TW200833855A - Apparatus and method for sputtering - Google Patents

Apparatus and method for sputtering

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Publication number
TW200833855A
TW200833855A TW96105021A TW96105021A TW200833855A TW 200833855 A TW200833855 A TW 200833855A TW 96105021 A TW96105021 A TW 96105021A TW 96105021 A TW96105021 A TW 96105021A TW 200833855 A TW200833855 A TW 200833855A
Authority
TW
Taiwan
Prior art keywords
cathode
working chamber
holding members
sputtering apparatus
rotate
Prior art date
Application number
TW96105021A
Other languages
Chinese (zh)
Other versions
TWI383059B (en
Inventor
Shih-Chieh Yen
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW96105021A priority Critical patent/TWI383059B/en
Publication of TW200833855A publication Critical patent/TW200833855A/en
Application granted granted Critical
Publication of TWI383059B publication Critical patent/TWI383059B/en

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Abstract

The present invention relates to a sputtering apparatus. An exemplary sputtering apparatus includes a working chamber, a rotate plate, a plurality of holding members, an actuator, a first cathode/target electrode, and a second cathode/target electrode. The rotate plate is placed in the working chamber, and the plurality of holding members is set on the rotate plate configured for holding work pieces. The actuator is configured for actuating the plurality of holding members to rotate a certain angle. The first cathode electrode and the second cathode are oppositely disposed in the working chamber configured for supporting a first target material and a second target material respectively, alternately sputtering on the work pieces. As such, the present sputtering apparatus can effectively save the cost of production and improve the productivity.
TW96105021A 2007-02-12 2007-02-12 Apparatus and method for sputtering TWI383059B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW96105021A TWI383059B (en) 2007-02-12 2007-02-12 Apparatus and method for sputtering

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW96105021A TWI383059B (en) 2007-02-12 2007-02-12 Apparatus and method for sputtering

Publications (2)

Publication Number Publication Date
TW200833855A true TW200833855A (en) 2008-08-16
TWI383059B TWI383059B (en) 2013-01-21

Family

ID=44819248

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96105021A TWI383059B (en) 2007-02-12 2007-02-12 Apparatus and method for sputtering

Country Status (1)

Country Link
TW (1) TWI383059B (en)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4401539A (en) * 1981-01-30 1983-08-30 Hitachi, Ltd. Sputtering cathode structure for sputtering apparatuses, method of controlling magnetic flux generated by said sputtering cathode structure, and method of forming films by use of said sputtering cathode structure
DE69027004T2 (en) * 1989-11-13 1996-11-14 Optical Coating Laboratory Inc Geometry and designs of a magnetron sputtering device
US6103320A (en) * 1998-03-05 2000-08-15 Shincron Co., Ltd. Method for forming a thin film of a metal compound by vacuum deposition
JP2003147519A (en) * 2001-11-05 2003-05-21 Anelva Corp Sputtering device
US6974976B2 (en) * 2002-09-30 2005-12-13 Miasole Thin-film solar cells
TWI236946B (en) * 2004-02-10 2005-08-01 Delta Electronics Inc Coating apparatus and clamping apparatus thereof
TW200528571A (en) * 2004-02-20 2005-09-01 Nanonexus Inc Method and apparatus for producing uniform, isotropic stresses in a sputtered film
TW200622030A (en) * 2004-12-21 2006-07-01 Metal Ind Res & Dev Ct Coating device for flexible substrate

Also Published As

Publication number Publication date
TWI383059B (en) 2013-01-21

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees