200841943 九、發明說明： ^ 【發明所屬之技術領域】 本發明係有關一種積體電路(ic)測試插座之測試介面的清潔機構及清 潔方法’尤指-種具自動清潔功能之IC測試插座之測試介面的清潔機構及 清潔方法。 【先前技術】 馨半導體製造的最後試’舣製程可分餘步戦與最終 測m要目齡了發辭導體元件的贼之外，也將依祕劃分半導 體元件的等級。在職半導體元件例如晶片的過財，職介面，例如探 針，會與半導體元件上的接腳，例如焊塾（pad)或錫球（s〇lderbaii)，進 行電性接觸，藉關試辨導體元件之細電性能，以及評估其功能是否 正常。 圖1所示爲-般用來测試BGA (Ball Grid Array,球柵陣列封裝）型式 • 之晶片特性的一晶片針測機系統，其包含晶片測試分類機（Handler) 6、晶 片承載裝置及測試機台之測試頭（TesterHead) 7。晶片測試分類機6位於 測式頭7上方’而晶片承载裝置安裝於測試頭7上。該晶片承載裝置包含 有-測試電路板(LoadBoard)8與一測試基座（s〇cket⑽或d〇㈣肠) 9。該測試基座9麟收容一對應測試插座（如如，未示於圖仆該測試 插座，係爲連接制晶片10之錫球1〇1舆測試頭7上的訊號傳送接點的一 轉換介面，其内設有複數個伸縮設計之探針（p〇g〇pin，未示於圖中），用以 與收容輯在其_待職1G底部之錫球⑼進行電接觸。該測試電路 5 200841943200841943 IX. INSTRUCTIONS: ^ Technical Field of the Invention The present invention relates to a cleaning mechanism and a cleaning method for a test interface of an integrated circuit (ic) test socket, in particular, an IC test socket having an automatic cleaning function. Test interface cleaning mechanism and cleaning method. [Prior Art] The final test of the manufacturing process of Xin Semiconductor can divide the level of the semiconductor component according to the secret of the thief who has the final measurement and the final measurement of the conductor component. In-service semiconductor components such as wafers, the interface, such as the probe, will be in electrical contact with pins on the semiconductor component, such as pads or solder balls, and the conductors will be tested. The fine electrical performance of the component and the evaluation of its function. Figure 1 shows a wafer probe system for testing the wafer characteristics of a BGA (Ball Grid Array) type, including a wafer test classifier (Handler) 6, a wafer carrier and Test head of the test machine (TesterHead) 7. The wafer test sorter 6 is located above the test head 7 and the wafer carrier is mounted on the test head 7. The wafer carrier includes a test board (LoadBoard) 8 and a test pedestal (scket (10) or d (four) intestine) 9. The test pedestal 9 receives a corresponding test socket (for example, not shown in the test socket), which is a conversion interface for connecting the signal transmission contacts on the test head 7 of the solder ball of the wafer 10. There are a plurality of telescopic design probes (not shown in the figure) for making electrical contact with the solder balls (9) at the bottom of the standby 1G. The test circuit 5 200841943
板8藉由該職插舶之探針與_“ 1G進行電連接，明試該晶片 1〇之性能是否正常。該分類機6具有一吸持裝置61，其一端連接_機域臂 (未不於财），另-端設有—真空吸嘴62可吸取—制晶“。該分類 機6之作業流程’依序爲將待渴】晶片1〇自待測區移至測試機台之測試區 内’再利用其上之吸持裝置61將待測“ 1()吸取且移動至戦區内之測 式插座内進行測5式。另，該測試基座9設於測試電路板$之上方，其上對 應吸持裝置61之定佩63財定轉％。#該吸絲置61錄待測晶 片1〇至該測試電路板8作測試時，其上之定位孔63可與該等定位㈣接 合，藉以達成定位。 惟，由於待測晶片10底面之錫球1〇1是由金屬材料所製成，因此，备 該錫球1〇1暴露于空氣中時，易產生氧化。另，在一些製造過程中的有I 材料亦可能沈積在錫球1G1上。因此，在重_過程中，探針尖端在反 =觸㈣丨後，金屬氧化物及其它在錫球ι〇ι上的材料會堆積在探針 ♦當㈣咖—繼時，會纖_娜，使得測試結 果變得不準確，進轉_戦之舞度與職良率。賊，探針在使用 二=:必須要進行清除其針尖表面之殘屑的工作，以維持其良好狀 悲。右探針纖污損得較繼，有時甚至還需更換整個測試插座。 1 針之清潔方法—般是_刷子紅具人工清潔。此種方法需將測試 頭W機6分離後再拆除職基座9，如此找將職插絲下來進 ==蝴_祕纖6_撕。__ 又萬反向錢上述動作，錄完成産品設定之動作，如此將 6 200841943 頓-段時間。若4新設定後’仍未能解決問題，則可能需再―:欠曹… 之動作，甚至第三次’不僅浪費時間與人力，亦嚴重影響測試效率上 綜上所述’習用之人工清潔測試介面之方式存在以下四方面之缺 1.清潔時機：完全錢人_斷，故秘及時清觀轉之八 面’導致職結料不良品數提高，械亦提高其細率，細降== 效率；The board 8 is electrically connected to the _"1G by the probe of the job, and it is tested whether the performance of the wafer is normal. The sorter 6 has a holding device 61, one end of which is connected to the _ machine arm (not Not for the money), the other end is provided - the vacuum nozzle 62 can be sucked - crystallized. The operation flow of the sorter 6 is to sequentially move the wafer 1 from the area to be tested to the test area of the test machine, and the suction device 61 on which the sample is taken is used to absorb the sample 1() Move to the test socket in the 戦 area to test type 5. In addition, the test pedestal 9 is placed above the test circuit board $, and the corresponding holding device 61 of the holding device 61 is fixed by 63%. When the wire is placed on the test chip 8 to the test circuit board 8 for testing, the positioning hole 63 thereon can be engaged with the positioning (4) to achieve positioning. However, due to the solder ball on the bottom surface of the wafer 10 to be tested 1 is made of a metal material, so that when the solder ball 1〇1 is exposed to the air, oxidation is apt to occur. In addition, some materials may be deposited on the solder ball 1G1 in some manufacturing processes. In the process of heavy _, after the tip of the probe is in the opposite direction, the metal oxide and other materials on the solder ball will accumulate on the probe ♦ when the (four) coffee is continued, The test results become inaccurate, and the _ 戦 戦 dance and job rate. Thieves, probes in use two =: must be cleared to their tip table The work of the debris on the surface to maintain its good shape. The right probe fiber loss is more frequent, and sometimes even the entire test socket needs to be replaced. 1 needle cleaning method - generally _ brush red with manual cleaning. The method needs to separate the test head W machine 6 and then dismantle the job base 9, so find the job to insert the wire down into the == butterfly _ secret fiber 6_ tear. __ 10,000 reverse money above the action, record the completion of the product set action So, this will be 6 200841943 for a period of time. If the 4 new settings are still unable to solve the problem, then you may need to again: the action of owing Cao... even the third time is not only a waste of time and manpower, but also seriously affects the test efficiency. In the above summary, there are four shortcomings in the way of the manual cleaning test interface. 1. The timing of cleaning: the complete money person _ broken, so the secret in time to clear the view of the eight sides, leading to an increase in the number of defective products. Machinery also increases its fineness, fine drop == efficiency;
2.清潔方法：人讀行清潔之動作，其清潔品質參差不齊，且清潔時· 分離測試頭與分類機，浪費人力、_，增加_者之機台_=二 低測試效率； ' ^ 3.測試良率及效率··因無自動化功能，完全需依賴人工執行判斷與清潔 之動作，故造成職良率不穩定之現象，良轉異增大，重測率提高，測 試效率下降； 式/丨Φ之使用壽中·人工清潔之方式由於清潔時機不易把握及清潔 品質參差不齊，故會影_戦介蚊使用壽命。 故有鐾於上述缺失，有必要提供一種具自動清潔功能之測試介面的 清潔機構及清潔方法。 【發明内容】 本發明之主要目的在於提供一種利用一清潔元件清潔IC測試插座之測 5式介面的自動清潔機構，其結構簡單、操作簡便，<達成對測試介面之自 動、及時、高效之清潔。 本發明之另一目的在於提供一種利用一清潔元件清潔IC測試插座之測 7 200841943 试>/丨面的自動’H /糸方法，藉以達成對測試介面之自動、及時、高效之清淳， 以降低重測率，提高測試效率’並延長測試介面之使用壽命。 依據本發明之主要目的而提供之積體電路(IC)測試插座之測試介面的 自動清潔機構，係使用賴機祕，該自動清潔機構包含： 一清潔兀件夾持裝置，係可移動地設置於IC測試插座之上方，該夹持 裝置具有一面向1C測試插座之底面；以及 一清潔元件，係可分離地依附職鱗裝置之底面，該清潔元件的形 狀與1C _式插座的用於承載IC之收容部的形狀相匹配； 其中’藉由該夾持裝置相對1(3職插座之移動，依附於其底面之該清 泳元件可達成對1C測試触Uj試介s的自動清潔功能。 依據本發_較佳實施例，其中，該清航件係由一本體與_清潔片 所組成’該清潔片黏貼於該本體之底面。該清紅件之本體的形狀係與待 mC的形狀相同’其係—仿真積體電路（dummy 1C)。該清潔元件存放於 K：測試機祕之測舰旁__存放緩_内。該清刻可爲—砂紙或水 砂紙。 依據本發明的較佳實施例，其中，該夾持裝置係可相對ic測試插座作 垂直及彳κ向運動’其係―麟晶㈣試分峨的；吸持裝置，藉由真空 吸力吸持該清潔树。該夾持裝置包含-本體及設於本體_-_= 本體設有定位孔，用來與收容IC測試插座之測試基座的定位銷相结合。 依據本發3_瓣_，射，較獅紅職細爲複數個 探針。 發月之3目的而提供之1C $則試插座之測試介面的自動清潔方 8 200841943 法，係使用於一ic測試機系統，該自動清潔方法包含下列步驟： 提供-清潔元件夾持裝置，將其設置於1(：測試插座之上方，該夹持穿 置具有一面向1C測試插座之底面； 提供-清航件，其形狀與IC測試插座_於承載IC之收容部的形 狀相匹配； 將該清潔元件可分離地依附於該夾持裝置之底面；以及 使該夾持裝置相肖!C渴]試插座移動，藉此使依附於其底面之該清潔元 件可達成對1C測試插座之測試介面的自動清潔功能。 依據本發明驗佳實補，其巾，該提供—清潔元件之步驟包含提供 -本體與-清潔片，並黏貼該清潔片於該本體之底面。該清潔元件之本體 的形狀係與待測IC的形狀相同，其係一仿真積體電路刪㈣）。該清 潔元件存胁1C職齡狀職轉邊的―存魏衝㈣。 m 依據本發明的較佳實施例，其中，該夹持裝置係可相對IC測試插座作 垂直及橫向運動。該夾持裝置係-用於晶片職分類機的晶片吸持裝置， 其藉由真空吸力吸持該清潔元件 依據本發明陳佳實補，其中，該提供—續裝置之轉包含提供 -本體以及於該本體内設置-吸嘴。該本體設有定位孔，用來與收容IC測 試插座之測試基座的定位銷相結合。 與習知技術相比，本發明之IC測試插座之測試介面的自動清潔方式藉 由對測試機台之自動設定，可及時清潔已污損之職介面，更具時效性與 便利性，且清潔品質較均句，清潔時無須分離測試猶分類機。藉由機台 之該自動清潔魏，可提高職良率及職效率，並可延長測試介面之使 9 200841943 用壽命 實施方式】 本發明之積II雷效< 、 （C)測試插座之測試介面的自動清潔機構及清潔 方法係可適用於一 τ / 、 、 硎試機系統，例如圖1所示之晶片針測機系統。 述 Θ ”圖3顯不本發明Ic測試插座之測試介面的自動清潔機構（以下 簡稱自動清潔機構所示之晶片針測齡統的實施例示意圖， 圖爲刀解圖，而圖3爲圖2之組合圖。如圖2與圖3所示，本發明 自動清潔機觀含1潔元件夹難置〗及—清潔元件2。該清潔元件爽 持裝置1料籍由機械臂可移動地設置於1C測試插座3之上方，其係1 持裝置，藉由真空吸力吸持該清潔元件2。該夹持裝置丨包含—本體^及 設於她！内的-物2。該本體n峨有—空氣管路13至該吸嘴 12猎由t时路13提供吸氣，形成吸取清潔元件2的吸力，以將清潔 兀件2及附於其底面14。該本體u外緣更财複數個定位孔Μ，用來與 收容忙測試插座3之測試基座4上的對應定位銷Μ相結合，以使晶岣 測機系統之峨姉輸者爾_，崎则晶片測試作 業。由於料潔元倾縣置丨其結觀控糖作式與習知晶片針鄉 機糸統之分類機的晶片吸取裝置（夹具）基本相同，故在此不再進—步寶 該清潔元件2爲-獨立元件，係可分離地依附於該夹持裝置1之底面 14，以進行_試插座3⑽測試介面，即探針$ _驗作。該清、絮元 件2可存放於IC職機祕之戦區旁相_存錢衝_，以^持裝 200841943 置1之吸取及使用後之存放。該清潔元件2的雜與測試插座3用於承載 制1C之收容部31的形狀她配。該清潔元件2係由—本體21與一清潔 片22所組成，該清潔片22黏貼於該本體21之底面η。該清潔元件2之本 鱧21的形狀係與待測IC的形狀相同，其係一不包含晶片之仿真積體電路 (dummy 1C)’其結構亦包括一電路板24及自電路板％凸伸出的一封膠 體25。該仿真積體電路通常係用於在新購測試設備、新製測試冶具、新封 裝薇1C第-次上線等情形時，使該等仿真積體電路在測試機構上不斷空 跑，以作〗am Rate崎細試，使實關試時發生堵塞的情況降至最低， 進而避免&成ic外觀不良或損壞^該清潔片η係可爲—砂紙或水砂紙， 如圖6中所不，其包含多層結構，其中之一爲緩衝層η，其底部以植砂技術 植有許多用以研磨探針5之細小砂粒您。該清潔片22可由市面講得，如日 本NHK、美國3M公司製造之精密清潔片。 圖4及圖5所示爲本發明自動清潔機_對測墙座3内的探針5的動作方 式示意圖。其清潔作業流程依序爲:將清潔元件2自存放緩衝區移至測試機 台之測試_，由清航倾縣置1將清潔元件2吸取且移動至測 试區内之取插座3内，以_清潔元件2底面之清烈^對測試插座3 内的探針5進仃清潔之動作。在清潔片a與探針$接觸前，爽持裝置1本 體11上所叹之疋位孔ls與測試基座*上之定位銷μ對應接合，藉以達成 疋位在預叹之席潔動作與次數完成後，夹持裝置^將清潔元件2放回 放緩衝區内，以供下次使用或直接檢棄。 本發明自動清潔機構之夹持裝置i係可吸取帶動清潔元件$底面之清潔 200841943 片22相對設置於測試插座3内的探針5以預設之次數與她乍垂直及橫向 運動’以清潔針尖Μ。該清潔元件夾持裝置i的該等預設之垂直及 動可藉由_调^之_達^本發明_雜構之清潔時機可 由操作者自行蚊，或設定機台在已進行m測試次數後自動執行 清潔，亦或設定機台在晶片測試良率下降一特定百分點後自動執行清潔。 圖6細部顯示了清潔元件2底面之清潔片22研磨探針5夹端51之動 作示意圖。如圖6中箭頭所示，清潔片22在夹持裝置i之帶動下，可以預 設次數與利用其底部砂粒222·表面絲針5失端Μ表面接觸而磨 鲈達成自動清潔針尖51表面殘屑之效果1清潔片22之垂直運動可研磨 針A 51表面，而其微小之橫肖運動則可平滑針尖&表面。 圖7所不爲本發明IC戦插座之測試介面的自動清潔方法的流程圖， 其包含下列步驟: ⑴提供-清潔元件夹持裝置5將其設置於IC賴插座之上方，該爽 持裝置具有一面向1C測試插座之底面； (2)提供-清潔元件，其形狀與IC測試插座_於承餅測ic之收容 部的形狀相匹配； ⑶將該清潔元件可分離地_於該夾持裝置之底面；以及 ⑷使該緒裝置姆IC職插座飾，藉此餘_其底面之該清 珠7G件可達麟IC峨插紅職介面的自麟潔功能。 、主其中，該提供一清潔元件之步驟包含提供一本體與-清潔片，並黏貼 該’月W於該本體L該清潔元件之本體的形狀係與待測1C的形狀相 同，其係一仿真積體電路。該清潔元件可存放於ic測試機系統之測試區旁邊 12 200841943 的一存放緩衝區内。 該夾持裝置係可相對測試插座作垂直及橫向運動。該失持裝置係一吸 • 持裝置，藉由真空吸力吸持該清潔元件。在車交佳實施例中，該夾持裝置係一 晶片測試分類機上的晶片吸持裝置。 上述提供一夾持裝置之步驟包含提供一本體以及於本體内設置一吸 嘴。該本體設有定位孔，用來與收容IC職插座之測試基座的定位麟相結 合0 參 1 如上所述，本發明提供之自動清潔機構及清潔方法，可達成對測試插 座之測試介面的自動、及時、高效之清潔。該自動清潔機構構造簡單、操 作簡便，其清潔元件夾持裝置i爲現有IC測試I系統之分類機的一部分， 原係僅用來夹持欲測試之IC，而在本發明中，更可用來夹持一清潔元件， 以藉由清潔元件上之清潔片的材質特性與磨擦力量來達成在線自動清潔IC 測試介面之目的，故本發明充分利用了既有之資源，實施容易，極具便利 • I藉由本發明之在線自動清潔方式，職插座不紐生產線上移出即可 進订π政動作，可減> 生絲停财間，同時亦可延長測齡面之使用 y相車乂於驾用之人工清潔方式，本發明之自綺潔方式具有以 下四方面之優點： 1·清潔時機:不依主觀人爲剎磨 爲〗辦’而猎由測試機台之自動設定，故能及 時清潔已污損之測試介面，更呈眸 ^ /、蚪放性與便利性，可降低重測率，進而提 高測試效率； 13 200841943 2·清潔方法：藉由機台依設定自動執行清潔之動作，其清潔品質較均 勻，且清潔時無須分離測試頭與分類機，可節省人力、時間，提高測試致 率； 3·測試良率及效率：因機台具有依設定自動清潔之功能，故能及時有致 地進行清潔之動作，故測試良率較穩定，良率差異較小，重測率下降，夠 試效率提高； 、^1Μ面之使用令命·機台自動清潔之方式由於清潔時機把握較好 及清潔品質較均勻，故可延長測試介面之使用壽命。 需說明的是，本發明之自動清潔機構及清潔方法可適用於各類1C測試 機系統的各式分_，如 Handler，Gmvity Handler等，而不限於所揭 厂、貝％例q潔元件與夾持裝置之依附方式並不限於真空吸取之方式， 且測試介面亦不限於探針介面。目此，本發明具有普遍之適用性。 綜上所述，本發明確已符合發明專利之要件，爰依法提出專利申請。 惟’以上所述者顧本發日狀較佳實施方式，舉簡f本案技術之人士援 依本發明之精神所作之等效修飾紐化，皆涵錄後附之中請專利範圍内。 【圖式簡單說明】 圖1顯示一習知的晶片針測機系統之侧視圖。 圖2顯示本發明自動清潔機構應用於圖1所示之晶片針測機纽的實施例 分解示意圖。 14 200841943 圖3顯示圖2實施例之組合圖。 圖4及圖5顯示本發明自動清潔機#4目對測試插座内的探針的動作方式示意圖。 圖6細部顯示了清潔元件底面之清潔片研磨探針尖端之動作示意圖。 圖7顯示本發明自動清潔方法之流程圖。2. Cleaning method: people read the cleaning action, the cleaning quality is uneven, and when cleaning · Separating the test head and the sorting machine, waste manpower, _, increase the machine__= two low test efficiency; ' ^ 3. Test yield and efficiency··Because there is no automation function, it is completely dependent on manual execution judgment and cleaning action, which causes the phenomenon of unstable job rate, the improvement of good turn, the increase of retest rate and the decrease of test efficiency; The use of the type / 丨 Φ in the middle of the life · manual cleaning method because the cleaning time is difficult to grasp and the quality of the cleaning is uneven, it will shadow 戦 戦 使用寿命 使用寿命 lifetime. Therefore, in view of the above-mentioned deficiencies, it is necessary to provide a cleaning mechanism and a cleaning method for a test interface having an automatic cleaning function. SUMMARY OF THE INVENTION The main object of the present invention is to provide an automatic cleaning mechanism for cleaning a 5-type interface of an IC test socket by using a cleaning element, which has a simple structure and simple operation, and achieves automatic, timely and efficient testing of the test interface. clean. Another object of the present invention is to provide an automatic 'H / 糸 method for cleaning an IC test socket using a cleaning element to test the automatic, timely and efficient cleaning of the test interface. In order to reduce the retest rate, improve the test efficiency 'and extend the service life of the test interface. An automatic cleaning mechanism for a test interface of an integrated circuit (IC) test socket provided in accordance with the main object of the present invention is a machine cleaning device comprising: a cleaning device clamping device movably disposed Above the IC test socket, the clamping device has a bottom surface facing the 1C test socket; and a cleaning element detachably attached to the bottom surface of the scale device, the shape of the cleaning element and the 1C _ socket for carrying The shape of the accommodating portion of the IC is matched; wherein 'by the clamping device relative to 1 (the movement of the 3rd socket, the cleaning element attached to the bottom surface thereof can achieve the automatic cleaning function for the 1C test touch Uj. According to the present invention, the clearing member is composed of a body and a cleaning sheet. The cleaning sheet is adhered to the bottom surface of the body. The shape of the body of the red-red member is related to the shape of the mC. The same 'the system - the simulation integrated circuit (dummy 1C). The cleaning element is stored in the K: test machine secret ship __ storage slow _. The etch can be - sandpaper or water sandpaper. According to the invention Preferred embodiment, Wherein, the clamping device is capable of performing vertical and 彳κ-direction movements relative to the ic test socket, and the holding device is capable of holding the cleaning tree by vacuum suction. The clamping device comprises - The body and the body are provided _-_= The body is provided with a positioning hole for combining with the positioning pin of the test base for accommodating the IC test socket. According to the present invention, the 3_ _ _, shot, the lion red job is plural The probe is used for the automatic cleaning of the test interface of the test socket. The 200841943 method is used in an ic tester system. The automatic cleaning method comprises the following steps: Providing - cleaning component clip Holding the device, set it to 1 (: above the test socket, the clamping through has a bottom surface facing the 1C test socket; providing - clearing device, its shape and IC test socket - the shape of the receiving portion of the carrying IC Matching; the cleaning element is detachably attached to the bottom surface of the clamping device; and the clamping device is moved to the test socket, thereby enabling the cleaning component attached to the bottom surface thereof to achieve 1C Automatic cleaning of the test interface of the test socket According to the invention, the step of providing the cleaning element comprises providing a body and a cleaning sheet and adhering the cleaning sheet to the bottom surface of the body. The shape of the body of the cleaning element is The shape of the test IC is the same, which is a simulated integrated circuit (4). The cleaning element protects the 1C-aged-level employee's "Chang Wei Chong (4). m According to a preferred embodiment of the present invention, wherein the clip The holding device is capable of vertical and lateral movement with respect to the IC test socket. The clamping device is a wafer holding device for a wafer job sorter, which is held by vacuum suction according to the present invention, wherein The providing-continuing device includes a providing body and a nozzle disposed in the body. The body is provided with a positioning hole for combining with a positioning pin of the test base for housing the IC test socket. Compared with the prior art, the automatic cleaning method of the test interface of the IC test socket of the present invention can automatically clean the defaced job interface, and is more timely and convenient, and cleaned by automatically setting the test machine. The quality is more uniform, and there is no need to separate and test the sorting machine when cleaning. With the automatic cleaning of the machine, the job rate and job efficiency can be improved, and the test interface can be extended. 9 200841943 Lifetime implementation method] The product II lightning efficiency of the invention <, (C) test socket test The interface automatic cleaning mechanism and cleaning method can be applied to a τ / , 硎 test machine system, such as the wafer needle test system shown in FIG. Illustrated in Fig. 3 shows the automatic cleaning mechanism of the test interface of the Ic test socket of the present invention (hereinafter referred to as the embodiment of the wafer needle dating system shown by the automatic cleaning mechanism, the figure is the knife solution diagram, and the figure 3 is the diagram 2 As shown in FIG. 2 and FIG. 3, the automatic cleaning machine of the present invention comprises a cleaning element and a cleaning element 2. The cleaning element holding device 1 is movably disposed by a robot arm. Above the 1C test socket 3, it is a holding device for holding the cleaning element 2 by vacuum suction. The clamping device 丨 includes a body ^ and an object 2 disposed in her! The air line 13 to the nozzle 12 is provided with suction by the t-timer 13 to form a suction force for sucking the cleaning element 2 to attach the cleaning element 2 and to the bottom surface 14. The outer edge of the body u is more complex. The hole Μ is used to combine with the corresponding positioning pin on the test pedestal 4 of the busy test socket 3, so that the 岣 则 , , , 则 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片Dianxian County's wafer picking machine for its classification and sugar control The setting (clamp) is basically the same, so the cleaning element 2 is a separate component, which is detachably attached to the bottom surface 14 of the clamping device 1 for the test socket 3 (10) test interface, that is, The probe $ _ inspection. The cleaning and flocculation element 2 can be stored in the side of the IC job secret area _ save money _ _, hold the storage and use after the storage of 200841943. The cleaning element 2 The miscellaneous and test socket 3 is used to support the shape of the accommodating portion 31 of the 1C. The cleaning member 2 is composed of a body 21 and a cleaning sheet 22, and the cleaning sheet 22 is adhered to the bottom surface η of the body 21. The shape of the body 21 of the cleaning element 2 is the same as the shape of the IC to be tested, which is a dummy integrated circuit (dummy 1C) that does not include a wafer. The structure also includes a circuit board 24 and a self-distribution from the circuit board. A piece of colloid 25 is produced. The simulated integrated circuit is usually used to make the simulated integrated circuit on the testing mechanism when the newly purchased test equipment, the new test tool, the new package Wei 1C first-on-line, etc. Constantly running, to make the 〖am rate fine test, so that the situation of the blockage during the actual test The lowest, and then avoid & ic appearance is poor or damaged ^ The cleaning sheet η can be - sandpaper or water sandpaper, as shown in Figure 6, it contains a multi-layer structure, one of which is the buffer layer η, the bottom of which is planted The sand technology is planted with a lot of fine sand particles for grinding the probe 5. The cleaning sheet 22 can be said from the market, such as NHK Japan, the precision cleaning sheet manufactured by 3M Company of the United States. Figure 4 and Figure 5 show the automatic cleaning of the present invention. The machine_the schematic diagram of the action mode of the probe 5 in the wall socket 3. The cleaning operation process is in order: the cleaning component 2 is moved from the storage buffer to the test machine _, and the The cleaning element 2 is sucked and moved into the socket 3 in the test area, and the cleaning action of the probe 5 in the test socket 3 is cleaned by the cleaning of the bottom surface of the cleaning element 2. Before the cleaning piece a is in contact with the probe $, the clamping hole ls sighed on the body 11 of the holding device 1 is engaged with the positioning pin μ on the test base*, thereby achieving the squatting action in the pre-sighing After the number of times is completed, the clamping device 2 puts the cleaning element 2 into the playback buffer for the next use or direct discard. The clamping device i of the automatic cleaning mechanism of the present invention is capable of sucking and cleaning the cleaning element. The surface of the cleaning device 200841943 is opposite to the probe 5 disposed in the test socket 3 by a predetermined number of times to move vertically and laterally with her to clean the needle tip. Hey. The preset vertical and dynamic movement of the cleaning element holding device i can be performed by the operator by means of the cleaning time of the invention, or by setting the machine to perform m test times. After the cleaning is performed automatically, or the machine is set to automatically perform cleaning after the wafer test yield drops by a certain percentage point. The detail of Fig. 6 shows a schematic view of the operation of the cleaning piece 22 on the bottom surface of the cleaning member 2 to grind the probe end 51 of the probe 5. As shown by the arrow in Fig. 6, the cleaning sheet 22 can be driven by the holding device i for a predetermined number of times to be rubbed with the bottom surface of the surface of the surface of the surface of the surface of the wire 222. Effect of the swarf 1 The vertical movement of the cleaning sheet 22 can grind the surface of the needle A 51, and its slight transverse movement can smooth the tip & Figure 7 is a flow chart of the automatic cleaning method of the test interface of the IC 戦 socket of the present invention, which comprises the following steps: (1) providing - cleaning element holding device 5 is disposed above the IC cradle, the holding device has One facing the bottom surface of the 1C test socket; (2) providing a cleaning element having a shape that matches the shape of the IC test socket _ the accommodating portion of the hood; (3) the cleaning element is detachably _ The bottom surface; and (4) the emperor device IC outlet socket decoration, thereby the remaining _ the bottom of the bead 7G pieces can reach the Lin IC plug-in red interface of the self-Linjie function. The main step of providing a cleaning component comprises providing a body and a cleaning sheet, and attaching the same to the body L. The shape of the body of the cleaning component is the same as the shape of the 1C to be tested, and the simulation is performed. Integrated circuit. The cleaning element can be stored in a storage buffer next to the test area of the ic tester system 12 200841943. The clamping device is vertically and laterally movable relative to the test socket. The lost device is a suction device that holds the cleaning element by vacuum suction. In the preferred embodiment of the vehicle, the holding device is a wafer holding device on a wafer test sorter. The step of providing a clamping device includes providing a body and providing a nozzle in the body. The body is provided with a positioning hole for combining with the positioning lining of the test pedestal for accommodating the IC socket. As described above, the automatic cleaning mechanism and the cleaning method provided by the present invention can achieve the test interface of the test socket. Automatic, timely and efficient cleaning. The automatic cleaning mechanism is simple in structure and simple in operation, and the cleaning component clamping device i is a part of the classification machine of the existing IC test I system. The original system is only used to hold the IC to be tested, and in the present invention, it can be used in the present invention. By clamping a cleaning component, the purpose of the online automatic cleaning IC test interface is achieved by the material properties and frictional force of the cleaning sheet on the cleaning component, so the invention makes full use of the existing resources, is easy to implement, and is very convenient. I can use the online automatic cleaning method of the present invention to remove the π political action when the job outlet is not in the production line, and can reduce the weight of the raw silk, and also extend the use of the aging phase to drive the y phase. The self-cleaning method of the present invention has the following four advantages: 1. Cleaning timing: not subjectively manipulating for grinding, and hunting is automatically set by the testing machine, so it can be cleaned in time. The test interface of the damage is more 眸^, 蚪 性 and convenience, which can reduce the retest rate and improve the test efficiency. 13 200841943 2. Cleaning method: automatically clean by the machine according to the setting The action is more uniform in cleaning quality, and it is not necessary to separate the test head and the sorting machine during cleaning, which can save manpower, time and improve the test rate; 3. Test yield and efficiency: Because the machine has the function of automatic cleaning according to the setting, Therefore, the cleaning action can be carried out in a timely manner, so the test yield is relatively stable, the yield difference is small, the retest rate is decreased, and the test efficiency is improved; and the use of the surface of the machine is automatically cleaned by means of cleaning. The timing is better and the cleaning quality is more uniform, so the service life of the test interface can be extended. It should be noted that the automatic cleaning mechanism and the cleaning method of the present invention can be applied to various types of 1C test machine systems, such as Handler, Gmvity Handler, etc., and are not limited to the disclosed factory, and the The attachment means of the clamping device is not limited to the vacuum suction mode, and the test interface is not limited to the probe interface. Accordingly, the invention has general applicability. In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above-mentioned preferred embodiments of the present invention, and those skilled in the art of the present invention, in accordance with the spirit of the present invention, are equivalent to the scope of the patent. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 shows a side view of a conventional wafer probe system. Fig. 2 is a schematic exploded view showing the embodiment of the automatic cleaning mechanism of the present invention applied to the wafer needle measuring machine shown in Fig. 1. 14 200841943 Figure 3 shows a combined view of the embodiment of Figure 2. 4 and 5 are schematic views showing the operation mode of the probe in the test socket of the automatic cleaning machine #4 of the present invention. The detail of Figure 6 shows the action of the cleaning blade tip of the cleaning element on the underside of the cleaning element. Figure 7 is a flow chart showing the automatic cleaning method of the present invention.
【主要元件符號說明】 清潔元件夾持裝置 1 本體 11 > 61 吸嘴 12、62 空氣管路 13 底面 14 定位孔 15、63 清潔元件 2 本體 21 清潔片 22 緩衝層 221 砂粒 222 底面 23 電路板 24 封膠體 25 測試插座 3 收容部 31 測試基座 4、9 定位銷 4卜91 測試介面（探針） 5 針尖 51 分類機 6 吸持裝置 61 測試頭 7 測試電路板 8 待測晶片 14 錫球 101 15[Main component symbol description] Cleaning component holding device 1 body 11 > 61 suction nozzle 12, 62 air pipe 13 bottom surface 14 positioning hole 15, 63 cleaning element 2 body 21 cleaning sheet 22 buffer layer 221 sand 222 bottom surface 23 circuit board 24 Sealant 25 Test socket 3 Housing 31 Test base 4, 9 Locating pin 4 卜 91 Test interface (probe) 5 Tip 51 Sorter 6 Holding device 61 Test head 7 Test circuit board 8 Chip to be tested 14 Tin ball 101 15