200847873 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種電路板與一種裝置；更特別的是， 本發明之電路板與裝置，係利用異方性導電膜進行元件間 之輕接，其中利用特殊結構，而加強上述耗接之妥善度。 【先前技術】 帝在一些電子裝置中，元件與電路板間的連接是透過導 包膜’例如異方性導電膜(anisotropic eonduetive ftlm, ACF)。ACF是以非導電性的合成樹脂與導電顆粒混合而 成’其中導電顆粒的中央部份通常為聚合物，而外面包覆 金屬導體。 ACF常被用於液晶顯示器的製造，例如將面板的驅動 晶片直接封裝於玻璃基板上(chip on giass，c〇G)，或是將 驅動晶片接合至軟性電路板(chip on Film, COF)，或是將晶 片接合於一般印刷電路板(chip onb〇ard，COB)。 然而，應用ACF進行晶片封裝時，常見的問題是導 電顆粒的不當遷移。由於加熱後ACF中的導電顆粒容易 向周圍擴散遷移，而使得兩個或兩個以上電性元件彼此電 性連接’因此容易造成線路的短路。 習知技術在垂直基板的方向上設置特殊的結構，例如 4ADT/07005TW ； AU0612034 5 200847873 線導ΐ顆粒’進而避免短路。·然而在基板 的方向I;是^的，基板的絕緣層雜在平行於基板 ^的$ 緣層之邊緣而流動擴散，進而造成線 【發明内容】 的方2明於提出—種電路板，其中在平行底板 接合元件時，崎賴射社__成膠來 $發明另一方面在於提出一種裝置此裂置之一元件 ，、有特殊結構。當使用導電膠來接合此元件與此 另-7G件時，此特殊結射防止線路間形成短路。、 在一實施例中，揭示一種電路板，此電路板包含底 ❿ 板、複數連接墊與絕_。複數連接㈣設置於底板上： 此絕緣層亦設置於該底板上，且具有-波形結構，該 方向係與該底板平行。此外，此電路板 更稷數V線位於該底板上，該些導線係與該些連 iii性連接，其中該波形結構之複數開口係大體暴露該 在另一實施例中，揭示一種裝置，此裝置包含一第一 元件與一第二元件。第一元件包含複數接觸墊，而第二元 4ADT/07005TW ； AU0612034 6 200847873 件包含底板、複數連接墊與絕緣層。複數連接墊係設置於 底板上。此絕緣層亦設置於該底板上，且具有一波形結 構，其中該波形結構之一開口方向係與該底板平行。此 外，該第一元件更包含複數訊號線，與該些接觸墊對應電 性連接’且該波形結構之複數開口係大體暴露該些訊號 線。更進一步地，該第二元件更包含複數導線位於該底板 上’該些導線係與該些連接塾對應電性連接，其中該波形 結構之複數開口係大體暴露該些導線。 熟此技藝者應可知，本發明可應用，但不限於，在將 面板的駆動日日片直接封裝於玻璃基板上(cjiip 〇n giass， COG)，或是將驅動晶片接合至軟性電路板(chip 〇n Film， COF)，或是將晶片接合於一般印刷電路板(chip 〇n b〇ard， COB) 〇 配合以下之較佳實施例之敘述與圖式說明，本發明之 目的、實施例、特徵、與優點將更為清楚，其中相似的編 號係代表相似元件’而圖式中所顯示之尺寸與比例僅供參 考。 【實施方式】 圖1顯示根據本發明一實施例之裝置10。裝置10包 含一第一元件100與一第二元件200。第一元件100舉例 可為一覆晶整合電路(flip Chip integrated circuit ; FC 1C；)、 一捲V式自動連接整合電路(Tape Automated Bonding integrated circuit; TAB IC)、_軟性電路板、一面板、一印 4ADT/07005TW ； AU0612034 7 200847873 刷電路板、一多層晶片板組基板(muhi_chip m〇dule substrate)或一混成電路基板(hybrid circuit substrate)。而第 二元件200舉例可為一覆晶整合電路、一捲帶式自動連接 整合電路、一軟性電路板、一面板、一印刷電路板、一多 層晶片模組基板、或混成電路基板。較佳地，第一元件1〇〇 係為一顯示面板，顯示面板例如為一液晶顯示面板、一有 機發光^極體顯示面板、一微機電顯示面板或一電漿顯示200847873 IX. Description of the Invention: [Technical Field] The present invention relates to a circuit board and a device; more particularly, the circuit board and device of the present invention utilize an anisotropic conductive film for light connection between components , which utilizes a special structure to enhance the appropriateness of the above-mentioned consumption. [Prior Art] In some electronic devices, the connection between components and boards is transmitted through a package film such as an anisotropic eonduetive ftlm (ACF). The ACF is a non-conductive synthetic resin mixed with conductive particles to form 'where the central portion of the conductive particles is usually a polymer, and the outer portion is coated with a metal conductor. ACF is often used in the manufacture of liquid crystal displays, such as directly mounting a driver wafer of a panel on a glass substrate (chip on giass, c〇G), or bonding a driver wafer to a chip on film (COF). Or the wafer is bonded to a general printed circuit board (COB). However, a common problem when applying ACF for wafer packaging is improper migration of conductive particles. Since the conductive particles in the ACF are easily diffused to the periphery after heating, two or more electrical members are electrically connected to each other', so that a short circuit of the wiring is liable to occur. Conventional techniques provide a special structure in the direction of the vertical substrate, such as 4ADT/07005TW; AU0612034 5 200847873. · However, in the direction I of the substrate; the insulating layer of the substrate is flow-diffused parallel to the edge of the edge layer of the substrate ^, thereby causing the line [the invention] to be proposed as a circuit board, In the case where the parallel bottom plate is engaged with the component, the other side of the invention is to provide a device having a special structure. This special junction prevents a short circuit between the lines when a conductive paste is used to bond the element to the other -7G piece. In one embodiment, a circuit board is disclosed that includes a bottom plate, a plurality of connection pads, and a plurality of pads. The plurality of connections (4) are disposed on the bottom plate: the insulating layer is also disposed on the bottom plate and has a corrugated structure, and the direction is parallel to the bottom plate. In addition, the circuit board has a plurality of V lines on the bottom plate, and the wires are connected to the plurality of wires, wherein the plurality of openings of the wave structure are substantially exposed. In another embodiment, a device is disclosed. The device includes a first component and a second component. The first component comprises a plurality of contact pads, and the second component 4ADT/07005TW; AU0612034 6 200847873 comprises a bottom plate, a plurality of connection pads and an insulating layer. A plurality of connection pads are provided on the bottom plate. The insulating layer is also disposed on the bottom plate and has a corrugated structure, wherein an opening direction of the corrugated structure is parallel to the bottom plate. In addition, the first component further includes a plurality of signal lines electrically connected to the contact pads and the plurality of openings of the waveform structure substantially expose the signal lines. Further, the second component further includes a plurality of wires on the bottom plate. The wires are electrically connected to the plurality of wires, wherein the plurality of openings of the wave structure substantially expose the wires. It should be understood by those skilled in the art that the present invention can be applied, but is not limited to, directly encapsulating the stencil of the panel on a glass substrate (cjiip 〇n giass, COG), or bonding the driver wafer to a flexible circuit board ( Chip 〇n Film, COF), or a description of the preferred embodiment of the present invention, the following is a description of the preferred embodiments of the present invention, and the purpose of the present invention is to enable the bonding of a wafer to a general printed circuit board (CB). Features, advantages and advantages will become more apparent, in which like numerals represent like elements and the dimensions and proportions shown in the drawings are for reference only. [Embodiment] FIG. 1 shows a device 10 according to an embodiment of the present invention. Device 10 includes a first component 100 and a second component 200. The first component 100 can be, for example, a flip chip integrated circuit (FC 1C;), a Tape Automated Bonding Integrated Circuit (TAB IC), a flexible circuit board, a panel, A printed circuit board, a multilayer circuit board substrate or a hybrid circuit substrate. The second component 200 can be, for example, a flip chip integrated circuit, a tape automated connection integrated circuit, a flexible circuit board, a panel, a printed circuit board, a multi-layer wafer module substrate, or a hybrid circuit substrate. Preferably, the first component 1 is a display panel, and the display panel is, for example, a liquid crystal display panel, an organic light emitting body display panel, a microelectromechanical display panel or a plasma display.
面板’第二元件2〇〇係為一軟性電路板，以下並依此較佳 實施例以說明本發明。 •顯不面板1⑻包含接觸墊102，而軟性電路板2〇〇包 含底板201、連接墊2〇2與絕緣層204。圖2進一步顯示 幸人性電路板200之俯視圖。複數連接墊2〇2係設置於底板 201上，材料可以是金、銅、鎳、錫其中之一或上述組合。 此絕緣層204亦設置於底板2⑴上，且具有一波形結構 j〇5 ’其中該，形結構2〇5之一開口方向係與底板2〇1平 行(進-步請參考後續圖2之說明）。絕緣層施係包 亞醯胺(PI)、有機材料、樹脂或上述組合。 裝置10更包含， ‘接合物50位於顯示面板1〇〇與軟性 電路板2〇〇中’使得接觸* 1〇2與連接墊搬對應地電性 連結。接合物50包含_膠體5〇〇以及複數個與膠體_ 混合之導電酿5〇2。紐地，接合物5()糊為異方 電膠(ACFJ。以ACF電性連結接觸墊1〇2與連接墊地的 手段應為熟此技藝者所習知，在此不加贅述。 、 4ADT/07005TW ； AU0612034 8 200847873 、胃如圖2所示，軟性電路板2〇〇更包含複數導線2〇6， 導線206係與連接墊2〇2對應電性連接，其中波形結構2〇5 =口係與®1 1中之底板平行且大縣露導線206。 予接合物50以連結軟性電路板2〇〇與顯示面板1〇〇 %，波形結構205之開口可供收納且集中擴散的導電顆粒 502，一方面可以增加接觸墊1〇2與連接墊之耦接效 果，另一方面亦可以防止導電顆粒502向兩侧擴散，而造 成相鄰的導線206短路。值得一提的是，只要絕緣層2〇4 之波形結構205具有至少—内凹部份錄為開口供收納擴 ，的導電雜502，或是具有—突出部份㈣分隔擴散的 ^電顆粒皿，即可改善因導電麵皿擴散所造成的相 ㈣導線206短路問題，亦即本發明並不欲對波形結構2〇5 進行限制，因此波形結構2〇5可為規則或不規則，連續或 不連續。 一，3所示為在本發明另一實施例中裝置10之部分剖 =示圖。其中第二元件2〇〇具有一絕緣層3〇4，以部份 φ 丨覆盍連接墊202。接合物50位於接觸墊與連接墊 202之間以提供電性連結。絕緣層3〇4在連接墊2⑽上形 =凹陷，藉此亦可針導電雛皿，並減少導電顆粒 向外的擴散’更增加接觸墊1〇2與連接墊202間電性 耦接的效果。 一，4所示為在本發明又一實施例中裝置10之部分剖 ，示思圖。其t第_元件200具有一絕緣層4G4，而絕緣 运404並不覆盍連接墊2〇2。接合物5〇位於接觸墊1〇2與 4ADT/07005TW ; AU0612034 9 200847873 執衝目^間以提供電性連結。絕緣層404相對於連接 、ά、口垂、有較厚的厚度，藉此亦可集中導電顆粒502 ’並 顆粒5〇2向外的擴散，更増加接觸塾102與連接 墊202間電性耦接的效果。 斤述，運用本發明之電路板與含有此電路板的裳 ’可以有效避免ACF在接合時，因為The panel 'second component 2' is a flexible circuit board, and the preferred embodiments are described below in order to illustrate the invention. • The display panel 1 (8) includes a contact pad 102, and the flexible circuit board 2A includes a bottom plate 201, a connection pad 2〇2, and an insulating layer 204. Figure 2 further shows a top view of the fortunate circuit board 200. The plurality of connection pads 2〇2 are disposed on the bottom plate 201, and the material may be one of gold, copper, nickel, tin or a combination thereof. The insulating layer 204 is also disposed on the bottom plate 2(1) and has a wave structure j〇5'. wherein, the opening direction of the shape structure 2〇5 is parallel to the bottom plate 2〇1 (refer to the description of the following FIG. 2 for further steps) ). The insulating layer is coated with linoleamide (PI), an organic material, a resin or a combination thereof. The device 10 further includes that the conjugate 50 is located in the display panel 1A and the flexible circuit board 2' such that the contact *1〇2 is electrically coupled to the connection pad. The conjugate 50 comprises _colloid 5 〇〇 and a plurality of conductive granules 5 〇 2 mixed with the colloid _. New Zealand, the conjugate 5 () paste is a hetero-electro-adhesive (ACFJ. The means for electrically connecting the contact pad 1 〇 2 and the connection pad with ACF should be known to those skilled in the art, and will not be described herein. 4ADT/07005TW; AU0612034 8 200847873, stomach as shown in Figure 2, the flexible circuit board 2〇〇 further includes a plurality of wires 2〇6, the wire 206 is electrically connected to the connection pad 2〇2, wherein the waveform structure 2〇5 = The port is parallel to the bottom plate of the ® 1 1 and the large exposed wire 206. The pre-bond 50 connects the flexible circuit board 2 and the display panel 1%, and the opening of the wave structure 205 can be stored and concentrated. The particles 502 can increase the coupling effect of the contact pads 1〇2 and the connection pads on the one hand, and prevent the conductive particles 502 from diffusing to the sides on the other hand, thereby causing the adjacent wires 206 to be short-circuited. It is worth mentioning that, as long as The corrugated structure 205 of the insulating layer 2〇4 has at least a conductive portion 502 in which the concave portion is recorded as an opening for storage expansion, or a conductive particle dish having a protruding portion (four) separated and diffused, thereby improving the conductive surface The phase (four) wire 206 caused by the diffusion of the dish is short-circuited, that is, the hair It is not intended to limit the waveform structure 2〇5, so the waveform structure 2〇5 may be regular or irregular, continuous or discontinuous. One, 3 shows a partial section of the device 10 in another embodiment of the invention. The second element 2 has an insulating layer 3〇4, and a portion φ 丨 covers the connection pad 202. The bonding material 50 is located between the contact pad and the connection pad 202 to provide electrical connection. 3〇4 is formed on the connection pad 2(10)=depression, whereby the pin can be electrically conductive and reduce the outward diffusion of the conductive particles, which further increases the electrical coupling between the contact pad 1〇2 and the connection pad 202. 4 is a partial cross-sectional view of the device 10 in another embodiment of the present invention. The t-element 200 has an insulating layer 4G4, and the insulating package 404 does not cover the connection pads 2〇2. The material 5 is located at the contact pads 1〇2 and 4ADT/07005TW; AU0612034 9 200847873 is provided to provide electrical connection. The insulating layer 404 has a thick thickness relative to the connection, the crucible, the mouth, and the like. Concentrating the conductive particles 502 'and the particles 5 〇 2 outward diffusion, and further adding the contact 塾 102 and the connection pad 202 The effect of the sexual coupling. It is said that the circuit board of the present invention and the skirt containing the circuit board can effectively prevent the ACF from being engaged because
ίίί 致使得導線、訊號線、甚至能源線 良的現象。因此，可有效增加產品良 率’並建少重工(rework)的機會。 然以上所述僅為本發明之較佳實施例而已，並非用 明之中請專利範圍；凡其它未脫離本發明所揭示 =神下所完成之等效改變或料，均應包 請專利簌1H內。 甲 【圖式簡單說明】 圖1為本發明一實施例中裝置之側視圖； 圖2為本發明一實施例中電路板之俯視圖·， 圖3顯示本發明一實施例中裝置之部分剖面示意圖·， 圖4顯示本發明另—實施例中裝置之部分剖面示意圖。 4ADT/07005TW ; AU0612034 200847873 【主要元件符號說明】 10 裝置 100 第一元件 102 接觸墊 200 第二元件 201 底板 202 連接墊 204、304、404 絕緣層 205 波形結構 50 接合物 500 膠體 502 導電顆粒 4ADT/07005TW ； AU0612034 11Ίίί causes the wire, signal line, and even the energy line to be good. Therefore, it is possible to effectively increase product yields and build opportunities for less rework. However, the above description is only for the preferred embodiment of the present invention, and is not intended to be used in the scope of the patent; any other equivalent changes or materials that have not been deviated from the disclosure of the present invention should be included in the patent 簌 1H Inside. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a side view of a device according to an embodiment of the present invention; FIG. 2 is a plan view of a circuit board according to an embodiment of the present invention, and FIG. 3 is a partial cross-sectional view showing a device according to an embodiment of the present invention; Figure 4 is a partial cross-sectional view showing the apparatus of another embodiment of the present invention. 4ADT/07005TW ; AU0612034 200847873 [Main component symbol description] 10 device 100 first component 102 contact pad 200 second component 201 bottom plate 202 connection pad 204, 304, 404 insulating layer 205 wave structure 50 splicing 500 colloid 502 conductive particles 4ADT / 07005TW ; AU0612034 11