TW200845531A - Coil unit, manufacturing method thereof, and electronic machine - Google Patents

Abstract

A coil unit (12,22) includes a planar coil (30), a magnetic member (52) that is provided under the planar coil, a magnetic flux leakage prevention member (54) that is provided under the magnetic member, and a heat sink (70) that is provided under the magnetic flux leakage prevention member. The magnetic flux leakage prevention member is electrically insulated from the heat sink. The magnetic flux leakage prevention member is insulated from the heat sink using a double-sided adhesive tape (60), for example.

Description

。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 [Prior Art] It is known that electromagnetic induction is used, and even if there is no metal part contact, the contactless power transmission of power transmission can be applied. As a suitable machine for this contactless power transmission, there are proposals for charging a mobile phone and charging a home device (for example, a child of the telephone Φ). In the case of the contactless power transmission, there is a problem that the heat of the transmission coil is heated, and there is a proposal to suppress the heat generation (Patent Document 丨_5). Patent Document discloses a design method for suppressing heat generation by non-contact charging. Patent Document 2 discloses a technique for suppressing heat generation by a configuration of a coil and a magnetic material. Patent Document 3 discloses a contactless charging device having an air cooling mechanism. Patent Document 4 discloses a structure in which a ceramic body is placed between a primary side coil and a secondary side coil to cause heat release. Patent Document 5 discloses a structure of a frame body which improves heat dissipation. [Patent Document 4] Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. [Patent Document 5] JP-A-2005-110357 SUMMARY OF INVENTION [Problems to be Solved by the Invention] In this jointless power transmission, since a magnetic field is used between coils Transmission 128611.doc 200845531 Absorption, and the efficiency can not be used is best for the delivery of 'when the metal is close' the magnetic field will be reduced by the metal and the induction heating of the metal itself. Therefore, the problem of metal for heat use. A good coil unit and several aspects of the invention are used to provide exothermic methods of manufacture and electronic machines. The coil unit of the present invention is characterized by comprising: a planar coil; a magnetic member disposed below the planar coil; a leakage flux preventing member disposed under the magnetic member; and a heat release Board, its

The leakage flux prevention member is electrically insulated from the heat radiation plate. According to this configuration, the heat radiating plate is provided between the planar coil and the leakage flux preventing member via the magnetic member, instead of being disposed between the planar coil and the heat radiating plate via the space, so that the planar coil can be efficiently generated. The heat is exothermic. Further, since the leakage magnetic flux prevention structure # is provided, induction heating can be prevented by receiving the magnetic flux from the heat radiation plate. Further, the leakage flux preventing member formed of metal can be electrically insulated from the heat radiating plate, so that the heat radiating plate can be prevented from performing the function as a member that receives the magnetic flux. In one aspect of the invention, the leakage flux preventing member and the heat radiating plate may be insulated by a double-sided tape. According to this configuration, the leakage flux preventing member can be insulated from the heat radiating plate by the double-sided adhesive tape. Therefore, it is not necessary to separately provide an insulator, and assembly is easy. In one aspect of the invention, a printed circuit board may be further provided, wherein the heat radiation plate is mounted and a conductive pattern connected to the planar coil is formed. According to this configuration, since the conductive pattern is provided on the printed circuit board, it is easy to perform electrical connection with the elements for controlling the planar coil. In the embossed-type towel, at least one mounting component may be mounted on the surface of the printed circuit board on which the heat-dissipating plate is mounted; the upper position of the planar coil may be set higher than the at least one mounting component The highest height in the middle. According to this configuration, the upper position of the planar coil is set higher than the upper surface of the mounted component, so that assembly is easy, and the upper surface of the planar coil can be brought closer to the coil unit on the other side. In the aspect of the invention, in the at least one of the aforementioned mounting parts, the part having the largest height can be connected to the capacitor part of the aforementioned planar coil. From the standpoint of ensuring electrical capacity, it is necessary to set the capacitor parts to a larger size. Therefore, one aspect of the present invention is quite effective in the case where the mounting part is a capacitor part. In one aspect of the invention, a temperature detecting element for detecting the temperature of the heat radiating plate may be attached to a surface of the printed circuit board different from the surface on which the heat radiating plate is mounted. Thereby, even if foreign matter or the like enters and the temperature of the heat radiating plate abnormally rises due to the temperature rise of the planar coil, the abnormality can be detected. In one aspect of the present invention, the power supply to the planar coil may be blocked depending on the temperature of the heat radiating plate coil on a surface of the printed circuit board different from the surface on which the heat radiating plate is mounted. element. Thereby, the circuit for blocking the power supply can be constructed easily and surely. In one aspect of the present invention, the printed circuit board may be provided with a 128611.doc 200845531= portion, which guides the assembly fixture, and the assembly fixture houses the heat release plate and the leakage flux prevention member. The magnetic member and the planar coil. Thereby, assembly of a planar coil or the like becomes easier. In the aspect of the invention, the spacer member may be disposed on the magnetic member. The spacer member includes a hole </ RTI> for accommodating the planar coil, and the upper surface of the planar coil and the upper surface of the spacer member The essence is the same plane. Thus, when the upper surface of the planar coil and the upper surface of the spacer member are substantially flush with each other, the transmission surface can be made flat. When the two members touch the corners of the planar coil, the planar coil can be prevented from being damaged. In one aspect of the invention, the leakage flux preventing member and the heat radiating plate may have substantially the same planar size, and the heat radiating member is thicker than the leakage flux preventing member. By making the planar dimensions substantially the same, the leakage flux preventing member can surely capture the magnetic flux. Further, when the heat radiating plate is set thicker than the leakage flux preventing member, the heat radiating property of the heat radiating plate can be further improved. Another electronic device of the present invention includes a coil unit and an electronic device that houses the outer casing of the coil unit; the outer casing has a hole portion facing the plane coil, and the hole The portion is covered by the protective cover; a reinforcing portion is formed at a position opposite to a maximum height position of the at least one mounting member, and the thickness of the reinforcing portion is formed thicker than the thickness of the protective cover When the height from the printed circuit board to the outer surface of the rib guard is H1, and the maximum height aH2 of the at least one mounting component based on the printed circuit board, and the thickness of the reinforcing one is H3, Hl>H2+H3. 128611.doc 200845531 When thinning the protective cover and thickening the reinforcing part, it is indeed ^ ^ ^ ^ ^ ^ VII. The reinforcing part protects the other parts. When X' has a reinforcing portion, it is possible to suppress the upper portion of the mounting member from being recessed, so that the transfer (4) near outer casing and fT1&gt;M7 are π-upper. Also, when set to 2m, it can be between the mounting part and the reinforcing part.

Suppress damage to the mounting parts. The manufacturing method of the coil unit according to another aspect of the present invention may include: a step (Α) 'which is in the assembly process and the receiving part of the sheet is a collection of the above-mentioned planar coil, the magnetic member And before, especially, interest

讦 讦 述 漏 漏 漏 ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; 漏 漏 漏 漏 漏 漏 漏 漏 漏 漏 漏 漏 漏 漏 漏 漏 漏 漏 漏 漏 漏 漏 漏 漏 漏 漏After the step (B), the assembly jig is coupled to the printed circuit board on the side of the accommodating portion of the assembly jig, and the planar coil, the magnetic member, and the leakage flux are prevented. The member and the heat radiating plate are mounted on the printed circuit board. In this way, after the assembly jig accommodates the planar coil, the magnetic member, the leakage flux prevention member, and the heat radiation plate, the printed circuit board is stacked and the planar coil or the like is assembled to the printed circuit board, so that the assembly is performed one by one. In comparison, assembly is easier. In still another aspect of the manufacturing method of the present invention, the planar coil magnetic member, the leakage flux preventing member, and the heat radiating plate are sequentially housed in the assembling jig 'but the two sides are interposed between the members. Other members such as belts are also included in the scope of the present invention. In still another aspect of the manufacturing method of the present invention, between the foregoing step (A) and the step (B), the method may further include: a step of accommodating the leakage flux of the first 128611.doc 200845531 The insulating double-sided tape for preventing the member from being insulated from the heat radiation plate. In still another aspect of the invention, in the manufacturing method of the present invention, before the step (A), the step of accommodating the spacer member in the housing portion is included. In still another aspect of the invention, the printed circuit board may include a positioning portion, and the assembly fixture includes a positioning guide portion corresponding to the clamping portion of the printing stroke substrate. In this way, there is a positioning portion that makes positioning easier and makes assembly easier. A coil unit according to still another aspect of the present invention includes: a coil; a magnetic member in which a first magnetic flux generated by the coil is incident; and a second magnetic flux incident on the magnetic member according to the second magnetic flux a leakage flux preventing member; and a heat releasing plate that radiates heat generated by the coil; and the leakage flux preventing member is electrically insulated from the heat radiating plate. In another aspect of the coil unit of the present invention, a heat radiating plate may be provided between the magnetic member and the leakage flux preventing member between the planar shape and the planar magnetic field, instead of being disposed in the planar coil and radiating heat through the space. Between the plates, the heat generated by the planar coils can be effectively released. Further, since the leakage flux prevention member is provided, it is possible to prevent the heat radiation plate from receiving the magnetic flux and causing induction heating. Further, the leakage flux preventing member formed of México can be electrically insulated from the heat radiating plate, so that the function of the heat radiating plate as a member for receiving the magnetic flux can be prevented. Further, in still another sad coil unit of the present invention, various embodiments of the coil unit of one aspect of the present invention described above can be applied. 128611.doc -11 - 200845531 Still another aspect of the present invention can include the above-described coil unit. [Embodiment] Hereinafter, a suitable embodiment of the present invention will be described in detail. Further, the present embodiment described below should not unduly limit the scope of the invention described in the claims, and all of the configurations described in the present embodiment are not necessarily required as a means for solving the invention. Fig. 1 is a view schematically showing a charger 1 被 and a charger 2 。. The charging of the charger 20 by the charger 10 utilizes electromagnetic induction between the coil of the coil unit 12 of the charger 1 and the coil of the coil unit 22 of the charger 20, and by means of no contact Power is delivered for implementation. As one of the feature points of this embodiment, there is a configuration of a coil unit. Hereinafter, the coil unit will be specifically described. Fig. 2 is a schematic exploded view of the coil units 12, 22. Fig. 3 is a schematic cross-sectional view showing the coil units 12, 22 along the Α·Α line of Fig. 2. 4 schematically shows the charger 1 of the coil unit 22 or the coil units 12, 22 of a partial cross section of the charger 22 to sequentially overlap the heat release plate 70 and the shield magnetic member 5 on the printed circuit board 8A. And a coil, for example, a state in which the planar coil % is formed. The planar coil 30 is not particularly limited as long as it is a planar coil. For example, a hollow coil in which a single-core or multi-core covered coil wire is wound on a plane can be applied. The planar coil 30 may be formed by one coil, but as shown in Figs. 2 to 4, the coils 32a and 32b may be stacked in plural layers. When the coils 32&amp;, 12S6H.doc -12-200845531 32b are connected in series, in addition to the self-inductance, the mutual inductance can be utilized and the coil diameter can be reduced. The coil 32a is provided with a plurality of layers of milk, and the coils 32a, 32b can be fixed by a double-sided tape 34. ^ A spacer member 4' can be provided around the planar coil 30. A hole portion 44 is formed in the spacer member 40, and a planar coil % is accommodated in the hole portion. In the partition member 4, a notch portion 44 is provided, from which the bow of the planar coil 30 is taken out. The upper surface of the planar coil 30 and the upper surface of the spacer member 4 are substantially flush with each other. By providing the spacer member 40, the transfer surface can be made flat: • 1 can reduce the damage of the planar coil 30 (in particular, the corner of the planar coil) Department damage). Further, it is possible to prevent something from being caught at the end of the planar coil 3, and the planar coil 30 can be prevented from being peeled off. The material of the spacer member 4 is not particularly limited as long as it has high heat resistance to heat generation of the coil and does not have a dielectric constant. For example, polyethylene terephthalate resin or the like is exemplified. Below the planar coil 30, a shielded magnetic member 5 is provided. The shield magnetic member 50 includes the magnetic member 52 and the leakage flux preventing member 54 〇 # magnetic member 52 disposed thereunder to perform the function of receiving the magnetic flux, and has the function of improving the inductance. As the material of the magnetic member 52, a soft magnetic material is preferable, but a 'ferrite soft magnetic material and a metal soft magnetic material are used. The leakage flux preventing member 54 has a task of absorbing the magnetic flux that is not completely captured by the magnetic member 52 and the magnetic flux leaking from the periphery of the magnetic member 52. Alternatively, it may be defined that, when the magnetic flux generated by the planar coil 30 is the jth magnetic flux, the first magnetic flux is incident on the magnetic member 52, and the second magnetic flux generated by the magnetic member 52 according to the magnetic flux is incident on the magnetic flux. Leakage flux prevention member 54. In this case, the leakage flux prevention member 128611.doc -13- 200845531 has the task of absorbing the second magnetic flux. The material of the second member is only a material that can absorb the magnetic flux, and = a non-magnetic material, such as Ming. The transfer characteristics are affected by the objects formed under the condition of the defective member. Therefore, it is preferable that the magnetic flux leakage stop member 54 is configured to have a material and a leakage flux preventing member 5 in accordance with the obtained transmission characteristic, and the material portion (4) is provided to the heat radiating plate 70 provided in the same, so that it can be prevented. Induction heating of metal such as heat release plate 7〇

Below the leakage flux preventing member M, the heat releasing plate 70 is carried out via the insulating double-sided tape. The heat release plate 7 has a task of radiating heat generated by the planar coil %. The material of the heat radiating plate 70 is not particularly limited as long as it is a material having high thermal conductivity, and a metal such as A1 (Ming) can be applied. Further, since the heat radiating plate 70 is k, the magnetic member and the leakage flux preventing member (4) are in contact with the planar coil 3', so that the heat generated in the planar coil 30 can be released. The plane size of the heat radiating plate 7G is substantially equal to the leakage flux preventing member ^ U I /, and the heat radiating plate 70 is set to be thicker than the leakage flux preventing member 54. By making the plane size substantially @, the leakage flux preventing member 54 can surely capture the magnetic flux. Further, when the heat releasing plate is made thicker than the leakage flux preventing member 54, the heat release property of the heat radiating plate 70 can be further improved. Since the leakage flux preventing member 54 is insulated from the heat radiating plate 7〇 by the insulating double-sided tape 6〇, the heat radiating plate 7〇 does not affect the transmission steepness, that is, when the insulation is not so, the heat releasing plate 70 is also It will take on the task of the leakage flux preventing member 54 to affect the transmission characteristics. However, when the insulating double-sided tape 60 is provided and electrically insulated, the leakage flux preventing member can be made "with 128611.doc -14- 200845531 The heat release plate 70 is attached to the printed circuit board 8 via the double-sided adhesive tape. The printed circuit board 8 is mounted with mounting components (4), and a conductive pattern connecting the mounting component 82b and the planar coil 3 () is formed. For example, when the charger side is used as an example, the mounting part 82b can be exemplified by the Japanese special, and (10) the heat-removing plate 7 of the Η 之 确实 确实 确实 〇 〇 〇 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 As a result, according to the present embodiment, the degree of freedom of the material of the heat radiating plate 70 can be improved. The insulating double-sided tape 6G can be applied to the adhesive tape.

When the capacitors C1 and C2' described in the first embodiment are taken as an example of the charger side, capacitors C3 and C4 of the same drawing can be cited. Such capacitors are formed, for example, by thin film capacitors. On the back surface of the printed circuit board 80 (which is different from the surface on which the heat radiating plate 7 is mounted), a temperature sensing element 86 such as a thermistor for detecting the temperature of the planar coil 3 is mounted. Even if foreign matter or the like enters to abnormally increase the temperature of the coil, the temperature detecting element 86 can detect the abnormality. The temperature detecting element "detects the abnormal temperature of the planar coil 30, and can perform the control of stopping the transmission. Instead of the temperature detecting element 86, depending on the temperature of the heat radiating plate 7, the temperature is blocked when the temperature is higher than a specific value. An element that energizes the planar coil 3〇. As such a component, a fuse element that can be blown at a high temperature and a thermistor that suppresses or blocks a current when the resistance value increases due to a high temperature can be used. As described above, the heat radiating plate 70 is interposed between the planar coil 3〇 and the printed circuit board 80. Therefore, as shown in FIG. 3, the planar coil 3 〇 is configured to easily set the upper position A1 of the planar coil 30 to be at least one mounting part. In the case of 128611.doc -15- 200845531, the maximum height A2 is approximately equal to the thickness portion of the heat release plate 70. Thus, the upper position A1 of the planar coil 30 is set to be higher than the maximum height A2 of at least one of the mounted parts. In this case, the assembly of the module can be facilitated. Further, the upper surface of the planar coil 30 can be brought closer to the coil unit on the other side. Next, the outer casing 14 and the coil single will be described using FIG. The outer casing 14 has a hole portion 14c on a surface facing the planar coil 30. The hole portion 14c is covered by the protective cover 16. The outer casing 14 is at the maximum height position from the mounting member 82b. The reinforcing portion 14b is formed at the position of the opposing portion, and the thickness H3 of the reinforcing portion 14b is formed thicker than the thickness H4 of the protective cover 16. When the protective cover 16 is thinned and the reinforcing portion 14b is thickened, the transport distance can be shortened, and the reinforcing portion can be used to protect other components. Further, when the reinforcing portion 14b is provided, the recess of the outer casing 14 on the mounting member 82b can be suppressed, and the outer surface of the outer surface of the conveying surface can be flattened. The height from the circuit substrate to the outer surface of the protective cover is H1, when the maximum height of the mounting component 82b based on the printed circuit board 80 is H2, and the thickness of the reinforcing portion is H3, H1>H2+H3 can be obtained. When this is set, it can be between the mounting part 82b and the reinforcing portion 14b. The space is secured, and the damage of the mounting member 82b can be suppressed. As shown in Fig. 2, the printed circuit board 80 is provided with a positioning hole portion 82a on the side surface of the region where the planar coil 3 is mounted. Description of the shape of the coil unit (Manufacturing Method) Next, a method of manufacturing a coil unit will be described with reference to Fig. 5 to Fig. 1 128 128611.doc -16- 200845531 An example of manufacturing a coil unit using the assembly jig 9 shown in Fig. 5. The tool 90 is provided with a recessed portion 92'. The recessed portion 92 accommodates the constituent material of the coil unit. Further, the assembly and the jig 90 are provided with a positioning projection portion %.

First, as shown in FIG. 6 and FIG. 7, the recessed portion % of the jig 9 is assembled, and the spacer member 40, the planar coil 3, the magnetic member, the leakage flux preventing member 54, and the insulating double-sided are sequentially accommodated. The belt 6 〇, the heat release plate, and the double-sided tape 84. Next, as shown in Figs. 8 and 9, the printed circuit board 80 and the assembly jig 9 are stacked on the concave portion of the assembly jig. In the meantime, the projections 94 of the assembly jig 9G are inserted into the positioning hole portions 82a of the printed circuit board 8A. This makes it easy to position. After the mounting, the assembly jig is removed. As shown in FIG. 10, the constituent member accommodated in the assembly jig 9G is attached to the printed circuit board 8A via the double-sided adhesive tape 84. (Application examples of the electronic device)

This embodiment is applicable to all electronic devices that perform power transmission and signal transmission, for example, for wristwatches, electric toothbrushes, electric to razor, wireless telephones, personal mobile phones, portable personal computers, and pDA (Personal Digital) Assistants, personal digital assistants, electric vehicles, etc., rechargeable devices with secondary batteries, and charging devices that charge them. Further, as described above, the present embodiment has been described in detail, and various modifications can be readily made by those skilled in the art without departing from the scope of the invention. Therefore, such modifications are all included in the scope of the present invention. For example, in a patent specification or schema, at least one term that is simultaneously stated in a different term than the broader one may also be replaced by the patent specification or any of the figures 128611.doc • 17- 200845531. term. This embodiment relates to contactless power transmission, but is equally applicable to contactless power transmission using the principle of electromagnetic induction. In the above description, the present invention is applied to both the coil unit on the charging device side and the coil unit on the charged device side, but it may be applied to only one of them. [Simple description of the map]

Fig. 1 is a view schematically showing a charger and a charger. Fig. 2 is a schematic exploded view of the coil unit. 3 is a cross-sectional schematic view of a coil unit taken along line AA of FIG. 2. FIG. 4 is a schematic diagram showing a charger of a coil unit or a partial sectional view of a charger. FIG. Schematic diagram showing the process of the coil unit

Fig. 7 is a schematic view showing the process of the coil unit. Fig. 8 is a schematic view showing the process of the coil unit. Fig. 9 is a schematic view showing the process of the coil unit. Fig. 10 is a schematic diagram showing the process of the coil|element. Main component symbol description], σ 10 12 14 14a 14b Charger 1 coil unit exterior body hole portion reinforcement portion 128611.doc 200845531 16 Protective cover 20 by charger 22 second coil unit 30 planar coil 40 spacer member 50 attached Shielding magnetic member 52 magnetic member 54 60 70 80 82a 82b 84 86 90 92 94

Leakage flux prevention member Insulating double-sided tape Heat release plate Circuit board Positioning hole Mounting parts Double-sided tape Temperature detecting element Assembly jig Recession Positioning projection 128611.doc -19-

Claims (1)

200845531 X. Patent application scope: 1. A coil unit, comprising: a planar coil; a magnetic I* raw member, which is disposed under the planar coil; and a leakage flux preventing member, which is disposed in the foregoing a lower portion of the magnetic member; and a heat releasing plate disposed under the leakage flux preventing member and electrically insulating the leakage flux preventing member from the heat radiating plate. 2. The coil unit of claim 1, wherein: the leakage flux preventing member and the heat radiating plate are insulated by a double-sided tape. The coil unit of claim 1 or 2, further comprising: a printed circuit board on which the heat radiation plate is mounted and formed with a conductive pattern connected to the planar coil. 4. The coil unit of claim 3, wherein at least one mounting part of the niece is mounted on the printed circuit board on the surface on which the heat radiating plate is mounted; _W the upper position of the planar coil is set higher than the foregoing The maximum height of at least one mounting part. _ 5. The coil unit of claim 4, wherein A of the at least one mounting part, the part having the largest height is connected to the capacitor part of the planar coil. The coil unit according to any one of claims 3 to 5, wherein a temperature detecting element 128611 for detecting a temperature of the heat radiating plate is mounted on a surface of the printed circuit board different from a surface on which the heat radiating plate is mounted. The coil unit according to any one of claims 3 to 5, wherein a surface of the printed circuit board different from a surface on which the heat radiating plate is mounted is mounted with a temperature according to a temperature of the heat radiating plate coil An element that supplies power to the aforementioned planar coil. The coil unit according to any one of claims 3 to 7, wherein the printed circuit board is provided with a positioning portion for guiding the assembly jig, and the assembly jig receives the heat radiation plate and the leakage flux The member, the magnetic member, and the planar coil described above. 9. The coil unit according to any one of claims 1 to 8, wherein a spacer member is disposed on the upper surface of the magnetic member; the spacer member includes a hole portion for accommodating the planar coil, and the upper surface of the planar coil is as described above The upper surfaces of the spacer members are substantially the same plane. The coil unit according to any one of claims 1 to 9, wherein the leakage flux preventing member and the heat radiating plate have substantially the same planar size and the two heat releasing members are thicker than the leakage flux preventing member. An electronic device, comprising: the coil unit according to any one of the claims (1), and an electronic device that houses the outer casing of the coil unit; the outer casing system is opposite to the planar coil a hole portion is provided, and the hole portion is covered by the protective cover; and a reinforcing portion is formed at a position opposite to a maximum height position of the outer casing and the at least one mounting member, and the thickness of the reinforcing portion is 128611.doc 200845531 is thicker than the thickness of the protective cover; the height from the printed circuit board to the outer surface of the protective cover is H1, and the maximum height of the at least one mounting component based on the printed circuit board is H2, and the reinforcing portion is When the thickness is H3, H1>H2+H3. A method for manufacturing a coil unit, which is characterized by the method of manufacturing a coil unit according to any one of claims 3 to 8, and comprising: step (A), which is in a housing portion of the assembly fixture, in order The planar coil, the magnetic member, and the leakage flux preventing member are housed; and the step (B) is performed after the step (A) is electrically insulated from the leakage flux preventing member. The plate is housed in the valley receiving portion, and in a step, after the step (B), the assembly jig is combined with the printed circuit board on the side of the accommodating portion of the assembly jig, and the rain is planar The coil, the magnetic member, the leakage flux preventing member, and the heat radiation plate are mounted on the printed circuit board. The method of manufacturing the coil unit of claim 12, wherein between the step (A) and the step (B), the method includes: a step of accommodating the leakage flux preventing member from the heat radiating plate The above-mentioned insulating double-sided tape is used. The method of manufacturing a coil unit according to claim 12 or 13, wherein before the step (A), the step of accommodating the spacer member in the accommodating portion is included. The method of manufacturing a coil unit according to any one of claims 12 to 11, wherein the printed circuit board includes a positioning portion, and the assembly fixture includes a positioning portion corresponding to the printed circuit board. Position the guide bow I. A coil unit comprising: a coil; a magnetic member into which the first magnetic flux generated by the coil is incident; &lt; the magnetic member according to the foregoing! a leakage flux preventing member that is incident on the second magnetic flux generated by the magnetic flux; and a heat release plate that radiates heat generated by the coil; and the leakage flux preventing member is electrically insulated from the heat radiation plate. 17. An electronic machine characterized by comprising a coil unit as claimed in claim 16. 128611.doc