is separated by a gap, as shown in the cross-sectional view of Figure 3. Since the sealing material ^ 斜 oblique 106 can be a general transparent colloid, or mixed with firefly Fluorescent colloid of light powder, 囡μ [u sealant 108 can be a general transparent sealant, or a fluorescent colloid. Next, for example, a molding method can be used to form a plurality of reflective swells < on the circuit board 1GG On the surface 1G2, and the reflective colloids 11 这些 of the molded structures are respectively disposed on the side of the encapsulant 106 of the LEDs 1 〇 4, as described in the figure _ The top view is shown in the top view of Fig. 5. The reflection on the side of the light-emitting diode wafer 1〇4 is reversed. The body HO can reflect the light emitted from the side of the 200924551 _ to the side, so that the light emitted by the tv can be pulled out from the sealing body (10). In one embodiment, the reflecting body (1) can be a white body. Finish: = After the production of the body m, the adjacent two households on the surface of the circuit board i00 〇 2 = 7 pole body wafers, separated by a section - Duanyuan, as shown in Figure 5, complete the reflection colloid uo After the setting, the circuit board can be cut and squid, and the row of the LED chips 1 〇 4 is cut out to form a strip of illuminating light: the polar body 112, as described 6 above view:: Therefore, in a light-emitting diode strip 112, mainly from the circuit board, a few light-emitting diode wafers arranged on the surface φ 1〇2 of the circuit board 1 Correspondingly, all the light-emitting bodies are covered: a plurality of sealants 108 of the polar body wafer 1 (10), and a plurality of reflective colloids 11 对应 corresponding to the sides of the sealant 108 of all the light-emitting diode wafers. The light-emitting body wafer is directly packaged on the circuit board, and each light is made by molding. The sealing body of the diode chip can be used to eliminate the need for package holders and tapes, and the surface mount package can be omitted. Moreover, the test of the light-emitting diode chip can be performed directly on the circuit board, and the process can be omitted. The test procedure of the lower light emitting diode element. It is obvious from the above embodiments of the present invention that the manufacturing method of the light emitting diode light strip of the present invention directly bonds the light emitting diode wafer to the circuit board. Then, the encapsulant and the reflective colloid of the LED wafer are fabricated by molding. Therefore, the method of the invention can save the cost of manufacturing the bracket, the test cost of the LED component, and the LED. The tape cost of the component and the surface adhesive seal of the LED component are formed into 200924551
本，而可大大地降低製程成本D 由上述本發明之實施例可知，本發明之另一優點就是因 為本發明之發光二極體光條的發光二極體晶片係直接封裝 載電路板上，因此可省掉封裝支架。故，發光二極體光條= 重量與尺寸均可獲得縮減。 、 雖然本發明已以一較佳實施例揭露如上，然其並非用以 限定本發明，任何在此技術領域中具有通常知識者，在不脫 離本發明之精神和範圍内，當可作各種之更動與潤飾，因此 本發明之保護範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 第1圖至第6圖係繪示依照本發明—較佳實施例的一種 發光二極體光條的製程示意圖’其中第i圖至第4圖係剖面 示意圖’且第5圖與6圖係上視示意圖。 【主要元件符號說明】According to the embodiment of the present invention, another advantage of the present invention is that the light-emitting diode chip of the light-emitting diode strip of the present invention is directly packaged on the circuit board. Therefore, the package holder can be omitted. Therefore, the light-emitting diode strip = weight and size can be reduced. While the present invention has been described above in terms of a preferred embodiment, it is not intended to limit the invention, and any of those skilled in the art can make various modifications without departing from the spirit and scope of the invention. The scope of protection of the present invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 to FIG. 6 are schematic diagrams showing a process of a light-emitting diode strip according to the preferred embodiment of the present invention, wherein the i-th to fourth-fourth views are schematic views and 5 and 6 are schematic views of the top view. [Main component symbol description]
102 :表面 106 :封裝持料 110 :反射膠體 100 :電路板 104 :發光二極體晶片 108 :封襞膠體 11 2 :發光二極體光條 10102: Surface 106: Package holding material 110: Reflective colloid 100: Circuit board 104: Light-emitting diode wafer 108: Sealing gel 11 2: Light-emitting diode strip 10