'V 'V200829102 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種電路板之製作方法，尤指一種可達 到穩固貼合的鋁合金電路板之製作方法。 【先前技術】'V 'V200829102 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD The present invention relates to a method of fabricating a circuit board, and more particularly to a method of fabricating an aluminum alloy circuit board that can be stably bonded. [Prior Art]
Is合金板由於具有良好的導熱性質5因此5其逐漸廣 泛的被運用於電路板的散熱之上。 所謂銘合金電路板係將銘合金板貼合於電路板的非電 路佈設面’藉此令該鋁合金板直接吸收電路板所產生的熱 篁’並散逸至外部介質達到良好的散熱；亦或，於鋁合金 板表面貼合銅箔或者銅板，再藉由蝕刻方式，令銅箔或者 銅板直接於鋁合金板表面形成電路。 現有技術中，前述電路板（或銅箔、銅板）與铭合金 板相貼合之達成，係以一散熱膠片夾合於兩者的貼附表面 之間，藉由熱熔或壓合方法令該散熱膠片黏合於電路板（或 鋼箔、銅板）與鋁合金板表面。 然而，鋁合金板之表面極容易產生氧化膜，當鋁合金 板表面形成氧化膜而貼附至散熱膠片時，將導致該鋁合金 板與散熱膠片之間的結合力衰退，使得鋁合金板與電路板 (或銅箔、銅板）相互間無法穩固的貼合。 【發明内容】 為令鋁合金電路板可穩固的貼合，本發明之目的係在 於提供一鋁合金電路板之製作方法。 為達則述目的，本發明所運用之技術手段係將銘合金 5 ,200829102 、2 板貼合於一電路元件（例如：電路板、銅箔或銅板）的非 電路佈設面；亦或，於鋁合金板表面貼合銅箔或者銅板， 再藉由蝕刻方式，令銅箔或者鋼板直接於鋁合金板表面形 成電路；其中，該電路元件與鋁合金板的貼附表面之間， 係夾合黏附有一散熱膠片，藉由熱熔或壓合方法令該散熱 膠片黏合於電路元件與鋁合金板表面； 而本發明之特徵在於：該銘合金板在對散熱朦片進行 貼合之前，係先進一步對其表面施以機械磨刷、噴砂處理 及鉻系皮膜處理（或非鉻系皮膜處理），令其表面之氧化 膜得以去除，以增加鋁合金板與電路元件間散熱膠片之結 合力，以達到穩固的貼合。 【實施方式】 本發明之鋁合金電路 以機械磨刷，其係將 一磨刷裝置（圖中未 請配合第二圖參看第一圖所示， 板之製作方法，其步驟包括有：Because the Is alloy plate has good thermal conductivity, it is gradually used in the heat dissipation of the board. The so-called alloy circuit board is attached to the non-circuit layout surface of the circuit board, so that the aluminum alloy plate directly absorbs the heat generated by the circuit board and dissipates to the external medium to achieve good heat dissipation; A copper foil or a copper plate is bonded to the surface of the aluminum alloy plate, and the copper foil or the copper plate is directly formed on the surface of the aluminum alloy plate by etching. In the prior art, the foregoing circuit board (or copper foil, copper plate) and the alloy plate are bonded together, and a heat-dissipating film is sandwiched between the attachment surfaces of the two, by means of hot-melting or pressing. The heat-dissipating film is bonded to the surface of the circuit board (or steel foil, copper plate) and the aluminum alloy plate. However, the surface of the aluminum alloy plate is extremely likely to generate an oxide film. When the surface of the aluminum alloy plate is formed into an oxide film and attached to the heat dissipating film, the bonding force between the aluminum alloy plate and the heat dissipating film is degraded, so that the aluminum alloy plate and the aluminum alloy plate are The circuit boards (or copper foils, copper plates) cannot be firmly bonded to each other. SUMMARY OF THE INVENTION In order to make a stable adhesion of an aluminum alloy circuit board, the object of the present invention is to provide a method for fabricating an aluminum alloy circuit board. For the purpose of the above description, the technical means used in the present invention is to attach the alloy 5, 200829102, and 2 plates to a non-circuit layout surface of a circuit component (for example, a circuit board, a copper foil or a copper plate); or, in aluminum The surface of the alloy plate is bonded with a copper foil or a copper plate, and the copper foil or the steel plate is directly formed on the surface of the aluminum alloy plate by etching, wherein the circuit component and the attached surface of the aluminum alloy plate are bonded and adhered. a heat dissipating film is bonded to the surface of the circuit component and the aluminum alloy plate by a hot melt or a pressing method; and the present invention is characterized in that the alloy plate is further advanced before the heat dissipating film is bonded. The surface is mechanically brushed, sandblasted and treated with a chrome-based film (or non-chrome-based film treatment) to remove the oxide film on the surface to increase the bonding force between the aluminum alloy plate and the heat-dissipating film between the circuit components. Achieve a firm fit. [Embodiment] The aluminum alloy circuit of the present invention is mechanically brushed, which is a brushing device (not shown in the figure with reference to the second figure, the method for manufacturing the board, the steps of which include:
對一鋁合金板（10)的表面施 該鋁合金板（i 〇 )的板體表面藉由 示）來進行磨刷； 貝吵恳理，其係利 二:鋼ΤΓ銘合金板表面喷射以微小的珠體（該珠體 =材=珠、陶莞珠、具圓面的碳鋼粒子或具圓珠 旧仕何材科的粒子）， 合全;0 =勻且费集的撞擊該銘 小圓E7 #，A ~ 』生k形而形成密密麻麻的 回凹展，而完全除去該銘合金板 對該鋁合金柘i 面之巩化膜， 、’ （1 〇 )的表面施以鉻系皮膜處理，其 6 200829102 係依序對該鋁合金板（1 〇 )表面進行去油脂、水洗、酸 洗、皮膜處理、最後水洗、電著塗裝、水洗、烘乾等步驟； 其中皮膜處理係藉由喷洗式（皮膜重量〇 8-18g/m2)與浸 洗式（皮膜重量2.0-3.0g/m2)來形成鉻皮膜（2 〇 ); 請配合參看第三圖所示，前述對該鋁合金板（i 〇 ) 的表面施以鉻系皮膜處理的步驟，亦可取代為對該鋁合金 板（1 0 )的表面施以非鉻系皮膜處理，其係依序對該鋁 _ 合金板（1〇)表面進行去油脂、水洗、酸洗、皮膜處理、 最後水洗、電著塗裝、水洗、烘乾等步驟；其中皮膜處理 係藉由喷洗式（皮膜重量（K8-18g/m2)與浸洗式（皮膜重 量2· 0-3· 0g/m2)來形成非鉻皮膜（2 0 ,)(例如：鎂、 鋁）； 於該鋁合金板（10)的皮膜表面鋪設散熱膠片（3 0 )； 於散熱膠片（30)相對於鋁合金板（1 〇)的另一 表面上，鋪設一電路元件（4 0 )例如：電路板、銅箔或 銅板； 對丽述最後結構物進行加熱或加壓，使鋁合金板（工 0 )以其皮膜（2 0 ) ( 2 〇 ’）與散熱膠片（3 〇 )相 貼固，且散熱膠片（3 〇 )相對於鋁合金板（丄〇 )的另 一表面與電路元件（4 0 )相貼固； 令電路兀件（4 〇 )表面形成電路，其可利用茲刻方 式，令電路板表面形成電路，或利用#刻方式令銅箱或者 銅板則直接於鋁合金板（i 〇 )表面形成電路。 7 200829102 由上可知，該鋁合金板（1 〇)在貼合之前，其表 的氧化膜即已被去除，此加上其表面的鉻系或非鉻系^膜 (2 0 ) ( 2 0,)貼附於散熱膠片（3 〇 )表面，可提 昇該鋁合金板（10)與電路元件（4〇)間的結合力， 因而形成穩固的鋁合金電路板。 【圖式簡單說明】 第一圖係本發明之製作方法流程圖。 第二圖係本發明之鋁合金電路板最終結構側面剖視示 意圖。 第三圖係本發明之鋁合金電路板另一實施例之最終結 構侧面剖視示意圖。 【主要元件符號說明】 (10)鋁合金板 （20)鉻皮膜 (20 )非鉻皮膜（30)散熱膠片 (4 0 )電路元件Applying the surface of the plate of the aluminum alloy plate (i 〇) to the surface of an aluminum alloy plate (10) by means of a brush; the shell is noisy, and the tie is two: the surface of the steel ΤΓ 合金 alloy plate is sprayed Tiny beads (the beads = material = beads, pottery beads, round carbon steel particles or particles with round beads of the old stone), complete; 0 = uniform and expensive impact of the Ming Xiaoyuan E7 #, A ~ 』 raw k-shaped to form a dense back-concave exhibition, and completely remove the alloy plate to the aluminum alloy 柘i surface of the sclering film, and the surface of '(1 〇) is treated with chrome film , 6 200829102 sequentially removes the surface of the aluminum alloy plate (1 〇) by degreasing, washing, pickling, film treatment, final washing, electrocoating, washing, drying, etc. Spray-type (film weight 〇 8-18g/m2) and immersion type (film weight 2.0-3.0g/m2) to form chrome film (2 〇); please refer to the third figure, the aforementioned aluminum alloy The surface of the plate (i 〇) is subjected to a chrome-based film treatment step, and the surface of the aluminum alloy plate (10) may be replaced with a non-chromium system. Membrane treatment, which sequentially removes the surface of the aluminum alloy plate (1 〇) by degreasing, washing, pickling, film treatment, final water washing, electrocoating, water washing, drying, etc. Forming a non-chromium film (20,) (for example, magnesium, aluminum) by spray-washing (film weight (K8-18g/m2) and dipping type (film weight 2·0-3·0g/m2); The surface of the aluminum alloy plate (10) is provided with a heat dissipating film (30); on the other surface of the heat dissipating film (30) with respect to the aluminum alloy plate (1 〇), a circuit component (40) is laid, for example: a circuit Plate, copper foil or copper plate; heating or pressurizing the final structure of the Lishi, so that the aluminum alloy plate (work 0) is adhered to the heat-dissipating film (3 〇) by the film (20) (2 〇'), And the other surface of the heat-dissipating film (3 〇) is attached to the circuit component (40) with respect to the other surface of the aluminum alloy plate (丄〇); the surface of the circuit component (4 〇) is formed into a circuit, which can be utilized in an engraved manner. Form the circuit on the surface of the board, or use the #刻方式 to make the copper box or copper plate directly form the surface of the aluminum alloy plate (i 〇) 7 200829102 It can be seen from the above that the aluminum alloy plate (1 〇) has been removed before the bonding, and the surface of the chrome or non-chromium film (20) (2) 0,) attached to the surface of the heat-dissipating film (3 〇), which can enhance the bonding force between the aluminum alloy plate (10) and the circuit components (4〇), thus forming a stable aluminum alloy circuit board. [Simple description] The first drawing is a schematic cross-sectional view of the final structure of the aluminum alloy circuit board of the present invention. The third drawing is a side view of the final structure of another embodiment of the aluminum alloy circuit board of the present invention. See the schematic. [Main component symbol description] (10) Aluminum alloy plate (20) Chrome film (20) Non-chrome film (30) Thermal film (4 0 ) Circuit components