200906255 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種用於焊接表面貼裝元件的焊盤，以及 具有該悍盤的電路板和電子裝置。 【先前技術】 隨著科學技術的不斷發展，現代社會與電子技術息息 相^移動電話、步話機、可檇式電腦、記憶體、硬碟驅 動态、光碟驅動器、高清晰度電視機等電子產品的應用曰 益廣泛。為了方便隨身攜帶和使用，用戶對產品的小型化、 f型化提出了較高的要求。表面貼裂技術（Su如e Mount :一§” SMT)順應了這一潮流，為實現電子 輕、溥、短、小打下了基礎。 光電進m代以來’ smt技術走向了成熟階段，隨著 衍不斷、。7工，技術的飛速發展，新的高密度組裝技 現。球柵陣列封襄(BaiiGr—^ 7疋B二已：進入貫用化階段的高密度組裝技術。 BGA表面貼裝元件 (以下稱騎點狀焊料凸點或錫球 件與電路基板（如E嘴路板B 面貼裝元 術的優點是提高了組裝成品率；：:：、Β:Α技 裝技術有所減少；寄生表 又σ里Μ父以則的封 頻率大大提高；組裝可用此面焊接信號：輸延遲小’使用 點在於焊點與電路美 ，可罪性尚。其主要缺 电塔基板上焊盤的折 低，易出現焊點漂移、 …口口貝、罪性比較 •于料温露、空焊和焊點錫裂 6 200906255 等問= 吏得職器件在很多領域的應用中受到限制。 下··’、貼裝技術令也容易出現上述問題’其原因如 傳統的焊盤一般為圓形或 接部的形狀相同，且1面表面貼裝7^件的引腳/連 并女^ /、面知比表面貼裝元件的連接部的面 二二將表面貼装元件與電路板進行烊接 固疋過程中由於錫膏凝固 離其原來設定的中心 1，：ϊ广會將表面貼裝元件拉 上發"二/使佧表面貼裝元件的引腳在焊盤 上1生味移，攸而導致該表面貼裝元件的位置發生偏 接的過財也㈣出現包焊和 ==間的短路現象。特別的一表丄： :=一，二:板上焊盤為圓形，其…表面貼裝 狀，該3焊勒：、日大知點相連’因受限於電路板上焊盤的形 焊π二十;：、烊盤之間只有—個支撐點，表面貼裝元件盥 較弱。電路板受熱後會產生形變（彎曲）現 成只有—個支撐點的焊點與焊盤在其焊接點形 度較高或發生其他情況而導致bga元件 面占 ’甚至會出現焊點（錫球）錫裂，BGA表 應用中受到限制見象錢#BGA 11件在很多領域的 【發明内容】 有鑒於此，有必亜担糾 令义要楗供―種經過改良的焊盤，以提高 表面接者讀與焊盤的焊接品質。 此外，退有必要提供一種具有該焊盤的電路板和電子 200906255 裝置。 一種焊盤，用於焊接表面貼裝元件，包括：—中心部， 以及從該中心部向外延伸的複數延伸部，該複數延伸部相 互之間存在間隙。 σ 一種電路板，其表面形成有複數用於焊接表面貼裝元 件的焊盤，所述複數焊盤中的至少一個焊盤包括心 部’以及從該中心部向外延伸的複數延伸部，該複數延= 部相互之間存在間隙。 一種電子裝置，包括至少—塊電路板及焊接在所述電 路板上的表面貼裝元件，所述電路板表面形成有複數用於 焊接所述表面貼裝元件的焊盤；所述複數焊盤中的至少一 :卜包&巾心部’以及從該中心部向外延伸的複數延 申部，該複數延伸部相互之間存在間隙。 ^發明所述的焊盤具有—中心部和複數延伸部，從而 表面貼裝兀件的連接部限制在焊盤上的中心位置，減 =耗度，以便於精確定位表面貼裝元件；特別的，採 …述^後’在焊接過財，焊料會料焊盤的延伸部， 焊般ί到卜盤上的表面貼裝元件的連接部或谭點與 ==間存在複數接著點，增加了表面貼裝組 = 出現空焊、包焊、焊料溢露的現象，除 產Ρ率'即噌焊料。综上’本發明可提高電子產品的生 產良率，減少維修件的產生。 【實施方式】 如圖1所示’焊盤10設置在電路板20上。其中，電 200906255 路板20可為^|jf ^ 路與表面貼裝元件的連接點，用二中電子線 將表面貼裝元件電連接到電路 子^件，以 10可為裸鋼或鍍有或摻雜右^入_的电子線路。焊盤 和鉛導電金屬材料中的至少一種口:導：、銅、鐵、錫、紹 學钱刻f傳統方式形成，在此不再二^具體可藉由化 的中盤1〇週邊大體呈圓形，包括-正方形 四個延伸部！ 3，各延伸部i 3 H四备、邊向外延伸出的 T形，包括鱼由、、 相互不連接。延伸部13近似 u ，、心部11相連的連接端131和遠離中心部 的寬度\νΓ/、Γ般自由端133的寬度W1大於連接端131 同，° "皿1〇週邊的大小可與現有焊盤的大小相 α ’也可根據實際情況略大於或略小於現有焊盤。 採用上述形狀的焊盤1〇後，在將表面貼裝元件與電路 板20進仃焊接的過程中，焊料在受熱融化後會自動殖滿中 心部11和延伸部13，有效防止了包焊、虛焊和焊料溢露 現象的出現。同時，由於複數延伸部13均勻分佈於中心部 11的週邊，在焊接回流過程中，焊料的表面張力作用可將 表面貼裝元件的連接部的位置自動限制在中心部u上，從 而限制表面貼裝元件在焊盤10上的漂移範圍，減小漂移幅 度貝現了對表面貼裝元件的精確定位。且當焊盤1〇週邊 形狀與現有焊盤相同時’焊盤1 〇的實際面積相對現有焊盤 面積將減小，從而節省焊料的使用。 特別的，當表面貼裝元件焊接到焊盤10上後，其每個 200906255 •連接σ卩或：fcf'點都與焊盤10的中心部n和複數延伸部13 •固疋連接，從而使得焊接到焊盤上的表面貼裝元件的連接 部或焊點與烊盤1G之間存在複數支撐點和連接點，增加了 表面貼裝7G件與焊盤的耐推力，自由端133的完度大 於，接端m的寬度W2更是提高了該優點，有效防止由 :電路:反20形變等原因造成的空焊、焊點（錫球）錫裂、 二n的現象’提高電子產品的生產良率’減少維修件 的產生。 延伸S3他了實Γ戶方式令’焊盤10財心部11可為圓形， 了為扇形，其可包括四個延伸部（如圖2)，也 可包括三個延伸部卩^ ^ 且财犯也 p (如圖3)。可以理解的是，焊盤10的 .开Γ件的連接料形狀有多種變 伸部，以，見部以及從該中心部向外延伸的複數延200906255 IX. Description of the Invention: [Technical Field] The present invention relates to a pad for soldering a surface mount component, and a circuit board and an electronic device having the same. [Prior Art] With the continuous development of science and technology, modern society and electronic technology are closely related to mobile phones, walkie-talkies, portable computers, memory, hard disk drive, optical disk drives, high-definition televisions and other electronic The application of the product is beneficial. In order to be convenient to carry and use, the user puts forward higher requirements for miniaturization and f-type of the product. Surface cracking technology (Su such as e Mount: a § "SMT) conforms to this trend, laying the foundation for the realization of electronic light, sturdy, short, and small. Since the photoelectric generation, the smt technology has reached a mature stage, with Continuous development, 7 workers, rapid development of technology, new high-density assembly technology. Ball grid array sealing (BaiiGr-^ 7疋B 2: high-density assembly technology into the pervasive stage. BGA surface mount Components (hereafter referred to as point solder bumps or solder balls and circuit boards (such as the E-face board B-face mounting element has the advantage of improved assembly yield;:::, Β: Α 装 技术 有所Reduced; the parasitic table and σ Μ 以 以 以 以 以 以 大大 大大 大大 组装 组装 组装 组装 组装 组装 组装 组装 组装 组装 组装 组装 组装 组装 组装 组装 组装 组装 组装 组装 组装 组装 组装 组装 组装 组装 组装 组装 组装 组装 组装 组装 组装 组装 组装The plate is depreciated, and it is prone to solder joint drift, ... mouth and mouth, sin comparison. In the material temperature, air soldering and solder joint tin cracking 6 200906255 etc. = 吏 The successful device is limited in many fields of application. The next ··', placement technology orders are also prone to the above problems 'the original For example, the conventional pad is generally circular or the shape of the joint is the same, and the surface of the surface of the surface is mounted on the surface of the joint of the surface mount component of the surface mount component. When the surface mount component and the circuit board are spliced and solidified, the solder paste is solidified from its original center 1 , and the surface mount component is pulled up and the second surface is mounted on the surface mount component. The foot is on the pad 1 and the taste is shifted, which causes the position of the surface mount component to be misaligned. (4) There is a short circuit between the package solder and the ==. A special watch: := one, two : The pad on the board is round, and its surface is mounted. The 3 solder joints: The connection between the Japanese and the Japanese is limited by the shape of the solder on the board. π20; Only one support point, the surface mount component is weaker. When the board is heated, it will be deformed (bent). Only the solder joints and pads of the support point are high in shape or other conditions. Bga component surface accounted for even solder joints (solder balls) tin cracking, BGA meter application is limited to see money #BGA 11 pieces in [Inventive content] In many fields, in view of this, it is necessary to provide an improved pad to improve the soldering quality of the surface mount and the pad. In addition, it is necessary to provide a The pad of the circuit board and the electronic device 200906255. A pad for soldering a surface mount component, comprising: a central portion, and a plurality of extensions extending outwardly from the central portion, the plurality of extensions present between each other σ A circuit board having a surface formed with a plurality of pads for soldering surface mount components, at least one of the plurality of pads including a core portion and a plurality of extensions extending outward from the center portion The plurality of delays have a gap between each other. An electronic device comprising at least a block circuit board and a surface mount component soldered on the circuit board, the circuit board surface being formed with a plurality of surfaces for soldering the surface a pad of the mounting component; at least one of the plurality of pads: a bag & a core portion and a plurality of extensions extending outward from the central portion, the plurality of extensions being mutually There is a gap between. The pad of the invention has a central portion and a plurality of extensions such that the connection portion of the surface mount component is limited to a central position on the pad, minus = consumption, in order to accurately position the surface mount component; After the soldering, the solder will pass the solder, the solder will feed the extension of the pad, the connection of the surface mount component on the soldering disc or the tandem and the == there will be a plurality of points, which increases Surface mount group = There is a phenomenon of empty soldering, over-welding, and solder spillage, except for the yield rate. In summary, the invention can improve the production yield of electronic products and reduce the generation of maintenance parts. [Embodiment] As shown in Fig. 1, a pad 10 is provided on a circuit board 20. Among them, the electric 200906255 road board 20 can be the connection point of the ^|jf ^ road and the surface mount component, and the surface mount component is electrically connected to the circuit component by the two middle electron wires, and the 10 can be bare steel or plated. Or doping the right electronic circuit. At least one of the pad and the lead conductive metal material: the guide: copper, iron, tin, and the traditional method of forming the money, which is no longer formed by the middle of the middle plate 1 Shape, including - four extensions of the square! 3. The extensions i 3 H are four-piece, and the T-shapes extending outward from the sides include fish and are not connected to each other. The extension portion 13 is approximately u, the connection end 131 of the core portion 11 and the width away from the center portion, and the width W1 of the free end 133 is larger than the connection end 131, and the size of the circumference of the dish 1 The size of the existing pad α ' can also be slightly larger or slightly smaller than the existing pad according to the actual situation. After the pad 1 of the above shape is used, during the process of soldering the surface mount component and the circuit board 20, the solder automatically fills the center portion 11 and the extension portion 13 after being melted by heat, thereby effectively preventing over-welding, The phenomenon of solder joints and solder spills. Meanwhile, since the plurality of extensions 13 are evenly distributed around the periphery of the center portion 11, the surface tension of the solder can automatically limit the position of the connection portion of the surface mount component to the center portion u during the solder reflow process, thereby limiting the surface sticker. The drift range of the mounted components on the pad 10 reduces the drift amplitude and provides accurate positioning of the surface mount components. And when the pad 1〇 peripheral shape is the same as the existing pad, the actual area of the pad 1 〇 will be reduced relative to the existing pad area, thereby saving solder use. In particular, when the surface mount component is soldered to the pad 10, each of its 200906255 • connection σ卩 or :fcf′ points are connected to the central portion n and the plurality of extensions 13 of the pad 10, thereby making There are a plurality of support points and connection points between the connection portion or the solder joint of the surface mount component soldered to the pad and the pad 1G, which increases the thrust resistance of the surface mount 7G device and the pad, and the completion of the free end 133 If the width W2 of the terminal m is greater than this, the advantage is improved, and the air soldering, solder joint (solder ball) cracking, and the phenomenon of "n" caused by the circuit: anti-20 deformation and the like are effectively prevented to improve the production of electronic products. Yield 'reduces the generation of repair parts. Extending S3, he has a house-to-house approach, so that the pad 10 can be circular, fan-shaped, which can include four extensions (as shown in Figure 2), and can also include three extensions 且 ^ ^ The financial prisoner is also p (Figure 3). It can be understood that the shape of the connecting material of the pad 10 has a plurality of extensions, such as a portion and a plurality of extensions extending outward from the central portion.
件與桿盤的耐推力、節 S面貼裝7L 利_、、，+ ^ 即嗜知枓、避免出現空焊、包焊、煜 枓-露的現象’提高電子產品的生產良率。4坏 成焊1陣列明中的電路板20可具有複數焊盤，形 : = ; =表面貼裝元件，如圖4、圖5所示。 有口 P刀；fcp盤採用本發明戶斤述 部焊盤都採用本發明所述的形狀 ：狀1::全 為傳統的圓形谭盤，焊盤 /所不，其中焊盤 同。 〇的週邊大小與焊盤70的相 π參閱@ 6’為本發明一實施 + 其包括電路柘Μ #主 飞笮的电子裝置100， 板3〇和表面貼裝元件％。其中，表面貼裝元 10 200906255 .:50可為電阻、電容、積體電路元件、按鍵或 貫施例中，所述電子元件5〇為採 本 η休用BCJA技術封裝的積體 :蹊二，'下表面設置有複數錫球60組成的球栅陣列。 ^反30上設置有複數焊盤40，每個焊盤40都包括—中 Μ，以及從該中心部向外延伸的複數延伸 ::勻分佈於中心部的週邊，且延伸部的自由端的= ㈣，接端的寬度’其形狀可採用如圖丄所示的形狀，立 週邊大小可與現有圓形焊盤大小相同。 八 所述電子裝置在組裝過程中，會首先在電路板州 的焊盤40上塗布上錫f等焊接材料，然後將 5〇貼裝到電路㈣上，使表面貼裝元件50的複數^牛〇 :立於對應的焊盤40上，而後經過回焊爐將 5〇焊接到電路板30上，從而形成電子裝置100。件 mp:::解的疋’對於本領域的普通技術人員來說，可 二根據^明的技術構思做出其他各種相應的改變 護範圍。 ^、-形都應屬於本發明權利要求的保 【圖式簡單說明】 圖1為—實施方式中垾盤的平面示意圖。 圖2為另—實施方式中焊盤的平面示意圖。 圖3為再—實施方式中谭盤的平面示意圖。 圖4為又—實施方式凡 面示意圖。 1中-置有知盤陣列的電路板的平 圖5為另一實施方式中設置有焊盤陣列的電路板的平 11 200906255 面示意圖。 圖6為一實施方式中電子裝置的結構示意圖。 【主要元件符號說明】 悍盤 10 電路板 20 中心部 11 延伸部 13 連接端 131 自由端 133 自由端的寬度 W1 連接端的寬度 W2 悍盤 70 電子裝置 100 電路板 30 悍盤 40 表面貼裝元件 50 錫球 60 12The thrust resistance of the piece and the plate, and the 7-side mounting of the section S are good for _,,, + ^, which means avoiding the phenomenon of air welding, over-welding, and 枓----increasing the production yield of electronic products. 4 The board 20 of the soldering array 1 can have a plurality of pads, shape: =; = surface mount components, as shown in Figures 4 and 5. There is a mouth P knife; the fcp disk adopts the shape of the invention according to the invention. The shape of the invention is as follows: shape 1:: all are traditional round tan plates, pads/no, where the pads are the same. The size of the periphery of the crucible and the phase π of the pad 70 are referred to as @6'. An embodiment of the present invention includes an electronic device 100, a board 3, and a surface mount component % of the circuit 柘Μ #main flying raft. Wherein, the surface mount component 10 200906255 . : 50 can be a resistor, a capacitor, an integrated circuit component, a button or a solution, and the electronic component 5 is an integrated package of the BCJA technology package: 蹊二, The lower surface is provided with a ball grid array composed of a plurality of solder balls 60. The counter 30 is provided with a plurality of pads 40, each of which includes a middle, and a plurality of extensions extending outward from the central portion: uniformly distributed around the center portion, and the free end of the extension = (4) The width of the joint' can be shaped as shown in Figure ,, and the size of the vertical perimeter can be the same as the size of the existing circular pad. In the assembly process, the electronic device is first coated with solder material such as tin f on the pad 40 of the circuit board state, and then 5 〇 is mounted on the circuit (4) to make the surface mount component 50 〇: Standing on the corresponding pad 40, and then soldering 5 〇 to the circuit board 30 through a reflow oven, thereby forming the electronic device 100. The mp:::solution 疋' can be used by those skilled in the art to make various other corresponding changes depending on the technical concept. The ^ and - shapes are all in accordance with the claims of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view showing a disk in an embodiment. 2 is a schematic plan view of a pad in another embodiment. Figure 3 is a plan view of a Tan disk in a re-embodiment. Fig. 4 is a schematic view showing still another embodiment. 1 is a plan view of a circuit board in which a disk array is placed. Fig. 5 is a plan view showing a circuit board in which a pad array is provided in another embodiment. FIG. 6 is a schematic structural view of an electronic device according to an embodiment. [Main component symbol description] 10 10 10 circuit board 20 center portion 11 extension portion 13 connection end 131 free end 133 free end width W1 connection end width W2 悍 disk 70 electronic device 100 circuit board 30 40 disk 40 surface mount component 50 tin Ball 60 12