200847590 九、發明說明 【發明所屬之技術領域】 本發明係關於，主要在高壓電源下進行動作之變流器 裝置或伺服放大器等之馬達控制裝置，尤其關於馬達控制 裝置之用以提升依據自動測試化所達成之製程數減少效果 以及測試的可靠度之主電路端子台。 【先前技術】 以往的馬達控制裝置，例如變流器裝置，由於使用會 產生高熱之功率半導體模組，因此，係使功率半導體模組 密接於散熱體以提升冷卻效果。此外，爲了更爲提升冷卻 效果，係使用風扇，藉由強制空冷而提升冷卻效果（例如 參照專利文獻1 )。 此外，係將樹脂支撐件，構成於散熱體與安裝有進行 主電路配線之主電路端子台之基板之間，以不會使熱從散 熱體側傳達至基板側而構成。 於以往的馬達控制裝置，例如變流器裝置中，係採用 如第5圖、第6圖及第7圖所示之構成。於第5圖至第7 圖中，係於散熱體1，配置例如於散熱體1所具備之螺孔 1 c上安裝有進行主電路配線之主電路端子台6之第1基 板5，並以螺絲9將第1基板5予以安裝。於位在第1基 板5的下面之散熱體1上，安裝有具備變流器部igBT( Insulated Gate Bipolar Transistor:絕緣閘雙極型電晶體 )元件等之功率半導體模組3。功率半導體模組3係藉由 -4- 200847590 螺絲4密接於散熱體1的上面而安裝。於散熱體1與第1 基板5之間配置有樹脂支撐件2，於散熱體1與第1基板 5的安裝時，係以螺絲9 一同固定。於散熱體1的底側， 安裝有設置風扇7之風扇外殼8。 此構成之第7圖的主電路端子台6，爲了進行主電路 配線，係由：以樹脂所成型之塑模6 a ;使電流傳達至第1 基板5之導電板6b ;及將主電路配線的纜線連結至導電 扳6 b之螺絲6 c所形成。 第2基板等，於圖式中予以省略。 專利文獻1:日本特開2004-349548號公報 【發明內容】 (發明所欲解決之課題） 然而，以往之馬達控制裝置的構成乃具有下列問題。 於進行馬達控制裝置的出貨測試時，係以樹脂覆蓋主 電路端子台的導電板周圍’因此抵接於探針之導電部分較 少’一旦將探針抵接於螺絲或導電板，則電流容量變得不 足而引起短路。因此，係先鬆開螺絲將纜線安裝於主電路 端子台，之後再鎖緊螺絲並進行出貨測試。此外，於出貨 測試後，鬆開螺絲取出纜線，並以規定的扭矩鎖緊螺絲。 由於此出貨測試的設定需花費時間，因此就其作業時間的 縮短上，乃具有限制。因此，就縮短作業時間且實現馬達 控制裝置的成本降低上，乃具有限制。此外，於電流値較 低的主電路端子台中，爲了達成馬達控制裝置的小型化， -5- 200847590 係溥化導電板的板厚。由於導電板的板厚變得較薄，因而 產生導電板引線強度不足之問題。因此須以樹脂覆蓋導電 板周圍。一旦以樹脂覆蓋導電板的引線，則熱會聚集於內 部使主電路端子台的溫度上升。一旦主電路端子台的溫度 上升，則主電路端子台的可靠度會降低。爲了確保主電路 端子台的可靠度，必須抑制溫度上升，爲了抑制溫度上升 ，必須增加導電板的板厚。一旦增加導電板的板厚，則必 須使主電路端子台增大，因此，就達成馬達控制裝置的小 型化而言，乃具有限制。 本發明係鑒於上述問題點而創作出之發明，目的在於 ，提供一種可縮短出貨測試的作業時間，進行成本的降低 ’提升測試的可靠度，並且可藉由主電路端子台的小型化 而達成裝置小型化之馬達控制裝置。 (用以解決課題之手段） 爲了解決上述課題，本發明係構成如下。 申請專利範圍第1項所記載之發明，爲具備：散熱體 、及以密接於散熱體之樹脂所形成之支撐件、及具備密接 於散熱體之複數個外部電極端子之功率半導體模組、及具 有導電板部且進行主電路配線之主電路端子台、及載置於 上述支撐件且具有上述主電路端子台，並且連接有上述複 數個外部電極端子之基板、及安裝於上述散熱體之風扇， 以及固定上述風扇及上述散熱體之風扇外殻之馬達控制裝 置，其特徵爲：於上述主電路端子台的導電板部，具備有 -6- 200847590 配合出貨測試用之探針形狀而去除肉壁之樹脂部。 申請專利範圍第2項所記載之發明的特徵爲，於上述 主電路端子台的導電板部，形成有用以增加導電板與探針 的接觸面積之抵接面。 申請專利範圍第3項所記載之發明的特徵爲，於上述 主電路端子台之導電板部的引線，形成有用以增加強度之 寬幅部。 申請專利範圍第4項所記載之發明的特徵爲，上述引 線的寬幅部係從去除肉壁後的樹脂部暴露於外部。 發明之效果： 根據本發明，係具有下列效果。 根據申請專利範圍第1項所記載之發明，由於配合出 貨測試用之探針形狀將導電板部的樹脂部去除肉壁，因此 可使探針抵接於導電板而容易進行測試。 由於容易進行測試，因此可藉由機器人簡單地進行自 動測試，而提升作業性。 根據申請專利範圍第2項所記載之發明，由於在導電 板上形成用以增加與探針的接觸面積之抵接面，因此不會 產生因電流量的不足所導致之短路的產生，而提升測試的 可靠度。 根據申請專利範圍第1項及第2項所記載之發明，即 使從正面方向施加力道於導電板，由於在導電板具有探針 的抵接面，因此可於該抵接面受力，而不會使導電板傾斜 200847590 。由於導電板不會傾斜，因此不會產生安裝不良而能夠提 升組裝性。 根據申請專利範圍第3項所記載之發明，爲了增加導 電板的引線強度，因而形成較寬的引線寬度。由於形成較 寬的引線寬度，即使不以樹脂補強該部分，引線亦不會傾 斜，因此導電板不會傾斜。由於導電板不會傾斜，因此不 會產生安裝不良而能夠提升組裝性。 根據申請專利範圍第4項所記載之發明，由於形成較 寬的引線寬度且將該部分的樹脂部去除肉壁，因此可將風 吹送至導電板，而抑制端子台的溫度上升。藉由抑制端子 台的溫度上升，可達成端子台的小型化，由於端子台的小 型化，可達成馬達控制裝置的小型化。 【實施方式】 以下參照圖式，說明本發明之實施型態。 實施例1 第1圖係顯示本發明之馬達控制裝置之立體圖。第2 圖係顯示第1圖之馬達控制裝置之分解立體圖。第3圖係 顯示第1圖的主電路端子台6之圖式，第3圖（a)爲主 電路端子台6的正視圖，第3圖（b )爲主電路端子台6 的右側面圖，第3圖（c )爲主電路端子台6的俯視圖， 第3圖（d)爲主電路端子台6的立體剖面圖，第3圖（e )爲導電板6 b的立體圖。第4圖係顯示於擴大導電板引 -8 - 200847590 線的寬度時之主電路端子台6之圖式，第4圖（a )爲主 電路端子台6的正視圖，第4圖（b )爲主電路端子台6 的右側面圖，第4圖（c )爲主電路端子台6的俯視圖， 第4圖（d)爲主電路端子台6的立體圖，第4圖（e)爲 導電板6b的立體圖。 於第1圖至第4圖中，1爲散熱體，2爲樹脂支撐件 ，3爲包含變流器部IGBT元件等之功率半導體模組，且 成爲具有複數個外部電極端子之構造。6爲進行主電路配 線之主電路端子台，5爲連接有功率半導體模組3的外部 電極端子及主電路端子台6之第1基板。7爲風扇，8爲 將風扇7固定於散熱體1之風扇外殼。 上述風扇外殻亦可不直接固定於散熱體1，而是夾介 構件而固定。此外，第2基板等，於圖式中予以省略。 上述散熱體1例如形成爲直方體，上面形成爲平面狀 ，且形成有複數個安裝支撐件2之支撐件安裝突座lb。 此外，係形成有複數個用以將上述功率半導體模組3安裝 於散熱體1之螺孔1 a。 上述支撐件2係配置於上述散熱體1上，且形成有複 數個散熱體安裝孔2c。此外，係形成有複數個基板定位 突座2a及基板固定鈎2b，此基板定位突座2a及基板固 定鈎2b係用以安裝連接有上述功率半導體模組3的外部 電極端子及主電路端子台6之第1基板5。 上述功率半導體模組3係配置於上述散熱體1的螺孔 1 a上，並使用螺絲4暫時固定。 -9- 200847590 上述主電路端子台6係配置於上述第1基板5上並予 以焊接固定。 上述第1基板5係配置於上述支撐件2上，並以基板 定位突座2a及基板固定鈎2b予以固定。上述功率半導體 模組3亦予以扣緊固定。於此狀態下，將上述功率半導體 模組3的端子焊接固定於第1基板5。 上述風扇7係配置於上述散熱體1，並以風扇外殻8 固定於上述散熱體1。 本發明之馬達控制裝置，係於主電路端子台6的塑模 (樹脂部）6 a形成塑模去除肉壁部6 a 1，於導電板6 b形 成導電板探針抵接面6b 1，因此可容易使探針抵接於導電 板6b而容易進行測試。由於容易進行測試，因此可藉由 機器人簡單地進行自動測試，而提升作業性。由於可提升 作業性，因此可縮短出貨測試的作業時間，而達成馬達控 制裝置的成本降低。再者，藉由設置導電板探針抵接面 6b 1，可增加導電板6b與探針的接觸面積，因此不會產生 因電流量的不足所導致之短路的產生，而提升測試的可靠 度。 此外，即使從正面方向施加力道於導電板6b，由於 在導電板6b具有導電板探針抵接面6b 1的抵接面，因此 可於該抵接面受力，而不會使導電板6b傾斜。由於導電 板6b不會傾斜，因此不會產生安裝不良而能夠提升組裝 性。 此外，由於增加導電板6b之導電板引線6b2的引線 -10- 200847590 寬度以補強引線強度，即使不以塑模6a補強該部分，引 線亦不會傾斜，因此導電板6b不會傾斜。由於導電板6b 不會傾斜，因此不會產生安裝不良而能夠提升組裝性。再 者，由於將上述寬幅部6b2a部分的塑模去除肉壁，因此 可使風吹送至導電板6b，而抑制端子台6的溫度上升。 藉由抑制端子台6的溫度上升，可達成端子台的小型 化，由於端子台的小型化，可達成馬達控制裝置的小型化 產業上之可利用性： 本發明係適用於主要在高壓電源下進行動作之變流器 裝置或伺服放大器等之馬達控制裝置，並且可利用於製造 或提供馬達控制裝置之領域，此馬達控制裝置可縮短出貨 測試的作業時間，進行成本的降低，提升測試的可靠度， 並且可藉由主電路端子台的小型化而達成裝置小型化。 【圖式簡單說明】 第1圖係顯示本發明的實施例之馬達控制裝置之立體 圖。 第2圖係顯示第1圖之馬達控制裝置之分解立體圖。 第3圖係顯示第2圖的主電路端子台之圖式，（a ) 爲正視圖，（b )爲右側面圖，（c )爲俯視圖，（d )爲 立體剖面圖，（e )爲導電板的立體圖。 第4圖係顯示於擴大導電板引線的寬度時之主電路端 -11 - 200847590 子台之圖式’ （a)爲主電路W子台的正視圖，（b)爲主 電路端子台的右側面圖’ （c )爲主電路端子台的俯視圖 ’ （d)爲主電路端子台的立體圖，（e)爲導電板的立體 圖。 第5圖係顯示以往技術之馬達控制裝置之立體圖。 第6圖係顯不第5圖之馬達控制裝置之分解立體圖。 第7圖係顯示第6圖的主電路端子台之圖式，以往之 主電路端子台的（a )爲正視圖，（b )爲右側面圖，（c )爲俯視圖，（d )爲立體剖面圖，（e )爲導電板的立體 圖。 【主要元件符號說明】 1 =散熱體 1 a :螺孔 lb:支撐件安裝突座 1 c :螺孔 2 :樹脂支撐件 2 a :基板定位突座 2b :基板固定鈎 2c :散熱體安裝孔 3 ··功率半導體模組 4 :功率半導體模組固定用螺絲 5 :第1基板 5 a :基板定位突座通孔 -12- 200847590 5 b :螺絲通孔 6 :主電路端子台 6a :塑模 6al :塑模去除肉壁部 6b :導電板 6bl :導電板探針抵接面 6b2 :導電板引線 6b2a :寬幅部 6 c :螺絲 7 :風扇 8 :風扇外殼 9 :第1基板固定用螺絲 -13200847590 IX. INSTRUCTIONS OF THE INVENTION [Technical Field] The present invention relates to a motor control device such as a converter device or a servo amplifier that operates mainly under a high-voltage power supply, and particularly relates to a motor control device for improving automatic test based on The main circuit terminal block that reduces the effect of the number of processes and the reliability of the test. [Prior Art] Conventional motor control devices, such as converter devices, use a power semiconductor module that generates high heat. Therefore, the power semiconductor module is closely attached to the heat sink to improve the cooling effect. Further, in order to further improve the cooling effect, a fan is used to enhance the cooling effect by forced air cooling (for example, refer to Patent Document 1). Further, the resin supporting member is formed between the heat radiating body and the substrate on which the main circuit terminal block on which the main circuit wiring is mounted, so that heat is not transmitted from the heat radiating body side to the substrate side. In the conventional motor control device, for example, the converter device, the configurations shown in Figs. 5, 6 and 7 are employed. In the fifth embodiment, in the heat dissipating body 1, for example, the first substrate 5 on which the main circuit terminal block 6 for main circuit wiring is mounted is mounted on the screw hole 1c of the heat sink 1, and The screw 9 mounts the first substrate 5. A power semiconductor module 3 including a current transformer portion igBT (Insulated Gate Bipolar Transistor) device or the like is mounted on the heat sink 1 located below the first substrate 5. The power semiconductor module 3 is mounted by attaching the -4-200847590 screw 4 to the upper surface of the heat sink 1. The resin support 2 is disposed between the heat sink 1 and the first substrate 5, and is fixed by the screws 9 when the heat sink 1 and the first substrate 5 are mounted. A fan casing 8 on which the fan 7 is disposed is attached to the bottom side of the radiator 1. In order to perform main circuit wiring, the main circuit terminal block 6 of the seventh configuration of the present configuration is a mold 6a molded of a resin; a current is transmitted to the conductive plate 6b of the first substrate 5; and the main circuit wiring is performed. The cable is formed by a screw 6c connected to the conductive plate 6b. The second substrate or the like is omitted in the drawings. [Problem to be Solved by the Invention] However, the configuration of the conventional motor control device has the following problems. When performing the shipment test of the motor control device, the resin is covered around the conductive plate of the main circuit terminal block. Therefore, the conductive portion abutting the probe is less. Once the probe is abutted on the screw or the conductive plate, the current is applied. The capacity becomes insufficient to cause a short circuit. Therefore, first loosen the screws to install the cable to the main circuit terminal block, then tighten the screws and carry out the shipping test. In addition, after the shipment test, loosen the screw to remove the cable and tighten the screw with the specified torque. Since the setting of this shipment test takes time, there is a limit to the shortening of the operation time. Therefore, there is a limit in shortening the working time and realizing the cost reduction of the motor control device. Further, in the main circuit terminal block having a low current ,, in order to achieve miniaturization of the motor control device, -5-200847590 is a plate thickness of the conductive plate. Since the plate thickness of the conductive plate becomes thin, there arises a problem that the strength of the conductive plate leads is insufficient. Therefore, the periphery of the conductive plate must be covered with a resin. Once the leads of the conductive plates are covered with the resin, heat is concentrated inside to raise the temperature of the main circuit terminal block. Once the temperature of the main circuit terminal block rises, the reliability of the main circuit terminal block is lowered. In order to ensure the reliability of the main circuit terminal block, it is necessary to suppress the temperature rise, and in order to suppress the temperature rise, it is necessary to increase the thickness of the conductive plate. When the thickness of the conductive plate is increased, the main circuit terminal block must be increased. Therefore, there is a limit in achieving a miniaturization of the motor control device. The present invention has been made in view of the above problems, and an object of the invention is to provide a method for shortening the operation time of a shipment test, reducing the cost, improving the reliability of the test, and miniaturizing the main circuit terminal block. A motor control device that achieves miniaturization of the device. (Means for Solving the Problem) In order to solve the above problems, the present invention is structured as follows. The invention described in claim 1 is characterized in that: a heat sink, a support formed of a resin adhered to the heat sink, and a power semiconductor module including a plurality of external electrode terminals that are in close contact with the heat sink, and a main circuit terminal block having a conductive plate portion and performing main circuit wiring, and a substrate having the main circuit terminal block mounted on the support and having the plurality of external electrode terminals; and a fan mounted on the heat sink And a motor control device for fixing the fan and the fan casing of the heat dissipating body, wherein the conductive plate portion of the main circuit terminal block is provided with a probe shape of -6-200847590 for shipment test The resin part of the meat wall. The invention according to claim 2 is characterized in that an abutting surface for increasing the contact area between the conductive plate and the probe is formed in the conductive plate portion of the main circuit terminal block. According to the invention of claim 3, the lead wire of the conductive plate portion of the main circuit terminal block is formed to have a wide portion for increasing the strength. The invention according to claim 4 is characterized in that the wide portion of the lead wire is exposed to the outside from the resin portion after the removal of the meat wall. Effects of the Invention: According to the present invention, the following effects are obtained. According to the invention of the first aspect of the invention, since the resin portion of the conductive plate portion is removed from the meat wall in accordance with the shape of the probe for the test of the product, the probe can be easily abutted by abutting against the conductive plate. Since it is easy to test, it is easy to perform automatic testing by the robot to improve workability. According to the invention described in claim 2, since the abutting surface for increasing the contact area with the probe is formed on the conductive plate, the occurrence of a short circuit due to the shortage of the current is not generated. The reliability of the test. According to the invention described in the first and second aspects of the patent application, even if a force is applied to the conductive plate from the front direction, since the conductive plate has the abutting surface of the probe, the contact surface can be stressed without Will tilt the conductive plate 200847590. Since the conductive plates are not inclined, assembly defects can be improved without causing mounting failure. According to the invention described in claim 3, in order to increase the lead strength of the conductive plate, a wider lead width is formed. Since the wide lead width is formed, the lead is not inclined even if the portion is not reinforced with the resin, so the conductive plate is not inclined. Since the conductive plates are not inclined, assembly defects are not caused and assembly can be improved. According to the invention of claim 4, since the resin portion of the portion is removed from the meat wall by forming a wide lead width, the wind can be blown to the conductive plate, and the temperature rise of the terminal block can be suppressed. By suppressing the temperature rise of the terminal block, the size of the terminal block can be reduced, and the size of the terminal block can be reduced, and the size of the motor control device can be reduced. [Embodiment] Hereinafter, embodiments of the present invention will be described with reference to the drawings. Embodiment 1 Fig. 1 is a perspective view showing a motor control device of the present invention. Fig. 2 is an exploded perspective view showing the motor control device of Fig. 1. Fig. 3 is a view showing the main circuit terminal block 6 of Fig. 1, Fig. 3(a) is a front view of the main circuit terminal block 6, and Fig. 3(b) is a right side view of the main circuit terminal block 6. Fig. 3(c) is a plan view of the main circuit terminal block 6, Fig. 3(d) is a perspective cross-sectional view of the main circuit terminal block 6, and Fig. 3(e) is a perspective view of the conductive plate 6b. Fig. 4 is a view showing the main circuit terminal block 6 when the width of the conductive plate -8 - 200847590 line is enlarged, and Fig. 4 (a) is a front view of the main circuit terminal block 6, Fig. 4 (b) The right side view of the main circuit terminal block 6, Fig. 4(c) is a plan view of the main circuit terminal block 6, Fig. 4(d) is a perspective view of the main circuit terminal block 6, and Fig. 4(e) is a conductive plate. 3d perspective view. In the first to fourth figures, 1 is a heat sink, 2 is a resin support, and 3 is a power semiconductor module including a converter portion IGBT element and the like, and has a structure having a plurality of external electrode terminals. 6 is a main circuit terminal block for wiring the main circuit, and 5 is a first substrate to which the external electrode terminal of the power semiconductor module 3 and the main circuit terminal block 6 are connected. 7 is a fan, and 8 is a fan case for fixing the fan 7 to the heat sink 1. The fan case may not be directly fixed to the heat sink 1, but may be fixed by a sandwich member. In addition, the second substrate or the like is omitted in the drawings. The heat radiating body 1 is formed, for example, as a rectangular parallelepiped, and is formed in a planar shape on the upper surface thereof, and a plurality of support mounting brackets 1b for mounting the support members 2 are formed. Further, a plurality of screw holes 1a for mounting the power semiconductor module 3 to the heat sink 1 are formed. The support member 2 is disposed on the heat sink 1 and has a plurality of heat sink mounting holes 2c formed therein. In addition, a plurality of substrate positioning protrusions 2a and substrate fixing hooks 2b are formed. The substrate positioning protrusions 2a and the substrate fixing hooks 2b are used for mounting external electrode terminals and main circuit terminal blocks to which the power semiconductor module 3 is connected. The first substrate 5 of 6. The power semiconductor module 3 is disposed on the screw hole 1a of the heat sink 1, and is temporarily fixed by a screw 4. -9- 200847590 The main circuit terminal block 6 is disposed on the first substrate 5 and fixed by soldering. The first substrate 5 is disposed on the support 2, and is fixed by the substrate positioning protrusion 2a and the substrate fixing hook 2b. The power semiconductor module 3 is also fastened and fixed. In this state, the terminals of the power semiconductor module 3 are soldered and fixed to the first substrate 5. The fan 7 is disposed on the heat sink 1 and is fixed to the heat sink 1 by a fan case 8. The motor control device of the present invention is formed in a mold (resin portion) 6a of the main circuit terminal block 6 to form a mold removing meat wall portion 6a1, and a conductive plate probe abutting surface 6b1 is formed on the conductive plate 6b. Therefore, the probe can be easily brought into contact with the conductive plate 6b to be easily tested. Since it is easy to test, it is easy to perform automatic testing by the robot to improve workability. Since the workability can be improved, the operation time of the shipment test can be shortened, and the cost of the motor control device can be reduced. Furthermore, by providing the conductive plate probe abutting surface 6b 1, the contact area between the conductive plate 6b and the probe can be increased, so that the short circuit caused by the insufficient current amount is not generated, and the reliability of the test is improved. . Further, even if a force is applied to the conductive plate 6b from the front direction, since the conductive plate 6b has the abutting surface of the conductive plate probe abutting surface 6b1, the abutting surface can be stressed without the conductive plate 6b. tilt. Since the conductive plate 6b is not inclined, the mounting property can be improved without causing mounting failure. Further, since the width of the lead -10- 200847590 of the conductive plate lead 6b2 of the conductive plate 6b is increased to reinforce the lead strength, the lead wire is not inclined even if the portion is not reinforced by the mold 6a, so that the conductive plate 6b is not inclined. Since the conductive plate 6b is not inclined, the mounting property can be improved without causing mounting failure. Further, since the mold of the wide portion 6b2a is removed from the meat wall, the wind can be blown to the conductive plate 6b, and the temperature rise of the terminal block 6 can be suppressed. By suppressing the temperature rise of the terminal block 6, the size of the terminal block can be reduced, and the miniaturization of the terminal block can achieve the miniaturization of the motor control device. The present invention is applicable to mainly under a high voltage power supply. A motor control device such as a converter device or a servo amplifier that operates, and can be utilized in the field of manufacturing or providing a motor control device, which can shorten the operation time of the shipment test, reduce the cost, and improve the test. Reliability, and the size of the device can be reduced by miniaturization of the main circuit terminal block. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing a motor control device according to an embodiment of the present invention. Fig. 2 is an exploded perspective view showing the motor control device of Fig. 1. Fig. 3 is a view showing the main circuit terminal block of Fig. 2, (a) is a front view, (b) is a right side view, (c) is a plan view, (d) is a perspective view, and (e) is a A perspective view of a conductive plate. Figure 4 shows the schematic diagram of the main circuit end -11 - 200847590 sub-station when expanding the width of the conductive plate lead ' (a) the front view of the main circuit W sub-station, (b) the right side of the main circuit terminal block The surface view '(c) is a top view of the main circuit terminal block' (d) is a perspective view of the main circuit terminal block, and (e) is a perspective view of the conductive plate. Fig. 5 is a perspective view showing a conventional motor control device. Fig. 6 is an exploded perspective view showing the motor control device of Fig. 5. Fig. 7 is a view showing the main circuit terminal block of Fig. 6. In the conventional main circuit terminal block, (a) is a front view, (b) is a right side view, (c) is a plan view, and (d) is a three-dimensional view. In the cross-sectional view, (e) is a perspective view of the conductive plate. [Description of main components] 1 = Heat sink 1 a : Screw hole lb: Support mounting bracket 1 c : Screw hole 2 : Resin support 2 a : Substrate positioning stand 2b : Substrate fixing hook 2c : Heat sink mounting hole 3 · Power semiconductor module 4: Power semiconductor module fixing screw 5: First substrate 5 a : Substrate positioning protrusion through hole -12- 200847590 5 b: Screw through hole 6: Main circuit terminal block 6a: Molding 6al: mold removal meat wall portion 6b: conductive plate 6b1: conductive plate probe abutting surface 6b2: conductive plate lead 6b2a: wide portion 6c: screw 7: fan 8: fan case 9: first substrate fixing screw -13