TW200848487A - Cleaning sheet, transporting member having cleaning function and method for cleaning substrate treating apparatus - Google Patents

Abstract

Disclosed are: a cleaning sheet excellent in both of conveyability in a substrate-processing apparatus and an ability of removing foreign matters adhered in the apparatus; a conveying member having a cleaning function, which employs the cleaning sheet; and a method for cleaning a substrate-processing apparatus by using the cleaning sheet or the conveying member. Specifically, the cleaning sheet is characterized by having a cleaning layer on one surface of a base material and an adhesive layer on the other surface (i.e., a surface on which the cleaning layer is not provided) of the base material, wherein the adhesive layer comprises a layered silicate.

Description

200848487 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a cleaning sheet. Further, the present invention relates to a conveying member having a cleaning function using a cleaning sheet, and further relates to a cleaning method using the substrate processing apparatus. Specifically, it can be used as a cleaning sheet for a substrate processing apparatus, such as a semiconductor device such as a semiconductor device, a flat panel display, or a printed circuit board, and the like. [Prior Art] A manufacturing apparatus such as a semiconductor, a flat panel display, or a printed circuit board, an inspection apparatus, and various substrate processing apparatuses are configured such that each of the transport systems is in physical contact with the substrate and transported. At this time, if foreign matter adheres to the substrate or the transport system, the subsequent substrates are successively contaminated. Therefore, it is necessary to periodically stop the apparatus and perform a cleaning process for removing foreign matter. Therefore, there is a problem that productivity is lowered or a labor force is required. Further, there is a problem that foreign matter adheres to other parts due to human intervention during washing. In order to solve such problems, there has been proposed a method of cleaning and removing foreign matter adhering to a substrate processing apparatus by transporting a substrate to which an adhesive is adhered (Patent Document 1). • However, when the cleaning sheet is used in the substrate processing apparatus in a high-temperature environment, the cleaning sheet may be peeled off from the substrate to be conveyed, and the conveyance may become difficult to remove, and the foreign matter may not be removed. Patent Document 1: Japanese Patent Application Laid-Open No. PCT No. 154686. SUMMARY OF THE INVENTION Problems to be Solved by the Invention 128847.doc 200848487 Therefore, an object of the present invention is to provide a substrate processing apparatus in view of the above-described circumstances, even in In a high-temperature environment, a cleaning sheet excellent in both good transportability and trapping property against foreign matter adhering to the apparatus further provides a cleaning member having a cleaning function using a cleaning sheet, and cleaning using a substrate processing apparatus using the same method. Means for Solving the Problems As a result of intensive studies, the inventors of the present invention have found that the above (4) can be achieved by using the following cleaning sheet, thereby completing the present invention. That is, the present invention is a cleaning sheet characterized in that it is a cleaning sheet having a cleaning layer on one side of a support substrate and an adhesive layer on one side of a support substrate on a side where the cleaning layer is not provided, and The adhesive layer contains a layered silicate. In the above cleaning sheet, the adhesive layer is aliquoted with respect to the adhesive 100, and contains 1 part by weight or more of the above layered silicate. In the conveying member having the cleaning function of the present invention, it is preferable that the cleaning sheet is provided on the conveying member via the fixing adhesive layer. In the cleaning method of the substrate processing apparatus of the present invention, it is preferable to transport the above-described transport member having the 'moon cleaning function' to the substrate processing apparatus. EFFECT OF THE INVENTION The cleaning sheet of the present invention has an adhesive layer containing a layered tantalate. By using the layered niobate, the adhesive layer J can increase the cohesive force of the adhesive layer and maintain the adhesion to the conveying member. X, even after the high-temperature heat treatment, 1, the transfer of the workpiece to produce adhesive residue, can be peeled off, in this regard, 128847.doc 200848487 effect. The cleaning member having the adhesive layer is transported to the substrate for processing and penetrating inside the processing unit, and the device is maintained in a good condition. And can be good [Implementation] 1 test the foreign body.

The cleaning sheet of the present invention will be described below with reference to the drawings. As shown in the figure! The cleaning sheet shown on the support substrate is a single S, a main kiss 尻 λ 匁硐, and a 糸 layer 2. Further, the support substrate of the side of each of the layers 2 is not provided with J ^ 4. 卞W /, and the adhesive layer 4 for fixing. Furthermore, it is also possible to clean the layer 2 and the separation membrane. Further, as shown in FIG. 2, the conveying member having the cleaning function of the present invention has a fixing adhesive 4 on one side of the conveying member 5, and an adhesive on the side not connected to the conveying member. The support substrate is provided on one side of the layer 4 and further has a cleaning layer 2 on the support substrate 1. Further, the film can also be separated on the surface of the cleaning layer 2. The support base material 1 is not particularly limited as long as it can be a support base material for a cleaning sheet. For example, a polyolefin resin such as polyethylene or polypropylene, a polyester such as polyethylene terephthalate A cellulose-based resin such as a lyophilized cellulose, a polycarbonate resin, a polyamide resin, a polyimide resin, a polycarbodiimide resin, or a vinyl resin. Film and so on. The thickness of the less-supporting substrate is usually preferably about 10 to 300 μη. Further, the support substrate of about 30 to 200 μm is preferable in terms of handling. Further, when the cleaning layer is used in the case of a photocurable adhesive, a plastic sheet which is permeable to ultraviolet light or the like is used. Further, as the substrate, a metal foil may be used as needed. The substrate such as 128847.doc 200848487 can also be subjected to various surface treatments on the surface thereof, for example, chrome tanning treatment, ozone exposure, flame exposure, high voltage electric shock exposure, ionizing radiation treatment, etc. Coating treatment of a lower coating agent (for example, an adhesive substance). In the cleaning layer 2 of the present invention, if it is adhesive, it is not particularly impotence, material, or composition, and various materials such as acrylic, rubber, and polyoxo can be used. It is an acrylic type, and it is especially preferable that it is hardening of the radiation hardening or thermosetting acrylic adhesive. Hereinafter, a radiation curable or thermosetting acrylic adhesive will be described. The radiation curable or thermosetting acrylic adhesive can be used without any particular limitation, such as a radiation curable or thermosetting functional group having a carbon-carbon double bond and exhibiting no adhesiveness. As the functional group, those having a (meth)acryl fluorenyl group are preferred. The (meth) acrylonitrile group means an acryl fluorenyl group and/or a decyl acryl fluorenyl group. Hereinafter, (methyl) also means the same meaning. The radiation-curable or thermosetting acrylic-based pressure-sensitive adhesive may be, for example, a pressure-sensitive acrylic pressure-sensitive adhesive based on an acrylic polymer as a base polymer, or a radiation curable or thermosetting monomer component or The valence polymer component is an additive type curable adhesive which is a polymerizable unsaturated compound. As the acrylic polymer, for example, an acrylic acid-based alkyl ester and/or an acrylic polymer having an alkyl acrylate as a main monomer is preferably used. Specifically, an alkyl (meth)acrylate is used. Esters (eg methyl ester, ethyl acetate, propyl ester, isopropyl ester, butyl ester, isobutyl ester, second butyl ester, tert-butyl ester, amyl ester, isoamyl ester, hexyl ester, heptyl ester, octyl ester, 2 -ethylhexyl ester, iso 128847.doc 200848487

Acrylic polymerization of 18 linear or branched chains of a group of esters, dodecyl esters, etc.

And other carboxyl group-containing monomers; anhydride monomers such as maleic anhydride and itaconic anhydride; (meth)acrylic acid 2- to ethyl acetate, (meth)acrylic acid 2, propyl _, (meth) acrylic acid hydroxybutyrate Ester, 6-hydroxyhexyl (meth)acrylate, (meth)propenyl 8-hydroxyoctyl ester, 10-hydroxydecyl (meth)acrylate, 12-hydroxydodecyl (meth)acrylate, a hydroxyl group-containing monomer such as (meth)acrylic acid (4-hydroxymethylcyclohexyl)methyl ester; styrenesulfonic acid, acrylic acid sulfonic acid, 2·(meth)acrylamide amine-2-methylpropanesulfonic acid, a sulfonic acid group-containing monomer such as (meth)acrylonitrile-propanesulfonic acid, sulfopropyl (meth)acrylate or (meth)acryloxynaphthalenesulfonic acid; 2-hydroxyethylpropenylphosphonate And other phosphate-containing monomers; glycidyl methacrylate, (meth) acrylamide, N-hydroxymethyl decyl (meth) acrylate, alkyl amino alkyl (meth) acrylate Ester (such as dimethylaminoethyl methacrylate, butyl butyl methacrylate, etc.), N-vinyl fluorene _, propylene, ketone, ethyl acetate, propionic acid B: Fcipg, benzene Dilute, propylene guess; (meth) Cycloalkyl acrylate (such as cyclopentyl ester, cyclohexyl ester, etc.) and the like. These monomer components which can be copolymerized may be used alone or in combination of two or more. In the above-mentioned copolymerizable single unit 128847.doc 200848487, it is preferred to use *, preferably 40% by weight or less based on 70% by weight of the total monomer component.

The use of the monomer is f, and it is preferably 70% by weight or less, more preferably 3% by weight or less, based on the total adhesion of the monomer component. In addition, in order to carry out crosslinking, the above-mentioned acrylic polymer may be a copolymerized monomer component as needed. Examples of the poly-adjuvant-precipitate include hexanediol di(methyl)propyl acetoacetate, (poly)ethyl-K methyl propyl acetoacetate, and (poly) propylene glycol di(methyl) propyl acrylate. Dilute vinegar, pentane: alcohol _ (meth) acrylate, pentaerythritol di (meth) acrylate, trimethylolpropane tri(mercapto) acrylate, pentaerythritol tri(methyl) propylene hydride, Pentaerythritol hexa(indenyl) acrylate, epoxy (meth) acrylate, polyester (meth) acrylate, urethane (meth) acrylate, and the like. These polyfunctional monomers may be used alone or in combination of two or more. Multifunctional

The above acrylic polymer can be obtained by polymerizing a single monomer or a mixture of two or more kinds of monomers. The polymerization can be carried out in any manner such as solution polymerization, emulsion polymerization, bulk polymerization, suspension polymerization or the like. The weight average molecular weight (Mw) of the acrylic polymer is preferably from 500,000 to 150,000, more preferably from 80,000 to 1,200,000. Further, the degree of dispersion (Mw/Mn) of the weight average molecular weight (Mw) and the number average molecular weight (?η) is preferably 6 to 1 Torr. The reset average molecular weight is converted by standard GPC by the GPC method. Using the HLC-8120GPC manufactured by Tosoh as the GPC body, the column temperature is 40 C, the pump flow is 0.5 ml/min, and the data processing system using the debt detector ri uses the standard polystyrene of the known molecular weight. The line (having a molecular weight of 500 to 20.6 million) was obtained by converting the molecular weight to obtain the amount of the molecule 128847.doc 200848487. Use the column: ^ rSKSel GMH-H(S)x2 root (manufactured by Tosoh) Mobile phase ·· Tetrahydrofuran injection amount: 100 μ1 Sample concentration: i.0g/1 (tetrahydroanthracene. South solution) 2 The degree of relaxation is calculated as The ratio of the weight average molecular weight to the number average molecular weight. The enthalpy of the number average molecular weight is carried out in the same manner as the measurement of the weight average molecular weight. A polymerizable unsaturated compound which can be cured by an active energy source such as radiation or heat and which has one or more unsaturated double bonds in the knives can be used in the month/tantal layer 2. It is preferred to use a polymerizable unsaturated ester which is a compound having two or more unsaturated double bonds. This component is adapted to control the adhesion so that the cleaning layer and the portion to be cleaned are not strongly adhered to during the conveyance, and the coefficient of the system can be lowered by adding these. The polymerizable unsaturated compound is preferably a low molecular weight body which is nonvolatile and has a weight average molecular weight of 10,000 or less, and particularly preferably has a molecular weight of 5,000 or less so that the three-dimensional networking efficiency of the cleaned layer upon hardening is changed. it is good. Specific examples of such a polymerizable unsaturated compound include phenoxy polyethylene glycol (meth) acrylate, ε_caprolactone (meth) acrylate, and polyethylene glycol bis (methyl). Acrylate, polypropylene glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, tetraethylene glycol di(meth)acrylate, 1,6-hexanediol (Τ) Acrylate, trimethylolpropane tris(f) acrylate, tetramethylol methane tetra(meth)acrylic acid 128847.doc 12 200848487 = pentaerythritol tri(meth)acrylate, pentaerythritol tetra(methyl) Acrylic vinegar, dipentaerythritol monoperylpenta(methyl) acrylate vinegar, dipentaerythritol hexa(meth) acrylate, neopentyl glycol di(meth) acrylate, etc. (methyl) propyl T and 7 L of alcohol One or two or more kinds of the above-mentioned hydrazines can be used as the acetate, the methic acid, the (meth) acryl, the bismuth (meth) acrylate, the oligo (meth) acrylate, and the like. The amount of the polymerizable unsaturated compound (monomer component, oligomer component) is preferably from 3 to 1 (10) by weight, more preferably from 5 to 80, based on 1 part by weight of the acrylic polymer. The parts by weight are more preferably 10 to 70 parts by weight, more preferably 10 to 60 parts by weight. Further, as the radiation curable or thermosetting acrylic adhesive, in addition to the above-described additive type, a base of a polymer or a main chain or a carbon-carbon double bond at the end of a main chain may be used as a basis. An intrinsic type of hardenable adhesive for polymers. The intrinsic type curable adhesive does not need to contain an oligomer component as a low molecular component, or is not contained in a large amount, and therefore does not cause a phenomenon in which the polymer component is equal to the movement in the adhesive, and a layer structure can be formed. Adhesive layer. The above-mentioned base polymer having a carbon-carbon double bond can be used without any particular limitation, and has a carbon-carbon double bond and has adhesiveness. As such a base polymer, an acrylic polymer is preferred as a basic skeleton. The basic skeleton of the acrylic polymer is exemplified by the above-exemplified acrylic polymer. The introduction method of introducing the carbon-carbon double bond to the above acrylic polymer is not particularly limited. Various methods can be employed to introduce a carbon-carbon double bond into the polymer branch 128847.doc -13 - 200848487 in the chain for molecular design. For example, a method in which a monomer having a functional group is copolymerized on an acrylic polymer and a compound having a functional group reactive with the functional group and a carbon-carbon double bond is maintained in a carbon-carbon double bond is exemplified. Radiation hardening and condensation or addition. Examples of the combination of the functional groups include an acid group, an epoxy group, a decanoic acid group, a nitrogen-based group, a thiol group, and an isocyanate group. Among the combinations of these functional groups, the easiness of self-reaction tracking is tested, and the combination of 疋 ^ ^ 1 ^ 权 适 疋 与 与 与 与 。 。 。 。 。 。. Further, in the case where a combination of the above-described acrylic acid-based polymer having a carbon-carbon double bond is produced by the combination of the genus and the base, the functional group may be located on either side of the acrylic polymer and the above compound. In a preferred combination, it is preferred that the acrylic polymer has a hydroxyl group and the upper compound has an isocyanate group. In this case, as an isocyanate compound having a carbon-carbon double bond, Examples thereof include methacryl oxime isocyanate, 2-methyl propylene oxy methoxyacetate, isopropyl isodecanoate, m-isopropenyl _ α, α-dimethyl benzyl isocyanate. Further, as the acrylic acid polymer, ϋ, the above-exemplified hydroxyl group-containing monomer ethyl bromide test, butyl vinyl ether, diethylene glycol monoethyl bromide, and the compound (four) compound can be used. Aggregator. The above-mentioned intrinsic type hardening adhesive can be used in the same manner as the base polymer (acrylic polymer) having the above carbon-carbon double bond, and the above hardenable monomer can be blended to the extent that the properties are not deteriorated. Knife or fuss composition. In the case of an intrinsic type hardenable adhesive, it is preferred that the cerium contains 40% by weight or more of the above base polymer having a carbon-carbon double bond, and more preferably 50% by weight or more of the above carbon-carbon. The base polymer of double bonds. In the above-mentioned curable acrylic adhesive (4), a starter can be contained according to the hardening method of 128847.doc -14-200848487. When the curable adhesive is cured by ultraviolet rays or the like, a photopolymerization initiator is contained. Examples of the photopolymerization initiator include 4-(2-hydroxyethoxy)phenyl (2-hydroxy-2-propyl) ketone, cardinyl hydroxyl group, methyl group B-, 2-methyl-2- An alcoholic compound such as phenylacetone or 1-cyclohexyl phenyl ketone; methoxyacetophenone, 2,2-dimethoxy _w'卞. ,▲_T Sign_Bu L4_(Methylsulfide

Acetophenone-based compounds such as 2-phenyl-phenyl-propanyl-propanone; benzoin, benzoin, abirate, fennel, and other benzoin ethers; benzoic dimethyl condensate Ketones and other compounds (4); 2_Caiqi brewing gas and other aromatic == compounds; 1-benzene is called propylene, _B_^ m compound; benzophenone, benzoylbenzoic acid, , -methyl -4·Methyllacyl benzophenone _ et al., bismuth ketone ketone, 2-methyl ketone monomethyl (tetra) _: iso = geronic ketone, 2, 4 dioxin (tetra) ketone, 2, 4 _ Ethyl (tetra) broad, ... isopropyl tyanate and other thioxanthene, phosphine oxide ~ phosphonic acid vinegar: two =; bismuth halide based on the composition of the (4) material of the sticky (four), relative 7: for the type of the amount of the agent , Example 2:::r plus external crosslinker. As a cross-linked polymer, it can be added with a functional group of anti-accumulating thiol or a trans-acidic acrylic acid; = such as a decanoic acid ester, an epoxy compound, or a "cyanate ester" A method of reacting a polyisoprene compound, a melamine-based cross-linking agent, a urea resin, an anhydrous compound, a polyamine, a carboxyl group-containing polymer, various metal salts, a chelate compound, and the like. The amount of the crosslinking agent (polyfunctional compound) to be used is not particularly limited. For example, it is preferably 20 parts by weight or less based on 100 parts by weight of the acrylic polymer, more preferably The amount of the crosslinking agent may be one or two or more kinds of the crosslinking agents. In addition to the above components, the above-mentioned adhesive may be used as needed.

Various additives such as tackifiers, anti-aging agents, fillers, colorants, chain transfer agents, plasticizers, and the like are known. The solvent used in the preparation of the above adhesive is not particularly limited, and an organic solvent is usually used. As the organic solvent, the adhesive composition can be uniformly dissolved, and the film stability at the time of film formation is good. Examples of the organic solvent include: butadiene, hexane, gengyuan, toluene, o-xylene, m-dimethyl-p-xylene, cyclohexane, methanol, ethanol, isopropanol, pentanol, cyclohexanol, 2. methylcyclohexanol, diethyl ether, diisopropyl ether, dibutyl ether, diphenyl ether, tetrahydrofuran, acetone, methyl ethyl ketone, methyl isobutyl ketone, 2 - heptanone (methyl amyl ketone), Diisobutyl ketone, cyclohexanone, methylcyclohexanone, cyclopentane, pentyl acetate, methyl acetate, ethyl acetate, propylene acetate, butyl acetate, N,N-dimethylformamide (DMF), n, n-dimethylacetamide (Kalamine N-methylpyrrolidone, 2-methoxyethyl _, 2 ethoxy ethoxylate: 2 · butoxyethanol, etc. as the above organic The solvent is preferably acetic acid: hydrazine, formazan, = toluene, etc. By the solvent, the adhesive composition is usually prepared to have a solid concentration of 5 to 50% by weight, preferably 5 to 3 Torr. / 〇, more preferably a solution of 1 〇 25% by weight. 128847.doc -16- 200848487 The borrowing: The thickness of the cleaning layer 2 formed by the sizing agent is not particularly limited, the lord is 5 to 10 〇 Ιιη left Preferably, it is about 2 〇 to 6 。. If it is not 5 _ ', the shape followability of the cleaning layer is reduced, and the trapping property is reduced by + 2 士 ^ ^, and the factory is low. On the other hand, if it exceeds Η)〇μιη, it may become too thick to be handled. Γ 形成 Method of forming a cleaning layer The acrylic adhesive can be applied to a support to form an adhesive composition layer. As the formation method, each method can be employed. For example, when continuous coating or setting is used for the formation of the adhesive composition layer, for example, the adhesive composition is continuously supplied (the dissolution device is continuously applied to the thin soil material by a discharge device such as a mold attached to the front end of the device). A method of extruding into a thin layer. Further, as a method of forming an adhesive composition, in the case of a batch method, it is exemplified that: the adhesive composition (solution) is cast on a support substrate. The substrate is formed by an applicator, a rod, or a blade coater. Thereafter, the thinned adhesive composition is laminated on a support substrate, and then heated to remove the solvent. In the case of radiation curable or thermosetting acrylic acid=adhesive, the adhesive is applied to a carrier, dried, and then subjected to radiation hardening or thermal hardening. When the agent composition layer is irradiated with radiation or heated, the acrylic acid-based adhesive is hardened, the oxygen barrier is prevented, and the flat surface is smoothed, and the adhesive layer is gradually dipped, and the surface of the coating layer is Coverage insurance In the state of the film, the hardening treatment is carried out, whereby the curing degree and the degree of crosslinking caused by the oxygen resistance during the curing of the adhesive can be suppressed (4). The protective film is not particularly limited, and examples thereof include polyethylene and polypropylene 128847. .doc 17- 200848487 Polyene, polyethylene terephthalate, acetonitrile, polycarbonate, decylamine, polycarbodiimide, ruthenium, yttrium, etc. The thickness of the protective film is preferably from 10 to 100 μm. When a radiation curable adhesive is used in the formation of the cleaning layer, a plastic film having a relatively high transparency such as "through" or "external" is selected. As the protective film, various peeling treatments may be applied to the surface facing the adhesive, and it may be used as a peeling film which is generally used.

As the film 4, it is preferable to use a film having an average coarse slit degree (four) of 0.01 to 0.3 μπ^, more preferably 〇〇2 to 〇28 _. The surface having the above-mentioned center line average roughness (Ra) covers the surface side of the above-mentioned adhesive composition layer. By using the protective film, the surface of the center line average roughness (Ra) is transferred to the surface of the cleaning layer, and the center line average roughness (Ra) can be controlled to nw _, thereby achieving both transportability and foreign matter. Capture twins. If the average center line roughness (Ra) of the above center line is less than 〇〇1, it is not good for transporting the twins. Moreover, when the center line average roughness (Ra) exceeds Ο·] μηι, it is not preferable in terms of foreign matter collection property. The above α layer preferably has a tensile elastic modulus of 〇 98 MPa to 4 〇〇 MPa. If the tensile modulus of elasticity exceeds 4 〇〇 Mpa, there is a case where the adhesion of the surface of the 糸 layer is low, and even if the concave portion 4 is formed on the surface of the cleaning layer, the aspect of the foreign matter trapping function is not exhibited. Further, when the temperature is less than 98 MPa, there is a possibility that even when the concave portion is formed on the surface of the cleaning layer, the surface structure is deformed and the inside of the conveying device is followed. The tensile modulus of elasticity is preferably from 1 MPa to 3 Å Mpa, more preferably from 10 MPa to 200 MPa. The tensile modulus of elasticity can be determined according to the composition of the acrylic acid adhesive of 128847.doc -18-200848487, for example, acrylic polymer and polytropic:: and compound (monomer component, polymer component) ) The amount of the mixture should be set to 0 Ο c and 'When the above cleaning layer is used as a cleaning sheet, attach it to the mirror surface of the wonderful wafer at a width of 10 mm at room temperature (23. The tensile speed is 3 〇〇 / / minutes measured for m9G. The peeling force is preferably N / U) mm, more preferably on 〇 _ _. If the force is less than 0.05 N/10 mm, the foreign matter cannot be removed. If it exceeds 1.5 N/l 〇 mm, it will follow the inside of the transfer device. In the adhesive layer 4 for fixing of the present invention, if it is adhesive, the material or the constitution thereof is not particularly limited, and an adhesive such as an acrylic or rubber-based adhesive can be used. Acrylic adhesive. As the fixing adhesive layer, a double-sided tape can also be used. The above-mentioned adhesive layer ' can be attached to a transport member such as various substrates or other tapes and sheets, and can be transported as a transport member having a cleaning function to the device to be cleaned by coming into contact with the portion to be cleaned. An acrylic polymer which is mainly composed of a (four) acid monomer having a low glass transition temperature (Tg) for imparting adhesion can be used as the acrylic-based Lemo-added product. The monomer, which is a monomer having a high Tg imparting an adhesive force or a cohesive force, is formed by a monomer having a functional group for improving crosslinkability or adhesion, that is, a monoethylenically unsaturated monomer. Examples of the main monomer include (meth)acrylic acid, (meth)acrylic acid, (meth)acrylic acid, and (methyl)acrylic acid.曰(Methyl) propylene hexamethylene vinegar, (ethyl) propylene succinic acid 2-ethylhexyl vinegar, (A 128847.doc -19- 200848487 base) isooctyl acrylate, isophthalic acid (meth) acrylate An alkyl group having an alkyl group such as an ester, an oxime (meth)acrylate or a dodecyl (mercapto)acrylate, or an acrylic polymer having two or more monomer components. Examples of the above-mentioned co-monomer include vinyl-containing compounds such as ethyl acetate, ethyl propionate, vinyl ether, ethylene, acrylonitrile, and methacrylonitrile. Examples of the functional group-containing monomer include carboxyl group-containing monomers such as acrylic acid, mercaptoacrylic acid, itaconic acid, maleic acid, fumaric acid, and crotonic acid; 2-hydroxyethyl (meth)acrylate; Hydroxy-containing monomer such as 2-hydroxypropyl acrylate, 4-hydroxybutyl (meth) acrylate, N-methylol acrylamide, propylene alcohol, etc.; (meth) acrylate diammonium a tertiary amino group-containing monomer such as vinegar, diethylaminoethyl (meth)acrylate or dimethylaminopropyl (meth) acrylate; a guanamine group such as acrylamide or decyl acrylamide Monomer; N-methyl (meth) acrylamide, N-ethyl (meth) acrylamide, N-methoxymethane (methacrylamide, N-ethoxymethyl (methyl) An N-substituted guanamine-based monomer such as acrylamide, hydrazine tert-butyl (meth) acrylamide, N-octyl (meth) acrylamide or the like; an epoxy group such as glycidyl methacrylate A monomer or the like. These monomer components which can be copolymerized may be used in combination of two or more kinds. The amount of these monomers which can be copolymerized is preferably 7% by weight or less based on the total monomer component. , 40% by weight or less. The acrylic adhesive may suitably contain a crosslinking agent, and examples thereof include an isocyanate crosslinking agent, an epoxy crosslinking agent, an aziridine crosslinking agent, and a chelate crosslinking. The amount of the crosslinking agent to be used is not particularly limited. For example, it is preferably from 01 to 15 parts by weight, more preferably from 1 to 15 parts by weight, based on 100 parts by weight of the above-mentioned propylene 128847.doc • 20 to 200848487 acid polymer. ～10 parts by weight. The layered bismuth sulphate, the sillimanite, the serpentine, the pearlite, and the pearlite are not particularly limited, and examples thereof include saponite, hectorite, pearl mica, and talc. , phlogopite, chlorite, vermiculite, kaolinite, green crispy mica, pyrophyllite, montmorillonite, aluminum bentonite, iron bentonite, four stone fluorite mica, sodium band mica, leaf serpentine, water Kaolin, etc. Ο The above-mentioned layered citrate may be used in any of natural or synthetic materials, or may be used in combination of two or more kinds. The average length of the above-mentioned layered citrate is preferably 0〇i~i〇〇, more preferably 0.05~Η) μΐη, The aspect ratio is preferably 2〇~5〇〇, preferably 50~200. < The amount of the above-mentioned layered citrate is not particularly limited, and it can be appropriately determined to use the summer, and to obtain the heat and the mold release by the conjugate. The amount of the acid salt of the above-mentioned acrylic polymer is preferably more than 10 parts by weight, more preferably 0 to 40 parts by weight, based on 1 part by weight of the above acrylic polymer. If it is less than 1 part by weight, it is difficult to exhibit stagnation resistance. Further, although it is preferably less than _ by weight, there is no particular limitation, and it is also possible to add 1 part by weight or more. According to the usage amount of the above range, both the heat resistance performance and the mold release effect (10) disengagement force can be achieved, and the amount of the system is ideal. The solvent to be used in the preparation of the above-mentioned adhesive is not particularly limited. The organic solvent may be used, and the solvent used for the adhesive for forming the above cleaning layer may be used. The method of forming the above-mentioned adhesive layer of X' can be carried out by a known method generally used in 128847.doc 21 200848487. The thickness of the above-mentioned dot agent layer is not particularly limited, and is usually H) to 4 〇 _ 乂 right, preferably about 15 to 30 Å. If it is less than 1〇, there is a case where it is not: and it is peeled off. On the other hand, if it exceeds 4 〇 _ too thick, it is difficult to operate. In the state in which the adhesive layer 4 of the present invention is bonded to a conveying member (for example, a glass substrate), it is (10) with respect to the conveying member. The stretching speed is 805 mm or more after the heating of the coffee/^ tearing (7) hours. In this case, the cleaning sheet of the present invention can maintain the adhesion without peeling off from the substrate even in the case of the guest in the substrate processing apparatus, and the brothers in the same position, and can ensure the conveyability and the excellent performance. Foreign matter trapping. Preferably, the layer 4' is preferably a storage elastic modulus of 〇, more preferably G. 5 to 2 MPa. If the storage elastic modulus exceeds 10, then there is a case where it cannot be attached at the time of bonding. X, if it does not reach ο" MPa h shape ¥ ', there is a case where it peels off from the substrate at a high temperature. The above adhesive layer 4' preferably has a shear holding force of Η. Good 疋 5~1 〇 N. When the former τι / Ridushan h right d-cut retention force exceeds 20 Ν ‘, it will cause problems in workability. In addition, when there is a case where the distortion and the right side are less than 1 ,, there is a case where it peels off from the substrate at a temperature. The conveying member 5 to which the cleaning sheet of the present invention is attached is not particularly limited as long as it is a flat panel display such as a conductor wafer, lcd or qing, or the like, a substrate such as another optical disk or a magnetoresistive head. Further, the transporting member ^ may be a dummy board, a glass plate, an aluminum plate or the like that mimics the substrate itself that is transported by the target device. 128847.doc -22- 200848487 The conveying member with the cleaning function preferably makes the shape of the cleaning sheet smaller than the shape of the moving member, and does not expose the end portion of the conveying member to be larger than the shape of the conveying member. It exists in the conveying device; = the plate is attached to the device and is hung on the conveying system, and the device cannot operate normally. (1) The manufacturing method of the conveying member having the cleaning function is particularly limited, and for example, a cleaning sheet can be bonded to a conveying member such as a substrate to produce a cleaning conveying member. In this case, a comparison is made. After the cleaning member is transported, the cleaning sheet is cut along the shape of the member, and the cleaning sheet is cut, and the cleaning sheet is cut in the shape of the conveying member. A method of manufacturing a cleaning conveying member on the member (hereinafter referred to as a pre-cut method). EXAMPLES Hereinafter, the present invention will be added to these and the like according to the examples. Further, the average molecular weight is measured to illustrate 'but the present invention is not limited to the degree of dispersion of the molecular weight of the conjugate. <Example 1 > The "parts" in the following represent parts by weight. Mw represents the number average molecular weight of Μ ^, Mw / Mn means poly (preparation of the adhesive solution for the cleaning layer). The layer is prepared by using an adhesive solution, which can be prepared by the following method. . First, a propylene-based polymer (Mw, spoon 830,000 to 89) obtained from a monomer mixture containing 2, ethylhexyl acrylate, methyl (tetra) acrylate, and propylene S 夂 1 0 was prepared. Wan' Mw/Mn: 7 to 9), polyethylene glycol as a polymerizable unsaturated compound was added to the acrylic polyaphthalide 1 128847.doc -23- 200848487 fine dimercapto acrylate (new Manufactured by Nakamura Chemical Co., Ltd., trade name: nk Ε(10)4G) 35 parts, polyisocyanate as a crosslinking agent _ compound (manufactured by Japan Polyamine Vinegar Industry Co., Ltd., trade name: COR〇NET L) 3 parts and polyepoxy 2 parts of a compound (manufactured by Mitsubishi Gas Chemical Co., Ltd., trade name: Tetrad C), 3 additions of a photopolymerization initiator (Irgac_ 651: manufactured by Ciba Specialty Chemicals Co., Ltd.), and further prepared by uniformly mixing with acetic acid The brightness is 23% by weight. (Preparation of Adhesive Solution for Fixing Adhesive Layer) The adhesive solution for the adhesive layer for solid use can be prepared by the following method. First, a montmorillonite (manufactured by Kunimine Industries, Inc., trade name Kumpia G, average length: 〇) μηι) containing 1 part by weight of n-butyl acrylate, 5 parts of acrylic acid, and as a layered sulphate was prepared. The base polymer to be added as a monomer mixture is a propionic acid-based polymer (Mw: about 00 to 2 million 'Mw/Mn: 50 to 70), relative to the acrylic polymer. Ingredients, polyethylene glycol 2 decyl acrylate (manufactured by Shin-Nakamura Chemical Co., Ltd., trade name: NK Ester 4G) as a polymerizable unsaturated compound. 35 Injury, + epoxy compound (Mitsubishi Gas Chemical Co., Ltd.) , Trade name: Tetrad C) 1 part, and further prepared by uniformly mixing with ethyl acetate to a concentration of 20% by weight. (Formation of a cleaning layer) The above-mentioned cleaning layer adhesive solution is applied to one surface of a polyester film having a width of 200 mm and a thickness of 75 μm, and dried to have a thickness of 35 μm after drying. A 38 μm thick polyolefin release film having a surface roughness of 〇·1 μηι with a center line average roughness was applied to the surface as a protective film of 128847.doc •24-200848487. Then, an ultraviolet light having a center wavelength of 365 nm is irradiated with a cumulative light amount of 1000 mW to harden it to form a clean layer. (Production of Cleaning Sheet) The adhesive solution for the fixing adhesive layer is applied to the other side of the base material on which the cleaning layer is provided, and dried to have a thickness of 10 μΓΠ after drying, and is fixed. The adhesive layer was adhered to the surface of the polyolefinized separation membrane having a thickness of 25 Å. Further, the fixing adhesive layer was aged at 5 (TC heating 2 j ^. Thereby, the cleaning sheet of the present invention was obtained. <Comparative Example 1 > The fixing adhesive layer prepared in Example 1 was used. In the same manner as in Example i, a cleaning sheet was prepared in the same manner as in Example i except that the layered ceric acid salt was not used in the adhesive solution. The cleaning layer and the fixing adhesive obtained in the tenth embodiment and the comparative examples were prepared. The following evaluations were carried out on the layers. The results are shown in Table 1. (Tensile elastic modulus) The cleaning layer was applied with an adhesive solution on a PET film having a width of 200 mm and a thickness of 50 μη1. After drying and ultraviolet curing, the film was peeled off from the PET crucible, and the tensile test was performed with a sample width of 1 〇, a chuck distance of ιι〇mm, and a tensile speed of 5 〇 mm/min, and the tensile elastic modulus was calculated from the stress at the time of measurement. The measurement is based on JIS K7127. (Hurry cutting retention) A tape containing a 25 mm x 25 mm support substrate and a fixing + adhesive layer is attached to the bonded body, and crimped using a hand roller and bonded. The body is vertically drooping. The above-mentioned adherend The lower end portion was subjected to a load of 9.8 N in an environment of 1 5 ° C according to the method of 128847.doc -25-200848487 of JIS Z0237, and the tape offset (with the cutting retention force, unit: mm) after 1 hour was measured. (Adhesive force) The measurement was carried out at a tensile speed of 300 mm/mm in a state in which a tape having a width of 20 mm including a support substrate and a fixing adhesive layer was attached to a conveying member (for example, a glass substrate). It is 180° with respect to the conveying member, and the adhesive force (N/20 mm) after heating at 15 ° C for 1 hour. (Storage elastic modulus)

U. The fixing adhesive layer was measured at a frequency i Hz and a temperature rising rate of 5 using ARES' manufactured by Rheometric Scientific. 〇/_, in the shear storage mode of parallel plates with a sample size of 7.9 mm, 15 (TC storage elastic modulus (MPa). Further, the cleaning sheets obtained in the examples and the comparative examples were subjected to the following The results are shown in Table 1. (Transportability) The substrate processing apparatus (device name: GR-3000, manufactured by Nitto Seiki Co., Ltd.) having a wafer platform was transported and evaluated according to the following criteria. - When the conveyor is stopped at each part or platform, △: It is attached to each part and the case of Yay. "Position, but it does not cause the conveyance device to stop and the conveyance device does not stop. Each part and the platform shape (foreign material collection property) The separation film on the side of the fixing adhesive layer of the peeling cleaning sheet is peeled off by a hand roller, 128847.doc -26- 200848487 The adhesive layer is attached to the wafer of 8 吋The inner surface (mirror surface) is used to produce a cleaning wafer for cleaning, and is then used in a substrate processing apparatus (device name: GR-3000, manufactured by Nitto Seiki Co., Ltd., 150 ° C) having a wafer platform. Placing wafers on the platform The simulated foreign matter is attached. The grinding debris of the foreign matter wafer is simulated, and the size of 1.0 μm or more (upper limit of 600 μm) is attached to the platform by about 19,000. The initial contamination state is evaluated by using the wafer. After the mirror surface is transported toward the lower side in the substrate processing apparatus, the mirror surface is measured by a laser type foreign matter measuring device, and the amount of initial foreign matter (in the area of the wafer size of 8 Å) is measured, and the cleaning function is used for transport. The wafer was cleaned and the cleaning surface was transferred three times to the lower side in the substrate processing apparatus. The amount of foreign matter after the mirror surface was measured by a laser type foreign matter measuring device (laser particle counter, manufactured by TENCOR, SURFSCAN6200). Table 1]

Example 1 Comparative Example 1 Tensile modulus of elasticity (MPa) 70 0.8 Storage modulus (MPa) 1.5 0.01 Shear holding force (mm) 0.1 10 Adhesion (N/19 mm) 0.27 0.1 Transporting 〇X Foreign matter catching In the first embodiment of the cleaning apparatus using the cleaning sheet of the present invention, even in the substrate processing apparatus under a high temperature environment of 150 ° C, the cleaning sheet does not peel off, and has excellent transportability, and the number of foreign objects is from the original. Reduced from approximately 19,000 to approximately 3,500, confirming that it can be easily and efficiently captured and removed from the device. 128847.doc •27- 200848487

Things. On the other hand, in Comparative Example 1, since the layered bismuth salt was not contained in the adhesive layer, the heat resistance was poor, and the cleaning sheet was peeled from the substrate to collect foreign matter during the conveyance. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an example of a schematic view of a cleaning sheet of the present invention. 2 is a conveying member with a cleaning function according to the present invention.

1 Supporting substrate 2 Cleaning layer 3 Separation film 4 Adhesive layer for fixing 5 Transfer member (矽 wafer) 128847.doc •28-

Claims (1)

200848487 X. Patent application scope: The type of patented film is characterized in that it is a clean layer on one side of the supporting substrate, and the support substrate of the side of the soil is not attacked. The surface has a #诏 layer of cleansing film, and the adhesive layer contains a layered stone. 2. The cleaning sheet according to claim 1, wherein the adhesive layer contains 1 part by weight or more of the above layered oxalate salt with respect to 100 parts by weight of the adhesive. 3. A conveying member having a cleaning function, wherein the cleaning sheet of the request or the cleaning sheet is provided to the conveying member via a fixing adhesive layer A cleaning method of a substrate processing apparatus, characterized in that a conveying member having a cleaning function according to claim 3 is conveyed to a substrate processing apparatus. 128847.doc