V M353382 八、新型說明： 【新型所屬之技術領域】 本創作係關於一種散熱模組，特別是一種用於LED背 光模組之散熱模組。 【先前技術】 • 隨著科技日新月異，各種智慧型資訊產品已經充斥於 • 現代人的生活中’而液晶顯示器在資訊產品中亦扮演了相 當重要的角色。由於液晶顯示器具有外型輕薄、耗電量少 以及無輻射污染等特性，因此已被廣泛地應用在筆記型電 腦（notebook)、個人數位助理(pDA)及手機等各種攜帶式資 訊產品上’並逐漸取代傳統陰極射線管（Cath〇de_Ray Tube ’ CRT)顯示器’而成為平面薄型化顯示器的主流。 一般液晶顯示器包含一背光模組與一液晶顯示面 板其中貪光板組係用來提供液晶顯不面板在顯示晝面時 所需要之光源。傳統液晶顯示器係使用冷陰極螢光燈管 • (cold cathode fluorescent lamp，CCFL)或外部電極鸯光 燈管（External Electrode Fluorescent Lamp，EEFL )作為背 光模組中之光源’但以螢光燈管為光源之液晶顯示器限制 了色彩規格的改進，因其4800K左右的色溫嚴重影響了& 晶顯示器的色彩表現，而僅能達到美國國家電視標準#胃 " 會（National Television System Committee，NTSC ) ^ M353382 « 之彩色電視廣播標準所規範色域表現的70〜80%，故已逐 漸無法滿足使用者對於顯示晝面之要求，而且螢光燈管号 有不符合綠色產品要求與尺寸較大等缺點。因此目前業界 便研發以具有高細腻度、高輝度、無水銀、低電壓、高色 彩再現性、高色彩飽和度、反應速度快與體積小等優勢之 發光二極體（light emitting diode ’ LED )來取代螢光燈管， - 應用於中、小尺寸的液晶顯示器之背光模組中。 然而，使用LED作為背光模組之光源仍有其需要改良 之缺點，其一不可忽略之處即在於背光模組的散熱問題。 由於LED係裝設於近似於封閉空間的背光模組中，因此隨 著液晶顯示器的操作時間增長，背光模組的内部溫度亦會 因LED所產生熱量而逐漸上升，影響到LED的使用壽命 以及液晶顯示器的整體穩定度。目前業界的處理方法是在 背光模組的LED設置處附近增設散熱裝置，以降低LED 所產生的南溫。 • 請參考第1圖，第1圖係例示美國專利6,966,674號 所揭露之散熱裝置。如第1圖所示，發光二極體20設於液 晶顯示器之背光模組内的一電路板10上，電路板10具有 一貫穿孔12，一熱傳導柱300設置於貫穿孔12中，並透 過一導熱體500連接於發光二極體20下方，而熱傳導柱 ， 300下方另設置一散熱片400。然而，此種設置之散熱裝置 M353382 « . 部存在有成本提高與組裝不便等缺點，因為需逐個於電路 板之各貫穿孔中塗佈或貼覆該等導熱體，程序複雜且操作 不易。此外，目前業界泛用之導熱體，例如其所揭露之導 熱墊(thermal conductive pad)或散熱 f(thermai c〇nductive paste)，導熱係數多僅介於卜⑺瓦/米•度)之間， 與純鋁具有大於220之導熱係數或純銅具有高達385之導 熱係數相比’相差甚多。換句話說，這種使用導熱體來增 # 加接觸面貼合的散熱方式，效果有限。 *因此如何設計出成本低叙具有良好散熱效果之背 光模組與散熱模組，仍為液晶顯示產#之—重要課題。 【新型内容】 因此本創作之目的是提供一種散熱模組，以解決前述 問題。 依據本創作之目的，摘作係提供—錄熱模組，包 各有·散熱基板以及至少一散熱彈片。其中，散孰彈片且 :-突，，且突起部彈性抵接於光源等之產熱裝置之； 部之高度小於該散熱彈片厚度之兩倍，並大於 b產”、、裝置與散熱彈片相隔之厚度。 依據本創作之另—目的，本創作係提供-㈣光模 4 M353382 體，以 一散熱 組，該背光模組包含有一電路板、至少一發光二極 及一散熱模組，且該散熱模組包含有一散熱基板、 彈片。其中電路板，具有至少—貫穿孔，對應該發光二極 體而設於該電路板中。本創作散熱模組之散熱彈片本身具 有一突起部，且此突起部可經由各貫穿孔實質上彈性抵接 於發光二極體之底部，而突起部之高度係小於該散熱彈片 •厚度之兩倍並大於該電路板之厚度。另外，散熱彈片更包 # 含沖壓散熱基板所產生之懸臂，並可以在散熱彈片根部選 擇性增加一圓弧凹槽，圓弧凹槽深度需小於散熱彈片厚度 之二分之一，用來增進散熱彈片之彈性。 由於本創作散熱模組係利用散熱彈片之突起部直接 與發光二極體等之產熱裝置相接觸，而為—導熱、散熱一 體化架構’以大幅減少傳熱過程中任何非金屬等之外加低 導熱係數之傳㈣介對於散減組本身所增加的熱阻，更 有效克服了電路㈣触曲變形而可能造成之導熱效果不 佳的狀態。 【實施方式】 本創作之散熱模組可應用於各種直下式背光模組或 側光式肖光n而該等背光模組内可包含至少—個光源 等之產熱裝置’例如發光二極體。請參考第2圖，第2圖 係為本創作較佳實施例之背光模組的示意圖。為了方便說 M353382 明起見，其係例示單一發光二極體與散熱模組之背光模組 的構造示意圖，但本創作並不以此為限。 如第2圖所示，背光模組70包含一電路板100，至少 一發光二極體200,至少一貫穿孔120以及一散熱模組60。 散熱模組60包含一散熱基板40以及至少一散熱彈片42。 發光二極體200設置於電路板1〇〇上方對應於貫穿孔120 之位置，並電連接電路板100内的電路（未顯示）。而散熱 模組60中之散熱基板40與散熱彈片42係置於電路板1〇〇 之下方。本創作之散熱彈片42具有一突起部44，且突起 部44透過貫穿孔120彈性抵接於發光二極體200之底部下 方，以確保發光二極體200實質上接觸突起部44，進而可 使發光二極體200於發光時產生之廢熱得以透過突起部μ 而有效地經由散熱彈片42傳導至散熱基板4〇發散掉。 外，本創作之散熱基板40底面更可以直接利用切割、 砂、蝕刻、機械加工等之表面處理，或是結合散熱鳍片^ 結構設計，以產生更大散熱表面積，幫助廢熱傳導。4 圖與第4圖為散熱模組之散熱彈片立體示音 ^創^較佳實施例中’設置於散熱基板4Q上的料彈 2’係利用沖壓破孔等機械式加工直接 、择 結構，亦即散熱彈片42可為散熱基板基4^〇 邛刀，而為—體成型的設計，但不限於此，散熱彈片= 9 M353382 亦為獨立製作之部件，V M353382 VIII. New description: [New technical field] This creation is about a heat dissipation module, especially a heat dissipation module for LED backlight module. [Prior Art] • With the rapid development of technology, various intelligent information products have been flooded with the lives of modern people, and LCD monitors have played an important role in information products. LCD monitors are widely used in notebooks, personal digital assistants (PDAs), mobile phones, and other portable information products because of their slimness, low power consumption, and no radiation pollution. Gradually replace the traditional cathode ray tube (Cath〇de_Ray Tube 'CRT) display' and become the mainstream of flat thin display. Generally, the liquid crystal display comprises a backlight module and a liquid crystal display panel, wherein the greedy panel is used to provide a light source required for the liquid crystal display panel to display the fascia. The conventional liquid crystal display uses a cold cathode fluorescent lamp (CCFL) or an external electrodefluororescent lamp (EEFL) as a light source in the backlight module, but the fluorescent tube is used. The liquid crystal display of the light source limits the improvement of the color specification, because the color temperature of about 4800K seriously affects the color performance of the & crystal display, and can only reach the National Television System Committee (NTSC) ^ M353382 « The color TV broadcast standard has 70~80% of the gamut performance, so it has gradually failed to meet the user's requirements for displaying the enamel surface, and the fluorescent tube number does not meet the requirements of green products and large size. . Therefore, the industry has developed a light-emitting diode (LED) with high fineness, high luminance, mercury-free, low voltage, high color reproducibility, high color saturation, fast response speed and small size. ) to replace the fluorescent tube, - used in the backlight module of medium and small size LCD monitors. However, the use of LEDs as the light source of the backlight module still has the disadvantage of being improved. One of the indispensable points is the heat dissipation problem of the backlight module. Since the LED system is installed in a backlight module that is similar to an enclosed space, as the operation time of the liquid crystal display increases, the internal temperature of the backlight module gradually rises due to the heat generated by the LED, which affects the service life of the LED and The overall stability of the liquid crystal display. At present, the industry's processing method is to add a heat sink near the LED setting of the backlight module to reduce the south temperature generated by the LED. • Please refer to Fig. 1, which illustrates a heat sink disclosed in U.S. Patent No. 6,966,674. As shown in FIG. 1 , the light emitting diode 20 is disposed on a circuit board 10 in the backlight module of the liquid crystal display. The circuit board 10 has a uniform through hole 12 , and a heat conducting column 300 is disposed in the through hole 12 and transmits through the through hole 12 . The heat conductor 500 is connected below the light emitting diode 20, and a heat sink 400 is disposed under the heat conducting column 300. However, such a heat dissipating device M353382 « has some disadvantages such as cost increase and inconvenient assembly, because it is necessary to apply or coat the heat conductors one by one in each through hole of the circuit board, and the procedure is complicated and the operation is not easy. In addition, the heat-conducting body widely used in the industry, such as the thermal conductive pad or the heat-heating c (thermai c〇nductive paste), has a thermal conductivity of only between (7) watts/meter deg. Compared with pure aluminum having a thermal conductivity greater than 220 or pure copper having a thermal conductivity of up to 385, there is much difference. In other words, the use of a heat conductor to increase the heat dissipation of the contact surface is limited. * Therefore, how to design a low-cost backlight module and a heat-dissipating module with low heat dissipation effect is still an important issue for liquid crystal display production. [New content] Therefore, the purpose of this creation is to provide a heat dissipation module to solve the aforementioned problems. For the purpose of this creation, the extracting system provides a recording module, each having a heat-dissipating substrate and at least one heat-dissipating elastic piece. Wherein, the dilated shrapnel is: - protruding, and the protrusion is elastically abutted against the heat generating device of the light source or the like; the height of the portion is less than twice the thickness of the heat radiating elastic piece, and is larger than the b production, and the device is separated from the heat radiating elastic piece According to another aspect of the present invention, the present invention provides a (4) optical mode 4 M353382 body, which has a heat dissipation group, the backlight module includes a circuit board, at least one light emitting diode and a heat dissipation module, and The heat dissipation module includes a heat dissipation substrate and a spring piece, wherein the circuit board has at least a through hole corresponding to the light emitting diode and is disposed in the circuit board. The heat dissipation spring piece of the heat dissipation module itself has a protrusion portion, and the The protruding portion can be substantially elastically abutted against the bottom of the light emitting diode via the through holes, and the height of the protruding portion is less than twice the thickness of the heat radiating elastic piece and larger than the thickness of the circuit board. The cantilever arm generated by the stamping heat-dissipating substrate can be selectively added with a circular arc groove at the root of the heat-dissipating elastic piece, and the depth of the circular groove should be less than one-half of the thickness of the heat-dissipating elastic piece for increasing The elasticity of the heat-dissipating shrapnel. Since the heat-dissipating module of the present invention uses the protrusion of the heat-dissipating elastic piece to directly contact the heat-generating device such as the light-emitting diode, it is an integrated structure of heat conduction and heat dissipation to greatly reduce any heat transfer process. Non-metallic and other low thermal conductivity transmission (four) through the increased thermal resistance of the dissipation group itself, more effectively overcome the state of the circuit (4) contact deformation can cause poor thermal conductivity. [Embodiment] The heat dissipation module can be applied to various direct type backlight modules or side-light type backlights, and the backlight modules can include at least one heat generating device such as a light source, such as a light-emitting diode. Please refer to FIG. 2 is a schematic diagram of a backlight module according to a preferred embodiment of the present invention. For convenience, M353382 is a schematic diagram showing the structure of a backlight module of a single light-emitting diode and a heat-dissipating module, but this creation is As shown in FIG. 2, the backlight module 70 includes a circuit board 100, at least one light emitting diode 200, at least a permanent through hole 120 and a heat dissipation module 60. The heat dissipation module 60 includes a The thermal substrate 40 and the at least one heat-dissipating elastic member 42. The light-emitting diode 200 is disposed above the circuit board 1 at a position corresponding to the through-hole 120, and electrically connected to a circuit (not shown) in the circuit board 100. The heat-dissipating module 60 The heat dissipating substrate 40 and the heat dissipating elastic piece 42 are disposed under the circuit board 1 . The heat dissipating elastic piece 42 of the present invention has a protruding portion 44 , and the protruding portion 44 is elastically abutted against the light emitting diode 200 through the through hole 120 . The lower portion of the bottom portion ensures that the light-emitting diode 200 substantially contacts the protrusion portion 44, so that the waste heat generated by the light-emitting diode 200 during the light-emitting diode can be transmitted through the heat-dissipating elastic member 42 to the heat-dissipating substrate 4 to be diverged. In addition, the bottom surface of the heat-dissipating substrate 40 of the present invention can be directly processed by surface treatment such as cutting, sanding, etching, machining, or combined with heat-dissipating fin structure to generate a larger heat-dissipating surface area and help waste heat conduction. 4 and FIG. 4 are schematic diagrams of the heat-dissipating shrapnel of the heat-dissipating module. In the preferred embodiment, the material 2' disposed on the heat-dissipating substrate 4Q is directly processed and selected by means of punching and other mechanical processing. That is to say, the heat-dissipating elastic piece 42 can be a heat-dissipating substrate base, but is a body-shaped design, but is not limited thereto, and the heat-dissipating elastic piece=9 M353382 is also an independently manufactured component.
螺方疋形、半圓形等非圖示之直條形構造。 槽46。此外， 例如螺旋形、 月 > 考第5圖，第5圖為為第4圖沿著切線，所視 的剖面圖。由於要確保散熱彈片42之傳熱散熱功效，本創 作政熱模組6G之突起部44之高度，較佳不超過散熱彈片 42厚度之兩倍’且突起部44之高度，需超過電路板勘 之厚度’使突起部44得以經過貫穿孔12()彈性抵接於發光A straight strip structure such as a spiral shape, a semicircle, or the like. Slot 46. Further, for example, spiral shape, month > test 5, and Fig. 5 is a cross-sectional view taken along line tangential to Fig. 4. Because the heat transfer and heat dissipation effect of the heat radiating elastic piece 42 is to be ensured, the height of the protruding portion 44 of the creative thermal module 6G is preferably not more than twice the thickness of the heat radiating elastic piece 42 and the height of the protruding portion 44 needs to exceed the circuit board survey. The thickness 'allows the protrusion 44 to elastically abut the light through the through hole 12 ()
’如第2圖所示’以確保發光二極體2〇〇 夏買上接觸突起部44。另外，如前所述，在散熱彈片42 懸臂之根部可選擇性增加一圓弧凹槽46，以加強散熱彈片 42之彈性。然而，由於金屬除了彈性變形之性質外亦有塑 性變形的性質，因此給予機械加卫之外力產生圓弧凹槽46 又要保有金屬本身之彈性時，此圓弧凹槽46深度較佳需小 於散熱彈片42厚度之二分之一。 值知主忍的是’當散熱基板40與散熱彈片42跟發光 10 M353382 二極體200與電路板應進行組裝時，散熱基板4〇另可藉 由透過螺絲m鎖、卡栓等方朗定於電路板⑽之下方， 、確保電路板1GG與散熱基板4G能面對面貼合。因此當突 起M4通過貝穿孔12〇抵接於發光二極體細之底部時， =於突起部44之高度超過電路板！⑻之厚度，故會使散熱 彈片们受到發光二極體200的抵觸所施予之一向下作用力 4產生彈性應變。亦即，散熱彈片42因受到散熱彈片 42,之突起部44被發光二極體2〇〇壓迫之影響會向下變形， 、步後^藉散熱彈片42本身為彈性構造以及設計上採用干 驻配合之設計概念，使得散熱彈片42在向下變形之餘也會 ::自身之彈性恢復力向發光二極體2〇〇所在之上方施以 乍用力’進而確保散熱彈片42之突起部44盘發光二 路 &面之間隙保持為〇，而不會受散熱基板40與電As shown in Fig. 2, the contact protrusions 44 are bought in the summer to ensure that the light-emitting diodes 2 are mounted. In addition, as described above, a circular arc groove 46 can be selectively added to the root of the cantilever of the heat radiating elastic piece 42 to reinforce the elasticity of the heat radiating elastic piece 42. However, since the metal has plastic deformation properties in addition to the property of elastic deformation, when the mechanical force is applied to the external force to generate the circular arc groove 46 and the elasticity of the metal itself is retained, the depth of the circular groove 46 is preferably smaller than One half of the thickness of the heat radiating elastic piece 42. The value of the main forbearance is 'When the heat-dissipating substrate 40 and the heat-dissipating shrapnel 42 and the light-emitting 10 M353382 diode 200 and the circuit board should be assembled, the heat-dissipating substrate 4 can be fixed by the screw m lock, the card plug, etc. Under the circuit board (10), it is ensured that the circuit board 1GG and the heat dissipation substrate 4G can face each other. Therefore, when the protrusion M4 abuts against the bottom of the thin portion of the light-emitting diode through the bead hole 12, the height of the protrusion 44 exceeds the circuit board! The thickness of (8) causes the heat-dissipating fins to be elastically strained by one of the downward forces 4 applied by the contact of the light-emitting diodes 200. That is, the heat-dissipating elastic piece 42 is deformed downward by the heat-dissipating elastic piece 42, and the protruding portion 44 is pressed by the light-emitting diode 2, and the heat-dissipating elastic piece 42 itself is elastic and the design is dry. In conjunction with the design concept, the heat-dissipating elastic piece 42 is also deformed downward: the elastic restoring force of the light-emitting elastic piece 42 is applied to the upper side of the light-emitting diode 2〇〇 to ensure the protrusion 44 of the heat-dissipating elastic piece 42. The gap between the light-emitting two-way surface is kept 〇, and is not affected by the heat-dissipating substrate 40 and electricity.
^ 100的狀況所影響。因此可解決習知背紐組中電路 ^良製程或過熱產线曲變形料其他因素而造成 題。此^板之間產生空隙’導致無法有效導熱、散熱的問 本創作之散熱模組亦不限於位在發光二極體200 等之H產熱裝置下方’例如亦可設置於其他光源驅動器 確Γ'裝置下方，然後再利用本創作彈性作用之設計來 技二4等產熱裝置與具備良好熱傳導性之散熱彈片42直 接接觸，有轉熱傳導出去。 << 々圖為將本創作散熱模組應用於直下式背光模組的 M353382 剖面圖。如第6圖所示，背光模組具有複數個發光二極體 200作為其光源。發光二極體200電連接於一電路板100 上，散熱基板40，固鎖於電路板100之下方，其上具有沖 壓產生複數個散熱彈片42以及複數個相對應之突起部 44，且各突起部44係彈性抵接於各發光二極體200之下 方，以確保發光二極體200與散熱彈片42之突起部44能 緊密結合。 由於本創作散熱模組是利用散熱彈片直接與光源等產 熱裝置，例如發光二極體，相接觸，係為一導熱、散熱一 體化架構，故可有效減少傳熱過程中任何非金屬低導熱係 數之傳熱媒介降低整體散熱裝置之散熱效能。此外，散熱 彈片本身具有彈性之設計可以確保產熱裝置與散熱模組之 接觸面貼合狀態良好，亦能克服先前技術中電路板受熱變 形翹曲後，發光二極體與散熱裝置接觸面被破壞甚至於相 互分離，而造成之導熱效果不佳的狀態。同時本創作又可 減少習知散熱模組需逐個於電路板之各貫穿孔中塗佈散熱 膏或貼覆導熱墊等導熱體之複雜程序，此一體成型的散熱 架構設計大幅降低材料以及組裝散熱模組之工時成本，故 本創作改善了目前背光模組散熱普遍遇到之困境。 以上所述僅為本創作之較佳實施例，凡依本創作申請 專利範圍所做之均等變化與修飾，皆應屬本創作之涵蓋範 12 M353382 圍。 【圖式簡單說明】 第1圖為習知背光模組散熱模組的示意圖。 第2圖為本創作較佳實施例之背光模組之散熱模組的示意 圖。 第3圖與第4圖為本創作較佳實施例散熱模組之散熱彈片 立體示意圖。 第5圖為第4圖沿著切線V-V’所視的剖面圖。 第6圖為將本創作散熱模組應用於直下式背光模組的剖面 圖。^ The condition of 100 is affected. Therefore, it can solve the problems caused by other factors such as the circuit in the conventional back-up group or the deformation of the overheated production line. The gap between the two boards is such that the heat-dissipating module that cannot be effectively thermally and thermally dissipated is not limited to being located under the H-heat generating device such as the light-emitting diode 200. For example, it can be set in other light source drivers. Under the device, and then using the design of the elastic design of the present invention, the heat generating device of the second and fourth heat is directly in contact with the heat radiating elastic piece 42 having good thermal conductivity, and the heat is transmitted out. << The diagram is a cross-sectional view of the M353382 using the creative heat sink module in a direct type backlight module. As shown in Fig. 6, the backlight module has a plurality of light emitting diodes 200 as its light source. The light-emitting diode 200 is electrically connected to a circuit board 100. The heat-dissipating substrate 40 is fixed under the circuit board 100, and has a plurality of heat-dissipating elastic pieces 42 and a plurality of corresponding protrusions 44, and protrusions. The portion 44 is elastically abutted under each of the light emitting diodes 200 to ensure that the light emitting diode 200 and the protruding portion 44 of the heat radiating elastic piece 42 can be tightly coupled. Since the heat dissipating module of the present invention is directly connected with a heat generating device such as a light source, such as a light emitting diode, is a heat conduction and heat dissipating integrated structure, thereby effectively reducing any non-metal low heat conduction in the heat transfer process. The heat transfer medium of the coefficient reduces the heat dissipation performance of the overall heat sink. In addition, the heat-dissipating elastic piece itself has an elastic design to ensure that the contact surface of the heat generating device and the heat-dissipating module is in good contact state, and can overcome the thermal deformation deformation of the circuit board in the prior art, and the contact surface between the light-emitting diode and the heat-dissipating device is Destruction or even separation from each other, resulting in a state of poor thermal conductivity. At the same time, the creation can reduce the complicated procedure of applying the thermal grease or the thermal conductor such as the thermal pad to each of the through holes of the circuit board, and the integrated heat dissipation structure design greatly reduces the material and heat dissipation. The labor cost of the module, this creation has improved the current difficulties encountered in backlight module cooling. The above descriptions are only preferred embodiments of the present invention, and all changes and modifications made in accordance with the scope of patent application of this creation should belong to the scope of this creation 12 M353382. [Simple description of the figure] Fig. 1 is a schematic diagram of a conventional heat dissipation module of a backlight module. Fig. 2 is a schematic view showing a heat dissipation module of a backlight module of the preferred embodiment. 3 and 4 are perspective views of the heat sinking elastic member of the heat dissipation module of the preferred embodiment. Fig. 5 is a cross-sectional view of Fig. 4 taken along a line V-V'. Fig. 6 is a cross-sectional view showing the application of the heat dissipation module of the present invention to a direct type backlight module.
【主要元件符號說明】 10 電路板 12 貫穿孔 20 發光二極體 300 熱傳導柱 400 散熱片 500 導熱體 100 電路板 120 貫穿孔 200 發光二極體 40 散熱基板 42 散熱彈片 44 突起部 46 圓弧凹槽 50 背框板 60 背光模組 70 散熱模組 13[Major component symbol description] 10 Circuit board 12 Through hole 20 Light-emitting diode 300 Thermal conduction column 400 Heat sink 500 Thermal conductor 100 Circuit board 120 Through-hole 200 Light-emitting diode 40 Heat-dissipating substrate 42 Heat-dissipating fin 44 Projection 46 Arc concave Slot 50 Back frame board 60 Backlight module 70 Heat dissipation module 13