TW200910015A - Drawing system, drawing apparatus and drawing method - Google Patents

Drawing system, drawing apparatus and drawing method Download PDF

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Publication number
TW200910015A
TW200910015A TW097113692A TW97113692A TW200910015A TW 200910015 A TW200910015 A TW 200910015A TW 097113692 A TW097113692 A TW 097113692A TW 97113692 A TW97113692 A TW 97113692A TW 200910015 A TW200910015 A TW 200910015A
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TW
Taiwan
Prior art keywords
light
divided
substrate
split
optical paths
Prior art date
Application number
TW097113692A
Other languages
Chinese (zh)
Inventor
Kiyotada Amenomori
Kunio Ikefuji
Yasuyuki Koyagi
Hideaki Ogawa
Kouji Yasufuku
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Dainippon Screen Mfg
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Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Publication of TW200910015A publication Critical patent/TW200910015A/en

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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70516Calibration of components of the microlithographic apparatus, e.g. light sources, addressable masks or detectors

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

The invention provides a drawing system, a drawing device, and a drawing method. The drawing system can carry out drawing processing and other processing using light from one source in a plurality of drawing devices or a plurality of drawing processing parts, so as to improve the working efficiency of the laser and the production efficiency of the substrate. The drawing system (100) divides the pulsed light emitted from the laser oscillator (110) into primary pulsed light and secondary pulsed light, and alternately distributes the primary pulsed light and the secondary pulsed light to a first drawing device (1a) and a second drawing device (1b).; Therefore, the drawing processing using primary pulsed light and the correction processing using secondary pulsed light can be carried out in parallel and alternately in two drawing devices (1a, 1b), so that the working efficiency of the laser oscillator and the production efficiency of the substrate are enhanced.

Description

200910015 九、發明說明: 【發明所屬之技術領域】 本發明係關於一種描繪系統、描繪裝置及描繪方法,藉 由對液晶顯示裝置所具備之彩色濾光片用玻璃基板、液晶 顯示裝置與電漿顯示裝置等平板顯示器(FPD,flat panel display)用玻璃基板、半導體基板及印刷基板等基板照射 光束’而於形成於基板上之感光材料上描繪特定圖案。 【先前技術】 於基板之製造步驟中使用如下描繪裝置,其藉由對基板 照射光束,而於形成於基板上之感光材料上描繪特定圖 案°先前之描續·裝置例如具備:平台,一面以水平姿勢保 持基板,一面使基板於水平面内移動;作為光源之雷射振 盪器;及照射頭,將雷射振盪器射出之光束一面成形為特 定圖案一面照射於基板上表面。 於此種描繪裝置中處理基板時,首先,描繪裝置藉由特 定之搬運機構將基板搬入,並將基板載置於平台上。又, 描繪裝置使載置於平台上之基板進行對準。I板之對準完 成後,描緣裝置-面使基板與平台—併移動,—面由雷射 振盛器間斷性射出光束’藉此於基板上表面上㈣特定圖 案。其後,描繪裝置藉由特定之搬運機構搬出描繪處理完 畢之基板。又,騎裝置根據需要,對照射頭之照射光狀 態進行修正處理(校正處理)。 關於此種先前之描㈣置’例如揭示於專利文|U中。 又’專利文獻2中揭示有以與描綠裝置相同之方式,使由 130516.doc 200910015 光源射出之光束照射於基板上表面之裝置之例。 [專利文獻1]日本專利特開2006-145745號公報 [專利文獻2]日本專利特開昭61 -1617 19號公報 【發明内容】 [發明所欲解決之問題] 如上所述,於描繪裝置之動作時間中,除具有使雷射振 盪器動作進行描繪處理之時間外,還存在不使雷射振盪器 f200910015 IX. OBJECTS OF THE INVENTION: TECHNICAL FIELD The present invention relates to a drawing system, a drawing device, and a drawing method, which are provided by a glass substrate for a color filter, a liquid crystal display device, and a plasma for a liquid crystal display device. A flat panel display (FPD) such as a display device irradiates a light beam with a substrate such as a glass substrate, a semiconductor substrate, or a printed substrate, and draws a specific pattern on the photosensitive material formed on the substrate. [Prior Art] In the manufacturing step of the substrate, a drawing device is used which draws a specific pattern on the photosensitive material formed on the substrate by irradiating the substrate with a light beam. For example, the device has a platform, for example, The substrate is held in a horizontal posture, and the substrate is moved in a horizontal plane; a laser oscillator as a light source; and an illumination head that irradiates the beam emitted from the laser oscillator into a specific pattern while irradiating the upper surface of the substrate. When the substrate is processed in such a drawing device, first, the drawing device carries the substrate by a specific transport mechanism, and the substrate is placed on the stage. Further, the drawing device aligns the substrates placed on the platform. After the alignment of the I-plate is completed, the trace device-surface causes the substrate and the platform to move, and the surface is intermittently emitted by the laser oscillator to produce a beam on the upper surface of the substrate (4). Thereafter, the drawing device carries out the substrate on which the drawing process is completed by a specific transport mechanism. Further, the riding device performs a correction process (correction process) on the illumination state of the irradiation head as needed. This prior description (4) is disclosed, for example, in the patent text |U. Further, Patent Document 2 discloses an example in which a light beam emitted from a light source of 130516.doc 200910015 is irradiated onto the upper surface of the substrate in the same manner as the green display device. [Patent Document 1] Japanese Patent Laid-Open No. Hei. No. 2006-145745 (Patent Document 2) Japanese Patent Laid-Open No. 61-1617 No. 19--A SUMMARY OF INVENTION [Problems to be Solved by the Invention] As described above, in the drawing device In the operation time, in addition to the time for causing the laser oscillator to perform the rendering process, there is also no laser oscillator f

動作而進行基板之搬入搬出及對準等之時間。又,先前於 1台描繪裝置中設有1台雷射振盪器。由此,雷射振盪器之 運轉率較低,基板相對於雷射振盪器設置台數之製造效率 不佳。 另一方面,描繪裝置除描繪處理外,如上述校正處理 般,有時無需如同描繪處理程度之光強度,卻使用來自雷 射振盪器之光束進行處理。因此,僅將來自丄台雷射振盪 器之光束簡單地依次切換供給至複數台料裝置,則無法 於複數台描繪裝置中並行营 ''' T I仃實施描繪處理與其他處理。 本發明係鑒於此種情況而6 月况而疋成者,其目的在於提供一種 描續'系統、描緣裝置;5少务+丄 置及描、會方法,其於複數台描繪裝置或 複數個描續·處理部中, 使用來自個光源之光使描繪處 理與其他處理平行進行, 造效率。 了耠阿雷射之運轉率及基板之製 [解決問題之技術手段] 為解決上述問題,嗜书 特徵在;^ . K D求項1之發明係一種描繪系統,其 荷徵在於.其係包括靼 括藉由對基板照射光而於形成於基板上 I30516.doc 200910015 之感光材料上描繪特定圖案之描繪裝置,且包括:光源; 分配裝置’其係將自上述光源射出之光分割為複數個分割 光,並且將上述複數個分割光分配至複數個光路;及複數 個上述描繪裝置,其係分別配置於上述複數個光路_ ;上 述複數個分割光包含光強度高於其他分割光之i束描繪用 分割光,而上述分配裝置將上述摇纷用分割光依次分配至 上述複數個光路中。 請求項2之發明係如請求項〗之描繪系統,其中上述複數 個描緣裝置分別具有修正機構,其係使用上述財用分割 光以外之上述分割光來修正光對基板之照射狀態。 請求項3之發明係一種描繪系、统,其特徵在於:其係包 括藉由對基板照射光而於形成於基板上之感光材料上描繪 特定圖案之描綠裝置者,且包括:光源;分配裝置,其係 將自上述光源射出之光分割為光強度較高之第W割光與 光強度較低之第2分割光,並且將上述約分割光及第2分 割光分配至2條光路中;及2台上述描緣裝置,其係分別配 置於上述2條光路上述分配裝置將上述^分割光及上 述第2分割光交替分配至上述2條光路中。 請求項4之發明係如請求項3之描綠系統,其中上述2台 描緣裝置交替進行描繪處理,上述分配裝置以對上述2台 描緣裝置中進行描緣處理之描繪裝置提供上述第i分割光 之方式’將上述第1分割光與上述第2分割光分配至上述2 條光路中。 請求項5之發明係如請求項4之描緣系統,其中上述2台 130516.doc 200910015 描繪裝置分別具有修正機構’其係使用上述第2分割光來 修正光對基板之照射狀態。 、、項6之發明係如請求項3至請求項5中任一項之描繪 八中上述分配裝置包含:光分割部,其係將自上述 光源射出之光分割為對該光軸正交且相互向相反方向前進 之上述第1分割光與上述第2分割光;及旋轉機構,其係使 上述光分割部以上述光軸為中心而旋轉。The time for loading, unloading, and aligning the substrate is performed by the operation. Further, one laser oscillator has been previously provided in one drawing device. As a result, the operating rate of the laser oscillator is low, and the manufacturing efficiency of the number of substrates to the laser oscillator is not good. On the other hand, the drawing device may be processed using a light beam from a laser oscillator as in the above-described correction processing as in the above-described correction processing, as in the case of the above-described correction processing. Therefore, only by simply switching the light beams from the laser oscillators of the turntable to the plurality of stocking devices in sequence, it is impossible to perform drawing processing and other processing in parallel with the plurality of drawing devices. The present invention has been made in view of such circumstances, and the object of the present invention is to provide a system for depicting a system, a stalking device, and a method for drawing and drawing a plurality of devices. In the continuation/processing unit, the drawing process is performed in parallel with other processes using light from a single light source, and the efficiency is improved. In order to solve the above problems, the invention of the book is a depiction system, and the invention is based on the fact that the operation rate of the Aray shot and the substrate are solved. A drawing device for drawing a specific pattern on a photosensitive material formed on a substrate I30516.doc 200910015 by irradiating light onto a substrate, and comprising: a light source; the distributing device dividing the light emitted from the light source into a plurality of Dividing light and distributing the plurality of divided lights to a plurality of optical paths; and a plurality of the drawing devices respectively disposed in the plurality of optical paths _; wherein the plurality of divided lights comprise i beams having higher light intensities than other divided lights The dividing light is drawn, and the distribution device sequentially distributes the divided light for the shaking into the plurality of optical paths. The invention of claim 2 is the drawing system of claim 1, wherein each of the plurality of finder devices has a correction mechanism for correcting an illumination state of the light to the substrate by using the split light other than the financial division light. The invention of claim 3 is a drawing system comprising: a green device for drawing a specific pattern on a photosensitive material formed on a substrate by irradiating light onto a substrate, and comprising: a light source; The device divides the light emitted from the light source into the W-cut light having a high light intensity and the second split light having a low light intensity, and distributes the divided light and the second split light into the two optical paths. And two of the above-described edge devices are disposed on the two optical paths, and the distribution device alternately distributes the divided light and the second divided light to the two optical paths. The invention of claim 4 is the green system of claim 3, wherein the two drawing devices alternately perform drawing processing, and the distributing device supplies the i-th drawing to the drawing device that performs the edge processing on the two drawing devices The method of dividing the light 'distributes the first divided light and the second divided light to the two optical paths. The invention of claim 5 is the drawing system of claim 4, wherein each of the two 130516.doc 200910015 drawing devices has a correcting mechanism </ RTI> which uses the second split light to correct the illumination state of the light to the substrate. The invention of claim 6, wherein the distribution device of any one of claim 3 to claim 5 includes: a light division unit that divides light emitted from the light source into orthogonal to the optical axis and The first divided light and the second divided light that advance in opposite directions, and a rotating mechanism that rotates the light dividing unit around the optical axis.

°月求項7之發明係如請求項3至請求項5中任一項之描繪 系統’其中上述分配裝置包含:帛ι局部透射鏡,其係將 =度相當於上述^分割光之光反射,並且使光強度相 當於上述第2分割光之光透射;第2局部透射鏡,其係使光 強度相當於上述第卜分割光之光透射,並且將光強度相當 於^述第2分割光之光反射;及配置機構,其係將上述第】 局4透射鏡及上述第2局冑透射鏡選擇性配置於自上述光 源射出之光之光路上。 «月求項8之發明係一種描繪裝置,其特徵在於:其係藉 由對基板照射光而於形成於基板上之感光材料上描緣特定 圖案者’且包括:光源;分配機構,其係將自上述光源射 出之光分割為複數個分割光,並謂上述複數個分割光分 配至複數個光路中;及複數個描繪處理部,其係分別配置 於上述複數光路上;上述複數個分割光包含光強度高於盆 他分割光之丨束騎用分割光,上述分配機構將上述描緣 用分割光依次分配至上述複數個光路令。 其特徵在於:其係藉 請求項9之發明係一種描繪裝置 130516.doc 200910015 由對基板照射光而於形忐於装此u u a成於基板上之感光材料上描繪特定 圖案者,且包括:光源;分配機盖 刀配機構,其係將自上述光源射 出之光分割為光強度較客夕# ,人*丨,^ * X校円之第1分割光與光強度較低之第2 分割光,並且將上述第1分宝1丨# 心矛1刀割先及上述第2分割光分配至2 條光路中;及2個描緣處理部,其係分別配置於上❸條光 路上;上述分配機構將上述第!分割光及上述第2分割光交 替分配至上述2條光路中。 請求項H)之發明係-種騎方法,其特徵在於:於複數 個描緣處理部中依次進行描緣處理,該描搶處理係藉由對 基板照射1而於形成於基板上之感&amp;材料上描繪特定圖 案;且包括:分割步驟,其係將自特定光源射出之光分割 為稷數個分割光;及分配步驟,其係將上述複數個分割光 分配至上述複數個描繪處理部中;力丨述分配步驟,將上 述描緣用分割光中光強度高於其他分割光^束描繪用分 割光依次分配至上述複數個描繪處理部中。 [發明之效果] 根據如請求項丨〜2之發明,描繪系統將自光源射出之光 束分割為複數個分割光,並將光強度高於其他分割光之描 繪用分割光依次分配至複數個描繪裝置中。因此,可一面 於複數個描繪裝置令依次進行使用描繪用分割光之描繪處 理,一面於其他描繪裝置中並行實施使用其他分割光之處 理。藉此,可提高光源之運轉率及基板之製造效率。 尤其,根據如請求項2之發明,描繪裝置使用描繪用分 割光以外之分割光來修正光對基板之照射狀態。因此,可 I305l6.doc •10- 200910015 與1台描緣裝置令之描緣處理並行地於其他 施修正光照射狀態之處理。 、 令實 之二!=求項3〜7之發明,系統將自光源射出 第2分:光替光與第2分割光,並將第1分割光及 置:分配至2台描㈣置,。因此,可於兩台描 續裝置中’交替地並行實 你田曾〇、 仃使用弟1分割光之描繪處理與 割光之其他處理。藉此,可提高光源之運轉率 及基板之製造效率。 手 尤其,根據如請求項4之發明,分配裝置以對上述2台描 繪裝置中進行騎處理之描緣裝置提供^分割光之方 被分配第1分割光與第2分割光。因此,可根據描繪處理 之時序,適當分配分割光。 尤其’根據如請求項5之發明,描緣裝置使用第2分割光 來修正光對基板之照射狀態。因此,可與i台描繪裝置中 之描繪處理並行地於苴#始洽姑 之處理。 肩、,·曰裝置中實施修正光照射狀態 尤其,根據如請求項6之發明,分配裝置具備光分割 部’將自光源射出之光束分割為相對該光軸正交且相互反 向前進之上述第1分割光與上述第2分割光;及轉動機構, 使先分割部以光抽為中心進行轉動。因此,可適當且容易 地將第!分割光與第2分割光分配至2條光路中。 尤其’根據如請求項7之發明,分配裝置具備:第!局部 透射鏡’將光強度相當於第1分割光之光束反射,並且使 光強度相當於第2分割光之光束透射;第2局部透射鏡,使 130516.doc 200910015 先強度相當於第1分割光之光束透射,並且將光強度相各 ==之光束反射;及配置機構’將第1局部透㈣ 及第2局錢射鏡選擇性配置於自上述光源射出之光束之 光路上因此,可適當且容易地將第i分割光與第2分 分配至2條光路中。 ° &amp; 根據如請求項8之發明’描㈣置將自光源射出之 先束分割為複數個分割光,並將光強度高於其他分割光之 描繪用分割光依次分配至複數個描緣處理部中。因此,可 一面於複數個描繪處理部中依次進行㈣描繪时割光之 描緣處理’―面於其他描繪處理部中並行實施使用其他分 割先之處理。藉此’可提高光源之運轉率及基板之製造效 又’根據如請求項9之發明,描繪裝置將自光源射出之 光束分割為第i分割光與第2分割光,並將第!分割光及第2 分割光交替分配至2個描繪處理部中。因此,可於2個描緣 處理部令,交替地並行實施使用第i分割光之描繪處理與 使用弟2分割光之其他處理。藉此,可提高光源之運轉率 及基板之製造效率。 根據如請求項1G之發明,騎方法將自光源射出之 先束分割為複數個分割光’並將光強度高於其他分巧光之 1束描緣用分割光依次分配至錢個騎處理部中。因 1可-面於複數個描繪處理部中依次進行使用描緣用分 繪處理,-面於其他描綠處理部中並行實施使用 其他刀割光之處理。藉此,可提高光源之運轉率及基板之 130516.doc -12· 200910015 製造效率。 【實施方式】 以下就本發明之較佳實施方式,參照圖式進行說明。 &lt;1 _描繪裝置之構成&gt;The invention of claim 7 is the drawing system of any one of claim 3 to claim 5 wherein the above-mentioned dispensing device comprises: 帛ι partial transmission mirror, which is a degree equivalent to the light reflection of the above-mentioned divided light And the light intensity corresponds to the transmission of the light of the second divided light, and the second partial transmission mirror transmits the light intensity to the light of the second divided light, and the light intensity corresponds to the second divided light. The light reflection and the arrangement mechanism selectively dispose the first-stage 4th transmission mirror and the second in-situ transmission mirror on the optical path of the light emitted from the light source. The invention of the present invention is characterized in that it is a method for drawing a specific pattern on a photosensitive material formed on a substrate by irradiating light onto a substrate, and includes: a light source; a distribution mechanism, Dividing the light emitted from the light source into a plurality of divided lights, wherein the plurality of divided lights are distributed to the plurality of optical paths; and a plurality of drawing processing units respectively disposed on the plurality of optical paths; and the plurality of divided lights The splitting light includes a bundled riding light having a light intensity higher than that of the pitted light, and the distributing means sequentially distributes the divided light for the drawing to the plurality of optical path commands. The invention is characterized in that: the invention of claim 9 is a drawing device 130516.doc 200910015, which is characterized in that a specific pattern is drawn on a photosensitive material which is formed on the substrate by irradiating light onto the substrate, and includes: a light source The distribution cover knife-distributing mechanism divides the light emitted from the light source into a light intensity of the guest eve #, person *丨, ^ * X, the first split light and the second split light having a lower light intensity And assigning the first splitter 1丨# heart spear 1 knife and the second split light to the 2 optical paths; and the two edge processing units respectively disposed on the upper beam optical path; The distribution unit alternately distributes the first divided light and the second divided light to the two optical paths. The invention of claim H) is characterized in that the edge processing is sequentially performed in a plurality of edge processing units, and the image processing is performed on the substrate by irradiating the substrate 1 Depicting a specific pattern on the material; and comprising: a dividing step of dividing the light emitted from the specific light source into a plurality of divided lights; and an assigning step of allocating the plurality of divided lights to the plurality of drawing processing units In the above-described plurality of drawing processing units, the light intensity in the divided light for the above-described stroke is higher than the divided light for drawing the other divided light beams. [Effects of the Invention] According to the invention of claim 2, the drawing system divides the light beam emitted from the light source into a plurality of divided lights, and sequentially distributes the divided light having a higher light intensity than the other divided lights to a plurality of depictions. In the device. Therefore, it is possible to sequentially perform the drawing processing using the divided light for drawing while using a plurality of drawing devices, and to use other divided light paths in parallel with other drawing devices. Thereby, the operation rate of the light source and the manufacturing efficiency of the substrate can be improved. In particular, according to the invention of claim 2, the drawing device corrects the illumination state of the light to the substrate by using the split light other than the splitting light for drawing. Therefore, I305l6.doc •10- 200910015 can be processed in parallel with other trimming devices to perform the correction light irradiation state. , the real two! = The invention of claims 3 to 7, the system will emit from the light source. The second point: the light for the light and the second split light, and the first split light and the set: are assigned to two (four) sets. Therefore, it is possible to alternately perform parallel processing of the drawing process and the other processing of the cut light by the two brothers in the two sculpt devices. Thereby, the operation rate of the light source and the manufacturing efficiency of the substrate can be improved. In particular, according to the invention of claim 4, the distribution device distributes the first divided light and the second divided light by providing the dividing device for the riding device in the two drawing devices. Therefore, the split light can be appropriately allocated according to the timing of the drawing process. In particular, according to the invention of claim 5, the striking device corrects the illumination state of the light to the substrate by using the second split light. Therefore, the processing can be started in parallel with the drawing processing in the i-picture drawing device. In particular, according to the invention of claim 6, the distribution device includes a light dividing unit that divides the light beam emitted from the light source into orthogonal to the optical axis and advances in opposite directions to each other. The first divided light and the second divided light; and the rotating mechanism rotates the first divided portion around the light extraction. Therefore, the first divided light and the second divided light can be appropriately and easily distributed to the two optical paths. In particular, according to the invention of claim 7, the distribution device is provided with: The partial transmission mirror 'reflects the light intensity corresponding to the first split light beam, and the light intensity corresponds to the second split light beam transmission; and the second partial transmission mirror makes the 130516.doc 200910015 first intensity equivalent to the first split light The light beam is transmitted, and the light beams of the light intensity phase == are reflected; and the arrangement mechanism 'selects the first partial through (four) and the second local light mirror selectively on the optical path of the light beam emitted from the light source, thereby being appropriate And the ith division light and the second division are easily distributed to the two optical paths. ° & According to the invention of claim 8, the first beam emitted from the light source is divided into a plurality of divided lights, and the divided light whose light intensity is higher than that of the other divided lights is sequentially distributed to a plurality of stroke processing. In the ministry. Therefore, in the plurality of drawing processing units, the processing of cutting the light during the drawing (4) can be sequentially performed in the other drawing processing units in parallel with the other cutting processing. According to the invention of claim 9, the drawing device divides the light beam emitted from the light source into the i-th split light and the second split light, and the first! The divided light and the second divided light are alternately distributed to the two drawing processing units. Therefore, the other processing using the i-th split light drawing process and the younger two-divided light can be alternately performed in parallel in the two edge processing sections. Thereby, the operation rate of the light source and the manufacturing efficiency of the substrate can be improved. According to the invention of claim 1G, the riding method divides the first beam from the light source into a plurality of divided lights' and distributes the light beams with the light intensity higher than the other beams of light to the riding processing unit in turn. in. In the plurality of drawing processing units, the drawing processing using the drawing is sequentially performed, and the processing using the other knife cutting light is performed in parallel in the other green processing units. Thereby, the operating rate of the light source and the manufacturing efficiency of the substrate can be improved. [Embodiment] Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. &lt;1 _Drawing device configuration&gt;

圖1及圖2係本發明一實施方式之構成描繪系統1〇〇之局 部之描繪裝置1的側視圖及俯視圖。此描繪裝置丨係於製造 液晶顯示裝置之彩色濾光片步驟中,於彩色濾光片用玻璃 基板(以下簡稱&quot;基板&quot;)9之上表面描繪特定圖案之裝置。如 圖1及圖2所示,描繪裝置丨主要具備:用以保持基板9之平 台1〇、連結於平台1〇之平台驅動部2〇、將由光源供給之脈 衝光導入至裝置内之照明光學系統3〇、朝向基板9之上表 面照射脈衝光之照射頭40、拍攝照射頭4〇之攝影部5〇、及 控制裝置内各部分之裝置控制器6〇。 平台10係具有平板狀外形,並用於以水平姿勢將基板9 載置保持於其上表面之保持部。於作為處理對象之基板9 之上表面,預先塗佈形成著光阻劑等感光材料。於平台1〇 之上表面形成有複數個吸孔(圖示省略)。因此,於平台⑺ 上載置基板9時,藉由吸孔之吸引壓力,基板9得以固定地 保持於平台10上表面。 平台驅動部2 0係使平台〗〇沿主掃描方向(γ軸方向)、副 掃描方向(X軸方向)及旋轉方向(圍繞ζ軸之旋轉方向)移動 之機構。平台驅動部20具備:使平台1〇旋轉之旋轉機構 21、支持平台1〇能夠旋轉之支持板22、使支持板Μ沿副掃 描方向移動之副掃&amp;機構23、經由副掃描機仙支持該支 130516.doc -13· 200910015 持板22之底板24、使底板24沿主掃描方向移動之主掃描機 構25 〇 方疋轉機構21具備線性馬達21a,該線性馬達21a包括安裝 於平台1 0之-Y側端部之移動件與敷設於支持板22上表面之 固疋件。又,平台10之中央部下表面側與支持板22之間設 置有旋轉軸21b。因此,若使線性馬達21a動作,則移動件 沿固定件朝向X軸方向移動,平台10以支持板22上之旋轉 軸21b為中心在特定角度範圍内旋轉。 副掃描機構23具備線性馬達23a,該線性馬達23a包括安 裝於支持板22下表面側之移動件與敷設於底板24上表面之 固定件。又,於支持板22與底板24之間設置有沿副掃描方 向延長之一對導向部23b。因此’若使線性馬達23a動作, 則支持板22沿底板24上之導向部23b向副掃描方向移動。 主柃描機構25具備線性馬達25a,其由安裝於底板24底 面之移動件與敷設於本裝置丨之基台7〇上之固定件構成。 又,底板24與基台70之間設置有延長於主掃描方向上之一 對導向部25b ^因此,若使線性馬達25a動作,則底板以沿 基口 70上之導向部25 b朝向主掃描方向移動。 照明光學系統30係用以將自下述雷射振盪器11〇射出並 經由下述光分配單元丨2〇供給之脈衝光導入至照射頭4〇之 光學系統。於照明光學系統30内部配置有:將入射光分割 為光量相等之複數束脈衝光之分光器、用以調節經分割之 各脈衝光之光強度之衰減器、及使各脈衝光之光強度分布 均勻之均化器等。 130516.doc 14- 200910015 複數個照射頭40係一面使透過照明光學系統3〇之脈衝光 成形為特定圖案光束,一面將該圖案光束照射至保持於平 台10上之基板9之上表面上之機構。複數個照射頭4〇以橫 跨平台10及平台驅動部20之方式固定於架設在基台70上之 框架80。 如圖1所示,於各照射頭4〇内部設置有光圈單元41與投 影光學系統42。光圈單元41具備:形成有特定遮蔽圖案之 作為玻璃板的光圏41a及支持光圈41a之支持部41b。又, 投影光學系統42具備:變焦鏡頭42a、42b,聚焦鏡42c、 42d等。導入至照射頭4〇中之脈衝光透過由支持部^^支持 之光圈41a時被局部遮蔽,並以成形為特定圖案形狀之圖 案光而向下方照射。又,透過光圈41a之脈衝光藉由投影 光學系統42之變焦鏡頭42a、42b及聚焦鏡42〇、42d而使投 衫倍率及焦點得以調節’調節後之脈衝光照射至基板9之 上表面。 於光圈單兀41之支持部41b連接有驅動機構4ic。若使驅 動機構41c動作,則支持部41b及支持部41b上之光圈41&amp;沿 主掃描方向、副掃描方向及旋轉方向移動。藉此,光圈單 凡41可選擇需要投影之圖案,或者調節圖案之投影位置。 再者,圖1中為了便於圖示,而將驅動機構41c概念化表 不,實際上,驅動機構41〇藉由使用線性馬達等之機構實 現,且固定於框架80。 於變焦鏡頭42a ' 42b連接有使變焦鏡頭42a、42b之高度 單獨變化之驅動機構42e、42f。若使驅動機構426、4訂動 130516.doc •15- 200910015 作,則變焦鏡頭42a、42b之高度改變,藉此可調節投影於 基板9上表面之圖案倍率。又,聚焦鏡42c ' 42^連接有使 其等沿主掃描方向整體移位之驅動機構42g。若使驅動機 構42g動作,則會因聚焦鏡42〇、42d之位置改變,而使光 路長度變化,使脈衝光之焦點位置得以調節。再者,圖^ 令為了便於圖示,而將驅動機構42e〜42g概念化表示,實 際上,驅動機構42e〜42g藉由使用馬達與滾珠螺桿之機構 等實現,且均固定於框架8〇。Fig. 1 and Fig. 2 are a side view and a plan view of a drawing device 1 constituting a drawing system 1 according to an embodiment of the present invention. This drawing device is a device for drawing a specific pattern on the surface of a color filter glass substrate (hereinafter referred to as &quot;substrate&quot;) 9 in the color filter step of manufacturing a liquid crystal display device. As shown in FIGS. 1 and 2, the drawing device 丨 mainly includes a stage 1A for holding the substrate 9, a platform driving unit 2〇 connected to the stage 1〇, and illumination light for introducing pulsed light supplied from the light source into the device. The system 3A, the irradiation head 40 that irradiates the pulsed light toward the upper surface of the substrate 9, the imaging unit 5 that photographs the irradiation head 4, and the device controller 6A that controls each part in the apparatus. The platform 10 has a flat outer shape and is used to hold the substrate 9 on the upper surface thereof in a horizontal posture. A photosensitive material such as a photoresist is applied in advance to the upper surface of the substrate 9 to be processed. A plurality of suction holes (not shown) are formed on the upper surface of the platform 1A. Therefore, when the substrate 9 is placed on the stage (7), the substrate 9 is fixedly held on the upper surface of the stage 10 by the suction pressure of the suction holes. The stage drive unit 20 is a mechanism for moving the stage in the main scanning direction (γ-axis direction), the sub-scanning direction (X-axis direction), and the rotation direction (rotation direction around the x-axis). The platform drive unit 20 includes a rotation mechanism 21 that rotates the platform 1 , a support plate 22 that can support the rotation of the support plate 1 , a sub-sweeping mechanism 23 that moves the support plate Μ in the sub-scanning direction, and a sub-scanner support. The base plate 24 of the holding plate 22 and the main scanning mechanism 25 for moving the bottom plate 24 in the main scanning direction are provided with a linear motor 21a, which is mounted on the platform 10 The moving member of the Y-side end portion and the fixing member attached to the upper surface of the support plate 22. Further, a rotating shaft 21b is provided between the lower surface side of the central portion of the stage 10 and the support plate 22. Therefore, when the linear motor 21a is operated, the moving member moves in the X-axis direction along the fixing member, and the stage 10 rotates within a specific angle range around the rotating shaft 21b on the supporting plate 22. The sub-scanning mechanism 23 is provided with a linear motor 23a including a moving member mounted on the lower surface side of the support plate 22 and a fixing member attached to the upper surface of the bottom plate 24. Further, a pair of guide portions 23b extending in the sub-scanning direction is provided between the support plate 22 and the bottom plate 24. Therefore, when the linear motor 23a is operated, the support plate 22 moves in the sub-scanning direction along the guide portion 23b on the bottom plate 24. The main scanning mechanism 25 is provided with a linear motor 25a which is constituted by a moving member attached to the bottom surface of the bottom plate 24 and a fixing member which is laid on the base 7 of the apparatus. Further, between the bottom plate 24 and the base 70, a pair of guide portions 25b extending in the main scanning direction are provided. Therefore, when the linear motor 25a is operated, the bottom plate faces the main scanning portion along the guide portion 25b on the base port 70. Move in direction. The illumination optical system 30 is for introducing the pulse light supplied from the laser oscillator 11 described below and supplied through the light distribution unit 丨2 下述 to the optical system of the illumination head 4A. Inside the illumination optical system 30, a spectroscope that divides incident light into a plurality of bundles of pulsed light having an equal amount of light, an attenuator for adjusting the intensity of the divided pulsed light, and a light intensity distribution of each pulsed light are disposed. Even homogenizer and so on. 130516.doc 14- 200910015 A plurality of illumination heads 40 are mechanisms for irradiating the pulsed light transmitted through the illumination optical system 3 into a specific pattern beam while irradiating the pattern beam onto the upper surface of the substrate 9 held on the stage 10. . A plurality of illumination heads 4 are fixed to the frame 80 mounted on the base 70 so as to straddle the platform 10 and the platform drive unit 20. As shown in Fig. 1, a diaphragm unit 41 and a projection optical system 42 are provided inside each of the illumination heads 4''. The diaphragm unit 41 includes a diaphragm 41a as a glass plate and a support portion 41b that supports the diaphragm 41a, in which a specific shielding pattern is formed. Further, the projection optical system 42 includes zoom lenses 42a and 42b, focusing mirrors 42c and 42d, and the like. The pulse light introduced into the illumination head 4 is partially shielded when it passes through the aperture 41a supported by the support portion, and is irradiated downward by the pattern light formed into a specific pattern shape. Further, the pulse light transmitted through the diaphragm 41a is adjusted by the zoom lenses 42a and 42b of the projection optical system 42 and the focusing mirrors 42A and 42d, and the adjusted pulse light is irradiated onto the upper surface of the substrate 9. A drive mechanism 4ic is connected to the support portion 41b of the aperture unit 41. When the driving mechanism 41c is operated, the diaphragm 41&amp; on the support portion 41b and the support portion 41b moves in the main scanning direction, the sub-scanning direction, and the rotation direction. Thereby, the aperture unit 41 can select a pattern to be projected, or adjust the projection position of the pattern. Further, in Fig. 1, the drive mechanism 41c is conceptually shown for convenience of illustration. Actually, the drive mechanism 41 is realized by a mechanism such as a linear motor and is fixed to the frame 80. Drive mechanisms 42e and 42f for individually changing the heights of the zoom lenses 42a and 42b are connected to the zoom lens 42a'42b. When the drive mechanisms 426, 4 are engaged 130516.doc • 15 - 200910015, the heights of the zoom lenses 42a, 42b are changed, whereby the pattern magnification projected on the upper surface of the substrate 9 can be adjusted. Further, the focus mirror 42c' 42 is connected to a drive mechanism 42g for shifting the same in the main scanning direction as a whole. When the driving mechanism 42g is operated, the optical path length is changed by the position of the focusing mirrors 42A and 42d, and the focus position of the pulse light is adjusted. Further, in order to facilitate the illustration, the drive mechanisms 42e to 42g are conceptually shown. Actually, the drive mechanisms 42e to 42g are realized by a mechanism using a motor and a ball screw, and are fixed to the frame 8A.

複數個照射頭40沿副掃描方向等間隔地(例如以2〇〇爪爪 之間隔)排列。若-面使平台1G沿主掃描方向移動,一面 由各照射頭40間斷性照射脈衝光,則於基板9之上表面, 可描繪複數個經間斷性曝光之特定寬度(例如5〇瓜瓜之寬 度)的圖案群。料裝置冰沿轉描方向之—次描緣結束 時,使平台10沿副掃描方向僅移動相對於照射頭4〇之照射 寬度之量後’-面使平台1G再次沿主掃描方向移動,一面 由各照射頭40間斷性照射脈衝光。藉此,描繪裝置^ 一面 以照射頭40之照射寬度為單位使基板9沿副掃描方向錯 開’-面將沿主掃描方向之圖案描㈣複特定次數(例如4 次),藉此於基板9之整個面上形成彩色滤光片用之規則性 攝影部50料敎與脈衝光之照射狀態、相關之各種參數 而拍攝由各照射頭40照射之脈衝光的機構。攝影部叫 備·拍攝脈衝光之攝影機5丨、及使摄 汉便攝衫機51沿副掃描方向 移動之移動機構52。移動機構52且 八悚/〇衂知描方向敷設於 130516.doc -16- 200910015 底板24之+Y側侧邊之導軌52a,並利用線性馬達等之驅動 力,使攝影機51沿導轨52a移動。攝影_由例如 CCD㈣arge coupled device ’電荷輕合裝置)攝影機構成, 並設置為其視角面朝向上方。The plurality of illumination heads 40 are arranged at equal intervals in the sub-scanning direction (e.g., at intervals of two jaws). If the surface 1G is moved in the main scanning direction and the pulse light is intermittently irradiated by the respective illumination heads 40, a plurality of intermittently exposed specific widths can be drawn on the upper surface of the substrate 9 (for example, 5 〇 瓜 瓜Width) pattern group. When the ice of the material device is in the direction of the scanning, at the end of the secondary stroke, the platform 10 is moved only in the sub-scanning direction by the amount of the irradiation width of the irradiation head 4〇, and the surface 1G is moved again in the main scanning direction. The pulse light is intermittently irradiated by each of the irradiation heads 40. Thereby, the drawing device is configured such that the substrate 9 is shifted by the '-plane in the sub-scanning direction with respect to the irradiation width of the irradiation head 40, and the pattern in the main scanning direction is read (four times) a specific number of times (for example, four times), whereby the substrate 9 is formed. The entire surface is formed with a mechanism for photographing the pulsed light irradiated by each of the irradiation heads 40 by the regular imaging unit 50 for the color filter and the irradiation state of the pulsed light and various parameters. The photographing unit is called a camera that shoots a pulsed light, and a moving mechanism 52 that moves the photographing machine 51 in the sub-scanning direction. The moving mechanism 52 is disposed on the guide rail 52a of the +Y side of the bottom plate 24 of the 130516.doc -16-200910015, and the camera 51 is moved along the guide rail 52a by the driving force of the linear motor or the like. . The photographing_ is constituted by, for example, a CCD (array coupled device 'charge coupled device) camera, and is set such that its viewing angle faces upward.

藉由攝影部50進行拍攝時,首先,以攝㈣51位於照射 頭40下方之方式’使平台1〇沿主掃描方向移動(圖^及圖2 之狀態)。繼而’藉由使移動機構52動作,而—面使攝影 機51沿導軌52a朝向副掃描方向移動,一面由各照射頭4〇 照射脈衝光,並由攝影機51拍攝經照射之脈衝光。又,攝 影部50將攝影機51之拍攝結果傳送至裝置控制器6〇。 圖3係表示藉由攝影機51拍攝之脈衝光之光強度分布之 不例的圖。圖3之橫軸表示副掃描方向之位置,圖3之縱軸 表示光強度。裝置控制請對攝影㈣中取得之拍攝結果 進行解析,取得光源之雷射功率(所有脈衝光之光強度之 乘積值)、脈衝光整體於副掃描方向上之寬度(圖3中之 XI)、各脈衝光之光強度之變化量(圖3中之yi〜y7之變化 量)、各脈衝光之邊唾寬度(圖3中之△】〜△?)、及脈衝光之 絕對位置(圖3中之xa)等資訊。 裝置控制器60係控制裝置内各部分動作之處理部。圖4 係表示描繪裝置!中上述各部分與裝置控制器6〇間之連接 構成的方塊圖。如圖4所示,裝置控制器6〇與上述線性馬 達21a、23a、25a、驅動機構仏、42e、42f、,、攝影機 51及移動機構52電性連接,以控制其等之動作。裝置控制 器60包括例如具有CPU(Central prGeessing咖,中央處理 130516.doc 200910015 單元)及記憶體之電腦, 葙十, 藉由電腦按照安裝於電腦中之 紅式及各種指令輸入進扞 、冤腩中之 制》 而對上述各部分進行控 &gt; &lt;2.描繪系統之構成 圖5係表示本發明—奮絲士 a 貫知方式之描繪系統100之椹占糾 圖。如圖5所示,描繪系統工 構成的 1描繪裝置la及第泠# 要八備· 2台描繪裝置(第 衣1 ia及弟2拖繪裝置lb △ 光分配單元12〇。第旧… 口田射振盧器110、及 與上述描緣裝㈣同之構:广及第2描緣裝置1b均具有 ::==:1一…1- 雷射振盪器110連接有雷射控制器 111。又,雷射控制器u i盥 /、第1描繪裝置la及第2描繪裝置 lb之各裝置控制器6〇連 W 要雷射控制器111與各裝置控制 器60進行通信,根據各描 対田、、會裝置la、lb之處理進行狀態而 對雷射振盈器110傳輪驅動信號,藉此使雷射《器U0射 出脈衝光。自雷射振盈器11〇中射出之脈衝光,射入至光 分配單元120中。 。光分配單元U0係如下光學單元,其用以將自雷射振盪 :中射出之脈衝光分割為主脈衝光與副脈衝光,並將 經分割之各脈衝光分配至朝向第i描緣裝置1&amp;與第2描繪裝 置lb之2條光路上。圖6伤矣;业八 園係表不先分配皁元120之概略立體 圖。又,圖7及圖8係表示光分配單元12〇之内部構成的剖 面圖。如圖6〜圖8所示,弁公 元刀配早兀12〇具備能夠以入射光 軸A為中心轉動之框架121。 130516.doc -18- 200910015 框架121中具備:將自雷射振盪器11〇射出之脈衝光截取 至框架121内部之射入部121a、將分割後之主脈衝光射出 至框架121外部之主脈衝光射出窗mb、及將分割後之副 脈衝光射出至框架121外部之副脈衝光射出窗121c。主脈 衝光射出窗121b與副脈衝光射出窗12lc經由入射光軸A而 相互形成於框架121之相反側之壁面上。 如圖7及圖8所示,於框架121内部配置著局部反射鏡122 及3塊反射鏡123〜125。局部反射鏡122及3塊反射鏡 123〜125均藉由螺母等而相對框架m固定。局部反射鏡 122將經射入之脈衝光一部分(例如9〇%)反射,使餘下部分 (例如10%)透射。局部反射鏡122中經反射之光束,作為光 強度相對較高之主脈衝光,自主脈衝光射出窗121b朝向框 架121外部射出。另一方面,透過局部反射鏡122之光束, 於反射鏡123、124、125中依次反射後,作為光強度相對 較低之副脈衝光自副脈衝光射出窗121(;朝向框架121外部 射出。 光分配單元120具有使框架121以入射光軸a為中心轉動 之圓環馬達126。作為圓環馬達126可使用例如利用超音波 振動使馬達旋轉之超音波馬達。圓環馬達126與馬達控制 器126a電)生連接。若自馬達控制器uga向圓環馬達丨26傳 輸驅動信號,則圓環馬達126動作,使框架121以入射光軸 A為中心轉動。藉此,可將對第丨描繪裝置“提供主脈衝光 並對第2描繪裝ilb提供副脈衝光之狀態(圖7之狀態,以 下稱為&quot;第1狀態&quot;)與對第丨描繪裝置u提供副脈衝光並對第 130516.doc -19- 200910015 2描繪裝置1 b提供主脈衝光之狀態(圖8之狀態,以下稱為&quot; 第2狀態&quot;)進行切換。 又’光分配單元12〇具備用以檢測框架121之轉動姿勢的 檢測感應器127。檢測感應器127藉由檢測框架121之特定 部位’來檢測框架121為第1狀態及第2狀態中之何種狀 態。檢測感應器127可使用例如光學式非接觸感應器構 成。 如圖5所示’馬達控制器126a及檢測感應器127分別連接 於共用之分配控制器128。分配控制器128基於自檢測感應 益127中所接收之檢測信號,控制馬達控制器126a。藉 此,可使圓環馬達126以適當角度動作,故可將框架121之 轉動姿勢控制為預期狀態(第1狀態或第2狀態)。又,分配 控制器128與第1描繪裝置la及第2描繪裝置1]3之各裝置控 制器60連接。分配控制器128與各裝置控制器的進行通 信,根據各描繪裝置la、lb之處理進行狀態來控制框架 之轉動姿勢。 &lt;3.描繪系統之動作&gt; 繼而,參照圖9之流程圖對描緣系統1〇〇之動作流程進行 說明。再者’以下說明之動作藉由分配控制器128、馬達 控制器126a、雷射控制器⑴及騎裝置u、^各裝置 控制盗6 0 —面相互聯動個銘批也丨n主广 助调即控制時序,一面控制各部分 作而進行。 描%系統10 0首先藉士 乂由圓E 土 错由使圓%馬達126動作來轉動框架 121,使光分配單元12〇臭笛土 Μ '、 υ馮第2狀態(步驟SA1)。即,描繪系 130516.doc -20- 200910015 、克,成為如下狀態:自光分配單元120對第1描繪裝置!a 照射光強度相對較低之副脈衝光,自光分配單元120對第2 描繪裝置1 b照射光強度相對較高之主脈衝光。 ,其次,描繪系統100於第丨描繪裝置1&amp;中進行使用副脈衝 光之校正處理(自複數個照射頭4〇照射之脈衝光的修正處 理)(步驟SB1)。對第i描緣裝置la照射之副脈衝光於照明光 學系統3 0中分割為複數束後,經由各照射頭40向下方照 射。第1描繪裝置13—面於複數個照射頭4〇之下方使攝^ 機51 副掃描方向移動,—面由攝影機$ !拍攝來自各照射 頭40之照射光。 又第1描繪裝置1a之裝置控制器60對取自攝影機51中 之拍攝結果進行分析,獲取副脈衝光之雷射功率、照射寬 度光強度之變化量、邊陲量、及照射光之絕對位置等資 訊。繼而,裝置控制器60控制驅動機構4U、42e、42f、 42g,以使此等參數各自接近目標值。藉此,可修正由複 數個照射頭40照射之脈衝光的照射狀態。 第1描繪裝置la中校正處理結束後,其次,描繪系統1〇〇 將作為處理對象之基板9搬入第丨描繪裝置1&amp;中(步驟 SB2)。具體而言,第!描繪裝置la藉由特定之搬運機構(圖 示省略)將基板9載置於平台10之上表面,並將基板9吸附 固定於平台10之上表面。又,第丨描繪裝置&amp;藉由使平台 驅動部20動作,來進行基板9之位置及傾斜度之調節(對 準)。 繼而,描繪系統100藉由使圓環馬達126動作而轉動框架 130516.doc 21 200910015 121,使光分配單元12〇為第1狀態(步驟SA2)。即,描繪系 統100成為如下狀態:自光分配單元120對第1描繪裝置la 照射光強度相對較高之主脈衝光,並自光分配單元i2〇對 第2描繪裝置ib照射光強度相對較低之副脈衝光。When photographing is performed by the photographing unit 50, first, the stage 1 is moved in the main scanning direction so that the photographing (four) 51 is positioned below the irradiation head 40 (the state of Fig. 2 and Fig. 2). Then, by moving the moving mechanism 52, the camera 51 is moved in the sub-scanning direction along the guide rail 52a, and the pulsed light is irradiated by the respective irradiation heads 4, and the irradiated pulsed light is imaged by the camera 51. Further, the photographing unit 50 transmits the photographing result of the camera 51 to the device controller 6A. Fig. 3 is a view showing an example of the light intensity distribution of the pulsed light taken by the camera 51. The horizontal axis of Fig. 3 indicates the position in the sub-scanning direction, and the vertical axis of Fig. 3 indicates the light intensity. Device control Please analyze the shooting results obtained in photography (4) to obtain the laser power of the light source (the product of the light intensity of all pulsed light) and the width of the pulse light as a whole in the sub-scanning direction (XI in Figure 3). The amount of change in the light intensity of each pulsed light (the amount of change of yi to y7 in Fig. 3), the width of the saliva of each pulsed light (Δ in Fig. 3) to Δ?, and the absolute position of the pulsed light (Fig. 3) In the xa) and other information. The device controller 60 is a processing unit that controls the operation of each part in the device. Figure 4 shows the depiction device! A block diagram of the connection between the above components and the device controller 6. As shown in Fig. 4, the device controller 6 is electrically connected to the linear motors 21a, 23a, 25a, the drive mechanisms 仏, 42e, 42f, the camera 51, and the moving mechanism 52 to control the operations thereof. The device controller 60 includes, for example, a computer having a CPU (Central prGeessing coffee, central processing 130516.doc 200910015 unit) and a memory, which is input by the computer according to the red type and various commands installed in the computer. In the case of the above system, the above-mentioned parts are controlled. &lt;2. Composition of the drawing system Fig. 5 shows the entanglement of the drawing system 100 of the present invention. As shown in Fig. 5, the drawing device 1 and the 泠# of the system configuration are depicted. (8) and 2 drawing devices (1st ia and 2nd drawing device lb △ light distribution unit 12〇. The old... The laser illuminator 110 and the above-described ribbing device (4) have the same structure: the wide and the second finder device 1b each have::==:1 - 1 - The laser oscillator 110 is connected to the laser controller 111. Further, the laser controller ui盥/, the first drawing device 1a, and the device controller 6 of the second drawing device 1b are connected to the laser controller 111 to communicate with each device controller 60, and according to each drawing field The processing of the devices la, lb is performed to transmit the driving signal to the laser oscillator 110, thereby causing the laser "U0 to emit pulsed light. The pulsed light emitted from the laser oscillator 11", The light distribution unit U0 is an optical unit for dividing the pulse light emitted from the laser oscillation into the main pulse light and the sub-pulse light, and dividing the divided pulses. The light is distributed to the two optical paths facing the i-th drawing device 1& and the second drawing device lb. Figure 6 scars; A schematic perspective view of the distribution of the soap element 120. Further, Fig. 7 and Fig. 8 are sectional views showing the internal structure of the light distribution unit 12A. As shown in Fig. 6 to Fig. 8, the 弁 刀 刀 配 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 The optical axis A is a frame 121 that is rotated centrally. 130516.doc -18- 200910015 The frame 121 is provided with an injection unit 121a that intercepts the pulsed light emitted from the laser oscillator 11 and the inside of the frame 121, and the divided main The pulse light is emitted to the main pulse light emission window mb outside the frame 121, and the divided sub-pulse light is emitted to the sub-pulse light emission window 121c outside the frame 121. The main pulse light emission window 121b and the sub-pulse light emission window 12lc are via The incident optical axis A is formed on the wall surface opposite to the frame 121. As shown in FIGS. 7 and 8, a partial mirror 122 and three mirrors 123 to 125 are disposed inside the frame 121. The partial mirror 122 and Each of the three mirrors 123 to 125 is fixed to the frame m by a nut or the like. The partial mirror 122 reflects a part (for example, 9%) of the incident pulse light, and transmits the remaining portion (for example, 10%). The reflected beam in mirror 122 acts as The main pulse light having a relatively high intensity is emitted from the autonomous pulsed light exiting window 121b toward the outside of the frame 121. On the other hand, the light beam transmitted through the partial mirror 122 is sequentially reflected in the mirrors 123, 124, and 125 as a light intensity. The lower sub-pulsed light is emitted from the sub-pulse light exiting window 121 (outward toward the outside of the frame 121. The light distributing unit 120 has a ring motor 126 that rotates the frame 121 around the incident optical axis a. As the ring motor 126, it can be used. For example, an ultrasonic motor that rotates a motor by ultrasonic vibration. The ring motor 126 is electrically coupled to the motor controller 126a. When the drive signal is transmitted from the motor controller uga to the ring motor 丨 26, the ring motor 126 operates to rotate the frame 121 about the incident optical axis A. Thereby, the state in which the main pulse light is supplied to the second drawing device and the sub-pulse light is supplied to the second drawing device ilb (the state of FIG. 7, hereinafter referred to as &quot;first state&quot;) and the second drawing can be described. The device u supplies the sub-pulse light and switches the state in which the device 1 b is supplied with the main pulse light (the state of Fig. 8, hereinafter referred to as &quot; the second state &quot;) in the 130516.doc -19-200910015 2 . The distribution unit 12A includes a detection sensor 127 for detecting the rotational posture of the frame 121. The detection sensor 127 detects which state of the first state and the second state the frame 121 is by detecting a specific portion ' of the frame 121. The detecting sensor 127 can be constructed using, for example, an optical non-contact sensor. As shown in Fig. 5, the 'motor controller 126a and the detecting sensor 127 are respectively connected to the shared distribution controller 128. The distribution controller 128 is based on the self-detecting sensor 127. The detection signal received therein controls the motor controller 126a. Thereby, the ring motor 126 can be operated at an appropriate angle, so that the rotational posture of the frame 121 can be controlled to an expected state (first state or second state). The distribution controller 128 is connected to each device controller 60 of the first drawing device 1a and the second drawing device 1] 3. The distribution controller 128 communicates with each device controller, and performs status according to the processing of each drawing device 1a, 1b. The rotation posture of the frame is controlled. <3. Operation of the drawing system> Next, the flow of the stroke system 1〇〇 will be described with reference to the flowchart of Fig. 9. Further, the operation described below is performed by the distribution controller. 128, the motor controller 126a, the laser controller (1) and the riding device u, ^ each device control theft 6 0 - face each other, the same batch of instructions, the main control, the control sequence, while controlling the various parts. The first system 10 0 first rotates the frame 121 by the operation of the circle % motor 126 by the circle E, and causes the light distribution unit 12 to smear the scent of the squid ', υ von second state (step SA1). The drawing system 130516.doc -20-200910015 and gram are in a state in which the first light drawing unit 120 irradiates the first drawing device !a with the sub-pulse light having a relatively low light intensity, and the second light drawing unit 120 pairs the second drawing device 1 bThe light intensity is relatively high Then, the drawing system 100 performs correction processing using the sub-pulse light (correction processing of the pulse light irradiated from the plurality of irradiation heads 4〇) in the second drawing device 1 &amp; (step SB1). The sub-pulse light irradiated by the edge device 1a is divided into a plurality of beams by the illumination optical system 30, and then irradiated downward through the respective irradiation heads 40. The first drawing device 13 is disposed below the plurality of illumination heads 4〇 to cause the camera 51 The sub-scanning direction is moved, and the illumination light from each of the illumination heads 40 is taken by the camera $! Further, the device controller 60 of the first drawing device 1a analyzes the imaging result taken from the camera 51, and acquires the laser power of the sub-pulse light, the amount of change in the intensity of the illumination width, the amount of the edge, and the absolute position of the illumination light. News. In turn, the device controller 60 controls the drive mechanisms 4U, 42e, 42f, 42g such that the parameters each approach the target value. Thereby, the irradiation state of the pulse light irradiated by the plurality of irradiation heads 40 can be corrected. After the correction processing in the first drawing device 1a is completed, the drawing system 1 搬 carries the substrate 9 to be processed into the second drawing device 1 &amp; (step SB2). Specifically, the first! The drawing device 1a mounts the substrate 9 on the upper surface of the stage 10 by a specific transport mechanism (not shown), and adsorbs and fixes the substrate 9 on the upper surface of the stage 10. Further, the second drawing device &amp; adjusts (aligns) the position and inclination of the substrate 9 by operating the stage driving unit 20. Then, the drawing system 100 rotates the frame 130516.doc 21 200910015 121 by operating the ring motor 126, and causes the light distribution unit 12 to be in the first state (step SA2). In other words, the drawing system 100 is in a state in which the first drawing device 1a is irradiated with the main pulse light having a relatively high light intensity from the light distribution unit 120, and the light intensity of the second drawing device ib is relatively low from the light distributing unit i2. The secondary pulsed light.

繼之,描繪系統100於第丨描繪裝置13中進行使用主脈衝 光之描繪處理(步驟SB3)。對第丨描繪裝置丨a照射之主脈衝 光於照明光學系、統3G中分割為複數束後,經由各照射頭4。 向下方,、、、射。第1描繪裝置丨a 一面使平台丨〇沿主掃描方向 及剎掃描方向移動,一面自複數個照射頭4〇對基板9之上 表面照射脈衝光(主脈衝光分割為複數束之各分割光卜藉 此,可於保持於第丨描繪裝置“之平台1〇上之基板9之上表 面描繪彩色濾光片用之規則性圖案。 另方面,描繪系統100—面於第1描繪裝置“中進行描 ’’曰處理,一面於第2描繪裝置lb進行使用副脈衝光之校正 處理(步驟SC1)。對第2描㈣置lb照射之副脈衝光於昭明 光學系統3G中分割為複數束後,經由各照射頭40向下方照 射第2¾繪裝置lb_面於複數個照射頭扣下方 機51沿副掃描方向移動 品拉山後 使攝^ 门移動,一面藉由攝影機51拍攝來 射頭40之照射光。 …、 之拍二1b之裝置控制器6〇對取自攝影機5艸 拍攝,'、.果進行分析,獲取副脈衝光之雷射功率、 又光強度之變化量、邊唾量及照射光之絕對位置等次 訊。繼之,裝罟松座丨μ 寻貝 置控制态60控制驅動機構41c、42e、 42g ’以使此等參數久&amp;拉、^ 各自接近目標值。藉此’可修正自複 130516.doc -22- 200910015 數個照射頭40中照射之脈衝光的照射狀態。 第2描繪裝置lb中校正處理結束後,其次,描繪系統ι〇〇 將作為處理對象之基板9搬入第2描繪裝置lb中(步驟 SC2)。具體而言,第2描繪裝置113藉由特定之搬運機構(圖 示省略)將基板9載置於平台10之上表面,並將基板9吸附 固定於平台10之上表面。又,第2描繪裝置113藉由使平台 驅動部20動作,而進行基板9之位置及傾斜度之調節(對 準)。 繼而,描繪系統100藉由使圓環馬達126動作而轉動框架 121,使光分配單元120成為第2狀態(步驟SA3) ^即,描繪 系統100成為如下狀態:自光分配單元12〇對第1描繪裝置 la照射光強度相對較低之副脈衝光,並自光分配單元Η。 對第2描繪裝置lb照射光強度相對較高之主脈衝光。 繼而,描繪系統100於第2描繪裝置lb中進行使用主脈衝 光之描繪處理(步驟SC3)。對第2描繪裝置lb照射之主脈衝 光於照明光學系統3〇中分割為複數束後,經由各照射頭4〇 向下方照射。第2描繪裝置1 b —面使平台! 0沿主掃描方向 及田彳掃描方向移動,一面自複數個照射頭4〇對基板9之上 表面照射脈衝光(主脈衝光分割成複數束之各分割光)。藉 此,可於保持於第2描繪裝置lb之平台1〇上之基板9之上表 面’描繪彩色濾光片用之規則性圖案。 另—方面,描繪系統100 —面於第2描繪裝置11?中進行描 繪處理,一面於第1描繪裝置1a搬出描繪處理完畢之基板 9(步驟SB4)。具體而言,第1描繪裝置la解除平台10上基 130516.doc -23· 200910015 板9之固定,並藉由特定 之搬運機構(圖示省略)將基板9自 平台10之上表面搬出。 其後,描繪裝置_於第】描㈣置la進行使用副脈衝光 處理(步驟SB5)°對第1描縿裝置la照射之副脈衝光 於照明光學系統30令分 T刀〇J為歿數束後,經由各照射頭4〇向 下方照射。第1描皆奘要 、裝置la—面於複數個照射頭4〇之下 方’使攝影機51沿副掃描方氏 方向移動,一面藉由攝影機51拍 攝來自各照射頭40之照射光。 又’弟1財裝置U之裝置控制⑽對取自攝影機^之 拍攝果進行为析,獲取副脈衝光之雷射功率、照射寬 度、光強度之變化量、邊陲量及照射光之絕對位置等資 〇fl繼之,裝置控制器60控制驅動機構41c、42e、42f、 42§ ’以使此等參數各自接近目標值。藉此,可修正自複 數個照射頭40照射之脈衝光的照射狀態。 第1描繪裝置la中校正處理結束後,其次,描繪系統1〇〇 將新基板9搬入至第i描繪裝置u中(步驟SB6)。具體而 言,第1描繪裝置la藉由特定之搬運機構(圖示省略)將基板 9載置於平台1〇之上表面,並將基板9吸附固定於平台1〇之 上表面。又,第1描繪裝置la藉由使平台驅動部2〇動作, 來進行基板9之位置及傾斜度之調節(對準)。 繼而,描繪系統100藉由使圓環馬達126動作而轉動框架 121,使光分配單元12〇成為第}狀態(步驟SA4)。即,描繪 系統100成為如下狀態:自光分配單元120對第1描繪裝置 la照射光強度相對較高之主脈衝光,並自光分配單元 130516.doc -24- 200910015 對第2描繪裝置lb照射光強度相對較低之副脈衝光。 繼之,描繪系統100於第1描繪裝置1&amp;中進行使用主脈衝 光之描繪處理(步驟SB7)。又,描繪裝置1〇〇一面於第1描 綠裝置la中進行描繪處理,一面於第2描繪裝置比中搬出 描繪處理完畢之基板9(步驟SC4)。 如此’該描繪系統1〇〇將自雷射振盪器11〇中射出之脈衝 光分割為主脈衝光與副脈衝光,並將主脈衝光及副脈衝光 交替分配至第1描繪裝置la與第2描繪裝置lb。因此,可於 2台描繪裝置ia、lb中,交替並行實施使用主脈衝光之描 繪處理與使用副脈衝光之校正處理。藉此,可提高雷射振 盪器110之運轉率及基板9之製造效率。 &lt;4.變形例&gt; 以上就本發明一實施方式進行了說明,然而本發明並非 僅限於上述示例。上述描繪系統1〇〇藉由轉動光分配單元 120而將主脈衝光與副脈衝光分配至2台描繪裝置la、lb 中’但亦可使用其他方法分配主脈衝光與副脈衝光。例 如,如圖10所示,亦可採用於自雷射振盪器11〇中射出之 脈衝光之光路上選擇性配置反射率相異之2塊局部反射鏡 131 、 132 ° 圖10之局部反射鏡131將光強度相當於主脈衝光之光束 反射’並且使光強度相當於副脈衝光之光束透射。因此, 若將局部反射鏡131配置於雷射振盪器11〇之光路上,則局 部反射鏡13 1中經反射之光束將作為主脈衝光對第1描繪裝 置la照射,又,透過局部反射鏡131之光束於反射鏡14〇中 130516.doc -25- 200910015 經反射後’作為副脈衝光對第2描繪裝置lb照射。另一方 面’局部反射鏡132將光強度相當於副脈衝光之光束反 射,並且使光強度相當於主脈衝光之光束透射。因此,若 將局部反射鏡132配置於雷射振盪器no之光路上,則局部 反射鏡131中經反射之光束將作為副脈衝光對第1描繪裝置 1 a照射’又’透過局部反射鏡13 1之光束於反射鏡14〇中經 反射後,作為主脈衝光對第2描繪裝置1 b照射。 局部反射鏡131、132之切換,可利用例如圖u〜14所示 之切換機構133〜135而實現。圖11、12之切換機構133藉由 使上下配置之局部反射鏡131、132整體上下移動,而對雷 射振盪器110之光路上配置局部反射鏡131之狀態(圖^之 狀態)與雷射振盪器110之光路上配置局部反射鏡132之狀 態(圖12之狀態)進行切換。 圖13之切換機構134具有圍繞特定中心軸轉動之轉盤 134a,並於轉盤134a之上表面以豎立姿勢固定設置著局部 反射鏡131與局部反射鏡132。切換機構134藉由使轉盤 134a旋轉’而對雷射振盪器11〇之光路上配置局部反射鏡 131之狀感(圖13之狀悲)與雷射振盡器110之光路上配置局 部反射鏡132之狀態(圖示省略)進行切換。 又’圖14之切換機構135具有旋轉框架135a ’該旋轉框 架135a相對雷射振盪器11〇之光路具有特定傾斜度且圍繞 中心軸旋轉,而形成於旋轉框架之2個貫通孔中,分別喪 入者局部反射鏡131與局部反射鏡132。切換機構135藉由 使叙轉框架135a^轉’而對雷射振盈器11〇之光路上配置 130516.doc -26- 200910015 局部反射鏡131之狀態(圖14之狀態)與雷射振盪器“ο之光 路上配置局部反射鏡132之狀態(圖示省略)進行切換。 又,上述描繪系統1〇〇於描繪處理前每次均進行校正處 理’然而無需每次均進行校正處理,視需要進行即可。 又,描繪系請之各描繪裝置la、Ib亦可使用副脈衝光 進行校正處理以外之處理。例如亦可使用副脈衝光進行光 軸調節等維護處理》 又,上述描繪系統1 〇〇係相對丨台雷射振盪器丨丨〇設置2台 描繪裝置la、lb,但亦可相對〗台雷射振盪器11〇設置3台 以上之描繪裝置1。圖15係表示相對i台雷射振盪器11〇設 置3台描繪裝置ia、ib、ic之描繪系統2〇〇之示例的圖。此 描繪系統200藉由光分配部15〇將自雷射振盪器ιι〇中射出 之脈衝光分割為1束光強度相對較高之主脈衝光與2束光強 度相對較低之副脈衝光。繼而,描繪系統2〇〇以將主脈衝 光依-人供給至3台描繪裝置ia、lb、1(;中之方式,將3束分 割光分配至3台描繪裝置la、lb、lc。藉此’可於3台描繪 裝置la、lb、1c中依次進行對基板9之描繪處理,並且於 其餘2台描繪裝置並行實施校正處理及維護處理。 圖15之描繪系統200中,主脈衝光及2束副脈衝光之光強 度比率可β又為例如、5%、。又,可於光分配部1 中,以大致比率分割主脈衝光與2束副脈衝光,並於各描 繪裝置la、lb、lc搭載於照明光學系統3〇之衰減器中,對 主脈衝光或副脈衝光之光強度進行最終之微調節。 又’於上述描繪系統100、2〇〇中係將雷射振盪器11〇用 130516.doc •27- 200910015 作光源裝置,但亦可使用LED(Light Emitting Diode ;發光 二極體)或水銀燈等其他發光器作為光源裝置。又,上述 描繪裝置1係對基板9之上表面同時照射複數束光束者,然 而構成本發明之描繪系統的描繪裝置並非僅限於此種多頭 描繪裝置,亦可對基板9之上表面照射丨束光束。又,上述 描繪裝置1係以彩色濾光片用玻璃基板9作為處理對象,然 而處理對象基板9亦可為半導體基板、印刷基板、電漿顯 示裝置用玻璃基板等其他基板。 又’上述示例對具備複數台描繪裝置之描繪系統100、 200進行了說明,但亦可於1台描繪裝置中設置同等構成。 即’亦可於具有複數個描繪處理部(平台)之1台描繪裝置 中’ δ史置對各描續處理部分配主脈衝光與副脈衝光之光分 配單元。由此,可於丨台描繪裝置中,一面於複數個描繪 處理部依次進行描繪處理,一面於其他描繪處理部中並行 實施校正處理等。 【圖式簡單說明】 圖1係描繪裝置之側視圖。 圖2係描繪裝置之俯視圖。 圖3係表示藉由攝影機拍攝之脈衝光之光強度分布之示 例的圖。 圖4係表示描繪裝置各部分與裝置控制器之間之連接結 構的方塊圖。 圖5係表示描繪系統結構之圖。 圖6係光分配單元之概況立體圖。 130516.doc -28- 200910015 圖7係第1狀態下之光分配單元的剖面圖。 圖8係第2狀態下之光分配單元的剖面圖。 圖9係表示描繪系統動作流程的流程圖。 圖1 〇係表示變形例之描繪系統結構之圖。 圖11係表示2塊局部反射鏡之切換機構之示例的圖 圖12係表示2塊局部反射鏡之切換機構之示例的圖 圖13係表示2塊局部反射鏡之切換機構之示例的圖 圖14係表示2塊局部反射鏡之切換機構之示例的圖 圖15係表示變形例之描繪系統結構之圖。 【主要元件符號說明】 1 、 la 、 lb 、 lc 描繪裝置 9 基板 10 平台 20 平台驅動部 21 轉動機構 21a 線性馬達 21b 轉動軸 22 支持板 23 副掃描機構 23a 線性馬達 23b 導向部 24 底板 25 主掃描機構 25a 線性馬達 130516.doc 200910015 25b 導向部 30 照明光學系統 40 照射頭 41 光圈單元 41a 光圈 41b 支持部 41c 驅動機構 42 投影光學系統 42a、42b 變焦鏡頭 42c 、 42d 聚焦鏡 42e、42f、42g 驅動機構 50 攝影部 51 攝影機 52 移動機構 52a 導軌 60 裝置控制器 70 基台 80 框架 100 、 200 描繪系統 110 雷射振盪器 111 雷射控制器 120 光分配單元 121 框架 121a 射入部 130516.doc -30- 200910015 121b 121c 122 123〜125 126 126a 127 128 C&quot; 131, 132Next, the drawing system 100 performs drawing processing using the main pulse light in the second drawing device 13 (step SB3). The main pulse light irradiated to the second drawing device 丨a is divided into a plurality of beams by the illumination optical system 3G, and then passed through the respective irradiation heads 4. Down, ,,, and shoot. The first drawing device 丨a irradiates the upper surface of the substrate 9 with pulse light from the plurality of irradiation heads 4 while moving the stage 丨〇 in the main scanning direction and the scanning direction (the main pulse light is divided into the respective divided lights of the plurality of beams) Therefore, the regular pattern for the color filter can be drawn on the upper surface of the substrate 9 held on the platform 1 of the second drawing device. In addition, the drawing system 100 is in the first drawing device. The second drawing device 1b performs the correction processing using the sub-pulse light (step SC1). The second pulse (b) of the sub-pulse light is divided into a plurality of beams in the Zhaoming optical system 3G. The lens 40 is irradiated downward through each of the illumination heads 40 to face the plurality of illumination head buckles. The lower machine 51 moves the product pull hill in the sub-scanning direction to move the camera, and the camera 40 shoots the camera 40. The illumination of the light. ..., the device controller of the 1st 1b is taken from the camera 5艸, and the analysis is performed to obtain the laser power of the sub-pulse light, the amount of change in the light intensity, and the amount of the side. And the absolute position of the illumination After that, the mounting position of the controller 60 controls the driving mechanisms 41c, 42e, 42g' so that the parameters are long and the respective values are close to the target value. 130516.doc -22- 200910015 The irradiation state of the pulsed light irradiated by the plurality of irradiation heads 40. After the correction processing in the second drawing device lb is completed, the drawing system 〇〇 loads the substrate 9 as the processing target into the second In the drawing device 1b (step SC2), specifically, the second drawing device 113 mounts the substrate 9 on the upper surface of the stage 10 by a specific transport mechanism (not shown), and adsorbs and fixes the substrate 9 to the stage 10 Further, the second drawing device 113 adjusts (aligns) the position and the inclination of the substrate 9 by operating the stage driving unit 20. Then, the drawing system 100 operates by the ring motor 126. When the frame 121 is rotated, the light distribution unit 120 is brought into the second state (step SA3). That is, the drawing system 100 is in a state in which the first drawing device 1a is irradiated with the sub-pulse light having a relatively low light intensity from the light distribution unit 12A. Self-light distribution unitΗ The second drawing device 1b is irradiated with main pulse light having a relatively high light intensity. Then, the drawing system 100 performs drawing processing using the main pulse light in the second drawing device 1b (step SC3). The main pulse light is divided into a plurality of beams in the illumination optical system 3A, and then irradiated downward through the respective irradiation heads 4〇. The second drawing device 1b faces the main scanning direction and the field scanning direction. The surface of the upper surface of the substrate 9 is irradiated with pulse light (the main pulse light is divided into the divided lights of the plurality of beams) from the plurality of irradiation heads 4, whereby the substrate 9 held on the stage 1 of the second drawing device 1b can be held. The upper surface 'depicts a regular pattern for color filters. On the other hand, the drawing system 100 performs the drawing processing on the second drawing device 11 to carry out the substrate 9 on which the drawing process has been completed in the first drawing device 1a (step SB4). Specifically, the first drawing device 1a releases the fixing of the base plate 130516.doc -23· 200910015 on the platform 10, and the substrate 9 is carried out from the upper surface of the platform 10 by a specific transport mechanism (not shown). Thereafter, the drawing device performs the sub-pulse light processing (step SB5) and the sub-pulse light irradiated to the first tracing device 1a in the illumination optical system 30. After the beam, it is irradiated downward through each of the irradiation heads 4〇. In the first description, the device la-plane is moved below the plurality of illumination heads 4' to move the camera 51 in the sub-scanning direction, and the illumination light from each of the illumination heads 40 is taken by the camera 51. In addition, the device control (10) of the device 1 is used to analyze the image taken from the camera, and the laser power, the illumination width, the amount of change in the light intensity, the amount of the edge, and the absolute position of the illumination are obtained. The resource ff is followed by the device controller 60 controlling the drive mechanisms 41c, 42e, 42f, 42 § 'to make these parameters each close to the target value. Thereby, the irradiation state of the pulse light irradiated from the plurality of irradiation heads 40 can be corrected. After the correction processing in the first drawing device 1a is completed, the drawing system 1 搬 moves the new substrate 9 into the i-th drawing device u (step SB6). Specifically, the first drawing device 1a mounts the substrate 9 on the upper surface of the stage 1〇 by a specific transport mechanism (not shown), and adsorbs and fixes the substrate 9 on the upper surface of the stage 1〇. Further, the first drawing device 1a adjusts (aligns) the position and the inclination of the substrate 9 by operating the stage driving unit 2〇. Then, the drawing system 100 rotates the frame 121 by operating the ring motor 126, thereby causing the light distributing unit 12 to be in the first state (step SA4). In other words, the drawing system 100 is in a state in which the first drawing device 1a is irradiated with the main pulse light having a relatively high light intensity from the light distribution unit 120, and the second drawing device 1b is irradiated from the light distributing unit 130516.doc-24-200910015. A sub-pulse light having a relatively low light intensity. Then, the drawing system 100 performs drawing processing using the main pulse light in the first drawing device 1 & (step SB7). Further, the drawing device 1 carries out the drawing processing in the first greening device 1a, and carries out the drawing-processed substrate 9 in the second drawing device ratio (step SC4). Thus, the drawing system 1 divides the pulse light emitted from the laser oscillator 11A into main pulse light and sub-pulse light, and alternately distributes the main pulse light and the sub-pulse light to the first drawing device 1a and the 2 depicts device lb. Therefore, the drawing processing using the main pulse light and the correction processing using the sub-pulse light can be alternately performed in parallel in the two drawing devices ia, lb. Thereby, the operation rate of the laser oscillator 110 and the manufacturing efficiency of the substrate 9 can be improved. &lt;4. Modifications&gt; Although an embodiment of the present invention has been described above, the present invention is not limited to the above examples. The drawing system 1 is configured to distribute the main pulse light and the sub-pulse light to the two drawing devices 1a, 1b by rotating the light distributing unit 120. However, the main pulse light and the sub-pulse light may be distributed by other methods. For example, as shown in FIG. 10, two partial mirrors 131 and 132° having different reflectances may be selectively disposed on the optical path of the pulsed light emitted from the laser oscillator 11A. 131 transmits light having a light intensity equivalent to that of the main pulsed light and transmits light having a light intensity equivalent to that of the secondary pulsed light. Therefore, if the partial mirror 131 is disposed on the optical path of the laser oscillator 11, the reflected beam in the partial mirror 13 1 will be irradiated to the first drawing device 1 as the main pulse light, and the partial mirror will be transmitted through the partial mirror. The beam of 131 is irradiated to the second drawing device 1b as a sub-pulse light after being reflected in the mirror 14 130 130516.doc -25- 200910015. On the other hand, the partial mirror 132 reflects the light beam having a light intensity equivalent to that of the sub-pulse light, and causes the light intensity to be equivalent to that of the main pulse light. Therefore, if the partial mirror 132 is disposed on the optical path of the laser oscillator no, the reflected beam in the partial mirror 131 will illuminate the first drawing device 1 a as the sub-pulse light through the partial mirror 13 The light beam of 1 is reflected by the mirror 14A, and then irradiated to the second drawing device 1b as main pulse light. The switching of the partial mirrors 131, 132 can be realized by, for example, the switching mechanisms 133 to 135 shown in Figs. The switching mechanism 133 of FIGS. 11 and 12 is configured such that the state of the partial mirror 131 (the state of FIG. 2) and the laser are arranged on the optical path of the laser oscillator 110 by moving the partial mirrors 131 and 132 arranged up and down as a whole. The state of the partial mirror 132 (the state of FIG. 12) is arranged on the optical path of the oscillator 110 to be switched. The switching mechanism 134 of Fig. 13 has a turntable 134a that rotates about a specific central axis, and a partial mirror 131 and a partial mirror 132 are fixedly disposed in an upright position on the upper surface of the turntable 134a. The switching mechanism 134 is configured to rotate the turntable 134a to configure the partial mirror 131 on the optical path of the laser oscillator 11 (the sadness of FIG. 13) and the partial mirror on the optical path of the laser expander 110. The state of 132 (not shown) is switched. Further, the switching mechanism 135 of FIG. 14 has a rotating frame 135a. The rotating frame 135a has a specific inclination with respect to the optical path of the laser oscillator 11 and rotates around the central axis, and is formed in two through holes of the rotating frame, respectively. The entrance partial mirror 131 and the partial mirror 132. The switching mechanism 135 configures the state of the partial mirror 131 (the state of FIG. 14) and the laser oscillator on the optical path of the laser oscillator 11 by rotating the frame 135a. "The state in which the partial mirror 132 is disposed on the optical path of ο (not shown) is switched. Further, the drawing system 1 performs the correction processing every time before the drawing processing. However, it is not necessary to perform the correction processing every time, as needed. In addition, the respective drawing devices 1a and 1b of the drawing system may perform processing other than the correction processing using the sub-pulse light. For example, maintenance processing such as optical axis adjustment may be performed using the sub-pulse light. Although two drawing devices 1a and 1b are provided for the laser oscillator, the drawing device 1a and lb are provided, but three or more drawing devices 1 can be provided for the laser oscillator 11. Fig. 15 shows the relative i stage. The laser oscillator 11 is a diagram showing an example of three drawing systems 2a for drawing devices ia, ib, and ic. The drawing system 200 emits pulses from the laser oscillator by means of the light distributing portion 15 Light split into 1 beam of light a relatively high main pulse light and two sub-pulse lights of relatively low light intensity. Then, the system 2 is depicted to supply the main pulse light to three drawing devices ia, lb, 1 (; In this way, the three divided lights are distributed to the three drawing devices 1a, 1b, and 1c. Thus, the drawing processing on the substrate 9 can be sequentially performed in the three drawing devices 1a, 1b, and 1c, and the remaining two drawing devices can be used. The correction processing and the maintenance processing are performed in parallel. In the drawing system 200 of Fig. 15, the light intensity ratio β of the main pulse light and the two sub-pulse light may be, for example, 5%. Further, in the light distribution unit 1, The main pulse light and the two sub-pulse lights are divided into a ratio, and are mounted on the attenuators of the illumination optical system 3 at each drawing device la, lb, and lc, and the light intensity of the main pulse light or the sub-pulse light is finally reduced. In the above-described drawing systems 100 and 2, the laser oscillator 11 is used as a light source device, but LED (Light Emitting Diode) or LED (Light Emitting Diode) or Other illuminators such as mercury lamps are used as light source devices. The apparatus 1 irradiates a plurality of beams simultaneously on the upper surface of the substrate 9. However, the drawing device constituting the drawing system of the present invention is not limited to such a multi-head drawing device, and the upper surface of the substrate 9 may be irradiated with a beam of light. In the drawing device 1 described above, the glass substrate 9 for a color filter is used as a processing target. However, the substrate to be processed 9 may be another substrate such as a semiconductor substrate, a printed substrate, or a glass substrate for a plasma display device. Although the drawing systems 100 and 200 of the drawing device have been described, an equivalent configuration may be provided in one drawing device. In other words, it is also possible to arrange a light distribution unit for the main pulse light and the sub-pulse light for each of the drawing processing portions in one drawing device having a plurality of drawing processing units (platforms). In this way, in the drawing device, the drawing processing is sequentially performed in a plurality of drawing processing units, and the correction processing and the like are performed in parallel in the other drawing processing units. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a side view depicting a device. Figure 2 is a top plan view of the device. Fig. 3 is a view showing an example of light intensity distribution of pulsed light taken by a camera. Figure 4 is a block diagram showing the connection structure between various parts of the apparatus and the device controller. Figure 5 is a diagram showing the structure of the system. Fig. 6 is a schematic perspective view of a light distribution unit. 130516.doc -28- 200910015 Figure 7 is a cross-sectional view of the light distribution unit in the first state. Fig. 8 is a cross-sectional view showing the light distributing unit in the second state. Figure 9 is a flow chart showing the flow of the system operation. Fig. 1 is a diagram showing the structure of a drawing system of a modification. 11 is a view showing an example of a switching mechanism of two partial mirrors. FIG. 12 is a view showing an example of a switching mechanism of two partial mirrors. FIG. 13 is a view showing an example of a switching mechanism of two partial mirrors. FIG. 15 showing an example of a switching mechanism of two partial mirrors is a view showing a configuration of a drawing system of a modification. [Description of main component symbols] 1. la, lb, lc drawing device 9 substrate 10 platform 20 platform driving portion 21 rotating mechanism 21a linear motor 21b rotating shaft 22 support plate 23 sub-scanning mechanism 23a linear motor 23b guide portion 24 bottom plate 25 main scanning Mechanism 25a Linear motor 130516.doc 200910015 25b Guide 30 illumination optical system 40 illumination head 41 aperture unit 41a aperture 41b support portion 41c drive mechanism 42 projection optical system 42a, 42b zoom lens 42c, 42d focusing mirror 42e, 42f, 42g drive mechanism 50 Photographing unit 51 Camera 52 Moving mechanism 52a Guide rail 60 Device controller 70 Base station 80 Frame 100, 200 Drawing system 110 Laser oscillator 111 Laser controller 120 Light distribution unit 121 Frame 121a Injection unit 130516.doc -30- 200910015 121b 121c 122 123~125 126 126a 127 128 C&quot; 131, 132

133〜135 134a 135a 140 150 A 主脈衝光射出窗 副脈衝光射出窗 局部反射鏡 反射鏡 圓環馬達 馬達控制器 檢測感應器 分配控制器 局部反射鏡 切換機構 轉盤 轉動框架 反射鏡 光分配部 入射光軸133~135 134a 135a 140 150 A main pulse light exit window sub-pulse light exit window partial mirror mirror ring motor motor controller detection sensor distribution controller partial mirror switching mechanism turntable rotating frame mirror light distribution part incident light axis

130516.doc -31 -130516.doc -31 -

Claims (1)

200910015 、申請專利範圍: 1. :種描m其特徵在於:其係包括藉由對基板照射 &quot;於开少成於基板上之感光材才斗上描繪特定圖案之描繪 裝置者,且包括: 光源; 八刀配裝置,其係將自上述光源射出之光分割為複數個 力割光,並且將上述複數個分割光分配至複數個光路 中;及 複數個上述描繪裝置,其係分別配置於上述複數個光 路上;且 上述複數個分割光包含光強度高於其他分割光之】束 描繪用分割光; 上述分配裝置將上述描繪用分割光依次分配至上述複 數個光路中。 2.如請求項1之描繪系統,其中 上述複數個描繪裝置分別具有修正機構,其係使用上 述描綠用分割光以外之上述分割光來修正光對基板之照 射狀態。 3. 一種描繪系統,其特徵在於:其係、包括藉由對基板照射 先而於形成於基板上之感光材料上騎特定圖案之描繪 裝置者,且包括: 光源; 刀配裝置,其係將自上述光源射出之光分割為光強度 較高之第!分割光與光強度較低之第2分割光,並且將上 130516.doc 200910015 述第1分割光及第2分割光分配至2條光路中;及 2台上述描繪裝置,其係分別配置於上述2條光路上: 且 上述分配裝置將上述第丨# g U &lt;乐1刀劄先及上述第2分割光交替 分配至上述2條光路中。 4. 如請求項3之描繪系統,其中 上述2台描繪裝置係交替進行描繪處理; 上述分配裝置以對上述2台描緣裝置中進行描緣處理 之描繪裝置提供上述第丄分割光之方式,將上述第】分割 光與上述第2分割光分配至上述2條光路中。 5. 如請求項4之描繪系統,其中 上述2台描繪裝置分別具有修正機構,其係使用上述 第2分割光來修正光對基板之照射狀態。 6. 如請求項3至5中任一項之描繪系統,其中 上述分配裝置包含: 光分割部,其係將自上述光源射出之光分割為對該光 軸正父且相互向相反方向前進之上述第丨分割光與上述 第2分割光;及 旋轉機構,其係使上述光分割部以上述光轴為中心而 旋轉。 7. 如請求項3至5中任一項之描繪系統,其中 上述分配裝置包含: 第1局部透射鏡,其係將光強度相當於上述第丨分割光 之光反射,並且使光強度相當於上述第2分割光之光透 130516.doc 200910015 射; 第2局部透射鏡,其係使光強度相當於上述第丨分割光 之光透射,並且將光強度相當於上述第2分割光之光反 射;及200910015, the scope of application for patents: 1. The description of the invention is characterized in that it includes a device for depicting a specific pattern by illuminating the substrate with a photosensitive material which is formed on the substrate, and includes: a light source; an eight-knife device for dividing light emitted from the light source into a plurality of force cuts, and distributing the plurality of split lights to a plurality of light paths; and a plurality of the drawing devices respectively configured The plurality of optical paths include: the plurality of divided lights include split light for beam drawing having higher light intensity than the other divided lights; and the distribution device sequentially distributes the divided light for drawing to the plurality of optical paths. 2. The drawing system of claim 1, wherein each of the plurality of drawing devices has a correction mechanism that corrects an illumination state of the light to the substrate by using the divided light other than the green divided light. 3. A drawing system, comprising: a device for drawing a specific pattern on a photosensitive material formed on a substrate by irradiating a substrate, and comprising: a light source; a knife matching device The light emitted from the above light source is divided into the light intensity higher! Dividing the second split light having a low light and light intensity, and assigning the first split light and the second split light to the two optical paths in the upper 130516.doc 200910015; and the two drawing devices are respectively arranged in the above Two optical paths: The distribution device alternately distributes the above-mentioned 丨#g U &lt;Le 1 knife first and the second divided light to the two optical paths. 4. The drawing system of claim 3, wherein the two drawing devices alternately perform drawing processing; and the distributing device provides the second divided light by a drawing device that performs a edge processing on the two drawing devices. The first divided light and the second divided light are distributed to the two optical paths. 5. The drawing system of claim 4, wherein each of the two drawing devices has a correction mechanism that corrects an illumination state of the light to the substrate by using the second divided light. 6. The drawing system according to any one of claims 3 to 5, wherein the distribution device comprises: a light dividing unit that divides light emitted from the light source into a parent to the optical axis and advances in opposite directions to each other. The second divided light and the second divided light; and a rotating mechanism that rotates the light dividing unit around the optical axis. 7. The drawing system according to any one of claims 3 to 5, wherein the dispensing device comprises: a first partial transmission mirror that reflects light having a light intensity corresponding to the second divided light and makes the light intensity equivalent The second split light is transmitted through 130516.doc 200910015; the second partial transmission mirror is configured to transmit light having a light intensity corresponding to the second split light and to reflect the light intensity corresponding to the second split light. ;and 配置機構,其係將上述第丨局部透射鏡及上述第2局部 透射鏡選擇性配置於自上述光源射出之光之光路上。 -種描繪裂置,其特徵在於:其係藉由對基板照射光而 於形成於基板上之感光材料上描繪特定圖案者,且包 括: 光源; 分配機構,其係將自上述光源射出之光分割為複數個 分割光,並且將上述複數個分割光分配至複數個光路 中;及 複數個描繪處理部,其係分別配置於上述複數光路 上; 上述複數個分割光包含光強度高於其他分割光之丄束 描繪用分割光; 上述分配機構將上述描繪用分劃光依次分配至上述複 數個光路中。 9_ 一種描繪裝置,其特徵在於:其係藉由對基板照射光而 於形成於基板上之感光材料上描繪特定圖案者,且包 括: 光源; 分配機構,其係將自上述光源射出之光分割為光強度 130516.doc 200910015 較高之第1分割光與光強度較低之第2分割光,並且將上 述第1分割光及上述第2分割光分配至2條光路中;及 2個描繪處理部,其係分別配置於上述2條光路上; 上述分配機構將上述第丨分割光及上述第2分割光交替 分配至上述2條光路中。 10. 一種騎方4,其特徵在於:其係於複數個描繚處理部 中依次進行描繪處理者,該描繪處理係藉由對基板照射 光而於形成於基板上之感光材料上描繪特定圖案;且包 括: 分割步驟,其係將自特定光源射出之光分割為複數個 分割光;及 刀配步驟,其係將上述複數個分割光分配至上述複數 個描繪處理部中;且 於上述分配步驟,將上述描繪用分割光中光強度高於 其他刀割光之1束描繪用分割光依次分配至上述複數個 描繪處理部中。 130516.docThe arrangement mechanism selectively disposes the second partial transmission mirror and the second partial transmission mirror on an optical path of light emitted from the light source. a patterning crack, characterized in that it is a person who draws a specific pattern on a photosensitive material formed on a substrate by irradiating light onto the substrate, and includes: a light source; a distribution mechanism that emits light from the light source Dividing into a plurality of divided lights, and distributing the plurality of divided lights into a plurality of optical paths; and a plurality of drawing processing units respectively disposed on the plurality of optical paths; wherein the plurality of divided lights include higher light intensity than other segments The splitting light for drawing of the light is divided; the distributing means sequentially distributes the dividing light for drawing to the plurality of optical paths. 9_ A drawing device characterized in that it draws a specific pattern on a photosensitive material formed on a substrate by irradiating light onto the substrate, and includes: a light source; a distribution mechanism that splits the light emitted from the light source a first split light having a higher light intensity 130516.doc 200910015 and a second split light having a lower light intensity, and the first split light and the second split light are distributed to two optical paths; and two drawing processes The first portion is disposed on the two optical paths, and the distribution unit alternately distributes the second divided light and the second divided light to the two optical paths. 10. A rider 4 characterized in that a drawing process is sequentially performed in a plurality of tracing processing sections for drawing a specific pattern on a photosensitive material formed on a substrate by irradiating light onto a substrate. And including: a dividing step of dividing the light emitted from the specific light source into a plurality of divided lights; and a knife matching step of allocating the plurality of divided lights to the plurality of drawing processing units; In the above-described drawing, the divided light for drawing in which the light intensity of the divided light is higher than the other cut light is sequentially distributed to the plurality of drawing processing units. 130516.doc
TW097113692A 2007-06-12 2008-04-15 Drawing system, drawing apparatus and drawing method TW200910015A (en)

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