200921830 九、發明說明： 【發明所屬之技術領域】 本發明係提供-種晶圓升降台及其測試機台，特別係指具有感測裝置之晶 圓升降台及其測試機台。 【先前技術】 目前在進行晶圓測試前，操作員會將包含有晶圓片之晶舟(ca喊^置於晶圓 升降台之晶圓盒(pod)内，再藉由晶圓升降台將晶圓片往下傳送至傳送臂可存取 ,的位置，以進行後續晶圓測試。然而當晶舟在晶圓升降台輸送過程中，或多或 S少會因晶舟移動而造《舟内之晶κ片產生異位的現象。在先前技術之美國專 利號5,601，484已揭露一種具有感測裝置之晶圓輸送裝置，如第一圖所示，其 特徵在於此感測裝置41係水平地安裝在晶圓盒4下方之容置板兩部位，當進行 晶圓盒輸送晶舟6的過程中，此感測裝置41用以感測晶舟6内之晶片是否發生 異位，以避免晶舟6内之晶圓片在輸送過程中發生破片的情形。此外，先前技 術之美國專利號6,775,918另外揭露一種具有定位感測裝置之晶舟盒，其特徵在 於此定位感測裝置係為磁簧開關，當晶舟盒置於容置台發生異位情況時，藉由 磁簧開關的彈簧力以阻卻晶舟盒的門意外地被關上而造成晶圓片發生破片的情 I形。然而當傳動臂在抓取晶舟盒内之晶圓片的過程t，上述前案無法解決傳動 臂是否與晶舟盒内之晶圓片正確定位而避免破片的情形’或者確保傳動臂是否 在舟盒内正確作動以抓取晶圓片，因此如何解決上述問題已是業界刻不容=的 課題。 【發明内容】 為了解決上述之問題，本發明提供一種晶圓升降台及晶圓測試機。其中此 曰曰圓升降台包含一感測裝置(sensingdevice)，當晶舟内的晶圓片出現位置的偏移 而與該基準面戦干涉_發(trigger·)城赚置時，停止晶K升降台的運作。 6 200921830 此外’此晶圓測試機主要包含有一晶圓升降台’藉由其内之感測裝置，可停止 測試機的所有運作。 因此，本發明的主要目的在於提供一種晶圓升降台，以避免晶圓盒輸送晶舟 時’因晶®片異位而造成破片的問題。 本發明的次要目的在於提供一種晶圓升降台，以確保傳動臂是否在舟盒内正 確作動以抓取晶圓片’而避免傳動臂誤觸晶圓造成破片的問題。 本發明的又一目的係提供一種晶圓測試機，以避免晶圓盒輸送晶舟時，因 晶圓片位移而造成破片的問題。 / k: 本發明的再一目的係提供一種晶圓測試機，以確保傳動臂是否在舟盒内正 確作動以抓取晶圓片，而避免傳動臂誤觸晶圓造成破片的問題。 據此’本發明係提供一種晶圓升降台(devat〇r)，包含有第一容置區與第二容 置區，第-容置區藉以容置至少一晶圓盒(wafer P0D)，晶圓盒具有一開口以容 許承載晶圓片之晶舟(wafer cassette)自晶圓盒内移出至該第二容置區；一驅動模 組⑺疏⑽-^用以提供該晶舟的位置升降：一感測裝置㈣如㈣心）； 以及-控制裝置，㈣接收來自該感測裝置所傳送之錢，並根據該信號以控 制該晶圓升降台的作動。上述晶圓升降台的特徵在於感測裝置之感測區在第二 容置區内形成至少-個基準面，基準面鄰近於晶圓片之外緣，且垂直於晶圓片 之平面’當晶舟内的晶圓片出現位置的偏移而與該基準面形成干涉而觸發 (trigger)該感測裝置時，該控制裝置即停止晶圓升降台的運作。 本發明進-步提供-種晶圓測試機，至少包含—個可容置晶圓的晶圓升降 台、-侧試頭、-個晶圓運動平台及—個抓取裝置，該抓轉置伽以抓取 該晶圓升降台内的晶圓片’移送至該晶圓運動平台，而供該測試頭進行晶圓測 試，其中該晶圓升降台包含有第-容置區與第二容置區，第—容置區藉以 至少-晶圓盒，晶圓盒具有-開卩以容許承載晶圓片之晶舟自晶圓盒⑽出至 第二容置區’-驅賴_nvingm(xiule)，肋提供晶舟触置升降 置(讎ingdevice);以及-控制裝置，用以接收來自感測裝置所傳送之伸: 200921830 的作動。上述之晶圓測試機的特徵在於感魏置 測試機的運作 且垂直於晶圓片之平面，當晶舟内的晶圓片出現位置的偏移、或抓 誤動作而與該基準面形成干涉而觸修㈣感測裝置日夺，控制裝置即停止晶圓曰 【實施方式】 由於本發明係揭露—種晶圓升降台及其晶圓測試機，其中所利用之 ^試的基本原理，已為侧技術領域具有通常知識者所能明瞭，故以下文說 明’不再作完整描述。同時，以下文中所對照之圖式，係表達與本發明特徵有 關之結構示意’並未亦不需要依據實際尺寸完整繪製，盘先敛明。 首先請參考第二圖，係根據本發明所提供之第一較佳實施例，為一種曰圓 升降台(devator)之示意圖。一種晶圓升降台2〇，包含有第一容置區Μ、第:容 置區22、一驅動模組25(driving咖她）、一感測裝置26(_^如 以及 一控制裝置27。 第今置區21藉以容置至少一晶圓盒23(waferp〇D)，晶圓盒23具有一開 (口以谷許承載晶圓片之晶舟24(wafer _咖)自晶圓盒23内移出至第二容置區 22。驅動模組25，用以提供晶舟24的位置升降。 為了較先前技術提供更佳的晶圓片之異位偵測效果，本發明之感測裝置％ 包括複數個感測器26卜藉以形成在第二容置區22内用以偵測晶圓片異位之基 準面28 ’基準面28鄰近於晶圓片之外緣，且垂直於晶圓片之平面。基準面28 的數量至少為-個，當_可以設置多個基準面，例如平行的基準面或交錯的 基準面’藉以達到更精準偵測晶圓片異位的效果。感測裝i26可以紅外線訊號 觸發、或是以雷射光訊號觸發、或是以超音波訊號觸發。感測器261的形式以 成對配置的穿透式感測器為最佳，其中之一為發送端感測器，另一為接收端感 8 200921830 測器。當然，感測器261也可以是一個反射式感測器。 控制裝置27為微電細程式處理器(miero pr〇gramming pr〇cess〇r)，用以接 收來自感測裝置26所傳送之信號，並根據該信號以控制晶圓升降台的作動。當 晶舟24内的晶圓片在第二容置區22内出現位置的偏移而與基準面28形成干涉 而觸發(trigger)感測裝置26時，控制裝置27即停止晶圓升降台的運作，以防止 晶圓片破片的問題。 請參考第三® ’係根據本發明所提供之第二較佳實關，為__種晶圓測試 機之示意圖。晶_試機3G ’至少包含-個可容置晶圓的晶圓升降台3卜一個 測試頭32、一個晶圓運動平台33，以及一個抓取裝置34。 晶圓升降台31包含有第一容置區3U、第二容置區312 '驅動模組315、感 測裝置316、控制裝置317。第-容置區311藉以容置至少一晶圓盒313，晶圓 盒313具有一開口以容許承載晶圓片之晶舟314自晶圓盒313内移出至第二容 置區312。而此驅動模組3i5(drivingmodule)，用以提供晶舟314的位置升降。 為了較先前技術提供更佳的偵測異位晶圓片之效果，本發明之感測裝置316 包括複數個感測器（未圖示）’藉以形成在第二容置區312内用以彳貞測晶圓片異 位之基準面（未圖不）’基準面鄰近於晶圓片之外緣，且垂直於晶圓片之平面。 基準面的數4至少為—個’當然亦可以設置多個基準面，例如平行的基準面或 交錯的基準面，藉以達到更精準偵測晶圓片異位的效果。感測裝置316可以紅 外線訊號觸發、献料射光訊賴發、或是鱗音波喊紐。感測器的形 j以成對配置的穿透式感測器為最佳，其中之—為發送端感測器，另一為接收 端感測器。當然，感測器也可以是一個反射式感測器。 制裝置317為微電腦程式處理器(micr〇pr〇cess〇r)，用以接 收來自感測裝置316所傳送之信號，並根據該信號以控制晶圓升降台31的 田日曰舟314内的晶圓片在第二容置區312内出現位置的偏移、或抓取裝置 曰誤動作而與基準面形成干涉而觸發(trigger)感測裝置316時，控制裝置 200921830 即停^圓測試機3Q的運作，以防止晶圓片破片的問題。 運動平σ 33係用以承載 - 圓藉由晶圓運動平二w 1乙二軸之移動，待測晶 以進行電性功_;，1飾使得待娜圓侧試頭32下方的針測觸鬚接觸 運算裝置35之運算後^稍料藉由針劇__娜2，經控制與 後俾呈現於顯示裝置(未圖示）。 抓取裝置34係用以抓取晶圓升降台μ内的晶圓片 、 進仃晶《測試，包括至少-個機械傳送f 。 f 時以佳實蘭’並_限定本發明的權利範圍；同 叶對於热知本技術領域的專門人士應 :離本發明所揭示的精神下所完成的等效，，均== 【圖式簡單說明】 望-®Ι ^圖，係_種具有感測裝置之晶圓輸送裝置的先前技術。 圖為一不意圖’係根據本發明所提出之第—較佳實施例 ，為一種晶圓升200921830 IX. Description of the Invention: [Technical Field] The present invention provides a wafer lifting platform and a testing machine thereof, and more particularly to a crystal lifting platform having a sensing device and a testing machine thereof. [Prior Art] Before the wafer test, the operator will place the wafer boat containing the wafer in the pod of the wafer lifting table, and then use the wafer lifting table. The wafer is transported down to the position accessible by the transfer arm for subsequent wafer testing. However, when the wafer boat is transported in the wafer elevator, more or less S will be created by the movement of the boat. A wafer-transfer device having a sensing device is disclosed in the prior art, as shown in the first figure, and is characterized in that the sensing device 41 is disclosed in the prior art, U.S. Patent No. 5,601,484. The sensing device 41 is configured to sense whether the wafer in the wafer boat 6 is ectopic during the process of transporting the wafer boat 6 to the wafer cassette 4 in a horizontal manner. In order to avoid the occurrence of fragmentation of the wafer in the wafer boat 6 during the transport process. In addition, the prior art US Patent No. 6,775,918 additionally discloses a wafer boat box having a positioning sensing device, characterized in that the positioning sensing device is For the reed switch, when the boat box is placed on the receiving table, the difference occurs. In the case, the spring force of the reed switch prevents the door of the boat box from being accidentally closed, causing the wafer to be fragmented. However, when the transmission arm is grasping the wafer in the wafer cassette Process t, the above case can not solve whether the transmission arm is correctly positioned with the wafer in the boat box to avoid fragmentation' or ensure that the transmission arm is correctly operated in the boat to grab the wafer, so how to solve The above problem has been the subject of the industry. In order to solve the above problems, the present invention provides a wafer lifting platform and a wafer testing machine, wherein the circular lifting platform includes a sensing device (sensing device) When the wafer in the wafer boat is displaced from the position and interferes with the reference surface, the operation of the crystal K lifting platform is stopped. 6 200921830 In addition, this wafer testing machine is mainly The invention includes a wafer lifting platform' with which the sensing device can be used to stop all operations of the testing machine. Therefore, the main object of the present invention is to provide a wafer lifting platform to prevent the wafer cassette from being transported by the wafer boat. The problem of fragmentation caused by the eccentricity of the Crystal® sheet. The secondary object of the present invention is to provide a wafer lifting platform to ensure that the actuator arm is properly actuated in the boat to grab the wafer 'to avoid accidental contact with the actuator arm. The circle causes a problem of fragmentation. Another object of the present invention is to provide a wafer testing machine to avoid the problem of fragmentation due to wafer displacement when the wafer cassette is transported to the wafer boat. / k: A further object of the present invention A wafer testing machine is provided to ensure that the arm is properly actuated in the boat to grab the wafer, and to avoid the problem of fragmentation caused by the actuator being accidentally touched by the wafer. The present invention provides a wafer lifting The devat〇r includes a first accommodating area and a second accommodating area, wherein the first accommodating area accommodates at least one wafer box (wafer P0D), and the wafer cassette has an opening to allow the wafer to be carried The wafer cassette is removed from the wafer cassette to the second receiving area; a driving module (7) is used to provide the position of the wafer boat: a sensing device (4) such as (4) heart) And - control device, (4) receiving the transmission from the sensing device Money, and the wafer lift table according to this actuation signal to control. The wafer lifting platform is characterized in that the sensing region of the sensing device forms at least one reference plane in the second accommodating region, and the reference surface is adjacent to the outer edge of the wafer and perpendicular to the plane of the wafer. When the wafer in the wafer boat is displaced from the position and interferes with the reference surface to trigger the sensing device, the control device stops the operation of the wafer lifting platform. The invention further provides a wafer testing machine comprising at least one wafer lifting platform capable of accommodating wafers, a side test head, a wafer moving platform and a gripping device, and the gripping and transposing device The wafer is transferred to the wafer moving platform for the wafer to be tested by the test head, wherein the wafer lifting platform includes a first-accommodating area and a second capacity The first area, the first accommodating area is at least a wafer cassette, and the wafer cassette has a opening to allow the wafer boat carrying the wafer to exit from the wafer cassette (10) to the second accommodating area' Xiule), the rib provides a boat touch lift (雠ing device); and a control device for receiving the action from the sensing device: 200921830. The above-mentioned wafer testing machine is characterized in that the operation of the tester is perpendicular to the plane of the wafer, and the wafer in the wafer boat is displaced or misaligned to interfere with the reference surface. Touching (4) sensing device, the control device stops the wafer 曰 [Embodiment] Since the present invention discloses a wafer lifting platform and a wafer testing machine thereof, the basic principle of the test is The side of the art is well known to those skilled in the art, so the following description will not be fully described. At the same time, the drawings referred to in the following texts express the structural schematics relating to the features of the present invention, and do not need to be completely drawn according to the actual size. Referring first to the second drawing, a first embodiment of the present invention is a schematic view of a devator. A wafer lifting platform 2 includes a first accommodating area 第, a accommodating area 22, a driving module 25, a sensing device 26, and a control device 27. The first set area 21 is configured to accommodate at least one wafer cassette 23 (waferp〇D), and the wafer cassette 23 has an opening (the wafer boat 24 for carrying the wafer from the wafer cassette 23) The inner module is removed to the second accommodating area 22. The driving module 25 is configured to provide the position and elevation of the wafer boat 24. In order to provide a better wafer ectopic detection effect than the prior art, the sensing device of the present invention% A plurality of sensors 26 are formed to form a reference plane 28 for detecting wafer eccentricity in the second accommodating region 22. The reference plane 28 is adjacent to the outer edge of the wafer and perpendicular to the wafer. The plane of the reference plane 28 is at least one. When _ can set multiple reference planes, such as parallel reference planes or staggered reference planes, the effect of detecting the wafer ectopic is more accurately achieved. The i26 can be triggered by an infrared signal, or triggered by a laser light signal, or triggered by an ultrasonic signal. The sensor 261 is in the form of a pair. The penetrating sensor is optimal, one of which is a transmitter sensor and the other is a receiver 8 200921830. Of course, the sensor 261 can also be a reflective sensor. The device 27 is a micro-electric program processor (miero pr〇gramming pr〇cess〇r) for receiving signals transmitted from the sensing device 26 and controlling the operation of the wafer lifting platform according to the signal. When the wafer in 24 appears offset in the second accommodating area 22 and interferes with the reference surface 28 to trigger the sensing device 26, the control device 27 stops the operation of the wafer lifting platform. To prevent the problem of wafer fragmentation. Please refer to the third ® ' is a schematic diagram of a wafer testing machine according to the second preferred embodiment provided by the present invention. The crystal_testing machine 3G' includes at least one The wafer lifting platform 3 for accommodating the wafer includes a test head 32, a wafer moving platform 33, and a gripping device 34. The wafer lifting platform 31 includes a first accommodating area 3U and a second accommodating area 312. 'Drive module 315, sensing device 316, control device 317. The first-accommodating area 311 is used to accommodate At least one wafer cassette 313, the wafer cassette 313 has an opening to allow the wafer boat 314 carrying the wafer to be removed from the wafer cassette 313 to the second accommodating area 312. The driving module 3i5 (driving module) To provide the position of the wafer boat 314. In order to provide better detection of the effect of the ectopic wafer than the prior art, the sensing device 316 of the present invention includes a plurality of sensors (not shown) The reference surface (not shown) for detecting the ectopicity of the wafer in the second accommodating area 312 is adjacent to the outer edge of the wafer and perpendicular to the plane of the wafer. The number 4 of the reference plane is at least one. Of course, a plurality of reference planes, such as parallel reference planes or staggered reference planes, may be provided to achieve a more accurate detection of wafer ectopicity. The sensing device 316 can be triggered by an infrared signal, a light source, or a scale sound wave. The shape of the sensor is optimal for a pair of configured transmissive sensors, one of which is the transmitter sensor and the other is the receiver sensor. Of course, the sensor can also be a reflective sensor. The device 317 is a microcomputer program processor (micr〇pr〇cess〇r) for receiving signals transmitted from the sensing device 316 and controlling the wafer lifting platform 31 according to the signal. When the wafer is displaced in the second accommodating area 312, or the gripping device malfunctions to interfere with the reference surface to trigger the sensing device 316, the control device 200921830 stops the testing machine 3Q. The operation to prevent wafer fragmentation problems. The motion flat σ 33 series is used to carry the - the movement of the circle by the wafer movement, the second axis of the w 1 and the second axis, and the crystal to be measured for electrical work _;, 1 decoration makes the needle under the round side test head 32 After the operation of the whisker contact computing device 35, it is slightly displayed by the display device (not shown) by means of the needle drama __娜2. The gripping device 34 is configured to grab the wafer in the wafer lifting table μ, and to test, including at least one mechanical transfer f. f is defined as the scope of the present invention in the context of the present invention; the same as that of the person skilled in the art of the prior art should be: equivalent to the spirit disclosed in the present invention, all == [pattern Brief Description] The Vision-® diagram is a prior art of a wafer transport device with a sensing device. The figure is not intended to be a preferred embodiment of the present invention, which is a wafer liter
第三圖為一示意圖， 試機之示意圖。 係根據本發明所提出之第二較佳雜例，為—種晶_ 【主要元件符號說明】 晶圓盒 4 (先前技術） 晶舟 6 (先前技術） 感測裝置 41 (先前技術) 晶圓升降台 20 第一容置區 21 200921830 第二容置區 22 驅動模組 25 感測裝置 26 控制裝置 27 晶圓盒 23 晶舟 24 基準面 28 感測器 261 晶圓測試機 30 晶圓升降台 31 第一容置區 311 第二容置區 312 晶圓盒 313 晶舟 314 驅動模組 315 感測裝置 316 控制裝置 317 測試頭 32 晶圓運動平台 33 抓取裝置 34 機械傳送臂 340 控制與運算裝置35The third picture is a schematic diagram of the test machine. According to the second preferred example of the present invention, the seed crystal is _ [main component symbol description] wafer cassette 4 (prior art) wafer boat 6 (prior art) sensing device 41 (prior art) wafer Lifting table 20 first accommodating area 21 200921830 second accommodating area 22 driving module 25 sensing device 26 control device 27 wafer cassette 23 wafer boat 24 reference surface 28 sensor 261 wafer testing machine 30 wafer lifting table 31 First accommodating area 311 Second accommodating area 312 Wafer box 313 Crystal boat 314 Driving module 315 Sensing device 316 Control device 317 Test head 32 Wafer moving platform 33 Grab device 34 Mechanical transfer arm 340 Control and operation Device 35