200847318 九、發明說明： 【發明所屬之技術領域】 本發明係一種具有如申請專利範圍第1項之特徵的在 基板上安裝半導體晶片的方法。 【先前技術】 半導體晶片的安裝是以自動安裝機進行，此種安裝晶 片用的自動安裝機在業界被稱爲黏晶機（Die Bonder)。將半 導體晶片放在一片被框架撐開的薄膜上，此種薄膜在業界 被稱爲線帶（Tape)。半導體晶片黏在這片薄膜上。將框架及 薄膜夾緊在一個可以在兩個彼此垂直的方向上移動的晶圓 料盤上。按照一定的節奏移動晶圓料盤，使半導體晶片一 個接一個被準備好放置在第一個位置 A。接著自動安裝機 的壓焊頭會將準備好的半導體晶片抓起，然後將半導體晶 片放置在一片基板上的第二個位置 B。例如專利 CH 694745、EP 9 2 3 m、EP 1 049 1 40、EP 1 5 8 7 1 3 8 > W0 9732460 等均揭示此種自動安裝設備及方法。在前述所有專利提出 的設備中，框架都是以使半導體晶片的邊緣與晶圓料盤的 兩個驅動軸平行的方式被夾緊在晶圓料盤上。 專利JP 5 7 1 5 2 1 3 3揭示一種半導體晶片的安裝方法，使 用這種方法時必須將半導體晶片安裝在基板上的一個特殊 位置，也就是半導體晶片的邊緣相對於基板的邊緣轉動一 個特定角度α的位置。這是因爲晶片壓焊頭的晶片抓取器 不能繞本身的縱軸轉動，因此在開始安裝時要先將晶圓料 盤轉動一個角度6Κ。 200847318 【發明内容】 本發明之目的是要提高這種自動安裝機的生產量 爲達到上述目的’本發明採取的方法是縮短晶圓 準備下一個半導體晶片所需的時間，也就是在開始安 前’先調整晶圓的方向，使半導體晶片的邊緣與兩個 軸傾斜一個特定的角度p，這樣在接下來的安裝階段 料盤就必須沿著兩個驅動軸移動，以便將下一個半導 片準備好。角度/0的最佳値取決於外界情況。兩個驅 通常是沿著兩個彼此垂直的方向移動。如果兩個驅動 夠以大致相同的速度移動晶圓料盤，則角度P的最佳 P = 4 5 °。如果兩個驅動軸是以不同的平均速度移動晶 盤，則角度P的最佳値是使兩個驅動軸都需要相同的 △ t，以移動晶圓料盤及準備下一個半導體晶片。將在 階段準備好的半導體晶片從晶圓料盤上抓起，接著通 動角度 r ，然後放置在基板上。角度Τ=-/〇+ψ-Δω 度△ ω是一個用來消除可能的位置誤差的修正角度。 是根據一個圖像處理系統在半導體晶片從晶圓料盤上 起之前測得之在晶圓料盤上準備好的半導體晶片的 (實際位置），以及以同一個或另外一個圖像處理系統 之半導體晶片在基板上應被放置的位置（額定位置）， 出修正角度△ ω。修正角度△ ω相當於要將半導體 從實際位置轉動到在基板上的額定位置所需轉動的角 I △ ω | << | ρ |。角度ψ是一個由使用者設定的角度 度Ψ通常是0°，但是在某些應用情況下可能是+90°、 料盤 裝之 驅動 晶圓 體晶 動軸 軸能 値爲 圓料 時間 生產 常轉 〇角 通常 被抓 位置 測得 計算 晶片 度。 ，角 -90 200847318 或180°。因此角度r 一定是一個明顯不等於〇的角度。如 果角度Ψ等於0°、+90°、-90°或180°，則被安裝的半導體晶 片的邊緣就會近似平行於基板的邊緣。 根據本發明的在基板上安裝半導體晶片的方法’半導 體晶片在晶圓料盤上被準備好，其中晶圓料盤可以沿著兩 個驅動軸移動，這兩個驅動軸之間夾一個特定的角度’本 發明的方法的特徵是，在準備階段調整晶圓的方向’使一 條連接兩個相鄰半導體晶片之中心的直線與第一驅動軸夾 一個特定的角度Ρ ，角度Ρ介於30°至60°之間，接著在 安裝階段使晶圓料盤沿著兩個驅動軸同時移動’以準備下 一個半導體晶片。 以壓焊頭的晶片抓取器將準備好的半導體晶片抓起， 接著通常轉動角度Τ，然後放置在基板上。角度τ=-ρ+ψ- △ ω，其中角度Ψ是一個由使用者設定的角度，角度Δω 是一個用來消除可能的位置誤差的修正角度。 修正角度 △ ω 是自動安裝機在安裝階段測定的一個 角度，也就是半導體晶片從實際角度（被晶片抓取器抓住時 的位置）到額定位置（被放置在基板上的位置）應轉動的角 度。 角度Ρ最好是介於Ρ〇-5°至0。+ 5°之間，其中ρ0 需滿足方程式△ χ/νι = △ y/V2’其中△ X代表晶圓料盤沿著 第一驅動軸被移動的距離’ △y代表晶圓料盤沿著第二驅 動軸被移動的距離，同時Vl = △x/△t及 V2=^y/At，其中 △ t代表晶圓料盤移動△ χ及△ y之距離所需的移動時間。 200847318 以下配合圖式及一個實施例對本發明的內容做進一步 的說明。以上的圖式僅是示意圖，並非按照正確的比例尺 繪製。200847318 IX. Description of the Invention: [Technical Field] The present invention is a method of mounting a semiconductor wafer on a substrate having the features of the first item of the patent application. [Prior Art] The mounting of a semiconductor wafer is performed by an automatic mounting machine, and such an automatic mounting machine for mounting a wafer is called a Die Bonder in the industry. The semiconductor wafer is placed on a piece of film that is stretched by the frame, which is known in the industry as a tape. A semiconductor wafer is adhered to the film. The frame and film are clamped to a wafer tray that can be moved in two perpendicular directions. The wafer tray is moved at a certain rhythm so that the semiconductor wafers are ready to be placed in the first position A one by one. The autoclave's bond head then picks up the prepared semiconductor wafer and places the semiconductor wafer in a second position B on a substrate. Such an automatic mounting apparatus and method are disclosed, for example, in the patents CH 694745, EP 9 2 3 m, EP 1 049 1 40, EP 1 5 8 7 1 3 8 > W0 9732460. In the apparatus proposed in all of the aforementioned patents, the frame is clamped to the wafer tray in such a manner that the edges of the semiconductor wafer are parallel to the two drive axes of the wafer tray. Patent JP 5 7 1 5 2 1 3 3 discloses a method of mounting a semiconductor wafer in which the semiconductor wafer must be mounted at a particular location on the substrate, that is, the edge of the semiconductor wafer is rotated relative to the edge of the substrate by a particular The position of the angle α. This is because the wafer gripper of the wafer bond head cannot rotate about its own longitudinal axis, so the wafer tray is first rotated by an angle of 6 在 at the beginning of installation. 200847318 SUMMARY OF THE INVENTION The object of the present invention is to increase the throughput of such an automatic mounting machine to achieve the above object. The method adopted by the present invention is to shorten the time required for the wafer to prepare the next semiconductor wafer, that is, at the beginning of the installation. 'Adjust the orientation of the wafer so that the edge of the semiconductor wafer is tilted to the two axes by a specific angle p, so that the tray must move along the two drive axes during the next installation phase in order to move the next semi-guided piece get ready. The best choice of angle / 0 depends on the external situation. The two drives are usually moved in two directions perpendicular to each other. If the two drives are able to move the wafer tray at approximately the same speed, the angle P is optimally P = 4 5 °. If the two drive shafts move the disc at different average speeds, the optimum angle of angle P is such that both drive shafts require the same Δt to move the wafer tray and prepare the next semiconductor wafer. The semiconductor wafer prepared at the stage is picked up from the wafer tray, then rotated at an angle r and then placed on the substrate. Angle Τ = - / 〇 + ψ - Δω Degree △ ω is a correction angle used to eliminate possible position errors. Is based on an image processing system (actual position) of a semiconductor wafer prepared on a wafer tray before the semiconductor wafer is lifted from the wafer tray, and in the same or another image processing system The correction angle Δω is obtained at a position (rated position) at which the semiconductor wafer should be placed on the substrate. The correction angle Δ ω corresponds to the angle I Δ ω | < | ρ | of the rotation required to rotate the semiconductor from the actual position to the nominal position on the substrate. The angle ψ is a user-set angle Ψ usually 0°, but in some applications it may be +90°, and the tray-loaded drive wafer body axis can be used as a round material. The turning angle is usually measured by the grip position to calculate the wafer degree. , angle -90 200847318 or 180°. Therefore the angle r must be an angle that is not significantly equal to 〇. If the angle Ψ is equal to 0°, +90°, -90° or 180°, the edge of the mounted semiconductor wafer will be approximately parallel to the edge of the substrate. A method of mounting a semiconductor wafer on a substrate according to the present invention 'a semiconductor wafer is prepared on a wafer tray, wherein the wafer tray can be moved along two drive axes, and a specific one is sandwiched between the two drive shafts Angle 'The method of the present invention is characterized in that the direction of the wafer is adjusted in the preparation stage' so that a line connecting the centers of two adjacent semiconductor wafers is clamped to the first drive shaft by a specific angle Ρ, the angle Ρ is between 30° Between 60[deg.] and then the wafer tray is simultaneously moved along the two drive axes during the installation phase to prepare the next semiconductor wafer. The prepared semiconductor wafer is picked up by a wafer grabber of the bonding head, and then normally rotated at an angle Τ, and then placed on the substrate. The angle τ = - ρ + ψ - Δ ω, where the angle Ψ is an angle set by the user, and the angle Δω is a correction angle for eliminating possible position errors. The correction angle Δ ω is an angle measured by the automatic mounting machine during the installation phase, that is, the semiconductor wafer should be rotated from the actual angle (the position grasped by the wafer grabber) to the rated position (the position placed on the substrate). angle. The angle Ρ is preferably between Ρ〇-5° and 0. Between + 5°, where ρ0 needs to satisfy the equation Δ χ / νι = Δ y / V2 ' where △ X represents the distance the wafer tray is moved along the first drive axis △ y represents the wafer tray along the first The distance at which the two drive shafts are moved, while Vl = Δx/Δt and V2=^y/At, where Δt represents the travel time required for the wafer tray to move the distances Δ χ and Δ y. 200847318 The content of the present invention will be further described below in conjunction with the drawings and an embodiment. The above figures are only schematic diagrams and are not drawn to the correct scale.
【實施方式】 I 第1圖以示意方式顯示晶圓料盤（1)的俯視圖，晶圓料 盤（1)的任務是將要被安裝在基板上的半導體晶片（2)準備 好。第2圖顯示第一圖的部分放大圖。第一驅動器（3)可以 將晶圓料盤（1)沿著第一線性驅動軸（4)移動。第二驅動器（5) 可以將晶圓料盤（1)沿著第二線性驅動軸（6)移動，其中第二 線性驅動軸（6)及第一線性驅動軸（4)之間夾一個特定的角 度0。第三驅動器（未在圖式中繪出）可以將晶圓料盤（1)繞 著一個垂直於由兩個驅動器（4，6)拉伸成的平面的轉軸（7) 轉動。在本實施例中轉軸（7 )垂直於圖面。 先在一片晶圓上一起製造出許多半導體晶片（2)，然後 再鋸開成一個一個的半導體晶片（2)。這些半導體晶片（2) 都被黏著在一片被框架撐開的薄膜（8)上。這個框架被夾緊 在晶圓料盤（1)上。L,及L2代表長方形的半導體晶片（2)彼 此之間的中心距離。半導體晶片（2)被排列成行及列’其中 行與行的距離等於較短的距離L2，同時列與列的距離等於 較長的距離h。進行安裝時，晶圓料盤（1)會按照一定的節 奏被移動，使半導體晶片（2)—個接一個被準備好放置在一 個特定的位置。放置的過程是一行接一行或一列接一列依 序將半導體晶片（2)放置在特定的位置。由於距離L2短於距 離L :，因此本實施例最好是沿著第1圖中虛線顯示的路徑 200847318 (10)—行接一行的將半導體晶片（2)放置在特定的位置。調 整晶圓料盤（1)的方向，使一條連接同一行上兩個相鄰半導 體晶片（2)之中心的直線（1 1)與第一驅動軸（4)夾一個特定的 角度 p 。但由於此時半導體晶片（2)的方向傾斜於驅動軸 (4，6)，因此晶圓料盤（1)在每一次進給時都必須在兩個方 向上被移動，也就是說第一驅動器（3)必須將晶圓料盤（1) 移動距離△ X，第二驅動器（5)必須將晶圓料盤（1)移動距離 △ y，而且這兩個移動必須是同時進行。自動安裝機之焊接 頭的晶片抓取器會將準備好的半導體晶片（2)從晶圓料盤（1) 抓取出來，然後放置在基板上。由於晶片抓取器可以繞自 身的縱軸轉動，因此可以先將所抓取的半導體晶片（2)轉動 到正確的位置，然後再放置到基板上。從第2圖可以看出， 距離△ X及△ y短於距離L!及L2。 根據本發明的方法，半導體晶片（2)的安裝步驟如下： 1.準備階段： 調整晶圓料盤（1)的方向，使一條連接同一行之半導 體晶片（2)之中心的直線（1 1)與第一驅動軸夾一個特定的 角度P。 由於半導體晶片的形狀爲長方形，因此另外一條連接 同一列之半導體晶片（2)之中心的直線（1 2)與第一驅動軸 夾一個特定的角度φζζ90°·*Ρ。 2 .接下來的安裝階段： 使晶圓料盤（1)沿著兩個驅動軸（4，6)同時移動，以便 在規定的位置將下一個半導體晶片（2)準備好，接著以晶 200847318 片抓取器抓取準備好的半導體晶片（2)，並將半導體晶片（2) 轉動角度r到一個特定的轉動位置（最好是經過事先計算 出的可能位置誤差的修正），然後將半導體晶片（2)放置在 基板上。 角度7=_ρ+ψ-Δω，如前面所述，角度Δω是一個 用來消除可能的位置誤差的修正角度’角度Ψ是一個由使 用者設定的角度。 角度Ρ通常介於30°至60°之間。角度Ρ的最佳値取 決於不同的外界因素。如果是一行接一行將半導體晶片（2) 放置在特定的位置，則移動路徑△ S代表連接同一行上兩 個相鄰半導體晶片（2)之中心的路徑；如果是一列接一列將 半導體晶片（2)放置在特定的位置，則移動路徑△ S代表連 接同一列上兩個相鄰半導體晶片（2)之中心的路徑。也就是 說，如果是一行接一行將半導體晶片（2)放置在特定的位 置，則移動路徑△ S相當於兩個相鄰半導體晶片（2)之中心 之間較短的距離L2 ;如果是一列接一列將半導體晶片（2)放 置在特定的位置，則移動路徑△ S相當於兩個相鄰半導體 晶片（2)之中心之間較長的距離L!。從向量上來講，移動路 徑 △ S是由第一驅動器（3)必須將晶圓料盤（1)移動的路段 △ X及第二驅動器（5)必須將晶圓料盤（1)移動的路段△ y所 構成。 以下利用3個範例說明如何求出角度p的最佳値： 範例1 兩個驅動軸（4，6)彼此垂直，也就是說角度β = 90°， •10· 200847318 同時兩個驅動器（3，5)可以以大致相同的速度移動晶圓料 盤（1)。在這種情況下，角度P的最佳値爲P = 0 /2 = 45°， 也就是說，連接同一行之半導體晶片（2)之中心的直線（11) 的方向垂直於兩個驅動軸（4，6)的等角分線（9)，同時距離 △ y及△ X的大小相同，而且： Δχ = Ay = L2/( 1 ) 但是如果角度 P 並非剛好等於45°，而是介於40°至 50°之間，則節奏時間會顯著的縮短。 範例2 兩個驅動軸（4，6)彼此垂直，但是驅動器（5)的移動速 度小於驗動器（3)。因此最好是調整晶圓料盤（1)的方向，使 第一驅動器（3)在時間△ t內將晶圓料盤（1)沿著第一驅動軸 (4)移動距離Δχ’问時％ _»驅動器（5)也在時間At內將晶 圓料盤（1)沿著第二驅動軸（6)移動距離△ y。如果第一驅動 器（3 )在將晶圓料盤（1)移動距離△ X期間的平均速度爲v !， 第二驅動器（5)在將晶圓料盤（1)移動距離△ y期間的平均速 度爲V2，則在步驟1(準備階段）最好是將晶圓料盤（1)的方 向調整成使角度P能夠滿足以下的方程式： Δχ Δγ —=— (2)[Embodiment] I Fig. 1 shows a plan view of a wafer tray (1) in a schematic manner, and the task of the wafer tray (1) is to prepare a semiconductor wafer (2) to be mounted on a substrate. Figure 2 shows a partial enlarged view of the first figure. The first actuator (3) can move the wafer tray (1) along the first linear drive shaft (4). The second driver (5) can move the wafer tray (1) along the second linear drive shaft (6), wherein the second linear drive shaft (6) and the first linear drive shaft (4) are sandwiched between A specific angle of 0. A third actuator (not depicted in the drawings) can rotate the wafer tray (1) about a spindle (7) that is perpendicular to the plane that is stretched by the two actuators (4, 6). In the present embodiment, the rotating shaft (7) is perpendicular to the drawing. A plurality of semiconductor wafers (2) are first fabricated together on a single wafer and then sawn into individual semiconductor wafers (2). These semiconductor wafers (2) are all adhered to a film (8) which is stretched by the frame. This frame is clamped to the wafer tray (1). L, and L2 represent the center distance between the rectangular semiconductor wafers (2). The semiconductor wafers (2) are arranged in rows and columns 'where the row to row distance is equal to the shorter distance L2, while the column to column distance is equal to the longer distance h. During installation, the wafer tray (1) is moved according to a certain rhythm so that the semiconductor wafers (2) are ready to be placed in a specific position. The placement process places the semiconductor wafer (2) in a specific position one by one or one column after another. Since the distance L2 is shorter than the distance L:, the present embodiment is preferably a path shown in a broken line in Fig. 1 200847318 (10) - the semiconductor wafer (2) is placed in a specific position in a row. The orientation of the wafer tray (1) is adjusted such that a line (1 1) connecting the centers of two adjacent semiconductor wafers (2) on the same row is sandwiched by a specific angle p with the first drive shaft (4). However, since the direction of the semiconductor wafer (2) is inclined to the drive shaft (4, 6) at this time, the wafer tray (1) must be moved in both directions at each feed, that is, the first The drive (3) must move the wafer tray (1) by a distance Δ X, and the second actuator (5) must move the wafer tray (1) by a distance Δ y, and the two movements must be performed simultaneously. The wafer gripper of the soldering head of the automatic mounting machine picks up the prepared semiconductor wafer (2) from the wafer tray (1) and then places it on the substrate. Since the wafer grabber can be rotated about its own longitudinal axis, the captured semiconductor wafer (2) can be first rotated to the correct position and then placed on the substrate. As can be seen from Fig. 2, the distances Δ X and Δ y are shorter than the distances L! and L2. According to the method of the present invention, the mounting process of the semiconductor wafer (2) is as follows: 1. Preparation stage: adjusting the direction of the wafer tray (1) so that a straight line connecting the centers of the semiconductor wafers (2) of the same row (1 1 ) is clamped to the first drive shaft by a specific angle P. Since the shape of the semiconductor wafer is rectangular, another straight line (12) connecting the centers of the semiconductor wafers (2) of the same column is sandwiched by the first drive shaft by a specific angle φ ζζ 90 ° · * 。. 2. Next installation phase: Simultaneously move the wafer tray (1) along the two drive shafts (4, 6) to prepare the next semiconductor wafer (2) at the specified position, followed by crystal 200847318 The chip grabber grabs the prepared semiconductor wafer (2) and rotates the semiconductor wafer (2) to a specific rotational position (preferably through a correction of a possible position error calculated in advance), and then the semiconductor The wafer (2) is placed on the substrate. Angle 7 = _ρ + ψ - Δω, as previously described, the angle Δω is a correction angle used to eliminate possible position errors. The angle Ψ is an angle set by the user. The angle Ρ is usually between 30° and 60°. The best choice for angle Ρ depends on different external factors. If the semiconductor wafer (2) is placed in a specific position row by row, the moving path ΔS represents a path connecting the centers of two adjacent semiconductor wafers (2) on the same row; if it is a column of semiconductor wafers ( 2) Placed at a specific position, the moving path ΔS represents a path connecting the centers of two adjacent semiconductor wafers (2) on the same column. That is, if the semiconductor wafer (2) is placed at a specific position row by row, the moving path ΔS corresponds to a shorter distance L2 between the centers of two adjacent semiconductor wafers (2); if it is a column After placing the semiconductor wafer (2) at a specific position in a row, the moving path ΔS corresponds to a longer distance L! between the centers of two adjacent semiconductor wafers (2). In terms of vector, the moving path Δ S is the section Δ X that the first driver (3) must move the wafer tray (1) and the section where the second driver (5) must move the wafer tray (1) △ y is composed. The following three examples illustrate how to find the best 角度 of the angle p: Example 1 The two drive axes (4, 6) are perpendicular to each other, that is to say the angle β = 90°, • 10· 200847318 at the same time two drives (3, 5) The wafer tray (1) can be moved at approximately the same speed. In this case, the optimum 値 of the angle P is P = 0 /2 = 45°, that is, the direction of the straight line (11) connecting the centers of the semiconductor wafers (2) of the same row is perpendicular to the two drive axes. The equiangular line (9) of (4,6), while the distances Δ y and Δ X are the same size, and: Δχ = Ay = L2/( 1 ) but if the angle P is not exactly equal to 45°, but Between 40° and 50°, the rhythm time is significantly shortened. Example 2 The two drive shafts (4, 6) are perpendicular to each other, but the drive (5) moves at a lower speed than the actuator (3). Therefore, it is preferable to adjust the direction of the wafer tray (1) so that the first actuator (3) moves the wafer tray (1) along the first drive shaft (4) by a distance Δχ during time Δt. The %_»driver (5) also moves the wafer tray (1) along the second drive shaft (6) by a distance Δ y in time At. If the average speed of the first actuator (3) during the movement of the wafer tray (1) by the distance Δ X is v !, the average of the second actuator (5) during the movement of the wafer tray (1) by the distance Δ y If the speed is V2, then in step 1 (preparation stage), it is preferable to adjust the direction of the wafer tray (1) so that the angle P can satisfy the following equation: Δχ Δγ —=— (2)
Vl V2 其中△ X及△ y代表晶圓料盤（1)必須移動的距離，以 便從半導體晶片上的參考點（例如前導體晶片的中心點）到 達同一行上相鄰的下一個半導體晶片上的參考點。但是如 果角度P不能滿足方程式（2)，而是介於p。- 5°至P。+ 5° 200847318 之間，其中P。滿足方程式△ X/V1 = △ y/n ’則節奏時間會 顯著的縮短。角度P。滿足以下的方程式： P 〇 = arcten(v2/v ι) (3) 其中〜及v2代表用以下方程式計算出的平均速度： VI = Δ χ/ Δ t 及 V2=Ay/z\t ⑷ 其中△ t代表晶圓料盤移動△ X及△ y之距離所需的 移動時間。 範例3 這個範例說明的情況是兩個驅動軸（4，6)並非彼此垂 直，而是彼此夾一個任意的角度0。在這種情況下，爲了 滿足方程式（2)，角度p ◦必須滿足以下的方程式： sin p 〇 / (sm( θ - p 〇)) = γ2/νι (5) 和前面的範例一樣，如果角度p不能滿足方程式（5)， 而是介於p 〇 - 5。至p。+ 5。之間，則節奏時間會顯著的縮 短。 範例1至3的情況都是一行接一行的將半導體晶片放 置在特定的位置。如果因爲某種原因需要一列接一列的將 半導體晶片放置在特定的位置，則只需將按照上述方程式 計算出的角度p加上9 〇。或減掉9 〇。即可。 【圖式簡單說明】 第1圖：一個承裝準備好要被安裝在基板上的半導體 晶片用的晶圓料盤。 第2圖：第ι圖的部分放大圖。 【主要元件符號說明】 -12- 200847318 1 晶圓料盤 2 半導體晶片 3, 5 驅動器 4, 6 驅動軸 7 轉軸 8 薄膜 9 等角分線 10 路徑 11,12 直線Vl V2 where Δ X and Δ y represent the distance that the wafer tray (1) must move in order to reach from a reference point on the semiconductor wafer (eg, the center point of the front conductor wafer) to the next adjacent semiconductor wafer on the same row. Reference point. But if angle P does not satisfy equation (2), it is between p. - 5° to P. + 5° 200847318, where P. If the equation Δ X/V1 = Δ y/n ′ is satisfied, the rhythm time will be significantly shortened. Angle P. The following equation is satisfied: P 〇 = arcten(v2/v ι) (3) where ~ and v2 represent the average velocity calculated by the following formula: VI = Δ χ / Δ t and V2 = Ay / z \ t (4) where △ t represents the movement time required for the wafer tray to move the distance between Δ X and Δ y. Example 3 This example illustrates the situation where the two drive shafts (4, 6) are not perpendicular to one another but are each clamped at an arbitrary angle of zero. In this case, in order to satisfy equation (2), the angle p ◦ must satisfy the following equation: sin p 〇 / (sm( θ - p 〇)) = γ2/νι (5) Same as the previous example, if the angle p cannot satisfy equation (5), but is between p 〇-5. To p. + 5. Between, the rhythm time will be significantly shortened. The case of Examples 1 to 3 is to place the semiconductor wafer in a specific position row by row. If for some reason one row after another is required to place the semiconductor wafer in a specific position, it is only necessary to add 9 〇 to the angle p calculated according to the above equation. Or lose 9 〇. Just fine. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a wafer tray for a semiconductor wafer to be mounted on a substrate. Figure 2: A partial enlarged view of the ι diagram. [Main component symbol description] -12- 200847318 1 Wafer tray 2 Semiconductor wafer 3, 5 Driver 4, 6 Drive shaft 7 Rotary shaft 8 Film 9 Isometric line 10 Path 11,12 Straight line
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