TW200832664A - Interposer for connecting a plurality of chips and method for manufacturing the same - Google Patents

Interposer for connecting a plurality of chips and method for manufacturing the same Download PDF

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Publication number
TW200832664A
TW200832664A TW096103230A TW96103230A TW200832664A TW 200832664 A TW200832664 A TW 200832664A TW 096103230 A TW096103230 A TW 096103230A TW 96103230 A TW96103230 A TW 96103230A TW 200832664 A TW200832664 A TW 200832664A
Authority
TW
Taiwan
Prior art keywords
wafer
disposed
metal
connection
substrate
Prior art date
Application number
TW096103230A
Other languages
English (en)
Other versions
TWI363414B (en
Inventor
Kuan-Jui Huang
Chang-Ping Wang
Hsiu-Ming Li
Shih-Min Huang
Hui-Chen Kuo
Chia Chun Chen
Original Assignee
Touch Micro System Tech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Touch Micro System Tech filed Critical Touch Micro System Tech
Priority to TW096103230A priority Critical patent/TWI363414B/zh
Priority to US11/756,634 priority patent/US20080182432A1/en
Publication of TW200832664A publication Critical patent/TW200832664A/zh
Priority to US12/273,550 priority patent/US7987588B2/en
Application granted granted Critical
Publication of TWI363414B publication Critical patent/TWI363414B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0657—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/486—Via connections through the substrate with or without pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/023—Redistribution layers [RDL] for bonding areas
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    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
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    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16237—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bonding area disposed in a recess of the surface of the item
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/4823—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a pin of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
    • H—ELECTRICITY
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    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06517—Bump or bump-like direct electrical connections from device to substrate
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    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
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    • H01L2924/14—Integrated circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Description

200832664 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種微晶片連結器，特別是一種可連結複數個 晶片，以縮小晶片封裝面積之微晶片連結器。 【先前技術】 近年來，幾乎所有的電子產品除了追求輕、薄、短、小之外， φ 尚功能、咼速度、大容量、多功能與低耗電量等的要求，也是帶 動晶片封裝技術發展的原動力。
請參考第1圖，第1圖為一習知封裝結構10的示意圖。如第 1圖所示，封裝結構10包含一封裴基板12以及二晶片14、16分 別設於封裝基板10之一表面。晶片14、16上分別設有複數個連 接塾14A、14B及16A、16B，晶片14、16之連接塾14B及16B ⑩__條導線18分猶設於封裝基板1G表面之複數個連 接塾2〇電連接，而晶片Μ、W間則是透過複數條導線Μ彼此電 連接。-般來說，習知封裝結構10通常由一封裝材料(圖未示）， 包覆在晶片14、16、晶片14、16上的連接墊14A、14B、16A、 16B、連接晶片之導線18、以及封裝基板口表面之連接 墊’此外’封裝結構1〇將透過複數個導電凸塊加师，圖未示) 或是不同規格的外接腳_)，使封裝結構1〇貞載於一印刷電路板 、（圖未示），耻熟他主鋪之電子元件減_完_電子系統， 以有效運作於各式的電子產品之中。 6 200832664 然而，在電子商品走向_化_勢下，f知的 勢必要縮短⑼14、16的間距，以達成縮減封裝結構面積的口目的， ^ . 14 ： 16 ,1 ^ ^^^^ ^ $疋以成b曰片14、16間電磁干擾(eMI)等問題，為業界所不樂見 之事。 V、 【發明内容】 • 1鑑於此，本發敗主要目的在於提供—種連接複數個晶片 之微晶片連接器，藉此克服上述打線困難的問題。 A達上述目的，本發明提供—種連接複數個晶片之微晶片連 接器，其包含有-連結基板、至少一第—晶片、至少—第二晶片 以及至少-連通導線設於該連結基板中。該連結基板包含一^曰一 表面以及-第二表面，且該第—晶片與該第二晶片係以覆晶的方 鲁式分別設於該第-表面和該第二表面電連接，並由設於連結基板 中的該連通導線電連接該第-表面與該第二表面。 同日守杨明另揭露-種微晶片連接騎製作方法。首先， 提供-連結基板，其包含—第—表面以及—第二表面，且該第一 表面上設有至少-第-介電層、至少一第—金屬内連線以及至少 第-連接墊’接著提供-黏著層將第—表面貼附於—晶圓載且， 然後由該連絲板之料二表_絲少—連祕細ugh_ 於該連結基板中，且該連通孔係連通該第—表面與該第二表面， 200832664 之層填補該連通孔’以形成—連通導線，再者形成 ^-弟-介電層、至少—第二金屬内連線以及至少 =該連結基板之該第二表面’且該第二金屬内連線及該第二連 :Γ==線與設於該第一表面之該第-金屬内連線及 -連接墊電連接，最後分_第—表面與該晶圓载具。 因此，利用本發明所提供之微晶片連接器，將可連接兩個或 •兩^上υ」或是其他_需要訊號通連之树，藉此縮 夕目=件以及线、準系統的封裝面積和成品體積，同時組合 夕種封裝方式’以降低封裝打線時的_性及提升封襄良率。 【實施方式】 為了突顯本剌之伽及特徵，τ文列舉本發明之數個較佳 實施例，並配合圖示作詳細說明如下： • π請參考第2圖至第10圖，第2圖至第1〇圖係為製作本發明 之微曰^片連接器之-較佳實施例的流程示意圖。如第2圖所示， 首先提供-連結基板3〇,例如—晶圓。連結基板％包含一第一表 2 32以及-第二表面34，且連結基板3()之第—表面μ上，依^ 設有-氧化料36、至少—介電層以及至少—導電層，係經由多 次的沉積、黃光與餘刻等製程，形成一至少金屬内連線於該介電 層之中以及至少一連接塾曝露於表面供電連接之用；為簡化說 明’於本較佳實施例中，第2圖僅以—具有雙層結構之全屬内連 線做代表’但不為此限，如第2圖所示，第—表面&上係設有複 8 200832664 數層第-介電層38，其間設有複數組第—金屬内連線*、42，並 設有-保護層覆44蓋於第-介電層38以及第—金屬内連線4〇、 42上方’鱗露歧數個第—連接墊46，其中氧化卿％係作 為防止層與應力緩衝H具註少—和48，錢續製程中 製作電連接第-絲32與第二表面34之連稱線所必需。此外 第-金屬峰MG、42之厚度、線寬、_料和其佈局 咖断視不同之使用需求作調整。為降低第一金屬内連線4〇、 42之電阻值，第-金勒連線4()、42之較佳厚度為大㈣$微米 且其較佳之線寬為大於10微米，同時，用以形成第一金 屬内連線40、42之材料，可明_銅合金(Aicu)、銅、紹或金 等低電阻之金屬材料做為連接線路，以降低訊號傳遞時的損失。 如第3圖所示，接著提供一晶圓载具5〇，配合一黏著層^， 例如-雙轉帶歧其他具醫性轉雜之物y，將設有第一 介電層38、第-金屬内連線4〇、42以及第一連接塾柄之第一表 面32貼附於晶圓載具50。然後如第4圖所示，自連結基板％之 第二表面34進行-薄化製程，例如利用一化學機械研磨製程 (CMP) ’齡連結基板3G之厚度。然而，第4騎示之薄化製程 可以實際操作時所個的連結基板3G的厚度而選擇性的進行，且 薄化的方法並不限於本較佳實施例所示之化學機械研磨製程，其 他適用於薄化基贼晶圓之方法，亦_於本發明。 如第5圖所示，在連結基板3〇之第二表面％表面沉積一氣 200832664 化矽層54作為防止層及應力緩衝 一黃光及__，絲部錢化_ M =表面34進行 内連線42當作働_的_停止㈣__之第一金屬 _56於連結基板3G中^二—連通孔_呦 過氧化補36之開口 48^讀連結基板3〇 ,透 .之後如第6圖所示，形成一導==之第-金屬内連線 , 導電層58於填補連通孔56。於本 d先在氧切層54及連通孔56表罐一銅種 接著配合—電鍍製程，在銅種子㈣表面進 =面=的銅讀，形成以銅為材料的導電層％。然後如第7圖 'll % '千坦化製程’例如_—化學機械研磨製程移除連 通孔56以外的導電層58，形成—連通導線62。此外，導電層56 之材料並不限於本較佳實施例麻之銅轉，其他具有低電阻特 性之金屬材料，如銘銅合金、銘或金等，亦適用於本發明；再者， 形成連通導線62之方法並祕於本發騎示之濺鑛、電鍍及平坦 =導電層56之化學機械研磨製程，亦可利用其他該領域之人所熟 4之方法’直接填補連通孔56，形成本發明之連通導線％。 接著在第二表面34上，依序形成至少一介電層以及至少一導 電層，利肢次黃光及侧等製程，關出至少—金屬内連線層 於該介電層之中，以及至少一連接墊曝露於表面供電連接之用； 於本較佳實施例中，係以一具有雙層結構之金屬内連線做說明，. 但不為此限，如第8圖所示，係在連結基板3〇之第二表面32上 依序形成複數層苐二介電層64，其間並設有複數組第二金屬内連 200832664 -線66、68，同時第二介電層64以及第二金屬内連線⑽、68上方 設有-保制7G ’以曝露岐數鄉二連接塾72。值得注意的是， 第-表面32之第-金屬内連線42，係經由形成於連結基板财 的連通導線62與第二表面34之第二金屬内連線紐電連接，供訊 號傳遞之用。此外第二金屬内連線66、68之厚度、線寬、圖案設 計和其佈局可視不同之使用需求作調整。為降低第二金屬内連線 66 68之電阻值$一金屬内連線66、68之較佳厚度為大於〇 $ 籲被米(/zm) ’且其車又佳之線寬為大於1〇微米，同日夺，用以形成第 二金屬内連線66、68之材料，可以利舰銅合金、銅、銘或金等 低電阻之金屬㈣做為連接線路，崎低峨傳遞時的損失。 然後如第9圖所示，在第二表面34之第二連接墊72上，形 成複數個帛—凸塊底層金^| y^undei'bumpmetallui'gxUBM；)，供 後續晶片覆晶連接之用。此外第9圖所示之第二凸塊底層金屬％ 將依實務需求而選擇性地形成在連接塾72上，其位置及數量將視 欲連接之晶片大小及連接方式而定。同理可知，若第一表面32亦 有以覆晶的方式連接其他晶片的需求時，亦可以第9圖所示之方 法’形成複數個第一凸塊底層金屬（圖未示)於第一連接墊46表面。 最後如第10圖所示，在不損及第一表面32上之各元件結構 的如提下，移除黏著層52，分離第一表面32與晶圓載具5〇 ,形 成本發明所揭示之微晶片連接器76。 200832664 至此，本發明之微晶片連接器76 個晶片之用，如第1〗m邮- # 取J用7、連、、、口夕 接i不。弟1181為利用本發明之微晶片連 H⑼數個w之-較佳實施例的結構示意圖，與前述實施 )相同之讀將沿用其元件符號。微 30,且連結基板3G ^ 板 & 、有弟表面32與第二表面34,且第-表面
上^又有氬化石夕層36、第一介電層％、第一金屬内連線4〇、 八、連接弟-金屬内連線40、42之第一連接塾％以及覆蓋第一 IS 38,與第;金屬内連線40、42之保護層44，且第-表面32 、击又至^第曰曰片78 ’以覆晶的方式，透過複數個設於第-8Π^*表面之第—凸塊底層金屬⑽和設於第—凸塊底層金屬 〇與弟間之複數個第—導電凸塊82與第—表面32電連 而弟二表面34上則依序設有氮化石夕層％、第二介電層料、 第二金屬内連線66、68、連接第二金屬内連線66、68之第二連接 塾74以及覆蓋第二介電層38與第二金勒連線4()、42之保護層 70，且第二表面34上設有至少―第二；84，以覆晶的方式，^ 過複數個辦第二連雜72絲之第二凸塊金屬％和設於 弟^塊底層金屬74鄕二晶片84間之複數個第二導電凸塊％ :、第一表面34電連接。值得注意的是，設於連結基板中的連 通‘線62 ’係電連接第一表面Μ之第一金屬内連線42與第二表 面34之第二金屬内連線66，並以利第一晶片％與第二晶片84 間的訊號傳遞。然而於第u圖翁示之較佳實施例，僅纷示出一 個連通導線作綱，並非對本發明加以限制，連通導線的數量、 位置將視產品需求作適度的調整。 12 200832664 另請參考第12圖其繪示以本發明之微晶片連接器連接三個晶 片的一較佳實施例之結構示意圖。如第12圖所示，係在三個晶片 90、92、94間，透過覆晶的方式在晶片90、92間設有一第一微晶 片連接器96，在晶片92、94間則設有一第二微晶片連接器98， 因此，三個晶片90、92、94間的訊號傳遞將可通過第一微晶片連 接器96及第二微晶片連接器98相互傳送。第11圖與第12圖所 緣示之較佳實施例係利用微晶片連接器在垂直方向上堆疊多個晶
片，另外，本發明之微晶片連接器的應用，並不限於第U圖和第 12圖所示之單純以覆晶的方式在垂直方向上堆疊多個晶片，亦可 同時在垂直和水平的方向上連接多個晶片，如第13圖所示，第13 圖為利用本發明之微以連接ϋ連結辣晶狀又_較佳實施例 的不意圖’其特點在於同時在微晶片連接器的水平方向及垂直方 =上連接夕個晶片，其中位於微晶片連接器觸垂直方向上的一 第日日102與一第二晶片1〇4係透過覆晶的方式與微晶片連接 =電連广於微晶片連接器卿水平方向上的一第三晶 片106、一弟四晶片108、一 ^ 則是透過打線的方式H 日片0以及一弟六晶片112, 電連接。 "*數條導線114分別與微晶片連接器100 說明實施例，實^有雙層結構之金屬内連線的微晶片連接器為 層或多層結構的:屬晶片，性，計出具有單 繪示一個晶片以Ρ曰、 本發明在各實施例中係簡單 覆曰曰的方式電連接微晶片連接器之第一表面或第 13 200832664 二表面，亦可視實務上的需要，製作不聰格 局之微晶片繼，陳辣W㈣在第= f二表面，·刪咐求，，㈣連接^ :層與設於第一表面或第二表面之第一介電層或第二介電層 = 利用乳化_、&切或其他具麵絕緣雜讀郷作。 另=要說明的是，利用本發明所述之微晶片連接器所連接之 硬個曰曰片，可視為-晶片模組(m〇dule)，可再固定於一反 上’並封裝材料包覆該晶片模組，另藉由導電凸塊或;:接 腳’將㈣片模組裝設於-印刷電路虹，以與其他主動或被^ 元件組成完整的電子系統。 綜上所述，本發明所提供之微晶片連接器係透過設於連結基 ，中之連通導線連通微晶片連結器之第—表面及第二表面，並由 #微晶片連接n連接兩倾兩個以上的晶片或其他需要訊號通連之 讀，藉此縮小棚整合元件及系統的封裝面積，並且組合多種 可月b的封裝或連結方式以降低封裝打線時的困難度。 以上所述僅為本發明之較佳實施例，凡依本發明申請專利範 圍所做之均等變化與修飾，皆應屬本發明之涵蓋範圍。 【圖式簡單說明】 第1圖為一習知封裝結構的示意圖。 200832664 第2圖至第10圖係為製作本發日月之微晶片連接器之—較佳實施例 的流程示意圖。 只 第11圖為本發明之微晶片連翻連結複數個晶片之—較佳實 施例的結構示意圖。 土只 第12圖其綠示以本發明之微晶片連接器複數個晶片之另一較佳實 施例之結構示意圖。 第13圖為利用本發明之微晶片連接器連結多個晶片之又一較佳實 • 施例的示意圖。 【主要元件符號說明】 10 封裝結構 12 封裝基板 14、16 晶片 14A、14B、 連接墊 16A、16B 18、22 導線 20 連接墊 30 連結基板 32 第一表面 34 弟二表面 36 氧化矽層 38 第一介電層 40、42 第一金屬内連線 44 保瘦層 46 第一連接墊 48 開口 50 晶圓載具 52 黏著層 54 氧化矽層 56 連通孔 58 導電層 60 銅種子層 62 連通導線 64 第二介電層 66、68 第二金屬内連線 15 200832664 70 保護層 74 第二凸塊底層金屬 78 第一晶片 82 第一導電凸塊 86 弟二導電凸塊 96 第一微晶片連接器 100 微晶片連接器 104 弟二晶片 108 第四晶片 112 弟六晶片 72 第二連接墊 76 微晶片連接器 80 第一凸塊底層金屬 84 弟二晶片 90、92、94 晶片 98 第二微晶片連接器 102 弟一晶片 106 第二晶片 110 第五晶片

Claims (1)

  1. 200832664 十、申請專利範圍： 1· 一種連接複數個晶片之微晶片連接器、，其包含： 一連結基板，該連結基板包含一第一表面以及一第二表面； 至少一第一晶片設於該第一表面，該第一晶片係以覆晶的方式與 該第一表面電連接； 至少一第二晶片設於該第二表面，該第二晶片係以覆晶的方式與 該第二表面電連接；以及 • 至少一連通導線設於該連結基板中，該連通導線係電連接該第一 表面與該第二表面。 么如請求項1所述之微晶片連接器，其中該第一表面另包含有： 複數層第一介電層設於該第一表面； 複數組第一金屬内連線設於該等第一介電層中； 複數個第一連接墊曝露於該等第一介電層表面，且該等第一連接 _ 塾係各自與該等第一金屬内連線電連接； 複數個第一凸塊底層金屬(under bump metallurgy，UBM)佈設於該 等第一連接墊表面；以及 稷數個第-導電凸塊設於該第一晶片與該第一凸塊底層金屬間， 電連接該第一晶片至該第一表面。 =如請求項1所述之微晶片連接器，其中該第二表面另包含有： 複數層第二介電層設於該第二表面； 複數組第二金屬内連線設於該等第二介電層中； 17 200832664 ^ 複數個第二連接墊曝露於該等第二介電層表面，且該等第二連接 墊係各自與該等第二金屬内連線電連接； 複數個第二凸塊底層金屬佈設於該等第二連接塾表面；以及 複數個第二導電凸塊設於該第二晶片與該第二凸塊底層金屬間， 電連接該第二晶片至該第二表面。 4. 如請求項2所述之微晶片連接器，其中該等第一金屬内連線之 0 材料包含鋁銅合金(AlCu)、銅、鋁或金。 5. 如請求項3所述之微晶片連接ϋ，其中轉第二金仙連線之 材料包含鋁銅合金、銅、鋁或金。 6.如請求項1所述之微晶片連接器’另包含至少一第三曰片，該 晶片係以打線的方式與該微晶片連接器之該第—表^該第二 表面電連接。 乂币 一金屬内連線之 7·如請求項2所述之微晶片連接器，其中該等第 線寬大於10微米。 第二金屬内連線之 8·如請求項3所述之微晶片連接器，其中該等 線寬大於10微米。 9，一種微晶片連接器的製作方法， ，且該第一 提供一連結基板，其包含-第-表面以及1二表面 18 200832664 表面上設有至少—第—介電層、至少-第-金屬内連線以及至 少第一連接墊； 提供一黏著層將第—表面貼附於-晶圓載具; 由該連結基板之該第二表面形成至少一連通孔(thr〇ugh h〇ie)於該 連結基板中，且該連通孔係連通該第一表面與該第二表面； 形成-導電層填顯連通孔，以形成_連通導線]
    幵>/成至V第—;|電層、至少—第二金屬内連線以及至少一第二 ί接·該連結基板之該第二表面，且該第二金助連線及ί 弟二連接·經由該連通導線與設於該第—表面之該第一金屬 内連線及該第一連接墊電連接；以及 分離該第一表面與該晶圓載具。 =^_所叙_法，射職第—表_至該晶圓 後，成—應力緩衝層於該連結基板之該第二表面。 結一二表面 後，另包含形成一保護層覆蓋該第二塾之 線，並曝露出該第二連接墊。 I、知-金屬内連 如請求項9所述之製作方法，其 =〃 载具後，可選擇性地進行-薄化製程於該第—表面_至該晶圓 面薄化该連結基板。 、自錢結基板之該第二表 19 200832664 13.如請求項9所述之製作方法，其中形成該連通導線包含下列步 驟： 進行一電鍍製程，使該導電層覆蓋於該第二表面並填滿該連通 孔；以及 進行一平坦化製程，移除該連通孔外之該導電層，以形成該連通 導線。 鲁 14· 一種連接複數個晶片之微晶片連接器’包含： 一連結基板，該連結基板包含一第一表面以及一第二表面； 至少一第一晶片設於該第一表面，並與該第一表面電性連接；以及 至少一第二晶片設於該第二表面，並與該第二表面電性連接。 U·如請求項第13項所述之微晶片連接器，另包含至少一連通導 線設於該連結基板中，且該連通導線係電連接該第一表面與該第 • 〜表面。 16·如請求項13所述之微晶片連接器，另包含至少一第三晶片， 該等晶片係以打線的方式與該晶片之該第一表面或該第二表面電 連接。
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US8686570B2 (en) * 2012-01-20 2014-04-01 Taiwan Semiconductor Manufacturing Company, Ltd. Multi-dimensional integrated circuit structures and methods of forming the same
US20130277855A1 (en) * 2012-04-24 2013-10-24 Terry (Teckgyu) Kang High density 3d package
US9853015B1 (en) * 2016-12-15 2017-12-26 Powertech Technology Inc. Semiconductor device with stacking chips
US9929484B1 (en) * 2016-12-20 2018-03-27 General Electric Company Electrical connector design for isolating electrical contacts in medical devices
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