TW200847248A - Substrate treating apparatus and method of treating substrate - Google Patents

Substrate treating apparatus and method of treating substrate Download PDF

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Publication number
TW200847248A
TW200847248A TW96148999A TW96148999A TW200847248A TW 200847248 A TW200847248 A TW 200847248A TW 96148999 A TW96148999 A TW 96148999A TW 96148999 A TW96148999 A TW 96148999A TW 200847248 A TW200847248 A TW 200847248A
Authority
TW
Taiwan
Prior art keywords
region
substrate
chemical liquid
liquid
processing
Prior art date
Application number
TW96148999A
Other languages
English (en)
Chinese (zh)
Other versions
TWI380355B (ja
Inventor
Hiroshi Tanaka
Takao Inada
Yuji Kamikawa
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2006344806A external-priority patent/JP4842794B2/ja
Priority claimed from JP2006344875A external-priority patent/JP4829094B2/ja
Priority claimed from JP2006344911A external-priority patent/JP5063103B2/ja
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200847248A publication Critical patent/TW200847248A/zh
Application granted granted Critical
Publication of TWI380355B publication Critical patent/TWI380355B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW96148999A 2006-12-21 2007-12-20 Substrate treating apparatus and method of treating substrate TW200847248A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006344806A JP4842794B2 (ja) 2006-12-21 2006-12-21 基板処理装置、基板処理方法、基板処理プログラム、および、プログラム記録媒体
JP2006344875A JP4829094B2 (ja) 2006-12-21 2006-12-21 基板処理装置、基板処理方法、基板処理プログラム、および、プログラム記録媒体
JP2006344911A JP5063103B2 (ja) 2006-12-21 2006-12-21 基板処理装置、基板処理方法、プログラムおよび記録媒体

Publications (2)

Publication Number Publication Date
TW200847248A true TW200847248A (en) 2008-12-01
TWI380355B TWI380355B (ja) 2012-12-21

Family

ID=39536273

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96148999A TW200847248A (en) 2006-12-21 2007-12-20 Substrate treating apparatus and method of treating substrate

Country Status (2)

Country Link
TW (1) TW200847248A (ja)
WO (1) WO2008075643A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111785623B (zh) * 2020-06-15 2022-11-04 上海华虹宏力半导体制造有限公司 湿法刻蚀方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0475341A (ja) * 1990-07-18 1992-03-10 Fujitsu Ltd 半導体基板洗浄方法及び洗浄装置
JP2000183005A (ja) * 1998-12-10 2000-06-30 Sony Corp ウエハの洗浄方法及び洗浄装置
JP3810968B2 (ja) * 1999-12-03 2006-08-16 東京エレクトロン株式会社 液処理装置および液処理方法
JP2001223193A (ja) * 2000-02-08 2001-08-17 Smt:Kk 基板の洗浄方法およびその装置
JP2006019350A (ja) * 2004-06-30 2006-01-19 Dainippon Screen Mfg Co Ltd 基板処理装置

Also Published As

Publication number Publication date
WO2008075643A1 (ja) 2008-06-26
TWI380355B (ja) 2012-12-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees