200920866 九、發明說明： 【發明所屬之技術領域】 - 本發明是有關於一種立型連續式濺鍍設備之基板傳輪 ； 裝置，且特別是有關於一種利用載具搭載以垂直姿態傳輸 之基板’並利用磁性元件與載具之間的非接觸式磁力穩定 作用’避免傳輸垂直擺置的基板因重心不穩傾倒而導致基 板表面碰撞或刮傷，而應用至基板垂直式傳輸，進而達到 f)冑基板同時單片雙面鍍膜或雙片基板單㈣膜的立型連續 式滅鑛設備之基板傳輸裝置。 【先前技術】 因應真空濺鍍技術應用層面曰廣，為增加相關鍍膜產 品的產業競爭力，必須降低真空濺鍍製程的成本，連續式 (In-Line)與傳統批次式（batchtype)或晶圓式（抓 ( type)比較，連續式則可以減少高達60%以上的生產成本， •並可大幅降低設備成本及廠房空間，極具量產經濟價值及 產業競爭性。因此目前使用濺鍍設備大多為連續式作業流 程；請參相5’絲*-㈣續式麟設備作業流程圖， 一般而言，連續式真空濺鍍設備至少分為三個區域：進料 腔體區51、鍍膜腔體區52及出料腔體區53，基板5〇係在 上述腔體内或跨腔體之間作傳輸，並從該出料腔體^輸出 成品54。 200920866200920866 IX. Description of the Invention: [Technical Field of the Invention] - The present invention relates to a substrate transfer wheel of a vertical continuous sputtering apparatus; and, more particularly, to a substrate for carrying a vertical attitude transmission using a carrier 'And the non-contact magnetic stabilization between the magnetic component and the carrier' avoids the transmission of the vertically placed substrate due to the unstable center of gravity dumping, causing the substrate surface to collide or scratch, and applied to the substrate for vertical transmission, thereby achieving f a substrate transfer device for a vertical continuous demineralization apparatus in which a single substrate is double-coated or a two-piece single (four) film is used. [Prior Art] In order to increase the industrial competitiveness of vacuum coating technology, in order to increase the industrial competitiveness of related coating products, it is necessary to reduce the cost of vacuum sputtering process, continuous (In-Line) and traditional batch (batchtype) or crystal Round (type) comparison, continuous type can reduce production costs by up to 60%, and can greatly reduce equipment costs and plant space, and is extremely economical in mass production and industrial competitiveness. Therefore, sputtering equipment is currently used. Most of them are continuous operation processes; please refer to the 5's wire*-(4) continuous lining equipment operation flow chart. Generally speaking, the continuous vacuum sputtering equipment is divided into at least three areas: the feed cavity area 51, the coating cavity The body region 52 and the discharge cavity region 53 are transported between the cavity or the cavity, and the finished product 54 is output from the discharge cavity ^ 2009-20866
近年來’隨著切割邊緣電子裝置，例如液晶顯示器LCD 係朝向輪薄化發展，安裝在上述電子裝置上的部件亦逐漸 往小型化設計；同樣地，相鄰部件之間的距離亦隨之變小。 為了在各個部件之間形成細窄空間，人們已提出了各種用 以形成薄骐的方法，例如真空濺鍍方法’關於濺鍍原理則 詳述如下。 首先’透過基板（substrate)傳輸裝置將需要表面鑛 膜的基板载入真空腔體内。然後，提供特定壓力、功率及 偏電壓（bias)給在真空腔體内的反應氣體（如Ar)，以 使在乾材（target)周圍產生離子化’而離子化的正離子 (如Ar+)透過電場之電位差高速轟擊靶材的表面，並將 正離子的動能傳送至靶材表面的原子或分子；當傳送的動 能大於靶材分子之間的鍵結力時，位於靶材表面的鍍膜分 子被轟擊出來並沉積至基板表面，進而達到鍍膜的目的。 基板可為水平或垂直方式擺置，而連續式濺鍍設備可 依前述基板的擺置方式，概分為臥型（horizontal)及立 型（vertical)兩種，然而臥型濺鍍設備，只適用於體積 小、重量輕、面積小、單面鑛膜等基板特性之民生產業（如 手機按鍵），然而隨著LCD及FDP逐漸朝向第七、八代的導 電玻璃發展，臥型濺鍵設備已無法滿足如大平面、高重量、 又面錢膜專玻璃基材的技術需求，其次，因臥型丨賤艘設備 200920866 是採平面展開式廠房配置^ 二计古如 ,H Uay〇ut)，導致設備較佔空間， 而其真空腔體空間較大亦導 — 不具經濟成本效益；再者， 、 導致鬲化更多時間來抽真空，較 因RF射頻電極（RF Electrode) 強度難以均勻控制，導致 '乾材鍍膜分子被轟擊過大， 針對臥型濺鍍設備而言， 柯x尺寸的鍍膜分子會因本身重 因素而直接下降沉積在水平擺置的基板表面，進而產生In recent years, as cutting edge electronic devices, such as liquid crystal display (LCD) systems, have become thinner toward wheels, the components mounted on the electronic devices have been gradually miniaturized; likewise, the distance between adjacent components has also changed. small. In order to form a narrow space between the respective members, various methods for forming a thin crucible have been proposed, such as a vacuum sputtering method, which is described in detail below with respect to the sputtering principle. First, the substrate requiring the surface mineral film is loaded into the vacuum chamber through a substrate transfer device. Then, a specific pressure, power, and bias are supplied to the reactive gas (such as Ar) in the vacuum chamber to cause ionization around the target and ionized positive ions (such as Ar+). High-speed bombardment of the surface of the target by the potential difference of the electric field, and transfer the kinetic energy of the positive ions to the atoms or molecules on the surface of the target; when the transmitted kinetic energy is greater than the bonding force between the target molecules, the coated molecules on the surface of the target It is bombarded and deposited on the surface of the substrate to achieve the purpose of coating. The substrate can be placed horizontally or vertically, and the continuous sputtering device can be divided into horizontal type and vertical type according to the manner in which the substrate is placed. However, the horizontal sputtering device only It is suitable for the production of small-sized, light-weight, small-area, single-sided mineral film and other substrate properties (such as mobile phone buttons). However, as LCD and FDP gradually develop toward the seventh and eighth generation of conductive glass, horizontal splash-type devices have It is unable to meet the technical requirements of large-area, high-weight, and special-purpose glass substrates. Secondly, because of the horizontal type of equipment 200920866, it is a flat-planning factory configuration ^ 二古古如, H Uay〇ut), As a result, the equipment takes up more space, and the vacuum chamber space is larger. It is not economical and cost-effective; in addition, it causes more time for vacuuming, which is difficult to control evenly due to the RF RFde strength. As a result, the dry coating molecules are bombarded too much. For the horizontal sputtering equipment, the coating molecules of the size x are directly deposited on the surface of the horizontally placed substrate due to their own heavy factors, thereby producing
5染粒子（如異常顆粒或暗點），影響其後續透光性及導電 性’導致製程良率過低，然而針對立型濺鑛設備 ’過大的 乾材刀子會因重力因素直接降落在真空腔體底部而不會沉 知在玻璃絲表面上；目此，立型連續式舰設備目前已 廣泛應用到大平面、高重量、雙面鑛膜等LGD導電玻璃基 材的鍍膜技術需求上。 然而如何將重達幾十公斤、但厚度僅有8_且材質易 脆的破璃基板在真空腔體内及跨腔體之間做平順立式傳 輸’並同時保持無殘餘應力或接觸碰撞存在而導致玻璃變 形、破裂及刮傷等現象發生，一直是立式基板傳輸裝置設 α十的最兩準則’目前習知的傳輸技術說明如下：首先，請 參考中華民國專利公告號第1282376號發明專利，係為一 種立型濺:鍍設備的基板傳輸裴置，包括用以支撐基板支撐 單元’用以將基板的一側固定到支撐單元上的固定單元’ 以及用以移動基板的滾輪。支撐單元配備有喷氣組件’當 200920866 基板載入腔室或者從腔室中卸載時，以及當在腔室中沉澱 薄膜時，基板傳輸單元相對於垂直方向傾斜一特定角度， 且喷氣組件將氣體喷射到支撐單元的上表面；透過支撐單 元的前表面連續喷射並吸收氣體，從而喷氣組件形成具有 特定厚度的氣墊。由於喷射氣體在喷氣組件和基板之間形 成氣墊，因此可以避免由於基板與支撐單元的接觸碰撞而 造成的基板損壞。而且，喷氣組件配備至少一個距離偵測 感測器，以分別隨時監測基板與支撐單元之間的距離，所 測得的距離值被傳送到氣體流量控制器，以根據測得的距 離值控制氣流量。然而，由於氣墊的形成必須有空氣存在， 因此在如圖5所示的連續式真空鍍膜製程中，無法以上述 氣墊技術做跨腔體傳輸，僅能在真空鍍膜製程完成出真空 腔體後，於卸載過程中才能以氣墊做非接觸式傳輸。 其次，請參考中華民國專利公告號第1231806號發明 專利，係提供具有放片框、多個夾片以及多個定位裝置的 載具，其中定位裝置與夾片分別位於放片框之内側邊緣， 且定位裝置係由垂直於載具平面方向之金屬圓柱及包覆金 屬圓柱的軟質護套所構成，亦即僅以一點或是一線接觸之 方式的具弧狀曲面之結構或受軟質護套包覆的具弧狀曲面 之結構，減少玻璃基板與載具之間的接觸，以大幅減少玻 璃基板發生缺角或裂紋的機率。然而，習知技術應用夾具 200920866 夾住基板（或載呈） 參考圖7,基板傳财置7#^連續式跨腔體傳輸者，請 構m聰空二係f動力傳輸單元72及夾持機 板重心落在動力===此傳動方式因基 Ο k 絲料，但是由上杨力_單元72因 君耗所產生的汗染粒子或粉屑會因重力而往下飄落， 而使部分科粒子附著沉積位於下方的基録面上，容易 在基板表面產生異常顆粒或暗點而導致良率偏低的問題。 *為避免上述缺失，請參考圖6，另一種習知基板傳輪 衣置6係將動力傳輸單元62及夹持機構設置在真空腔 ，61下方’如此動力傳輸單it 62因傳動磨耗所產生的汗 木粒子’因本身重力因素而直接下沉至真空腔體61底部， 再由抽真工幫浦65將汙染粒子抽至腔體外，而不會附著在 基板60表面；然而，此時基板60類似以倒單擺方式做腔 體傳輸，基板60的重^因偏高而容易產生左右晃動、傾斜 等不穩定動作，為避免晃動太大而導致基板傾倒，會在真 空腔體61上方加置u型辅助限位機構64以穩定基板60的 傳輸。然而，由於連續式濺鍍設備必須在腔體與腔體之間 做跨腔體傳輸’然而動力傳輸單元62及U型輔助限位機構 64並非連續式配置’故在跨腔體傳輸基板過程時，必須解 決兩相鄰腔體之間基板60導正對位問題，否則基板60會 200920866 產生碰撞或卡死現象。若是限位機構的空隙裕度 (tolerance)太大，雖然在跨腔體傳輸過程之間可以較容 易導正對位傳輸，卻易造成基板6 0因重心不穩而户右搖晃 程度大’易與ϋ型補助隊位機構64接觸碰傷而影響鍵膜品 質；但倘若是限位機構的空隙裕度太小且接近基板厚度 ’則基板在跨腔體傳輸過程中，易造成兩腔體之間對位 不易而造成基板移位卡死的問題；再者，U型辅助限位機 構64是一種接觸式輔助定位裝置，無法完全避免與基板 6 0之間接觸與碰撞’進而造成鑛膜成品表面到傷或磨損。 【發明内容】 有鑑於此，本發明所欲解決的問題在於提供一種磁控 基板非接觸式垂直姿態傳輸，可以提升鑛膜良率及設備稼 動率的立型連續式濺鍍設備之基板傳輸裝置。 為解決上述問題，本發明所述的立型連續式濺鍍設備 之基板傳輸裝置，係提出在真空腔體下方設置傳輸動力單 元，基板係由金屬載具所搭載，且載具的底端係與傳輸動 力單元接觸以傳輸基板前進；另外，至少—組磁性元件分 別設置在相對於基板的兩側的腔體内側面，而相對應的磁 性元件之磁性大小相同，且磁性元件可以為永久磁鐵或電 磁鐵；由於載具係導電金屬材質，而可藉相對應磁性元件 對玻璃基板的非接觸式磁力作用，使搭載基板的載具維持 200920866 穩定垂直姿態傳輸而不產生傾斜晃動，達到可同時對基板 進行雙面鍍膜。 Ο 此外，本發明所述的立型連續式濺艘設備之基板傳輪 I置，提出在真空腔體下方設置傳輸動力單元，基板係由 載具所搭载’其中該載具可搭載單片双面待鍍玻璃基板， 或其兩側各分別搭載單片單面待鍍玻璃基板；所述载具邊 緣具有若干空心槽，並在空心槽内設置磁柱，則磁检與在 :對基板兩側的腔體内側面上的磁性元件之磁性大小相 等，故可藉由礤柱及磁性元件之間的非接觸式磁力作用， 而使玻璃基板維持彳m直姿態傳輸，達到可同時對單片 基板雙面㈣或双片基板單面鍵膜。 另曰在本發明所述的立型連續式滅鍍設備之基板傳輸 裝置’提出在真空腔體 身就具有導電性，例如i方設置傳輸動力單元’若基板本 _的導電玻璃，則不你有减銦錫（indiumtln〇xide， 透過本身與在相對導電^再透過金屬載具搭載’即可直接 件之間的非接觸式磁力'"板兩側的腔體内侧面上的磁性元 直姿態傳輸。 乍用，而使導電性基板維持穩定垂 再者，針對磁性元 型連續式濺鍍設偫之基#電磁鐵時，在本發明所述的立 與腔體内側面之距離的^傳輸裝置’更提出偵測基板表面 埂娜器，由於在腔體内側面的磁性 200920866 元件為電磁鐵，可將量測到的距離經由回授 磁鐵，控制電磁鐵的磁力以維持基 二:饋到電 定間隙及以穩定垂直姿態傳輸。 以體之間的固 元二ίΤ磁控方式立型傳輸，並將傳輪動力單 4在—腔體下方，不但可單片雙面鍍骐 :膜，還可維持基板以倒單擺垂直姿態穩定傳輪:二 Γ ^空間亚減少玻璃基板表面異物的附著或碰觸刮傷^更 可達到改錢職率及㈣設備義㈣目的， 生產成本以滿足顧客需求。 夺低 【實施方式】 兹配合圖式將本發明較佳實施例詳細說明如下。 請參考圖1，係本發明的第一 圖；基板傳财置i勺杯“ 例之剖面側視 、板得輸衣置1包括真空腔體11，動力傳輸單元12， 以及金屬載具13,其基板1G料 时戰/、U所私载，其中動 係與載具13的底端接觸，並利用滾輪121 的:衰動摩擦方式來傳動載具13前進，用以將基板= 一個腔體載人’並傳送進人下—個腔體；此外，滾輪121 型，：達到跨腔體傳輸時辅助導正定位功能； 力傳輸平元12設置在真空腔體11内的下方，使 程中因磨耗所產生的汗染粒子直接因重力因素 /儿貝α腔體11下方，再經由真m (圖中未示）抽 200920866 至腔體外，以避免沉積並汙染基板10表面。 由於動力傳輸單元12係設置在基板10下方，使得基 板10重心高而導致傳輸不穩定（類似倒單擺模型），因此， 一組磁性元件141、142(或可設置上、下兩組相對應磁性 元件）分別設置在相對於基板10兩側的真空腔體11之内 側面，而前述之磁性元件141、142可以使用永久磁鐵或是 電磁鐵。 由於該載具13為導電金屬材質，故利用磁性元件與導 電金屬材質載具之間的非接觸式磁力作用，即磁性元件對 金屬材質的磁吸力，達到以非接觸式輔助定位來維持基板 10以垂直姿態穩定傳輸，以取代傳統U型接觸式輔助定位 裝置，因在基板10與真空腔體11之間形成非接觸式空間， 基板10不會在傳輸過程中產生傾斜、碰撞或刮傷，因此在 本發明第一實施例中可以達到同時將單片基板雙面鍍膜， 不但可以節省製程空間，更可提升設備稼動率。 針對磁性元件141、142是電磁鐵時，在基板10的兩 侧更可分別設置有距離量測器151、152，係用以量測基板 10與真空腔體11之間的距離，亦即時量測基板10傳輸過 程中的傾斜狀況，由於基板10傾斜時係以底部為中心，離 底部越遠，基板10晃動的程度越大，故量測器151、152 設置在基板10重心之上較佳；此時量測器151、15 2將量 13 200920866 測的距離資訊輸出到控制電路16，而利用控制電路16調 控電磁鐵141、142所產生的磁力大小，使基板Π)與真空 腔體11兩倒之間維持穩定相同的距離。 另卜在该腔體中更可在基板的兩側分別設置支撐單 兀（圖)，可將該等磁性元件相對應地設置在支撐單元 上’亦能達到非接觸式傳輸的功效。5 dyed particles (such as abnormal particles or dark spots), affecting its subsequent light transmission and conductivity 'cause the process yield is too low, but for the vertical splashing equipment 'oversized dry knives will fall directly under vacuum due to gravity factors The bottom of the cavity is not known on the surface of the glass fiber; therefore, the vertical continuous ship equipment has been widely applied to the coating technology requirements of LGD conductive glass substrates such as large flat surface, high weight, double-sided mineral film. However, how to make a tens of kilograms, but the thickness of only 8 _ and the material is brittle, the glass substrate is smoothly transferred between the vacuum chamber and the cavity, while maintaining no residual stress or contact collision. The phenomenon of glass deformation, cracking and scratching has always been the most common criterion for setting up the vertical substrate transmission device. The current known transmission technology is as follows: First, please refer to the invention of the Republic of China Patent No. 1282376. The patent is a vertical type sputtering: a substrate transfer device of a plating apparatus, including a fixing unit for supporting a substrate supporting unit 'to fix one side of the substrate to the supporting unit' and a roller for moving the substrate. The support unit is equipped with a jet assembly 'When the 200920866 substrate is loaded into or unloaded from the chamber, and when the film is deposited in the chamber, the substrate transfer unit is tilted at a specific angle with respect to the vertical direction, and the jet assembly jets the gas To the upper surface of the support unit; the front surface of the support unit is continuously sprayed and absorbed, so that the air jet assembly forms an air cushion having a specific thickness. Since the ejection gas forms an air cushion between the jet assembly and the substrate, damage of the substrate due to contact collision of the substrate with the supporting unit can be avoided. Moreover, the jet assembly is equipped with at least one distance detecting sensor to monitor the distance between the substrate and the supporting unit at any time, and the measured distance value is transmitted to the gas flow controller to control the gas according to the measured distance value. flow. However, since air cushion must be formed due to the formation of the air cushion, in the continuous vacuum coating process shown in FIG. 5, the air cushion technology cannot be used for the trans-cavity transfer, and only after the vacuum chamber is completed in the vacuum coating process. Non-contact transmission with air cushion can be carried out during the unloading process. Next, please refer to the invention patent of No. 1231806 of the Republic of China, which provides a carrier having a release frame, a plurality of clips and a plurality of positioning devices, wherein the positioning device and the clip are respectively located at the inner edge of the release frame. And the positioning device is composed of a metal cylinder perpendicular to the plane direction of the carrier and a soft sheath covering the metal cylinder, that is, a curved curved surface structure or a soft sheath package only in a one-point or one-line contact manner. The structure of the curved curved surface reduces the contact between the glass substrate and the carrier to greatly reduce the probability of occurrence of cornering or cracking of the glass substrate. However, the conventional technology application fixture 200920866 clamps the substrate (or the carrier). Referring to FIG. 7, the substrate is transferred to the 7#^ continuous cross-cavity transmitter, and the m-constrained two-system f-power transmission unit 72 and the clamping The center of gravity of the board falls on the power === This transmission method is based on the k-wire material, but the sweat-dyed particles or dust generated by the upper Yang force_unit 72 due to the consumption of the king will fall down due to gravity, and make part The attachment of the particles to the underlying substrate is likely to cause abnormal particles or dark spots on the surface of the substrate, resulting in a low yield. * In order to avoid the above-mentioned missing, please refer to FIG. 6 , another conventional substrate transfer device 6 system, the power transmission unit 62 and the clamping mechanism are arranged in the vacuum chamber, 61 below. [The power transmission unit it 62 is generated by the transmission wear. The sweat particles "sink directly to the bottom of the vacuum chamber 61 due to gravity factors, and then the contaminated particles are pumped to the outside of the cavity by the pumping pump 65 without being attached to the surface of the substrate 60; however, at this time, the substrate 60 is similar to the cavity in the inverted pendulum mode. The weight of the substrate 60 is high, and it is easy to generate unstable motions such as left and right shaking and tilting. In order to avoid the swaying too much, the substrate is tilted, and the vacuum cavity 61 is added. The u-type auxiliary limiting mechanism 64 is placed to stabilize the transmission of the substrate 60. However, since the continuous sputtering apparatus must transmit across the cavity between the cavity and the cavity, the power transmission unit 62 and the U-shaped auxiliary limiting mechanism 64 are not in a continuous configuration, so when the substrate is transferred across the cavity The problem of the positive alignment of the substrate 60 between two adjacent cavities must be solved, otherwise the substrate 60 will collide or become stuck in 200920866. If the tolerance of the limiting mechanism is too large, although it is easier to conduct the alignment transmission between the trans-cavity transmission processes, it is easy to cause the substrate 60 to be unstable due to the unstable center of gravity. Contact with the 补助-type subsidy team mechanism 64 to affect the quality of the bond film; but if the margin of the limit mechanism is too small and close to the thickness of the substrate, the substrate will easily cause two cavities during the trans-cavity transfer process. The problem of the misalignment is not easy to cause the substrate to be displaced; further, the U-shaped auxiliary limiting mechanism 64 is a contact-type auxiliary positioning device, which cannot completely avoid contact and collision with the substrate 60, thereby resulting in a finished mineral film. The surface is damaged or worn. SUMMARY OF THE INVENTION In view of the above, the problem to be solved by the present invention is to provide a substrate transfer device for a vertical continuous sputtering device capable of improving non-contact vertical attitude transmission of a magnetic control substrate and improving the yield of the mineral film and the utilization rate of the device. . In order to solve the above problems, the substrate transfer device of the vertical continuous sputtering device according to the present invention proposes to provide a transmission power unit under the vacuum chamber, the substrate is carried by a metal carrier, and the bottom end of the carrier is Contacting the transmission power unit to transport the substrate to advance; in addition, at least the group of magnetic elements are respectively disposed on the inner side of the cavity with respect to both sides of the substrate, and the corresponding magnetic elements have the same magnetic magnitude, and the magnetic element may be a permanent magnet Or an electromagnet; because the carrier is made of a conductive metal material, the non-contact magnetic force acting on the glass substrate can be performed by the corresponding magnetic element, so that the carrier on which the substrate is mounted maintains a stable vertical attitude transmission of 200920866 without causing tilting, thereby achieving simultaneous The substrate is coated on both sides. In addition, the substrate transfer wheel I of the vertical continuous splashing device of the present invention is arranged to provide a transmission power unit under the vacuum chamber, and the substrate is carried by the carrier, wherein the carrier can be loaded with a single piece of double a glass substrate to be plated, or a single-sided single-sided glass substrate to be plated thereon; the carrier has a plurality of hollow grooves at the edge thereof, and a magnetic column is arranged in the hollow groove, and the magnetic inspection and the substrate are The magnetic elements on the side surface of the side cavity are of the same magnetic magnitude, so that the glass substrate can be maintained in a 姿态m straight posture by the non-contact magnetic force between the column and the magnetic element, so that the single piece can be simultaneously Double-sided (four) substrate or double-sided substrate single-sided bond film. In addition, in the substrate transfer device of the vertical continuous de-plating apparatus of the present invention, it is proposed that the vacuum chamber body has conductivity, for example, the i-side transmission power unit 'if the substrate _ the conductive glass, then you are not There is a reduction of indium tin (indium tlx ide xide, through the non-contact magnetic force between the direct and the metal can be used to carry the 'contactless magnetic '' directly between the sides of the cavity Attitude transmission is used to maintain the stability of the conductive substrate. For the magnetic element type continuous sputtering, the distance between the vertical and the inner side of the cavity is The transmission device further proposes to detect the surface of the substrate. Since the magnetic component 200920866 on the side of the cavity is an electromagnet, the measured distance can be controlled by the feedback magnet to maintain the magnetic force of the electromagnet to maintain the base 2: It is transmitted to the fixed gap and in a stable vertical attitude. It is transmitted vertically by the solid element between the body, and the power of the transmission wheel is 4 below the cavity, not only can be plated on both sides: film Can also maintain the substrate to Inverted single pendulum vertical attitude stable transmission wheel: Γ ^ Space sub-reduction of the adhesion or scratching of foreign objects on the surface of the glass substrate ^ can also achieve the change of the employment rate and (4) equipment meaning (four) purposes, production costs to meet customer needs. [Embodiment] The preferred embodiment of the present invention will be described in detail below with reference to the drawings. Please refer to FIG. 1 , which is a first diagram of the present invention; 1 includes a vacuum chamber 11, a power transmission unit 12, and a metal carrier 13, the substrate 1G is time-warmed, and U is privately loaded, wherein the moving system is in contact with the bottom end of the carrier 13 and utilizes the roller 121: The damper friction mode is used to drive the carrier 13 forward to transfer the substrate=one cavity into the human body and transmit it into the lower cavity of the person; in addition, the roller type 121: achieves the auxiliary guiding and positioning function when transmitting across the cavity; The force transmission flat element 12 is disposed below the vacuum chamber 11, so that the sweat-dyed particles generated by the abrasion in the process are directly drawn by the gravity factor/below the alpha cavity 11 and then pumped through the true m (not shown). 200920866 to the outside of the cavity to avoid deposition and contamination of the substrate 10 table Since the power transmission unit 12 is disposed under the substrate 10 such that the center of gravity of the substrate 10 is high and the transmission is unstable (similar to the inverted single pendulum model), a set of magnetic elements 141, 142 (or upper and lower sets can be set). The corresponding magnetic elements are respectively disposed on the inner side surfaces of the vacuum chambers 11 on both sides of the substrate 10. The magnetic elements 141, 142 may use permanent magnets or electromagnets. Since the carrier 13 is made of a conductive metal material, Therefore, the non-contact magnetic force between the magnetic component and the conductive metal carrier, that is, the magnetic attraction of the magnetic component to the metal material, achieves the non-contact auxiliary positioning to maintain the substrate 10 in a vertical attitude and stably transmit, instead of the traditional U. The contact type auxiliary positioning device can form a non-contact space between the substrate 10 and the vacuum chamber 11, and the substrate 10 does not cause tilt, collision or scratch during the transfer, and thus can be used in the first embodiment of the present invention. When the single-sided substrate is coated on both sides, the process space can be saved, and the equipment utilization rate can be improved. When the magnetic elements 141 and 142 are electromagnets, the distance measuring devices 151 and 152 are respectively disposed on the two sides of the substrate 10 for measuring the distance between the substrate 10 and the vacuum chamber 11. During the measurement of the tilting state of the substrate 10, since the substrate 10 is tilted, the bottom is centered, and the further away from the bottom, the greater the degree of shaking of the substrate 10, so the measuring devices 151, 152 are preferably disposed above the center of gravity of the substrate 10. At this time, the measuring devices 151, 15 2 output the distance information measured by the amount 13 200920866 to the control circuit 16, and the control circuit 16 regulates the magnitude of the magnetic force generated by the electromagnets 141, 142 to make the substrate Π) and the vacuum chamber 11 Maintain the same distance between the two inverted. In addition, in the cavity, a support unit (Fig.) can be respectively disposed on both sides of the substrate, and the magnetic elements can be correspondingly disposed on the support unit to achieve the effect of non-contact transmission.
月再》考圖2,係表示本發明第二較佳實施例之别面 側視圖；本實施例縣板傳輸裝置丨所示的基板傳 輸衣置1大致相同，其差異在於載具23邊緣空心槽26、 27内„又置相對應的磁柱28a、28b，其中磁柱28a係相對應 磁)生元件241 a、242a設置，且兩兩之間相對應的磁極相同 而產生斥力’磁柱28b則相對應磁性元件241 b、242b設置， 且兩兩之間相對應的磁極相同而產生斥力，或者磁柱28a 與相對應磁性元件241a、242a兩兩之間，相對應的磁極相 反而產生吸力’磁柱28b與相對應磁性元件241b、242b兩 兩之間’相對應的磁極相反而產生吸力；故載具23係以磁 柱28a、28b及磁性元件241a、241b、242a、242b之間的 非接觸式磁力作用而穩定立型傳輸。當然，本實施例亦可 如前述第一較佳實施例所述，針對磁性元件241a、241b、 242a、242b為電磁鐵時，可再設置距離量測器，其結構與 作用均與第一較佳實施例同，故不再加以贅述。 14 200920866 請再參考圖3，係本發明之第三較佳實施例之剖面侧 視圖；基板傳輸裝置3之結構與基板傳輸裝置2大致相同， 其差異在於載具33可以搭載二個基板10，且其應用原理 及傳輸過程則相同；由於本發明之第三較佳實施例係同時 搭載二個基板10，因此可以達到同時雙片單面鍍膜，不但 可以提升設備稼動率，更能降低單位鍍膜成本。同樣地， 亦可在載具邊緣的空心槽中設置若干磁柱，並利用磁柱與 該等磁性元件之間的磁力作用，達到非接觸式的立型傳輸。 請參考圖4,係本發明第四較佳實施例之剖面侧視圖； 基板傳輸裝置4包括導電基板40，真空腔體41以及動力 傳輸早元42’導電基板40係在原本無法導電的母玻璃 (mother glass)基板上，已鑛上一層可以導電的氧化銦 錫（i nd i um t i n ox i de，I TO)的導電玻璃，故不需透過僅 屬載具搭載傳輸。 動力傳輸單元42係與導電基板40的一端接觸，並利 用滾輪421的滾動摩擦方式來傳動導電基板40，用以將導 電基板40自前一個腔體載入，並傳送進入下一個腔體，而 且滾輪421斷面係呈V型，可達到跨腔體傳輸時輔助導正 定位功能；此外，動力傳輸單元42設置在真空腔體41内 的下方，使其在傳輸過程中因磨耗所產生的汙染粒子直接 因重力因素沉積至真空腔體41下方，再經由真空幫浦（圖 15 200920866 中未不）抽至腔體外，以避免沉積並汙染導電基板4〇表面。 由於動力傳輸單元42係設置在導電基板40下方，使 得導電基板40重心高而導致傳輸不穩定（類似倒單擺模 型），因此，在相對於導電基板4〇兩側的真空腔體41之内 側面，分別設置磁性元件441、442或分別設置有磁性元件 441a、441b、442a、442b，其中磁性元件44ia及磁性元件 442a相對應設置，磁性元件44丨b及磁性元件44此相對應 設置，而前述之磁性元件441、442或磁性元件441&、441卜 442a、442b可以使用永久磁鐵或是電磁鐵。 由於導電基板4〇本身具有導電性，故導電基板4〇藉 由相對應設置的磁性元件441、442或磁性元件44ia、 441b、442a、442b之間產生的磁力作用以維持立型傳輸； 因為導電基板40 W兩側係利用非接觸式磁力辅助定位裝 置’因此*會在傳輸過程中產生傾斜、碰#或刮傷，因此 在本，明第四實施例中可以達到同時單片雙面㈣，不但 可以即省製程空間’更可提升設備稼動率。當然，本實施 例亦可如前述第—較佳實施例所述，針對磁性元件44卜 442或磁性元件4叫、碰、4似、_為電磁鐵時，可 再設置距離量測器，其結構與作用均與第—較佳實施例 同，故不再加以贅述。 T、上所述，乃僅記載本發明為呈現解決問題所採用的 16 200920866 之μ㈣方式或實施例而已，並非用來限定本 y專利f施之範圍。即凡與本發明專利申請範圍 付，或依本發料鄉_㈣均替化與 發明專利範圍所涵蓋。 為本 【圖式簡單說明】 圖1係本發明第-較佳實施例之剖面側視圖； 圖2係本發明第二較佳實施例之剖面側視圖； 圖3係本發明第三較佳實施例之剖面側視圖； 圖4係本發明第吨佳實施例之剖面側視圖； 圖5係麵m切鍍設料業流程圖； 圖6係習知之-種基板傳輸裝置結構示意圖； 圖7係習知另一種基板傳輸裝置結構示意圖。 【主要元件符號說明】 I 基板傳輸裝置 10 基板 II 真空腔體 12 動力傳輸單元 121 滾輪 13 金屬載具 141 磁性元件 200920866 磁性元件 距離量測器 距離量測器 控制電路 基板傳輸裝置 載具 f 磁性元件 磁性元件 磁性元件 磁性元件 空心槽 空心槽 磁柱 磁柱 基板傳輸裝置 載具 基板傳輸裝置 導電基板 真空腔體 動力傳輸單元 滾輪 18 200920866 磁性元件 磁性元件 磁性元件 磁性元件 磁性元件 磁性元件 基板 進料腔體區 鍍膜腔體區 出料腔體區 成品 基板傳輸裝置 基板FIG. 2 is a side view showing a second preferred embodiment of the present invention; the substrate transporting device 1 shown in the embodiment of the present invention is substantially the same, and the difference is that the edge of the carrier 23 is hollow. In the slots 26, 27, the corresponding magnetic columns 28a, 28b are disposed, wherein the magnetic posts 28a are corresponding to the magnetic elements 241a, 242a, and the corresponding magnetic poles are the same to generate a repulsive force. 28b is disposed corresponding to the magnetic elements 241 b, 242b, and the corresponding magnetic poles between the two are the same to generate a repulsive force, or the magnetic poles 28a and the corresponding magnetic elements 241a, 242a are opposite to each other, and the corresponding magnetic poles are oppositely generated. The suction 'magnetic column 28b and the corresponding magnetic elements 241b, 242b are opposite to each other to generate a suction force; therefore, the carrier 23 is between the magnetic columns 28a, 28b and the magnetic elements 241a, 241b, 242a, 242b. The non-contact magnetic force acts to stabilize the vertical transmission. Of course, the embodiment can also set the distance when the magnetic elements 241a, 241b, 242a, and 242b are electromagnets as described in the first preferred embodiment. Detector, its structure and function The first preferred embodiment is the same as that of the substrate transfer device 2. Referring to FIG. 3, a cross-sectional side view of a third preferred embodiment of the present invention; the structure of the substrate transfer device 3 is substantially the same as that of the substrate transfer device 2. The difference is that the carrier 33 can carry two substrates 10, and the application principle and transmission process are the same; since the third preferred embodiment of the present invention is equipped with two substrates 10 at the same time, the simultaneous two-sided single-sided can be achieved. Coating can not only improve the equipment utilization rate, but also reduce the cost per unit coating. Similarly, several magnetic columns can be placed in the hollow groove at the edge of the carrier, and the magnetic force between the magnetic column and the magnetic components can be used to achieve Non-contact vertical transmission. Please refer to FIG. 4, which is a cross-sectional side view of a fourth preferred embodiment of the present invention; the substrate transfer device 4 includes a conductive substrate 40, a vacuum chamber 41, and a power transmission early element 42' conductive substrate 40. It is based on a mother glass substrate that cannot be electrically conductive, and has a conductive glass of conductive indium tin oxide (I TO), which is not required. The power transmission unit 42 is in contact with one end of the conductive substrate 40, and the conductive substrate 40 is driven by the rolling friction of the roller 421 for loading the conductive substrate 40 from the previous cavity and transmitting Entering the next cavity, and the cross section of the roller 421 is V-shaped, which can achieve the auxiliary guiding and positioning function when transporting across the cavity; in addition, the power transmission unit 42 is disposed below the vacuum cavity 41 to make it in the transmission process. The contaminated particles generated by the abrasion are directly deposited under the vacuum chamber 41 by gravity factors, and then pumped to the outside of the cavity through a vacuum pump (not shown in Fig. 15 200920866) to avoid deposition and contamination of the surface of the conductive substrate. Since the power transmission unit 42 is disposed under the conductive substrate 40 such that the center of gravity of the conductive substrate 40 is high and the transmission is unstable (similar to the inverted single pendulum model), it is within the vacuum cavity 41 on both sides of the conductive substrate 4A. On the side, the magnetic elements 441, 442 are respectively disposed or magnetic elements 441a, 441b, 442a, 442b are respectively disposed, wherein the magnetic elements 44ia and the magnetic elements 442a are correspondingly disposed, and the magnetic elements 44b and the magnetic elements 44 are correspondingly disposed, and As the magnetic elements 441 and 442 or the magnetic elements 441 & 441, 442a and 442b, permanent magnets or electromagnets can be used. Since the conductive substrate 4 itself has electrical conductivity, the conductive substrate 4 is maintained by a magnetic force generated between the corresponding magnetic elements 441, 442 or the magnetic elements 44ia, 441b, 442a, 442b to maintain the vertical transmission; Both sides of the substrate 40 W utilize a non-contact magnetic assisted positioning device 'so that * will cause tilt, bump # or scratch during the transfer process, so in the fourth embodiment, the simultaneous single-sided double-sided (four) can be achieved. Not only can the process space be saved, it can increase the equipment utilization rate. Certainly, the embodiment may also be further configured with a distance measuring device for the magnetic element 44 442 or the magnetic element 4 when called, bumped, 4 like, and _ is an electromagnet, as described in the foregoing first preferred embodiment. The structure and function are the same as those of the first preferred embodiment, and therefore will not be described again. It is to be noted that the above description of the present invention is intended to provide a solution to the problem of the present invention, and is not intended to limit the scope of the present invention. That is, the scope of the patent application of the present invention is paid, or is covered by the scope of the invention and the patent of the invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional side view of a first preferred embodiment of the present invention; FIG. 2 is a cross-sectional side view of a second preferred embodiment of the present invention; FIG. 3 is a third preferred embodiment of the present invention. FIG. 4 is a cross-sectional side view of a preferred embodiment of the present invention; FIG. 5 is a flow chart of a m-cut plating industry; FIG. 6 is a schematic view of a conventional substrate transfer device; Another schematic diagram of the structure of a substrate transfer device is known. [Main component symbol description] I Substrate transfer device 10 Substrate II Vacuum chamber 12 Power transfer unit 121 Roller 13 Metal carrier 141 Magnetic component 200920866 Magnetic component distance measuring device Distance measuring device Control circuit substrate Transfer device carrier f Magnetic component Magnetic component magnetic component magnetic component hollow slot hollow slot magnetic column magnetic column substrate transmission device carrier substrate transmission device conductive substrate vacuum cavity power transmission unit roller 18 200920866 magnetic component magnetic component magnetic component magnetic component magnetic component magnetic component substrate feeding cavity Substrate coating cavity area discharge cavity area finished substrate transfer device substrate
C 真空腔體 動力傳輸單元 夾持機構 u型輔助限位機構 抽真空幫浦 基板傳輸裝置 真空腔體 動力傳輸單元 19 200920866 73 夾持機構C Vacuum chamber Power transmission unit Clamping mechanism U-type auxiliary limiting mechanism Vacuum pumping Substrate transmission device Vacuum chamber Power transmission unit 19 200920866 73 Clamping mechanism