TWI712503B - Carrier film and laminate for transparent conductive film - Google Patents

Abstract

The object of the present invention is to provide a transparent conductive film that can suppress the generation of tearing noise, has excellent adhesion and re-peelability to a transparent conductive film, and has a small difference in adhesion between high-speed peeling and low-speed peeling, and excellent workability. Carrier film for sexual film. Furthermore, the object of this invention is to provide the laminated body containing the said carrier film for transparent conductive films, and a transparent conductive film.

The present invention is a carrier film for a transparent conductive film, which is characterized in that it has an adhesive layer on at least one side of a support, and the adhesive layer of the carrier film is attached to the adherend After heating at 140°C for 90 minutes in the state, the adhesive force P when peeling off the carrier film from the adherend at a stretching speed of 0.3 m/min and the adhesive force Q when peeling off at a stretching speed of 10 m/min are both 0.7 N/50mm or less, and the absolute value of the difference between the adhesive force P and the adhesive force Q is 0.2N/50mm or less.

Description

Carrier film and laminate for transparent conductive film

The present invention relates to a carrier film for a transparent conductive film having a support and an adhesive layer. Moreover, this invention relates to the laminated body which has this carrier film for transparent conductive films, and a transparent conductive film.

In recent years, in touch panels, liquid crystal display panels, organic EL (ElectroLuminescence, electroluminescence) panels, electrochromic panels, electronic paper components, etc., one of the components used in the film substrate formed by the transparent electrode on the plastic film The demand continues to increase.

As materials for transparent electrodes, ITO (Indium Tin Oxide) films (In, Sn composite oxides), metal films such as silver or copper, and silver nanowire films are currently used, including the aforementioned ITO films, silver or copper The thickness of the film substrate of the metal film and the silver nanowire film tends to become thinner year by year.

In addition, on the film substrate containing the above-mentioned ITO film, an anti-reflection (AR) layer is provided as a functional layer to improve visibility, or a hard coat (HC) layer is provided to prevent damage, or an anti-sticking layer is provided There are more cases where the AB layer is connected to prevent adhesion, or the oligomer (OB) layer is provided to prevent turbidity during heating.

Among them, for optical members such as an ITO film, a surface protective film or the like is laminated and used in order to prevent damage, stains, etc. in a processing step or a transport step.

As an adhesive film for surface protection used in optical components, for example, the following are known: a surface protection sheet having an adhesive layer on a support, and the adhesive layer is made of special The predetermined blending ratio is formed by using two kinds of (meth)acrylic polymers with different glass transition temperatures and an adhesive whose degree of crosslinking caused by the crosslinking agent has been adjusted (refer to Patent Document 1); or on the plastic film An adhesive film with an adhesive layer obtained from an adhesive solution on one side. The adhesive solution contains a specific amount of 2-ethylhexyl acrylate and hydroxyethyl methacrylate monomer components formed Acrylic copolymer and a specific amount of polyfunctional isocyanate crosslinking agent (refer to Patent Document 2).

In addition, as a carrier film for a transparent conductive film, a carrier film for a transparent conductive film having an adhesive layer on at least one side of a support is known. The adhesive layer is composed of a glass transition temperature of -50°C or less. A (meth)acrylic polymer, an isocyanate-based crosslinking agent, and an iron-centric adhesive composition are formed (see Patent Document 3).

[Prior Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2005-146151

[Patent Document 2] Japanese Patent Laid-Open No. 2012-21164

[Patent Document 3] Japanese Patent Laid-Open No. 2015-48394

Patent Documents 1 and 2 have not fully studied the use of transparent conductive films. Therefore, when the surface protection sheets of Patent Documents 1 and 2 are used as carrier films for transparent conductive films, the difference in adhesion between low-speed peeling and high-speed peeling is not sufficiently reduced, and the film breaks in the middle of peeling. Or the transparent conductive film as the adherend has cracks.

In addition, Patent Document 3 has a description that can eliminate the tearing sound when peeling from the transparent conductive film, but the difference in adhesion between low-speed peeling and high-speed peeling is not small enough, and there is room for further research from the viewpoint of workability .

The so-called "tear sound" caused when the transparent conductive film is peeled off from the carrier film means that when the transparent conductive film is peeled off from the carrier film, it does not peel off smoothly and makes a crunching sound. Sound, peeling off or stopping repeatedly at the same time. If the above-mentioned tearing sound is generated when the adhesive force of the carrier film to the transparent conductive film as the adherend is high, the transparent conductive film may crack or remain peeling marks, which is not good.

In addition, when the carrier film is peeled from the transparent conductive film, the adhesive force in the case of high-speed peeling tends to be low, and the adhesive force of the case of rapid peeling is high. In most cases, the peeling of the carrier film is performed manually. Generally speaking, most operators perform high-speed peeling. Therefore, the carrier film is difficult to peel off and the workability is poor. Furthermore, the film may break or break in the middle of peeling. In addition, generally for such manual peeling, the peeling speed is often not constant, like the low-speed peeling at the beginning and then the high-speed peeling gradually. In this case, if the difference in adhesion between low-speed peeling and high-speed peeling is large, the film may break in the middle of peeling, or the transparent conductive film as the adherend may crack. A carrier film for a transparent conductive film that has a fixed adhesive force at any peeling speed.

The object of the present invention is to provide a transparent conductive film that can suppress the generation of tearing noise, has excellent adhesion and re-peelability to a transparent conductive film, and has a small difference in adhesion between high-speed peeling and low-speed peeling, and excellent workability. Carrier film for sexual film. Furthermore, the object of this invention is to provide the laminated body containing the said carrier film for transparent conductive films, and a transparent conductive film.

The inventors of the present invention made diligent studies in order to achieve the above-mentioned object, and as a result, found that the above-mentioned object can be achieved by using the following transparent conductive film carrier film, and completed the present invention.

That is, the present invention relates to a carrier film for a transparent conductive film, which is characterized in that it has an adhesive layer on at least one side of a support, and the adhesive layer of the carrier film is bonded to the adhesive layer. After heating at 140°C for 90 minutes in the state of the body, the adhesive force P when the carrier film is peeled from the adherend at a stretching speed of 0.3m/min, and the adhesive force Q when peeling off at a stretching speed of 10m/min Both are 0.7N/50mm or less, and The absolute value of the difference between the adhesive force P and the adhesive force Q is 0.2N/50mm or less.

Preferably, the above-mentioned adhesive layer is formed of an adhesive composition comprising a hydroxyl-containing monomer that will contain an alkyl (meth)acrylate and a homopolymer whose glass transition temperature is less than 50°C, (Meth) acrylic polymer obtained by polymerizing monomer components of hydroxyl-containing monomer whose glass transition temperature of homopolymer is above 50°C.

Preferably, the blending amount of the hydroxyl-containing monomer whose glass transition temperature of the above-mentioned homopolymer does not reach 50°C is 10-17% by weight relative to the total amount of the above-mentioned monomer components, and the glass transition temperature of the above-mentioned homopolymer is 50 The compounding amount of the hydroxyl-containing monomer above ℃ is 2-8% by weight with respect to the total amount of the above-mentioned monomer components.

It is preferable that the above-mentioned monomer component further includes a carboxyl group-containing monomer, and the blending amount of the carboxyl group-containing monomer is 0.005 to 0.10% by weight relative to the total amount of the above-mentioned monomer components.

Preferably, the adhesive composition further includes a crosslinking agent, and the blending amount of the crosslinking agent exceeds 20 parts by weight with respect to 100 parts by weight of the (meth)acrylic polymer.

It is preferable that the said crosslinking agent is an aliphatic polyisocyanate type crosslinking agent, and it is more preferable that the said aliphatic polyisocyanate type crosslinking agent contains hexamethylene diisocyanate.

In addition, it may also be a carrier film for a transparent conductive film characterized in that it has an adhesive layer on at least one side of the support, and the adhesive layer is formed of the following adhesive composition: The adhesive composition comprises a monomer component containing a hydroxyl-containing monomer whose glass transition temperature of a homopolymer is less than 50°C and a monomer component of a hydroxyl-containing monomer whose glass transition temperature of the homopolymer is 50°C or higher. Meth) acrylic polymer.

In addition, the present invention relates to a laminated body characterized in that it has the above-mentioned carrier film for transparent conductive film, and a transparent conductive film laminated on the above-mentioned carrier film for transparent conductive film, and the transparent conductive film On at least one side of the transparent film, the adhesive surface of the adhesive layer of the carrier film for the transparent conductive film is attached.

In addition, as the laminate, the transparent conductive film includes a transparent conductive layer and a transparent base material, and the transparent base material is bonded to the surface of the transparent base material on the opposite side to the surface in contact with the transparent conductive layer. The adhesive surface of the adhesive layer of the carrier film for transparent conductive film.

In addition, as the laminate, the transparent conductive film includes a transparent conductive layer and a transparent base material, and further includes a functional layer on the surface of the transparent base material on the opposite side to the surface in contact with the transparent conductive layer. On the surface of the functional layer opposite to the surface in contact with the transparent substrate, the adhesive surface of the adhesive layer of the carrier film for the transparent conductive film is bonded.

The carrier film for a transparent conductive film of the present invention can suppress the generation of tearing noise, has excellent adhesion and re-peelability to the transparent conductive film, has a small difference in adhesion between high-speed peeling and low-speed peeling, and has excellent workability. Furthermore, this invention can provide the laminated body containing the said carrier film for transparent conductive films, and a transparent conductive film.

In addition, by using the carrier film for a transparent conductive film of the present invention, the transparent conductive film as an adherend can be free from wrinkles or damage, and the shape of the transparent conductive film can be maintained.

1‧‧‧Adhesive layer

2‧‧‧Support (base material)

3‧‧‧Carrier film for transparent conductive film

4‧‧‧Transparent conductive layer

5‧‧‧Transparent substrate

6‧‧‧Transparent conductive film

7‧‧‧Functional layer

8‧‧‧Transparent conductive film with functional layer

9‧‧‧Layered body

A‧‧‧Adhesive surface

Fig. 1 is a schematic view showing an embodiment of the carrier film for a transparent conductive film of the present invention.

Fig. 2 is a schematic view showing an embodiment of a laminate in which a transparent conductive film is attached to the adhesive layer of the carrier film for a transparent conductive film of the present invention.

Fig. 3 is a schematic diagram showing an embodiment of a laminate in which a transparent conductive film with a functional layer is attached to the adhesive layer of the carrier film for a transparent conductive film of the present invention.

1. Carrier film for transparent conductive film

Hereinafter, the embodiment of the present invention will be described in detail using FIGS. 1 to 3. However, the present invention is not limited to the embodiments shown in FIGS. 1 to 3.

As shown in FIG. 1, the carrier film 3 for a transparent conductive film of the present invention has an adhesive layer 1 on at least one side of a support 2, and the adhesive layer 1 is opposite to the surface contacting the support 2 The side has an adhesive surface A. The above-mentioned adhesive surface A is shown in FIG. 2, when the transparent conductive film 6 as the adherend does not have a functional layer, it is the same as the surface of the transparent substrate 5 constituting the transparent conductive film (the absence of the transparent substrate 5) The surface in contact with the side of the transparent conductive layer 4, as shown in FIG. 3, is the surface in contact with the functional layer 7 when the transparent conductive film as the adherend is the transparent conductive film 8 with a functional layer. In addition, as shown in FIGS. 2 and 3, the laminate 9 of the present invention described later includes a carrier film 3 for a transparent conductive film and a transparent conductive film 6 (or a transparent conductive film 8 with a functional layer).

The carrier film for a transparent conductive film of the present invention is characterized by heating at 140°C for 90 minutes in a state where the adhesive layer of the carrier film is attached to the adherend, and then at a stretching speed of 0.3 m/min The adhesive force P when the carrier film is peeled from the adherend and the adhesive force Q when peeling off at a tensile speed of 10m/min are both 0.7N/50mm or less, and the absolute difference between the adhesive force P and the adhesive force Q The value is 0.2N/50mm or less.

The adhesive force P is 0.7N/50mm or less, preferably 0.6N/50mm or less, and more preferably 0.5N/50mm or less. The lower limit of the adhesive force P is not particularly limited, but from the viewpoint of the adhesive force of the transparent conductive film as the adherend, it is preferably 0.1 N/50 mm or more. Since the adhesive force when peeling off at a stretching speed of 0.3m/min is in the above range, even when the carrier film for a transparent conductive film is peeled from the transparent conductive film at a low speed, no tearing sound will be generated, and the adhesion and The balance of repeelability is excellent, so it is preferable.

The above-mentioned adhesive force Q is 0.7 N/50 mm or less, preferably 0.6 N/50 mm or less, and more preferably 0.5 N/50 mm or less. The lower limit of the adhesive force Q is not particularly limited, but from the viewpoint of the adhesive force of the transparent conductive film as the adherend, it is preferably 0.1 N/50 mm or more. If peeling at a tensile speed of 10m/min, the adhesive force exceeds 0.7N/50 mm, workability deteriorates, and when the carrier film for a transparent conductive film is peeled from the transparent conductive film, the film may be broken or broken. On the other hand, since the adhesive force at the time of peeling at a tensile speed of 10m/min falls within the above range, even when the carrier film for a transparent conductive film is peeled from the transparent conductive film at a high speed, no tearing sound is generated and the adhesion is tight. The balance between performance and re-peelability is excellent, so it is preferable.

The absolute value of the difference between the adhesive force P and the adhesive force Q is 0.2N/50mm or less, preferably 0.15N/50mm or less, more preferably 0.1N/50mm or less, and particularly preferably 0.05N/50mm or less. The lower limit of the absolute value of the difference between the adhesive force P and the adhesive force Q is not particularly limited, and the smaller the better, and ideally there is no difference (0N/50mm). If the absolute value of the difference between the adhesive force P and the adhesive force Q exceeds 0.2N/50mm, when the transparent conductive film carrier film is peeled from the transparent conductive film, the film may break in the middle of peeling, or the transparent conductive layer may be generated The situation of the rift. On the other hand, since the absolute value of the difference between the adhesive force P and the adhesive force Q is within the above range, even in cases where the peeling speed is not constant, such as manual peeling operations (usually at the beginning of low-speed peeling and gradually approaching high-speed peeling) In this case, the film will not break in the middle of peeling, or the transparent conductive layer will not crack, and the carrier film for the transparent conductive film has excellent re-peelability, which is preferable.

The "adhered body" in the above adhesion measurement is a transparent conductive film. When the transparent conductive film does not have a functional layer, the adhered surface is the surface of the transparent substrate constituting the transparent conductive film. When the film has a functional layer, the adhered surface is the surface of the functional layer.

The carrier film for a transparent conductive film of the present invention only needs to have an adhesive layer on at least one side of the support and have the above-mentioned adhesive force. The composition of the adhesive is not particularly limited, and preferable compositions are described below.

(1) Adhesive layer

The adhesive layer of the present invention is not particularly limited, and it can be an acrylic, synthetic rubber, rubber, silicone, etc. adhesive, etc. From the viewpoints of transparency, heat resistance, etc., Preferably, it is an acrylic adhesive using a (meth)acrylic polymer as the base polymer.

The (meth)acrylic polymer, which becomes the base polymer of the acrylic adhesive, is obtained by polymerizing monomer components containing alkyl (meth)acrylate, and will contain alkyl (meth)acrylate, homogeneous The (meth)acrylic polymer system obtained by polymerizing the monomer components of the hydroxyl-containing monomer whose glass transition temperature of the polymer is less than 50°C and the monomer component of the hydroxyl-containing monomer whose glass transition temperature of the homopolymer is above 50°C The difference in adhesion between high-speed peeling and low-speed peeling becomes smaller, so it is better.

As the above-mentioned alkyl (meth)acrylate, for example, those having an alkyl group having 2 to 14 carbons can be used. As the main monomer component of the alkyl (meth)acrylate, it is preferable that the alkyl group has 4 carbon atoms. The alkyl (meth)acrylate of ~14 is more preferably the alkyl (meth)acrylate of carbon 6 to 14, and the alkyl (meth)acrylate of carbon 6 to 9 is particularly preferred. The main monomer here means that the total amount of the "alkyl (meth)acrylate" contained in the monomer component is 50% by weight or more, more preferably 60% by weight or more, and more preferably 80 % By weight or more, more preferably 100% by weight.

Examples of the alkyl (meth)acrylate having an alkyl group having 2 to 14 carbon atoms include ethyl (meth)acrylate, n-butyl (meth)acrylate (BA), and (meth)acrylic acid. Tertiary butyl ester, isobutyl (meth)acrylate, hexyl (meth)acrylate, 2-ethylhexyl (meth)acrylate (2EHA), n-octyl (meth)acrylate, (meth) Isooctyl acrylate, n-nonyl (meth)acrylate, isononyl (meth)acrylate, n-decyl (meth)acrylate, isodecyl (meth)acrylate, n-dodecane (meth)acrylate Ester, n-tridecyl (meth)acrylate, n-tetradecyl (meth)acrylate, etc., these can be used alone or in combination of two or more. Among them, n-butyl (meth)acrylate (BA) or 2-ethylhexyl (meth)acrylate (2EHA) is preferred, and 2-ethylhexyl (meth)acrylate (2EHA) is particularly preferred. ).

Especially when light peeling is required for the adhesive layer, it is preferable to use the above-mentioned alkyl (meth)acrylate having an alkyl group with 6 to 14 carbon atoms, preferably relative to the alkyl (meth)acrylate The total amount of the above-mentioned alkyl (meth)acrylate having a carbon number of 6 to 14 It is set to 50% by weight or more, more preferably 60% by weight or more, still more preferably 80% by weight or more, and particularly preferably 90% by weight or more.

The content of the alkyl (meth)acrylate in the monomer component is preferably 65% by weight, more preferably 75% by weight or more, and still more preferably 80% by weight or more.

Examples of the hydroxyl-containing monomer whose glass transition temperature of the above-mentioned homopolymer is less than 50°C include: the glass transition temperature of the homopolymer is less than 50°C, has a (meth)acrylic acid group or a vinyl group containing unsaturated double The polymerizable functional group of the bond and the one containing a hydroxyl group. Specific examples include: 2-hydroxyethyl acrylate (Tg of homopolymer: -15°C), 2-hydroxypropyl methacrylate (Tg of homopolymer: 26°C), 2-hydroxypropyl acrylate ( Tg of homopolymer: -7℃), 4-hydroxybutyl acrylate (Tg of homopolymer: -32℃), etc. Hydroxyalkyl (meth)acrylate, 2-hydroxy-3-phenoxypropyl acrylate Esters (Tg of homopolymer: 17°C), 1,4-cyclohexanedimethanol monoacrylate (Tg of homopolymer: 18°C) and other (meth)acrylates with cyclic structure, polyethylene Alcohol monoacrylate (mole of ethylene glycol: 10, Tg of homopolymer: -64°C), polypropylene glycol monoacrylate (mole of propylene glycol: 6, Tg of homopolymer: -59°C) Such as (meth)acrylates having an alkylene oxide structure, etc., these may be used alone or in combination of two or more. Among them, in terms of suppressing the tearing sound, 4-hydroxybutyl acrylate (Tg of homopolymer: -32°C) is preferred.

In addition, the glass transition temperature of the homopolymer of the above-mentioned hydroxyl-containing monomer may be less than 50°C, for example, preferably 30°C or less, more preferably -40 to 30°C, and even more preferably -40 to 0°C.

With respect to the total amount of monomer components, the content of the hydroxyl-containing monomer whose glass transition temperature of the homopolymer is less than 50°C is preferably 10-17% by weight, more preferably 10-15% by weight, and still more preferably 11 ~14% by weight. If the content of the hydroxyl-containing monomer whose glass transition temperature is less than 50°C of the above-mentioned homopolymer is less than 10% by weight, the reaction points will be less, so the crosslinking density will decrease and the adhesive force will tend to increase. In this case, the repeelability to the transparent conductive film is lowered, and therefore it is not good. On the other hand, if the glass transition temperature of the above homopolymer does not reach 50 ℃ If the content of the hydroxyl-containing monomer exceeds 17% by weight, there are too many reaction points, so there is a tendency for the crosslinking density to increase and the adhesive force to excessively decrease. In this case, the adhesiveness to the transparent conductive film is lowered, so it is not good.

Examples of hydroxyl-containing monomers having a glass transition temperature of 50°C or higher for the above-mentioned homopolymer include: a homopolymer having a glass transition temperature of 50°C or higher, having a (meth)acrylic acid group or a vinyl group containing unsaturated double The polymerizable functional group of the bond and the one containing a hydroxyl group. Specifically, they can include: 2-hydroxyethyl methacrylate (Tg of homopolymer: 55°C), N-methylol acrylamide (Tg of homopolymer: 110°C), N-(2-hydroxyl Ethyl)acrylamide (Tg of homopolymer: 98°C), etc., and these can be used alone or in combination of two or more. Among them, in terms of suppressing the tearing sound, 2-hydroxyethyl methacrylate (Tg of homopolymer: 55°C) is preferred.

Moreover, the glass transition temperature of the homopolymer of the above-mentioned hydroxyl-containing monomer should just be 50 degreeC or more, for example, 50-150 degreeC is preferable, 50-100 degreeC is more preferable, and 50-90 degreeC is more preferable.

The content of the hydroxyl-containing monomer whose glass transition temperature of the above-mentioned homopolymer is 50° C. or higher is preferably 2 to 8% by weight, more preferably 3 to 6% by weight relative to the total amount of monomer components. If the content of the hydroxyl-containing monomer with the glass transition temperature of the above-mentioned homopolymer above 50°C is less than 2% by weight, the adhesive force during high-speed peeling tends to be less likely to decrease, and if it exceeds 8% by weight, high-speed peeling occurs. The tendency of time to excessively decrease the adhesive force, so it is not good.

The above-mentioned monomer components may contain other polymerizable monomers other than the above-mentioned alkyl (meth)acrylate and hydroxyl-containing monomers. As the above-mentioned other polymerizable monomers, a polymerizable monomer for adjusting the glass transition point or releasability of the (meth)acrylic polymer can be used within a range that does not impair the effects of the present invention. The other polymerizable monomers may be used alone or in combination. As the compounding amount of the above-mentioned other polymerizable monomers, it is preferably 10% by weight or less, and more preferably 5% by weight or less with respect to the total amount of monomer components.

As said polymerizable monomer, a carboxyl group-containing monomer can be mentioned. Can enter more efficiently In terms of cross-linking reaction and reduction of adhesive force during high-speed peeling, carboxyl group-containing monomers can be used. Examples of carboxyl group-containing monomers include those having polymerizable functional groups containing unsaturated double bonds, such as (meth)acrylic acid groups or vinyl groups, and carboxyl groups. Specifically, examples include (meth)acrylic acid and acrylic carboxyl groups Ethyl, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid, crotonic acid, methacrylic acid, etc. Among these carboxyl group-containing monomers, acrylic acid is preferred in terms of polymerizability, cohesiveness, price, and versatility.

The content of the above-mentioned carboxyl group-containing monomer is preferably 0.005 to 0.10% by weight, and more preferably 0.005 to 0.05% by weight relative to the total amount of monomer components. Since the content of the carboxyl group-containing monomer is in the above range, the adhesive force during high-speed peeling is reduced, which is preferable.

啉、乙烯醚單體等具有作為交聯化基點而發揮作用之官能基之單體成分。該等單體成分可單獨使用，又亦可混合使用2種以上。 As the above-mentioned other polymerizable monomers, for example, sulfonic acid group-containing monomers, phosphoric acid group-containing monomers, cyano group-containing monomers, vinyl ester monomers, aromatic vinyl monomers, etc. can be used to improve cohesion and heat resistance. Ingredients, or monomers containing acid anhydride groups, monomers containing amine groups, monomers containing amine groups, monomers containing epoxy groups, N-acrylic acid groups

A monomer component having a functional group functioning as a crosslinking base point, such as a morpholine and a vinyl ether monomer. These monomer components may be used alone, or two or more of them may be mixed and used.

As said acid anhydride group-containing monomer, maleic anhydride, itaconic anhydride, etc. are mentioned, for example.

Examples of the sulfonic acid group-containing monomer include styrene sulfonic acid, allyl sulfonic acid, 2-(meth)acrylamido-2-methylpropanesulfonic acid, and (meth)acrylamidopropyl. Sulfonic acid, sulfopropyl (meth)acrylate, (meth)acryloyloxynaphthalenesulfonic acid, etc.

Examples of the phosphoric acid group-containing monomer include 2-hydroxyethyl acryloyl phosphate, 2-(phosphinooxy)ethyl methacrylate, and 3-chloro-2-(phosphinooxy) methacrylate. ) Propyl ester and so on.

As said cyano group-containing monomer, acrylonitrile etc. are mentioned, for example.

As said vinyl ester monomer, vinyl acetate, vinyl propionate, vinyl laurate etc. are mentioned, for example.

As the above-mentioned aromatic vinyl monomers, for example, styrene, chlorostyrene, Chloromethylstyrene, α-methylstyrene, etc.

As said amine group containing monomer, acrylamide, diethyl acrylamide, etc. are mentioned, for example.

Examples of the above-mentioned amine group-containing monomer include N,N-dimethylaminoethyl (meth)acrylate, N,N-dimethylaminopropyl (meth)acrylate, and the like.

As said epoxy group-containing monomer, glycidyl (meth)acrylate, allyl glycidyl ether, etc. are mentioned, for example.

As said vinyl ether monomer, methyl vinyl ether, ethyl vinyl ether, isobutyl vinyl ether, etc. are mentioned, for example.

The (meth)acrylic polymer used in the present invention is obtained by polymerizing the above-mentioned monomer components. The polymerization method is not particularly limited. Solution polymerization, emulsion polymerization, bulk polymerization, suspension polymerization, etc. For polymerization by a known method, from the viewpoint of workability and the like, solution polymerization is more preferable. In addition, the obtained polymer may be any of homopolymers, random copolymers, and block copolymers.

The weight average molecular weight of the (meth)acrylic polymer used in the present invention is preferably 300,000 to 5 million, more preferably 400,000 to 2 million, particularly preferably 500,000 to 1 million. When the weight-average molecular weight is less than 300,000, the wettability to the transparent conductive film (with functional layer) as the adherend increases, and the adhesive force at the time of peeling increases, resulting in the peeling step (repeeling) When it is damaged by the adherend, there is a tendency for the paste to remain due to the decrease of the cohesive force of the adhesive layer. On the other hand, when the weight average molecular weight exceeds 5 million, the fluidity of the polymer is reduced, and the wetting of the transparent conductive film as the adherend (functional layer) is insufficient, which results in the adhesion of the adherend and the transparent conductive film. The adhesive layer of the carrier film for transparent conductive film tends to bulge. In addition, the weight average molecular weight refers to the one obtained by GPC (Gel Permeation Chromatograph) measurement.

Also, for the reason that it is easy to achieve a balance of adhesive performance, as the above-mentioned (methyl) acrylic The glass transition temperature (Tg) of the olefinic acid polymer is preferably below 0°C (usually above -100°C, preferably above -70°C), more preferably below -10°C, and even more preferably -20 Below ℃, particularly preferably below -30℃. When the glass transition temperature is higher than 0°C, the polymer is difficult to flow, and the wetting of the transparent substrate of the transparent conductive film as the adherend is insufficient, resulting in the adhesion between the adherend and the adhesive layer of the carrier film There is a tendency to bulge. Furthermore, the glass transition temperature (Tg) of the (meth)acrylic polymer can be adjusted to the above range by appropriately changing the monomer components or composition ratios used.

In the adhesive composition used in the present invention, it is preferable to add a crosslinking agent in addition to the (meth)acrylic polymer described above. As the crosslinking agent, isocyanate compounds, epoxy compounds, melamine-based resins, aziridine derivatives, metal chelate compounds, and the like can be used. Among these, the isocyanate compound can be used particularly preferably from the viewpoint of obtaining an appropriate cohesive force. These compounds may be used alone, or two or more of them may be mixed and used.

As said isocyanate compound, the compound which has at least 2 isocyanate groups is mentioned, For example, aliphatic polyisocyanate, alicyclic polyisocyanate, aromatic polyisocyanate etc. can be used generally. In the present invention, aliphatic polyisocyanate may be preferably used in terms of suppression of tearing and adhesion, and it is preferable not to use alicyclic polyisocyanate in terms of suppression of tearing and adhesion. Isocyanates, aromatic polyisocyanates.

Examples of aliphatic polyisocyanates include trimethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate, pentamethylene diisocyanate, 1,2-propylene diisocyanate, 1,3 -Butylene diisocyanate, dodecamethylene diisocyanate, 2,4,4-trimethylhexamethylene diisocyanate, etc. Among them, in terms of suppression of tearing and adhesion, It is preferably an aliphatic polyisocyanate containing hexamethylene diisocyanate.

As a commercially available product of the isocyanate-based crosslinking agent, for example, the trade names "Coronate HL" and "Coronate HX" (the above are manufactured by Japan Polyurethane Industry Co., Ltd.); Trade names "Takenate D-160N", "Takenate D-165N", "Takenate D-170HN", "Takenate D-178N" (above manufactured by Mitsui Chemicals Co., Ltd.), etc. These compounds may be used alone, or two or more of them may be mixed and used.

In the present invention, relative to 100 parts by weight of the (meth)acrylic polymer, the blending amount of the isocyanate-based crosslinking agent is preferably more than 20 parts by weight, more preferably more than 20 parts by weight and 30 parts by weight or less, and further Preferably it is 21-25 parts by weight, particularly preferably 22-24 parts by weight. By making the blending amount of the isocyanate-based crosslinking agent exceed 20 parts by weight, it is preferable in terms of the following aspects: the adhesive layer is sufficiently exchanged by the reaction with the hydroxyl group of the (meth)acrylic polymer Link formation, improve cohesion and suppress the generation of tearing. In addition, it can exhibit proper adhesive force during high-speed peeling and low-speed peeling, and can reduce the difference in adhesive force between high-speed peeling and low-speed peeling, which is preferable. In addition, especially with regard to the blending amount of the isocyanate-based crosslinking agent, it is preferable to add an amount such that the OH/NCO equivalent ratio becomes 0.89 to 1.22 with respect to the hydroxyl group of the (meth)acrylic polymer, and it is more preferable to add Add in the amount of 0.95~1.14. By setting the blending amount of the isocyanate-based crosslinking agent to the above range, the difference in adhesion between high-speed peeling and low-speed peeling can be controlled to be small, which is preferable.

These isocyanate-based crosslinking agents may be used alone, or two or more types may be used in combination, or a difunctional isocyanate compound and a trifunctional or higher isocyanate compound may be used in combination.

As the epoxy compound, for example, N,N,N',N'-tetraglycidyl metaxylylenediamine (trade name: TETRAD-X, manufactured by Mitsubishi Gas Chemical Co., Ltd.) or 1,3-bis (N,N-Diglycidylaminomethyl)cyclohexane (trade name: TETRAD-C, manufactured by Mitsubishi Gas Chemical Co., Ltd.) and the like. These compounds may be used alone, or two or more of them may be mixed and used.

As said melamine resin, hexamethylol melamine etc. are mentioned. As the aziridine derivatives, for example, the trade name HDU (manufactured by Mutual Pharmaceutical Co., Ltd.), the trade name TAZM (manufactured by Mutual Pharmaceutical Co., Ltd.), and the trade name TAZO (Mutual Pharmaceutical Industry (Stock) ) Manufacturing) etc. These compounds may be used alone, or two or more of them may be mixed and used.

As the metal chelate compound, the metal component includes aluminum, titanium, nickel, zirconium, etc. Synthetic components include acetylene, methyl acetylacetate, ethyl acetylacetate, ethyl lactate, acetone acetone, and the like. These compounds can be used alone or in combination.

When a crosslinking agent other than an isocyanate-based crosslinking agent is used in combination, as long as the effect of the present invention is not impaired, the amount used is not particularly limited, and it is preferably used within the following range: relative to (meth)acrylic acid 100 parts by weight of the polymer, the total amount of the isocyanate-based crosslinking agent exceeds 20 parts by weight, and the ratio of the isocyanate-based crosslinking agent in the total amount of the crosslinking agent is 50% by weight or more, then 70% by weight or more, and then 90 More than weight%.

In addition, in the adhesive composition of the present invention, in addition to the above-mentioned (meth)acrylic polymer, a multifunctional monomer having two or more radiation-reactive unsaturated bonds can be formulated. Multifunctional monomers can be used as monomer components when preparing (meth)acrylic polymers. In this case, the (meth)acrylic polymer is crosslinked by irradiation with radiation or the like. Examples of polyfunctional monomers having two or more radiation-reactive unsaturated bonds in one molecule include: having two or more vinyl groups, acryloyl groups, methacryloyl groups, vinyl benzyl groups, etc., which can be radioactive One or two or more radiation-reactive multifunctional monomers that are cross-linked (hardened) by irradiation. In addition, as the above-mentioned polyfunctional monomer, it is generally preferable to use one having 10 or less radiation-reactive unsaturated bonds. These compounds may be used alone, or two or more of them may be mixed and used.

As specific examples of the above-mentioned multifunctional monomers, for example, ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate, new Pentylene glycol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol Hexa(meth)acrylate, divinylbenzene, N,N'-methylenebisacrylamide, etc.

The blending amount of the above-mentioned polyfunctional monomer is preferably 30 parts by weight or less with respect to 100 parts by weight (solid content) of the (meth)acrylic polymer.

Examples of radiation include ultraviolet rays, thunder rays, α rays, β rays, γ rays, X rays, electron beams, etc., and it is possible in terms of good controllability and operability, and cost. Preferably, ultraviolet rays are used. It is better to use ultraviolet light with a wavelength of 200~400nm. Ultraviolet rays can be irradiated with appropriate light sources such as high-pressure mercury lamps, microwave excitation lamps, chemical lamps, etc. Furthermore, when ultraviolet rays are used as radiation, a photopolymerization initiator is formulated in the adhesive composition.

As the photopolymerization initiator, it is sufficient to irradiate ultraviolet rays of an appropriate wavelength that can be the initiator of the polymerization reaction according to the type of radiation-reactive component, thereby generating radicals or cations.

、2-乙基-9-氧硫

、2-異丙基-9-氧硫

等9-氧硫

類；雙(2,4,6-三甲基苯甲醯基)-苯基氧化膦、2,4,6-三甲基苯甲醯基二苯基氧化膦、(2,4,6-三甲基苯甲醯基)-(乙氧基)-苯基氧化膦等醯基氧化膦類；苯偶醯、二苯并環庚酮、α-醯基肟酯等。該等化合物可單獨使用，又亦可混合使用2種以上。 As the photoradical polymerization initiator, for example, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin ethyl ether, benzoin isopropyl ether, α-methyl benzoin and other benzoins; Acetophenones such as dimethyl ketal, trichloroacetophenone, 2,2-diethoxyacetophenone, 1-hydroxycyclohexyl phenyl ketone; 2-hydroxy-2-methylpropiophenone, Propiophenones such as 2-hydroxy-4'-isopropyl-2-methylpropiophenone; benzophenone, methylbenzophenone, p-chlorobenzophenone, p-dimethylaminobenzophenone Benzophenones such as ketones; 2-chloro-9-oxysulfur

, 2-Ethyl-9-oxysulfur

, 2-isopropyl-9-oxysulfur

9-oxysulfur

Class; Bis (2,4,6-trimethylbenzyl)-phenyl phosphine oxide, 2,4,6-trimethylbenzyl diphenyl phosphine oxide, (2,4,6- Trimethylbenzyl)-(ethoxy)-phenylphosphine oxide and other phosphine oxides; benzil, dibenzocycloheptanone, α-acyloxime ester, etc. These compounds may be used alone, or two or more of them may be mixed and used.

Examples of photocationic polymerization initiators include onium salts such as aromatic diazonium salts, aromatic iodonium salts, and aromatic sulfonium salts, or iron-arene complexes, titanocene complexes, and arylsilanes. Alcohol-aluminum complexes and other organic metal complexes, nitrobenzyl ester, sulfonic acid derivatives, phosphoric acid ester, phosphoric acid ester, phenol sulfonate, diazonaphthoquinone, N-hydroxyimide sulfonate Wait. These compounds may be used alone, or two or more of them may be mixed and used. With respect to 100 parts by weight of the (meth)acrylic polymer, the photopolymerization initiator is usually formulated in 0.1-10 parts by weight, preferably in the range of 0.2-7 parts by weight.

Furthermore, a photo-initiated polymerization aid such as amines may be used in combination. As the above-mentioned light initiator The agent includes, for example, 2-dimethylaminoethyl benzoate, dimethylaminoacetophenone, ethyl p-dimethylaminobenzoate, isoamyl p-dimethylaminobenzoate, etc. . These compounds may be used alone, or two or more of them may be mixed and used. With respect to 100 parts by weight of the (meth)acrylic polymer, the polymerization initiation assistant is preferably formulated in 0.05-10 parts by weight, more preferably in the range of 0.1-7 parts by weight.

A catalyst may be added to the adhesive composition used in the present invention. The type of the catalyst is not particularly limited, and a catalyst known in the art such as a tin catalyst can be used, and a tin catalyst is preferably used. Furthermore, in the present invention, it is preferable not to include a catalyst with iron as an active center.

Examples of the tin catalyst include: dioctyltin dilaurate, dibutyltin dilaurate, dibutyltin diacetate, dibutyltin dioctoate, dibutyltin dioleate, diphenyltin diacetate, dibutyltin oxide Tin, dibutyl tin dimethoxide, bis(triethoxysiloxy) dibutyl tin, benzyl dibutyl tin maleate, dioctyl tin diacetate, etc., these can be used alone or in combination of 2 types the above. Among them, dioctyl tin dilaurate is preferred. Moreover, the addition amount of a catalyst is not specifically limited, For example, about 0.001-0.5 weight part is preferable with respect to 100 weight part of acrylic polymers.

Furthermore, the adhesive composition used in the present invention may also contain other well-known additives. For example, powders such as colorants, pigments, surfactants, plasticizers, and adhesive properties can be appropriately formulated according to the application used. Agent, low molecular weight polymer, surface lubricant, leveling agent, antioxidant, anticorrosion agent, light stabilizer, ultraviolet absorber, polymerization inhibitor, silane coupling agent, inorganic or organic filler, metal powder, particle form, foil物 etc.

In addition, the solid component of the adhesive composition is not particularly limited, but it is preferably 20% by weight or more, and more preferably 30% by weight or more.

The adhesive layer used in the present invention is formed by the above adhesive composition. In addition, the carrier film for a transparent conductive film (with a functional layer) of the present invention is obtained by forming the adhesive layer on a support (base material, base material layer). At this time, the turn of (meth)acrylic polymers The linking is generally performed after coating the adhesive composition, and the adhesive layer including the crosslinked adhesive composition may be transferred to a support or the like.

The method of forming the adhesive layer on the support (also known as the substrate or the substrate layer) is not particularly required. For example, it can be produced by the following method: coating the above-mentioned adhesive composition on the support (for example, as a solid The ingredients are preferably 20% by weight or more, more preferably 30% by weight or more), the polymerization solvent and the like are dried and removed to form an adhesive layer on the support. After that, it may be matured in order to adjust the component transfer of the adhesive layer or adjust the crosslinking reaction. In addition, when the adhesive composition is coated on the support to produce a carrier film for a transparent conductive film, one or more solvents other than the polymerization solvent may be newly added to the adhesive composition to allow uniform coating On the support.

Moreover, as a coating method of the said adhesive composition, the well-known method used for manufacturing an adhesive tape etc. is used. Specifically, for example, roll coating, gravure coating, reverse coating, roll brushing, spray coating, air knife coating, etc. can be cited.

The drying conditions when drying the adhesive composition coated on the support can be appropriately determined according to the composition and concentration of the adhesive composition, the type of solvent in the composition, etc., and are not particularly limited. For example, it can be within 80~ Dry at 200°C for about 10 seconds to 30 minutes.

In addition, when the photopolymerization initiator as an optional component is formulated as described above, it can be coated on one side or both sides of the support (substrate, substrate layer) and then irradiated with light to obtain adhesion Agent layer. Usually, the light quantity is about 400~4000mJ/cm ² irradiating the ultraviolet light with the wavelength of 300~400nm and the illuminance is 1~200mW/cm ² for photopolymerization, thereby obtaining the adhesive layer.

The thickness of the adhesive layer of the carrier film for the transparent conductive film of the present invention is preferably 5-50 μm, more preferably 10-30 μm. If it is in the said range, the balance of adhesiveness and peelability will be excellent, and it will become a preferable aspect. The above-mentioned adhesive layer is formed by coating or the like on at least one side of the support (base material layer) used in the present invention, and is made into a form such as a film, a sheet, or a belt.

(2) Support

The support (base material) (No. 2 in Figure 1) constituting the carrier film for the transparent conductive film of the present invention is not particularly limited. For example, paper support such as paper; cloth, non-woven fabric, mesh can be used Other fiber-based supports (the raw materials are not particularly limited, for example, manila hemp, rayon, polyester, pulp fiber, etc. can be appropriately selected); metal-based supports such as metal foils and metal plates; plastics such as plastic films or sheets Supports; rubber supports such as rubber sheets; foams such as foam sheets or laminates of these (such as laminates of plastic supports and other supports or laminates of plastic films (or sheets), etc.) ) And other appropriate thin body.

烯結構之聚烯烴系樹脂；聚醚醚酮(PEEK)等。該等素材可單獨使用或組合使用2種以上。該等之中，尤其上述聚酯系樹脂具有強韌性、加工性、透明性等，故而藉由將其用於透明導電性膜用之載膜，作業性、檢查性提高，成為更佳之態樣。 As the material of the above-mentioned plastic film or sheet, for example, polyethylene (PE), polypropylene (PP), ethylene-propylene copolymer, ethylene-vinyl acetate copolymer (EVA), etc., with α-olefin as the monomer component can be mentioned. Olefin resins; polyester resins such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polybutylene terephthalate (PBT), etc.; polycarbonate resins ; Polyvinyl chloride (PVC); Vinyl acetate resin; Polyphenylene sulfide (PPS); Polyamide (nylon), fully aromatic polyamide (aromatic polyamide) and other amide resins; Polyamide Imine resin; with cyclic or lower

Polyolefin resin with olefin structure; polyether ether ketone (PEEK), etc. These materials can be used alone or in combination of two or more kinds. Among them, the above-mentioned polyester resins in particular have toughness, processability, transparency, etc., so by using them as a carrier film for transparent conductive films, workability and inspection properties are improved and become a better aspect .

The polyester resin is not particularly limited as long as it can be formed into a sheet or film shape, and examples thereof include polyethylene terephthalate (PET), polyethylene naphthalate, and polyethylene terephthalate. Polyester films such as butylene dicarboxylate. These polyester-based resins may be used alone (homopolymer), or two or more kinds may be mixed and polymerized (copolymer, etc.). Particularly in the present invention, since it is used in the form of a carrier film for a transparent conductive film, polyethylene terephthalate can be preferably used as a support. By using polyethylene terephthalate, it becomes a carrier film for a transparent conductive film with excellent toughness, processability, and transparency, and the workability is improved, which is a preferable aspect.

The thickness of the above-mentioned support is generally 25 to 300 μm, preferably 75 to 200 μm, more preferably 80 to 140 μm, and particularly preferably 90 to 130 μm. If it is within the above range, by attaching the carrier film for the transparent conductive film to the transparent conductive film (with a functional layer), the shape of the transparent conductive film, which is not stiff and easy to bend, can be maintained. It is useful to prevent defects such as wrinkles or damage during processing steps or transport steps.

In addition, the above-mentioned support may be subjected to mold release and antifouling treatment or acid treatment using silicone-based, fluorine-based, long-chain alkyl-based or fatty acid amide-based mold release agents, silicon dioxide powder, etc. , Alkali treatment, primer treatment, corona treatment, plasma treatment, ultraviolet treatment and other easy to follow treatment, coating type, kneading type, vapor deposition type, etc. antistatic treatment. Especially when performing antistatic treatment, it is preferable to provide an antistatic layer between the support and the adhesive layer.

Furthermore, in order to improve the adhesion between the adhesive layer and the support, the surface of the support can also be corona treated. In addition, the support may be subjected to back surface treatment.

For the carrier film for the transparent conductive film (with a functional layer) of the present invention, if necessary, in order to protect the adhesive surface, a silicone-based, fluorine-based, long-chain alkyl-based or fatty acid amide can be attached to the surface of the adhesive. Isolation film treated with release agent. As the base material constituting the release film, there is paper or plastic film, and the plastic film can be preferably used in terms of excellent surface smoothness. The film is not particularly limited as long as it is a film that can protect the adhesive layer, and examples include polyethylene film, polypropylene film, polybutene film, polybutadiene film, polymethylpentene film, Polyvinyl chloride film, vinyl chloride copolymer film, polyethylene terephthalate film, polybutylene terephthalate film, polyurethane film, ethylene-vinyl acetate copolymer film, etc.

In addition, as for the support for the isolation film, if necessary, alkali treatment, primer treatment, corona treatment, plasma treatment, ultraviolet treatment and other easy-to-adhesion treatments can be carried out. Coating type, kneading type, vapor deposition type, etc. Antistatic treatment. Especially in the case of antistatic treatment, it is preferable to provide an antistatic treatment layer between the support and the release agent.

2. (with functional layer) transparent conductive film

The transparent conductive film 6 includes a transparent conductive layer 4 and a transparent conductive layer 4 as shown in FIGS. 2 and 3. Film of substrate 5.

As the transparent base material 5, a base material (for example, a sheet-like, film-like, plate-like base material (member), etc.) containing a resin film, glass, etc., etc., and the like are particularly exemplified. The thickness of the transparent substrate 5 is not particularly limited, but is preferably about 10 to 200 μm, more preferably about 15 to 150 μm.

The material of the above-mentioned resin film is not particularly limited, and various plastic materials with transparency can be cited. For example, the material includes: polyester resins such as polyethylene terephthalate and polyethylene naphthalate, acetate resins, polyether turpentine resins, polycarbonate resins, and polyamides. Amine resins, polyimide resins, polyolefin resins, (meth)acrylic resins, polyvinyl chloride resins, polyvinylidene chloride resins, polystyrene resins, polyvinyl alcohol resins, Polyarylate resin, polyphenylene sulfide resin, etc. Among these, polyester-based resins, polyimide-based resins, and polyether-based resins are particularly preferred.

In addition, for the above-mentioned transparent substrate 5, etching treatments or primer treatments such as sputtering, corona discharge, flame, ultraviolet irradiation, electron beam irradiation, chemical treatment, oxidation, etc. can also be applied to the surface in advance to improve the The adhesion of the transparent conductive layer 4 and the like to the above-mentioned transparent substrate 5. In addition, before the transparent conductive layer 4 is provided, if necessary, dust removal and purification may be performed by solvent cleaning or ultrasonic cleaning.

The constituent material of the transparent conductive layer 4 is not particularly limited, and the group selected from the group consisting of indium, tin, zinc, gallium, antimony, titanium, silicon, zirconium, magnesium, aluminum, gold, silver, copper, palladium, and tungsten can be used At least one of the metal oxides. The metal oxide may further contain metal atoms shown in the above group as necessary. For example, indium oxide containing tin oxide (ITO), tin oxide containing antimony, etc. can be preferably used, and ITO can be particularly preferably used. As ITO, it is preferable to contain 80 to 99 weight% of indium oxide and 1 to 20 weight% of tin oxide.

The thickness of the transparent conductive layer 4 is not particularly limited, and is more preferably 10 to 300 nm, and still more preferably 15 to 100 nm.

The method for forming the transparent conductive layer 4 is not particularly limited, and a conventionally known method can be used. Specifically, for example, vacuum evaporation method, sputtering method, ion plating law. Moreover, an appropriate method can also be adopted according to the required film thickness.

Moreover, a primer layer, an anti-oligomer layer, etc. may be provided between the transparent conductive layer 4 and the transparent substrate 5 as needed.

Moreover, the transparent conductive film 6 which has the said transparent conductive layer 4 can be used as a base material (optical member) for optical elements. The substrate for optical elements is not particularly limited as long as it is a substrate with optical properties, and examples include display devices (liquid crystal display devices, organic EL (electroluminescence) display devices, PDP (Plasma Display Panel, Plasma display panels), electronic paper, etc.), input devices (touch panels, etc.) and other equipment (components) or substrates (components) used in such equipment. These substrates for optical elements have been thinned in recent years, their stiffness has disappeared, and they are easily bent or deformed in shape during processing steps or transport steps. By attaching and using the carrier film for the transparent conductive film of the present invention, the shape can be maintained and the occurrence of defects can be suppressed, which is a preferred aspect.

As shown in FIG. 3, a functional layer 7 may be provided on the surface of the transparent conductive film 6 on the side where the transparent conductive layer 5 is not provided.

As the above-mentioned functional layer, for example, an anti-glare treatment (AG) layer, an anti-reflection (AR) layer, a hard coat (HC), an anti-blocking (AB) layer, etc., for the purpose of improving visibility can be cited.

The constituent material of the anti-glare treatment layer is not particularly limited. For example, ionizing radiation curable resin, thermosetting resin, thermoplastic resin, etc. can be used. The thickness of the anti-glare treatment layer is preferably 0.1-30 μm. As the anti-reflection layer, titanium oxide, zirconium oxide, silicon oxide, magnesium fluoride, etc. can be used. The anti-reflection layer can be provided with multiple layers.

As a material for forming the above-mentioned hard coat (HC) layer, for example, hardening resins including melamine resins, urethane resins, alkyd resins, acrylic resins, and silicone resins can be preferably used. Laminated. The thickness of the hard coat layer is preferably 0.1 to 30 μm. The thickness is preferably 0.1 μm or more in terms of imparting hardness. In addition, the anti-glare treatment layer, anti-reflection layer, or anti-blocking layer may be provided on the hard coat layer. In addition, it can be used with anti-glare function, anti-reflection function, anti-blocking function, anti-oligomer function coating.

As the anti-blocking layer, it is preferable to use: a hardening resin layer containing fine particles; or using a coating composition containing two or more components that are phase-separated as the hardening resin composition; or Use these together to form unevenness on the surface. Examples of components of the curable resin layer include thermosetting resins, ultraviolet curable resins, electron beam curable resins, and the like. Furthermore, as a coating composition containing two or more components that undergo phase separation, for example, the composition described in International Publication No. 2005/073763 can be preferably used. The thickness of the anti-blocking layer is preferably 0.1 to 30 μm.

The thickness of the transparent conductive film with a functional layer (including the functional layer) is preferably 210 μm or less, more preferably 150 μm or less. By using the carrier film for a transparent conductive film (with a functional layer) of the present invention for a transparent conductive film (adherent) within the above range, the shape of the transparent conductive film can be maintained even when the transparent conductive film is very thin. It can suppress the occurrence of undesirable conditions such as wrinkles or damage, making it a better aspect.

3. Laminated body

In addition, the present invention relates to a laminate 9, characterized in that it has a transparent conductive film carrier film 3, and a transparent conductive film 6 laminated on the transparent conductive film carrier film 3, and The carrier film 3 for a transparent conductive film is the carrier film for a transparent conductive film described in this specification. The transparent conductive film 6 has a transparent conductive layer 4 and a transparent substrate 5, and is in contact with the transparent substrate 5 The surface of the transparent conductive layer 4 is the surface on the opposite side, and the adhesive surface of the adhesive layer 1 of the carrier film 3 for the transparent conductive film is bonded (for example, FIG. 2).

Furthermore, the present invention relates to a laminated body characterized in that it has a transparent conductive film carrier film 3 and a transparent conductive film 6 laminated on the transparent conductive film carrier film 3, and The carrier film 3 for the transparent conductive film is the carrier film for the transparent conductive film described in this specification. The transparent conductive film 3 has a transparent conductive layer 4 and a transparent substrate 5, and is in contact with the transparent substrate A functional layer 7 is provided on the surface opposite to the surface of the transparent conductive layer, and the transparent conductive film is attached to the surface of the functional layer 7 opposite to the surface contacting the transparent substrate 5 The adhesive surface of the adhesive layer 1 of the carrier film 3 (for example, FIG. 3).

The carrier film for a transparent conductive film and the transparent conductive film (with a functional layer) used in the laminate of the present invention include those described above.

[Example]

Examples and the like which specifically show the structure and effects of the present invention will be described below, but the present invention is not limited to these. In addition, the evaluation items of the Example etc. were measured as follows. The blending contents are shown in Table 1 and Table 2, and the evaluation results are shown in Table 2.

Manufacturing example 1

(Adjustment of acrylic polymer)

Into a four-necked flask equipped with a stirring blade, a thermometer, a nitrogen introduction tube, and a condenser, 82.99 parts by weight of 2-ethylhexyl acrylate (2EHA), 14 parts by weight of 4-hydroxybutyl acrylate (4HBA), and hydroxyl methacrylate were added. 3 parts by weight of ethyl ester (HEMA), 0.01 parts by weight of acrylic acid, 0.2 parts by weight of 2,2'-azobisisobutyronitrile as a polymerization initiator, and 186 parts by weight of ethyl acetate. While slowly stirring, nitrogen is introduced. The liquid temperature in the flask was maintained at about 60°C, and the polymerization reaction was performed for about 6 hours to prepare an acrylic polymer (A1) solution (about 35% by weight). The weight average molecular weight of the acrylic polymer (A1) was 650,000, and the Tg was -63°C.

Manufacturing example 2~12

In Production Example 1, as shown in Table 1, except for changing the acrylic polymer used Except for the types of monomers and their usage ratios, solutions of acrylic polymers (A2) to (A8) and (A11) to (A14) were prepared by the same method as in Production Example 1.

The abbreviations in Table 1 are as follows.

2EHA: 2-ethylhexyl acrylate

BA: Butyl acrylate

4HBA: 4-hydroxybutyl acrylate

HEMA: 2-hydroxyethyl methacrylate

HPA: 2-hydroxypropyl acrylate

AA: Acrylic

<Measurement of the weight average molecular weight (Mw) of acrylic polymers>

The weight average molecular weight of the produced polymer was measured by GPC (gel permeation chromatography).

Device: HLC-8220GPC, manufactured by Tosoh

String:

Sample column: TSKguardcolumn Super HZ-H (1) + TSKgel Super HZM-H (2 pieces), manufactured by Tosoh Corporation

Reference column: TSKgel Super H-RC (1), manufactured by Tosoh Corporation

Flow rate: 0.6ml/min

Injection volume: 10μL

Column temperature: 40℃

Eluent: THF (TetraHydro Furan, tetrahydrofuran)

Concentration of injected sample: 0.2% by weight

Detector: Differential refractometer

In addition, the weight average molecular weight is calculated by polystyrene conversion.

<Measurement of the glass transition temperature (Tg) of acrylic polymers>

Regarding the glass transition temperature (Tg) (°C), the following literature value is used as the glass transition temperature Tg _n (°C) of the homopolymer of each monomer, and it is calculated by the following formula.

Formula: 1/(Tg+273)=Σ[Wn/(Tg _n +273)]

(In the formula, Tg (℃) represents the glass transition temperature of the copolymer, Wn (-) represents the weight fraction of each monomer, Tg _n (℃) represents the glass transition temperature of the homopolymer of each monomer, and n represents each Type of monomer)

Butyl acrylate (BA): -55℃

2-Ethylhexyl acrylate (2EHA): -70℃

4-hydroxybutyl acrylate (4HBA): -32℃

2-Hydroxyethyl methacrylate (HEMA): 55℃

2-Hydroxypropyl acrylate (HPA): -7°C

Acrylic: 106°C

In addition, as the literature value, refer to "Synthesis, Design, and New Use Development of Acrylic Resin" (published by the Publishing Department of the Central Management Development Center) and the manufacturer's catalog.

Example 1

(Adjustment of adhesive solution)

The acrylic polymer (A1) solution (about 35% by weight) obtained in Production Example 1 was diluted to 29% by weight with ethyl acetate, relative to 100 parts by weight (solid content) of the acrylic polymer in the solution, 22 parts by weight of isocyanurate body containing hexamethylene diisocyanate (trade name: Coronaate HX, manufactured by Japan Polyurethane Industry Co., Ltd.), 0.015 parts by weight of dioctyltin dilaurate as a tin catalyst, keep The mixing and stirring were carried out at about 25°C for about 1 minute to prepare an acrylic adhesive composition (1).

(Production of carrier film for transparent conductive film)

The above acrylic adhesive composition (1) was coated on one side of a polyethylene terephthalate (PET) substrate (thickness 125μm, support) and heated at 150°C for 90 seconds to form a thickness of 20μm The adhesive layer. Next, the silicone-treated surface of a PET release liner (thickness 25μm) that has been silicone-treated on one side is attached to the surface of the above-mentioned adhesive layer, and stored at 50°C for 1 day to produce a transparent conductive film carrier membrane. In addition, use after removing the release liner during use.

Examples 2~10, Comparative Examples 1~6

As shown in Table 2, the type of acrylic polymer or the crosslinking agent constituting the adhesive composition or its blending amount was changed, and the iron catalyst (ferrous acetone acetone) was used instead of the tin catalyst in Comparative Examples 3 and 4. Except for the medium, a carrier film for a transparent conductive film was produced by the same method as in Example 1.

The following evaluations were performed on the carrier films for transparent conductive films obtained in Examples and Comparative Examples.

<Adhesive force measurement>

As the adherend, a transparent conductive film (trade name: V150-OFJ) with a width of 50 mm and a length of 100 mm fixed on a SUS plate (SUS430BA) has a transparent conductive layer on one side of the PET film. A film with an anti-adhesion layer (formed by a coating composition containing less than 5% by weight of 0.8 μm acrylic particles containing amorphous silicon dioxide, acrylic monomers, photoinitiators, and additives) on the surface , Anti-blocking of Nitto Denko Co., Ltd. On the layer, stick the adhesive surface of the adhesive layer of the carrier film for transparent conductive film (crimping with a laminator: 0.25MPa, crimping speed 2.0m/min). Next, heat at 140°C for 90 minutes, and then place it at room temperature (25°C) for more than 30 minutes, and use a universal tensile testing machine in the same environment at a peeling speed of 0.3m/min (low-speed peeling) and 10m/ The carrier film for the transparent conductive film was peeled from the transparent conductive film under conditions of minutes (high-speed peeling) and a peeling angle of 180°, and the peeling force (N/50mm) at this time was measured.

<tearing sound>

As the adherend, a transparent conductive film (trade name: V150-OFJ) with a width of 50 mm and a length of 100 mm fixed on a SUS plate (SUS430BA) has a transparent conductive layer on one side of the PET film. A film with an anti-adhesion layer (formed by a coating composition containing less than 5% by weight of 0.8 μm acrylic particles containing amorphous silicon dioxide, acrylic monomers, photoinitiators, and additives) on the surface , Nitto Denko (manufactured by Nitto Denko Co., Ltd.) on the adhesion surface of the adhesive layer of the transparent conductive film carrier film (crimping by laminating machine: 0.25MPa, crimping speed 2.0m/min) . Next, heat at 140°C for 90 minutes, and then place it at room temperature (25°C) for more than 30 minutes, then use a universal tensile testing machine in the same environment with a peeling speed of 0.3m/min and a peeling angle of 180°. Transparent conductive film The carrier film for the transparent conductive film was peeled by 80 mm, and the peeling force (N/50 mm) at this time was measured. Using the measurement data of the half 60 mm portion after the peeling force, the presence or absence of the tearing noise was evaluated by the following formula.

○:△F/F(Ave)<15% (no tearing sound)

×: △F/F(Ave)≧15% (produce tearing sound)

△F: F(Max)-F(Min)

(In the above formula, F(Max) is the maximum peeling force, F(Min) is the minimum peeling force)

F(Ave): Average peel force

[Table 2]

In Table 2, A1~A14 are the (meth)acrylic polymers produced in Production Examples 1-12, and C/HX represents the isocyanate-based crosslinking agent (isocyanurate body of hexamethylene diisocyanate). , Trade name: Coronaate HX, manufactured by Japan Polyurethane Industry Co., Ltd.), C/L means isocyanate-based crosslinking agent (trimethylolpropane/toluene diisocyanate trimer adduct, Trade name: Coronaate L, Japanese polyurethane Industrial (Stock) Manufacturing), tin catalyst means dioctyltin dilaurate, and iron catalyst means ferrous acetone acetone.

1‧‧‧Adhesive layer

2‧‧‧Support (base material)

3‧‧‧Carrier film for transparent conductive film

A‧‧‧Adhesive surface

Claims (9)

A carrier film for a transparent conductive film, characterized in that it is a support having an adhesive layer on at least one side of the support, and in a state where the adhesive layer of the carrier film is attached to the adherend After heating at 140°C for 90 minutes, the adhesive force P when peeling the carrier film from the adherend at a stretching speed of 0.3m/min and the adhesive force Q when peeling off at a stretching speed of 10m/min are both 0.7N/ 50mm or less, and the absolute value of the difference between the adhesive force P and the adhesive force Q is 0.2N/50mm or less, the adhesive layer is formed of an adhesive composition, and the adhesive composition includes a (meth)acrylate (Meth)acrylic acid obtained by polymerizing monomer components of hydroxyl-containing monomers whose glass transition temperature of base ester and homopolymer is less than 50℃, and that of homopolymer whose glass transition temperature is above 50℃ Department of polymers. The carrier film for transparent conductive film of claim 1, wherein the blending amount of the hydroxyl-containing monomer whose glass transition temperature of the above-mentioned homopolymer is less than 50°C is 10-17% by weight relative to the total amount of the above-mentioned monomer components And the blending amount of the hydroxyl-containing monomer whose glass transition temperature of the above-mentioned homopolymer is 50°C or higher is 2-8% by weight relative to the total amount of the above-mentioned monomer components. The carrier film for a transparent conductive film of claim 1 or 2, wherein the monomer component further contains a carboxyl group-containing monomer, and the blending amount of the carboxyl group-containing monomer is 0.005 to 0.10 weight relative to the total amount of the monomer components %. The carrier film for a transparent conductive film of claim 1 or 2, wherein the adhesive composition further comprises a crosslinking agent, and the blending amount of the crosslinking agent is relative to 100 parts by weight of the (meth)acrylic polymer More than 20 parts by weight. The carrier film for a transparent conductive film according to claim 4, wherein the crosslinking agent is an aliphatic polyisocyanate-based crosslinking agent. The carrier film for a transparent conductive film according to claim 5, wherein the aliphatic polyisocyanate-based crosslinking agent contains hexamethylene diisocyanate. A laminated body characterized in that it has a carrier film for a transparent conductive film as in any one of claims 1 to 6 and a transparent conductive film laminated on the carrier film for a transparent conductive film, and On at least one surface of the transparent conductive film, the adhesive surface of the adhesive layer of the carrier film for the transparent conductive film is bonded. The laminate of claim 7, wherein the transparent conductive film has a transparent conductive layer and a transparent substrate, and the transparent substrate is attached to the surface of the transparent substrate on the opposite side to the surface in contact with the transparent conductive layer. The adhesive surface of the adhesive layer of the conductive film carrier film. The laminate of claim 7, wherein the transparent conductive film has a transparent conductive layer and a transparent substrate, and further has a functional layer on the surface of the transparent substrate on the opposite side to the surface in contact with the transparent conductive layer, The adhesive surface of the adhesive layer of the carrier film for the transparent conductive film is attached to the surface of the functional layer on the opposite side to the surface in contact with the transparent substrate.

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