200835972 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種光源模組，供一液晶顯示器之背光模 組使用。 【先前技術】 液晶顯示器（Liquid Crystal Display，LCD)廣泛應 用在電腦、電視、以及行動電話等各種電子產品上。背光 模組（backlight module)是液晶顯示器重要組成元件之 一。背光模組所使用之光源裴置，則直接影響背光模組之 效能與組裝成本。其中，發光二極體（Light Emitting200835972 IX. Description of the Invention: [Technical Field] The present invention relates to a light source module for use in a backlight module of a liquid crystal display. [Prior Art] Liquid crystal displays (LCDs) are widely used in various electronic products such as computers, televisions, and mobile phones. A backlight module is one of the important components of a liquid crystal display. The light source device used in the backlight module directly affects the performance and assembly cost of the backlight module. Among them, Light Emitting
Diodes，LED)由於體積小、耗能少，因此成為液晶顯示 裔使用的光源之一。 發光二極體的溫度過高時，容易發生亮度降低以及顏色 不均勻的狀況。因此，使用發光二極體作為液晶顯示器之 光源時’發光二極體產生之熱能之賴效率會對液晶顯示 裔之晝質造成影響。換言之，當發光二極體產生之熱能之 散熱效率較南時，液晶顯示器可具有較高之亮度及色彩均 勻度。 如圖1所不之習知技術，作為光源5〇〇之發光二極體係 設置於電路板100上。祕f路板⑽本身材質之導熱效 果較低，因此，對於光源500 i生之熱能之散熱效果較差。 5 200835972 習知技術中亦有使用鋁板貼附於電路板1〇〇，以利用鋁金 屬之熱良導性增加散熱效果的做法。然而此做法會增加材 料成本。以上所述以發光二極體作為背光模組之設計有改 進的空間。 【發明内容】 本發明之主要目的在於提供一種光源模組，可提高熱能 之散熱效率。 本發明之主要目的在於提供一種光源模組，可增加液晶 顯示器之亮度。 本發明之主要目的在於提供一種光源模組，可增加液晶 顯示器之顏色均勻度。 本發明之光源模組包含電路板、複數組訊號傳導層、複 數個光源、熱傳導層以及複數組熱導體。複數組訊號傳導 層具有導熱性，係設置於電路板上。電路板於訊號傳導層 之下方具有複數組貫穿孔。複數個光源係設置於與訊號傳 導層同側之電路板上。每—光源與相鄰光源之間各以訊號 傳導層電連接。其巾，複數組貫穿孔係分佈於電路板於複 數、、且光源下方以外之區間。熱傳導層係相對於訊號傳導層 =置於與複數組光源反側之電路板上。複數組熱導體，係 投置於訊號傳導層與熱傳導制之複數組貫穿孔中，且連 接訊號傳導層及熱傳導層。 光源包含發光二極體。_之間之電連接方式係為串聯 200835972 或並聯。而熱導體係包含以填充方式或以塗佈於複數組貫 穿孔内側方式設置於複數組貫穿孔中。 【實施方式】 本發明係提供一種光源模組。以較佳實施例而言，此光 源模組可配合直下式或侧光式液晶顯示裝置之背光模組 使用。然而在不同實施例中，此光源模組亦可供電腦鍵 盤、行動電話按鍵、看板及其他需要平面光源之裝置之背 光模組使用。在較佳實施例中，本發明之液晶顯示裝置係 包含一彩色液晶顯示裝置。然而在不同實施例中，本發明 之液晶裝置亦可包含單色之液晶顯示裝置。此外，液晶顯 示I置係泛指使用液晶面板之顯示裝置，包含家用的液晶 電視、個人桌上電腦及膝上型（筆記型）電腦之液晶監視 态、行動電話及數位相機之液晶顯示幕等。 •如圖2a所不之較佳實施例，本發明之光源模組8〇〇包 含電路板100、複數組訊號傳導層300、複數個光源500、 熱傳導層·以及複餘鮮體_。複數組訊號傳導層 300具有導熱性’係設置於電路板上，且電路板 於訊號傳導層_之下方具有複數組貫穿孔m。在較佳 實施例中，光源模組800係設置於背板2〇〇上。 在較佳實施例中，電路板議係為印刷電路板，然而在 不同實施射亦可為其鋪設錢路之各絲板。訊號傳 導層300較佳係為包絲、金、銀、銅、鐵等在内之金屬 200835972 導體。然而在不同實施例中，訊號傳導層300可以為包含 錫-銀、錫-銅、錫—錯、錫〜銀—錯、錫—銅—錯等在内之合 金或疋包含石墨在内之非金屬導體。 在較佳實施例中，複數組貫穿孔101係由機械加工鑽孔 生成。然而在不同實施例中，可以使用雷射加工形成較小 直徑之貫穿孔101，使複數組貫穿孔101具有較高之分布 密度。此外，貫穿孔101之直徑大小及佈設密度可視需求 而增大或減小，以達到較高之效能及較低之製造成本。 複數個光源500係設置於與訊號傳導層300同侧之電路 板100上。在較佳實施例中，光源5〇〇係為發光二極體。 然而在不同實施例中，光源500可以為其他發光裝置。其 中，發光二極體可以為頂面發光或側面發光。如圖2a所 示之較佳實施例，光源500係以座體51〇設置於電路板1〇〇 1 ’且座體510之左右二側係分別為正負相反電極。在此 車父佳實施例巾，每-統_與相鄰光源5⑽之間各以一 訊號傳導層_電連接。亦即，每—光源5⑽之座體51〇 與相鄰光源_之座體51G之間，係各以訊號傳導層綱 電連接。其中，複數組貫穿孔1〇1係分佈於電路板100於 上，8-庙 S1 Π 少士 - >/ai丨/么 /V mi .Due to its small size and low energy consumption, Diodes (LED) has become one of the light sources used by liquid crystal display. When the temperature of the light-emitting diode is too high, the brightness is lowered and the color is uneven. Therefore, when a light-emitting diode is used as a light source of a liquid crystal display, the efficiency of the heat generated by the light-emitting diode affects the quality of the liquid crystal display. In other words, when the heat dissipation efficiency of the thermal energy generated by the light-emitting diode is relatively south, the liquid crystal display can have higher brightness and color uniformity. As a conventional technique as shown in Fig. 1, a light-emitting diode system as a light source 5 is disposed on the circuit board 100. The heat transfer effect of the material of the secret plate (10) itself is low, so the heat dissipation effect of the heat generated by the light source 500 i is poor. 5 200835972 It is also known in the prior art that an aluminum plate is attached to the circuit board to increase the heat dissipation effect by utilizing the thermal conductivity of the aluminum metal. However, this approach increases material costs. The above design has a modified space in which the light-emitting diode is used as a backlight module. SUMMARY OF THE INVENTION The main object of the present invention is to provide a light source module that can improve the heat dissipation efficiency of thermal energy. The main object of the present invention is to provide a light source module which can increase the brightness of a liquid crystal display. The main object of the present invention is to provide a light source module which can increase the color uniformity of the liquid crystal display. The light source module of the present invention comprises a circuit board, a complex array signal conducting layer, a plurality of light sources, a heat conducting layer, and a complex array of heat conductors. The complex array signal conducting layer has thermal conductivity and is disposed on the circuit board. The board has a complex array of through holes below the signal conducting layer. A plurality of light sources are disposed on a circuit board on the same side as the signal transmission layer. Each light source and the adjacent light source are electrically connected by a signal conducting layer. The towel, the complex array of through-holes are distributed over the circuit board at a plurality of intervals, and outside the light source. The heat conducting layer is opposite to the signal conducting layer = placed on the board opposite the complex array source. The complex array of thermal conductors is placed in the signal-transmissive layer and the thermally conductive multi-layer through-holes, and is connected to the signal conducting layer and the heat conducting layer. The light source includes a light emitting diode. The electrical connection between _ is in series 200835972 or in parallel. The thermal conductivity system is disposed in the plurality of through-holes in a filling manner or in a manner of being applied to the inner side of the plurality of perforations. Embodiments The present invention provides a light source module. In a preferred embodiment, the light source module can be used with a backlight module of a direct-lit or edge-lit liquid crystal display device. However, in various embodiments, the light source module can also be used for a computer keyboard, a mobile phone button, a kanban, and other backlight modules that require a planar light source. In a preferred embodiment, the liquid crystal display device of the present invention comprises a color liquid crystal display device. However, in various embodiments, the liquid crystal device of the present invention may also comprise a monochromatic liquid crystal display device. In addition, the liquid crystal display I refers to a display device using a liquid crystal panel, including a liquid crystal display state of a home LCD TV, a personal desktop computer and a laptop (note type) computer, a liquid crystal display screen of a mobile phone and a digital camera, and the like. . As shown in the preferred embodiment of Fig. 2a, the light source module 8 of the present invention comprises a circuit board 100, a complex array of signal conducting layers 300, a plurality of light sources 500, a heat conducting layer, and a remnant _. The complex array signal conducting layer 300 has a thermal conductivity set on the circuit board, and the circuit board has a complex array through hole m below the signal conducting layer. In the preferred embodiment, the light source module 800 is disposed on the backboard 2A. In the preferred embodiment, the board is considered to be a printed circuit board, but the various boards of the money path can be laid for different implementations. The signal conducting layer 300 is preferably a metal such as a wire, gold, silver, copper, iron, etc. 200835972 conductor. However, in different embodiments, the signal conducting layer 300 may be an alloy containing tin-silver, tin-copper, tin-wrong, tin-silver-wrong, tin-copper-wrong, or the like including graphite. Metal conductor. In the preferred embodiment, the multiple array through holes 101 are formed by machined drilling. However, in various embodiments, the through-holes 101 of smaller diameter may be formed by laser processing such that the plurality of through-holes 101 have a higher distribution density. In addition, the diameter and layout density of the through-holes 101 can be increased or decreased as needed to achieve higher performance and lower manufacturing costs. A plurality of light sources 500 are disposed on the circuit board 100 on the same side as the signal conducting layer 300. In a preferred embodiment, the light source 5 is a light emitting diode. However, in various embodiments, light source 500 can be other light emitting devices. Among them, the light emitting diode may be a top surface light or a side light. As shown in the preferred embodiment of Fig. 2a, the light source 500 is disposed on the circuit board 1〇〇 1 ' with the base 51〇 and the left and right sides of the base 510 are positive and negative opposite electrodes, respectively. In this embodiment, the driver and the adjacent light source 5 (10) are electrically connected by a signal conducting layer. That is, each of the bases 51 of the light source 5 (10) and the base 51G of the adjacent light source are electrically connected by a signal conducting layer. Wherein, the complex array through hole 1〇1 is distributed on the circuit board 100, 8-miao S1 少 少士->/ai丨/么/V mi .
有導電性。在較佳實施例中，熱傳 金、銀、銅、鐵、銘、鎂、錫、錯、 熱傳導層7GG係相對於訊號傳導層_設置於與複數組 光源500反側之電路才反100上。熱傳導層糊可進一步具 熱傳導層700係為包含鉑、 鹤等在内之金屬導體、 200835972 金屬合金或是包含石墨在内之非金屬熱導體。如圖2&所 不’在此較佳實施例中，熱傳導層7〇〇係以區域分佈方式， 相對於‘號傳導層300設置於與複數組光源500反侧之電 路板100上。然而在如圖2b所示之不同實施例中，熱傳 導層700可以為不具導電性之物質如金屬氧化物等，在此 實施例中，熱傳導層700係以整片分佈方式，相對於訊號 傳導層300設置於與複數組光源5〇〇反侧之電路板丨〇〇上。 如圖2a所示之較佳實施例，複數組熱導體9〇〇係設置 於訊號傳導層300與熱傳導層700間之複數組貫穿孔101 中，且連接訊號傳導層300及熱傳導層700。光源5〇〇發 光時會產生熱能。由於訊號傳導層300、熱導體900以及 熱傳導層700均為熱的良導體，因此，光源5〇〇產生之熱 月b可由訊號傳導層3〇〇傳導分散，並且由熱導體g〇〇傳導 至熱傳導層700。熱能傳導至熱傳導層700後再傳導至背 板200，並藉由空氣之熱交換方式離開背板2〇〇。 在較佳實施例中，由於訊號傳導層300相對於光源5〇〇 具有較大之面積’光源500產生之熱能可較快速分散。此 外，由於熱傳導層700相對於光源500具有較大之面積， 可使經熱傳導層700進一步傳導至背板200之熱能由空氣 較快速帶離。措由以上設置，可增加光源50Q產生之熱能 之散熱速度，降低光源500之表面溫度，進而提升使用光 源才吴組800之液晶顯示器之亮度以及顏色均勻度。 在如圖2a所示之較佳實施例中，熱導體900係以填充 9 200835972 方式設置於複數組貫穿孔101中。亦即，貫穿孔1〇1中係 填充滿熱導體900。然而，如圖3所示，在不同實施例中， 熱導體900可以塗佈於貫穿孔1〇1内側方式設置於複數組 貫穿孔101中。換言之’在此實施例中，貫穿孔1Q1僅在 内侧侧壁上塗佈有熱導體900。 在較佳實施例中，熱導體900係為包含鉑、金、銀、銅、 鐵、鋁、鎂、錫、鉛、汞等在内之金屬導體。然而在不同 實施例中，熱導體900可以為金屬合金、金屬氧化物、散 熱膏等金屬/非金屬混和物、或是包含石墨在内之非金屬 熱導體。此外，熱導體900亦可具有導電性。 複數組光源500之間之電連接方式可以視需求而採用串 聯或並聯方式。如圖4所示之實施例，光源5〇〇之間之電 連接方式係為並聯。亦即，光源500之正極與負極係分別 藉由訊號傳導層300與相鄰之光源5〇〇之正極與負極電連 接。在此實施例中，熱傳導層700較佳係具有導電性，並 以區域分佈方式設置。換言之，熱傳導層7〇〇係相對於訊 號傳導層300，以相同之並聯佈設方式設置於與複數組光 源500反侧之電路板1〇〇上。然而在不同實施例中，熱傳 導層700不具有導電性，可以整片分佈方式設置於與複數 組光源500反侧之電路板1〇〇上。 藉由不同設置之訊號傳導層300，可變換電源5〇〇之間 之電連接方式。如圖5所示，在此實施例中，光源5〇〇之 間之電連接方式係為串聯。換言之，光源5〇〇之正極與負 200835972 極係分別藉由訊號傳導層300與相鄰之光源5〇〇之負極與 正極電連接。在此實施例中，熱傳導層7〇〇較佳係具有導 電性，並以區域分佈方式設置。換言之，熱傳導層7〇〇係 相對於號傳導層300，以相同之串聯佈設方式設置於與 複數組光源500反侧之電路板1〇〇上。然而在不同實施例 中，熱傳導層700不具有導電性，可以整片分佈方式設置 於與複數組光源500反侧之電路板iQo上。 除了使用不同設置之訊號傳導層3〇〇,亦可藉由光源5〇〇 之不同設置以變換電源500之間之電連接方式。如圖6所 示之實施例。在此實施例中，光源500係以正負極與相鄰 光源之正負極相反之方式設置。藉此，光源5〇〇之間之電 連接方式係為並聯。 在不同實施例中，貫穿孔101不限僅設置於訊號傳導層 300下方。如圖7a及圖7b所示之實施例，熱傳導層700 係以區域分佈方式，相對於訊號傳導層3〇〇設置於與複數 組光源500反侧之電路板1〇〇上。其中，貫穿孔1〇1除了 設置於電路板100於訊號傳導層300下方之區間，亦設置 於電路板100於光源500下方以外之區間。在此實施例 中，設置於電路板100於訊號傳導層300下方之區間之貫 穿孔101中係填充有熱導體900，設置於電路板1〇〇於訊 號傳導層300下方以外之區間之貫穿孔1〇1中較佳係為中 空。然而在不同實施例中，設置於電路板1〇〇於訊號傳導 層300下方以外之區間之貫穿孔1〇1中亦可填充有熱導體 11 200835972 900。 本發明已由上述相關實施例加以描述，然而上述實施例 僅為實施本發明之範例。必需指出的是，已揭露之實施例 並未限制本發明之範圍。相反地，包含於申請專利範圍之 精神及範圍之修改及均等設置均包含於本發明之範圍内。 【圖式簡單說明】 圖1為習知技術示意圖； 圖2a為本發明之較佳實施例示意圖； 圖2b為本發明具有不同設置之熱傳導層之實施例示意圖； 圖3為本發明之光源模組之熱導體設置於貫穿孔之内侧壁 之實施例示意圖； 圖4為本發明之光源模組之光源以串聯方式電連接之實施 例示意圖； 圖5為本發明之光源模組之光源以並聯方式電連接之實施 例示意圖； 圖6為本發明之光源模組具有不同設置之光源之實施例示 意圖； 圖7a為本發明之光源模組之電路板具有不同設置之貫穿 孔之貫施例不意圖； 圖7b為本發明之光源模組之電路板具有不同設置之貫穿 孔之實施例側視示意圖。 12 200835972 【主要元件符號說明】 100電路板 101貫穿孔 200背板 300訊號傳導層 500光源 510座體 700熱傳導層 800光源模組 900熱導體 13Conductive. In a preferred embodiment, the heat transfer gold, silver, copper, iron, indium, magnesium, tin, erroneous, heat conducting layer 7GG is opposite to the signal conducting layer _ disposed on the opposite side of the complex array source 500. . The heat conductive layer paste may further have a heat conductive layer 700 as a metal conductor including platinum, a crane, etc., a 200835972 metal alloy, or a non-metal heat conductor including graphite. 2 & not in the preferred embodiment, the heat conducting layer 7 is disposed in a region-distributed manner with respect to the 'No. Conductive layer 300' disposed on the circuit board 100 opposite the complex array source 500. However, in different embodiments as shown in FIG. 2b, the heat conducting layer 700 may be a non-conductive material such as a metal oxide or the like. In this embodiment, the heat conducting layer 700 is distributed in a whole piece manner with respect to the signal conducting layer. 300 is disposed on the circuit board 〇〇 opposite to the complex array light source 5〇〇. As shown in the preferred embodiment of FIG. 2a, a plurality of thermal conductors 9 are disposed in the plurality of through-holes 101 between the signal conducting layer 300 and the thermally conductive layer 700, and connect the signal conducting layer 300 and the heat conducting layer 700. When the light source 5 emits light, heat is generated. Since the signal conducting layer 300, the thermal conductor 900, and the heat conducting layer 700 are both good conductors of heat, the heatmoon b generated by the light source 5〇〇 can be conductively dispersed by the signal conducting layer 3〇〇 and conducted by the thermal conductor g〇〇 to Thermal conduction layer 700. The heat is conducted to the heat conducting layer 700 and then conducted to the backing plate 200 and exits the backing plate 2 by heat exchange of air. In the preferred embodiment, since the signal conducting layer 300 has a relatively large area relative to the source 5', the thermal energy generated by the source 500 can be dissipated relatively quickly. In addition, since the heat conducting layer 700 has a larger area with respect to the light source 500, the heat energy further conducted to the backing plate 200 via the heat conducting layer 700 can be more quickly carried away by the air. By setting the above, the heat dissipation speed of the heat energy generated by the light source 50Q can be increased, and the surface temperature of the light source 500 can be lowered, thereby improving the brightness and color uniformity of the liquid crystal display using the light source. In the preferred embodiment shown in Figure 2a, the thermal conductor 900 is disposed in the complex array through-hole 101 in a manner of filling 9 200835972. That is, the through-hole 1〇1 is filled with the full thermal conductor 900. However, as shown in FIG. 3, in various embodiments, the thermal conductor 900 may be disposed in the multi-layer through-hole 101 in such a manner as to be coated inside the through-hole 1〇1. In other words, in this embodiment, the through hole 1Q1 is coated with the heat conductor 900 only on the inner side wall. In a preferred embodiment, the thermal conductor 900 is a metallic conductor comprising platinum, gold, silver, copper, iron, aluminum, magnesium, tin, lead, mercury, and the like. However, in various embodiments, the thermal conductor 900 can be a metal/non-metal mixture such as a metal alloy, a metal oxide, a thermal paste, or a non-metallic thermal conductor including graphite. In addition, the thermal conductor 900 can also have electrical conductivity. The electrical connection between the complex array of light sources 500 can be in series or in parallel depending on the requirements. In the embodiment shown in Figure 4, the electrical connections between the light sources 5A are in parallel. That is, the positive and negative electrodes of the light source 500 are electrically connected to the positive and negative electrodes of the adjacent light source 5 through the signal conducting layer 300, respectively. In this embodiment, the heat conducting layer 700 is preferably electrically conductive and disposed in a regionally distributed manner. In other words, the heat conducting layer 7 is disposed on the circuit board 1A opposite to the complex array light source 500 in the same parallel arrangement with respect to the signal conducting layer 300. However, in various embodiments, the thermal conduction layer 700 is not electrically conductive and may be disposed in a monolithic distribution on the circuit board 1A opposite the complex light source 500. The electrical connection between the power sources 5〇〇 can be changed by the signal conducting layers 300 of different settings. As shown in Fig. 5, in this embodiment, the electrical connection between the light sources 5 is in series. In other words, the positive and negative 200835972 poles of the light source 5 are electrically connected to the positive electrode by the signal conducting layer 300 and the negative electrode of the adjacent light source 5, respectively. In this embodiment, the heat conducting layer 7 is preferably electrically conductive and disposed in a regionally distributed manner. In other words, the heat conducting layer 7 is disposed on the circuit board 1A opposite to the complex array light source 500 in the same series arrangement with respect to the conductive layer 300. However, in various embodiments, the thermally conductive layer 700 is not electrically conductive and may be disposed in a monolithic distribution on the circuit board iQo opposite the complex array source 500. In addition to using differently arranged signal conducting layers 3, the electrical connections between the power supplies 500 can be varied by different settings of the light source 5'. The embodiment shown in Figure 6 is shown. In this embodiment, the light source 500 is disposed in such a manner that the positive and negative electrodes are opposite to the positive and negative electrodes of the adjacent light source. Thereby, the electrical connection between the light sources 5〇〇 is in parallel. In various embodiments, the through hole 101 is not limited to being disposed only below the signal conducting layer 300. In the embodiment shown in Figures 7a and 7b, the heat conducting layer 700 is disposed in a region-distributed manner with respect to the signal conducting layer 3A on the circuit board 1A opposite the complex light source 500. The through hole 1〇1 is disposed in a section other than the lower side of the light source 500 of the circuit board 100 except for the section of the circuit board 100 below the signal conducting layer 300. In this embodiment, the through hole 101 disposed in the section below the signal conducting layer 300 of the circuit board 100 is filled with the heat conductor 900, and is disposed in the through hole of the circuit board 1 outside the signal conducting layer 300. The preferred one is hollow. However, in various embodiments, the through hole 1〇1 disposed in the section other than the lower side of the signal conducting layer 300 of the circuit board 1 may be filled with the heat conductor 11 200835972 900. The present invention has been described by the above-described related embodiments, but the above embodiments are merely examples for implementing the present invention. It is to be understood that the disclosed embodiments do not limit the scope of the invention. On the contrary, modifications and equivalents of the spirit and scope of the invention are included in the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of a preferred embodiment of the present invention; FIG. 2b is a schematic view of an embodiment of a heat conducting layer having different settings according to the present invention; FIG. 4 is a schematic view showing an embodiment in which the light source of the light source module of the present invention is electrically connected in series; FIG. 5 is a schematic diagram of the light source of the light source module of the present invention in parallel FIG. 6 is a schematic diagram of an embodiment of a light source module having different settings of a light source according to the present invention; FIG. 7a is a schematic diagram of a through hole of a circuit board having different settings of the light source module of the present invention; FIG. 7b is a side view showing an embodiment of a circuit board of a light source module of the present invention having different through holes. 12 200835972 [Main component symbol description] 100 circuit board 101 through hole 200 back plate 300 signal conduction layer 500 light source 510 seat body 700 heat conduction layer 800 light source module 900 heat conductor 13