TW200910490A - Bonding device and bonding method - Google Patents

Abstract

When wire bonding is performed using a copper wire, formation of a ball is performed in an inert gas atmosphere (S10, 12), a copper ball touches a bonding object at the first height of a capillary, the copper ball has a predetermined flat shape at the second height of a capillary, the capillary lowers toward the bonding object, application of ultrasonic energy is started before the capillary reaches the first height and ended before the capillary reaches the second height after reaching the first height. From a predetermined time before or after reaching the first height, the output level of ultrasonic energy can be lowered depending on thebonding characteristics of the bonding object (S16, 18, 20, 22, 24).

Description

200910490 IX. Description of the Invention: [Technical Field] The present invention relates to a bonding device and a bonding tool lead wire which are held and which are held by a bonding tool for the drop of the load and the supersonic... The joining device and the joining side of the joining work: '. [Prior Art] The J-line device is a device in which a first bonding point of a semiconductor die temple such as LSI is bonded to a semi-conductive scorpion 2 by a thin metal wire, and a sub-metal and a metal bow are connected. 'There is the use of the inserted metal bow 丨人二 for the joint end tool plus the appropriate load and the appropriate ultrasonic energy ^ if ^ the appropriate twist on the joint line. In addition, if it is connected, it will be hidden, and the tool will be connected to 0. It is also used to move the metal lead from the first access interface point. Therefore: the application of negative m, heating temperature and ultrasonic energy 3 appropriate control and the full genus 曰U application conditions, can make the joint state between the end /, Meng Gong bow line is appropriate. The illusion, in the patent literature, reveals that: in the human ball docking person, the amount of 4 A ± the mouth of the mouth is the end of the J 丨 J: when the 塾 is hit, the deformation of the ball is monitored by the drop of the capillary (4) Zhe Ultrasonic vibration The point at which the profit begins and the time of application. Also known as: is a fixed condition. Here, it is explained as follows: after the pressure is pressed, the height of the crying is H〇'. The ultrasonic vibration is started from the time t0: the person descends to the high 纟H1 due to the compression deformation of the ball, and starts to drop from the time t1: The ball is broken and fixed to cause vibration, and the ball is further deformed by, for example, a number of Am, which becomes a height H2 corresponding to a predetermined amount of deformation. When the specified amount of deformation is reached in 200910490, the ultrasonic vibrator is stopped and the ultrasonic oscillation is stopped. As described above, the joint area can be accurately managed by changing the amount of deformation of the joint portion by making the ultrasonic wave application time or the dust tight load change 'the wire diameter of the joint lead is not affected'. (Patent Document 1) pp. 297741 [Patent Document] In the patent document, the application of ultrasonic waves is started from the height corresponding to the diameter of the ball, that is, after the ball contacts the object to be joined, and the ball is changed. (4) Stop the application of ultrasonic waves when the height of the shape is established. By doing so, the wire diameter of the + tube lead can be managed by making the deformation height of the ball 'the joint area of the ball the same. However, in recent years, the demand for the line has been controlled by the above-mentioned ones. For example, in the insulating layer of a semiconductor die, a low dielectric material called a L〇w-k material is used. The mechanical strength of this material is lower than that of the oxide film or the nitride film which was previously used as the insulating layer, and if the ultrasonic energy is excessively applied, there is a possibility that the bonded object is damaged. Further, although the metal lead used for bonding has been using a gold lead, the copper lead has been reviewed to reduce the cost. Although the copper lead has a high electrical conductivity, it has a larger current capacity than the gold wire of the phase line, and is relatively low in gold, but on the other hand, it is easy to emulsify and has a strong degree of work hardening. Therefore, if the copper wire is bonded by the method of the tenth, the oxidized copper wire is pressed by the bonding tool and hardened, hardened and not easily deformed, and a metal layer of the terminal to be joined, for example, aluminum is laminated. Width, or a part of the layer to break through the current 200910490 image ° These phenomena are sometimes referred to as the 撇, 聃 化 化 、, or splash, or welding (c ^ er). As described above, when the copper wire is joined, if the ultrasonic energy is continuously applied, the bonding target may be damaged. Therefore, even if the ultrasonic wave is applied from the contact of the α-object with the ball in the improved method of the patent document, the ultrasonic wave is continuously applied until the predetermined deformation south degree is reached, which is the possibility of a joint object having a low mechanical strength. Or, in the case of a work-hardening lead such as a copper lead, there is a possibility that the bonded object is damaged. The purpose of the present invention is to provide a method for suppressing damage to the bonded object. The bonding apparatus of the present invention is characterized by comprising: a bonding tool, a plug=holding wire; a load applying means for applying a predetermined sound position t ultrasonic wave applying means to the bonding tool, and applying ultrasonic energy to the bonding tool; The detecting means detects the height position of the bonding tool to the bonding object, that is, the position of the degree; and the computer, the falling control of the bonding tool, and the cooperation object 2 are provided: the tool height position becomes the bow|the front end of the wire contacts the bonding: the height of the brother 1 The hand that starts to supply the ultrasonic energy to the bonding tool and the height position where the lead wire is a predetermined flat shape is the second super: the I chopping at any height position between the first height and the second height The means by which the stop position allows the ultrasonic wave to stop. In the case of the bonding device of the present invention, it is a case where the computer is connected to the first joint by the bonding machine, and is fed in a meandering manner and further joined to the second joining point. , the third height of the joint of the front end of the bow I line contacting the second joint, 200910490. 2: means for supplying ultrasonic energy to the bonding tool; and forming the arc from the first connection; The tool height position degree in the curvature state is a means for setting the ultrasonic wave stop position at the super-day wave stop position set at an arbitrary height between the third height and the fourth height. Further, in the joint device of the present invention, the position of the lightness reaches the first position. "Small spit is preferably "includes: is the tool high? The first moment of the ancient danger j von, the time when the tool height reached 苐2 Adu was the second time / and set in the "the temple before and after the temple's joint characteristics of the mouth & ls / at the second moment At any time before, the means for reducing the output of the super-shell from the corresponding time passes. The joint device of Benming Ming, the position of the higher reaches the third Μ is electric & has the tool height 4th... The time is the third At the moment, the moment when the height of the tool reaches the 4th degree of the brother is the 4th time ^ is set at the 3rd; the joint characteristic of the 丨 ^ ^ ^ 对象 . . . . . . . . . . . . . . . . . . . . . . . . . . At the moment, the means for reducing the output of the super-wave moon from the corresponding time passes is too high. 'The joint step of the present invention ^ includes the following three means to I h / is the height position detection means i means: means for detecting the amount of movement in the direction of the eight directions; or, °, the means of contact with the load, or / and the arm, the means of detecting the current of the bonding tool. "'! Lead and bonding When the object is in contact with the flow, the joint device of the present invention is lowered in position to The load U. To reduce high tool means. At the time of load reduction, the copper lead of the bonding apparatus of the present invention. ", the lead wire is mainly composed of copper 200910490. Further, the joint device of the present invention preferably has a means of inserting a yellow green A;

With the 梏 e e “j-end illusion to form the shape of the ball · and Q retention means, in the ball formation mechanism (10) front shape, and the nuclear joint work 亘 円 円 円 扯 为 球 球 球 , , , , # Maintained in a gaseous environment that inhibits the oxidation of copper. The hand-and-joining method of the present invention is a bonding tool that is inserted into the tool and applies a tight load and ultrasonic energy to the tool, and is characterized in that the bonding work is performed at the position of the f κ degree at the joint worker = down. The high-pitched sound station/,··································································· · And set in the first! The height and the second high 帛2 - degree, ^ The position of the position and the position of the singer and the stop position so that the ultrasonic wave can be stopped. The super-wave and the joining method of the present invention are preferably connected to the first receiver by a borrowing wire, and the cooker sends the lead in the second pick D' and sends the lead further: The case of the point of the point includes: at the height position of the tool, the step of supplying the ultrasonic energy to the bonding tool by the Si height of the third height of the bonding object contacting the bonding point of the second bonding point, and the lead wire from the gi The arc shape becomes a predetermined curvature shape: ...the joint point is sent 4 ^ ^ The height position of the tool in the state of the curved sheep is the fourth degree, and the ultrasonic stop position is set at the third height. In the case of "the position of position I, the ultrasonic energy can be stopped. The bonding method of the present invention is preferably white. l7 ii - from the set to the first! The height is at the time of the third :: 4 degrees ^ j At 1st time, the first time, when the height of the tool reaches the 2nd time, the second time is set, and the ultrasonic energy 200910490 is compliant with the corresponding time after the engraving of the joint characteristics of the joint object and at any time before the second time. The step of lowering the output wheel temple. Preferably, the joining method includes: a time when the height of the tool height is the third time, and a time when the height of the tool reaches the fourth south is the 4th main *丨^^ + , the time, and the joint object The joint characteristic is set before and after the third time, and the step of lowering the output contour of the ultrasonic wave from the arbitrary time before the employee's door & The joining method of the 'bright' preferably comprises: at the tool height level step. When the position is further increased, the load for reducing the load is lowered according to the above-mentioned composition φ # $ , or at least one of the joint devices, and the joint device is in the ancient translation position. Became the ball at the front end of the lead and put it in the ^^ degree open (four)w and the ball touches the first part of the joint object. [Before the height, σ ί connect the S tool to supply the super sound, ^ flat report strong + _ this ball with the lead end The 2nd H is the same as the 2nd degree, and can be stopped at the first height. The ultrasonic stop position of the V: degree position makes the ultrasonic supersonic wave ^, 'This prevents over-exertion of the joint object with low mechanical strength. Force / 〆月b χ, using copper lead The shape can prevent damage to the joint object due to the continued application of the ultrasonic wave. Further, the joint device is joined by the jointer and the first pick-up point/the ball of the twisted end. When Yule 1 is connected to δ point, the lead wire is arc-shaped 2 joint point, and the tool is taken out and the wire is joined to the joint object of the joint point; the vertical contact energy becomes the second ultrasonic wave energy 'The height position of the tool from the state of the quot 妾 五 五 接合 接合 为了 为了 为了 接合 接合 接合 接合 四 四 四 四 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合The stop position stops the ultrasonic energy 200910490. Therefore, the mechanical strength is low, and the use of the copper lead (4) can suppress the damage caused by the joint object, and the time at which the tool height position reaches the first work and the high yield of the flute 7 is the first time. At the time of the second time, the second time is set, and the time before and after the second time is set from the engagement characteristic of the engagement target, so that the ultrasonic wave can follow the time of the corresponding time, and the tool height position reaches the second round: the contour When the height of the tool reaches the 4th height, the moment is the moment... The time before the 3rd time is set at the time of the engagement characteristic of the object 攸 攸 日本 日本 日本 日本 日本 日本 日本 日本 日本 日本 日本 日本 日本 日本 日本 日本 日本 日本Obedience corresponding day (4) The output contour is reduced. That is, 'before and after the tip of the lead contacts the joint object', the contour of the supersonic == Qian Ding is lowered. In the prior art, only the supersonic water == in recent years The control technology 'has been able to output the ultrasonic energy to the factory. By using this technology to match the output level of the ultrasonic phase of the joint characteristic stage of the joint object, it is possible to carry out the suitable round here. The bonding characteristics of the bonding object are combined with the mechanical strength of the problem when the two-two bonding is performed. For example, the machine: Si: the bonding object of the structure, or the vibration of the wire, etc., which is likely to cause damage; In other cases, the degree of reduction of the ultrasonic energy can be reduced. In addition, the ultrasonic wave can be used from the contact of the ball or the lead at the front end of the lead: the reduction of the rounding level can make contact with the joint object. The impact is eve, and the fault is temporarily maintained by the ultrasonic wave after the contact of the lead wire. 200910490 Then the output is lowered, and the processing hard disk rotation can be reduced before the work hardening occurs, and the occurrence of the flying raft is suppressed. 'High-position detection, the detection of the joint, the joint workmanship, the height of the direction of the work, the detection of the load, the detection of the load, and the detection of the current flowing when the lead is connected to the person. The front end is in contact with the object to be joined. Therefore, it is possible to detect the lead (and the 'joining device, when the position is changed due to the drop in the height of the tool', the load is lowered, so that the negative can be prevented: Damage. The load is added by the loader, and the copper is used as the main component to inhibit the work hardening of the joint. The joint with the above-mentioned structure is good. The shell injury and the low-cost copper lead are used to solve the problem. The copper environment of the tool is set to __, so the formation of the copper ball can be suppressed. =: The holding is to suppress the copper oxidative bonding characteristics. The emulsification at the time of the copper lead is improved. [Embodiment] The following is a detailed description of the use of the drawings. The wire is made of a copper wire, and the second wire is applied to the fourth wire. The following is an example of the wire connection between the wire ends of the die with the second joint. This example is merely illustrative of V. (4) The die can replace the circuit substrate with a semi-conductor: a wire frame, etc. Further, the individual die cut out for dividing the V-shaped V-body wafer can also be 12 200910490

...nip aize rackage) and other joints and second joints # Small electronic parts. σ 可 可 系 系 系 系 系 叠层 叠层 叠层 叠层 叠层 叠层 叠层 叠层 叠层 叠层 叠层 叠层 叠层 叠层 叠层 叠层 叠层 叠层 叠层 叠层 叠层 叠层 叠层 叠层 叠层 叠层 叠层 叠层 叠层 叠层 叠层 叠层 叠层 叠层 叠层 叠层 叠层 叠层 叠层 叠层 叠层 叠层The strength is called a dielectric material: a grain example: the insulating layer is used for the gold lead and the aluminum lead. The lead wire can be a / i shows the joint skirt i. The composition of the figure.打The wire bonding device for the bonding between the wires of the circuit board and the inter-parts is performed using a thin metal lead. Bonding device,..., pad of the die mechanism group! 2 with control group 50. These groups focus on the unillustrated = to distinguish into one joint device 1〇. For example, the E body can be placed inside the frame, and the upper part of the frame body can be accommodated in the upper part of the frame. Also, a thin metal lead is made of a copper lead 28. The mechanism group U includes a feeder π port 16 disposed on the stage 13, and a joint head 2 搭载 mounted on the XYs 16. The table 13 is disposed in the frame of the joint device 10 as described above. The upper part (4) is a member for the work surface of the joining work, and the component group 12 is disposed on the top of the stage 13. Further, the top of the stage U is parallel to the χγ plane shown in Fig. 1. 14. A mechanism for moving the bonding target to the position of the bonding position immediately below the capillary 26. Further, in Fig. 1, the non-engaged core structure is shown as a bonding target 8 and a circuit board on which the die is mounted is illustrated. In this type of feeder 14, it is possible to use a suitable substrate conveyor belt. In general, the same type of joint object 8 / car 乂 夕, The feeder 1 4 _ line ", in each shift (four) - the position of the joint work. The feeder ": the reference point of the second can be obtained. <action department party control group 50 control set in the feed crying〗, when the upper part of the upper part of the gas ring copper lead 28 to form the ball brother to 36 material in the refining and quenching array w > · ^ inch suppression copper lead The oxidation of 28, and the emulsification of the formation of the inert mt environment, between the hairs of the copper lead 28, for example, can be provided by enclosing the flowing inert gas, so that the wall portion of the wall is in the wall portion The gas environment / 36 Λ is the gas environment chamber 36. Iv ^ - 3^ -- The ritual supply unit 38 supplies inert gas and a reduced body. The gas supply body source and the appropriate regulators are used to adjust the machine configuration. The actuation of the gas supply unit 38 is controlled by the control group 5〇. Further, the inert gas, i., widely includes a gas which suppresses oxidation of the steel lead and the line 28, and for example, a narrow inert gas such as argon gas can be used in addition to nitrogen. Figure 2 is a diagram showing an example in which the hand is formed without forming a gaseous environment of the gas environment chamber 36. Hereinafter, the same elements as those of Fig. 1 will be described in detail using the same-paying number. Fig. 2(a) is a cross-sectional view taken along the gas environment forming means 4'', and Fig. 2(b) is a plan cross-sectional view. The gas atmosphere forming means 4B includes an inner wall portion 42 surrounding the capillary tube 26, a hollow portion 43 formed on the outer wall portion 44' outside the inner wall portion 42 by the inner wall portion 42 and the outer wall portion 44, and a plurality of gas nozzle outlets 45. The inner wall portion 42 is connected to the through hole of the hollow portion 43. 14 200910490 A gas supply port that connects the gas supply portion 38 and the hollow portion 43 is provided in the outer wall portion 44. The inner wall portion 42 is formed on the three sides of the front end portion of the capillary 26 by a three-sided wall in which a u-shaped or a zigzag shape is formed in a plan view. The gas discharge port 45 is provided with a plurality of walls on the three walls. Further, the gas environment forming mechanism 4 is attached so as to be rotatable about an appropriate fixing portion of the bonding device 10, and can be retracted from the tip end of the capillary 26. By using the gas environment forming means 40, the inert gas or the reductive gas is supplied from the gas supply portion π to the middle portion 43 to flow out from the gas discharge port 45 provided in the inner wall portion 42 to surround the three sides of the capillary. The gas environment chamber 36 receives a supply of pure gas or a regenerative gas. Returning to Fig. 1, the XY stage 16 is a mechanism for moving the engaging head 2'' to any position within the plane. Thereby, the front end of the capillary 26 attached to the joint head 2 can be moved to any position in the χ γ plane. The joint head 20 includes: a joint arm 22 that is swingably supported; a super-wave amplifier 26 and an ultrasonic oscillator 3, a motor 32' disposed at the other end of the joint arm U; and a capillary % Installed on the front end of the ultrasonic amplifier 24. The ultrasonic wave oscillated on the end side of the engaging arm 22 oscillates the gas 3 〇 two devices for supplying electric power to output ultrasonic energy. Specifically, it is applied to the piezoelectric element; it is said to produce ultrasonic vibration, and the output of the "energy: α chopper amplifier 24' is used to make the ultrasonic vibration of the ultrasonic vibration device 3 as good as possible. Conveyed to Mao... Sound:

St member: This: (four) shape, and material, etc., stand in the view of suppressing supersonics and sorrows. Further, the ultrasonic oscillator 30 and the ultrasonic wave 15 200910490 amplifier 24 are attached to the support portion on the one end side of the joint arm 22, and the support position and the i!: method are also set to suppress the attenuation of the ultrasonic energy. ^, Tian & 26, is an elongated cylindrical tool inserted through the steel lead 28. Capillary 26, and the function of the right armor, that is, 'use the ultrasonic wave to e / skin this' to press the front end of the copper lead 28 to the joint to the hair two to make the line 28 and the joint object " Hehe. Standing on this point of view, 6% can be used as a bonding tool. X, in a broad sense, because the supersonic energy of the fish is tight, the pressure is quite private, and the 1~s Di Xingxing tool "σ", the person in charge, can also include these communication elements as (4) copper lead, The edge 28' is here a thin wire for bonding mainly composed of copper. Copper? The diameter can be selected according to the size of the pad portion of the bonding object 8 and the wire end temple. For example, a lead of about 2 〇//〇1 can be used. The shape of the line 28 when it is joined to the object 8 is different at the point of the "combination point". Here, in the pad portion or the wire material where the i-th bonding point and the second bonding point and the bonding bar 28 are joined to each other, the first person's ', 1 joint point' sends the steel lead from the first bonding point, and the person who is joined is the younger. 2 joints. At the first bonding point, the tip end of the copper lead 28 is melted to have a spherical shape. Ball Original copper ^ diameter, larger than the principle line 28 t diameter. For example, in the above example, the diameter of the front # and the line 28 is about 2 〇 帛 帛 之 之 之 之 之 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26. The bonding is performed by capillary energy: the bonding object 8 sandwiches the spherical shape and is pressed, and ultrasonic waves are applied to the second bonding point, because the copper lead 28 sent from the first bonding point is bonded by 16 200910490. A copper lead 28 that is non-spherical and uses a fine line of β-diameter is used for bonding. That is, 'the copper lead, the line 2 is placed in a plane, and the hair..." is pressed to the joint object 8 ^ capillary 26 and the joint object 8 to press the copper lead 28 to select the u line 28, which can be joined. m friends: This 4 $ arm 22' is a slender arm member Π:: around the swing center. On the arm-end side: : vibrating S 3〇, ultrasonic amplifier 24, capillary % The direction of the axis of the swing center is the γ-axis direction shown in Fig. 1. The joint arm 22 is rotatable about an axis parallel to the γ-axis. The joint arm 22 is rotated around the axis parallel to the ¥-axis. The capillary 26 on the end side of the engaging arm 22 moves up and down substantially in two directions. Therefore, the swinging of the engaging arm 22 is the movement of the capillary 26 in the Z direction. The z motor 32 provided at the other end of the engaging arm 22, The device has a function of moving the connecting arm 22 in the Z direction at the other end. The movement of the Z motor 32 becomes the movement of the capillary 26 at the end of the engaging arm 22 through the center of the swing. Therefore, the position of the capillary f 26 Speed, acceleration, etc. are controlled by the drive control of the Z motor 32. ^ Z motor 32 The drive control is roughly divided into two functions: a single function, and a 'f movement servo control, that is, the integral drive includes the ultrasonic oscillator 30, the ultrasonic amplifier 24, the capillary 26, and the like to be mounted on the engagement arm 22. And control causes the position, velocity, acceleration, etc. of the capillary 26 to follow the target value. Another function is to apply a predetermined joint load (ie, compression pressure) to the capillary after the front end of the capillary contacts the semiconductor die. 17 200910490 Up to 3 2 'The precision linearity can be used. Therefore, the position, velocity, acceleration, engagement, and load of the capillary 26 can be obtained from the position, velocity, acceleration, etc. of the output portion of the Z motor 32, for example, if the Z motor is linear. In the case of the motor, the position of the capillary & the position of the capillary can be obtained from the moving position of the movable member, the moving speed, the moving acceleration, etc. If the z motor 32 is a stepping motor, the rotation angle and angular velocity from the output shaft can be obtained. , angular acceleration, etc., information on the position of the capillary %, etc. ί i The tool height detection unit shown in Fig. 1 attached to the Z motor 32 The position of the Z-horse 32 detects the height of the capillary 26 (the tool of the tool is high, and the sensor is detected by the position of the Z motor 32. Alternatively, the driving command for the target position data of the Z motor 32 can also be used. Data to detect the height position of the tool. The above description of the requirements of the organization group 12. The second description of the control group 5〇: The air system group 50, with the actions of the components of the organization group 12 as the whole to control, with the implementation of copper The function of the lead and the line 28 is engaged in the industry. ^The line of the object 8 is made of "the group of 5", including: the input unit of a plurality of operations, etc.: the output unit 56 of the amplifier, etc., the memory device of the recording program, etc. = Construction: and: the interface circuit of each component. In the memory device... In the second work bag: wide start program, so that the ultrasonic wave can start the application/stand-up program to stop the ultrasonic wave; the round-out reduction mode enables the super-wave wave to follow the output contour of the corresponding time. Returning the cow low, the joint control program, the joint control, etc.); according to the characteristics of the connector 18 200910490, the ultrasonic wave can be used to determine the various output contours and various control data. Further, the interface circuit includes: the feeder is connected to the feeder 14·, the gas supply I/F 62' is connected to the gas supply unit u; the ultrasonic wave (10) 4 is connected to the ultrasonic vibration oscillator 30; the Z motor I/F 66, It is connected to the Z motor 32; the tool height position I/F68 is connected to the measuring unit 34'· and the XY driving i/F7〇, 〇. Also check, _ h 埂 connected to XY stage 丨 6. The components that make up the control, 'and 50, are connected to each other by internal bus bars. This control power is made up of a computer. Although the CPU 52' has a computing function through the control group 5Q, it has a function of controlling the ultrasonic energy (supplied to the hair:::). This function is performed by the ultrasonic control unit and the sound wave control unit 8. Included: application start module... - application start time period; output reduction module %, control for lowering the output of the second skin; and application of the stop mode, group 88, control super cardiac plus stop period. Also, CPU52, two. The function of the wave. This function, • controlled by the joint control, is implemented by software, specifically, by the implementation of the machine. It is also possible to use the functions of the functions as follows: the flow chart of FIG. 3, the explanatory diagram of FIG. 8, the state change diagram of FIG. 13, and the role of FIG. = (4) The details of the above-mentioned constructions use the same-symbol, save the 'pair and Figure 1 with the symbol of Figure 1...Show the joint: 2 or less' to make the procedure about the control of ultrasonic energy:: In the order, especially the contents of the M% sequence, the contents of the respective processing procedures of the corresponding joint program for 19 200910490. = When the object is joined, the M ig is activated and the connection is started. In this case, the respective requirements of the engaging device 10 are initial settings. And, the = joint object 8 is fixed to the feeder 14. Here, the material bonding target 8 prepares a circuit board on which the die is mounted, and the wiring step is performed by the copper lead 28 from the circuit, the wire terminal, and the pad portion of the die. Take the initial 'forming gas environment (S1〇). In this step, the function of the joint control unit 82 is controlled, and the pair of gas supply parts 3":; inertia=, f-transparent money supply coffee environment... command=:!=sex supply to gas The regulator is actuated, and the nitrogen gas and the ten-rolled body are introduced into the gas environment chamber 36 from the gas source. The machine ^ into: the ball is formed (S12). This step is also performed by the joint control portion 82, which is formed by the copper 5 turns 28, which is inserted into the capillary 26, and the end protrudes from the front end of the capillary 26, and the capillary % is lowered to the gas atmosphere chamber 36. Inside, apply high voltage to the chamber

V tube % front end between the copper lead 28 front end. The front end of the copper lead 28 which is protruded from the front end is refining, and the ball v and the ball are formed, and the oxidation is caused by the melting of the inner lead wire 28 in the gas environment t 36 . In this case, the bonding object 8 carried on the feeder 14 is moved to the second position of the capillary %. Specifically, the 'system is positioned so that one joint pair "16: = wool... sanding" capillary 2 6 is smuggled, ~, the circuit board is actually engaged: end = greening of the joint object 8 The position of the above-mentioned 20th 200910490 state is located immediately above the "combination point". That is, the joint object detail 26 moves to the top (above the joint (S14). Again, the position of the capillary μ, That is, the height position of the tool is located at a position closer to the phase of the joint object 8. This step is also performed by the function of the joint control unit 82: In the case of 'transporting the feeder 14 to the feeder 14, the transport command is transmitted through the XY. The driver's job χ 16 # 16 τ 达 move instruction to execute. /- Borrow two ==:::,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, 30 I up to output I. In addition, the ultrasonic oscillator 3G, in order to ensure the P-function of the action, the vibration itself itself, preferably with the start of the engagement device at 5 simultaneous to the action of the engagement device is stopped. Of course, with the start, , the sound wave "Device 3. In the case, can also be opened in Sl6: Oscillation: The characteristic of this supersonic, although in Sl6, the supply of ultrasonic energy to the capillary f 26 (4), at this time, the capillary front end, and = but the copper lead core is not in contact with the spherical shape of the joint object 86 In the copper lead 28, the wire terminal of the 35 circuit board is removed. ^ (4) The ultrasonic wave of the object 8 is bonded to the capillary f 26 for the purpose of causing the capillary: 28 to vibrate and to be in this vibration state. The copper (10) 28 that is in contact with the bonding object 8 is in contact with the bonding object 8 so that the gate is covered by the oxide, the oxide of the surface of the copper wire 28, etc., on the surface of the bonding object 8:: removal-part, clean surface In this way, the bonding target 8 and the line can be divided into two parts: "Clearing is good, and the bonding characteristics are improved.", 3, and the bonding state 21 200910490 Next, 'the pressing pressure is changed, that is, the change is applied to the capillary f = two. The step is performed by the function of the joint control unit 82. The body is controlled by the z motor I/F 66, and the instruction is changed. The pressing force is applied to the second motor 32, and the bonding device 10' is not connected to the lead wire. By the movement of x... can be moved inwardly = Γ applied to The load in the direction of the thin tube 26 is called the search load. When the phase f is =, the bonding wire contacts the bonding target 8, and the pressing force is applied by applying the ultrasonic energy, which is called the bonding load. The search load is set to the bonding load. It is a relatively light value. For example, if it is about 2° gram mass, the search load = about 7 〇 mN. The above-mentioned i-tight pressure change is changed from the search load to the joint load. , also in the introduction of copper. Before proceeding. And, the _ force 1: no; touch the joint pair "image... set the characteristics. For example, the machine = 广佳 is set to a relatively small value depending on the joint of the joint, such as a joint object having a low mechanical strength, or a vibration of the lead, which is liable to cause damage. Depending on the situation, you can also set the search load set by ^月匕 as small. In the above example, the load is 2 〇mN, which can make the joint load after the compression pressure is changed, and the joint characteristics of the pile person, for example, the bite is large: the load fits the joint pair "sighs about 30mN to about 27〇〇mN. After the mountain, the capillary 26 leads to the circuit of the circuit junction of the first joint: A, the ultrasonic wave of S]6 is applied, and the pressing pressure is changed. Tian Ran, before the descent, the start of the wave application and the change of the pinch pressure can be performed first. The function of the joint control unit 82 is used to execute the descending step of the s 26, and the drive is issued to the Z motor 32. The command, / and Lu's change the capillary 26 by the Z motor height position to make the eighth compliant with the established tool position rim, preferably the initial of the drop:;: set. The tool is higher than the object 8 instead Low speed drops. ', door, drop, with close joint Figure 4 shows the ultrasonic energy p, the height position of the tool at the height position of the pressure Η / 依 =, corresponding to the hair... ^ ^ m day between the change of makeup ability阛, in Figure 4 (4), the horizontal axis is common Time, the vertical axis is P,; H = sub and J will change the time of the ultrasonic energy P, that is, the contour of the wheel, in (c) (S is a partial enlarged view of Figure 4 (a)), without matching the bonding to nitrogen An example of several output profiles set by the δ characteristic of the pile of 8 V.. At Fig. 4 (4), the time U is the speed at which the tool height position u falls, and the speed is changed from the south speed drop to the low speed drop point. U, the capillary 26 is lowered, quite close to the moment of engagement with the object 8. Again, at time t1 'the ball at the front end of the copper lead 28 has not been in contact with the joint pair. In Fig. 4 (4), the time t2 after the time U is the time at which the ultrasonic energy is applied at S16. # '' starts the ultrasonic oscillation at time t2'. The ultrasonic energy P' rises from zero at a relatively rapid rate to a predetermined size at time t2, and is maintained at this level until the falling time described later. Further, as described above, since the tool height position Η has started to decrease from the time t2, in this example, when the capillary 26 is lowered, the application of the ultrasonic energy P is started after the descending speed becomes a low speed. Then, after the tool height position Η is further lowered, the copper lead 28 is in contact with the bonding object 8 in front of 23 200910490. That is, a so-called joint contact state is formed. In each of the figures of FIG. 4, the height position of the tool at this time is represented by H, and the time, the number of the ball of the front end of the H1 'copper lead 28 is in contact with the height position of the joint object 8, because the height is The reference is joined, so the difference in the position of the bowl = degree is called the i-th height*. Further, when the line of engagement is at the time of joining the object 8, since the time is joined based on the time, it is called the first time τ]. °. Further, in each of the tool height positions %, the 显示 is listed in the tool height position %, and is attached to the second joint point, which will be described later, and the knife-free steel lead 28 is in contact with the joint object. 8 moments. The position of the tool 豕 8 is here, back to Figure 3, as shown in the top of Figure 4:: Set to the first high... Before and after the first time, make the super: wave energy match time pass The rim is ruining you - the old reverse order will be super-clamped + lowering the treatment (S20). In this step, the dream is performed by the output of the module 8 of the output unit 86. 9 = The degree to which the output of the sonic energy is reduced is determined by the ultrasonic energy output contour of the interface characteristics of the mating joint object. Figure 4 (a) A part of the enlarged view, car - 々 (), (c) (Figure, R various output contours. With the eight-to-eight-hook joint characteristics of the ultrasonic energy output contour, stored in the map; Group 50, 障 罟ς 罟ς c, control of Figure 1, M heart, for example, with the name of the joint object 8 stupid helmet search keyword and read from the memory | set 58 corresponding to the test can be super The sound wave «3G indicates the output level contour. According to this, in the conventional technology, only the ultrasonic wave can be turned on/off and the control technology has been able to adjust the output level of the ultrasonic energy in recent years. 24 200910490 This technology, in conjunction with the output level of the sound wave of the joint object 8, can adjust and super-adjust the joint phase. It is suitable for the joint object to be pulled in here, the established output contour, and can be connected to & For example, it is possible to match the joint of the joint/joining object 8 at the time of joining. For example, the joint 8 which is liable to cause damage such as vibration of a mechanical strength such as a mechanical strength:::::::: The combination of the sound wave can reduce the degree of the wheel. The situation 'can use the ultra-ultrasonic energy The output reduction process is performed, and the sound is shame-recognized. On the 1st day, before the T-single 1 is performed, the output contour of the Yi system is reduced from the ith moment τ, and the output contour is output from the beginning of the reduction. Decrease. Figure 4 (8) shows that under the first: the open ultrasonic energy does not become zero u to win d 1 to 刖, I double order (ie 'ultrasonic output is not contoured. Figure 4 (c) ping - τ) The old round of the value, and then resume = at the first moment Tl ultrasonic wave first reduced to small

In order to reduce the previous large value, I have several examples of output contours. $仃 Output V processing i. So 'by 9 s each mountain from the copper> The ball at the end of the 28 line 28 is in contact with the joint object 8 > _ The output level of the ultrasonic energy is reduced, can: The impact of the image. Moreover, the eye + the contact with the joint is temporarily held by the lead after the contact, and the image is held low, and the joint output can be reduced to reduce the rounding and suppress the fly before the work hardening occurs, for example. With "...more time Τ1", when the above-mentioned system corresponds to the first height %, the wide Hl' is detected by the tool height detecting unit 34, but the real hunting is divided by the position of the ii i 衾ς ' Detection is performed for detection. For example, the right-handed copper 25 200910490 bow wire diameter, you can find the straight shape of its ball shape. &, if it is foreseen that the copper lead 28 is not inserted into the capillary 26 when the object 8 corresponds to the position of the z motor 32: 26 contact with the joint (four) recorded oq transport 2 position 'can be obtained the ball shape of the copper lead 28 at the front end of the capillary 26

The height of the 2 motor 32 of the joint object 8. Then, the line Μ contact 4 is in contact with the bonding material MU in the foreseeable (four) line 28 ... the second degree position ' If the value is set to correspond to the first height and is set to the tool directionality detecting portion 34, the current position is known. A position higher than the ith height H1. In addition, the position of (9) degree is 4, as shown in Fig. 4, because the time of the pre-4 degree position changes, that is, the production of the capillary%, the current moment is the first, and the first can be set. :, with the specified output contour. The timing of the squatting is as described above in the 'tool height position Η, indicating that the joining step is based on the surface of the joining object 8. From the reference height to the capillary 26a, the position of the door can be 门 丁 Η 、 、 、 、 、 、 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 The reference of the degree of position Η is set to the engagement device 1 for example, and the engagement device 1 can be placed at a predetermined position. Or, as will be described later, ... the 32 sides are used as the reference height. — The position of the output of the 2nd is closely related to the position of the jade and the official 26, so the movement of the motor 32 can be used as the reference height of the height position of the tool. The reference position of the motion is the first A degree ίί丨, although the copper lead 28 is the same as the object 8 and the high-yield # stomach yj翊 ball is in contact with the joint position, but the detection of this state, except the use of Z Ma 26 200910490 f The position of the degree is detected by detecting the height of the bonding tool. The second is also detected by the following method. For example, by setting the contact arm to detect the contact of the bonding tool, the 5H is regarded as the first height 亦, and the device detecting lead is connected to the bonding object by the current flowing through the contact load change timing. , hand # again, this will be the first rumor 1 when measuring the current. In addition, the above methods can also be combined to comprehensively detect the ith high sound: x cis is used to reduce the output of the ultrasonic energy: after, the output contour of the 疋, the output of the ultrasonic energy is gradually reduced ', ', Zero output, stop the supply of ultrasonic energy (S22) e Reduce the function of the module 86 - part of the ^ is a turn, the difference between the knowing, as a function. That is, the "in case" may not be subjected to the S2 output reduction processing, and the application of the ultrasonic energy may be stopped. Further, the 'tightening pressure W' is as shown in Fig. 4 (4), and the tool height position Η is lowered: the degree is switched from the high speed down to the low speed down, and the load called the damping (-r) load is switched to the search load. Further, at the time when the disk tool is lowered to %, or at a later time, the pressing pressure W: the recording load is changed to the bonding load. In other words, the pressing pressure W is increased from the search load to the joint load at the same time as or after the contact with the ball of the copper lead h before the so-called joint contact of the joint object 8. The processing of the ultrasonic stop is performed at a stage before the ball at the front end of the copper lead 28 is formed into a predetermined flat shape. Here, the so-called established flat shape is generally referred to as the shape of a suitable joint ball (DFB), and can be empirically determined. For example, it is possible to deform the flat shape to the thickness of the diameter of the spherical shape, and replace it with a shape in which the original diameter is 70% flattened as a DFB. If the flattened 27 200910490 is rewritten as the tool height position, in the above example, it is from the first! Height %, the tool height position of 70% of the diameter of the lower I ball shape; if the diameter of the ball shape is about qing, it is a work position lower than the first height % and about the center m. Since the joint is completed after the predetermined flat shape is reached, the south position of the tool is distinguished from the other height positions, and is referred to as a second height H2. Further, the time until the second height is reached is referred to as the second time A. Therefore, after the supersonic stop processing of = is performed, the second height H2 is reached (s24), whereby the joining process of the first joint is completed (S26). ‘The supply of ultrasonic energy is stopped, and the position at the height of the tool becomes the second and the second is entered. If it is expressed by the time, the second time is reached. In Fig. 4, the tool height position at which the ultrasonic wave is stopped is at the super-clutter stop position Hs, and the time is indicated by the ultrasonic stop time L. As shown in Fig. 4, the ultrasonic stop position Η5 is set to be higher than the i-th and lower than the second 庳u----H2, the ultrasonic stop time is 5, and the system is set to be the first time. Τι later and the time before the second time τ2. Stopping the super-chopper wave until reaching the second height Η 2 or before the second time 八, the meaning of the ultrasonic stop position is lower than that of the ultrasonic wave without the ultrasonic wave. The state, with the pressure, 'deforms it into a defined flat shape. In this way, it is possible to prevent the low-intensity bonding machine 1 from excessively adding ultrasonic energy, and in addition to using the copper wire 28; ί Ab-mooning to prevent the engagement due to the continued application of ultrasonic waves Splashes and other damage. Fig. 5 to Fig. 8 show the state of the steel bow line 28 28 200910490 and the field g 2 6 of the first joint and the second joint in time series. Here, the bonding target is a circuit board on which a die is mounted. However, the corresponding point indicates that the wire terminal 90 of the circuit board corresponds to the ridge portion 92 of the die. Fig. 5 is a view showing a state in which the tool height position becomes the 帛i height η at the joint point. Fig. 6 shows the state at the first joint point, and the tool height position is the first degree. Further, in the description of Figs. 7 and 8, the joining process in relation to the second joining point will be described later. After the bonding process of the first bonding point is completed, the copper wire 28 is lifted upward by the capillary tube 26, and the second copper wire 28 is also fixed at the end of the "combination point", and is sent out with the movement of the capillary 26, and then the second bonding point is moved. Move above (10)). This step is performed by the function of the joint control unit 82 in the same manner as in S14. However, the drive of the feeder 14 is not performed, and the movement of the capillary 26 and the delivery of the copper lead 28 are performed only by the movement of the χ γ stage. Here, the second joint point ′ is a pad portion on the crystal grain as illustrated in Fig. 5 . Next, ultrasonic energy is applied to the capillary 26 (S3 〇). This step is the same as the S16 of the "combination point, and the ultrasonic energy is applied to the capillary 26 before the copper lead 28 contacts the bonding object 8. ...At the first joint, the dust tightness is changed afterwards. However, when the same joint load is used at the second joint, the pressing pressure is not changed, and the first joint is also made. The joint load of the joint is different from the joint load of the second joint. In this case, after S30, the pressing force is changed. 〃 After S28, the capillary 26 is also lowered toward the second joint, that is, the pad portion of the crystal grain, as in the case of the first joint. Therefore, the ultrasonic wave is applied to S30 in the middle of the descent, and the two are changed. Capillary 26 is to perform the above-mentioned waste tight pressure to the high-speed Lu knees and the eight-door positional contour. It is better to lower the initial position and then change to the lower limit of the object 8 and then change to the low speed drop. same. The joints are different in the state shown in Fig. 4, and the ultrasonic energy P " position Η time change trend is the same. (4) Force W, tool height position Η touch two: two horse position position - - step down, copper lead 28 is connected? =; In Figure 4, the height position of the tool in this state is: Question Η 3 'The time is indicated by the third time L. In addition, the wheel of the ultrasonic wave (4) _ is also the same as the "combination point", and the tool ".../a low processing is performed before and after the third time Τ3. ", ::,,,,,,,,,,,,,, Connection of the object 8 The bonding characteristics of the output image of the falling process are different from those of the first bonding point. The difference is the output of the first bonding point: the bonding characteristics of the combined circuit board and the lead terminal. Performing the ...:: Pointing out the outline 'with the joint characteristics of the die and its pad. That is, the output contour of the 2nd joint can also be the same as the output profile of the 1st joint (10)) The supply of sound waves. That is, the ultrasonic stop processing of the second joint is applied to stop the ultrasonic wave, and is the 之前 before the arc shape of the copper lead 28 from the first person becomes a predetermined curvature state; Here, the arc-shaped predetermined curvature state can be regarded as the final arc after the empirical decision = 30 200910490. Therefore, the height position of the tool is distinguished from the other, which is called the fourth height. Η#. Again, the time to reach the 4th South is called the 4th hour. T4.

This situation will be described using FIG. 7 and FIG. 8. Figure 7 and Figure 8 are in the same! Similarly to Fig. 5 and Fig. 6 which have been described, the third height H3 is shown in Fig. 7, and the fourth height & which is an arc in a proper arc shape is shown in Fig. 8. Here, in the state of the third height % of Fig. 7, since the copper lead 28 at the tip end of the capillary 26 is simply in contact with the pad portion 92, the arc shape is gently inclined and does not leave from the crystal grain surface. As the capillary 26 is further lowered from this state, the copper lead spring 28 is deformed, and the copper lead 28 at the front end of the capillary 26 is crushed, and the copper lead 28 is erected, and a small curvature is gradually formed, and the copper lead μ is arc-shaped. Part of it gradually leaves the grain. In this way, at the second joint, since the arc is a criterion for evaluation, the ancient itch of the observation arc is displayed. ^ The degree of curvature, the curvature of the arc, and the appropriate arc shape is determined as the appropriate field. . When the formation is in an appropriate arc shape, the joining of the second joint is completed. 〇 Therefore, n"# ώ Ττ brother 4 is the same as Η4, and the arc has a predetermined position when the arc is in the shape of a two-state state. The state of the copper lead 28 can be changed due to the appropriate arc shape and the change of the copper lead 28 > In the case of ^η, the table is not properly arced, and the flat deformation is changed to 40% of the diameter of the copper lead 28. It will be the case where the original diameter of 60% of the original diameter is flattened <corresponding to the shape of the appropriate arc θ, as the above example, 2:: If this? Calculated as the height of the tool's height position:: two: degrees, only / drop copper lead ... with "degree position ten if the copper bow line 28 diameter is about 31 200910490 that is from the third height & lower about ΐ 2 The height of the tool is returned to Figure 3 again, and becomes the fourth height η (S38, after the ultrasonic wave stops processing, it stands up...(). That is, before the fourth height is reached, the super-wave is known. Figure 4, the Ding Sonic stop time is "/ wave stop south to show, the super position Jin H <; / D 5, no, the same as the first joint, the ultrasonic stop / the deduction 4 ▲ The position is low and the position is higher than the fourth height Η4. When the ultrasonic wave is stopped, the fourth day of the fourth day is set. The time is set to be shorter than the third time, and the time is shorter than the fourth time. 26, the line 28 is cut at the second joint, and the joint processing of the joint of the bundle 2 is performed (S4〇). The clamp is placed on one joint object 8, and the lead terminal and the portion of the circuit board are connected. By joining the line 28, the joint object 8 is ended.

. deal with. Thereafter, the process returns to S 2 and the ball is formed. Then, at s", the feeder M is transported at a predetermined pitch, and the joint object 8 is moved to the next 5 points. Thus, the above steps are repeated for the new joined object 8. In the above-mentioned Figs. 5 to 8, the bonding target is a circuit board in which a die is mounted, but the ith junction is a wire terminal of the circuit board: the dot is a die. However, in general, for example, in the case of a laminated structure or a circuit board, the circuit board scorpion 90 located at a low height is a joint point, and the position is formed by a position toward the intermediate degree; and the lead wire is extended to make the die (4) 92 is more convenient for the second joint. On the other hand, in the connection between the normal die and the circuit board, the pad portion 92 of the die is generally the "combination point", and the wire 32 of the circuit board 200910490 terminal 90 is the second junction. . Therefore, the latter method in which the "92 1 junction of the crystal grains is joined can be referred to as a positive bonding method, and the former method in which the wire terminal % of the circuit substrate is the second junction is shown as the reverse bonding method.

FIG. 5 to FIG. 12 are diagrams showing the case where the positive bonding method is used. The same components are denoted by the same reference numerals, and the detailed description is omitted. 4 Here, the bonding target is a circuit board on which a die is mounted, but the bonding point is The pattern 0 portion 92 corresponds to the second junction loss circuit substrate. Fig. 9 shows the case where the tool height position is at the second joint point, and Fig. 10 shows that at the second joint point, the degree = The situation is when the position is the second height ^. Further, Fig. U shows the case where the square and the second joint point are at the third height H3 when the tool $@, _^ degree position. The 12-series is not in the case where the arc is in the shape of the appropriate arc and the position is the fourth height & One: the joining method, and the reverse joining described with reference to Figs. 5 to 8; the difference: the position at the joint point is at the same position as the position of the second joint. Therefore, the contents of the states of Figs. 9 to 闰 and Fig. 2 are the same as those of the states of Fig. 5 to = illustrated. For example, the third connection of the figure η:: guide: the copper lead 28 at the front end of the capillary 26 is simply brought into contact with the lead terminal 9〇 and left. As the capillary 26 is not shaped from the surface of the circuit board, the capillary is stepped down to cause the copper lead 28 to be deformed into a line 28". The copper lead 28 is pressed to be affected by the copper lead from the + path. Gradually into a small curvature, the arc portion of the copper lead 28 is left on the circuit board. Scythe Magic 33 200910490 Similarly, the positive joint can be used as a 俨 俨 I 7, a ζ崁 ζ崁 point, a curved secret reference, comprehensive Observe the height of the arc, the arc is appropriate for grasping, the curvature of the muscle, etc., and the 'shape' is taken as the appropriate arc shape. When the arc shape is formed, the second technician L 乂 forms the appropriate joint s point. The appropriate arc shape is also the change of the fc lead 28. The relationship between the shape of the fox and the cymbal cymbal is as shown in Fig. 8 as shown in Fig. 8 to the flattening of the copper bow 丨 nickel ^ + For example, the diameter of the line 28 is 40% thick, for t... 60°/diameter of the total pressure, which is the amount of deformation corresponding to the appropriate arc when the shape of the original figure η is flat. /r The figure compares the effect of the above-mentioned joint method | Illustrated diagram y fruit / white diagram. Figure U shows the diagram of the ultrasonic control of the conventional example, Fig. 14 is #-皮Fig. 4 (4) shows a diagram of the joint situation under the control of:::: Control. The square of the procedure of Fig. 3: the diagram of the state after the figure 'Fig. 16 is a perspective view showing the state after the joint is removed. For the same elements as those of Figures 1 to 5? ^, the same symbol is used, and ' is omitted. Again, the following uses the symbols of Figures 1 to 8. / Figure 13 is taken on the 撗 axis, on the vertical axis. Take a picture of the control situation that should be exceeded by the capillary. Here, it is indicated in the patent document 1 that you are 丨Ρη ^, and the finder is in contact with the child. In other words, in the control method, the application of the ultrasonic energy is started when the copper lead 28 is in contact with/like the first time, and the application of the ultrasonic energy is stopped when the copper lead 28 reaches a predetermined amount of deformation. The figure 糸 indicates the state of the steel bow | 7 8 when the joining process is performed by the control method of β 13 and the dam portion 94 which is the sigma object. Fig. 14 (4) shows that the ball portion of the steel lead 28 of the shape g ′ before the first J is not in contact with the pad portion 94. Super ^. Not applied. Fig. 14 (b) is the first time Τ, the ball portion of the copper lead 28 is just in contact with the pad portion 94, and the ultrasonic energy is applied from the time opening 34 200910490. Fig. H(e) is the second moment A, and the ball portion of the copper lead 28 reaches a predetermined amount of deformation, for example, 70% of the initial ball diameter is in the state of the dust fan. However, the crotch portion%, the surrounding portion of the flat-shaped ball is raised, resulting in a petal-like splash 96. The reason for this is as follows. Since the copper lead 28 is a material which is easy to work harden, it is gradually hardened due to the deformation of the 攸 blade, and the deformation is gradually difficult. However, until the predetermined amount of deformation is reached, the state of the hard shape is maintained, and the supersonic is continued. The supply of = is gradually hardened by the flat-shaped ball, and the ultrasonic vibration/flat to the flat shape of the 4 hard state is equal to rubbing the pad portion 94 with a hard material. This state continues until the flat shape of the hard and deformable flat shape reaches a predetermined amount of deformation. Therefore, the ball portion of the flat shape that has been hardened: τ: the portion of the pad portion 94 is gradually thinned. The pad material is raised in the peripheral portion of the flat shape. Thus, the pad portion 94 produces a biochemical valve-like splash 96 in the peripheral portion of the flat-shaped ball. a As described above, after the splash 96 is formed, the crotch portion 94 of the lower portion of the flat-shaped ball is likely to generate moisture, adhesion of organic matter, and the like depending on the environment after the joining, and the reliability of the joining is lowered. Fig. 15 is a view showing the joint portion L of the conventionally exemplified example in which the pad portion 94 is opened. Figure 16 is a copper wire bonded to the pad portion 94 by the method of Figure 3. It is known that the splash shown in Fig. 15 is not detected. BRIEF DESCRIPTION OF THE DRAWINGS y1 is a view showing a configuration of a bonding apparatus according to an embodiment of the present invention. Fig. 2 is a view showing a state of a gas environment chamber 35 200910490 in an embodiment of the present invention. Fig. 3 is a flow chart showing a joining operation program according to an embodiment of the present invention, in particular, a control program for ultrasonic energy. Fig. 4 is a view showing the state of time change of ultrasonic energy, pressing pressure, and tool height position in the embodiment of the present invention. FIG. 5 is a view showing a state of the i-th height in the embodiment of the present invention. FIG. 6 is an embodiment of the present invention, and FIG. 7 showing a state of the second height is an embodiment of the present invention. Fig. 1 is a view showing a state of a fourth height, and Fig. 9 showing a state of a fourth height corresponds to a state in which the height of the third height at the time of positive joining is shown in Fig. 1. 6 is a diagram showing a state of the second height at the time of the positive joint. FIG. 1 is a diagram corresponding to FIG. 7 and showing a state of the south degree at the time of the positive joint, and FIG. Figure 1 of the state shows the control of the super-chopper of the conventional FI 1 4 main master. Fig. 14 is a view showing the state of engagement in the control of Fig. 9; Fig. 15 is a perspective view showing a state after 妾 σ 36 200910490 Fig. 16 is a perspective view showing a state after joining using the method of the embodiment of the present invention. [Main component symbol description] 8 Bonding object 10 Engagement device 12 Mechanism group 13 Stage 14 Feeder 16 XY stage 20 Engagement head 22 Engagement arm 24 Ultrasonic amplifier 26 Capillary 28 Copper lead 30 Ultrasonic oscillator 32 Z motor 34 Tool height detecting unit 36 gas environment chamber 38 gas supply unit 40 gas environment forming mechanism 42 inner wall portion 43 hollow portion 44 outer wall portion 37 200910490 45 gas discharge port 50 control group 52 CPU 54 input portion 56 output portion 58 memory device 60 feeder I/F 62 Gas supply I/F 64 Ultrasonic I/F 66 Z Motor I/F 68 Tool height position I/F 70 XY drive I/F 80 Ultrasonic control unit 82 Engagement control unit 84 Application start component 86 Output reduction Component 88 Apply Stop Assembly 90 Wire Terminal 92 ' 94 Pad 96 Fly Money 38

Claims (1)

200910490 X. Patent Application: 1. A bonding device, comprising: a bonding tool for inserting and holding a lead; a load applying means for applying a predetermined pressing load to the bonding tool; an ultrasonic applying means, a bonding The tool applies ultrasonic energy; the height position detecting means detects the height position of the bonding tool to the bonding object, that is, the height position of the tool; and the X ί computer, which cooperates with the lowering of the bonding tool to control the bonding operation; the computer has: Before the ball at the leading end of the lead contacts the first height of the bonding target, the means for supplying ultrasonic energy to the bonding tool is started; and the height of the tool having the predetermined flat shape of the ball at the leading end of the lead is the second height, and is set at the second height. A means for stopping the ultrasonic wave by the ultrasonic stop position at any height position between the height and the second height. 2. The bonding device of claim 1, wherein the computer, V, joins the ball at the leading end of the lead to the first bonding point by a bonding tool, and the lead is arc-shaped and further bonded to the wire. In the case of 2 joints, there is: ^ means to supply ultrasonic energy to the bonding tool before the third height of the bonding target of the second bonding point is reached at the tool height position; and to send the ultrasonic energy from the first bonding point The arc of the lead has a predetermined curvature and the height of the tool is the fourth height, which is set at the third height and the fourth 39 200910490 south degree. ~. The position of the ultrasonic stop is so that the ultrasonic wave can be stopped. The joint of the patent scope is included in the case of the work. The height of the work is n ^ r ° 豕冤 丨 丨 丨 达 达 达 达 达 达 达 达 达 达 达 达 达 达„ The height of the tool reaches the 2nd heart gentleman, and the W is the 1st engraving of the brother. The second time is determined by the joint characteristics of the image, and the moment is matched with the moment, so that the supersonic is before and after the second moment. Any means of 〆 匕 匕 匕 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应The tool engagement characteristics are set before and after the third time and only when the bonding target is matched, so that the ultrasonic energy can be compliant with any time period before the time corresponding to the 0± gate width 4. The distance between the T and the output contour is reduced. For example, the method of detecting the position of the patent scope 帛i, the scooping person, the '/, the middle', and the second degree, at least one of the following three means: detecting the joint worker and the supporter i > Means of moving the amount between degrees The bonding arm detects the hand of the bonding tool and the hand of the bonding object and the means for the current of the device. 6. If the scope of the patent application is the third item, you are θ-& The joint device, the computer, has a square..., the position of the slant is lowered to a predetermined value - a low load reduction means. When the load is more positional, the load is lowered by 7_ as in the second part of the patent application, the tool height position is lowered to When the computer is fixed, the load is changed to 40, and the load is reduced by 40. The low load is reduced. 8. If the device is in the scope of patent application, the lead wire is made of copper as the main component. 9. If the patent application is the 8th knife copper lead. The means 'will be inserted into the joint device', which has the shape of a ball; and the front end of the steel wire of the eight steels is melted to form a spherical ring. The jointer 'V mechanism forms the front end of the lead into a spherical environment. The surrounding area is maintained in a gas ring that suppresses the oxidation of the steel. The pressure is applied to the plug-in and the wire is held. The I-load and the ultrasonic energy are applied. , " The utility model is characterized in that the method comprises the following steps: the lowering of the tool is carried out to cooperate with the bonding tool pair 斟i. The ball which is the front end of the lead contacts the joint: degree: set: has a height position, and supplies ultrasonic energy to the bonding tool. Steps; and before, start with the ball at the leading end of the lead to become the second height, set at the first!丄7' tool distance position position of the ultrasonic stop position and /, any height between the second height · as in the scope of patent application 〇 之 接 接 接 接 接 接 接 接 接 接 接 接 接 接 接 接 接 接 接 接 接 接'It is connected to the second joint by means of pick-up and step-by-step: the line is eight arc-shaped at the tool height position, and becomes the lead front contact: the first two. Before the third height of the joint object, the joint work is started. And:: a step of 5 o'clock; and /, supplying ultrasonic energy 41 200910490 The tool height position in which the lead wire sent from the first joint is arc-shaped into a predetermined curvature state is the fourth height, and is set at the third The step of stopping the ultrasonic wave by the ultrasonic stop position of the position between the height and the fourth height. 12. The joint method of claim 10, wherein the time to reach the first and the second of the tool is the first time, and the height of the tool reaches the second height. β » ' The temple is engraved as the second time, and is set at the arbitrary time after the 1st f ¥ and after the 2nd time from the joint characteristics of the joint object, so that the ultrasonic wave can be obeyed to the custody μ ^ _ corresponding day The step of reducing the output profile that can be passed is, for example, the joining method of the U-part of the patent application scope, wherein the tool reaches the first height at the time of reaching the first position, and the first time is the third time, and the tool is connected - The feature is engraved as "the moment, from the moment of cooperating with the object, knowing that it is not in the moment and at any time before the fourth moment * the ultrasonic wave can obey the η caller. The step 10 of the output contour reduction corresponding to the passage of time Item or the joining method of item 11 'when it is to a predetermined load changing position, the negative 4' is included in the load lowering step of the lowering of the tool height range as the patent application range is lowered. 11. Circumference: For example, the next page. 42