200922451 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種光源模組，尤其係一種能將其發光元 件產生的熱量有效排除之光源模組。 【先前技術】 發光二極體（Light Emitting Diode，LED)為一種半導體 光源’其電、光特性及壽命對溫度敏感，在此，一種於溫 度變化過程中還能保持穩定光強的新型發光二極體可參見 Yukio Tanaka 等人於文獻 IEEE Transactions On Electron Devices，V〇l. 41，No.7, July 1994 中之 A Novel Temperature-Stable Light-Emitting Diode —文。一般而言， 較高的溫度會導致低落之内部量子效應並且壽命亦會明顯 縮短；另一方面，半導體之電阻隨著溫度的升高而降低， 滑落的電阻會帶來較大的電流及更多的熱產生，造成熱累 積現象的發生；此一熱破壞循環往往會加速破壞高功率 LED光源模組。 如圖1所示，一種典型的LED光源模組1〇〇包括：一 印刷電路板（Printed Circuit Board, PCB) 101、複數個發光元 件102(如，LED)及一散熱元件103。印刷電路板1〇1包括 兩個相對設置的表面（圖未標示）。散熱元件103與複數個發 光兀件102分設於該印刷電路板101之兩個相對的表面 上’該印刷電路板101上設置有金屬線路以與複數個發光 70件1〇2形成電連接。該散熱元件103可藉由導熱膏與印 刷電路板101形成熱性連接，其遠離印刷電路板101的一 200922451 侧通常設置有複數個散埶 散熱。 政…韓片1031用以增大表面積以利於 ，印刷電路板1〇1上與發光元件 而散熱元件103僅針對整個 = 進灯均-化的敎熱，沒有對熱量高的區域 极如 =置:致難以將印刷電路板1〇1上與發 對的位置上的高熱量快速有效的排除。 〇2相 【發明内容】 么且I ^以實施例說明—種具良好散熱性能之光为模 j，其可將針對印刷電路板上與發光元件 ：：极 尚熱量快速有效的排除。 、位置上的 一種具良好散熱性能之光源模組， 路板、一散埶开杜 ，、υ括.一印刷電 -第—二發光元件。該印刷電路板呈有 ::表面、一與該第—表面相對的第二表面 心:=τ熱管及複數個散編，該:座： 之m , 第二表面相對的第四表面，該基座 管分別丧設於該複數個溝㈣二f复數個熱 電路C形部，該平板部用於吸收該印： 表'==散熱鰭片從該第四表面沿遠離該第Ϊ 的二 =2複數個發光元件設置於該印刷電路板 路板开:=: ，該複數個發光元件與該印刷電 板形成電連接且分職該複數個熱管之平板部形成2 200922451 連接。 相對於先前技術，該散熱元件之基座上設置有溝槽， 該溝槽與該發光元件相對且其中設置有熱管，該熱管之平 板部可吸收該印刷電路板上的熱量，在此主要係吸收印刷 電路板上與發光元件相對的位置上的高熱量，該熱管之弧 形部及與其相應的溝槽之側壁具有較大的熱接觸面積，從 而可獲得較佳的散熱效果。 【實施方式】 下面將結合附圖對本發明實施例作進一步之詳細說 明。 參見圖2及圖3,本發明實施例提供之具良好散熱性能 之光源模組10，其包括：一印刷電路板11、複數個發光元 件12及一散熱元件13。該散熱元件13包括一基座131， 複數個熱管132及複數個散熱鰭片133。 參見圖4及圖5，該印刷電路板11包括一第一表面 112，一與該第一表面112相對的第二表面114。該印刷電 路板11上設置有電氣連線（圖未示），用以與該複數個發光 元件12形成電連接。該印刷電路板11之基材可選用玻璃 纖維或陶瓷等電絕緣導熱材質，其上的電氣連線可選用銅 等金屬導電材質，該印刷電路板11亦可為披覆有絕緣材質 之銘基材或銅基材，例如：金屬芯印製板（Metal Core Printed Circuit Board，MCPCB)。 該複數個發光元件12設置於該印刷電路板11之與該 散熱元件13相對的一側，並與該印刷電路板11緊密接觸， 200922451 該印刷電路板11之發光面128相對遠離該第一表面112。 該複數個發光元件12分別設置有第一電極122及第二電極 124。該複數個發光元件12經由其第一、第二電極122，124 與印刷電路板11形成電連接，並經由與其緊密接觸的印刷 電路板11與散熱元件13之複數個熱.管132分別形成熱性 連接（如圖4所示）。該複數個發光元件12通常為點光源， 其分佈及數量可依該照明裝置10之實際亮度需求而定，並 不限於圖2及圖3所示的三列、每列五個，可為一列、兩 列、四列或更多，每列亦可為一，兩到四個或更多。 該複數個發光元件12可選用表面貼裝型發光二極體 (Light Emitting Diode，LED)。該發光二極體通常還包括至 少一發光二極體晶片（LED Chip)以及用於密封該發光二極 體晶片之封裝體（Encapsulant);該第一電極122及第二電極 124與該發光二極體晶片形成電連接。採用該種封裝好的發 光二極體，可簡化照明裝置10的組裝以利於量產。該發光 二極體並不限於上述之表面貼裝型，還可為其他適當的封 裝類型。另，該複數個發光二極體可選用白光發光二極體， 或其他能產生滿足實際需求顏色之發光二極體。 該基座131包括一第三表面1312，一與該第三表面 1312相對的第四表面1316,以及複數個沿該第三表面1312 向内開設的溝槽1314。於本實施例中，該複數個溝槽1314 均為長條型結構且平行設置，每個溝槽1314對應一熱管 132。該溝槽1314並不限於圖2及圖3中所示的弧形溝槽 及長條型結構，其還可根據熱管132之形狀將其設計成其 10 200922451 他形狀及結構之溝槽。該基座131可由導熱性能較佳的且 質地較硬的材質如銅等製成。 該複數個熱管132均為密閉中空結構，並分別嵌設於 " 該複數個溝槽1314内。每個熱管132中都填充有流體（圖 未示），例如水、酒精等，且每個熱管132均包括一平板部 1321、一與該平板部1321相接的弧形部1322以及兩個分 別設置於端部之側板（圖未示）。該弧形部1322之與其弧頂 相對的兩端與該平板部1321相連，該平板部1321與弧形 部1322之兩端部分別與該侧板相連，從而形成該密閉中空 結構。於本實施例中，該弧形部1322係與該溝槽1314相 配合之弧形，當然亦可為與該溝槽1314相配合之其他形 狀，例如其中之一或若干個熱管132之截面形狀為D形。 該平板部1321之厚度T大於該弧形部1322之厚度S，進 而可增加熱管132之平板部1321之熱均勻性。該平板部 1321與該印刷電路板11直接形成熱接觸，或藉由導熱膠等 熱介面材質熱性連接以減小印刷電路板11與熱管132之間 \ 的接觸熱阻。該弧形部1322與其相應的溝槽1314之側壁 直接形成熱接觸，或於弧形部1322與溝槽1314之侧壁之 間設置熱介面材質以減小接觸熱阻。該熱管132可由導熱 性能較佳的且質地較軟的材質如鋁等製成，以與質地較硬 的基座131相搭配，從而使熱管132之弧形部1322與基座 131上的溝槽1314配合之更緊密。 該發光元件12發出之熱量大部分經由該印刷電路板11 被熱管132之平板部1321吸收，進而傳入該熱管132内， 11 200922451 並被熱管132内之流體吸收，從而使該流體相變為氣態； 氣態之流體上升至該弧形部1322，該氣態流體之熱量被傳 入該弧形部1322，並進一步傳入該基座131及複數個散熱 ' 鰭片133以消散掉。較佳的，可於該複數個熱管132之弧 形部1322之内側壁上設置毛細結構.1323，例如於弧形部 1322之内側壁上設置凹槽或分佈金屬微粒等，從而氣態之 流體於該弧形部1322之内侧壁遇冷凝結後可於毛細結構 1323之導引下流回該平板部1321，由此可進一步提升熱管 / 132之熱導引效率。 該複數個散熱鰭片133從該基座131之第四表面1316 沿遠離該第三表面1312的方向延伸。該複數個散熱鰭片 133之設置可增大該基座131之散熱表面積，進而可達成將 熱管132傳遞來的熱量迅速排除之目的。該複數個散熱鰭 片133可由導熱性能較佳的材質如鋁、銅及其合金等製成， 其與基座131通常係一體成型的。 / 本發明實施例，經由散熱元件13之結構設置，將熱管 132嵌設於基座131之溝槽1314内，使得設置於該溝槽1314 内之熱管132之平板部1321快速有效的吸收印刷電路板11 上與發光元件12相對的位置上的高熱量，熱管132之弧形 部1322之散熱面積大於平板部1321之吸熱面積從而使得 該弧形部132及與其相應的溝槽1314之側壁具有較大的熱 接觸面積，進而可獲得較佳的散熱效果。另，該熱管132 採用導熱性能較佳且質地較軟的材質搭配質地較硬的基座 131可使二者配合之更緊密，從而進一步加快了發光元件 12 200922451 12產生的熱量導引至散熱元件13並排除之速率；每個熱管 132之平板部1321之厚度大於其弧形部1322之厚度，可增 加熱管132之平板部1321之熱均勻性。 綜上所述，本發明確已符合發明專利之要件，遂依法 提出專利申請。惟’以上所述者僅為本發明之較佳實施方 式，自不能以此限制本案之申請專利範圍。舉凡熟悉本案 技藝=人士援依本發明之精神所作之等效修飾或變化，皆 應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 係先前技術中之-種LED裝置之側視圖 圖 圖2係本發明實施例之光源模組之主視圖 圖3係本發明實施例之光源模組之側視圖。 圖4係圖2所示光源模組之截面示意圖。 =圖4所示光源模組之分解後之截面 主要件符號說明】 100 ， 10 11 ’ 101 工2 ’ 1〇2 U ’ 103 112 114 122 124 128 光源模組 印刷電路板 發光元件 散熱元件 第—表面 第二表面 第—電極 第二電極 發光面 13 200922451 基座 131 散熱鰭片 133 ， 1031 执管 *、、、 P 132 第三表面 1312 溝槽 1314 第四表面 1316 平板部 1321 弧形部 1322 毛細結構 1323 14200922451 IX. Description of the Invention: [Technical Field] The present invention relates to a light source module, and more particularly to a light source module capable of effectively eliminating heat generated by a light-emitting element thereof. [Prior Art] A Light Emitting Diode (LED) is a semiconductor light source whose electrical, optical characteristics and lifetime are sensitive to temperature. Here, a new type of light-emitting diode that maintains stable light intensity during temperature changes The polar body can be found in Yukino Tanaka et al., IEEE Transactions On Electron Devices, V.l. 41, No. 7, July 1994, A Novel Temperature-Stable Light-Emitting Diode. In general, higher temperatures result in low internal quantum effects and a much shorter lifetime; on the other hand, the resistance of the semiconductor decreases with increasing temperature, and the falling resistance causes a larger current and more More heat is generated, causing thermal accumulation; this thermal destruction cycle tends to accelerate the destruction of high-power LED light source modules. As shown in FIG. 1, a typical LED light source module 1A includes a printed circuit board (PCB) 101, a plurality of light emitting elements 102 (eg, LEDs), and a heat dissipating component 103. The printed circuit board 101 includes two oppositely disposed surfaces (not shown). The heat dissipating component 103 and the plurality of light emitting elements 102 are disposed on two opposite surfaces of the printed circuit board 101. The printed circuit board 101 is provided with a metal circuit to form an electrical connection with a plurality of light emitting devices 110. The heat dissipating component 103 can be thermally connected to the printed circuit board 101 by a thermal conductive paste. A side of the 200922451 remote from the printed circuit board 101 is usually provided with a plurality of heat dissipation. The Korean film 1031 is used to increase the surface area to facilitate the printing of the printed circuit board 1〇1 with the light-emitting elements, and the heat-dissipating element 103 is only for the entire heat of the lamp, and there is no region where the heat is high. : It is difficult to quickly and effectively eliminate the high heat on the printed circuit board 1〇1 and the paired position. 〇 2 phase [Summary] and I ^ as explained in the embodiment - a kind of light with good heat dissipation performance is a mode j, which can quickly and effectively eliminate the heat on the printed circuit board and the light-emitting element. In the position, a light source module with good heat dissipation performance, a road board, a divergent opening, and a cover. A printed electric-second light-emitting element. The printed circuit board has: a surface, a second surface center opposite to the first surface: a heat pipe of τ and a plurality of loose grooves, wherein: a seat: m, a fourth surface opposite to the second surface, the base The seat tube is respectively disposed in the plurality of grooves (four) and two f-number of thermal circuit C-shaped portions, and the flat plate portion is used for absorbing the ink: Table '== heat-dissipating fins from the fourth surface along the second side away from the second 2 a plurality of light-emitting elements are disposed on the printed circuit board board: =:, the plurality of light-emitting elements are electrically connected to the printed board, and the flat portion of the plurality of heat pipes is divided to form a connection 2 200922451. Compared with the prior art, the base of the heat dissipating component is provided with a groove opposite to the light emitting component and a heat pipe is disposed therein, and the flat portion of the heat pipe can absorb heat on the printed circuit board. Absorbing high heat on the printed circuit board at a position opposite to the light-emitting element, the curved portion of the heat pipe and the sidewall of the corresponding groove have a large thermal contact area, so that a better heat dissipation effect can be obtained. [Embodiment] Hereinafter, embodiments of the present invention will be further described in detail with reference to the accompanying drawings. Referring to FIG. 2 and FIG. 3, a light source module 10 with good heat dissipation performance according to an embodiment of the present invention includes: a printed circuit board 11, a plurality of light emitting elements 12, and a heat dissipating component 13. The heat dissipating component 13 includes a pedestal 131, a plurality of heat pipes 132 and a plurality of heat dissipating fins 133. Referring to Figures 4 and 5, the printed circuit board 11 includes a first surface 112, a second surface 114 opposite the first surface 112. The printed circuit board 11 is provided with an electrical connection (not shown) for electrically connecting to the plurality of light-emitting elements 12. The substrate of the printed circuit board 11 may be made of an electrically insulating and thermally conductive material such as glass fiber or ceramic. The electrical connection may be made of a metal conductive material such as copper, and the printed circuit board 11 may also be covered with an insulating material. Material or copper substrate, for example: Metal Core Printed Circuit Board (MCPCB). The plurality of light-emitting elements 12 are disposed on a side of the printed circuit board 11 opposite to the heat-dissipating component 13 and are in close contact with the printed circuit board 11, and the light-emitting surface 128 of the printed circuit board 11 is relatively far from the first surface. 112. The plurality of light-emitting elements 12 are provided with a first electrode 122 and a second electrode 124, respectively. The plurality of light-emitting elements 12 are electrically connected to the printed circuit board 11 via the first and second electrodes 122, 124 thereof, and are thermally formed by the plurality of heat pipes 132 of the printed circuit board 11 and the heat dissipating member 13 in close contact therewith. Connection (as shown in Figure 4). The plurality of light-emitting elements 12 are generally point light sources, and the distribution and the number thereof may be determined according to the actual brightness requirements of the illumination device 10. The number of the light-emitting elements 12 is not limited to the three columns shown in FIG. 2 and FIG. , two columns, four columns or more, each column can also be one, two to four or more. The plurality of light-emitting elements 12 may be selected from a surface mount type light emitting diode (LED). The light emitting diode generally further includes at least one LED chip and an encapsulant for sealing the LED chip; the first electrode 122 and the second electrode 124 and the light emitting diode The polar body wafers form an electrical connection. With such a packaged light-emitting diode, the assembly of the lighting device 10 can be simplified to facilitate mass production. The light-emitting diode is not limited to the above-described surface mount type, and may be of other suitable package types. In addition, the plurality of light emitting diodes may be selected from white light emitting diodes, or other light emitting diodes capable of producing colors that meet actual needs. The pedestal 131 includes a third surface 1312, a fourth surface 1316 opposite the third surface 1312, and a plurality of grooves 1314 extending inwardly along the third surface 1312. In this embodiment, the plurality of trenches 1314 are all elongated and arranged in parallel, and each of the trenches 1314 corresponds to a heat pipe 132. The groove 1314 is not limited to the curved groove and elongated structure shown in Figs. 2 and 3, and may be designed as a groove of its shape and structure according to the shape of the heat pipe 132. The susceptor 131 may be made of a material having a good thermal conductivity and a hard texture such as copper or the like. The plurality of heat pipes 132 are each a closed hollow structure and are respectively embedded in the plurality of grooves 1314. Each heat pipe 132 is filled with a fluid (not shown), such as water, alcohol, etc., and each heat pipe 132 includes a flat plate portion 1321, an arc portion 1322 that is in contact with the flat plate portion 1321, and two separate portions. Set on the side panel of the end (not shown). Both ends of the curved portion 1322 opposite to the arc top are connected to the flat plate portion 1321, and both end portions of the flat plate portion 1321 and the curved portion 1322 are respectively connected to the side plates, thereby forming the closed hollow structure. In this embodiment, the curved portion 1322 is curved in cooperation with the groove 1314, and may of course be other shapes matched with the groove 1314, for example, the cross-sectional shape of one or several heat pipes 132. It is D-shaped. The thickness T of the flat portion 1321 is larger than the thickness S of the curved portion 1322, thereby increasing the thermal uniformity of the flat portion 1321 of the heat pipe 132. The flat plate portion 1321 is in direct thermal contact with the printed circuit board 11, or is thermally connected by a thermal interface material such as a thermal conductive adhesive to reduce the thermal contact resistance between the printed circuit board 11 and the heat pipe 132. The curved portion 1322 is in direct thermal contact with the sidewall of the corresponding trench 1314, or a thermal interface material is disposed between the curved portion 1322 and the sidewall of the trench 1314 to reduce contact thermal resistance. The heat pipe 132 may be made of a material having a relatively good thermal conductivity and a soft texture such as aluminum to match the hard base 141, so that the curved portion 1322 of the heat pipe 132 and the groove on the pedestal 131. 1314 is more closely matched. The heat generated by the light-emitting element 12 is mostly absorbed by the flat portion 1321 of the heat pipe 132 via the printed circuit board 11, and is further introduced into the heat pipe 132, 11 200922451 and absorbed by the fluid in the heat pipe 132, thereby causing the fluid to phase change. The gaseous state rises to the curved portion 1322, and the heat of the gaseous fluid is introduced into the curved portion 1322 and further transmitted to the susceptor 131 and the plurality of heat-dissipating fins 133 to dissipate. Preferably, a capillary structure .1323 is disposed on the inner side wall of the curved portion 1322 of the plurality of heat pipes 132. For example, a groove or a metal particle is disposed on the inner side wall of the curved portion 1322, so that the gaseous fluid is The inner side wall of the curved portion 1322 can be condensed and returned to the flat plate portion 1321 under the guidance of the capillary structure 1323, thereby further improving the heat guiding efficiency of the heat pipe/132. The plurality of heat dissipation fins 133 extend from the fourth surface 1316 of the susceptor 131 in a direction away from the third surface 1312. The arrangement of the plurality of heat dissipation fins 133 can increase the heat dissipation surface area of the susceptor 131, thereby achieving the purpose of quickly eliminating heat transferred from the heat pipe 132. The plurality of heat dissipating fins 133 may be made of a material having a good thermal conductivity such as aluminum, copper, an alloy thereof, or the like, which is generally integrally formed with the susceptor 131. In the embodiment of the present invention, the heat pipe 132 is embedded in the groove 1314 of the susceptor 131 via the structure of the heat dissipating component 13, so that the flat portion 1321 of the heat pipe 132 disposed in the groove 1314 absorbs the printed circuit quickly and effectively. The high heat in the position of the plate 11 opposite to the light-emitting element 12, the heat-dissipating area of the curved portion 1322 of the heat pipe 132 is larger than the heat-absorbing area of the flat plate portion 1321 such that the arc-shaped portion 132 and the sidewall of the corresponding groove 1314 thereof are compared. A large thermal contact area provides better heat dissipation. In addition, the heat pipe 132 is made of a material having a better thermal conductivity and a softer texture, and the base 131 having a harder texture can be used to make the two pieces closer together, thereby further accelerating the heat generated by the light-emitting element 12 200922451 12 to the heat-dissipating element. 13 and the rate of elimination; the thickness of the flat portion 1321 of each heat pipe 132 is greater than the thickness of the curved portion 1322, which can increase the thermal uniformity of the flat portion 1321 of the heat pipe 132. In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art, in accordance with the spirit of the invention, are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 2 is a front view of a light source module according to an embodiment of the present invention. FIG. 3 is a side view of a light source module according to an embodiment of the present invention. 4 is a schematic cross-sectional view of the light source module shown in FIG. 2. = The main part symbol description of the disassembled section of the light source module shown in Fig. 4] 100, 10 11 '101 2' 1〇2 U '103 112 114 122 124 128 Light source module printed circuit board light-emitting element heat-dissipating element - Surface second surface first electrode second electrode light emitting surface 13 200922451 pedestal 131 heat sink fin 133, 1031 tube *, ,, P 132 third surface 1312 groove 1314 fourth surface 1316 flat portion 1321 curved portion 1322 capillary Structure 1323 14