200846138 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種用於化學機械研磨之研磨塾。 【先前技術】 化學機械研磨（CMP)係為使用一研磨墊以平坦化基板表 面之程序。CMP—般應用於研磨透鏡、鏡子、液晶顯示器 之基板、石夕晶圓及石夕晶圓上之氧化層及/或金屬層。200846138 IX. INSTRUCTIONS OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates to a grinding crucible for chemical mechanical polishing. [Prior Art] Chemical mechanical polishing (CMP) is a procedure in which a polishing pad is used to planarize the surface of a substrate. CMP is generally applied to polishing lenses, mirrors, substrates for liquid crystal displays, Shihua wafers, and oxide layers and/or metal layers on Shihwa wafers.
以石夕晶圓作為實例，首先將單晶矽之結晶塊切片。通常 磨光該等晶圓使其變平以供隨後進行化學蝕刻。在蝕刻過 程之後需要一研磨製程。在研磨製程期間，研磨墊連同漿 液一起與晶圓表面上之矽原子進行化學反應，以使得經反 應之表面比底下的矽柔軟。此外，持續抹除經反應之表 面’可使新鮮矽暴露於漿液及研磨墊。 第6,358,130號美國專利揭示一種與研磨液一起使用之習 知研磨墊。該習知研磨墊具有研磨層及穿過該研磨層之開 口中的冑口。料磨層及窗口 t下表面由#下之液體不； 滲透層覆蓋。該習知研磨墊進—步包含處於該液體不可渗 透層上之黏合劑，該黏合劑在研磨層及窗口與一下墊層之 間形成各自的接合密封。在該習知研磨墊中，黏合劑及液 體不可滲透層可防止黏合劑與研磨層、窗口及液體不可渗 透層中每-者之間的界面變濕。其優點在於，不間斷的液 體不可滲透層可避免由於以下原因而產生浅漏路徑之傾 :·由於在曰常處理期間彎曲；由於在使用該研磨墊期間 施加研磨壓力；或由於黏合劑中之小孔隙或間隙。另一優 114387.doc 200846138 點在於接合密封可減小黏合劑與研磨層、窗口及液體不可 滲透層中每一者之間界面中由研磨液引起之變濕。 因為習知研磨墊之下墊層通常包含纖維，所以下墊層之 • 内含物未均勻分布。並且，因為習知研磨墊之研磨層通常 ， 包含彈性體，所以研磨層之内含物亦未均勻分布，而可容 易觀測到下墊層及研磨墊之厚度變化。此外，下墊層及研 磨墊之表面係不平坦的，且通常粗糙並起伏。此類特徵使 _ 仔下墊層或研磨墊難以緊密且完全附著至該液體不可滲透 層在下墊層及研磨層與液體不可滲透層之間的界面中容 易觀測到氣泡及空白空間（如圖丨所示）。因而，漿液容易經 由該等氣泡及空白空間而滲透至下墊層及研磨層與液體不 可滲透層之間的界面中，因而縮短習知研磨墊之使用壽 中’並同時降低化學機械研磨之效果及效率。 【發明内容】 本發明之一目的在於提供一種研磨墊，該研磨墊包含一 肇 緩衝片、一研磨片及用於將該緩衝片黏合至該研磨片之黏 合劑。該緩衝片包含纖維。該研磨片包含第一彈性體。該 黏合劑包含第二彈性體。 ， 本發明之另一目的在於提供一種研磨基板之方法，該方 法包含使用上述研磨塾來研磨一基板表面。 本發明之又一目的在於提供一種用於製造上述研磨墊之 方法，該方法包含以下步驟·· (a) 提供緩衝片及研磨片； (b) 在緩衝片或研磨片之表面上施加第二彈性體；以及 H4387.doc 200846138 (0將緩衝片黏合至研磨片。 【實施方式】 本發明提供—種研磨墊，其包含-緩衝片、-研磨片及 用於將該緩衝片黏合至該研磨 纖維。該研磨片包含第二二合劑。該緩衝片包含 體。 。弟-彈性體。該黏合劑包含第二彈性 根據本發明，任何包含纖維之 中。緩#ί Μ ^ π l 衝片均可應用於本發明 干緩衝片％u土地包含不織布 捲之不皤I ^ 1更佺地，緩衝片包含成 捲之不織布，其可以連續捲 與包含掇制七爲、4 、便用該荨成捲之不織布， 成.s〜之生產單個研磨塾之習知方法相比，該 成捲方式可改進批次均勻性。 本文中使用「不織布 之製造片、網或niH 或隨機定向纖維 接口亚不包括紙及併入有接 力 簇生、螓绝十丄 / 4、名之經編織、針織、 族生、縫、扁或由濕式礙 之產品。該等纖維可為天缺J:(無：疋否經額外物 絲或可原位形成。取' ^八可為定長或連續的 合成不織布、針刺織布1網之方法’不織布通常包含 式成網不織布'、'甚式=、溶喷不織布、纺黏不織布、乾 布。與織布相二織：:：布、縫編不織布或水刺不織 本文中使用之「纖維好的材料特性。 地指複合纖維。可㈣二乙^指单纖維或複合纖維，較佳 地，該纖維由選自:研磨之基板來選擇該纖維，較佳 成：聚酿胺、=由以下各物組成之群的至少一種材料製 對本二胺、聚醋、聚甲基丙稀酸甲醋、聚對 114387.doc 200846138 苯二甲酸乙二酯、聚丙烯腈及其混合物。 本文中使用之「第一彈性體」乙詞（亦稱為「第一彈性 聚合物」）指展現類似橡膠品質之一聚合物種類。當研磨 犄，該第一彈性體可充當良好的緩衝器以避免刮傷待研磨 之基板表面。在本發明之一個較佳實施例中，第一彈性體 包含發泡樹脂。本文中使用之「發泡樹脂」乙詞指含有熱 塑樹脂及熱分解發泡劑之材料。該第一彈性體較佳地包含 選自由以下各物組成之群的至少一者：聚氨酯、聚稀烴、 聚碳酸酯、聚乙烯醇、耐綸、彈性橡膠、聚苯乙稀、聚芳 烴分子、含氟聚合物、聚醯亞胺、交聯聚氨酯、交聯聚烯 烴、？κ醚、聚酯、聚丙烯酸酯、彈性聚乙烯、聚四氟乙 烯、聚（對苯二甲酸亞乙酯）、聚芳烴醯胺、聚芳烴、聚甲 基丙烯酸甲酯、其共聚物、其嵌段共聚物、其混合物及其 摻合物；更佳地，第一彈性體包含聚氨酯。 在本發明之一個較佳實施例中，研磨片進一步包含纖 維，且更佳地，該纖維包含不織布（如上所述）。纖維研磨 片提供用於研磨之突起，亦可作為支架，該支架允許研磨 片之彈性體沈積在由該支架界定之空間中。本發明所屬技 術領域中具通常知識者可根據本說明書之揭示内容來選擇 適合種類之纖維並協調第一彈性體與該纖維。該纖維較佳 地由選自由以下各物組成之群的至少一種材料製成：聚醯 胺對笨一胺、聚酯、聚甲基丙烯酸曱酯、聚對苯二甲酸 乙二酯、聚丙烯腈及其混合物。 在本發明之一個更佳實施例中，研磨片包含複數個嵌在 114387.doc -9- 200846138 纖維及第一彈性體中之連續孔。研磨墊之連續孔具有均勻 尺寸，此有利於研磨液之流動、研磨顆粒之分布及研磨殘 留物之移除。在本發明之較佳實施例中，連續孔具有自 ， 0·1 μπι至500 μιη之孔尺寸。 • 根據本發明之黏合劑形成於缓衝片與研磨片之間，且較 佳地係嵌入至緩衝片之纖維中。因為根據本發明之黏合劑 較佳地係嵌入至緩衝片之纖維中，故可充當緩衝片與研磨 φ 片之間的中間體。根據本發明之黏合劑經設計以修改緩衝 片及研磨片之表面，且能夠填充緩衝片及研磨片之粗糙及 起伏點（如圖2所示）。因而該兩片材可彼此黏合良好，並大 幅地增強緩衝片與研磨片之黏合強度。此外，根據本發明 之研磨墊可工作而不會被漿液滲透，研磨墊之使用壽命得 以延長’並由此改進了化學機械研磨之效果及效率。 本文中使用之「第二彈性體」乙詞（亦稱為「第二彈性 水a物」）扎展現類似橡膠品質之一聚合物種類。該第二 • 彈性體可充當用於將緩衝片黏合至研磨片之黏合劑。在本 毛明之一個較佳實施例中，該第二彈性體為糊劑。該糊劑 較佳爲一液型糊劑、二液型糊劑或濕凝固糊劑。在本發明 • 之一個更佳實施例中，該第二彈性體包含選自由以下各物 ' 、、且成之群的至少一者··聚氨酯、聚氯乙浠、聚苯乙浠、聚 乙烯胺、聚_、聚丙稀、乙二醇二乙酸酯/醋酸乙 稀S曰、其共聚物、其谈段共聚物、其混合物及其摻合物。 在本發明之一個最佳實施例中，第二彈性體包含聚氨酯。 在本發明之一個較佳實施例中，黏合劑為二液型糊劑。 114387.doc 200846138 該一液型糊劑指包含彼此相互作用或交聯以實現黏合作用 之兩種成分的糊劑。該二液型糊劑較佳地包含 及聚異氰酸酯。 一坪注體 ，、本發明亦提供—種研磨基板之方法，該方法包含使用上 ， 述之研磨墊來研磨基板表面。 本發明亦提供一種用於製造上述研磨墊之方法，該方法 包含以下步驟： _ (a)&供緩衝片及研磨片； 0>)在緩衝片或研磨片之表面上施加第二彈性體；以及 (c)將緩衝片黏合至研磨片。 :緩衝片黏合至研磨片之方式根據黏合劑之形式而變 化用於將緩衝片黏合至研磨片之黏合劑較佳係藉由塗 覆噴射、印刷或刮擦而施加在緩衝片及研磨片之至少一 個表面上。 在施加黏合劑之後，緩衝片與研磨片黏合在一起。緩衝 ® 片及研磨片較佳在7rc至8〇。〇之溫度下彼此黏合。 —如必要，在根據本發明之步驟之後，該方法進一步包 否口化步驟。在某些情況下，黏合劑需要該固化步驟來 • m並形成接合。該固化步驟之條件及方式根據所使用之 黏合劑而變化。 茲以下列實例予以詳細說明本發明，唯其並不意味本發 明僅侷限於此等實例所揭示之内容。 驾头研磨塾·下塾層及研磨層由黏合劑黏合至液體不可 滲透層。 H4387.doc -11- 200846138 根據本發明之研磨墊：缓衝片及研磨片由包含聚氨酯之 黏合劑黏合在一起。 表1中展示習知研磨墊（墊1)及根據本發明之研磨墊（墊2) 之特性。 表1 黏合強度 乾(kg/cm) 濕(kg/cm) 墊1 0.42 0.35 墊2 U 0.9 (R.R)平均：6277 NU%： 5.6%Taking the Shixi wafer as an example, the crystal block of the single crystal crucible is first sliced. The wafers are typically polished to flatten for subsequent chemical etching. A polishing process is required after the etching process. During the polishing process, the polishing pad, along with the slurry, chemically reacts with the helium atoms on the surface of the wafer to make the reacted surface softer than the underlying crucible. In addition, the continuous removal of the reacted surface can expose the fresh mash to the slurry and the polishing pad. U.S. Patent No. 6,358,130 discloses a conventional polishing pad for use with a slurry. The conventional polishing pad has an abrasive layer and a cornice in the opening through the polishing layer. The underlayer and the bottom surface of the window t are not covered by the liquid under #; the permeable layer is covered. The conventional polishing pad further comprises an adhesive on the liquid impermeable layer which forms a respective joint seal between the polishing layer and the window and the underlying layer. In the conventional polishing pad, the adhesive and the liquid impermeable layer prevent the interface between the adhesive and the abrasive layer, the window, and the liquid impermeable layer from becoming wet. The advantage is that the uninterrupted liquid impermeable layer avoids the tilting of the shallow leak path due to: • being bent during the usual processing; due to the application of the grinding pressure during use of the polishing pad; or due to the adhesive Small pores or gaps. Another advantage is that the joint seal reduces the wetting caused by the slurry in the interface between the adhesive and each of the abrasive layer, window and liquid impermeable layer. Since the underlying layer of the conventional polishing pad usually contains fibers, the contents of the underlying layers are not evenly distributed. Moreover, since the polishing layer of the conventional polishing pad usually contains an elastomer, the contents of the polishing layer are not uniformly distributed, and the thickness variations of the underlying layer and the polishing pad can be easily observed. In addition, the underlying layer and the surface of the polishing pad are not flat and are generally rough and undulating. Such features make it difficult for the underlying layer or the polishing pad to adhere tightly and completely to the liquid impermeable layer. Bubbles and blank spaces are easily observed in the interface between the underlying layer and the abrasive layer and the liquid impermeable layer (see Figure 丨). Shown). Therefore, the slurry easily penetrates into the interface between the underlying layer and the polishing layer and the liquid impermeable layer via the bubbles and the blank space, thereby shortening the use of the conventional polishing pad and simultaneously reducing the effect of chemical mechanical polishing. And efficiency. SUMMARY OF THE INVENTION An object of the present invention is to provide a polishing pad comprising a buffer sheet, an abrasive sheet, and an adhesive for bonding the buffer sheet to the polishing sheet. The cushion sheet contains fibers. The abrasive sheet comprises a first elastomer. The binder comprises a second elastomer. Another object of the present invention is to provide a method of polishing a substrate comprising polishing a substrate surface using the above-described abrasive crucible. It is still another object of the present invention to provide a method for manufacturing the above polishing pad, which comprises the following steps: (a) providing a buffer sheet and an abrasive sheet; (b) applying a second surface to the surface of the buffer sheet or the abrasive sheet Elastomer; and H4387.doc 200846138 (0) Bonding a buffer sheet to an abrasive sheet. [Embodiment] The present invention provides a polishing pad comprising a buffer sheet, an abrasive sheet, and a bonding sheet for bonding the buffer sheet to the polishing sheet. The abrasive sheet comprises a second dimerizer. The buffer sheet comprises a body. The elastomer-elastomer. The binder comprises a second elasticity according to the invention, any of the fibers contained therein. It can be applied to the dry buffer sheet of the present invention. The land contains a non-woven fabric roll. The cushion sheet comprises a roll of non-woven fabric, which can be continuously wound and contained in a seven-piece, four-piece, and can be used. The non-woven fabric of the roll can improve the batch uniformity compared with the conventional method of producing a single grinding crucible. In this paper, the "non-woven fabric, net or niH or random oriented fiber interface" is used. include And incorporates products that are relayed, smashed, and woven, knitted, ethnic, sewn, flat, or wet. These fibers can be used for days: (No: 疋 No The extra filament may be formed in situ. The method of '^8 may be a fixed length or a continuous synthetic non-woven fabric, a needle-punched fabric 1 net 'non-woven fabric usually includes a type of non-woven fabric', 'very type=, spray-dissolved non-woven fabric, Spunbonded non-woven fabric, dry cloth. Two-woven with woven fabric::: cloth, stitched non-woven fabric or spunlace. The material properties of the fiber used in this article. The ground refers to the composite fiber. (4) Preferably, the fiber is selected from the group consisting of: a substrate to be polished, preferably: polyamine, = at least one material of the group consisting of: diamine, polyester, poly Methyl methacrylate methyl acetonate, polypair 114387.doc 200846138 phthalic acid phthalate, polyacrylonitrile and mixtures thereof. The term "first elastomer" used herein (also known as "first elastomeric polymer" ") refers to a polymer type that exhibits similar rubber qualities. When grinding 犄, the first The aptitude can act as a good buffer to avoid scratching the surface of the substrate to be polished. In a preferred embodiment of the invention, the first elastomer comprises a foamed resin. The term "foam resin" as used herein refers to a material comprising a thermoplastic resin and a thermally decomposable foaming agent. The first elastomer preferably comprises at least one selected from the group consisting of polyurethane, polyalkylene, polycarbonate, polyvinyl alcohol, and resistant Polyurethane, elastomeric rubber, polystyrene, polyarene molecules, fluoropolymers, polyimine, crosslinked polyurethanes, crosslinked polyolefins, ?? ethers, polyesters, polyacrylates, elastomeric polyethylenes, polytetra Vinyl fluoride, poly(ethylene terephthalate), polyarene phthalamide, polyaromatic hydrocarbon, polymethyl methacrylate, copolymers thereof, block copolymers thereof, mixtures thereof and blends thereof; more preferably The first elastomer comprises polyurethane. In a preferred embodiment of the invention, the abrasive sheet further comprises fibers, and more preferably the fibers comprise a nonwoven (as described above). The fiber abrasive sheet provides a protrusion for grinding and can also serve as a stent that allows the elastomer of the abrasive sheet to be deposited in the space defined by the stent. Those of ordinary skill in the art to which the present invention pertains can select a suitable type of fiber and coordinate the first elastomer with the fiber in accordance with the disclosure of the present specification. The fiber is preferably made of at least one material selected from the group consisting of polyamines, stupiamines, polyesters, poly(methacrylate), polyethylene terephthalate, polypropylene. Nitrile and mixtures thereof. In a more preferred embodiment of the invention, the abrasive sheet comprises a plurality of continuous apertures embedded in the fibers of 114387.doc -9-200846138 and the first elastomer. The continuous pores of the polishing pad have a uniform size which facilitates the flow of the slurry, the distribution of the abrasive particles, and the removal of the abrasive residue. In a preferred embodiment of the invention, the continuous pores have a pore size ranging from 0. 1 μm to 500 μm. • The adhesive according to the present invention is formed between the buffer sheet and the abrasive sheet, and is preferably embedded in the fibers of the cushion sheet. Since the adhesive according to the present invention is preferably embedded in the fibers of the cushion sheet, it can serve as an intermediate between the buffer sheet and the abrasive φ sheet. The adhesive according to the present invention is designed to modify the surface of the buffer sheet and the abrasive sheet, and is capable of filling the roughness and relief points of the buffer sheet and the abrasive sheet (as shown in Fig. 2). Therefore, the two sheets can be bonded to each other well, and the adhesion strength between the cushion sheet and the abrasive sheet is greatly enhanced. Further, the polishing pad according to the present invention can be operated without being infiltrated by the slurry, and the life of the polishing pad is prolonged' and thereby the effect and efficiency of chemical mechanical polishing are improved. The term "second elastomer" (also referred to as "second elastic water") used in this article exhibits a polymer type similar to rubber quality. The second elastomer can act as a binder for bonding the cushion sheet to the abrasive sheet. In a preferred embodiment of the present invention, the second elastomer is a paste. The paste is preferably a one-liquid type paste, a two-liquid type paste or a wet-solidified paste. In a further preferred embodiment of the present invention, the second elastomer comprises at least one selected from the group consisting of: , polyurethane, polyvinyl chloride, polystyrene, polyethylene Amine, poly-, polypropylene, ethylene glycol diacetate / vinyl acetate, copolymers thereof, copolymers thereof, mixtures thereof, and blends thereof. In a preferred embodiment of the invention, the second elastomer comprises polyurethane. In a preferred embodiment of the invention, the binder is a two-part paste. 114387.doc 200846138 The one-part paste refers to a paste comprising two components that interact with each other or crosslink to achieve adhesion. The two-liquid type paste preferably contains a polyisocyanate. A ping body, the invention also provides a method of polishing a substrate comprising polishing the surface of the substrate using the polishing pad described above. The present invention also provides a method for manufacturing the above polishing pad, the method comprising the steps of: _ (a) & a buffer sheet and an abrasive sheet; 0>) applying a second elastomer on the surface of the buffer sheet or the abrasive sheet And (c) bonding the buffer sheet to the abrasive sheet. The manner in which the buffer sheet is bonded to the abrasive sheet varies depending on the form of the adhesive. The adhesive for bonding the buffer sheet to the abrasive sheet is preferably applied to the buffer sheet and the abrasive sheet by coating spraying, printing or scratching. On at least one surface. After the application of the adhesive, the buffer sheet is bonded to the abrasive sheet. Buffer ® sheets and abrasive sheets are preferably from 7rc to 8〇. Adhesive to each other at the temperature of the crucible. - If necessary, after the step according to the invention, the method further comprises a singulation step. In some cases, the adhesive requires this curing step to form a bond. The conditions and manner of the curing step vary depending on the binder used. The invention is illustrated by the following examples, which are not intended to be construed as limiting the invention. The head grinding layer, the lower jaw layer and the abrasive layer are bonded by a binder to the liquid impermeable layer. H4387.doc -11- 200846138 A polishing pad according to the present invention: a buffer sheet and an abrasive sheet are bonded together by a binder containing polyurethane. Table 1 shows the characteristics of a conventional polishing pad (pad 1) and a polishing pad (pad 2) according to the present invention. Table 1 Adhesive strength Dry (kg/cm) Wet (kg/cm) Pad 1 0.42 0.35 Pad 2 U 0.9 (R.R) Average: 6277 NU%: 5.6%
設備·· IPEC776 上述實施例僅為說明本發明之原理及其功效，而非限制 本發明。習於此技術之人士對上述實施例所做之修改及變 化仍不違背本發明之精神。本發明之權利範圍應如後述之 申請專利範圍所列。 【圖式簡單說明】 圖1說明習知研磨墊在穿透式電子顯微鏡下之視圖。 圖2說明根據本發明之研磨墊在穿透式電子顯微鏡下之 視圖。 114387.doc -12-DEVICE··IPEC776 The above embodiments are merely illustrative of the principles of the invention and its effects, and are not intended to limit the invention. Modifications and variations of the embodiments described above will be apparent to those skilled in the art without departing from the spirit of the invention. The scope of the invention should be as set forth in the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 illustrates a view of a conventional polishing pad under a transmission electron microscope. Figure 2 illustrates a view of a polishing pad according to the present invention under a transmission electron microscope. 114387.doc -12-