TW201706128A - Carrier film for transparent electroconductive film, and laminate - Google Patents

Abstract

A purpose of the present invention is to provide a carrier film for transparent electroconductive films which can be inhibited from causing zipping, is excellent in terms of tight adhesion to transparent electroconductive films and removability therefrom, and has a small difference in adhesive force between a high-speed separation and a low-speed separation to attain excellent operation efficiency. Another purpose of the present invention is to provide a laminate comprising the carrier film for transparent electroconductive films and a transparent electroconductive film. The carrier film for transparent electroconductive films comprises a support and a pressure-sensitive adhesive layer formed on at least one surface of the support, and is characterized in that when the carrier film in such a state that the pressure-sensitive adhesive layer thereof has been applied to an adherend is heated at 140 DEG C for 90 minutes and is then separated from the adherend at a pulling speed of 0.3 m/min and at a pulling speed of 10 m/min to obtain adhesive force P and adhesive force Q, respectively, then the adhesive force P and the adhesive force Q are 0.7 N/50 mm or less each and the absolute value of the difference between the adhesive force P and the adhesive force Q is 0.2 N/50 mm or less.

Description

Carrier film and laminate for transparent conductive film

The present invention relates to a carrier film for a transparent conductive film having a support and an adhesive layer. Moreover, the present invention relates to a laminate having the carrier film for a transparent conductive film and a transparent conductive film.

In recent years, in a touch panel, a liquid crystal display panel, an organic EL (Electro Luminescence) panel, an electrochromic panel, an electronic paper element, or the like, an element of a film substrate provided with a transparent electrode on a plastic film is used. Demand is increasing.

As a material of the transparent electrode, an ITO (Indium Tin Oxide) film (In, Sn composite oxide), a metal film such as silver or copper, or a silver nanowire film, including the above ITO film, silver or copper, is currently used. The thickness of the film substrate of the metal thin film or the silver nanowire film tends to be thinner year by year.

Further, on the film substrate or the like including the ITO film, an antireflection (AR) layer is provided as a functional layer to improve visibility, or a hard coat (HC) layer is provided to prevent damage, or an anti-stick is provided. The (AB) layer is used to prevent adhesion, or an anti-oligomer (OB) layer is provided to prevent white turbidity during heating.

In particular, an optical member such as an ITO film is used in order to prevent damage or stains during a processing step, a transfer step, or the like, and to bond a surface protective film or the like.

As an adhesive film for surface protection used for an optical member, for example, a surface protective sheet having an adhesive layer on a support, the above-mentioned adhesive layer is The preparation is carried out by using an adhesive having two kinds of (meth)acrylic polymers having different glass transition temperatures and adjusting the degree of crosslinking by the crosslinking agent (see Patent Document 1); or in a plastic film. An adhesive film of an adhesive layer obtained from an adhesive solution on one side, the adhesive solution comprising a monomer component containing a specific amount of 2-ethylhexyl acrylate and hydroxyethyl methacrylate An acrylic copolymer and a specific amount of a polyfunctional isocyanate crosslinking agent (see Patent Document 2).

Moreover, as a carrier film for a transparent conductive film, a carrier film for a transparent conductive film having an adhesive layer on at least one surface of a support is known, and the adhesive layer contains a glass transition temperature of -50 ° C or lower. It is formed of an (meth)acrylic polymer, an isocyanate crosslinking agent, and an adhesive composition centered on iron (see Patent Document 3).

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2005-146151

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2012-21164

[Patent Document 3] Japanese Patent Laid-Open No. 2015-48394

The use of the transparent conductive film has not been sufficiently studied in Patent Documents 1 and 2. Therefore, when the surface protective sheets of Patent Documents 1 and 2 are used as a carrier film for a transparent conductive film, the difference in adhesion between the low-speed peeling and the high-speed peeling is not sufficiently reduced, and the film is broken during peeling. Or a case where a crack is generated as a transparent conductive film of an adherend.

Further, in Patent Document 3, there is a description that the tearing sound when peeling off from the transparent conductive film can be eliminated, but the difference in adhesion between the low-speed peeling and the high-speed peeling is not sufficiently small, and there is room for further research from the viewpoint of workability. .

The "tear sound" caused by peeling off the transparent conductive film from the carrier film means that the transparent conductive film is not peeled off smoothly when it is peeled off from the carrier film, and the sound is squeaky. Sound, while repeatedly peeling off or stopping. If the tearing sound is generated when the adhesion of the carrier film to the transparent conductive film as the adherend is high, the transparent conductive film may be cracked or may have a peeling trace, which is not preferable.

Further, when the carrier film is peeled off from the transparent conductive film, the adhesive force in the case where the adhesive force is peeled off at a high speed tends to be high at the time of low-speed peeling. In many cases, the peeling of the carrier film is performed by hand. In general, the operator often performs high-speed peeling, so that the carrier film is hard to be peeled off and workability is inferior. Further, there is a case where the film is broken or broken in the middle of peeling. Further, in general, the peeling of such a manual work is often performed at a low speed peeling at the beginning and gradually peeling at a high speed, and the peeling speed is not fixed. In such a case, if the difference in adhesion between the low-speed peeling and the high-speed peeling is large, there is a risk that the film is broken during the peeling or the crack is generated as the transparent conductive film of the adherend, and the industry is eagerly expected. The carrier film for a transparent conductive film in which the adhesion is fixed at any peeling speed.

An object of the present invention is to provide a transparent conductive material which is excellent in workability and which is excellent in adhesion to a transparent conductive film and re-peelability, and which has a small difference in adhesion between high-speed peeling and low-speed peeling. Carrier film for film. Further, an object of the present invention is to provide a laminate comprising the above-described transparent conductive film-carrying film and a transparent conductive film.

In order to achieve the above object, the inventors of the present invention have made an effort to achieve the above object by using the following carrier film for a transparent conductive film, and have completed the present invention.

That is, the present invention relates to a carrier film for a transparent conductive film, which is characterized in that it has an adhesive layer on at least one surface of a support, and the adhesive layer of the carrier film is bonded to the adhesive layer. After heating at 140 ° C for 90 minutes in a state of the body, the adhesion force P when the carrier film was peeled off from the adherend at a stretching speed of 0.3 m/min, and the adhesion force when peeled at a stretching speed of 10 m/min Q All are below 0.7N/50mm, and The absolute value of the difference between the adhesive force P and the adhesive force Q is 0.2 N/50 mm or less.

Preferably, the adhesive layer is formed of an adhesive composition comprising a hydroxyl group-containing monomer having a glass transition temperature of less than 50 ° C containing an alkyl (meth)acrylate and a homopolymer. And a (meth)acrylic polymer obtained by polymerizing a monomer component of a hydroxyl group-containing monomer having a glass transition temperature of 50 ° C or higher.

Preferably, the amount of the hydroxyl group-containing monomer having a glass transition temperature of less than 50 ° C of the above homopolymer is 10 to 17% by weight based on the total amount of the monomer components, and the glass transition temperature of the above homopolymer is 50 The compounding amount of the hydroxyl group-containing monomer above °C is 2 to 8% by weight based on the total amount of the above monomer components.

It is preferable that the monomer component further contains a carboxyl group-containing monomer, and the compounding amount of the carboxyl group-containing monomer is 0.005 to 0.10% by weight based on the total amount of the monomer component.

It is preferable that the pressure-sensitive adhesive composition further contains a crosslinking agent in an amount of more than 20 parts by weight based on 100 parts by weight of the (meth)acryl-based polymer.

The crosslinking agent is preferably an aliphatic polyisocyanate crosslinking agent, and more preferably the aliphatic polyisocyanate crosslinking agent contains hexamethylene diisocyanate.

Further, the carrier film for a transparent conductive film may be one in which an adhesive layer is formed on at least one surface of the support, and the adhesive layer is formed of the following adhesive composition. The adhesive composition comprises a monomer component comprising a hydroxyl group-containing monomer having a glass transition temperature of not more than 50 ° C of a homopolymer and a hydroxyl group-containing monomer having a glass transition temperature of 50 ° C or higher. Methyl) acrylic polymer.

Furthermore, the present invention relates to a laminate comprising the transparent conductive film carrier film and the transparent conductive film laminated on the transparent conductive film carrier film, and the transparent conductive film The adhesive surface of the adhesive layer of the above-mentioned transparent conductive film is bonded to the surface of at least one side of the film.

In addition, the transparent conductive film has a transparent conductive layer and a transparent substrate, and the surface of the transparent substrate opposite to the surface in contact with the transparent conductive layer is bonded to the surface. The adhesive surface of the adhesive layer of the carrier film for the transparent conductive film.

In addition, the transparent conductive film has a transparent conductive layer and a transparent substrate, and further has a functional layer on a surface of the transparent substrate opposite to a surface contacting the transparent conductive layer. The adhesive surface of the adhesive layer of the transparent conductive film-supporting film is bonded to the surface of the functional layer opposite to the surface contacting the transparent substrate.

The carrier film for a transparent conductive film of the present invention can suppress the occurrence of tearing sound, and is excellent in adhesion to a transparent conductive film and removability, and has a small difference in adhesion between high-speed peeling and low-speed peeling, and is excellent in workability. Further, the present invention provides a laminate comprising the above-described transparent conductive film-carrying film and a transparent conductive film.

Moreover, by using the carrier film for a transparent conductive film of the present invention, the transparent conductive film as the adherend can be prevented from wrinkles or damage, and the shape of the transparent conductive film can be maintained.

1‧‧‧Adhesive layer

2‧‧‧Support (substrate)

3‧‧‧Transparent film for transparent conductive film

4‧‧‧Transparent conductive layer

5‧‧‧Transparent substrate

6‧‧‧Transparent conductive film

7‧‧‧ functional layer

8‧‧‧With functional layer transparent conductive film

9‧‧‧Layer

A‧‧‧ adhesive face

Fig. 1 is a schematic view showing an embodiment of a carrier film for a transparent conductive film of the present invention.

Fig. 2 is a schematic view showing an embodiment of a laminate in which a transparent conductive film is adhered to an adhesive layer of a carrier film for a transparent conductive film of the present invention.

Fig. 3 is a schematic view showing an embodiment in which a laminate having a functional layer transparent conductive film is attached to an adhesive layer of a carrier film for a transparent conductive film of the present invention.

1. Transparent conductive film carrier film

Hereinafter, embodiments of the present invention will be described in detail using FIGS. 1 to 3. However, the present invention is not limited to the embodiments of Figs. 1 to 3.

As shown in Fig. 1, the carrier film 3 for a transparent conductive film of the present invention has an adhesive layer 1 on at least one surface of the support 2, and is opposite to the surface of the adhesive layer 1 which is in contact with the support 2 The side has an adhesive surface A. As shown in FIG. 2, the adhesive surface A is a surface of the transparent substrate 5 constituting the transparent conductive film (the transparent substrate 5 does not exist when the transparent conductive film 6 as the adherend does not have a functional layer). As shown in FIG. 3, when the transparent conductive film as the adherend is a functional layer transparent conductive film 8, as shown in FIG. 3, it is a surface in contact with the functional layer 7. Further, as shown in FIGS. 2 and 3, the laminated body 9 of the present invention includes the transparent conductive film supporting film 3 and the transparent conductive film 6 (or the functional layer transparent conductive film 8).

The carrier film for a transparent conductive film of the present invention is characterized in that the adhesive layer of the carrier film is heated at 140 ° C for 90 minutes while being bonded to the adherend, and then has a stretching speed of 0.3 m/min. The adhesive force P when the carrier film is peeled off from the adherend, and the adhesive force Q when peeled off at a tensile speed of 10 m/min are all 0.7 N/50 mm or less, and the absolute difference between the adhesive force P and the adhesive force Q is absolute. The value is 0.2 N/50 mm or less.

The adhesive force P is 0.7 N/50 mm or less, preferably 0.6 N/50 mm or less, and more preferably 0.5 N/50 mm or less. The lower limit of the adhesive force P is not particularly limited, and is preferably 0.1 N/50 mm or more from the viewpoint of the adhesive force of the transparent conductive film as the adherend. When the adhesive force at the time of peeling at a tensile speed of 0.3 m/min is in the above range, tearing sound does not occur even when the transparent conductive film carrier film is peeled off from the transparent conductive film at a low speed, and the adhesion is improved. It is preferable because the balance of the removability is excellent.

The adhesive force Q is 0.7 N/50 mm or less, preferably 0.6 N/50 mm or less, and more preferably 0.5 N/50 mm or less. The lower limit of the adhesive force Q is not particularly limited, and is preferably 0.1 N/50 mm or more from the viewpoint of the adhesive force of the transparent conductive film as the adherend. If the peeling force at a stretching speed of 10 m/min is more than 0.7 N/50 When the film thickness of the transparent conductive film is peeled off from the transparent conductive film, the film may be broken or broken. On the other hand, when the adhesive force at the time of peeling at a tensile speed of 10 m/min is in the above range, tearing sound does not occur even when the transparent conductive film carrier film is peeled off from the transparent conductive film at a high speed, and the adhesion is not obtained. It is preferable that the balance between the property and the re-peelability is excellent.

The absolute value of the difference between the adhesive force P and the adhesive force Q is 0.2 N/50 mm or less, preferably 0.15 N/50 mm or less, more preferably 0.1 N/50 mm or less, and particularly preferably 0.05 N/50 mm or less. The lower limit of the absolute value of the difference between the adhesive force P and the adhesive force Q is not particularly limited, and the smaller the smaller the thickness, the better the thickness is preferably (0N/50 mm). When the absolute value of the difference between the adhesive force P and the adhesive force Q exceeds 0.2 N/50 mm, when the transparent conductive film carrier film is peeled off from the transparent conductive film, the film is broken during the peeling or the transparent conductive layer is generated. The case of cracks. On the other hand, the absolute value of the difference between the adhesive force P and the adhesive force Q is within the above range, and the peeling speed is not fixed even in a peeling operation such as a manual operation (normally, low-speed peeling at the beginning, and gradually approaching high-speed peeling). In this case, the film is not broken during the peeling, or the transparent conductive layer is not cracked, and the transparent conductive film is excellent in removability, which is preferable.

In the measurement of the adhesive force, the "adhered body" is a transparent conductive film. When the transparent conductive film does not have a functional layer, the adhered surface is a surface of a transparent substrate constituting the transparent conductive film, and is transparently conductive. In the case where the film has a functional layer, the adhered surface is the surface of the functional layer.

The carrier film for a transparent conductive film of the present invention is not particularly limited as long as it has an adhesive layer on at least one surface of the support, and the adhesive composition is not particularly limited. Hereinafter, a preferred composition will be described.

(1) Adhesive layer

The adhesive layer of the present invention is not particularly limited, and may be an adhesive such as an acrylic, a synthetic rubber, a rubber or an anthrone, and the like, from the viewpoints of transparency and heat resistance. An acrylic adhesive based on a (meth)acrylic polymer is preferred.

The (meth)acrylic polymer which is a base polymer of an acrylic adhesive is obtained by polymerizing a monomer component containing an alkyl (meth)acrylate, and contains an alkyl (meth)acrylate. (meth)acrylic polymer system obtained by polymerizing a hydroxyl group-containing monomer having a glass transition temperature of less than 50 ° C and a monomer component of a hydroxyl group-containing monomer having a glass transition temperature of 50 ° C or higher It is preferable that the difference in adhesion at the time of high-speed peeling and low-speed peeling becomes small.

As the alkyl (meth)acrylate, for example, an alkyl group having 2 to 14 carbon atoms can be used, and as the main monomer component of the alkyl (meth)acrylate, the carbon number of the alkyl group is preferably 4 The alkyl (meth) acrylate of ~14 is more preferably an alkyl (meth) acrylate having a carbon number of 6 to 14, and particularly preferably an alkyl (meth) acrylate having a carbon number of 6 to 9. Here, the main monomer is 50% by weight or more, more preferably 60% by weight or more, and still more preferably 80% based on the total amount of the "(meth)acrylic acid alkyl ester" contained in the monomer component. More preferably, it is 100% by weight or more.

Examples of the alkyl (meth)acrylate having an alkyl group having 2 to 14 carbon atoms include ethyl (meth)acrylate, n-butyl (meth)acrylate (BA), and (meth)acrylic acid. Third butyl ester, isobutyl (meth)acrylate, hexyl (meth)acrylate, 2-ethylhexyl (meth)acrylate (2EHA), n-octyl (meth)acrylate, (methyl) Isooctyl acrylate, n-decyl (meth) acrylate, isodecyl (meth) acrylate, n-decyl (meth) acrylate, isodecyl (meth) acrylate, n-dodecane (meth) acrylate The ester, n-tridecyl (meth)acrylate, n-tetradecyl (meth)acrylate, etc. may be used alone or in combination of two or more. Among these, n-butyl (meth)acrylate (BA) or 2-ethylhexyl (meth)acrylate (2EHA) is preferred, and 2-ethylhexyl (meth)acrylate (2EHA) is preferred. ).

Particularly, in the case where the adhesive layer is required to be lightly peeled off, it is preferred to use the above alkyl (meth)acrylate having an alkyl group having 6 to 14 carbon atoms, preferably relative to the alkyl (meth)acrylate. The above alkyl (meth)acrylate having an alkyl group having 6 to 14 carbon atoms It is 50% by weight or more, more preferably 60% by weight or more, further preferably 80% by weight or more, and particularly preferably 90% by weight or more.

The content of the alkyl (meth)acrylate is preferably 65% by weight, more preferably 75% by weight or more, and still more preferably 80% by weight or more based on the monomer component.

The hydroxyl group-containing monomer having a glass transition temperature of less than 50 ° C as the homopolymer may be a homopolymer having a glass transition temperature of less than 50 ° C and having an unsaturated double (meth) acrylonitrile group or a vinyl group. A polymerizable functional group of a bond and containing a hydroxyl group. Specific examples thereof include 2-hydroxyethyl acrylate (Tg of a homopolymer: -15 ° C), 2-hydroxypropyl methacrylate (Tg of a homopolymer: 26 ° C), and 2-hydroxypropyl acrylate ( Hg of homopolymer: -7 ° C), 4-hydroxybutyl acrylate (Tg of homopolymer: -32 ° C) and other hydroxyalkyl (meth) acrylate, 2-hydroxy-3-phenoxy propyl acrylate (meth)acrylate having a cyclic structure such as ester (Tg of homopolymer: 17 ° C), 1,4-cyclohexane dimethanol monoacrylate (Tg of homopolymer: 18 ° C), polyethylene Alcohol monoacrylate (mole of ethylene glycol: 10, Tg of homopolymer: -64 ° C), polypropylene glycol monoacrylate (molar number of propylene glycol: 6, Tg of homopolymer: -59 ° C) (meth) acrylate or the like having an alkylene oxide structure, and the like may be used alone or in combination of two or more. Among these, 4-hydroxybutyl acrylate (Tg of homopolymer: -32 ° C) is preferred in terms of suppressing tearing sound.

Further, the glass transition temperature of the homopolymer of the hydroxyl group-containing monomer may be as low as 50 ° C, for example, preferably 30 ° C or lower, more preferably -40 to 30 ° C, still more preferably -40 to 0 ° C.

The content of the hydroxyl group-containing monomer having a glass transition temperature of less than 50 ° C of the above homopolymer is preferably 10 to 17% by weight, more preferably 10 to 15% by weight, and still more preferably 11 based on the total amount of the monomer components. ~14% by weight. When the content ratio of the hydroxyl group-containing monomer having a glass transition temperature of less than 50 ° C of the above homopolymer is less than 10% by weight, the number of reaction points is small, so that the crosslinking density is lowered and the adhesive strength tends to be high. In this case, the removability of the transparent conductive film is lowered, which is not preferable. On the other hand, if the above-mentioned homopolymer has a glass transition temperature of less than 50 ° C When the content ratio of the hydroxyl group-containing monomer exceeds 17% by weight, the reaction point is too large, so that the crosslinking density increases and the adhesion tends to be excessively lowered. In this case, the adhesion to the transparent conductive film is lowered, which is not preferable.

The hydroxyl group-containing monomer having a glass transition temperature of 50 ° C or higher as the homopolymer may be a homopolymer having a glass transition temperature of 50 ° C or higher and having an unsaturated double (meth) acrylonitrile group or a vinyl group. A polymerizable functional group of a bond and containing a hydroxyl group. Specific examples thereof include 2-hydroxyethyl methacrylate (Tg of a homopolymer: 55 ° C), N-methylol acrylamide (Tg of a homopolymer: 110 ° C), and N-(2-hydroxyl Ethyl) acrylamide (Tg: 98 ° C of a homopolymer), etc., These may be used individually by 1 type, or 2 or more types are used together. Among these, 2-hydroxyethyl methacrylate (Tg of a homopolymer: 55 ° C) is preferred in terms of suppressing tearing sound.

Further, the glass transition temperature of the homopolymer of the hydroxyl group-containing monomer may be 50 ° C or higher, for example, preferably 50 to 150 ° C, more preferably 50 to 100 ° C, still more preferably 50 to 90 ° C.

The content of the hydroxyl group-containing monomer having a glass transition temperature of 50 ° C or higher is preferably 2 to 8% by weight, and more preferably 3 to 6% by weight based on the total amount of the monomer components. When the content ratio of the hydroxyl group-containing monomer having a glass transition temperature of 50 ° C or higher is less than 2% by weight, the adhesive strength at the time of high-speed peeling tends to be less likely to be lowered, and when it exceeds 8 wt%, high-speed peeling occurs. The tendency of the adhesive force to decrease excessively is not good.

The monomer component may include the above-mentioned (meth)acrylic acid alkyl ester or a polymerizable monomer other than the hydroxyl group-containing monomer. As the other polymerizable monomer, a polymerizable monomer or the like for adjusting the glass transition point or the releasability of the (meth)acrylic polymer can be used within a range that does not impair the effects of the present invention. The other polymerizable monomers may be used singly or in combination, and the amount of the other polymerizable monomer to be added is preferably 10% by weight or less, and more preferably 5% by weight or less based on the total amount of the monomer components.

The carboxyl group-containing monomer is exemplified as the polymerizable monomer. Can enter more efficiently A carboxyl group-containing monomer can be used in terms of a crosslinking reaction and a reduction in adhesion at the time of high-speed peeling. Examples of the carboxyl group-containing monomer include a polymerizable functional group containing an unsaturated double bond such as a (meth) acrylonitrile group or a vinyl group, and a carboxyl group. Specific examples thereof include (meth)acrylic acid and a carboxyl group. Ethyl ester, carboxy amyl acrylate, itaconic acid, maleic acid, fumaric acid, crotonic acid, methacrylic acid, and the like. Among these carboxyl group-containing monomers, acrylic acid is preferred in terms of polymerizability, cohesiveness, price, and versatility.

The content of the carboxyl group-containing monomer is preferably 0.005 to 0.10% by weight, and more preferably 0.005 to 0.05% by weight based on the total amount of the monomer components. When the content of the carboxyl group-containing monomer is in the above range, the effect of lowering the adhesive force at the time of high-speed peeling is preferable, which is preferable.

As the other polymerizable monomer, for example, a sulfonic acid group-containing monomer, a phosphoric acid group-containing monomer, a cyano group-containing monomer, a vinyl ester monomer, an aromatic vinyl monomer, or the like can be suitably used to improve cohesive force and heat resistance. Ingredients, or an acid anhydride group-containing monomer, a mercapto group-containing monomer, an amine group-containing monomer, an epoxy group-containing monomer, an N-propylene group A monomer component having a functional group that functions as a crosslinking crosslinking point, such as a phenyl group or a vinyl ether monomer. These monomer components may be used singly or in combination of two or more.

Examples of the acid anhydride group-containing monomer include maleic anhydride and itaconic anhydride.

Examples of the sulfonic acid group-containing monomer include styrenesulfonic acid, allylsulfonic acid, 2-(methyl)acrylamido-2-methylpropanesulfonic acid, and (meth)acrylamide. Sulfonic acid, sulfopropyl (meth)acrylate, (meth)acryloxynaphthalenesulfonic acid, and the like.

Examples of the phosphoric acid group-containing monomer include 2-hydroxyethyl propylene decyl phosphate, 2-(phosphinooxy)ethyl methacrylate, and 3-chloro-2-(phosphino oxy methacrylate). ) propyl ester and the like.

Examples of the cyano group-containing monomer include acrylonitrile and the like.

Examples of the vinyl ester monomer include vinyl acetate, vinyl propionate, and vinyl laurate.

Examples of the aromatic vinyl monomer include styrene and chlorostyrene. Chloromethylstyrene, α-methylstyrene, and the like.

Examples of the guanamine-containing monomer include acrylamide, diethyl acrylamide, and the like.

Examples of the amine group-containing monomer include N,N-dimethylaminoethyl (meth)acrylate and N,N-dimethylaminopropyl (meth)acrylate.

Examples of the epoxy group-containing monomer include glycidyl (meth)acrylate and allyl glycidyl ether.

Examples of the vinyl ether monomer include methyl vinyl ether, ethyl vinyl ether, and isobutyl vinyl ether.

The (meth)acrylic polymer used in the present invention is obtained by polymerizing the above monomer component, and the polymerization method is not particularly limited, and may be carried out by solution polymerization, emulsion polymerization, bulk polymerization, suspension polymerization, or the like. The polymerization by a known method is more preferably solution polymerization from the viewpoint of workability and the like. Further, the polymer obtained may be any of a homopolymer or a random copolymer, a block copolymer, and the like.

The weight average molecular weight of the (meth)acrylic polymer used in the present invention is preferably from 300,000 to 5,000,000, more preferably from 400,000 to 2,000,000, and particularly preferably from 500,000 to 1,000,000. When the weight average molecular weight is less than 300,000, the adhesion to the transparent conductive film (with a functional layer) as the adherend is improved, and the adhesive force at the time of peeling is increased, so that the peeling step (re-peeling) is caused. In the case of being damaged by the adherend, there is a tendency that the cohesive force of the adhesive layer becomes small and the paste remains. On the other hand, when the weight average molecular weight exceeds 5 million, the fluidity of the polymer is lowered, and the wettability of the (conductive layer) transparent conductive film as the adherend is insufficient, resulting in the adherend and There is a tendency for the adhesive layer of the carrier film for a transparent conductive film to bulge. Further, the weight average molecular weight is obtained by GPC (Gel Permeation Chromatograph).

Moreover, it is easy to obtain a balance of adhesive properties, as the above (meth) propyl The glass transition temperature (Tg) of the olefinic polymer is preferably 0 ° C or lower (usually -100 ° C or higher, preferably -70 ° C or higher), more preferably -10 ° C or lower, and further preferably -20. Below °C, especially preferably below -30 °C. When the glass transition temperature is higher than 0 ° C, the polymer is difficult to flow, and the wet substrate of the transparent conductive film as the adherend is insufficiently wetted, resulting in the adhesive layer of the adherend and the carrier film. There is a tendency to bulge. Further, the glass transition temperature (Tg) of the (meth)acrylic polymer can be adjusted to the above range by appropriately changing the monomer component or composition ratio used.

In the adhesive composition used in the present invention, it is preferred to add a crosslinking agent in addition to the above (meth)acrylic polymer. As the crosslinking agent, an isocyanate compound, an epoxy compound, a melamine resin, an aziridine derivative, a metal chelate compound or the like can be used. Among these, an isocyanate compound can be preferably used from the viewpoint of obtaining an appropriate cohesive force. These compounds may be used singly or in combination of two or more.

The above isocyanate compound may, for example, be a compound having at least two isocyanate groups. For example, an aliphatic polyisocyanate, an alicyclic polyisocyanate or an aromatic polyisocyanate may be used. In the present invention, in terms of tearing suppression and adhesion, an aliphatic polyisocyanate can be preferably used, and in terms of tearing suppression and adhesion, it is preferred not to use an alicyclic polycondensation. Isocyanate, aromatic polyisocyanate.

Examples of the aliphatic polyisocyanate include trimethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate, pentamethylene diisocyanate, 1,2-propyl propyl diisocyanate, and 1,3. - butyl diisocyanate, dodecamethylene diisocyanate, 2,4,4-trimethylhexamethylene diisocyanate, etc., among which, in terms of tearing suppression and adhesion, An aliphatic polyisocyanate containing hexamethylene diisocyanate is preferred.

Examples of the commercially available product of the isocyanate-based crosslinking agent include the trade names "Coronate HL" and "Coronate HX" (the above is manufactured by Japan Polyurethane Industry Co., Ltd.); The trade names are "Takenate D-160N", "Takenate D-165N", "Takenate D-170HN", "Takenate D-178N" (above is manufactured by Mitsui Chemicals Co., Ltd.). These compounds may be used singly or in combination of two or more.

In the present invention, the amount of the isocyanate crosslinking agent is preferably more than 20 parts by weight, more preferably more than 20 parts by weight and not more than 30 parts by weight, based on 100 parts by weight of the (meth)acrylic polymer. It is preferably 21 to 25 parts by weight, particularly preferably 22 to 24 parts by weight. When the amount of the isocyanate crosslinking agent is more than 20 parts by weight, it is preferred to sufficiently carry out the crosslinking of the adhesive layer by the reaction with the hydroxyl group of the (meth)acrylic polymer. The formation of joints improves cohesion and suppresses the generation of tearing sound. Further, it is preferable to exhibit an appropriate adhesive force at the time of high-speed peeling and low-speed peeling, and it is possible to reduce the difference in adhesion between the high-speed peeling and the low-speed peeling. In addition, the amount of the isocyanate-based crosslinking agent is preferably added in an amount of from 0.89 to 1.22 in terms of an OH/NCO equivalent ratio with respect to the hydroxyl group of the (meth)acryl-based polymer, and more preferably Add the amount from 0.95 to 1.14. By setting the amount of the isocyanate-based crosslinking agent to the above range, the difference in the adhesion between the high-speed peeling and the low-speed peeling can be controlled to be small, which is preferable.

These isocyanate type crosslinking agents may be used singly or in combination of two or more kinds thereof, and a difunctional isocyanate compound may be used in combination with a trifunctional or higher isocyanate compound.

Examples of the epoxy compound include N,N,N',N'-tetraglycidyl metaxylylenediamine (trade name: TETRAD-X, manufactured by Mitsubishi Gas Chemical Co., Ltd.) or 1,3-double. (N,N-diglycidylamine methyl)cyclohexane (trade name: TETRAD-C, manufactured by Mitsubishi Gas Chemical Co., Ltd.). These compounds may be used singly or in combination of two or more.

Examples of the melamine-based resin include hexamethylol melamine and the like. Examples of the aziridine derivative include a commercial product name HDU (manufactured by Mutual Pharmaceutical Co., Ltd.), a trade name TAZM (manufactured by Mutual Pharmaceutical Co., Ltd.), and a trade name TAZO (Mutual Pharmaceuticals). ) Manufacturing) and so on. These compounds may be used singly or in combination of two or more.

Examples of the metal chelate compound include aluminum, titanium, nickel, zirconium, and the like. The synthesis component may, for example, be acetylene, ethyl acetoacetate, ethyl acetate, ethyl lactate or ethyl acetonacetone. These compounds may be used singly or in combination.

In the case where a crosslinking agent other than the isocyanate crosslinking agent is used in combination, the amount of the crosslinking agent is not particularly limited as long as the effect of the present invention is not impaired, and it is preferably used in the following range: relative to (meth)acrylic acid 100 parts by weight of the polymer, the total amount of the isocyanate crosslinking agent is more than 20 parts by weight, and the ratio of the isocyanate crosslinking agent in the total amount of the crosslinking agent is 50% by weight or more, more preferably 70% by weight or more, and further 90%. More than weight%.

Further, in the adhesive composition of the present invention, in addition to the above (meth)acrylic polymer, a polyfunctional monomer having two or more radiation-reactive unsaturated bonds may be blended. The polyfunctional monomer can be used as a monomer component in the preparation of a (meth)acrylic polymer. In this case, the (meth)acrylic polymer is crosslinked by irradiation with radiation or the like. Examples of the polyfunctional monomer having two or more radiation-reactive unsaturated bonds in one molecule include radiation having two or more vinyl groups, acrylonitrile groups, methacryl oxime groups, and vinyl benzyl groups. One or two or more kinds of radiation-reactive multifunctional monomers which are subjected to crosslinking treatment (hardening) are irradiated. Further, as the above polyfunctional monomer, generally, it is preferable to use 10 or less types of radiation-reactive unsaturated bonds. These compounds may be used singly or in combination of two or more.

Specific examples of the polyfunctional monomer include ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate, and new Pentyl glycol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol Hexa(meth)acrylate, divinylbenzene, N,N'-methylenebisacrylamide, and the like.

The compounding amount of the above polyfunctional monomer is preferably 30 parts by weight or less based on 100 parts by weight (solid content) of the (meth)acrylic polymer.

Examples of the radiation include ultraviolet rays, thunder rays, α rays, β rays, γ rays, X rays, and electron beams, and the like, and the controllability and operability are good, and the cost is good. Ultraviolet light is preferably used. More preferably, ultraviolet rays having a wavelength of 200 to 400 nm are used. The ultraviolet light can be irradiated with a suitable light source such as a high pressure mercury lamp, a microwave excitation lamp, or a chemical lamp. Further, in the case where ultraviolet rays are used as radiation, a photopolymerization initiator is formulated in the adhesive composition.

The photopolymerization initiator may be one which generates radicals or cations by irradiating ultraviolet rays of an appropriate wavelength which is an initiator of the polymerization reaction depending on the type of the radiation-reactive component.

Examples of the photoradical polymerization initiator include benzoin, benzoin methyl ether, benzoin ethyl ether, methyl phthalic acid benzoate, benzoin ethyl ether, benzoin isopropyl ether, α-methyl benzoin and the like. Acetophenones such as dimethyl ketal, trichloroacetophenone, 2,2-diethoxyacetophenone, 1-hydroxycyclohexyl phenyl ketone; 2-hydroxy-2-methylpropiophenone, Phenylacetones such as 2-hydroxy-4'-isopropyl-2-methylpropiophenone; benzophenone, methylbenzophenone, p-chlorobenzophenone, p-dimethylaminobiphenyl Benzophenones such as ketones; 2-chloro-9-oxosulfur 2-ethyl-9-oxosulfur 2-isopropyl-9-oxosulfur 9-oxosulfur Bis(2,4,6-trimethylbenzylidene)-phenylphosphine oxide, 2,4,6-trimethylbenzimidyldiphenylphosphine oxide, (2,4,6- Mercaptophosphine oxides such as trimethylbenzhydryl)-(ethoxy)-phenylphosphine oxide; benzophenone, dibenzocycloheptanone, α-mercaptodecyl ester, and the like. These compounds may be used singly or in combination of two or more.

Examples of the photocationic polymerization initiator include sulfonium salts such as aromatic diazonium salts, aromatic sulfonium salts, and aromatic sulfonium salts, or iron-aromatic complexes, ferrocene complexes, and aryl decanes. Organic metal complexes such as alcohol-aluminum complexes, nitrobenzyl esters, sulfonic acid derivatives, phosphates, phosphates, phenolsulfonates, diazonaphthoquinones, N-hydroxy quinone sulfinates Wait. These compounds may be used singly or in combination of two or more. The photopolymerization initiator is usually formulated in an amount of 0.1 to 10 parts by weight, preferably 0.2 to 7 parts by weight, based on 100 parts by weight of the (meth)acrylic polymer.

Further, a photoinitial polymerization aid such as an amine may be used in combination. As the above light start aid Examples of the agent include 2-dimethylaminoethyl benzoate, dimethylaminoacetophenone, ethyl p-dimethylaminobenzoate, isoamyl p-dimethylaminobenzoate, and the like. . These compounds may be used singly or in combination of two or more. The polymerization initiation aid is preferably formulated in an amount of from 0.05 to 10 parts by weight, more preferably from 0.1 to 7 parts by weight, based on 100 parts by weight of the (meth)acrylic polymer.

A catalyst may be added to the adhesive composition used in the present invention. The type of the catalyst is not particularly limited, and a catalyst known in the art such as tin catalyst can be used, and a tin catalyst is preferably used. Further, in the present invention, it is preferred that the catalyst having iron as an active center is not contained.

Examples of the tin catalyst include dioctyltin dilaurate, dibutyltin dilaurate, dibutyltin diacetate, dibutyltin dioctoate, dibutyltin dioleate, diphenyltin diacetate, and dibutyl oxidation. Tin, dibutyl dimethicone, bis(triethoxydecyloxy)dibutyltin, dibutyltin benzyl maleate, dioctyltin diacetate, etc., these may be used alone or in combination. the above. Among these, dioctyltin dilaurate is preferred. In addition, the amount of the catalyst to be added is not particularly limited, and is preferably, for example, about 0.001 to 0.5 parts by weight based on 100 parts by weight of the acrylic polymer.

Further, the adhesive composition used in the present invention may contain other known additives, and for example, a powder such as a coloring agent or a pigment, a surfactant, a plasticizer, or an adhesive property may be appropriately formulated depending on the intended use. Agent, low molecular weight polymer, surface lubricant, leveling agent, antioxidant, anticorrosive, light stabilizer, ultraviolet absorber, polymerization inhibitor, decane coupling agent, inorganic or organic filler, metal powder, particulate, foil And so on.

Further, the solid content component of the adhesive composition is not particularly limited, but is preferably 20% by weight or more, and more preferably 30% by weight or more.

The adhesive layer used in the present invention is formed of the above adhesive composition. Further, the carrier film for a transparent conductive film of the present invention (with a functional layer) is formed by forming the adhesive layer on a support (base material or base material layer). At this time, the intersection of the (meth)acrylic polymer The bonding is generally carried out after the application of the adhesive composition, and the adhesive layer containing the crosslinked adhesive composition may be transferred onto a support or the like.

A method of forming an adhesive layer on a support (also referred to as a substrate or a substrate layer) is not particularly required, for example, by applying the above-described adhesive composition to a support (for example, as a solid matter). The component is preferably 20% by weight or more, more preferably 30% by weight or more. The polymerization solvent or the like is dried and removed to form an adhesive layer on the support. Thereafter, the composition may be aged in order to adjust the component transfer of the adhesive layer or adjust the crosslinking reaction or the like. In addition, when the adhesive composition is applied to a support to form a carrier film for a transparent conductive film, one or more solvents other than a polymerization solvent may be newly added to the adhesive composition to uniformly coat the adhesive composition. On the support.

Further, as a method of applying the above-mentioned adhesive composition, a known method for producing a tape or the like is used. Specific examples thereof include roll coating, gravure coating, reverse coating, roll brushing, spray coating, and air knife coating.

The drying condition when the adhesive composition applied to the support is dried can be appropriately determined depending on the composition and concentration of the adhesive composition, the type of the solvent in the composition, and the like, and is not particularly limited, and for example, it can be 80~ Dry at 200 ° C for about 10 seconds to 30 minutes.

Further, when a photopolymerization initiator which is an optional component is blended as described above, it can be applied to one side or both surfaces of a support (base material or base material layer), and then light-irradiated to obtain adhesion. Agent layer. The adhesive layer is usually obtained by photopolymerizing ultraviolet rays having an illuminance of from 300 to 400 nm and having an illuminance of from 1 to 200 mW/cm ² at a light amount of about 400 to 4,000 mJ/cm ² .

The thickness of the adhesive layer of the carrier film for a transparent conductive film of the present invention is preferably 5 to 50 μm, more preferably 10 to 30 μm. When it is in the above range, the balance between the adhesion and the re-peelability is excellent, and it is preferable. The adhesive layer is formed by coating or the like on at least one side of the support (base material layer) used in the present invention, and is formed into a film shape, a sheet shape, a belt shape or the like.

(2) Support

The support (base material) (2 in Fig. 1) constituting the carrier film for a transparent conductive film of the present invention is not particularly limited, and for example, a paper-based support such as paper; cloth, non-woven fabric, or mesh can be used. The fiber-based support (the raw material is not particularly limited, for example, Manila hemp, enamel, polyester, pulp fiber, etc.); metal-based support such as metal foil or metal plate; plastic film or sheet plastic a support for a rubber; a rubber-based support such as a rubber sheet; a foam such as a foamed sheet, or a laminate of the above-mentioned laminates (for example, a laminate of a plastic support and other supports or a laminate of plastic films (or sheets)) ) and other suitable flakes.

Examples of the material of the plastic film or sheet include a polyethylene (PE), a polypropylene (PP), an ethylene-propylene copolymer, and an ethylene-vinyl acetate copolymer (EVA), and the like, and an α-olefin as a monomer component. Olefin-based resin; polyester resin such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polybutylene terephthalate (PBT); polycarbonate resin ; Polyvinyl chloride (PVC); Vinyl acetate resin; Polyphenylene sulfide (PPS); Polyamide (nylon), fluorene-based resin such as wholly aromatic polyamine (aromatic polyamide); Imine resin; with ring or drop A polyolefin-based resin having an olefin structure; polyetheretherketone (PEEK) or the like. These materials may be used alone or in combination of two or more. Among these, in particular, the polyester-based resin has toughness, workability, transparency, and the like. Therefore, it is used as a carrier film for a transparent conductive film, and workability and inspection property are improved, which is a better aspect. .

The polyester-based resin is not particularly limited as long as it can be formed into a sheet form or a film form, and examples thereof include polyethylene terephthalate (PET), polyethylene naphthalate, and polyparaphenylene. A polyester film such as butylene dicarboxylate. These polyester resins may be used singly (homopolymer), or two or more kinds thereof may be mixed and polymerized (copolymer or the like). In particular, in the present invention, since it is used in the form of a carrier film for a transparent conductive film, polyethylene terephthalate can be preferably used as a support. By using polyethylene terephthalate, it is a carrier film for a transparent conductive film which is excellent in toughness, workability, and transparency, and workability is improved, which is a preferable aspect.

The thickness of the above support is generally 25 to 300 μm, preferably 75 to 200 μm, more preferably 80 to 140 μm, and particularly preferably 90 to 130 μm. When it is in the above range, the transparent conductive film carrier film is attached to the (functional layer) transparent conductive film, and the shape of the transparent conductive film which is free from stiffness and which is easily bent can be maintained. In the processing step, the transfer step, and the like, it is useful to prevent problems such as wrinkles or damage.

Further, the support may be subjected to mold release, antifouling treatment or acid treatment using an anthrone-based, fluorine-based, long-chain alkyl-based or fatty acid-amide-based release agent or cerium oxide powder, if necessary. The alkali treatment, the primer treatment, the corona treatment, the plasma treatment, the ultraviolet treatment, and the like are easily followed by treatment, and the antistatic treatment such as a coating type, a kneading type, or a vapor deposition type. Particularly in the case of antistatic treatment, it is preferred to provide an antistatic layer between the support and the adhesive layer.

Further, in order to improve the adhesion between the adhesive layer and the support, the surface of the support may be subjected to corona treatment or the like. Further, the support can be back-treated.

The carrier film for a transparent conductive film of the present invention (with a functional layer) may be bonded to an anthrone-based, fluorine-based, long-chain alkyl group or fatty acid guanamine on the surface of the adhesive to protect the adhesive surface, if necessary. Is a release film treated with a release agent. As the substrate constituting the separator, there is a paper or a plastic film, and a plastic film can be preferably used in terms of excellent surface smoothness. The film is not particularly limited as long as it is a film that can protect the above-mentioned pressure-sensitive adhesive layer, and examples thereof include a polyethylene film, a polypropylene film, a polybutene film, a polybutadiene film, and a polymethylpentene film. A polyvinyl chloride film, a vinyl chloride copolymer film, a polyethylene terephthalate film, a polybutylene terephthalate film, a polyurethane film, an ethylene-vinyl acetate copolymer film, or the like.

Further, the support for the separator may be subjected to an easy treatment such as an alkali treatment, a primer treatment, a corona treatment, a plasma treatment, or an ultraviolet treatment, if necessary, and a coating type, a kneading type, a vapor deposition type, or the like. Antistatic treatment. Particularly in the case of performing an antistatic treatment, it is preferred to provide an antistatic treatment layer between the support and the release agent.

2. (with functional layer) transparent conductive film

The transparent conductive film 6 has a transparent conductive layer 4 and a transparent layer as shown in FIGS. 2 and 3. The film of the substrate 5.

The transparent substrate 5 may be a substrate including a resin film or glass (for example, a sheet-like or film-like substrate or a plate-like substrate (member)), and the like. The thickness of the transparent substrate 5 is not particularly limited, but is preferably about 10 to 200 μm, more preferably about 15 to 150 μm.

The material of the resin film is not particularly limited, and various plastic materials having transparency can be cited. For example, as a material thereof, a polyester resin such as polyethylene terephthalate or polyethylene naphthalate, an acetate resin, a polyether oxime resin, a polycarbonate resin, and a polyfluorene may be mentioned. Amine resin, polyimide resin, polyolefin resin, (meth)acrylic resin, polyvinyl chloride resin, polyvinylidene chloride resin, polystyrene resin, polyvinyl alcohol resin, A polyarylate resin, a polyphenylene sulfide resin, or the like. Among these, a polyester resin, a polyamidene resin, and a polyether oxime resin are particularly preferable.

Further, the transparent substrate 5 may be subjected to an etching treatment or a primer treatment such as sputtering, corona discharge, flame, ultraviolet ray irradiation, electron beam irradiation, chemical treatment, oxidation, or the like on the surface to improve the surface of the transparent substrate 5 thereon. The adhesion between the transparent conductive layer 4 and the like to the transparent substrate 5 described above. Further, before the transparent conductive layer 4 is provided, it may be subjected to dust removal or purification by solvent washing or ultrasonic cleaning, if necessary.

The constituent material of the transparent conductive layer 4 is not particularly limited, and a group selected from the group consisting of indium, tin, zinc, gallium, germanium, titanium, lanthanum, zirconium, magnesium, aluminum, gold, silver, copper, palladium, and tungsten can be used. a metal oxide of at least one metal. The metal oxide may further contain a metal atom as shown in the above group, as needed. For example, indium oxide (ITO) containing tin oxide, tin oxide containing antimony or the like can be preferably used, and ITO can be preferably used. The ITO preferably contains 80 to 99% by weight of indium oxide and 1 to 20% by weight of tin oxide.

The thickness of the transparent conductive layer 4 is not particularly limited, and is more preferably 10 to 300 nm, still more preferably 15 to 100 nm.

The method for forming the transparent conductive layer 4 is not particularly limited, and a conventionally known method can be employed. Specifically, for example, a vacuum deposition method, a sputtering method, and ion plating can be exemplified. law. Further, an appropriate method may be employed depending on the desired film thickness.

Further, a primer layer, an oligomer-preventing layer, or the like may be provided between the transparent conductive layer 4 and the transparent substrate 5 as needed.

Further, the transparent conductive film 6 having the transparent conductive layer 4 can be used as a substrate (optical member) for an optical element. The substrate for an optical element is not particularly limited as long as it is a substrate having optical characteristics, and examples thereof include a display device (a liquid crystal display device, an organic EL (electroluminescence) display device, and a PDP (Plasma Display Panel). A substrate (member) of a device such as a plasma display panel, an electronic paper, an input device (touch panel, etc.), or a substrate (member) used in the device. The base material for these optical elements tends to be thinned in recent years, and the stiffness disappears, and it is easy to bend or deform in shape during the processing step, the transfer step, and the like. By attaching the carrier film for a transparent conductive film of the present invention, it is possible to maintain the shape and suppress the occurrence of defects, which is a preferable aspect.

As shown in FIG. 3, the functional layer 7 can be provided on the surface of the transparent conductive film 6 on the side where the transparent conductive layer 5 is not provided.

Examples of the functional layer include an antiglare treatment (AG) layer, an antireflection (AR) layer, a hard coat (HC), and an anti-blocking (AB) layer for the purpose of improving visibility.

The constituent material of the antiglare treatment layer is not particularly limited, and for example, an epitaxial radiation-curable resin, a thermosetting resin, a thermoplastic resin, or the like can be used. The thickness of the anti-glare treatment layer is preferably from 0.1 to 30 μm. As the antireflection layer, titanium oxide, zirconium oxide, cerium oxide, magnesium fluoride or the like can be used. The antireflection layer can be provided with a plurality of layers.

As a material for forming the hard coat layer (HC) layer, for example, hardening of a hardening type resin such as a melamine resin, an urethane resin, an alkyd resin, an acrylic resin, or an anthrone resin can be preferably used. Laminating. The thickness of the hard coat layer is preferably from 0.1 to 30 μm. It is preferable to set the thickness to 0.1 μm or more in terms of imparting hardness. Further, the antiglare treatment layer or the antireflection layer or the anti-blocking layer may be provided on the hard coat layer. Moreover, it is possible to use an anti-glare function, an anti-reflection function, an anti-blocking function, and an anti-oligomer function. coating.

As the anti-adhesion layer, those having fine particles contained in the curable resin layer; or a coating composition containing two or more kinds of components in which phase separation occurs may be used as the curable resin composition; or These are used to form irregularities on the surface. Examples of the component of the curable resin layer include a thermosetting resin, an ultraviolet curable resin, and an electron beam curable resin. In addition, as the coating composition containing two or more kinds of components which are phase-separated, for example, a composition described in International Publication No. WO 2005/073763 can be preferably used. The thickness of the anti-adhesion layer is preferably from 0.1 to 30 μm.

The thickness of the functional layer-containing transparent conductive film (including the functional layer) is preferably 210 μm or less, and more preferably 150 μm or less. By using the carrier film for a transparent conductive film of the present invention (with a functional layer) on the transparent conductive film (adhered body) in the above range, the shape can be maintained even when the transparent conductive film is very thin. It is preferable to suppress the occurrence of defects such as wrinkles or damage.

3. Laminated body

Furthermore, the present invention relates to a laminated body 9 comprising a transparent conductive film supporting film 3 and a transparent conductive film 6 laminated on the transparent conductive film supporting film 3, and the above The transparent conductive film carrier film 3 is a carrier film for a transparent conductive film described in the present specification, and the transparent conductive film 6 has a transparent conductive layer 4 and a transparent substrate 5, and is in contact with the transparent substrate 5 The surface of the transparent conductive layer 4 on the opposite side is bonded to the adhesive surface of the adhesive layer 1 of the transparent conductive film carrier film 3 (for example, FIG. 2).

Furthermore, the present invention relates to a laminated body comprising a transparent conductive film carrier film 3 and a transparent conductive film 6 laminated on the transparent conductive film carrier film 3, and The transparent conductive film carrier film 3 is a carrier film for a transparent conductive film described in the present specification, and the transparent conductive film 3 has a transparent conductive layer 4 and a transparent substrate 5, and is further in contact with the transparent substrate. The functional layer 7 is provided on the surface opposite to the surface of the transparent conductive layer, and the surface of the functional layer 7 opposite to the surface contacting the transparent substrate 5 is bonded to the transparent conductive film. The adhesive surface of the adhesive layer 1 of the carrier film 3 (for example, FIG. 3).

The carrier film for a transparent conductive film and the (functional layer) transparent conductive film used for the laminated body of the present invention are as described above.

[Examples]

Hereinafter, embodiments and the like which specifically show the constitution and effect of the present invention will be described, but the present invention is not limited thereto. Further, the evaluation items of the examples and the like were measured as follows. The contents of the preparation are shown in Tables 1 and 2, and the evaluation results are shown in Table 2.

Manufacturing example 1

(Adjustment of acrylic polymer)

To a four-necked flask equipped with a stirring blade, a thermometer, a nitrogen introduction tube, and a condenser, 82.99 parts by weight of 2-ethylhexyl acrylate (2EHA), 14 parts by weight of 4-hydroxybutyl acrylate (4HBA), and a hydroxyl group of methacrylic acid were added. 3 parts by weight of ethyl ester (HEMA), 0.01 parts by weight of acrylic acid, 0.2 parts by weight of 2,2'-azobisisobutyronitrile as a polymerization initiator, and 186 parts by weight of ethyl acetate, and nitrogen gas was introduced while slowly stirring. The liquid temperature in the flask was maintained at about 60 ° C, and polymerization was carried out for about 6 hours to prepare a solution of an acrylic polymer (A1) (about 35 wt%). The acrylic polymer (A1) had a weight average molecular weight of 650,000 and a Tg of -63 °C.

Manufacturing example 2~12

In Production Example 1, as shown in Table 1, except for changing the preparation of the acrylic polymer. A solution of the acrylic polymers (A2) to (A8) and (A11) to (A14) was prepared in the same manner as in Production Example 1 except that the type of the monomer and the ratio of use thereof were used.

The abbreviations in Table 1 are as follows.

2EHA: 2-ethylhexyl acrylate

BA: butyl acrylate

4HBA: 4-hydroxybutyl acrylate

HEMA: 2-hydroxyethyl methacrylate

HPA: 2-hydroxypropyl acrylate

AA: Acrylic

<Measurement of Weight Average Molecular Weight (Mw) of Acrylic Polymer>

The weight average molecular weight of the produced polymer was determined by GPC (gel permeation chromatography).

Device: HLC-8220GPC, manufactured by Tosoh Co., Ltd.

Column:

Sample column: TSKguardcolumn Super HZ-H (1) + TSKgel Super HZM-H (2), manufactured by Tosoh

Reference column: TSKgel Super H-RC (1), manufactured by Tosoh Co., Ltd.

Flow rate: 0.6ml/min

Injection volume: 10μL

Column temperature: 40 ° C

Dissolution: THF (TetraHydro Furan, tetrahydrofuran)

Injection sample concentration: 0.2% by weight

Detector: differential refractometer

Further, the weight average molecular weight was calculated by conversion in terms of polystyrene.

<Measurement of glass transition temperature (Tg) of acrylic polymer>

The glass transition temperature (Tg) (° C.) was determined using the following literature values as the glass transition temperature Tg _n (° C.) of the homopolymer of each monomer by the following formula.

Formula: 1/(Tg+273)=Σ[Wn/(Tg _n +273)]

(wherein Tg(°C) represents the glass transition temperature of the copolymer, Wn(-) represents the weight fraction of each monomer, Tg _n (°C) represents the glass transition temperature of the homopolymer of each monomer, and n represents each Type of monomer)

Butyl acrylate (BA): -55 ° C

2-ethylhexyl acrylate (2EHA): -70 ° C

4-hydroxybutyl acrylate (4HBA): -32 ° C

2-Hydroxyethyl methacrylate (HEMA): 55 ° C

2-hydroxypropyl acrylate (HPA): -7 ° C

Acrylic: 106 ° C

In addition, as a literature value, reference is made to "Development, Design, and New Use of Acrylic Resin" (issued by the Publishing Department of the Central Business Development Center) and the manufacturer's catalogue.

Example 1

(Adjustment of adhesive solution)

The acrylic polymer (A1) solution (about 35% by weight) obtained in Production Example 1 was diluted to 29% by weight with ethyl acetate, and 100 parts by weight (solid content) of the acrylic polymer with respect to the solution. 22 parts by weight of a isocyanurate body (trade name: Coronate HX, manufactured by Japan Polyurethane Industry Co., Ltd.) of hexamethylene diisocyanate, 0.015 parts by weight of dioctyltin dilaurate as a tin catalyst, and kept The acrylic pressure-sensitive adhesive composition (1) was prepared by mixing and stirring at about 25 ° C for about 1 minute.

(Production of carrier film for transparent conductive film)

The acrylic pressure-sensitive adhesive composition (1) was applied onto one surface of a polyethylene terephthalate (PET) substrate (thickness: 125 μm, support), and heated at 150 ° C for 90 seconds to form a thickness of 20 μm. Adhesive layer. Next, an anthrone-treated surface of a PET release liner (thickness: 25 μm) which was subjected to an anthrone treatment on one surface was bonded to the surface of the pressure-sensitive adhesive layer, and stored at 50 ° C for one day to prepare a transparent conductive film. membrane. Furthermore, it is used after removing the above-mentioned release liner at the time of use.

Examples 2 to 10 and Comparative Examples 1 to 6

The type of the acrylic polymer or the crosslinking agent constituting the adhesive composition or the blending amount thereof was changed as shown in Table 2, and in the comparative examples 3 and 4, an iron catalyst (ferrous acetonitrile) was used instead of the tin contact. A carrier film for a transparent conductive film was produced in the same manner as in Example 1 except for the above.

The following films for the transparent conductive film supporting films obtained in the examples and the comparative examples were subjected to the following evaluations.

<Adhesion measurement>

As a bonded body, a transparent conductive film having a width of 50 mm and a length of 100 mm fixed on a SUS plate (SUS430BA) (trade name: V150-OFJ, having a transparent conductive layer on one side of the PET film, on another single sheet) a film having an anti-blocking layer (formed of a coating composition containing amorphous cerium oxide, an acrylic monomer, a photoinitiator, an additive containing less than 5% by weight of 0.8 μm of acrylic particles) Anti-adhesion of Nitto Denko (manufacturing) On the layer, the adhesive surface of the adhesive layer of the carrier film for the transparent conductive film was bonded (pressure bonding by a bonding machine: 0.25 MPa, pressure bonding speed: 2.0 m/min). Next, it was heated at 140 ° C for 90 minutes, and then left at room temperature (25 ° C) for 30 minutes or more, and then subjected to a universal tensile tester under the same environment at a peeling speed of 0.3 m/min (low-speed peeling), and 10 m/ In the minute (high-speed peeling) and the peeling angle of 180°, the carrier film for the transparent conductive film was peeled off from the transparent conductive film, and the peeling force (N/50 mm) at this time was measured.

<tear sound>

As a bonded body, a transparent conductive film having a width of 50 mm and a length of 100 mm fixed on a SUS plate (SUS430BA) (trade name: V150-OFJ, having a transparent conductive layer on one side of the PET film, on another single sheet) a film having an anti-blocking layer (formed of a coating composition containing amorphous cerium oxide, an acrylic monomer, a photoinitiator, an additive containing less than 5% by weight of 0.8 μm of acrylic particles) , on the anti-adhesive layer of Nitto Denko (manufactured by Nippon Electric Co., Ltd.), the adhesive surface of the adhesive layer of the carrier film for the transparent conductive film is bonded (pressure bonding using a bonding machine: 0.25 MPa, crimping speed 2.0 m/min) . Next, it was heated at 140 ° C for 90 minutes, and then left at room temperature (25 ° C) for 30 minutes or more, and then subjected to a universal tensile tester under the same conditions, at a peeling speed of 0.3 m/min and a peeling angle of 180°. The transparent conductive film was peeled off from the carrier film for a transparent conductive film by 80 mm, and the peeling force (N/50 mm) at this time was measured. Using the measurement data of the half 60 mm portion after the above peeling force, the presence or absence of the tearing sound was evaluated by the following formula.

○: △F/F(Ave)<15% (no tearing sound)

×: △ F / F (Ave) ≧ 15% (to produce tearing sound)

△F:F(Max)-F(Min)

(In the above formula, F(Max) is the maximum peeling force, and F(Min) is the minimum peeling force)

F(Ave): average peel force

[Table 2]

In Table 2, A1 to A14 are respectively (meth)acrylic polymers produced in Production Examples 1 to 12, and C/HX is an isocyanate crosslinking agent (isocyanurate body of hexamethylene diisocyanate). , trade name: Coronate HX, manufactured by Japan Polyurethane Industry Co., Ltd., C/L indicates isocyanate crosslinking agent (trimethylolpropane/toluene diisocyanate trimer adduct, trade name: Coronate L, Japanese polyurethane) Industrial (stock) manufacturing), tin catalyst means dioctyltin dilaurate, iron catalyst means acetonitrile acetonitrile.

1‧‧‧Adhesive layer

2‧‧‧Support (substrate)

3‧‧‧Transparent film for transparent conductive film

A‧‧‧ adhesive face

Claims (10)

A carrier film for a transparent conductive film, which is characterized in that an adhesive layer is provided on at least one surface of a support, and the adhesive layer of the carrier film is bonded to an adherend After heating at 140 ° C for 90 minutes, the adhesion force P when the carrier film was peeled off from the adherend at a tensile speed of 0.3 m/min and the adhesion force Q when peeled at a tensile speed of 10 m/min were 0.7 N/ 50 mm or less, and the absolute value of the difference between the adhesive force P and the adhesive force Q is 0.2 N/50 mm or less. The carrier film for a transparent conductive film according to claim 1, wherein the adhesive layer is formed of an adhesive composition containing a glass transition temperature which comprises an alkyl (meth)acrylate and a homopolymer. A (meth)acrylic polymer obtained by polymerizing a monomer component containing a hydroxyl group-containing monomer having a glass transition temperature of 50 ° C or higher and a homopolymer of 50 ° C or less. The carrier film for a transparent conductive film according to claim 2, wherein the amount of the hydroxyl group-containing monomer having a glass transition temperature of less than 50 ° C of the above homopolymer is 10 to 17% by weight based on the total amount of the monomer components. Further, the amount of the hydroxyl group-containing monomer having a glass transition temperature of 50 ° C or higher in the above homopolymer is 2 to 8% by weight based on the total amount of the monomer components. The carrier film for a transparent conductive film according to claim 2, wherein the monomer component further contains a carboxyl group-containing monomer, and the compounding amount of the carboxyl group-containing monomer is 0.005 to 0.10 by weight based on the total amount of the monomer component. %. The carrier film for a transparent conductive film according to any one of claims 2 to 4, wherein the above-mentioned adhesive composition further contains a crosslinking agent, the crosslinking agent being formulated in an amount relative to the above (meth)acrylic polymer 100 parts by weight and more than 20 parts by weight. The carrier film for a transparent conductive film according to claim 5, wherein the crosslinking agent is an aliphatic polymer Isocyanate crosslinking agent. The carrier film for a transparent conductive film according to claim 6, wherein the aliphatic polyisocyanate crosslinking agent contains hexamethylene diisocyanate. A laminated body comprising the carrier film for a transparent conductive film according to any one of claims 1 to 7 and a transparent conductive film laminated on the carrier film for the transparent conductive film. The adhesive surface of the adhesive layer of the transparent conductive film is bonded to at least one surface of the transparent conductive film. The laminate according to claim 8, wherein the transparent conductive film has a transparent conductive layer and a transparent substrate, and the transparent surface is bonded to a surface of the transparent substrate opposite to a surface contacting the transparent conductive layer. The adhesive surface of the adhesive layer of the carrier film for the conductive film. The laminate according to claim 8, wherein the transparent conductive film has a transparent conductive layer and a transparent substrate, and further has a functional layer on a surface of the transparent substrate opposite to a surface contacting the transparent conductive layer. The adhesive layer of the adhesive layer of the transparent conductive film is bonded to the surface of the functional layer opposite to the surface contacting the transparent substrate.