CN100462814C - Light source module - Google Patents

Light source module Download PDF

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Publication number
CN100462814C
CN100462814C CNB2007100800505A CN200710080050A CN100462814C CN 100462814 C CN100462814 C CN 100462814C CN B2007100800505 A CNB2007100800505 A CN B2007100800505A CN 200710080050 A CN200710080050 A CN 200710080050A CN 100462814 C CN100462814 C CN 100462814C
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Prior art keywords
light source
source module
circuit board
signal conductive
conductive layer
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CNB2007100800505A
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CN101017283A (en
Inventor
贺轩持
周信宏
李弘庆
曾行庆
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AU Optronics Corp
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AU Optronics Corp
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Abstract

This invention relates to one light source module to supply one LCD display use, wherein, light source module comprises circuit board, multiple sets of signal transmission layers, multiple light sources, heat transmission layer and multiple sets of heat conductor; the conductive layers have heat conductive layers on circuit board down the signal transmission layer with multiple sets of pass holes; the multiple sources are set on circuit board in same side of transmission layer with each light source and adjacent light source connected by signal transmission layer and the multiple sets of pass holes are distributed on circuit board on extra space; heat transmission layer is set on circuit board in reverse side of the light source; the heat conductor is set in the pass holes between the transmission layer and conductive layer.

Description

Light source module
Technical field
The invention relates to a kind of light source module, use for a backlight liquid crystal display module.
Background technology
(Liquid Crystal Display LCD) is widely used on the various electronic products such as computing machine, TV and mobile phone LCD.Backlight module (backlight module) is one of LCD important composition element.The employed light supply apparatus of backlight module then directly influences the performance and the assembly cost of backlight module.Wherein, (Light Emitting Diodes LED) because volume is little, power consumption is few, therefore becomes one of light source of LCD use to light emitting diode.
When the temperature of light emitting diode was too high, the even situation of brightness reduction and irregular colour took place easily.Therefore, when using light emitting diode as the light source of LCD, the radiating efficiency of the heat energy that light emitting diode produces can impact the image quality of LCD.In other words, when the radiating efficiency of the heat energy that produces when light emitting diode was higher, LCD can have higher brightness and color uniformity coefficient.
Known technology as shown in Figure 1 is arranged on the circuit board 100 as the light emitting diode of light source 500.Because the heat-conducting effect of circuit board 100 materials own is lower, therefore, the radiating effect of the heat energy that produces for light source 500 is relatively poor.Also have in the known technology and use aluminium sheet to be attached at circuit board 100, with the good way of the property led increase radiating effect of the heat of utilizing aluminum metal.Yet this way can increase material cost.The above has improved space with light emitting diode as the design of backlight module.
Summary of the invention
Fundamental purpose of the present invention is to provide a kind of light source module, can improve the radiating efficiency of heat energy.
Fundamental purpose of the present invention is to provide a kind of light source module, can increase the brightness of LCD.
Fundamental purpose of the present invention is to provide a kind of light source module, can increase the color uniformity of LCD.
Light source module of the present invention comprises circuit board, organizes signal conductive layer more, a plurality of light source, heat conduction layer and organize heat conductor more.Many group signal conductive layers have thermal conductivity, are arranged on the circuit board.Circuit board has many group through holes below signal conductive layer.A plurality of light sources are arranged on the circuit board with the signal conductive layer homonymy.Each is electrically connected with signal conductive layer between each light source and the adjacent light source.Wherein, organize through hole more and be distributed in the interval of circuit board beyond below multiple sets of light sources.Heat conduction layer is arranged on the circuit board of tossing about with multiple sets of light sources with respect to signal conductive layer.Many group heat conductors are arranged in the many groups through hole between signal conductive layer and heat conduction layer, and connect signal conductive layer and heat conduction layer.
Light source comprises light emitting diode.Electric connection mode between the light source is a serial or parallel connection.And heat conductor comprises how the inboard modes of group through holes are arranged in many group through holes with filling mode or to coat.
Description of drawings
Fig. 1 is the known technology synoptic diagram;
Fig. 2 a is a preferred embodiment synoptic diagram of the present invention;
Fig. 2 b has the embodiment synoptic diagram of the different heat conduction layers that are provided with for the present invention;
Fig. 3 is arranged at the embodiment synoptic diagram of the madial wall of through hole for the heat conductor of light source module of the present invention;
Fig. 4 is the embodiment synoptic diagram that the light source of light source module of the present invention is electrically connected with series system;
Fig. 5 is the embodiment synoptic diagram that the light source of light source module of the present invention is electrically connected with parallel way;
Fig. 6 has the embodiment synoptic diagram of the different light sources that are provided with for light source module of the present invention;
Fig. 7 a is the embodiment synoptic diagram that the circuit board of light source module of the present invention has the different through holes that are provided with;
Fig. 7 b is the embodiment schematic side view that the circuit board of light source module of the present invention has the different through holes that are provided with.
Wherein, Reference numeral is:
100 circuit boards
101 through holes
200 backboards
300 signal conductive layers
500 light sources
510 pedestals
700 heat conduction layers
800 light source modules
900 heat conductors
Embodiment
The invention provides a kind of light source module.With preferred embodiment, this light source module can cooperate the backlight module of straight-down negative or side-light type liquid crystal indicator to use.Yet in different embodiment, this light source module also can need the backlight module of the device of planar light source to use for computer keyboard, mobile phone button, billboard and other.In preferred embodiment, liquid crystal indicator of the present invention comprises a color liquid crystal display arrangement.Yet in different embodiment, liquid-crystal apparatus of the present invention also can comprise monochromatic liquid crystal indicator.In addition, liquid crystal indicator general reference is used the display device of liquid crystal panel, comprises the LCDs etc. of LCD monitor, mobile phone and the digital camera of the LCD TV of family expenses, individual desktop computer and (notes type) on knee computing machine.
Preferred embodiment shown in Fig. 2 a, light source module 800 of the present invention comprise circuit board 100, organize signal conductive layer 300 more, a plurality of light source 500, heat conduction layer 700 and organize heat conductor 900 more.Many group signal conductive layers 300 have thermal conductivity, be arranged on the circuit board 100, and circuit board 100 have many group through holes 101 below signal conductive layer 300.In preferred embodiment, light source module 800 is arranged on the backboard 200.
In preferred embodiment, circuit board 100 is a printed circuit board (PCB), yet also can be the various substrate that other is laid with circuit in different embodiment.Signal conductive layer 300 is preferably and comprises platinum, gold, silver, copper, iron etc. at interior metallic conductor.Yet in different embodiment, signal conductive layer 300 can be for comprising Xi-Yin, tin-copper, tin-lead, Xi-Yin-lead, tin-copper-lead etc. at interior alloy or comprise graphite at interior non-metal conductor.
In preferred embodiment, organize through hole 101 more and generate by machining boring.Yet in different embodiment, can use the through hole 101 of Laser Processing formation, make many group through holes 101 have higher distribution density than minor diameter.In addition, the visual demand of the diameter of through hole 101 and layout density and increase or reduce is to reach higher performance and lower manufacturing cost.
A plurality of light sources 500 are arranged on the circuit board 100 with signal conductive layer 300 homonymies.In preferred embodiment, light source 500 is a light emitting diode.Yet in different embodiment, light source 500 can be other light-emitting device.Wherein, light emitting diode can be for end face luminous or lateral emitting.Preferred embodiment shown in Fig. 2 a, light source 500 is arranged on the circuit board 100 with pedestal 510, and pedestal 510 about two sides be respectively positive and negative opposite electrode.In this preferred embodiment, each is electrically connected with a signal conductive layer 300 between each light source 500 and the adjacent light source 500.Also promptly, between the pedestal 510 of each light source 500 and the pedestal 510 of adjacent light source 500, each is electrically connected with signal conductive layer 300.Wherein, organize through hole 101 more and be distributed in the interval of circuit board 100 beyond below multiple sets of light sources 500.
Heat conduction layer 700 is arranged on the circuit board 100 of tossing about with multiple sets of light sources 500 with respect to signal conductive layer 300.Heat conduction layer 700 can further have electric conductivity.In preferred embodiment, heat conduction layer 700 is for comprising platinum, gold, silver, copper, iron, aluminium, magnesium, tin, lead, tungsten etc. at interior metallic conductor, metal alloy or comprise graphite at interior nonmetal heat conductor.Shown in Fig. 2 a, in this preferred embodiment, heat conduction layer 700 is arranged on the circuit board 100 of tossing about with multiple sets of light sources 500 with respect to signal conductive layer 300 in the areal distribution mode.Yet in the different embodiment shown in Fig. 2 b, heat conduction layer 700 can be the material that do not have electric conductivity such as metal oxide etc., in this embodiment, heat conduction layer 700 is arranged on the circuit board 100 of tossing about with multiple sets of light sources 500 with respect to signal conductive layer 300 with the full wafer distribution mode.
Preferred embodiment shown in Fig. 2 a is organized in many groups through hole 101 that heat conductor 900 is arranged on 700 of signal conductive layer 300 and heat conduction layers more, and is connected signal conductive layer 300 and heat conduction layer 700.Light source 500 can produce heat energy when luminous.Because signal conductive layer 300, heat conductor 900 and heat conduction layer 700 are the good conductor of heat, therefore, the heat energy that light source 500 produces can be disperseed by signal conductive layer 300 conduction, and conducts to heat conduction layer 700 by heat conductor 900.Thermal energy conduction conducts to backboard 200 again to heat conduction layer 700, and leaves backboard 200 by the heat exchange method of air.
In preferred embodiment, because signal conductive layer 300 has bigger area with respect to light source 500, the heat energy that light source 500 produces can faster disperse.In addition because heat conduction layer 700 has bigger area with respect to light source 500, can make the heat energy that further conducts to backboard 200 through heat conduction layer 700 by the very fast speed belt of air from.By above setting, can increase the radiating rate of the heat energy of light source 500 generations, reduce the surface temperature of light source 500, and then promote the brightness and the color uniformity of the LCD of using light source module 800.
In the preferred embodiment shown in Fig. 2 a, heat conductor 900 is arranged in many group through holes 101 with filling mode.Also promptly, fill full heat conductor 900 in the through hole 101.Yet as shown in Figure 3, in different embodiment, heat conductor 900 can be coated through hole 101 inboard modes and be arranged in many group through holes 101.In other words, in this embodiment, through hole 101 only is coated with heat conductor 900 on inside side walls.
In preferred embodiment, heat conductor 900 is for to comprise platinum, gold, silver, copper, iron, aluminium, magnesium, tin, lead, mercury etc. at interior metallic conductor.Yet in different embodiment, heat conductor 900 can or comprise graphite at interior nonmetal heat conductor for metal/non-metal mixtures such as metal alloy, metal oxide, thermal greases.In addition, heat conductor 900 also can have electric conductivity.
Electric connection mode between the multiple sets of light sources 500 can be looked demand and be adopted the serial or parallel connection mode.Embodiment as shown in Figure 4, the electric connection mode between the light source 500 is in parallel.Also promptly, the positive pole of light source 500 and negative pole are connected with negative electricity with the positive pole of adjacent light source 500 by signal conductive layer 300 respectively.In this embodiment, heat conduction layer 700 is preferably has electric conductivity, and is provided with in the areal distribution mode.In other words, heat conduction layer 700 is arranged on the circuit board 100 of tossing about with multiple sets of light sources 500 in identical parallel connection laying mode with respect to signal conductive layer 300.Yet in different embodiment, heat conduction layer 700 does not have electric conductivity, can the full wafer distribution mode be arranged on the circuit board 100 of tossing about with multiple sets of light sources 500.
By the signal conductive layer 300 that difference is provided with, the electric connection mode between the convertible power supply 500.As shown in Figure 5, in this embodiment, the electric connection mode between the light source 500 is series connection.In other words, the positive pole of light source 500 and negative pole are connected with positive electrical with the negative pole of adjacent light source 500 by signal conductive layer 300 respectively.In this embodiment, heat conduction layer 700 is preferably has electric conductivity, and is provided with in the areal distribution mode.In other words, heat conduction layer 700 is arranged on the circuit board 100 of tossing about with multiple sets of light sources 500 in identical series connection laying mode with respect to signal conductive layer 300.Yet in different embodiment, heat conduction layer 700 does not have electric conductivity, can the full wafer distribution mode be arranged on the circuit board 100 of tossing about with multiple sets of light sources 500.
Except using the different signal conductive layers 300 that are provided with, also can pass through the difference setting of light source 500 with the electric connection mode between the converting power source 500.Embodiment as shown in Figure 6.In this embodiment, light source 500 is provided with in the both positive and negative polarity mode opposite with the both positive and negative polarity of adjacent light source.Therefore, the electric connection mode between the light source 500 is in parallel.
In different embodiment, through hole 101 is not limited to only be arranged on signal conductive layer 300 belows.Embodiment shown in Fig. 7 a and Fig. 7 b, heat conduction layer 700 are arranged on the circuit board 100 of tossing about with multiple sets of light sources 500 with respect to signal conductive layer 300 in the areal distribution mode.Wherein, through hole 101 is except being arranged at the interval of circuit board 100 below signal conductive layer 300, also is arranged at the interval of circuit board 100 beyond below light source 500.In this embodiment, be arranged in the through hole 101 in the interval of circuit board 100 below signal conductive layer 300 and be filled with heat conductor 900, be arranged in the through hole 101 in the interval of circuit board 100 beyond below signal conductive layer 300 and be preferably hollow.Yet in different embodiment, be arranged in the through hole 101 in the interval of circuit board 100 beyond below signal conductive layer 300 and also can be filled with heat conductor 900.
The present invention is described by above-mentioned related embodiment, yet the foregoing description is only for implementing example of the present invention.Must be pointed out that, take off disclosed embodiment and do not limited the scope of the invention.On the contrary, being contained in the modification of the spirit of claims and scope and equalization is provided with and all is contained in the scope of the present invention.

Claims (10)

1. a light source module uses for a backlight module, it is characterized in that this light source module comprises:
One circuit board has many group through holes;
Many group signal conductive layers are arranged on this circuit board, and are covered in many group through holes top, and whole many group signal conductive layers below all is coated with through hole;
A plurality of light sources are arranged on this signal conductive layer, are electrically connected mutually by this signal conductive layer between each light source and adjacent light source;
One heat conduction layer is arranged on this circuit board of tossing about with these a plurality of light sources with respect to this signal conductive layer; And
Many group heat conductors are arranged in these many group through holes, and connect this signal conductive layer and this heat conduction layer;
On wherein many group through holes are distributed between this a plurality of light sources below this circuit board area in addition.
2. light source module according to claim 1 is characterized in that, these a plurality of light sources comprise light emitting diode.
3. light source module according to claim 1 is characterized in that, respectively the electric connection mode between this light source is series connection.
4. light source module according to claim 1 is characterized in that, respectively the electric connection mode between this light source is in parallel.
5. light source module according to claim 1 is characterized in that, this signal conductive layer is a metallic conductor.
6. light source module according to claim 1 is characterized in that this heat conduction layer has electric conductivity.
7. light source module according to claim 1 is characterized in that, this heat conductor comprises with filling mode and is arranged in this many group through holes.
8. light source module according to claim 1 is characterized in that, this heat conductor comprises how the inboard modes of group through holes are arranged in this many group through holes to coat this.
9. light source module according to claim 1 is characterized in that this heat conductor has electric conductivity.
10. light source module according to claim 1 is characterized in that, this heat conductor is a thermal grease.
CNB2007100800505A 2007-03-02 2007-03-02 Light source module Active CN100462814C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNB2007100800505A CN100462814C (en) 2007-03-02 2007-03-02 Light source module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNB2007100800505A CN100462814C (en) 2007-03-02 2007-03-02 Light source module

Publications (2)

Publication Number Publication Date
CN101017283A CN101017283A (en) 2007-08-15
CN100462814C true CN100462814C (en) 2009-02-18

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101802485B (en) * 2007-09-14 2013-01-02 欧司朗股份有限公司 Illumination module

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005283852A (en) * 2004-03-29 2005-10-13 Kyocera Corp Liquid crystal display device
JP2006011239A (en) * 2004-06-29 2006-01-12 Kyocera Corp Liquid crystal display device
CN1837926A (en) * 2006-04-20 2006-09-27 友达光电股份有限公司 Heat radiation structure of backlight module
CN1300633C (en) * 2004-02-17 2007-02-14 友达光电股份有限公司 Backlight module and heat sink structure
US20070041190A1 (en) * 2005-08-17 2007-02-22 Au Optronics Corp. Bottom lighting module

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1300633C (en) * 2004-02-17 2007-02-14 友达光电股份有限公司 Backlight module and heat sink structure
JP2005283852A (en) * 2004-03-29 2005-10-13 Kyocera Corp Liquid crystal display device
JP2006011239A (en) * 2004-06-29 2006-01-12 Kyocera Corp Liquid crystal display device
US20070041190A1 (en) * 2005-08-17 2007-02-22 Au Optronics Corp. Bottom lighting module
CN1837926A (en) * 2006-04-20 2006-09-27 友达光电股份有限公司 Heat radiation structure of backlight module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101802485B (en) * 2007-09-14 2013-01-02 欧司朗股份有限公司 Illumination module

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