TW200916969A - Organic-inorganic hybrid photosensitive resin composition and liquid crystal display comprising cured body thereof - Google Patents

Organic-inorganic hybrid photosensitive resin composition and liquid crystal display comprising cured body thereof Download PDF

Info

Publication number
TW200916969A
TW200916969A TW097126860A TW97126860A TW200916969A TW 200916969 A TW200916969 A TW 200916969A TW 097126860 A TW097126860 A TW 097126860A TW 97126860 A TW97126860 A TW 97126860A TW 200916969 A TW200916969 A TW 200916969A
Authority
TW
Taiwan
Prior art keywords
acid
acrylate
photosensitive resin
weight
methacrylate
Prior art date
Application number
TW097126860A
Other languages
Chinese (zh)
Other versions
TWI392909B (en
Inventor
Dong-Hee Han
Dong-Pil Kang
Dong-Jun Kang
Byung-Uk Kim
Hyoc-Min Youn
Tae Hoon Yeo
Sang Gak Choi
Su Youn Choi
Original Assignee
Korea Electrotech Res Inst
Dongjin Semichem Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Korea Electrotech Res Inst, Dongjin Semichem Co Ltd filed Critical Korea Electrotech Res Inst
Publication of TW200916969A publication Critical patent/TW200916969A/en
Application granted granted Critical
Publication of TWI392909B publication Critical patent/TWI392909B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials For Photolithography (AREA)
  • Optical Filters (AREA)
  • Liquid Crystal (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

The invention relates to an organic-inorganic composite photosensitive resin combination and a liquid crystal display component comprising the hardened combination. The photosensitive resin combination comprises: a) colloidal state inorganic sol; b) acrylic copolymer; c) photoinitiator; d) polyfunctional monomer; e) silicon compound; and f) solvent.; The organic-inorganic composite photosensitive resin combination achieves excellent low dielectric property, cohesive force, heat endurance, insulatibity, evenness and chemical resistance, is suitable imaging material for liquid crystal display component; the advantages of excellent dielectric constant, evenness, sensitivity, defective film rate and UV transmissivity of the composition play good roles while producing liquid crystal display components, so besides as a passivation organic insulation film in low dielectricity, the compositon also can be used as photoresistive resin in protective layer, a black matrix,, column divider or color filter. The composition also achieves the advantages of low dielectric property, high heat endurance and improved cohesive force.

Description

200916969 九、發明說明： 【發明所屬之技術領域】 本發明關於鈍化膜用的有機-無機混成感光性樹脂組 成物以及含其硬化體的液晶顯示器则，且更詳細地關於 -種感光性樹脂組成物’其具有低介電常數及優異的黏著 性'而ί熱性、絕緣性、平坦性及耐化學性，而因此適用作 為用於形成LCD的影像之材料，而且其在形成⑽的純化 有機絕緣膜後係表現低介電常數及優異的抗濕性、黏著性 生而因此適合充當有機絕緣膜，再者其係被利用 當作罩面層用的光阻樹脂 '專、色矩陣用的光阻樹脂、柱狀 間隔物用的光阻樹脂、或彩色渡光片用的光阻樹脂，而因 此増進耐熱性、黏著性等。 【先前技術】 通常，主要用於裝置的有機絕緣體係由Si〇2所製成。 理=為Si具有良好的絕緣效率且主要用基板，其本身有利 2膜的形成。然而，Sl具有非晶形結構及3. 9之等級的 :〗丨電常因此性能上係不適合用作為最理想的低介電 常數有機絕緣體。 ι鈍化膜用的有機絕緣體必須具有低介電常數，以便減 乂包何遷移率’ 使在低的厚度了’因此增加絕緣性及開, 關比’藉以增進TFT驅動性。 本1明的鈍化有機絕緣膜係一種丙烯酸有機絕緣膜， 具有約280。。的低耐熱性。為了達成所欲的可靠性，當確保 200916969 3 0 0 C或更尚的耐熱性時，絕緣膜係被視為穩定的。然而， 習知的SiCh及丙烯酸絕緣體係不利的，因為增加成本和介 電常數’及減少耐熱性，抗濕性和黏著性。 【發明内容】 因此’本發明已經注意到在相關技藝中所發生的上述 問題，而且本發明提供一種有機—無機混成感光性樹脂組成 物’其具有低介電常數及優異的黏著性、耐熱性、絕緣性、 平坦性及耐化學性，而因此能用當作一種用於形成lcd之 影像的材料，再者其在形成LCD的有機—無機混成鈍化絕緣 膜後係表現低介電常數及優異的抗濕性、黏著性及耐熱 性，而因此非常適合充當鈍化絕緣膜’而且本發明亦提供 一種含有其硬化體的LCD。 【實施方式】 依照本發明，一種有機-無機混成感光性樹脂組成物包 含：⑷膠態無機溶膠，⑻由（1)不飽和㈣、不飽和叛酸 針或其混合物與⑴）至少-種丙烯酸不飽和化合物之共聚 合反應所產生丙烯酸共聚物， 九引發劑’（d)具有乙烯 性不飽和鍵的多官能單體， ^ 3有％軋基或胺基的矽系化 合物，及（f )溶劑。而且，提佴—絲人廿, 供種含其硬化體的LCD。 具體地，（a)膠態無機溶膠之來拉 ， 〈小成係猎由添加膠態無機 奈米粒子與1〜120重量份的有捲 ... ，機矽烷，以便有機矽烷與無 機奈米粒子的表面反應，去除. 方陈水，然後添加有機溶劑，因 200916969 此使得反應介質成為疏水性。膠態無機奈米粒子較佳為由 水分散膠體在有機材料中所構成，其包含至少一種選自於 石夕石’乳化銘、二氧化鈦'氧化錯、氧化錫、氧化辞、能 與有機矽烷反應的有機材料、及經矽石所表面改質的益機 材料。 因此’ β亥方法包括添加經水分散的膠態無機材料與有 機石夕烧，去除水，及禾Α古拖&amp; 汉添加有機浴劑，可一次或以預定的時 間間隔重複地進行。 有機石夕烧係由下式所代表：RV3Si(〇R2)H，其中ri 係至少-種選自於烷基、笨基、敗碳烷基、丙烯醯基、甲 基丙烯醯基、烯丙基、乙烯基及環氧基，R2係至少一種選自 於甲基'乙基、異丙基、正丙基及正丁基，且〇R2係烧氧基、 醋酸酯基或肟態無機溶膠的用量較佳I卜”重量 再者，樹脂組成物包含：（b)100 f量份的丙稀酸共聚 物’其係由共聚合⑴5〜4Q重量份的不飽和㈣、不飽和 叛酸針或其混合物與(11)5〜95重量份的至少一種丙稀防 不飽和化合物而獲得；（c)U〇1〜3。重量份的光引發劑&quot; (d) 10〜100重量份的具有乙烯性不飽和鍵的多官能單體； (e) 〇. 0001〜5重量份的含有環氧基或胺基的矽系化合物： 及⑴溶劑，其用量係使得感光性樹脂組成物的固體含 為10〜50重量份。 (a)膠態無機奈米粒子具有1〜1〇〇nm的大小之球形或 1〇〇〜1_的大小之纖維形。當膠態無機奈米粒子的^面 200916969 經具有反應基的有機矽烷所處理時，無機奈米粒子係穩定 地分散在有機溶劑中，因此表現高的穩定性且以分子程度 化學地鍵結它們與有機樹脂。 (b)丙烯酸共聚物係可藉由使單體在溶劑及聚合引發 劑的存在下進行自由基反應而製備，該單體包含（i)不飽和 羧酸、不飽和羧酸酐或其混合物，及（i i )丙烯酸不飽和化 合物。 於本發明中’（b)(i)不飽和觀酸、不飽和缓酸針或其 混合物的例子包括不飽和一元羧酸，如丙烯酸、甲基丙稀 酸專’不餘和二緩酸，如馬來酸，富馬酸、檸康酸、仲康 酸、伊康酸等；及其不飽和二羧酸酐，彼可單獨使用或以 其二或多種的組合使用。為了在用作為顯影劑的鹼性水溶 液中實現所欲的共聚合反應性及溶解性，特別可有用的是 丙烯酸、曱基丙烯酸或馬來酸酐。 以單體的總重量為基準，不飽和叛酸、不飽和叛酸酐 或其混合物的用量為5〜40重量份。若其量少於5重量份， 則此成分難以溶解在驗性水溶液中。相反地，若量超過4 〇 重量份，則此成分在鹼性水溶液中的溶解性過高。 於本發明中，（b)(ii)丙細酸不飽和化合物包括含環氧 基的不飽和化合物及稀烴不飽和化合物。 含環氧基的不飽和化合物之例子包括丙浠酸縮水甘油 酯、曱基丙烯酸縮水甘油酯、α-乙基丙烯酸縮水甘油醋、 正丙基丙烯酸縮水甘油基酯、α-正丁基丙烯酸縮水甘油 酯' 丙烯酸β-甲基縮水甘油酯、曱基丙烯酸β_曱基縮水甘 200916969 油酯、丙烯酸β-乙基縮水甘油酯、甲基丙稀酸乙基縮水 甘油酯、丙烯酸3, 4-環氧丁酯、曱基丙稀酸3, 4-環氧丁醋、 丙烯酸6, 7-環氧庚酯、甲基丙烯酸6, 7-環氧庚醋、α_乙美 丙烯酸6，7 -環氧庚基酷、鄰乙烯基苄基縮水甘油基醚、間 乙烯基苄基縮水甘油基醚、及對乙烯基苄基縮水甘油基 醚。此化合物可單獨使用或以其二或多種的組合使用。 作為含環氧基的不飽和化合物，為了實現所欲的共聚 合反應性及增加所生成的圖案之耐熱性，特別適用的是甲 基丙烯酸縮水甘油酯、曱基丙烯酸β—曱基縮水甘油酯、曱 基丙烯酸6, 7-環氧庚酯，鄰乙烯基苄基縮水甘油基醚、間 乙烯基苄基縮水甘油基醚、或對乙烯基苄基縮水甘油基醚。 以單體的總重量為基準’含環氧基的不飽和化合物之 用量為10〜70重量份，且較佳為2〇〜60重量份。若其量 少於10重量份，則所生成的圖案之耐熱性低。相反地，若 里超過7 0重量份，則共聚物的儲存穩定性係不宜地低。 再者，烯烴不飽和化合物的例子包括甲基丙烯酸甲 酉曰、曱基丙烯酸乙酯、曱基丙烯酸正丁酯、曱基丙烯酸第 —丁 S曰、曱基丙烯酸第三丁酯、丙烯酸甲酯、丙烯酸異丙 酯、曱基丙烯酸環己酯、甲基丙烯酸2_甲基環己酯、丙烯 馱一裱戊烯酯、丙烯酸二環戊酯、曱基丙烯酸二環戊烯酯、 曱基丙烯酸二環戊酯、丙烯酸1 -金剛烷酯、曱基丙烯酸1 -金剛烷酯、甲基丙烯酸二環戊氧基乙酯、曱基丙烯酸異冰 片§曰、丙烯酸環己酯、丙烯酸2-曱基環己酯、丙烯酸二環 戍氧基乙酿、丙烯酸異冰片酯、曱基丙烯酸苯酯、丙烯酸 200916969 «、丙烯酸㈣、甲基丙稀酸2_經乙醋、苯^ 基笨乙烯、間甲基苯乙烯、對甲基苯乙稀、乙烯基甲笨 對甲氧基笨乙稀、i’3—丁二歸、異戊二稀、及2,3_二甲基 一1，3 —丁二稀。此化合物可單獨使用或以其二或多種的組: 使用。 作為烯烴不飽和化合物，為 為了達成所欲的共聚合反應 性及在用作為顯影劑的驗性水溶液中之溶解性，特別適用 的是苯^烯、甲基丙浠酸二環戊基甲酿或對甲氡基笨乙稀。 以早體的總重量為基準’烯烴不飽和化合物的用量為 10〜70重量份，且較佳為20〜5〇重量份。當其用量落於上 述範圍内，則可避免關於丙稀酸共聚物之低儲存穩定性及 在用作為顯影劑的鹼性水溶液中之溶解性的不可能性之 題。 。 用於使上述單體聚合成丙烯酸共聚物的溶劑之例子包 括醚類，如甲醇、四氫呋喃、乙二醇單甲基醚 '乙二醇單 乙基醚、甲基溶纖劑醋酸酯、乙基溶纖劑醋酸酯、二乙二 醇單甲基_，三乙二醇單乙基趟，乙二醇二甲基驗、乙二 醇一乙基醚、乙二醇甲基乙基醚、丙二醇單甲基醚、丙二 醇單乙基醚、丙二醇丙基醚、丙二醇丁基鰱、丙二醇甲基 _醋酸酯、丙二醇乙基醚醋酸酯、丙二醇丙基醚醋酸酯、 丙二醇丁基醚醋酸酯、丙二醇甲基乙基丙酸酯、丙二醇乙 基醚丙酸酯、丙二醇丙基醚丙酸酯、丙二醇丁基醚丙酸 酯、甲苯、二甲笨、甲基乙基酮、環己酮、4_羥基_4―甲基 戊酮、醋酸曱酯 '醋酸乙酯、醋酸丙酯、醋酸丁酯、 200916969 每基丙酸乙醋、2 -經基-2-曱基丙酸曱醋、2 -經基-2-甲基 丙酸乙酯、經基醋酸甲酯、羥基醋酸乙酯、經基醋酸丁酯、 乳酸曱酯、乳酸乙酯、乳酸丙酯、乳酸丁 g旨、3_羥基丙酸 甲酯、3-羥基丙酸乙酯、3-羥基丙酸丙酯、3-羥基丙酸丁 酯、2-羥基-3-曱基丁酸甲酯、曱氧基醋酸曱酯、曱氧基醋 酸乙酯、甲氧基醋酸丙酯、曱氧基醋酸丁酯、乙氧基醋酸 甲酷、乙氧基醋酸乙酯、乙氧基醋酸丙酯、乙氧基醋酸丁 酯、丙氧基醋酸曱酯 '丙氧基醋酸乙酯、丙氧基醋酸丙酯、 丙氧基醋酸丁酯、丁氧基醋酸甲酯、丁氧基醋酸乙酯、丁 氧基醋酸丙酯、丁氧基醋酸丁酯、2-曱氧基丙酸甲酯、2-曱氧基丙酸乙酯、2-曱氧基丙酸丙酯、2-甲氧基丙酸丁酯、 2- 乙氧基丙酸甲酯、2-乙氧基丙酸乙酯、2-乙氧基丙酸丙 酯、2-乙氧基丙酸丁酯、2-丁氧基丙酸曱酯、2-丁氧基丙 酸乙酯、2- 丁氧基丙酸丙酯、2-丁氧基丙酸丁酯、3-甲氧 基丙酸甲酯、3-甲氧基丙酸乙酯、3-曱氧基丙酸丙酯、3-曱氧基丙酸丁酯、3-乙氧基丙酸曱酯、3-乙氧基丙酸乙酯、 3- 乙氧基丙酸丙酯、3-乙氧基丙酸丁酯、3-丙氧基丙酸甲 酿、3 -丙氧基丙酸乙醋、3 -丙氧基丙酸丙醋' 3 -丙氧基丙 酸丁酯、3-丁氧基丙酸曱酯、3-丁氧基丙酸乙酯、3-丁氣 基丙酸丙酯、及3- 丁氧基丙酸丁酯。此化合物可單獨使用 或以其二或多種的組合使用。 用於使上述單體聚合成丙烯酸共聚物的聚合引發劑係 自由基聚合引發劑，且其具體例子包括2，2 -偶氮雙異丁 腈、2, 2-偶氤（2, 4-二曱基戍腈）、2, 2-偶氮（4-曱氧基〜2, 200916969 一曱基戊腈）、1,1—偶氮（環己烷_i_腈）、及二甲基2,2_偶 氮異丁酸酯。 於本电月中’（c)光引發劑的例子包括I rgacure 369、200916969 IX. Description of the Invention: [Technical Field] The present invention relates to an organic-inorganic hybrid photosensitive resin composition for a passivation film and a liquid crystal display comprising the same, and more specifically relates to a photosensitive resin composition The material 'has a low dielectric constant and excellent adhesion' and heat, insulation, flatness and chemical resistance, and thus is suitable as a material for forming an image of an LCD, and it is a purified organic insulation formed in (10). The post-film system exhibits low dielectric constant, excellent moisture resistance and adhesion, and is therefore suitable for use as an organic insulating film. Further, it is used as a resistive resin for the overcoat layer. The resist resin for the resin, the column spacer, or the photoresist resin for the color light-receiving sheet is inferior in heat resistance, adhesion, and the like. [Prior Art] Generally, an organic insulating system mainly used for a device is made of Si〇2. Rational = Si has good insulation efficiency and mainly uses a substrate, which itself is advantageous for the formation of a film. However, Sl has an amorphous structure and a grade of 3.9. It is often unsuitable for use as the most ideal low dielectric constant organic insulator. The organic insulator for the passivation film must have a low dielectric constant in order to reduce the mobility of the package to a low thickness, thereby increasing the insulating properties and opening and closing ratios to enhance TFT driving properties. The passivation organic insulating film of the present invention is an acrylic organic insulating film having about 280. . Low heat resistance. In order to achieve the desired reliability, the insulating film is considered to be stable when the heat resistance of 200916969 3 0 0 C or more is ensured. However, conventional SiCh and acrylic insulation systems are disadvantageous because of increased cost and dielectric constant and reduced heat resistance, moisture resistance and adhesion. SUMMARY OF THE INVENTION Therefore, the present invention has been noted in the related art, and the present invention provides an organic-inorganic hybrid photosensitive resin composition which has a low dielectric constant and excellent adhesion and heat resistance. Insulation, flatness, and chemical resistance, so it can be used as a material for forming an image of lcd, and further exhibits a low dielectric constant and excellent after forming an organic-inorganic hybrid passivation insulating film of an LCD. It is moisture-resistant, adhesive, and heat-resistant, and thus is very suitable as a passivation insulating film' and the present invention also provides an LCD containing a hardened body thereof. [Embodiment] According to the present invention, an organic-inorganic hybrid photosensitive resin composition comprises: (4) a colloidal inorganic sol, (8) from (1) an unsaturated (tetra), an unsaturated tickered needle or a mixture thereof, and (1) an at least one acrylic acid. Copolymerization of an unsaturated compound produces an acrylic copolymer, a non-functional initiator '(d) a polyfunctional monomer having an ethylenically unsaturated bond, ^3 has a %-based or amine-based lanthanide compound, and (f) Solvent. Moreover, it is a silkworm that supplies a hardened body. Specifically, (a) a colloidal inorganic sol is pulled, <small stalks are added by adding colloidal inorganic nanoparticles with 1 to 120 parts by weight of a roll..., organic decane, so that organic decane and inorganic nanoparticles The surface of the particles reacts, removes the water, and then adds an organic solvent, which makes the reaction medium hydrophobic due to 200916969. The colloidal inorganic nanoparticle is preferably composed of a water-dispersed colloid in an organic material, and comprises at least one selected from the group consisting of Shi Xishi's emulsification, titanium dioxide oxidized, tin oxide, oxidized, and reacted with organic decane. The organic materials and the prosperous materials modified by the surface of the meteorite. Therefore, the β-method includes the addition of a water-dispersed colloidal inorganic material to an organic stone, the removal of water, and the addition of an organic bath to the sputum, and can be repeatedly performed at a predetermined time interval or at a predetermined time interval. The organic zephyr is represented by the following formula: RV3Si(〇R2)H, wherein ri is at least one selected from the group consisting of alkyl, stupid, cyclized alkyl, propylene fluorenyl, methacryl fluorenyl, allylic a group, a vinyl group and an epoxy group, at least one selected from the group consisting of methyl 'ethyl, isopropyl, n-propyl and n-butyl, and R 2 is an alkoxy group, an acetate group or a bismuth inorganic sol. The amount of the material is preferably Ib". Further, the resin composition comprises: (b) 100 f parts by weight of an acrylic copolymer" which is copolymerized (1) 5 to 4 Q parts by weight of unsaturated (tetra), unsaturated tartile needle Or a mixture thereof and (11) 5 to 95 parts by weight of at least one propylene anti-unsaturated compound; (c) U 〇 1 to 3. parts by weight of a photoinitiator &quot; (d) 10 to 100 parts by weight a polyfunctional monomer having an ethylenically unsaturated bond; (e) 0.001 to 5 parts by weight of an anthracene compound containing an epoxy group or an amine group: and (1) a solvent in an amount such that the photosensitive resin composition is solid. The content is 10 to 50 parts by weight. (a) The colloidal inorganic nanoparticle has a spherical shape of a size of 1 to 1 〇〇 nm or a fiber shape of a size of 1 〇〇 to 1 _. When the surface of the nanoparticle of the machine is treated with an organic decane having a reactive group, the inorganic nanoparticle is stably dispersed in an organic solvent, thereby exhibiting high stability and chemically bonding them to the organic resin at a molecular degree. (b) An acrylic copolymer can be prepared by subjecting a monomer to a radical reaction in the presence of a solvent and a polymerization initiator, the monomer comprising (i) an unsaturated carboxylic acid, an unsaturated carboxylic anhydride or a mixture thereof. And (ii) an unsaturated compound of acrylic acid. In the present invention, examples of '(b)(i) unsaturated acid, unsaturated acid-fastening needle or a mixture thereof include unsaturated monocarboxylic acids such as acrylic acid, methyl acrylic acid Special 'uninterrupted and di-acidic acid, such as maleic acid, fumaric acid, citraconic acid, seccoic acid, itaconic acid, etc.; and its unsaturated dicarboxylic anhydride, which can be used alone or in combination with two or more Used in combination, in order to achieve desired copolymerization reactivity and solubility in an aqueous alkaline solution used as a developer, acrylic acid, mercaptoacrylic acid or maleic anhydride is particularly useful. Based on the total weight of the monomers, Unsaturation The unsaturated tauic anhydride or a mixture thereof is used in an amount of 5 to 40 parts by weight. If the amount is less than 5 parts by weight, the component is difficult to dissolve in the aqueous test solution. Conversely, if the amount exceeds 4 parts by weight, this The solubility of the component in the alkaline aqueous solution is too high. In the present invention, (b) (ii) the acrylic acid unsaturated compound includes an epoxy group-containing unsaturated compound and a dilute hydrocarbon unsaturated compound. Examples of the unsaturated compound include glycidyl propionate, glycidyl methacrylate, ?-ethyl methacrylate, glycidyl n-propyl acrylate, glycidyl α-n-butyl acrylate. -Methyl glycidyl ester, β-mercapto-glycolic acid 200916969 oil ester, β-ethyl glycidyl acrylate, ethyl glycidyl methacrylate, 3, 4-epoxybutyl acrylate, Mercaptopropionic acid 3, 4-epoxy butyl vinegar, 6,7-epoxyheptyl acrylate, methacrylic acid 6,7-epoxy vinegar, α_ methacrylic acid 6,7-epoxy heptyl , o-vinylbenzyl glycidyl ether, m-vinylbenzyl glycidol An ether, and a p-vinylbenzyl glycidyl ether. This compound may be used singly or in combination of two or more kinds thereof. As the epoxy group-containing unsaturated compound, in order to achieve desired copolymerization reactivity and increase heat resistance of the resulting pattern, glycidyl methacrylate or β-mercapto glycidyl methacrylate is particularly suitable. 6, methacrylic acid 6,7-epoxyheptyl ester, o-vinylbenzyl glycidyl ether, m-vinylbenzyl glycidyl ether, or p-vinylbenzyl glycidyl ether. The epoxy group-containing unsaturated compound is used in an amount of 10 to 70 parts by weight, based on the total weight of the monomers, and preferably 2 to 60 parts by weight. If the amount is less than 10 parts by weight, the heat resistance of the resulting pattern is low. On the contrary, if it exceeds 70 parts by weight, the storage stability of the copolymer is undesirably low. Further, examples of the olefin unsaturated compound include formazan methacrylate, ethyl methacrylate, n-butyl decyl acrylate, butyl sulfonium methacrylate, third butyl methacrylate, methyl acrylate. , isopropyl acrylate, cyclohexyl methacrylate, 2-methylcyclohexyl methacrylate, propylene decyl pentene ester, dicyclopentanyl acrylate, dicyclopentenyl methacrylate, methacrylic acid Dicyclopentyl ester, 1-adamantyl acrylate, 1-adamantyl methacrylate, dicyclopentyloxyethyl methacrylate, isobornyl hydrazide § 曰, cyclohexyl acrylate, 2-mercapto acrylate Cyclohexyl ester, dicyclohexyloxy acrylate, isobornyl acrylate, phenyl methacrylate, acrylic acid 200916969 «, acrylic acid (tetra), methyl acrylate 2 _ vinegar, benzene ^ stupyl ethylene, between Styrene, p-methyl styrene, vinyl phenyl p-methoxy stupid ethylene, i'3-dicene, isoprene, and 2,3-dimethyl- 1,3 - Two thin. This compound may be used singly or in the group of two or more thereof: used. As the olefin-unsaturated compound, in order to achieve desired copolymerization reactivity and solubility in an aqueous test solution used as a developer, it is particularly suitable to use a benzene enelate or a dicyclopentyl methacrylate. Or for the scorpion base stupid. The olefin unsaturated compound is used in an amount of 10 to 70 parts by weight, based on the total weight of the precursor, and preferably 20 to 5 parts by weight. When the amount thereof falls within the above range, the problem of low storage stability of the acrylic acid copolymer and impatience in solubility in an alkaline aqueous solution as a developer can be avoided. . Examples of the solvent for polymerizing the above monomer into an acrylic copolymer include ethers such as methanol, tetrahydrofuran, ethylene glycol monomethyl ether 'ethylene glycol monoethyl ether, methyl cellosolve acetate, ethyl Cellulolytic acetate, diethylene glycol monomethyl _, triethylene glycol monoethyl hydrazine, ethylene glycol dimethyl test, ethylene glycol monoethyl ether, ethylene glycol methyl ethyl ether, propylene glycol Monomethyl ether, propylene glycol monoethyl ether, propylene glycol propyl ether, propylene glycol butyl hydrazine, propylene glycol methyl acetate, propylene glycol ethyl ether acetate, propylene glycol propyl ether acetate, propylene glycol butyl ether acetate, propylene glycol Methyl ethyl propionate, propylene glycol ethyl ether propionate, propylene glycol propyl ether propionate, propylene glycol butyl ether propionate, toluene, dimethoprim, methyl ethyl ketone, cyclohexanone, 4_ Hydroxy_4-methylpentanone, decyl acetate 'ethyl acetate, propyl acetate, butyl acetate, 200916969 per propyl acetonate, 2 - mercapto-2-mercaptopropionate vinegar, 2 - Ethyl 2-methylpropionate, methyl acetate, ethyl hydroxyacetate, butyl acetate, decyl lactate, lactic acid Ester, propyl lactate, lactic acid, methyl 3-hydroxypropionate, ethyl 3-hydroxypropionate, propyl 3-hydroxypropionate, butyl 3-hydroxypropionate, 2-hydroxy-3-hydrazine Methyl butyrate, decyl oxyacetate, ethyl decyl acetate, propyl methoxyacetate, butyl oxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, ethoxy Propyl propyl acetate, butyl ethoxyacetate, decyl oxyacetate, ethyl propoxyacetate, propyl propoxy propyl acetate, butyl propyl acetate, methyl butoxyacetate, butoxy Ethyl acetate, butyl butoxyacetate, butyl butoxyacetate, methyl 2-methoxypropionate, ethyl 2-nonoxypropionate, propyl 2-methoxypropionate, 2- Butyl methoxypropionate, methyl 2-ethoxypropionate, ethyl 2-ethoxypropionate, propyl 2-ethoxypropionate, butyl 2-ethoxypropionate, 2- Ethyl butoxypropionate, ethyl 2-butoxypropionate, propyl 2-butoxypropionate, butyl 2-butoxypropionate, methyl 3-methoxypropionate, 3- Ethyl methoxypropionate, propyl 3-methoxypropionate, butyl 3-methoxypropionate, decyl 3-ethoxypropionate Ethyl 3-ethoxypropionate, propyl 3-ethoxypropionate, butyl 3-ethoxypropionate, 3-propoxypropionic acid, 3-propyl propoxyacetate, 3-propoxypropionic acid propyl vinegar butyl 3-propoxy propionate, decyl 3-butoxypropionate, ethyl 3-butoxypropionate, propyl 3-butoxypropanoate, And 3-butoxypropionic acid butyl ester. This compound may be used singly or in combination of two or more kinds thereof. A polymerization initiator for polymerizing the above monomer into an acrylic copolymer is a radical polymerization initiator, and specific examples thereof include 2,2-azobisisobutyronitrile, 2,2-anthracene (2, 4-di) Mercaptocarbonitrile, 2,2-azo (4-methoxyl~2, 200916969-mercapto valeronitrile), 1,1-azo (cyclohexane_i-nitrile), and dimethyl 2 , 2_ azo isobutyrate. In the current month, examples of '(c) photoinitiators include Irgacure 369,

Irgacure 651 Irgacure 907、Darocur TPO、Irgacure 819、 二井、苯偶姻、苯乙酮、咪唑、及咕噸酮。 光引發劑的具體例子包括2, 4-雙三氣曱基_6一對甲氧 基苯乙烯基-s-三井、2 —對曱氧基苯乙烯基_4, 6 —雙三氯曱 基s —井、2, 4-二氣曱基—6 —三井、2, 4-三氣甲基-4-曱基 萘基-6-二井、二笨曱酮 '對（二乙基胺基）二笨甲酮、2,2 — 二氣-4-笨氧基笨乙酮、2,2_二乙氧基苯己酮、2十二基噻 ㈣、2，m塞嘲酮、2,4_二乙基㈣嗣、及2 2_雙 -2-氣笨基-4, 5, 4, 5-四笨基—2 — ^ —雙咪唑。此化合物可單 獨使用或以其一或多種的組合使用。 以100重量份的丙稀酸共聚物為基準，光引發劑的用 量為0，001〜30重量份， 量少於0.001重量价， ，且較佳為〇.〇1〜2〇重量份。若其Irgacure 651 Irgacure 907, Darocur TPO, Irgacure 819, Dijing, benzoin, acetophenone, imidazole, and xanthone. Specific examples of the photoinitiator include 2,4-bistrimethylsulfonyl-6-p-methoxymethoxystyryl-s-tripper, 2-p-nonyloxystyryl-4,6-bistrichloroindenyl s - well, 2, 4-dione thiol-6 - Mitsui, 2, 4-trimethylmethyl-4-mercaptonaphthyl-6-two wells, dicuminone 'p-(diethylamino) Dibenzophenone, 2,2-di-2-cyclo-4-oxoethyl ketone, 2,2-diethoxybenzophenone, 2,12-ylthio (tetra), 2,m-zemonone, 2,4 _Diethyl(tetra)anthracene, and 2 2_bis-2-indolyl-4,5,4,5-tetraphenyl- 2 -^-diimidazole. This compound may be used singly or in combination of one or more thereof. The photoinitiator is used in an amount of from 0,001 to 30 parts by weight, based on 100 parts by weight of the acrylic acid copolymer, in an amount of less than 0.001% by weight, and preferably from 〇1 to 2 parts by weight. If it

12 200916969 六丙烯酸酯、二季戊四醇三丙烯酸酯、二季戊四醇二丙烯 酸酯、山梨糖醇三丙烯酸酯、雙酚A二丙烯酸酯衍生物、 二季戊四醇聚丙烯酸酯、及其曱基丙烯酸酯。 以100重量份的丙烯酸共聚物為基準，具有 w ，Ί 土个 飽和鍵的多官能單體之用於為10〜100重量份，且較佳為 1〇〜60重量份。若其量少於10重量份，則感光性樹脂的硬 化度低，使得其難以實現接觸孔及圖案。相反地，若量超 過100重量份，則硬化度不必要地增加，在顯影後不宜地 減少圖案及接觸孔的解析度。 於本發明中，（e)含有環氧基或胺基的矽系化合物之例 子包括（3 一縮水甘油氧基丙基）三甲氧基石夕烧'(3-縮水甘油 氧基丙基）二乙氧基秒炫、^ q y 沉（3-細水甘油氧基丙基）甲基二甲 氧基砍炫、（3-縮水甘油夤其石甘、 油乳基丙基）：甲基乙氧 壤乳丁基三甲氧某石〇 . 虱基矽烷、3,4-環氧丁基三乙氧基 2-（3, 4-環氧環己其、^ 土）乙基二甲氧基矽烷、2 基）乙基三乙氧基矽烷、乃盼甘 衣乳％己 獨使用或以其二或多種的組合使用。 -了早 以1 0 0重量份的$ ^ 里伤的丙烯醆共聚物為基 胺基的矽系化合物之用旦&amp; 3有％虱基或 重量份。；：：為〇划〜5重量份，且較佳為 序後，_極與感光;X於0·〇001重量份，則在硬化程 減低。相反地，若量超過5之:的黏者性變少’且耐熱性 在顯影劑中未曝光邻八&amp;重量份，則在顯影程序後導致 於本發明中的白化及圖案和接觸孔的浮逢。 冷劑係用於平坦化絕緣膜及防止塗層 200916969 污斑的產生，因此形成均勻的圖案輪廓。 溶劑的例子包括：醇類，如甲醇、乙醇等；醚類，如 四氫呋喃等；二醇醚類，如乙二醇單〒基醚、乙二醇單乙 基瞇等，乙基二醇烷基醚醋酸酯類，如曱基溶纖劑醋酸酯、 乙基溶纖劑醋酸酯等；二乙二醇類’如二乙二醇單甲基醚、 二乙二醇單乙基醚、二乙二醇二曱基醚等；丙二醇單烷基 醚類，如丙二醇曱基醚、丙二醇乙基醚'丙二醇丙基醚、 丙二醇丁基醚等；丙二醇烷基醚醋酸酯類，如丙二醇甲基 醚醋酸酯、丙二醇乙基醚醋酸酯、丙二醇丙基醚醋酸酯、 丙二醇丁基醚醋酸酯等；丙二醇烷基醚丙酸酯類，如丙二 醇曱基醚丙酸酯、丙二醇乙基醚丙酸酯、丙二醇丙基醚丙 酸酯、丙二醇丁基醚丙酸酯等；芳香族烴類，如曱苯、二 甲笨等；酮類，如曱基乙基嗣、環己酮、4一羥基—4—甲基_2_ 戊酮等；及S旨類，如醋酸甲、醋酸乙自、醋酸丙酯、醋 酸丁酯、2-羥基丙酸乙酯、2 —羥基—2_曱基丙酸甲酯、2_羥 基〜2-甲基丙酸醋乙、經基醋酸甲醋、經基醋酸乙醋、經基 醋酸丁酯、乳酸甲酯、乳酸乙酯 '乳酸丙酯、乳酸丁酯、 3-經基丙酸甲S旨、3-經基丙酸乙醋、3〜經基丙酸丙醋、3_ 經基丙酸丁 S旨、2-經基〜3_甲基丁酸”旨、f氧基醋酸〒 醋、甲氧基醋酸乙醋、甲氧基醋酸丙醋、甲氧基醋酸丁醋、 乙氧基醋酸曱酯、乙氧基醋酸乙酯、乙氧基醋酸丙酷、乙 氧基醋酸丁醋、丙氡基醋酸甲，、丙氧基醋酸乙醋、丙氧 基醋酸丙酯、丙氧基醋酸丁酯、丁氧基醋酸&quot;旨、氧基醋 酸乙酯、丁氧基醋酸丙酯、丁氧基醋酸丁酯、2—曱氧基丙 14 200916969 酸甲酯、2-甲氧基丙酸乙酯、2-甲氧基丙醆丙醋、2—甲氧 基丙酸丁醋、2-乙氧基丙酸曱酯、2-乙氧基丙酸乙酿、2一 乙氧基丙酸丙酯、2-乙氧基丙酸丁酯、2-丁氧基丙酸甲酯、 2-丁氧基丙酸乙酯、2-丁氧基丙酸丙酯、2_ 丁氧基丙酸丁 酯、3-甲氧基丙酸酯曱、3-甲氧基丙酸乙酯、3_曱氧基丙 酸丙酯、3-乙氧基丙酸甲酯、3—乙氧基丙酸乙醋、3―乙氧 基丙酸丙酯、3-乙氧基丙酸丁酯、3-丙氧基丙酸甲酯、3一 丙氧基丙酸乙酯、3-丙氧基丙酸丙酯、3-丙氧基丙酸丁酯、 3-丁氧基丙酸甲酯、3-丁氧基丙酸乙酯、3_丁氧基丙酸丙 酯、3 -丁氧基丙酸丁酯等。 作為溶劑，特別適用的是至少一種選自於二醇醚、伸 乙基烷醚醋酸酯及二乙二醇，其就與各成分的溶解性、反 應性及塗膜的形成容易性而言係有利的。 溶劑的用量係使得感光性樹脂組成物的固體含量範圍 成為10〜50重量份。滿足上述固體含量範圍要求的組成物 較佳係在使用〇.丨〜0 2μπι微孔過濾器過遽後而使用。較宜 地，溶劑的用量係使得組成物的固體含量範圍成為15〜4〇 重置份。若組成物的固體含量少於丨〇重量份，則塗層厚度 钗低且塗層的平坦性變低。相反地，若固體含量超過5 〇 重置份，則塗層厚度將減少，且塗覆裝置在塗佈過程中可 能受到負荷u 而且’本發明的感光性樹脂組成物，若須要則可包含 與其可相容的添加劑，如熱聚合抑制劑或消泡劑，且可額 外地包含顏料，視其最後用途而定。例如，黑色矩陣用的 15 200916969 光阻或彩色濾光片用的光阻，其為用於形成tft_lcd的影 像之材料，係藉由組合本發明的組成物與顏料來形成。而 且，如顏料的類型可適當地變化，視黑色矩陣或彩色濾光 片用的光阻之最後用而且可應用有機顏料及有機顏料。 此外，本發明提供一種TFT-LCD，其含有如上述的有機 一無機混成感光性樹脂組成物之硬化體。 :成m—LCD的圖案之方法包括由鈍化膜用的有機益 機成感光性樹脂組成物、罩面層用的光阻、，専、色矩陣用 2阻、柱狀間隔物用的光阻，彩色渡光片用的光阻來形 2機絕緣膜’因此製造TFT⑽，而且方法之特徵為使用 有機-無機混成感光性樹脂組成物。 具體地’以下說明使用有機—益 物來rnT ΪΓ“ &amp; …、機仰成感光性樹脂組成 刃采形成ΊΤΤ〜LCD的圖案之方法。 :先’錯由噴霧、輥對輥塗覆或回轉塗覆，將本發明 =樹脂組成議到基板的表面上，然後 除溶劑，而形成塗膜…該預烘烤係在 ： C 進行1〜15分鐘》 然後，經過已經作成的圖案，用可見光 外光、電子束或x射線來照射 通、‘工 7形成的塗膜，接荖用甜！ d來顯影以去除不要的部分， 員衫 J復传指定的圖案。12 200916969 Hexaacrylate, dipentaerythritol triacrylate, dipentaerythritol diacrylate, sorbitol triacrylate, bisphenol A diacrylate derivative, dipentaerythritol polyacrylate, and mercapto acrylate. The polyfunctional monomer having a saturated bond of w and alumina is used in an amount of 10 to 100 parts by weight, and preferably 1 to 60 parts by weight, based on 100 parts by weight of the acrylic copolymer. If the amount is less than 10 parts by weight, the degree of hardening of the photosensitive resin is low, making it difficult to achieve contact holes and patterns. On the contrary, if the amount exceeds 100 parts by weight, the degree of hardening is unnecessarily increased, and the resolution of the pattern and the contact hole is undesirably reduced after development. In the present invention, examples of (e) an anthracene-based compound containing an epoxy group or an amine group include (3-glycidoxypropyl)-trimethoxy-xanthine '(3-glycidoxypropyl)diethyl Oxygen stimuli, ^ qy s(3-glycidoxypropyl)methyldimethoxy sulphate, (3-glycidyl ruthenium sulphate, oleyl propyl): methyl ethoxylate Lactic butyl trimethoate, sulphate, decyl decane, 3,4-epoxybutyl triethoxy 2-(3, 4-epoxycyclohexyl, tert-ethyl) ethyl dimethoxy decane, 2 Ethyl triethoxy decane, yin gan yam is used alone or in combination of two or more thereof. - The amount of the oxime compound based on 100 parts by weight of the ruthenium-based ruthenium-based compound is 100% by weight or part by weight. ;:: is 〜5 parts by weight, and preferably after the order, _ pole and photosensitive; X is 0·〇001 parts by weight, and is reduced in the hardening course. Conversely, if the amount exceeds 5: the viscosity of the adhesive becomes less' and the heat resistance is not exposed to the adjacent eight &amp; parts by weight in the developer, the whitening and pattern and contact hole in the present invention are caused after the development process. Floating. The refrigerant is used to planarize the insulating film and prevent the generation of the stains of the coating 200916969, thus forming a uniform pattern outline. Examples of the solvent include: alcohols such as methanol, ethanol, etc.; ethers such as tetrahydrofuran, etc.; glycol ethers such as ethylene glycol monodecyl ether, ethylene glycol monoethyl hydrazine, etc., ethyl glycol alkyl group Ether acetates, such as thiol-based cellosolve acetate, ethyl cellosolve acetate, etc.; diethylene glycols such as diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethyl Diol dimethyl ether, etc.; propylene glycol monoalkyl ethers, such as propylene glycol decyl ether, propylene glycol ethyl ether 'propylene glycol propyl ether, propylene glycol butyl ether, etc.; propylene glycol alkyl ether acetates, such as propylene glycol methyl ether Acetate, propylene glycol ethyl ether acetate, propylene glycol propyl ether acetate, propylene glycol butyl ether acetate, etc.; propylene glycol alkyl ether propionate such as propylene glycol decyl ether propionate, propylene glycol ethyl ether propionate , propylene glycol propyl ether propionate, propylene glycol butyl ether propionate, etc.; aromatic hydrocarbons, such as toluene, dimethyl strepene; ketones, such as mercaptoethyl hydrazine, cyclohexanone, 4-hydroxy- 4 - methyl 2 - pentanone, etc.; and S, such as acetic acid, ethyl acetate, propyl acetate, butyl acetate Ethyl 2-hydroxypropionate, methyl 2-hydroxy-2-mercaptopropionate, 2-hydroxy~2-methylpropionic acid vinegar, transacetic acid methyl acetate, transacetic acid ethyl acetate, transacetate Ester, methyl lactate, ethyl lactate propyl lactate, butyl lactate, 3-propionic acid methyl s, 3-propyl propyl acetonate, 3 propyl propyl acrylate, 3 _ propyl propyl acrylate Acid butyl S, 2-carbyl~3-methylbutyric acid, f-oxyacetic acid vinegar, methoxyacetic acid vinegar, methoxyacetic acid vinegar, methoxyacetic acid butyl vinegar, ethoxylate Ethyl acetate, ethoxyacetic acid ethyl ester, ethoxyacetic acid propyl acetonate, ethoxy acetoacetic acid butyl vinegar, propyl decyl acetate, propyl ethoxyacetate, propyl propyl acetate, propoxyacetic acid Butyl ester, butoxyacetic acid &quot;, ethyl oxyacetate, propyl butoxyacetate, butyl butoxyacetate, 2-methoxypropene 14 200916969 methyl ester, 2-methoxypropionic acid Ethyl ester, 2-methoxypropane vinegar, 2-methoxypropionic acid butyl vinegar, 2-ethoxypropionate decyl ester, 2-ethoxypropionic acid ethyl, 2-ethoxypropionic acid Propyl ester, butyl 2-ethoxypropionate, methyl 2-butoxypropionate, 2- Ethyl oxypropionate, propyl 2-butoxypropionate, butyl 2-butoxypropionate, cesium 3-methoxypropionate, ethyl 3-methoxypropionate, 3 曱 oxygen Propyl propyl propionate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, propyl 3-ethoxypropionate, butyl 3-ethoxypropionate, 3-propoxy Methyl propionate, ethyl 3-propoxypropionate, propyl 3-propoxypropionate, butyl 3-propoxypropionate, methyl 3-butoxypropionate, 3-butoxy Ethyl propyl propionate, propyl 3-butoxypropionate, butyl 3-butoxypropionate, etc. As a solvent, at least one selected from the group consisting of glycol ethers and ethyl ether ether acetate is particularly suitable. And diethylene glycol, which is advantageous in terms of solubility and reactivity of each component and ease of formation of a coating film. The amount of the solvent is such that the solid content of the photosensitive resin composition ranges from 10 to 50 parts by weight. . The composition which satisfies the above requirements of the solid content range is preferably used after being passed through a 〇.丨~0 2μπι microporous filter. Preferably, the amount of the solvent is such that the solid content of the composition ranges from 15 to 4 Torr. If the solid content of the composition is less than 丨〇 by weight, the coating thickness is lowered and the flatness of the coating becomes low. Conversely, if the solid content exceeds 5 〇 of the replacement portion, the coating thickness will be reduced, and the coating device may be subjected to the load during the coating process and the 'photosensitive resin composition of the present invention may be included if necessary Compatible additives, such as thermal polymerization inhibitors or defoamers, and may additionally contain pigments, depending on their end use. For example, a photoresist for a black matrix of 15 200916969 photoresist or color filter which is a material for forming an image of tft_lcd is formed by combining the composition of the present invention with a pigment. Further, as the type of the pigment can be appropriately changed, the final use of the photoresist for the black matrix or the color filter can be applied to the organic pigment and the organic pigment. Further, the present invention provides a TFT-LCD comprising a hardened body of the organic-inorganic hybrid photosensitive resin composition as described above. : The method of forming the pattern of the m-LCD includes a photosensitive resin composition for the passivation film, a photoresist for the overcoat layer, a photoresist for the germanium, the color matrix, and a photoresist for the column spacer. The photoresist for the color light-receiving sheet is used to form a two-machine insulating film. Thus, the TFT (10) is manufactured, and the method is characterized in that an organic-inorganic hybrid photosensitive resin composition is used. Specifically, the following description uses an organic-benefit material to rnT ΪΓ " &amp; ..., a method of forming a photosensitive resin to form a pattern of ΊΤΤ ~ LCD. First: wrong by spray, roller-to-roll coating or slewing Coating, the invention = resin composition is discussed on the surface of the substrate, and then the solvent is removed to form a coating film... The pre-baking is performed at: C for 1 to 15 minutes. Then, after the pattern has been formed, the visible light is used. Light, electron beam or x-ray is used to illuminate the coating film formed by 'Working 7', and the film is made of sweetness! d to develop to remove the unnecessary portion, and the shirt J repeats the designated pattern.

顯影劑包含鹼性水溶液’I 氧氧化鈉、氫氧化鉀“炭酸鈉等：」I ·無機鹼’如 -’一級胺，如正丙胺耸· 〜級’如二乙胺、正丙胺等 胺寺， 二乙美脸、-审i —、及胺，如三曱胺'甲基 G基胺、—曱基乙基胺、三乙 丫丞 胺寻，醇胺，如二曱基乙 16 200916969 醇胺甲基—乙醇胺、三乙醇胺等；及四級敍鹽，如氫氧 甲基銨、氫氡化四乙銨等。藉由將鹼性化合物以〇. 1 〜10重置份的濃度來溶解而使用顯影劑，且可添加指定量 的水性有機溶劑’如甲醇或乙醇，及界面活性劑。 於使用上述顯影劑的顯影過程後，使用超純水來進行 30 90 #的清洗，因此去除不要的部分然後進行乾燥， 因此升v成圖案。用於uv光照射該圖案，然後使用加熱器如 九、相在150〜25(TC加熱30〜90分鐘，藉以獲得最终圖案。 依妝本發明的有機_無機混成絕緣膜係表現低介電常 數及優異的抗濕性、黏著性、耐熱性、絕緣性、平坦性及 耐化學性，因此適用作為形成LCD之影像用的材料，而且 在形成LCD的有機-無機混成鈍化絕緣膜後，顯示低介電常 數及優異的抗㈣、黏著性及耐熱性，因此適合當作純化 絕緣膜。再者，該有機_無機混成絕緣膜係可用作為罩面層 用的光阻樹脂、，累色矩陣用的光阻樹月旨、_狀間隔物用的 光阻樹脂、彩色遽光片用的光阻樹脂，因此實現高的对熱 性、黏著性等。 經由以下的實施例可更佳地瞭解本發明，該些實施例 用於說明而非構成本發明的限制。 實施例1 :無機溶膠的形成 於具有pH已經調到3〜5的酸性範圍之膠態無機材料 中，添加1〜120重量份的曱基三曱氧基矽烷（MTMS)或乙烯 基三曱氧基矽烷（VTMS)，其係經乙醇所稀釋的有機矽烷’ 以便有機矽烷與無機奈米粒子的表面反應，去除水，然後 17 200916969 添加有機溶劑，因此使得反應介質成為疏水性。 而且’隨扮演控制無機材料的表面之疏水性程度的 1色’方式為當MTMS的甲氧基與膠態無機粒子的表面反應 時，甲基係暴露於其表面’因此將膠態無機材料轉化成可 分散在有機樹財的形式。此外，v的功能為當舰的 —個甲氧基與疏水性膠態無機材料的界面之〇H基進行縮合 反應時’乙烯基變成暴露出，因此疏水性膠態無機粒子可 形成具有乙烯基或其它反應基的膠態無機溶膠。 貫施例2 :丙烯酸共聚物的製備 在裝設有冷卻管及攪拌器的燒瓶内，加入10重量份的 2’2偶氮（2,4~二曱基戊腈）、2〇〇重量份的丙二醇單曱基 謎醋酸酷、20重量份的曱基丙烯酸、35重量份的曱基丙烯 酸縮水甘油醋、1 5重量份的曱基丙烯酸曱酯、及30重量份 的苯乙稀’用氮氣沖洗，然後徐徐攪拌。將反應溶液加熱 到62 C ’然後將此溫度維持5小時，因此製備一種含有丙 稀酸共聚物的聚合物溶液。 將所製備的丙烯酸共聚物以液滴加到5, 000重量份的 己院中，進行沈澱、過濾、分離，添加200重量份的丙酸 醋’然後加熱到30°c，因此獲得具有45重量份的固體含量 及11，000的重量平均分子量之最终聚合物❶重量平均分子 量係使用GPC以聚笨乙烯換算。 實施例3 :有機—無機混成感光性樹脂組成物的製備 混合1 〇〇重量份的含有丙烯酸共聚物的聚合物溶液、 15重量份當作光引發劑的Irgacure 819、40重量份當作多 18 200916969 官能單體的二季戊四醇六丙烯酸酯及1〇重量份的三羥甲基 丙烷三丙烯酸酯、1重量份的當作矽系化合物的2_(3,4一環 氧環己基）乙基三甲氧基m 2重量份當切系界面活 性劑的F171。然後，於此混合物内，加入二乙二醇二曱基 醚’量為使得固體含量成為35重量份’藉以溶解混合物。 所獲得丙烯酸共聚物與實施例丨的無機溶膠以95:5的 重量比進行混合。 使用0. 2卿的微孔過濾器來過濾所獲得的有機_無機混 成感光性樹脂組成物，以去除雜f，而且過濾後的感純 樹脂組成物具# 15cps的黏度。若使用其來形成薄膜，則 將厚度設定在0. 5〜5. Ομιη ’視塗佈速率而定。 實施例4 :有機-無機混成感光性樹脂組成物的製備 如實施例2中製備丙烯酸共聚物，及如實施例丨中製 備無機溶膠。將丙烯酸共聚物與無機溶膠以8〇:2〇的重量 比進行混4，SUb獲得-種有機-無機混成感光性樹脂組成 物。使用0. 2叫的微孔過濾器來過濾有機—無機混成感光性 樹脂組成物，以去除雜質’而且過濾後的感光性樹脂組成 物具有15cps的黏度。若使用其來形成薄膜，則將厚度設 定在0.5〜5.0 μπι，視塗佈速率而定。 貫施例5 :有機-無機混成感光性樹脂組成物的製備 如實施例2中製備丙烯酸共聚物，及如實施例1中製 備無機溶膠。將丙烯酸共聚物與無機溶膠以6〇:4〇的重量 比進行混合’因此獲得-種有機-無機混成感光性樹脂組成 物。使用0. 2 μπι的微孔過濾益來過濾有機—無機混成感光性 19 200916969 樹脂組成物’以去除雜質，而且過濾後的感光性樹脂組成 物具有15cPS的黏度。若使用其來形成薄膜，則將厚度設 定在0.5〜5. 0μιη，視塗佈速率而定。 貝靶例6 .有機-無機混成感光性樹脂組成物的製備 如貝訑例2中製備丙烯酸共聚物，及如實施例1中製 備無機溶膠。將丙烯酸共聚物與無機溶膠以4〇:6〇的重量 比進行混合’因此獲得—種有機—無機混成感光性樹脂組成 物。使用0.2μιη的微孔過濾器來過濾有機—無機混成感光性 樹脂組成物’以去除雜質，而且過渡後的感綠樹脂組成 物具有15cps的黏度。若使用其來形成薄膜，則將厚度設 定在0.5〜5.0 μπι，視塗佈速率而定。 實施例7 :有機-無機混成感光性樹脂組成物的製備 如實施例2中製備丙烯酸共聚物，及如實施例丨中製 備無機溶膠。將丙稀酸共聚物與無機溶膠以的重量 比進行混合，因此獲得一種有機-無機混成感光性樹脂組成 物。使用0. 2_的微孔過濾器來過濾有機—無機混成感光性 樹脂組成物，以去除雜質，而且過濾後的感光性樹脂組成 物具有15cps的黏度。若使用其來形成薄骐，則將厚度設 定在〇_5〜5·0μπι，視塗佈速率而定。 貫施例8 :有機-無機混成感光性樹脂組成物的製備 如實施例2中製備丙烯酸共聚物，及如實施例1中製 備無機溶膠。將丙烯酸共聚物與無機溶膠以1 〇 : 9 〇的重量 比進行混合，因此獲得一種有機-無機混成感光性樹脂組成 物。使用0. 2μιη的微孔過濾器來過濾有機-無機混成感光性 20 200916969 樹脂組成物，以去除雜質，而且過濾後的感光性樹脂組成 物具有15cps的黏度。若使用其來形成薄膜，則將厚度設 定在0 · 5〜5. 0 μπι，視塗佈速率而定。 塗佈實施例3至8的各有機-無機混成感光性樹脂纽成 物之塗料溶液，且經由以下方法來評估其性質。結果顯示 於以下表1中。 ‘ ' 在玻璃基板上，用旋塗機來塗佈實施例3至8的各感 光性樹脂組成物溶液，然後在加熱板上於9〇它預烘烤2分 鐘，因此形成薄膜。 用指定的圖案光罩來覆蓋薄膜，然後用纟365nm呈有 1 5mw/cm2的強度之ϋν光來照射6秒。之後，用〇. 38重量份 的氫氧化四甲銨之水溶液，在肌將薄膜顯影2分鐘然 後用超純水洗1分鐘。 用在365_具有丨5mW/cm2的強度之”光來照射經顯影 的圖案34秒，在12〇t進行中間供烤3分鐘然後在⑽ 。㈤共箱中加熱60分鐘以使硬化，藉以得到一種圖案薄膜。 。耐熱性—刮擦最終圖案薄膜，及使用TGA來測量 重里知失溫度。當5wt%的重量損失溫度為3⑽。匸或 。/*Γ平估耐熱性為優異，當5wt%的重量損失溫度為28〇 ^或更鬲時，評估為良好，當5wt%的重量損失溫度為250 C或更高時，士半ώ 寸估為尚可’而且當5wt%的重量損失溫度低 於250°C時，評估為差。 一 (b)硬声 _ *. X〜在玻璃上形成塗膜，及依照ADTMD3363來 測量其表面的鉛筆硬度。 21 200916969 (C )透光率一在如（a )的耐熱性之測量中的預烘烤過程 後’具有3μπι的厚度之塗膜的可見光吸收光譜。在4〇〇⑽ 的光之透光率為98%或更高係評估為優異，在94%或更高但 低於98Χ係孑估為良好，在92%或更高但低於94%係評估為 尚可’而且低於92%係評估為差。 (d)黏著性—使Μ〇/Α1/ΙΤ〇基板之最終硬化的塗膜接 又使用3Μ膠▼的膠黏試驗。將塗膜切成具有指定大小的1 〇〇 单元，之後以3Μ膠帶來黏貼，然後徐徐地分離。當每1〇〇 單元中的殘留單元數目為95或更多時，評估為優異，當殘 留單元數目為9〇或更多時，評估為良好，當殘留單元數目 為80或更夕評估為尚可，而且當殘留單元數目少於 時，評估為差。 )平f生 於玻璃上形成塗膜，而且使用厚度計來 &amp;其約⑽點的各厚度。厚度差異小於酬評估平坦性 :、、'優-厚度差異小於2%則評估平坦性為良好，厚度差里 小於3%則評估平妇性Α Λ π 广— &quot; 性為尚可，厚度差異為3%或更大則評估 平垣性為差。，-Γ + ,θ Η 可禮認分散穩定性及使用球磨機所獲 侍的丙稀酸共聚物與金屬化合物分散體之間的金屬化合物 之沈澱。 ⑴”電系數一測量電容器的電容，及藉由以下方程式 7疋$此目的，以指定的厚度來形成介電膜，及使用 阻抗分析器來測量1〇 ^ ^ ^ ，、包公，而且由以下方程式來計算介電 吊數。 22 200916969 c :中，“系電容’。係真空介電常數，心係介電膜的比介電 常數，/係有效面積，而且J係介電膜的厚产 表1The developer contains an alkaline aqueous solution 'I sodium oxysulfide, potassium hydroxide "sodium carbonate, etc.:" I · an inorganic base such as - 'primary amine, such as n-propylamine sate ~ grade 'such as diethylamine, n-propylamine and other amine temples , 二乙美脸,-审i-, and amines, such as tridecylamine 'methyl G-amine, - mercaptoethylamine, triacetin, alcohol amines, such as dimercaptoethyl 16 200916969 alcohol Amine methyl-ethanolamine, triethanolamine, etc.; and four-stage salt, such as hydrogenoxymethylammonium, hydroquinone tetraethylammonium, and the like. The developer is used by dissolving the basic compound in a concentration of 0.1 to 10 parts by weight, and a specified amount of an aqueous organic solvent such as methanol or ethanol, and a surfactant may be added. After the development process using the above developer, ultra-pure water was used for the cleaning of 30 90 #, so that the unnecessary portion was removed and then dried, so that the pattern was raised to v. The uv light is used to illuminate the pattern, and then a heater such as nine is used, and the phase is heated at 150 to 25 (TC is heated for 30 to 90 minutes to obtain a final pattern. The organic-inorganic hybrid insulating film of the invention exhibits a low dielectric constant. And excellent moisture resistance, adhesion, heat resistance, insulation, flatness and chemical resistance, so it is suitable as a material for forming an image of an LCD, and exhibits low display after forming an organic-inorganic hybrid passivation insulating film of an LCD. It is suitable for use as a purified insulating film because of its dielectric constant and excellent resistance to (4), adhesion and heat resistance. Furthermore, the organic-inorganic hybrid insulating film can be used as a photoresist resin for overcoat layers, and for a color-reducing matrix. The photoresist of the photoresist, the photoresist for the spacer, and the photoresist for the color calender, thereby achieving high heat resistance, adhesion, etc. The present invention can be better understood by the following examples. These examples are intended to illustrate and not to limit the invention. Example 1: Formation of an inorganic sol in a colloidal inorganic material having an acidic range in which the pH has been adjusted to 3 to 5, and adding 1 to 120 parts by weight Base a decyloxydecane (MTMS) or a vinyl trimethoxy decane (VTMS) which is an organodecane diluted with ethanol to react the surface of the organic decane with the inorganic nanoparticles to remove water, and then 17 200916969 to add an organic solvent Therefore, the reaction medium becomes hydrophobic. And the 'one color' mode of the degree of hydrophobicity of the surface controlling the inorganic material is such that when the methoxy group of the MTMS reacts with the surface of the colloidal inorganic particles, the methyl group is exposed thereto. The surface 'thus converts the colloidal inorganic material into a form that can be dispersed in the organic tree. In addition, the function of v is when the H-group of the methoxy group of the ship and the hydrophobic colloidal inorganic material are condensed. 'The vinyl group becomes exposed, so the hydrophobic colloidal inorganic particles can form a colloidal inorganic sol having a vinyl group or other reactive groups. Example 2: Preparation of an acrylic copolymer in a flask equipped with a cooling tube and a stirrer 10 parts by weight of 2'2 azo (2,4-didecyl valeronitrile), 2 parts by weight of propylene glycol monoterpene acetaminophen, 20 parts by weight of methacrylic acid, 35 parts by weight a portion of methacrylic acid glycidol vinegar, 15 parts by weight of decyl decyl acrylate, and 30 parts by weight of styrene, rinsed with nitrogen, and then slowly stirred. The reaction solution was heated to 62 C ' and then maintained at this temperature. 5 hours, thus preparing a polymer solution containing a copolymer of acrylic acid. The prepared acrylic copolymer was added dropwise to 5,000 parts by weight of a house, precipitated, filtered, separated, and added in an amount of 200 parts by weight. The propionic acid vinegar' was then heated to 30 ° C, thus obtaining a final polymer ❶ weight average molecular weight of 45 parts by weight solids content and a weight average molecular weight of 11,000 using GPC in terms of polystyrene.Example 3: Preparation of organic-inorganic hybrid photosensitive resin composition 1 part by weight of a polymer solution containing an acrylic copolymer, 15 parts by weight of Irgacure 819 as a photoinitiator, 40 parts by weight as a poly 18 200916969 functional monomer Dipentaerythritol hexaacrylate and 1 part by weight of trimethylolpropane triacrylate, 1 part by weight of 2_(3,4-epoxycyclohexyl)B as a lanthanide compound M 2 parts by weight of trimethoxysilane-based interfacial active when the cutting agent F171. Then, in this mixture, diethylene glycol didecyl ether was added in an amount such that the solid content became 35 parts by weight' to dissolve the mixture. The obtained acrylic copolymer and the inorganic sol of Example 混合 were mixed at a weight ratio of 95:5. The obtained organic-inorganic hybrid photosensitive resin composition was filtered using a 0.2-inch microporous filter to remove impurities f, and the filtered pure resin composition had a viscosity of #15 cps. 5微米。 The thickness is set to 0. 5~5. Ομιη Depending on the coating rate. Example 4: Preparation of organic-inorganic hybrid photosensitive resin composition An acrylic copolymer was prepared as in Example 2, and an inorganic sol was prepared as in Example. The acrylic copolymer and the inorganic sol were mixed at a weight ratio of 8 Å:2 Torr, and SUb obtained an organic-inorganic hybrid photosensitive resin composition. A microporous filter called 0.2 was used to filter the organic-inorganic hybrid photosensitive resin composition to remove impurities' and the filtered photosensitive resin composition had a viscosity of 15 cps. If it is used to form a film, the thickness is set to 0.5 to 5.0 μm, depending on the coating rate. Example 5: Preparation of organic-inorganic hybrid photosensitive resin composition An acrylic copolymer was prepared as in Example 2, and an inorganic sol was prepared as in Example 1. The acrylic copolymer and the inorganic sol were mixed at a weight ratio of 6 Å: 4 Å. Thus, an organic-inorganic hybrid photosensitive resin composition was obtained. The organic-inorganic hybrid photosensitive property was filtered using a microporous filter of 0.2 μm. 19 200916969 Resin composition was used to remove impurities, and the filtered photosensitive resin composition had a viscosity of 15 cPS. If it is used to form a film, the thickness is set to 0.5 to 5.0 μm, depending on the coating rate. Shell target Example 6. Preparation of organic-inorganic hybrid photosensitive resin composition An acrylic copolymer was prepared as in Shell 2, and an inorganic sol was prepared as in Example 1. The acrylic copolymer and the inorganic sol were mixed at a weight ratio of 4 Å: 6 Å. Thus, an organic-inorganic hybrid photosensitive resin composition was obtained. The organic-inorganic hybrid photosensitive resin composition was filtered using a 0.2 μm microporous filter to remove impurities, and the transitional green-sensitive resin composition had a viscosity of 15 cps. If it is used to form a film, the thickness is set to 0.5 to 5.0 μm, depending on the coating rate. Example 7: Preparation of organic-inorganic hybrid photosensitive resin composition An acrylic copolymer was prepared as in Example 2, and an inorganic sol was prepared as in Example. The acrylic acid copolymer and the inorganic sol are mixed in a weight ratio, whereby an organic-inorganic hybrid photosensitive resin composition is obtained. The organic-inorganic hybrid photosensitive resin composition was filtered using a 0.20-microporous filter to remove impurities, and the filtered photosensitive resin composition had a viscosity of 15 cps. If it is used to form a thin crucible, the thickness is set to 〇_5 to 5·0 μm, depending on the coating rate. Example 8: Preparation of organic-inorganic hybrid photosensitive resin composition An acrylic copolymer was prepared as in Example 2, and an inorganic sol was prepared as in Example 1. The acrylic copolymer and the inorganic sol were mixed at a weight ratio of 1 〇:9 Torr, thereby obtaining an organic-inorganic hybrid photosensitive resin composition. The microporous filter of 0.2 μm was used to filter the organic-inorganic hybrid photosensitive 20 200916969 resin composition to remove impurities, and the filtered photosensitive resin composition had a viscosity of 15 cps. If it is used to form a film, the thickness is set to 0. 5 to 5. 0 μπι, depending on the coating rate. A coating solution of each of the organic-inorganic hybrid photosensitive resin compounds of Examples 3 to 8 was applied, and its properties were evaluated by the following methods. The results are shown in Table 1 below. ‘ On each of the photosensitive resin composition solutions of Examples 3 to 8, the solution of each of the photosensitive resin compositions of Examples 3 to 8 was applied by a spin coater, and then prebaked on a hot plate at 9 Torr for 2 minutes, thereby forming a film. The film was covered with a designated pattern mask, and then irradiated with ϋ 光 light having a intensity of 15 mw/cm 2 at 365 nm for 6 seconds. Thereafter, the film was developed on the muscle with an aqueous solution of 38 parts by weight of tetramethylammonium hydroxide for 2 minutes and then washed with ultrapure water for 1 minute. The developed pattern was irradiated with light of 365_ intensity of m5 mW/cm2 for 34 seconds, intermediate for baking for 3 minutes at 12 〇t, and then heated at (10) in (5) for 60 minutes in a common box to harden, thereby obtaining A pattern film. Heat resistance—scratch the final pattern film and use TGA to measure the weight loss. When the weight loss temperature of 5 wt% is 3 (10), 匸 or ./*Γ is estimated to be excellent in heat resistance, when 5 wt% When the weight loss temperature is 28 〇 ^ or more, it is evaluated as good. When the weight loss temperature of 5 wt% is 250 C or higher, the half-size is estimated to be acceptable and the temperature loss is low when 5 wt% The evaluation was poor at 250 ° C. One (b) hard sound _ *. X ~ formed a coating film on the glass, and measured the pencil hardness of the surface according to ADTMD 3363. 21 200916969 (C) light transmittance is as (a) a visible light absorption spectrum of a coating film having a thickness of 3 μm after the prebaking process in the measurement of heat resistance. The light transmittance of light at 4 〇〇 (10) was evaluated as 98% or higher, and was evaluated as excellent. At 94% or higher but below 98, the system is estimated to be good, and at 92% or higher but below 94% is evaluated as Can be 'lower than 92% is evaluated as poor. (d) Adhesiveness - The final hardened coating of the Μ〇/Α1/ΙΤ〇 substrate is bonded and the adhesive test of 3 Μ glue ▼ is used. The coating film is cut into Specify a size of 1 〇〇 unit, then paste with 3 Μ tape, and then slowly separate. When the number of residual units in each unit is 95 or more, it is evaluated as excellent, when the number of residual units is 9 〇 or More often, it was evaluated as good, when the number of residual units was 80 or more, it was evaluated as acceptable, and when the number of residual units was less than, it was evaluated as poor.) Flat f was born on glass to form a coating film, and a thickness gauge was used. The thickness of each of the points (10) is less than the thickness of the evaluation. The thickness difference is less than the evaluation flatness: , 'the superior-thickness difference is less than 2% to evaluate the flatness is good, and the thickness difference is less than 3% to evaluate the flatness Α Λ π广—&quot; Sex is acceptable, the difference in thickness is 3% or greater, and the flatness is evaluated as poor., -Γ + , θ Η can be used to recognize the dispersion stability and the acrylic copolymer obtained by using a ball mill. Precipitation of a metal compound between metal compound dispersions. (1) "Electrical system Measuring the capacitance of the capacitor, and forming a dielectric film with a specified thickness by the following equation 7 , $, and using an impedance analyzer to measure 1 〇 ^ ^ ^ , 包 公, and calculated by the following equation The number of electric cranes. 22 200916969 c : Medium, “capacitance” is the vacuum permittivity, the specific dielectric constant of the dielectric film, the effective area of the system, and the thick film of the J-based dielectric film.

如由表1可明知，其顯示如上述所製備的有機-無機混 成感光性樹脂組成物之性質’實施例3至8的樹脂組成物 表現高耐熱性及硬度、優異的平坦性及介電常數等級、以 及良好的透光率及黏著性。 特別地，經由穩定扯人p &amp; 穂疋地/tb合無機溶膠化合物，可確保感 光f生树月日的塗層平坦性及儲存穩定性。使用無機溶膠係產 生—種具有低介電常數的有機-無機混成感光性樹脂組成 物。 口此纟使用本發明的有機-無機混成感光性樹脂組成 物當作m—LCD的鈍化絕緣膜中，樣出現優異的耐熱 硬度平坦性及介電常數等級，以及良好的透光率及 黏著性。 23 200916969 如前述，本發明提供有機-無機混成感光性樹脂組成物 及含其硬化體的IX卜依照本發明，有機—無機混成感光性 樹脂組成物具有低介電常數、優異的耐熱性、絕緣性、平 坦性及耐化學性 '以及硬度’因此適用作為形纟lcd之影 像用的材料，而且在形成LCD的鈍化有機絕緣膜後係表現 高的硬度、耐熱性、適當的絕緣性及平坦性，因此適合充 當有機絕緣膜。再者，利用感光性樹脂組成物於罩面層用 的光阻樹脂、黑色矩陣用的光阻樹脂、柱狀間隔物用的光 阻樹脂、彩色濾光片用的光阻樹脂中，以便增進耐熱性、 硬度等。 雖然為了說明之目的’已經揭示本發明的較佳具體態 樣，惟熟習該項技術者將瞭解在不脫離如所附申請專利範 圍所揭示的本發明之範疇與精神内，可能有各種修飾、增 加及替代例。 24 200916969 【圖式簡單說明】 &amp; 〇 &lt; *»&gt; 【主要元件符號說明】 無0 25As is apparent from Table 1, the properties of the organic-inorganic hybrid photosensitive resin composition prepared as described above are exhibited. The resin compositions of Examples 3 to 8 exhibit high heat resistance and hardness, excellent flatness, and dielectric constant. Grade, and good light transmittance and adhesion. In particular, by stabilizing the p &amp; 穂疋 / / tb combined with the inorganic sol compound, it is possible to ensure the coating flatness and storage stability of the sensitization. An organic-inorganic hybrid photosensitive resin composition having a low dielectric constant is produced using an inorganic sol system. The organic-inorganic hybrid photosensitive resin composition of the present invention is used as a passivation insulating film of an m-LCD, and excellent heat-resistant hardness flatness and dielectric constant grade, and good light transmittance and adhesion are obtained. . 23 200916969 As described above, the present invention provides an organic-inorganic hybrid photosensitive resin composition and a hardened body thereof. According to the present invention, the organic-inorganic hybrid photosensitive resin composition has a low dielectric constant, excellent heat resistance, and insulation. Properties, flatness, and chemical resistance 'and hardness' are therefore suitable as materials for imaging lcd, and exhibit high hardness, heat resistance, proper insulation and flatness after forming a passivated organic insulating film for LCD. Therefore, it is suitable as an organic insulating film. Further, a photosensitive resin composition is used for the photoresist resin for the overcoat layer, the photoresist resin for the black matrix, the photoresist resin for the column spacer, and the photoresist resin for the color filter, in order to enhance Heat resistance, hardness, etc. Although the preferred embodiment of the present invention has been disclosed for the purpose of illustration, it will be understood by those skilled in the art that various modifications may be made without departing from the scope and spirit of the invention as disclosed in the appended claims. Additions and alternatives. 24 200916969 [Simplified illustration] & 〇 &lt;*»&gt; [Main component symbol description] None 0 25

Claims (1)

200916969 十、申請專利範圍： 1. 一種有機-無機混成感光性樹脂組成物，包含： (a)膠態無機溶膠； ⑻丙埽酸共聚物，其係藉由共聚合⑴不飽和缓酸、 不飽和幾酸酐或其混合物與(⑴至少—種丙埽酸不徵和 化合物而獲得； (c) 光引發劑； (d) 具有乙婦性不飽和鍵的多官能單體； (e) 含有環氧基或胺基的矽系化合物；及 (f )溶劑。 2·如申請專利範圍帛！項之感光性樹脂組成物，其包含： (a)1〜95重量份的膠態無機溶膠，其係一種溶液，藉 由添加膠態無機奈米粒子與卜12〇重量份的有機石夕/ 以便無機奈米粒子表面係疏水性，由其去除水，及添加 有機溶劑而獲得’其中膠態無機奈米粒子係水分散的膠 態無機奈朱粒子，其包含至少—種選自於石夕石、氧化紹、 二氡化鈦、氡化錯 '氧化锡、氧化鋅、能與有機石夕烷反 應的無機材料、及經矽石所表面改質的該無機材料，而 且該有機矽烷係由下式1所表示： 式1 Rl〇-3Si(〇R2)t.4 ，其中R1係至少一種選自於烷基、笨基、氟碳烷基、丙 烯醯基、甲基丙烯醯基'烯丙.基'乙 &quot;至少-種選自於曱基、乙基、異丙基基基及 26 200916969 正丁基，及 OR2係烷氧基、醋酸酯基或肟基； (b) IOO重量份的丙烯酸共聚物，其係由共聚合（i)5〜 40重量份的不飽和羧酸 '不飽和羧酸酐或其混合物與 (i 1) 5〜9 5重量份的至少一種丙烯酸不飽和化合物而獲 得； (c) 0. 001〜30重量份的光引發劑； (d) 10〜100重量份的具有乙烯性不飽和鍵的多官能單 體； (e) 0. 0001〜5重量份的含有環氧基或胺基的矽系化合 物；及 (f )溶劑，其用量係使得感光性樹脂組成物的固體含量 成為10〜50重量份。 3.如申請專利耗圍第1項之感光性樹脂組成物，其中（匕）（i) 不飽和幾酸、不飽和缓酸針或其混合物係至少一種選自 由丙細酸、曱基丙知酸、馬來酸、富馬酸、檸康酸、仲 康酸、伊康酸及其不飽和二羧酸酐所組成族群者。 4 ·如申請專利範圍弟1項之感光性樹腊組成物，其中（b) (j i ) 丙烯酸不飽和化合物包括含環氧基的不飽和化合物，其 係至少一種選自由丙烯酸縮水甘油酯、f基丙烯酸縮水 甘油酯、cc -乙基丙稀酸縮水甘油酯、-正丙基丙稀酸縮 水甘油基酯、α-正丁基丙烯酸縮水甘油酯、丙稀酸β_〒 基縮水甘油酯、曱基丙烯酸β-曱基縮水甘油酯、丙稀酸 乙基縮水甘油酯、曱基丙烯酸β-乙基縮水甘油酿、丙烤 27 200916969 酸3, 4-環氡丁酯、曱基丙烯酸3, 4-環氧丁酯、丙烯酸6, 7-環氧庚酯、甲基丙烯酸6, 7-環氧庚酯、α-乙基丙烯酸6, 7-環氧庚基酯、鄰乙烯基苄基縮水甘油基醚、間乙烯基节 基縮水甘油基醚、及對乙烯基苄基縮水甘油基醚所組成 族群者。 5. 如申請專利範圍第1項之感光性樹脂組成物，其中用於 製備（b)丙烯酸共聚物的（b)(ii)丙烯酸不飽和化合物更 包括10〜70重量份的烯烴不飽和化合物，其係至少一種 選自由甲基丙烯酸曱酯、曱基丙烯酸乙酯、曱基丙烯酸 正丁酯、甲基丙烯酸第二丁酯、甲基丙烯酸第三丁酯、 丙烯酸曱酯、丙烯酸異丙酯、曱基丙烯酸環己酯、曱基 丙烯酸2-甲基環己酯、丙烯酸二環戊烯酯、丙烯酸二環 戊S曰、甲基丙烯酸二環戊烯酯、甲基丙烯酸二環戊酯、 丙稀酸1-金剛烧醋、甲基丙烯酸卜金剛烷酯、甲基丙烯 酸二環戊氧基乙酯、曱基丙烯酸異冰片酯、丙烯酸環己 酯、丙烯酸2-曱基環己酯、丙烯酸二環戊氧基乙酯、丙 烯酸異冰片酯、曱基丙烯酸苯酯、丙烯酸苯酯、丙烯酸 苄S曰、甲基丙烯酸2-羥乙酯、苯乙烯、鄰曱基苯乙烯、 間甲基笨乙稀、董子曱基笨乙稀、乙稀基曱苯、對曱氧基 苯乙烯I 丁二烯、異戊二烯、及2, 3-二曱基-1,3-丁二烯所組成族群者。 6. 如申明專利範圍$ [項之感光性樹脂組成物，纟中⑻丙 烤酸共聚物具有範圍為6, 〇〇〇至90,000的重量平均分子 量，其係以聚笨乙烯來換算。 28 200916969 7. 如申請專利範圍第1項之感光性樹脂組成物，其中（c)光 引發劑係至少一種選自由Irgacure 369、Irgacure 651、 Irgacure 907、Darocur ΤΡ0、Irgacure 819、2, 4-雙三 氣曱基-6-對甲氧基苯乙烯基-s_三井、2 —對甲氧基笨乙 烯基-4, 6-雙三氣曱基_s —三井、2,4—三氣甲基—6_三井、 2, 4-三氣甲基—4_甲基萘基—三井、二苯甲酮、對（二乙 基胺基）二苯甲酮、2, 2-二氣—4-苯氧基苯乙酮、2, 2一二 乙氧基苯乙酮、2-十二基噻噸酮，2,4_二甲基噻噸酮， 2,4-二乙基噻噸酮、及2,2—雙—2_氯苯基—^卜四苯 基-2-1,2-雙咪唑所組成族群者。 8. 如申叫專利範圍第i項之感光性樹脂組成物，其中（㈦具 有乙烯性不飽和鍵的多官能單體係至少一種選自由1，4- 丁，醇二丙烯酸帛、u 3—丁二醇二丙烯㈣、[二醇二 丙烯酸S曰二羥甲基丙烷二丙烯酸酯、三羥甲基丙烷三 丙晞酸醋、季戊四醇三丙稀酸酷、季戊四醇四丙稀酸醋、 三乙二醇二丙稀酸s|、聚乙二醇：丙燁酸S旨 '二季戊四 醇六丙稀酸自旨、二季戊四醇三丙烯酸_、二季戊四醇二 丙烯酸S曰、山梨糖醇三丙烯酸酯、雙酚A二丙烯酸酯衍 生物、二季戊四醇聚丙歸酸酷、及其曱基丙稀酸酿所組 成族群者。 9·如申請專利範圍第 /u I上仃ί乃曰翅^欣奶，共甲（e)含 有衣乳基或胺基的矽系化合物係至少一種選自由(3—縮 水甘油氧基丙基）三甲氧基錢、（3-縮水甘油氧基丙基） 二乙氧基Μ、（3-縮水甘油氧基丙基）甲基二曱氧基石夕 29 200916969 烷、（3~縮水甘油氧基丙基）二甲基乙氧基矽烷、3, 4環 氧丁基三甲氧基矽烷、3, 4-環氧丁基三乙氧基矽烷、 2-(3,4-環氧環己基）乙基三甲氧基矽烷、2 —(3, 4_環氧環 己基）乙基二乙氧基矽烷、及胺基丙基三甲氧基矽烷所組 成族群者。 1 〇.如申請專利範圍第1項之感光性樹脂組成物，其更包含 至少-種選自由熱聚合抑制劑、消泡劑及顏料所組成族 群者。 1 1 .種液晶顯示器，包括如申請專利範圍第i至丨〇項中 任一項之感光性樹脂組成物的硬化體，其包含經矽烷改 質的無機奈米粒子且係用於絕緣膜。 30 200916969 七、指定代表圖： (一） 本案指定代表圖為：第（ ）圖。 (二) 本代表圖之元件符號簡單說明： 無。 八、本案若有化學式時，請揭示最能顯示發明特徵的化學式：200916969 X. Patent application scope: 1. An organic-inorganic hybrid photosensitive resin composition comprising: (a) a colloidal inorganic sol; (8) a propionate copolymer which is copolymerized by (1) unsaturated acid, not a saturated anhydride or a mixture thereof and ((1) at least one type of propionate is not obtained by a compound; (c) a photoinitiator; (d) a polyfunctional monomer having an ethylavalent unsaturated bond; (e) a ring containing An oxime-based compound of the oxy or amine group; and (f) a solvent. The photosensitive resin composition of the invention, which comprises: (a) 1 to 95 parts by weight of a colloidal inorganic sol, A solution obtained by adding colloidal inorganic nanoparticles and a 12 parts by weight of organic stone to make the surface of the inorganic nanoparticles hydrophobic, removing water, and adding an organic solvent to obtain a colloidal inorganic The nano particles are water-dispersed colloidal inorganic Naizhu particles, which comprise at least one selected from the group consisting of Shi Xishi, Oxidation, Titanium Dioxide, Bismuth Oxide, Zinc Oxide, and Organic Levoxane Reactive inorganic materials and surface modification by vermiculite The inorganic material, and the organodecane is represented by the following formula 1: Formula 1 Rl〇-3Si(〇R2)t.4, wherein at least one of R1 is selected from the group consisting of alkyl, stupid, fluorocarbon alkyl, propylene Mercapto, methacryl fluorenyl 'allyl. 'B' and at least one selected from the group consisting of fluorenyl, ethyl, isopropyl and 26 200916969 n-butyl, and OR2 alkoxy, acetate (b) 100 parts by weight of an acrylic copolymer copolymerized by (i) 5 to 40 parts by weight of an unsaturated carboxylic acid 'unsaturated carboxylic anhydride or a mixture thereof and (i 1) 5 to 9 5 parts by weight of at least one acrylic acid unsaturated compound; (c) 0.001 to 30 parts by weight of a photoinitiator; (d) 10 to 100 parts by weight of a polyfunctional monomer having an ethylenically unsaturated bond; e) 0. 0001 to 5 parts by weight of an anthracene compound containing an epoxy group or an amine group; and (f) a solvent in an amount such that the solid content of the photosensitive resin composition is 10 to 50 parts by weight. Patent application for the photosensitive resin composition of item 1, wherein (匕) (i) an unsaturated acid, an unsaturated acid-fastening needle or a mixture thereof One less selected from the group consisting of propionic acid, mercaptopropionic acid, maleic acid, fumaric acid, citraconic acid, seccoic acid, itaconic acid and its unsaturated dicarboxylic anhydride. The photosensitive wax composition of the first aspect, wherein (b) (ji) the acrylic unsaturated compound comprises an epoxy group-containing unsaturated compound, at least one selected from the group consisting of glycidyl acrylate and glycidyl acrylate. , cc-glycidyl ethyl acrylate, glycidyl-n-propyl acrylate, glycidyl α-n-butyl acrylate, β-mercapto glycidyl acrylate, β-fluorenyl methacrylate Glycidyl glyceride, ethyl glycidyl acrylate, β-ethyl glycidyl thioglycolate, propylene bake 27 200916969 3, 4-cyclobutyl phthalate, 3, 4-epoxybutyl methacrylate 6,7-epoxyheptyl acrylate, 6,7-epoxyheptyl methacrylate, 6,7-epoxyheptyl α-ethyl acrylate, o-vinylbenzyl glycidyl ether, methylene A group consisting of a benzyl glycidyl ether and a p-vinylbenzyl glycidyl ether. 5. The photosensitive resin composition of claim 1, wherein (b) (ii) the acrylic unsaturated compound used for preparing the (b) acrylic copolymer further comprises 10 to 70 parts by weight of an olefin unsaturated compound, At least one selected from the group consisting of decyl methacrylate, ethyl methacrylate, n-butyl methacrylate, second butyl methacrylate, tert-butyl methacrylate, decyl acrylate, isopropyl acrylate, Cyclohexyl methacrylate, 2-methylcyclohexyl methacrylate, dicyclopentenyl acrylate, dicyclopentanyl acrylate, dicyclopentenyl methacrylate, dicyclopentyl methacrylate, C Dilute acid 1-male vinegar, butyl amantaolate methacrylate, dicyclopentyloxy methacrylate, isobornyl methacrylate, cyclohexyl acrylate, 2-mercaptocyclohexyl acrylate, acrylic acid Cyclopentyloxyethyl ester, isobornyl acrylate, phenyl methacrylate, phenyl acrylate, benzyl sulfonium acrylate, 2-hydroxyethyl methacrylate, styrene, o-decyl styrene, m-methyl phenyl Rare, Dongzi 曱 base stupid ethylene, ethylene base Benzene, Yue acetoxystyrene I of butadiene, isoprene, and 2, 3-Yue-1,3-butadiene the group consisting of those. 6. For the purpose of claiming the patent range of [the photosensitive resin composition, the bismuth (8) acrylic acid copolymer has a weight average molecular weight ranging from 6, 〇〇〇 to 90,000, which is converted in terms of polystyrene. 28. The photosensitive resin composition of claim 1, wherein (c) the photoinitiator is at least one selected from the group consisting of Irgacure 369, Irgacure 651, Irgacure 907, Darocur ΤΡ0, Irgacure 819, 2, 4-double Triseocarbyl-6-p-methoxystyryl-s_Mitsui, 2-p-methoxy stupid vinyl-4,6-bistrimethyl sulfhydryl-s-Mitsui, 2,4-three gas基-6_三井, 2, 4-trimethylmethyl-4-ylnaphthyl-Mituto, benzophenone, p-(diethylamino)benzophenone, 2, 2-diox-4 -phenoxyacetophenone, 2,2-diethoxyacetophenone, 2-dodecylthioxanthone, 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone And 2,2-bis-2-chlorophenyl-^-tetraphenyl-2-1,2-bisimidazole group. 8. The photosensitive resin composition of claim i, wherein ((7) at least one of a polyfunctional single system having an ethylenically unsaturated bond is selected from the group consisting of 1,4-butene, anthracene acrylate, u 3 - Butanediol dipropylene (tetra), [diol diacrylate S曰 dimethylolpropane diacrylate, trimethylolpropane tripropylene vinegar, pentaerythritol tripropylene acid, pentaerythritol tetrapropyl vinegar, triethyl Glycol diacrylic acid s|, polyethylene glycol: propionic acid S is intended to be 'dipentaerythritol hexapropanoic acid, dipentaerythritol triacrylate _, dipentaerythritol diacrylic acid S hydrazine, sorbitol triacrylate, double A group consisting of phenol A diacrylate derivatives, dipentaerythritol polyacrylic acid, and its thiol acrylic acid brewing. 9·If the patent application scope is /u I, 曰ί曰曰翅^欣奶,共甲(e) at least one selected from the group consisting of (3-glycidoxypropyl) trimethoxy ketone, (3-glycidoxypropyl) diethoxy fluorene, (3-glycidoxypropyl)methyldimethoxylate eve 29 200916969 alkane, (3~ glycidoxypropyl) dimethyl ethoxy decane, 3, 4 epoxybutyl trimethoxy decane, 3, 4-epoxybutyl triethoxy decane, 2-(3, 4 - epoxycyclohexyl)ethyltrimethoxydecane, 2-(3,4-epoxycyclohexyl)ethyldiethoxydecane, and aminopropyltrimethoxydecane. 1 〇. The photosensitive resin composition of claim 1, further comprising at least one selected from the group consisting of a thermal polymerization inhibitor, an antifoaming agent, and a pigment. 1 1. A liquid crystal display comprising, as claimed in the patent application. A hardened body of a photosensitive resin composition according to any one of the items 1 to 3, which comprises a decane-modified inorganic nanoparticle and is used for an insulating film. 30 200916969 VII. Designation of representative drawings: (1) Designation of the case The representative picture is: ( ) Figure ( )) The symbol of the symbol of this representative figure is simple: No. 8. If there is a chemical formula in this case, please reveal the chemical formula that best shows the characteristics of the invention:
TW097126860A 2007-07-16 2008-07-16 Organic-inorganic hybrid photosensitive resin composition and liquid crystal display comprising cured body thereof TWI392909B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070071201A KR100911889B1 (en) 2007-07-16 2007-07-16 Photosensitive resin composition with organic~inorganic hybrid and liquid display devices using

Publications (2)

Publication Number Publication Date
TW200916969A true TW200916969A (en) 2009-04-16
TWI392909B TWI392909B (en) 2013-04-11

Family

ID=40268699

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097126860A TWI392909B (en) 2007-07-16 2008-07-16 Organic-inorganic hybrid photosensitive resin composition and liquid crystal display comprising cured body thereof

Country Status (4)

Country Link
JP (1) JP4961400B2 (en)
KR (1) KR100911889B1 (en)
CN (1) CN101349867B (en)
TW (1) TWI392909B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI616722B (en) * 2013-04-10 2018-03-01 東進世美肯有限公司 Negative photosensitive organic-inorganic hybrid insulator

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101475780B1 (en) * 2008-02-13 2014-12-23 주식회사 동진쎄미켐 Organic-inorganic complex resin composition which is useful as a protecting layer
CN102031026B (en) * 2009-09-28 2012-12-12 复旦大学 Aqueous nano zirconia particle paint and method for preparing paint film thereof
JP5636839B2 (en) * 2010-09-16 2014-12-10 Jsr株式会社 Radiation-sensitive resin composition, interlayer insulating film, method for forming interlayer insulating film, and display element
CN103608726B (en) * 2011-06-08 2016-11-09 3M创新有限公司 Comprise the photoresist of the nano-particle of polymer mooring
CN102294851A (en) * 2011-07-06 2011-12-28 上海大学 Hydrophobic scratch-resistant coating on organic polymer surface and preparation method thereof
CN103034056A (en) * 2011-10-07 2013-04-10 住友化学株式会社 Colored photosensitive resin composition
CN102643600B (en) * 2012-04-18 2014-09-03 上海维凯化学品有限公司 Ultraviolet light curing coating composition
TWI477556B (en) * 2012-06-11 2015-03-21 Chi Mei Corp Curable resin composition, protective film and liquid crystal display device including the same
KR101329218B1 (en) * 2012-10-22 2013-11-13 (주)아이컴포넌트 A optical transparent composite film for the use of display and manufacturing method thereof
WO2015033880A1 (en) * 2013-09-04 2015-03-12 富士フイルム株式会社 Resin composition, method for producing cured film, cured film, liquid crystal display device and organic el display device
JP6713320B2 (en) 2016-03-31 2020-06-24 日揮触媒化成株式会社 Surface-treated metal oxide sol
CN114397797A (en) * 2022-01-11 2022-04-26 上海玟昕科技有限公司 Negative photoresist composition containing nano particles

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4142735A1 (en) * 1991-12-21 1993-06-24 Hoechst Ag POLYMERIZABLE MIXTURE BY RADIATION AND METHOD FOR PRODUCING A SOLDER STOP MASK
KR100188181B1 (en) * 1996-12-20 1999-06-01 서영배 Photosensitive solder resist composition
JP4050370B2 (en) * 1998-01-07 2008-02-20 株式会社Ｋｒｉ Inorganic-containing photosensitive resin composition and inorganic pattern forming method
CN1274432A (en) * 1998-07-14 2000-11-22 伯韦尔科学公司 Photosensitive black matrix compsn. and process of haking it
JP4544519B2 (en) * 2004-09-10 2010-09-15 日本化薬株式会社 Photosensitive resin composition
US20060128853A1 (en) * 2004-12-13 2006-06-15 General Electric Company Compositions for articles comprising replicated microstructures
KR101068111B1 (en) 2005-01-27 2011-09-27 주식회사 동진쎄미켐 Photosensitive resin composition
KR101221450B1 (en) * 2005-07-19 2013-01-11 주식회사 동진쎄미켐 Photosensitive resin composition comprising organic and inorganic compound

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI616722B (en) * 2013-04-10 2018-03-01 東進世美肯有限公司 Negative photosensitive organic-inorganic hybrid insulator

Also Published As

Publication number Publication date
TWI392909B (en) 2013-04-11
CN101349867A (en) 2009-01-21
JP2009020520A (en) 2009-01-29
CN101349867B (en) 2012-01-25
KR100911889B1 (en) 2009-08-11
JP4961400B2 (en) 2012-06-27
KR20090007953A (en) 2009-01-21

Similar Documents

Publication Publication Date Title
TW200916969A (en) Organic-inorganic hybrid photosensitive resin composition and liquid crystal display comprising cured body thereof
JP6342998B2 (en) Spin-on compositions of soluble metal oxide carboxylates and methods for their use
CN102667625B (en) Positive type photosensitive organic compound, the cured film formed by said composition and there is the element of cured film
CN1900821B (en) Organic-inorganic composite photosensitive resin composition
TWI467247B (en) A method for forming a hardening resin composition, a protective film and a protective film
WO2004042474A1 (en) Negative type photosensitive resin composition
TW200428167A (en) Photosensitive resin composition and cured coating film
TW201127891A (en) Composite resin composition
TW201013316A (en) Negative working photosensitive composition, partition wall for optical element using the nagative working photosensitive composition, and optical element comprising the partition wall
TW201028794A (en) Positive photosensitive organic-inorganic hybrid insulator
JP2018184611A (en) Highly heat resistant polysilsesquioxane-based photosensitive resin composition
WO2016076205A1 (en) Radiation sensitive resin composition, cured film for display elements, method for forming cured film for display elements, and display element
TW200946597A (en) Organic-inorganic complex resin composition adapted for protection layer
JP2008532074A (en) Positive photoresist composition
WO2019065351A1 (en) Photosensitive resin composition, cured film, element comprising cured film, organic el display device comprising cured film, method for producing cured film, and method for producing organic el display device
JP6665528B2 (en) Radiation-sensitive resin composition, cured film, method for forming the same, and display element
JP5514566B2 (en) Photosensitive resin composition
KR101427445B1 (en) Photosensitive resin composition for organic insulator
CN105778726A (en) Coating composition and application thereof and substrate including film layer formed by coating composition
WO2022014684A1 (en) Polycyclic polyphenol resin, composition, method for producing polycyclic polyphenol resin, composition for forming film, resist composition, method for forming resist pattern, radiation-sensitive composition, composition for forming under layer film for lithography, method for producing under layer film for lithography, method for forming circuit pattern, and composition for forming optical member
JP7324408B2 (en) Composition for forming resist underlayer film, underlayer film for lithography, and pattern forming method
TWI479262B (en) Photosensitive resin composition which is capable of being cured at a low temperature
KR19990036936A (en) Manufacturing method of thermoplastic resin cured film
TWI396941B (en) Photosensitive resin composite
TW201610568A (en) Photocrosslinkable resin composition, insulation film formed therefrom, and OLED using the film

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees