200831921doc 九、發明說明： 【發明所屬之技術領域】 本發明是關於-種測試裝置、測試方法以及連接部。 本發明尤其是卩綠職元件供給轉電壓的測試裝 置。本申請案與下述日本申請案有關。對於允許以文獻參 照的方式併人的指定國，參照Ti4申鞋所記載的内容而 併入本申請案令，作為本申請案的一部分。 特願 2006-335331。200831921doc IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD The present invention relates to a test device, a test method, and a connection portion. The present invention is particularly directed to a test apparatus for supplying a voltage to a green component. This application is related to the following Japanese application. For the designated country that allows the reference to the literature, the contents of the present application are incorporated by reference to the contents of the Ti4 shoe as part of the present application. Special wish 2006-335331.
申請曰2006年12月]3曰。 【先前技術】 +厭I你一杰Γ 卞的微細化、以及與之倶來的低 電源電流的變化所導致的電源品質方 株㈣=正。亦即，電源品#的些許變動备對元 件的動作造成影塑。田1 义70 質改善。以下的i利文獻為，使供給至元件的電源品 電流的技術而為人所f中揭示的發明作為例如監控電源 ϋ ^文獻！：日本專利特開· 然而，難以對供給至元件 報 度地進行監控。例如， =路，原電壓高精 ㈣_行監控的情況下 “ 中的電 會因封裝:電感、接觸電阻等作，源電麼亦 如，:被該:刪得更加顯箸。例 即使在對供給至， 200831921doc 至動作電路的電源電壓除 會因插座的電感等而變化。？ •元件的封裝之外， 、一針對上述問題，考慮_種 亦 進行穩定測試的電源電壓的容 /、即可對被_碑 對被測試凡件輪入規定的測試圖安邮咖）測試。例如件 被測試元件正常動作:電==電壓、： 度 造成的影響。⑼，該方法中，t叫況下氛 試圖案已變更、α及被測試元件。2被測試元件 壓的劣化對測試精度的影響會:寺情況下’電綠電 行容限測試。 '又化，因此必須再次進 又，亦考慮另-種方法，亦 被測試元件的電源接腳與接地兩 於電源變動而在 容。然而，由於電容的特性通Y立I之間連接大容量的電 特性的被測試元件進扞钏々脖€ $化，故即使在對相同 劣化。上述良率的劣二為，良率亦會經時性地 問題，或者測試裝置的測量_麵試元件的製造過程的 解決變得非常困難。又，該此扣的性能劣化，因而問題的 封裝、測試裝置的插座上的二去無法估計被測試元件的 【發明内容】 壓的劣化。 因此，本發明的一個方面 述問題的測試裝置、測試方法ρ目的在於提供一種解決上 將申請專利範圍的獨立項中所^及連接部。該目的是藉由 的。又，依附項規定本發明^栽的特徵加以組合而達成 X 、吏為有利的具體例。 〇Application 曰 December 2006] 3曰. [Prior Art] + I'm I, I'm a geek, 微 卞 卞 、 、 、 、 、 、 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 That is, a slight change in the power supply item # is caused by the action of the component. Tian 1 Yi 70 quality improvement. The following document is the invention disclosed in the technique of supplying the current to the power supply of the element as, for example, a monitoring power supply. : Japanese Patent Special Opening. However, it is difficult to monitor the supply to the component. For example, = road, the original voltage is high (four) _ line monitoring case "in the electricity will be due to the package: inductance, contact resistance, etc., the source power is also like:: by: delete more obvious. Even in For supply, the power supply voltage to the operating circuit of 200831921doc will change depending on the inductance of the socket, etc. • In addition to the package of the component, the capacity of the power supply voltage for stable testing is considered for the above problem. It can be tested on the test chart by the _ monument to the tested part. For example, the tested component is in normal action: electricity == voltage, : degree caused by influence. (9), in this method, t is called The lower atmosphere test pattern has been changed, α and the tested component. 2 The deterioration of the test component pressure on the test accuracy will be: the electric green power line tolerance test in the case of the temple. 'Constant, so it must be entered again, Considering another method, the power pin and the ground of the tested component are both in the power supply fluctuation. However, due to the characteristics of the capacitor, the tested component that connects the large-capacity electrical characteristics is connected to the Y-I. Neck, so even in The same deterioration. The second disadvantage of the above yield is that the yield is also problematic over time, or the measurement process of the test device is very difficult to solve the manufacturing process of the interview component. Moreover, the performance of the buckle is degraded, and thus the problem The package on the socket of the test device cannot estimate the deterioration of the pressure of the device under test. Therefore, the test device and test method of one aspect of the present invention are intended to provide a patent for solving the problem of the general. The purpose of the separate term of the range is the purpose of the connection. The object of the present invention is to exemplify the specific examples in which the features of the present invention are combined to achieve X and 吏.
G 20083192 ldoc 裝置了測試呈=問題’本發明的第1形態提供-種測試 衣置i式具有於元件短 私㈣式 元件，該測試裝置具備電源供給部腳的被測試 上述電源供給部生成供給至被 控益，其中， 該電源電壓供給至被_元件===源電壓，並將 電源監控器檢測出祐丨夕们电源接腳；上述 供給電源電壓的_二二:源接腳中電源供給部未 本發明的第2形態提 件内部短路的多個 ^5式方法，測試具有於元 成供給至被測試。==，試元件，該測試方法生 被測試元件的至小一门，亚將该電源電壓供給至 的電源接腳中未^ ^原接腳，並且檢測出被測試元件 壓。 虹、，、5电源電壓的上述電源接腳上的電 内部提供-種連接部，在對具有於元件 置中，連接被測^ :的被測試7^件進行測試的测試裝 源輪入端子、電^ t裝置，該連接部具備多個電 個電源輪入端、以及監控器配線，其中，上述多 對應的泰、、择垃的.對一地對應到多個電源接腳，且連接於 輸二7，上述電源配線對欲供給電源電屋的電沔 電壓;上述監控一源配以 端子與電源監“二:未連接於電源配線的電源輸人 全部再ί此發明的概要並未列出本發明的必要特徵的 〆二寸敛群的次組合（sub-combination )亦可成為 8 200831921doc 發明。 【實施方式】 以下，將藉由發明的實施形態來說明本發明的—個方 面，但以下的實施形態並未限定申請專利範圍的發明， 實施形態中說明的特徵之組合的全部亦未必為發^的^ 手段所需者。 X “G 20083192 ldoc device test = problem 'The first aspect of the present invention provides a test device set i type having an element short private (four) type element, the test device having the power supply portion leg tested and the power supply unit generating the supply To be controlled, wherein the power supply voltage is supplied to the _ component === source voltage, and the power monitor detects the power supply pin; the above supply voltage _ 22: source pin power supply The supply unit is not subjected to a plurality of methods of internal short-circuiting of the second aspect of the present invention, and the test is supplied to the test. ==, test component, the test method is the lowest of the tested component, the power supply voltage is supplied to the power pin is not the original pin, and the tested component voltage is detected. The electric power supply on the above-mentioned power supply pin of the red,, and 5 power supply voltages is internally provided with a type of connection portion, and the test source is inserted in the test for the test piece 7 having the component to be tested. a terminal and an electric device, wherein the connecting portion is provided with a plurality of electric power feeding ends and a monitor wiring, wherein the plurality of corresponding Thai, and the other ones correspond to the plurality of power pins, and Connected to the transmission 2, the above-mentioned power supply wiring to the power supply voltage to be supplied to the power supply house; the above-mentioned monitoring source is equipped with a terminal and a power supply supervisor. "2: The power supply that is not connected to the power supply wiring is all invented. The sub-combination of the two-inch cluster which does not list the essential features of the present invention may also be the invention of 8 200831921doc. [Embodiment] Hereinafter, aspects of the present invention will be described by way of embodiments of the invention. However, the following embodiments do not limit the invention in the scope of the claims, and all of the combinations of the features described in the embodiments are not necessarily required by the means.
圖1是表示本發明之一實施形態的測試裝置1〇〇的構 成之一例。測試裝置100是測試半導體晶片等被測試元件 2〇〇的裝置，其具備主框架1〇、測試頭12、以及連接部2〇。 連接部20將被測試元件2〇〇與測試裝置1〇〇加以連 =。例如，連接部20可具有載置著被測試元件2〇〇的插座 接腳相連接的端子。又，基板上設有經由插座= 破測= 元件之間授受信號的配線。 总式碩12經由連接部2〇而與被測試元件2⑽之間授 2虎例如’測試頭12生成欲輪入至被測試元件2〇〇 $」式彳°號、電源電力等，並經由連接部20而輪入至被測 件200。又’測試頭12經由連接部2〇而獲取被測試 判!^ 2〇0的輸出信號。測試頭12可具有根據該輪出信號來 由^被測試元件200之良否的判定部。例如，判定部可藉 心。亥輪1出信號的邏輯圖案與規定的期待值圖案進行比 孕父，來判定被測試元件2⑻的良否。 框加主框架1〇是與測試頭12之間授受信號的。例如，主 匡木10可將控制測試頭12的控制信號輸入至測試頭12。 9 200831921- 又，主框架10可獲取測試頭12上的對被測試元件200的 測試結果。 •圖2是表示連接部20的構成之一例。連接部20具備： 電源供給部22、正侧電源配線24、正侧監控器配線26、 電源監控器62、插座60、負侧電源配線44、負侧監控器 配線46、以及基準電壓生成部64。 又，被測試元件200具備：動作電路210、設置於封 裝上的多個正側電源接腳212、以及設置於封裝上的多個 〇 負側電源接腳214。動作電路210藉由被賦予的電源電力 而驅動。又，封裝是藉由陶瓷、樹脂等形成，以對動作電 路210進行密封。 多個正侧電源接腳212於封裝的内部分別短路。又， 多個負侧電源接腳214是與正側電源接腳212獨立並於封 裝的内部分別短路。在正側電源接腳212及負侧電源接腳 214上，分別施加有規定的電壓。又，負側電源接腳214 可接地。動作電路210藉由施加至多個正侧電源接腳212 上的電壓與施加至多個負側電源接腳214上的電壓之差分 電壓而驅動。 插座60載置著被測試元件200。又，於插座60的表 面上，設有多個正侧電源輸入端子（3 0 — 1、3 0 — 2、…’ 以下總稱為30 )與多個負側電源輸入端子（50—1、50 — 2、…，以下總稱為50) 〇多個正侧電源輸入端子30 —對 一對應地設置於多個正侧電源接腳212上，並電性連接於 對應的正侧電源接腳212。多個負侧電源輸入端子50 —對 10 Ο Ο 20083192 ldoc -對應地設置於多個負側電源接腳214上，並 對應的負侧電源接腳214。連接電 山^帝、接表 的配，設於插座6G的_，且形成有寄應^原等接腳 電源供給部22生成供給至被測試元件2〇〇成刀寺 ，，並將該電源電Μ供給至被測試元件电 ，如，電源供給部22對正側電勸ρ 212 =二 =電本例中，電源供給部 源“知子30而對正側電源接腳212供給第！魏带舞电 又，電源供給部22亦可對負側電源接腳2至电丨、土— 電壓。負側電源接腳214 ㈣； 弟2包源私壓可為接地電壓。電源 ^ 由使負側電源輸人端子5G接地而將第2電源* 口喊 壓）施加至對應的負侧電源接腳214。 /、私^ 土電 源供2監控器62檢測出被測試元件200的電源接腳中恭 中：;”2未供給電源電壓的電源接腳上的電壓。本； 中，電源監控器62具有正側監控器28及負侧監控哭= 正側監控器28檢測出未施加有第 °。8。 ::;腳-上的電壓。本例中，正侧監 ，源接腳2U所對應的正侧電源輸入端子3〇— ^ 出该正侧電源接腳212的電壓。 源接二=控器，測出未施加有第2電源電壓的負侧電 邊腳214上的電壓。本例中，負側監控器48經由叫^ ioc 200831921 侧電源接腳214辦抛& 出該負例雷2所對應的負侧電源輸入端子50-4而μ 貝側电源接腳214的電壓。 4而檢測 正侧電源配線24將欲丘二 入端子30與電源供給部二:】源:壓:正側電源輸 子（3〇-!、30 —2、3 tH8的其他正側電源輪入端 電源供給部22 ~3)在連接部20上短路並連接於 〇 Ο 個正侧4上例如，在載置有插座6〇的基板上，Γ; 们正側〜原輪人端子（3Q—卜3 ，上使多 於電源供給部22。電源供 ^並連接 測試頭12獲取電源雷厭、，也^ j為δ又於该基板上且自 負侧電源配線，:供;至= 入端子5〇與電源供給部2 接原】=負：電源輸 :入端子5。連接於作為電源供給部22 =^側;源 中，負侧電源配線44使未連接 本例 侧電源輸入端子（刈〜工5〇 、^皿技印你的其他負 上，使多個負側電源輪入端子（5〇 路並連接於接地電位。 正侧監控裔配線26在連接部2η 24絕緣地設置著。例如 二 上，與正側電源配線 控器配㈣與正侧S配=妾Ζ20的基板上，正侧監 侧監控器配線26經由插座6〇及正2性達接。但是，正 侧電源配線24電性連接 $電源接腳212而與正 倒監控器2峨側電源輪==器=—欲連接正 每于30 — 4與正侧監控器28 短路並連接於接地電位。例二於===部20上 1、50-2、50 —3)短 上’使多個負侧電源齡λ # 7 ,二 有座60的基板 12 20083192 ldoc 加以運接。 負側監控器配綠+、去拉立。 44 Μ地#f荽、'友在連接口「 與負侧電源配線 :束地5又置者。例如，在連接部2G的基板上，負側κ 控益配線46與負侧電源配線44並未電性連接。但是 =控器配線46經由插座6〇及負側電源接腳214而與負 = 二Ϊ接。負側監控器配線46將欲連接負 加、侧電源輸入端子5〇 —4與負側監控器48 Ο Ο 子（3237構’正侧監控器28可經由正側電源輪入端 側電源於入、二2、3〇~3)、正侧電源接腳212、以及正 電源電ΐ。亦而民^4而檢測出電源供給部22供給的第1 广^土 '、17，電源供給部22輸出的第1電泝電屙;pu j 座，外部傳送至被測試元件·的封^二内原 =，2〇。的封裝的内部傳送=二： 封裝中檢測出插座6〇及被測試元件2。〇的 源电壓的劣化程度。同樣地，負侧監 2’、i出負側電源系統中的插座60 式元 爰中的電源電_劣化程度。 則仏件的封 又，較佳為，正側監控器28及 入阻抗的測量電路。例如，正侧-48為向輪 3〇 —4為止的路徑上的電璧 ^側电源輸入端子 接腳212流向正側電源輪入♦使從 J 較佳為，正側於#哭的私 4的黾减車 的輪入阻抗充分大於從正侧電^ 13Fig. 1 is a view showing an example of a configuration of a test apparatus 1A according to an embodiment of the present invention. The test apparatus 100 is a device for testing a device under test such as a semiconductor wafer, and includes a main frame 1A, a test head 12, and a connection portion 2A. The connecting portion 20 connects the device under test 2 to the test device 1 . For example, the connecting portion 20 may have a terminal to which the socket pins on which the device under test 2 is placed are connected. Further, wiring on the substrate via the socket = break test = signal between the components is provided. The total model 12 is connected to the device under test 2 (10) via the connection portion 2, for example, the 'test head 12 generates the wheel to be tested to the test element 2 〇〇 $", the power supply, etc., and is connected. The portion 20 is rotated into the device under test 200. Further, the test head 12 acquires an output signal of the test judgment !^ 2〇0 via the connection unit 2〇. The test head 12 may have a decision portion that determines whether or not the test element 200 is good or not based on the turn-off signal. For example, the judgment department can take care of it. The logical pattern of the signal of the round 1 is compared with the predetermined expected value pattern to determine whether the element under test 2 (8) is good or not. The frame plus main frame 1 is signaled to and from the test head 12. For example, the main rafter 10 can input a control signal for controlling the test head 12 to the test head 12. 9 200831921 - Again, the main frame 10 can obtain test results for the tested component 200 on the test head 12. FIG. 2 is an example of a configuration of the connection unit 20. The connection unit 20 includes a power supply unit 22, a positive power supply line 24, a positive side monitor line 26, a power source monitor 62, a socket 60, a negative side power supply line 44, a negative side monitor line 46, and a reference voltage generating unit 64. . Further, the device under test 200 includes an operation circuit 210, a plurality of positive side power supply pins 212 provided on the package, and a plurality of negative side power supply pins 214 provided on the package. The action circuit 210 is driven by the supplied power source. Further, the package is formed of ceramic, resin, or the like to seal the operation circuit 210. The plurality of positive side power pins 212 are respectively shorted inside the package. Further, the plurality of negative-side power supply pins 214 are independent of the positive-side power supply pins 212 and are respectively short-circuited inside the package. A predetermined voltage is applied to the positive side power pin 212 and the negative side power pin 214, respectively. Also, the negative side power pin 214 can be grounded. The action circuit 210 is driven by a differential voltage applied to a plurality of positive side power pins 212 and a voltage applied to a plurality of negative side power pins 214. The socket 60 carries the component under test 200. Further, on the surface of the socket 60, a plurality of positive side power input terminals (3 0 - 1, 3 0 - 2, ... 'hereinafter collectively referred to as 30) and a plurality of negative side power input terminals (50 - 1, 50) are provided. 2, ..., hereinafter collectively referred to as 50) 〇 A plurality of positive-side power input terminals 30 are disposed on the plurality of positive-side power pins 212 in a corresponding manner, and are electrically connected to the corresponding positive-side power pins 212. A plurality of negative side power input terminals 50 - 10 Ο Ο 20083192 ldoc - are correspondingly disposed on the plurality of negative side power pins 214 and corresponding to the negative side power pins 214. The connection of the electric mountain and the connection meter is set in the socket 6G, and the pin power supply unit 22 is formed and supplied to the device under test 2 to form a knife temple, and the power source is connected. The electric power is supplied to the device under test. For example, the power supply unit 22 is electrically positively punctured by the positive side. In the example of the present invention, the power supply unit source "the electron 30 is supplied to the positive side power pin 212. In addition, the power supply unit 22 can also be connected to the negative side power pin 2 to the electric power, the earth-voltage, the negative side power pin 214 (four); the second source voltage can be the ground voltage. The power input terminal 5G is grounded and the second power supply * port is pressed to the corresponding negative side power pin 214. /, the private power supply 2 monitor 62 detects the power pin of the tested component 200 Medium: "2" The voltage on the power pin that is not supplied with the supply voltage. In the present embodiment, the power monitor 62 has a positive side monitor 28 and a negative side monitor crying = the positive side monitor 28 detects that the θ is not applied. 8. ::; Foot-on voltage. In this example, the positive side power supply input terminal corresponding to the source side pin 2U receives the voltage of the positive side power pin 212. The source is connected to the second controller, and the voltage on the negative side leg 214 to which the second power supply voltage is not applied is measured. In this example, the negative side monitor 48 performs the voltage of the negative side power supply input terminal 50-4 corresponding to the negative side power supply terminal 214 and the negative side power supply input terminal 50-4 via the power supply pin 214 of the ioc 200831921 side. . 4, the detection of the positive side power wiring 24 will be the second input terminal 30 and the power supply unit two:] Source: pressure: positive side power supply (3 〇 -!, 30 2-3, 3 tH8 other positive side power supply wheel The terminal power supply units 22 to 3) are short-circuited on the connection portion 20 and connected to the positive side 4, for example, on the substrate on which the socket 6 is placed, and the front side to the original wheel terminal (3Q- 3, more than the power supply unit 22. The power supply is connected to the test head 12 to obtain the power supply, and the voltage is δ and is on the substrate and the power is off the negative side power supply: supply; to = terminal 5 〇 and the power supply unit 2 are connected to the original] = negative: power supply input terminal 5 is connected to the power supply unit 22 = ^ side; in the source, the negative side power supply wiring 44 is not connected to the power supply input terminal of this example (刈 ~ The other side of the negative power supply is turned into the terminal (5 turns and connected to the ground potential. The positive side monitor wiring 26 is insulated at the connection portion 2n 24. For example, Second, with the positive side power wiring controller (4) and the positive side S with = 妾Ζ 20 on the substrate, the positive side monitoring side monitor wiring 26 via the socket 6 正 and positive 2 However, the positive power supply wiring 24 is electrically connected to the power supply pin 212 and the forward and reverse monitor 2 峨 side power supply wheel == device = - to be connected to each other 30 - 4 and the positive side monitor 28 short circuit And connected to the ground potential. Example 2 on the === part 20, 1, 50-2, 50-3) short on 'multiple side power supply age λ #7, two base 60 substrate 12 20083192 ldoc shipped The negative side monitor is equipped with green +, to pull up. 44 Μ地#f荽, 'friend at the connection port' and the negative side power supply wiring: the grounding 5 is again set. For example, on the substrate of the connecting portion 2G, The negative side κ control wiring 46 is not electrically connected to the negative side power supply wiring 44. However, the controller wiring 46 is connected to the negative side power supply pin 214 via the socket 6 〇 and the negative side power supply pin 214. The negative side monitor wiring 46 Will be connected to the negative plus side supply input terminal 5〇-4 and the negative side monitor 48 Ο ( (3237 constituting the positive side monitor 28 can be connected to the end side power supply via the positive side power supply, 2, 2, 3 〇 ~3), the positive side power pin 212, and the positive power source. The first and second earth's 17 supplied from the power supply unit 22, and the first electric power output from the power supply unit 22 are detected. Pu; pu j socket, external transmission to the device under test · 封二内原 =, 2 〇. Internal transmission of the package = two: The socket 6 〇 and the tested component 2 are detected in the package. The source voltage is degraded. Similarly, the negative side monitor 2', i is out of the power supply_degradation degree in the socket 60 of the negative side power supply system. Then, the seal of the component, preferably, the positive side monitor 28 and the inlet The impedance measuring circuit. For example, the positive side -48 is the electric power input terminal pin 212 on the path to the wheel 3〇-4 flows to the positive side power supply wheel ♦ so that the slave J is preferably the positive side #哭的私4的黾减车's wheel-in impedance is sufficiently greater than from the positive side ^ 13
Joe 200831921 幸M入端子3 0至正侧雷源姑敗 调电，原接卿212為止的路徑上的阻抗。 • 又卞乂<土為’負側監控器48的輸人阻抗亦相同。 • 例如，將正侧監控器28的輸入阻抗設為zin，且將 正側電源接藤P 212經由正側電源輸入端子3〇一4直 ，控器28為止的傳送路徑上的傳送路徑阻抗設為zmrj %，正側|£控器28上的測量誤差顯示為··Joe 200831921 Fortunately M into the terminal 3 0 to the positive side of the source of the source of the loss of power, the impedance of the path until the original 212. • The input impedance of the negative-side monitor 48 is also the same. • For example, the input impedance of the positive side monitor 28 is set to zin, and the positive side power supply port P 212 is connected to the front side power supply input terminal 3, and the transmission path impedance on the transmission path up to the controller 28 is set. For zmrj %, the measurement error on the positive side of the controller 28 is shown as ··
Zinr/(Ziii+Znir)。 〇 以正舰控器28㈣核抗可設定為使·彳量誤差小 二寺於預先設定的容許誤差Er。x，負侧監控器 =阻抗亦可囉地奴為使_量誤差小於料容許誤差 裝的述=可使電源電壓從被測試元件200的封 t内讀达至插座60外部時的電源電㈣劣化減低。因 ’可南精度地測量施加至動作電路210上的電源電壓。 予的^二Γ監控器28及負側監控器48可根據各自被職 2=壓與檢測出的電壓之差分來測量電源電壓。基 ϋ π£生成部64對正側監控器28及負側監控哭48 #仏泰 壓值大致相同的基準雷厣。萚出唞τ 牝（、'、、口电 和哭μ似 早包&猎由對正侧監控器28及負侧監 二;茂 同的基準電壓，而可高精度地檢測出第1 ίί ° 也口至劝作黾路21〇上的電源電壓。 2中連?部2〇的其他構成例。連接部20除圖 ^>.^5 以夕，更具備調整部66。調整部66可根據 ⑼▲控器62檢測出的電壓來調整電源供給部22輸出的 14 20083192 ldocZinr/(Ziii+Znir). 〇 With the positive hull controller 28 (4), the nuclear reactance can be set to make the 彳 彳 error smaller than the preset tolerance Er. x, negative side monitor = impedance can also be used to make the _ quantity error less than the allowable error of the material = the power supply voltage can be read from the seal of the tested component 200 to the power supply outside the socket 60 (4) The degradation is reduced. The power supply voltage applied to the action circuit 210 is accurately measured. The secondary monitor 28 and the negative monitor 48 can measure the power supply voltage based on the difference between the respective applied voltages and the detected voltages. The base π £ generating unit 64 monitors the positive side monitor 28 and the negative side to monitor the reference threshold of the same pressure value.萚 唞 牝 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 ° The mouth is connected to the power supply voltage on the 21st road of the road. The other configuration example of the 2nd connection unit 2〇. The connection unit 20 further includes an adjustment unit 66 in addition to the figure. The output of the power supply unit 22 can be adjusted according to the voltage detected by the (9) ▲ controller 62. 20083192 ldoc
-L 電源電壓。例如，在對被測試元件200的測試過程中，調 整部66可根據電源監控器62檢測出的電壓，來動態地調 •整電源供給部22輸出的電源電壓。於此情形時，調整部 66可使電源監控器62檢測出的電壓成為預先設定的電 壓，以此來調整電源電壓。又，當第2電源電壓被賦予接 地電壓時，調整部66可調整第1電源電壓。 而且，在對被測試元件200進行測試前，調整部66 亦可將電源供給部2 2輸出的電源電壓進行預先調整，以使 電源監控器62所檢測出的電壓成為預先設定的電壓。於此 情形時，電源供給部22可將被測試元件200測試時欲供給 的電源電壓在被測試元件200測試前亦供給至被測試元件 200。測試裝置100可在調整部66對電源供給部22進行調 整之後，對被測試元件200輸入測試圖案。 根據上述結構，可高精度地調整施加至被測試元件 200的動作電路210上的電源電壓。因此，可高精度地測 試被測試元件200。 Q 又，測試裝置100亦可具備誤差檢測部，以取代調整 部66。誤差檢測部例如是在被測試元件200的測試過程 中，當電源監控器62檢測出的電壓不在規定的範圍内時， 檢測出誤差。根據上述結構，可檢測出測試過程中施加至 動作電路210上的電源電壓是否正常，並且在取得例如否 定的測試結果時，可容易分析原因。 圖4是表示連接部20的其他構成例。本例中，被測試 元件200具備：多個動作電路（210— 1、210 —2)、針對每 15 doc Γ ο 200831921 負側而設置的多個正侧電源接腳212以及多個 接腳214。本例中的動作電物可為欲供二 =源電壓的電路單位。亦即，動作電路可為二 了動作電路21G —2的電源電壓而 曰 #^212 πί! 〇 X ^ M2㈣地，多個負側電源 2源 電路210為單位，於被測試元件200的^^動作 如圖4所示’於各自的動作電路21〇 ;二短路’且 被測試元件200的封裝内部短路。 七、用，亚且於 ::二：電的封裝内 入為子30的組（3〇—卜邓―）如、叹置有正侧電源輸 側電源接腳214的組對庫而:、30 —4)，且與負 的組（50-卜50〜2 '二置有負側電源輪入端子50 ^ ‘···，：)0 — n)。 :原供給部22對正侧電源輸 —個正侧電源輪入端子3〇八 0的各組内的至 f部22獲取電源電愿的正側1^’，，5電源電摩。從電源供 2、3〇i的每1由】子…I 電源供給部22。又 心…己線24而短路，並連接於 各二内的至少—個負側電二二負側電源輪入端子50的 取電源電壓的負側電源輸入:：:50供給電源電壓。獲 心每、編電源=;，、並： 16 20083192 ldoc j侧監控器28以正侧電源輸入蠕子30的各個組為單 位而λ置且於對應的組中，檢測出電源供給部D 仏 ，源電壓的正侧電源輸入端子3〇一4上的電壓。負侧監= 48亦同枚地在對應的組中，檢測出未被供給電源電嚴 負侧電源輸入端子5〇〜n上的電壓。土、 Ο 根據上述結構，可高精度地檢測出供給至各個動作φ 路210上的電源電壓。X，如圖4所示，正側監控器 可對應於多個動作電路210而設置多個，負侧監控器48 可在多個動作電路21Q中共用而設置一個。根據上述結 構，可減少負側監控器48的個數。 圖5疋表不測試裝置1〇〇的其他構成例。測試裝置100 /、備 忙采1〇、測試頭12、性能板（performance board) 、連接* 20、以及探測器（pr〇be) μ。主框架及測 減頭12可^與圖]、中說明的主框架1〇及測試頭12相同。 採測為18載置著被測試元件200,並將該被測試元件 2()()配定的位置上。連接部20 {與被測試元件200 1向而0又置著’且經由探針銷（probe pin) 16而與被測試 兀件200甩性連接著。性能板14在連接部20與測試頭12 之間傳送信號。 立本例&中的連接部相對於圖2至圖4中所說明的連接 部20而5 ’其結構上具有探針銷16以取代插座60。例如 圖2中，在正侧電源輸入端子3〇與正侧電源接腳212之 負侧電源輪入端子5〇與負側電源接腳214之間， a置θ扮、針銷16。本例中的電源監控器62可檢測出探針 17 200831921doc 銷16及被測試元件200的壯士仏； 步料、十、㈣ 的封叙中的電源電墨的劣化。 根據上述結構，亦可高精度 件200的動作電路21〇上 &加至被暮式兀 該被測試元件2G0。. 〜原仏，且^精度地測試 2〇 ^ 上的不同之處在於2其結構 2至圖”所說物接：=。。其他構成要素可與圖 本例令，電源供給部22蘇 電源配線44而連 j正㈣源配線24及負側 叫。又，電源監控_ ^源接腳212及負侧電源接腳 控器配線46而連垃认土二由正侧監控器配線26及負侧監 212及負側電源^^4供給電源電壓的正側電源接腳 根據上述社錯^ 、 電源電壓的劣^。，u 出被測試元件2〇〇的封裝中的 21〇上的電源泰又可:精度地檢測出施加至動作電路 圖7是表t可高精度地測試被測試元件200。 20相對於圖連接部20的其他構成例。本例中的連接部 結構上更具有圖6中所朗的任-連接部2G而言，1 可與圖2蚱6 壓記憶部34。其他構成要素 電壓記憶部斤的任一連接部20相同。 電壓記憶部34 。黾源现控裔62所檢測出的電壓。 62 e, mi ^ ^ ^ ^I，J ^ ^ ^ ^ ^ ^ t ^ ^ 1 甩土的另化。例如，比較部32 doc 200831921 知电壓§己如部34已記憶的電壓來蛊 出的電壓進行比較，以檢測出帝、“书原62新檢測 加” 士 丁乂杈，貝J出私减電壓的劣化。又，比輕 4 32亦可將電壓記憶部34按時 孕乂 < 了间序列而储存的各電壓進 订比幸父，以礆測出電源電壓的劣化。 圍並實施!態說明了本發明，但本發明的技術範 員_目= 所記歲的範圍。本領域技術人 Ο-L power supply voltage. For example, during the test of the device under test 200, the adjustment unit 66 can dynamically adjust the power supply voltage output from the power supply unit 22 based on the voltage detected by the power source monitor 62. In this case, the adjustment unit 66 can adjust the power supply voltage by setting the voltage detected by the power source monitor 62 to a predetermined voltage. Further, when the second power supply voltage is applied to the ground voltage, the adjustment unit 66 can adjust the first power supply voltage. Further, before the test element 200 is tested, the adjustment unit 66 may adjust the power supply voltage output from the power supply unit 22 in advance so that the voltage detected by the power supply monitor 62 becomes a predetermined voltage. In this case, the power supply unit 22 can supply the power supply voltage to be supplied when the device under test 200 is to be tested to the device under test 200 before being tested by the device under test 200. The test apparatus 100 can input a test pattern to the device under test 200 after the adjustment unit 66 adjusts the power supply unit 22. According to the above configuration, the power supply voltage applied to the operation circuit 210 of the device under test 200 can be adjusted with high precision. Therefore, the device under test 200 can be tested with high precision. Further, the test apparatus 100 may be provided with an error detecting unit instead of the adjusting unit 66. The error detecting unit detects an error, for example, during the test of the device under test 200 when the voltage detected by the power source monitor 62 is out of the predetermined range. According to the above configuration, it is possible to detect whether or not the power source voltage applied to the operation circuit 210 during the test is normal, and it is easy to analyze the cause when, for example, a negative test result is obtained. FIG. 4 shows another configuration example of the connecting portion 20. In this example, the device under test 200 includes a plurality of operation circuits (210-1, 210-2), a plurality of positive side power pins 212 and a plurality of pins 214 provided for each 15 doc 2008 ο 200831921 negative side. . The action electric material in this example can be a circuit unit to be supplied with two = source voltage. That is, the action circuit can be the power supply voltage of the action circuit 21G-2, 曰#^212 πί! 〇X ^ M2 (four), and the plurality of negative side power source 2 source circuits 210 are units, and the test element 200 is ^^ The operation is as shown in FIG. 4 'in the respective action circuit 21 〇; two short circuits' and the package inside of the test element 200 is short-circuited. 7. Use, Yahe:: 2: The package of the electricity is inserted into the group of 30 (3〇-Bu Deng). For example, the group of the positive side power supply side power pin 214 is set to sigh: 30 — 4), and with the negative group (50-Bu 50~2 'two have negative side power supply wheels into the terminal 50 ^ '···, :) 0 — n). The original supply unit 22 acquires the positive side 1^' of the power source for each of the f-parts 22 in each group of the positive-side power supply-input-side power supply-in terminal 3. The power supply is electrically charged. From the power supply, each of the 2, 3〇i is supplied by the power supply unit 22. The core is short-circuited by the line 24, and is connected to the negative side power supply input of the power supply voltage of at least one negative side electric two-second negative power supply terminal 50 of each of the two terminals: ::50 to supply the power supply voltage. The power supply is replaced by a power supply unit D; The voltage on the positive side power supply input terminal 3〇4 of the source voltage. The negative side monitor = 48 also detects the voltage that is not supplied to the power supply negative side power supply input terminals 5 〇 n n in the corresponding group. Soil and Ο According to the above configuration, the power supply voltage supplied to each of the operation φ paths 210 can be detected with high precision. X, as shown in Fig. 4, a plurality of positive side monitors may be provided corresponding to the plurality of operation circuits 210, and a negative side monitor 48 may be shared by the plurality of operation circuits 21Q. According to the above structure, the number of the negative side monitors 48 can be reduced. Fig. 5 shows another configuration example of the test device 1〇〇. Test device 100 /, busy 1 〇, test head 12, performance board, connection * 20, and detector (pr〇be) μ. The main frame and the reduction head 12 can be the same as the main frame 1A and the test head 12 described in the drawings. It is measured that 18 is placed on the device under test 200, and the position to be tested 2 () () is assigned. The connecting portion 20 {and the member to be tested 200 1 and 0 is placed again' and is connected to the device to be tested 200 via a probe pin 16. The performance board 14 transmits signals between the connection 20 and the test head 12. The connecting portion in the present example &> has a probe pin 16 instead of the socket 60 with respect to the connecting portion 20 illustrated in Figs. 2 to 4. For example, in Fig. 2, between the negative side power input terminal 3A and the negative side power supply terminal 5' of the positive side power pin 212 and the negative side power pin 214, a pin and pin 16 are placed. The power monitor 62 in this example can detect the degradation of the power supply ink in the pin 17 of the probe 17 200831921 doc pin 16 and the component under test 200 in the coffin of the step, ten, and (iv). According to the above configuration, the operation circuit 21 of the high-precision device 200 can be applied to the device under test 2G0. ~ The original 仏, and ^ precision test 2 〇 ^ The difference is that 2 its structure 2 to the figure "the object is connected: =.. Other components can be combined with the diagram, power supply 22 power supply The wiring 44 is connected to the positive (four) source wiring 24 and the negative side. In addition, the power supply monitoring _ ^ source pin 212 and the negative side power pin controller wiring 46 are connected to each other by the positive side monitor wiring 26 and negative The side monitor 212 and the negative side power supply ^^4 supply the positive side power pin of the power supply voltage according to the above-mentioned social error ^, the power supply voltage is inferior ^, u out the power of the 21 〇 package in the package of the tested component 2〇〇 Further, it is possible to accurately detect the application to the operation circuit. FIG. 7 is a table t which can test the device under test 200 with high precision. 20 Other configuration examples with respect to the diagram connection portion 20. The connection portion in this example is further structured as shown in FIG. In the case of the connection unit 2G, the first connection unit 2G can be the same as the connection unit 20 of the other component voltage storage unit. The voltage storage unit 34. The detected voltage 62 e, mi ^ ^ ^ ^I, J ^ ^ ^ ^ ^ ^ t ^ ^ 1 The localization of the bauxite. For example, the comparison section 32 doc 2 00831921 Knowing voltage § has been compared with the voltage that has been memorized by the voltage of the part 34, in order to detect the deterioration of the voltage of the privately-reduced voltage of the "new test plus" of the book. The light 4 32 can also predict the deterioration of the power supply voltage by predicting the voltage of each of the voltages stored in the voltage memory unit 34 in time and in sequence. The present invention has been described. The technical expert of the present invention is the range of the aged age.
Q 己載顯然瞭解，緩上述變更或改良後的形 、可匕3於本發明的技術範圍内。 根據以上說明的測試裝置，可檢測出被職元件的封 二I :電源電壓的劣化。又，可高精度地檢測出施加至動 =上的電源電壓，且可高精度地 被 【圖式簡單說明】 圖1疋表示本發明之一實施形態的測試裝置100的構 成之一例。 固2疋表示連接部20的構成之一例。 圖3 ^表示連接部2〇的其他構成例。 圖4是表示連接部2〇的其他構成例。 圖 S I _ 疋表示測試裝置100的其他構成例。 圖6是表示連接部20的其他構成例。 圖 7 I i ~ + —疋辰不連接部20的其他構成例。 L主要元件符號說明】 ·主樞架 u :測試頭 19 200831921doc 14 :性能板 16 :探針銷 18 :探測器 20 :連接部 22 :電源供給部 24 :正側電源配線 26 :正侧監控器配線 28 :正側監控器 30 ·•正側電源輸入端子 32 :比較部 34 :電壓記憶部 44 :負側電源配線 46 :負側監控器配線 48 :負側監控器 50:負側電源輸入端子 60 :插座 q 62 :電源監控器 64 :基準電壓生成部 66 :調整部 100 :測試裝置 200 :被測試元件 210 :動作電路 212 :正侧電源接腳 214 :負侧電源接腳 20Q It is apparent that it is understood that the above-described changes or improvements are within the technical scope of the present invention. According to the test apparatus described above, it is possible to detect the deterioration of the power supply voltage of the component I. Further, the power supply voltage applied to the motion = can be detected with high accuracy, and can be accurately described. [Fig. 1A] Fig. 1A shows an example of the configuration of the test apparatus 100 according to an embodiment of the present invention. The solid state 2 shows an example of the configuration of the connecting portion 20. Fig. 3 is a view showing another configuration example of the connecting portion 2A. FIG. 4 shows another configuration example of the connecting portion 2A. The figure S I _ 疋 indicates another configuration example of the test apparatus 100. FIG. 6 shows another configuration example of the connecting portion 20. Fig. 7 shows another example of the configuration of the I i ~ + - 疋 不 disconnecting unit 20. L main component symbol description] · Main pivot u: Test head 19 200831921doc 14 : Performance board 16 : Probe pin 18 : Detector 20 : Connection part 22 : Power supply part 24 : Positive side power supply wiring 26 : Positive side monitor Wiring 28: Positive side monitor 30 • Positive side power input terminal 32 : Comparison unit 34 : Voltage memory unit 44 : Negative side power supply wiring 46 : Negative side monitor wiring 48 : Negative side monitor 50 : Negative side power input terminal 60: socket q 62 : power monitor 64 : reference voltage generating unit 66 : adjusting unit 100 : test device 200 : device under test 210 : operating circuit 212 : positive side power pin 214 : negative side power pin 20