TW200833855A - Apparatus and method for sputtering - Google Patents
Apparatus and method for sputteringInfo
- Publication number
- TW200833855A TW200833855A TW96105021A TW96105021A TW200833855A TW 200833855 A TW200833855 A TW 200833855A TW 96105021 A TW96105021 A TW 96105021A TW 96105021 A TW96105021 A TW 96105021A TW 200833855 A TW200833855 A TW 200833855A
- Authority
- TW
- Taiwan
- Prior art keywords
- cathode
- working chamber
- holding members
- sputtering apparatus
- rotate
- Prior art date
Links
Landscapes
- Physical Vapour Deposition (AREA)
Abstract
The present invention relates to a sputtering apparatus. An exemplary sputtering apparatus includes a working chamber, a rotate plate, a plurality of holding members, an actuator, a first cathode/target electrode, and a second cathode/target electrode. The rotate plate is placed in the working chamber, and the plurality of holding members is set on the rotate plate configured for holding work pieces. The actuator is configured for actuating the plurality of holding members to rotate a certain angle. The first cathode electrode and the second cathode are oppositely disposed in the working chamber configured for supporting a first target material and a second target material respectively, alternately sputtering on the work pieces. As such, the present sputtering apparatus can effectively save the cost of production and improve the productivity.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW96105021A TWI383059B (en) | 2007-02-12 | 2007-02-12 | Apparatus and method for sputtering |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW96105021A TWI383059B (en) | 2007-02-12 | 2007-02-12 | Apparatus and method for sputtering |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200833855A true TW200833855A (en) | 2008-08-16 |
TWI383059B TWI383059B (en) | 2013-01-21 |
Family
ID=44819248
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW96105021A TWI383059B (en) | 2007-02-12 | 2007-02-12 | Apparatus and method for sputtering |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI383059B (en) |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4401539A (en) * | 1981-01-30 | 1983-08-30 | Hitachi, Ltd. | Sputtering cathode structure for sputtering apparatuses, method of controlling magnetic flux generated by said sputtering cathode structure, and method of forming films by use of said sputtering cathode structure |
DE69027004T2 (en) * | 1989-11-13 | 1996-11-14 | Optical Coating Laboratory Inc | Geometry and designs of a magnetron sputtering device |
US6103320A (en) * | 1998-03-05 | 2000-08-15 | Shincron Co., Ltd. | Method for forming a thin film of a metal compound by vacuum deposition |
JP2003147519A (en) * | 2001-11-05 | 2003-05-21 | Anelva Corp | Sputtering device |
US6974976B2 (en) * | 2002-09-30 | 2005-12-13 | Miasole | Thin-film solar cells |
TWI236946B (en) * | 2004-02-10 | 2005-08-01 | Delta Electronics Inc | Coating apparatus and clamping apparatus thereof |
TW200528571A (en) * | 2004-02-20 | 2005-09-01 | Nanonexus Inc | Method and apparatus for producing uniform, isotropic stresses in a sputtered film |
TW200622030A (en) * | 2004-12-21 | 2006-07-01 | Metal Ind Res & Dev Ct | Coating device for flexible substrate |
-
2007
- 2007-02-12 TW TW96105021A patent/TWI383059B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TWI383059B (en) | 2013-01-21 |
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Legal Events
Date | Code | Title | Description |
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MM4A | Annulment or lapse of patent due to non-payment of fees |