200828547 九、發明說明： 【發明所屬之技術領域】 本發明係有關一種基板結構及其植球方法，特別是關於一 種應用於球柵陣列封裝之基板結構及其植球方法。 【先前技術】 近年來，隨著終端消費性電子產品朝向「輕、薄、短、小」及多 功能化發展的趨勢，積體電路(Integrated circuit, 1C)之晶片（也中)構壯 技術亦朝向高密度化、小型化、高腳數化的方向前進，為了實^小二 化與窄腳距的封裝、以及改善散熱等問題，目前球拇陣列二裝社構 _⑽Array, BGA)、覆晶㈣Chip)、晶片尺寸封褒(啊㈣ Package，CSP)等先進構裝技術已成為主流，其中之球栅陣列封裝相較 於打線封裝，具有信號傳輸延遲小、應箱率高 '散熱能力強及封裝 體積小等優點’所以廣泛應用於各種不同型式的封裝結構，包括窗 型球柵陣列封裝結構、細間距球栅陣列(Fine pitch BGA, FBGA)封裝結 構、超細間距球柵陣列(Very Fine pitch BGA, VFBGA)封裝結構、微型 球拇陣列(micro BGA，#BGA)封褎結構及疊置式多晶片球拇陣列 (Stacked-type Multi-Chip Package BGA，St_MCP BGA)封裝結構等。 因此，高密度晶片構裝需要高密度、高品質與低成本的晶片封褒 基板(substrate)予以配合。 第1圖是一習知球柵陣列封裝基板的剖面示意圖，一基板2具有 一第一表面ό與一第二表面1〇，且基板2内部具有一佈線扣⑽勻4， 其材質為銅(Cu)，其中，第一表面6具有暴露出部分佈線4的複數第 一凹槽；複數焊球塾(solder ball pad) 8設於第一凹槽並暴露出第一表 面6，其中，焊球墊8與佈線4電性連接，任一焊球墊8為一有機可 火干性保遵墊(Organic Solderability Preservative, OSP)，其用以電性連接 5 200828547 ^solder ball)(圖中未示)，焊球作為輸入/輸出(input/〇傘刚) 端，藉之使基板2得以電性連接一外界裝置(圖中未示），例如以表面 «_Surfaee M_t TeehnQk)gy，SMT)來完成球杨陣列封裝結構 與-印刷電路板(P_d Circuit Board，PCB)(圖中未示)的構裝 連接。 接續上述制，第二表面1G具有暴露_分佈線4的複數第二 凹槽，複數焊墊12設於第二凹槽並暴露出第二表面1〇，其令，焊塾 12與佈線4電性連接，任_焊墊12由_層鎳⑽14及—層金⑽）％ 所組成，其中，鎳14設於佈線4表面，而金16設於鎳14上；焊塾 12用以電性連接複數焊線(b〇ndingwire)(圖中未示》焊線的功用是電 $連接載設於封裝結構中之一晶片（圖中未示)與佈線4，藉之使晶片 得以電性連接基板2，並_得以雜連接—外界裝置⑽中未示）， 例如一印刷電路板(圖中未示）。 第2A圖至第2B圖是一習知球栅陣列封裝之植球_ _的方 法的步驟示意®，其步驟包含··提供—球栅_封裝基板2，基板2 具有-第-表面6 ’且第-表面6具有複數凹槽，基板2内部具有佈 線4，且凹槽暴露出部分佈線4，複數焊球墊8設於凹槽並暴露出第 表面6 ’其中，焊球墊8與佈線4電性連接，且焊球墊8為一有機 可輝性保護墊_-轉师，於焊球墊8表面；佈植扣〇械） 複數焊球2G於助焊_ux) 18上；以及迴焊㈣㈣，使複數焊球％ 與佈線4電性連接。 然而，此種採用有機可焊性保護墊作為焊球塾之球栅陣列封裝基 板具有數項缺點’包括焊球墊下面之銅會發生銅氧化(Cu〇涵㈣現 象以及發生焊球遷移(ball shifting)現象。 第3圖是另-習知球柵陣列封裝基板的剖面示意圖，基板22呈 有第-表面26與第二表面34，且基板22内部具有—佈線(t·) i 其材質為銅(Cu)，其中，第一表面26具有暴露出部分佈線％的複數 6 200828547 第-凹槽；複數焊球墊28設於第_凹槽並暴露出第—表面％，其中， 焊球墊28與佈線24電性連接，任一谭球塾28由一層錄％及一声金 32所組成，其中，鎳3〇設於佈線24表面，而金％設於錄3〇上^桌 30/金32通常是由電鍍(platlng)或無電解錄含浸金(胸士 M制 觀腿⑽，腿G)等方法所製作；焊球塾28用以電性連接複數 ba_中未示），焊球作為輸人____，吻 端’藉之使基板22得以電性連接一外界裝置(圖中未示 接績上述說明，第二表面34具有暴露出部分佈線24的複數第二 凹槽’複數焊墊36設於第二凹槽並暴露出第二表面34，盆中，焊塾 36與佈線24電性連接，任—焊墊36由_層㈣及—層金術斤組成， 其中’鍊38設於佈線24表面，而金4G設於錄38上；焊塾％用以 電性連接複數焊線(bondingWire)(圖中未示），焊線的功用是電性連接 載設於封裝結構中之-晶片（圖中未示)與佈線24,藉之使晶片得以電 性連接基板22，並因而得以電性連接—外躲置(圖中未示），例如一 印刷電路板(圖中未示 然而’此種採用-層錄及一層金作為焊球墊之球栅陣列封裝基板 的缺點是材料成本高，而且金制化._r.Metallle IMC)上之焊球容易發生破裂(啦冰)現象。 【發明内容】 為解決習知技術以有機可焊性保輕作為焊球觸產生之銅 化，焊球遷移等問題，本發明目的之—係提供—種採卿有機 可知性保護墊作鱗雜之基減構及其植球方法。 ^為解決習知技術之金/鎳焊球墊所產生之焊球破裂等問題，本 發，目的之一係提供一種採用錫/有機可焊性保護墊作為谭球墊 之基板結構及其植球方法。 200828547 列封球橋陣 線，其設於基板内部，其中，有凹槽=二=复數凹槽;-佈 其設於凹槽並暴露出表面，其中 二電卜球塾， 墊包括··一層錫，並設於_矣品n線連接，任一焊球 於錫上。 〃、布4表面；及一層有機可焊性保護塾，其設 球方:，了包T·鱼本發明-實施例之球栅陣列嶋植 且表面具魏數_：~基餘財—表面， 及一層有機哪由一層錫 谭tiitr蚀助焊劑於焊球塾表面；佈植複數焊球於助 上，及迴烊，使焊球與佈線電性連接。 易瞭=:ΓΓΓ*_圖式詳加說明，當更容 之目的'技術内容、特點及其所達成之功效。 【實施方式】 而非用以限 詳細說明如下，所述較佳實施例僅做-說明 定本發明。 第4暇本發明—實_之球柵陣韻裝基板_面示意圖，一 j 42具有一第一表面46與一第二表面54，且基板42内部具有一 一《（trace)44’其中’第一表面46具有暴露出部分佈線糾的複數第 曰凹槽，複數焊球墊48設於第一凹槽並暴露出第一表面46，其中， 4球塾48與佈線44電性連接，任一焊球墊仙由一層錫㈣％及一 200828547 機I焊性賴墊52所組成，其中，錫5〇設_線44表面，而 破rH生做塾52設於錫5〇上；焊球墊48用以電性連接複數焊 ，derballX圖中未示），焊球作為輸入/輸出(—ο,，ι/〇)端， 精之使基板42得以電性連接—外界裝置(圖中未示）。 在實施例中’基板42可為服4(版她也加抑心〇f⑽)基 =、FR5(Fire ret_nt _ Gf G11)基板或 Βτ_ —基板，且‘ 貝可為有機玻璃纖維、環氧樹脂或上述之組合；佈線44 ^ 銅㈣，·且錫50之-厚度可等於或小於3〇 = 保護墊52之-厚度可等於或小於2〇微米。 幻斗陸 接續上述說明，第二表面34具有暴露出部分佈線糾的複數第二 凹槽’在-實施财，複數焊墊56設於第二凹槽並暴露出第二表面 34，其中，焊墊56與佈線44電性連接，任一焊墊弘由一声鎳別及 -層金60所組成，其中，錄58設於佈線44表面，而金⑼設於錄兄 上’知塾56用以電性連接複數焊線(⑹出吨从㈣（圖令未示），焊 的功用是電性連接載設於封裝結構巾之―晶片（财未示）與佈線 44，藉之使晶片得以電性連接基板42，並因而得以電性連接一外界裝 置(圖中未示），例如一印刷電路板(圖中未示）。 * 因此，本發明之球柵陣列封裝基板的特徵之一是採用錫/有機可 焊性保護墊作鱗球墊，因此可避免f知技細有機可焊性保護塾作 為知球墊之魄化現減焊球遷移齡，也可解料知技術之金/錄 丈干球塾的知球破裂問題，而且成本比金/鎳焊球塾低廉。 、~' 第5A圖至帛5B _是本發明-實施例之球栅陣列封裝的植球方 法步驟示意圖，其步驟包括：提供一球柵陣列封裝基板42，基板G 具有第一表面46，且第一表面46具有複數凹槽，基板42内部"且有佈 線44，且凹槽暴露出部分佈線44，複數焊球墊仙設於凹槽内^暴露 出第一表面46，其中，焊球墊48與佈線44電性連接，且焊球塾' = 由一層錫50及一層有機可焊性保護墊52所組成，其中，錫％設於 9 200828547 佈線44表面，有機可焊性 於焊球塾48表面；你括…缸又於錫〇上’塗佈一助焊劑62 (布植復數焊球64於助焊劑48上；以a、 _吵使焊球64與佈線44電性連接以上，以及迴焊 在一實施例中，焊球64的材質可包含錫 輸可焊性保護墊物球塾的 < 土板及其植球方法具有高品f與低成本等優點。 述之實施例僅係為說明本發明之技 /. :墟:：的在使熟習此項技藝之人士能夠瞭解本發明之内： 太=以實施’當不能以之㈣本發明之專利範圍，即大凡依 神所作之均等變化或修飾，仍應涵蓋在本 發明之專利範圍内。 4 【圖式簡單說明】 第1圖是一習知球柵陣列封裝基板的剖面示意圖； 第2A圖至第2B ®是一習知球柵陣列封裝之植球方法的步驟示音 圖； 〜 第3圖是一習知球柵陣列封裝基板的剖面示意圖； 第4圖是本發明一實施例之球柵陣列封裝基板的剖面示意圖，·及 第5A圖至第5B圖是本發明一實施例之球栅陣列封裝的植球方法步 驟示意圖。 【主要元件符號說明】 2'22、42 基板 4、24、44 佈線 10 200828547 6、26、46 第一表面 8、28、48 焊球塾 10、34、54 第二表面 12、36、56 焊墊 14、30、38、58 鎳 16、32、40、60 金 18、48、62 助焊劑 20、64 焊球 50 錫 52 有機可焊性保護墊BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate structure and a ball-spreading method thereof, and more particularly to a substrate structure applied to a ball grid array package and a ball-spreading method thereof. [Prior Art] In recent years, with the trend of “light, thin, short, small” and multi-functional development of end-consumer electronic products, integrated circuit (1C) wafers (also in the middle) In the direction of high density, miniaturization, and high-volume, in order to achieve small-sized and narrow-pitch packaging, and to improve heat dissipation, the current ball-shaped array is equipped with _(10)Array, BGA, Advanced packaging technology such as flip chip (Chip), chip size package (A4 package, CSP) has become the mainstream. Among them, the ball grid array package has lower signal transmission delay and higher box rate than the wire package. Strong and small package size, so it is widely used in a variety of different types of package structure, including window ball grid array package structure, fine pitch ball grid array (Fine pitch BGA, FBGA) package structure, ultra-fine pitch ball grid array ( Very Fine pitch BGA, VFBGA) package structure, micro bGA (#BGA) sealing structure and stacked multi-chip package BGA (St_MCP BGA) package structure. Therefore, high density wafer fabrication requires high density, high quality and low cost wafer package substrates. 1 is a schematic cross-sectional view of a conventional ball grid array package substrate. A substrate 2 has a first surface ό and a second surface 〇, and the substrate 2 has a wiring button (10) 4 therein. The material is copper (Cu). The first surface 6 has a plurality of first grooves exposing the partial wires 4; a plurality of solder ball pads 8 are disposed on the first grooves and exposing the first surface 6, wherein the solder ball pads 8 Electrically connected to the wiring 4, any solder ball pad 8 is an Organic Solderability Preservative (OSP), which is used to electrically connect 5 200828547 ^solder ball) (not shown), The solder ball is used as an input/output (input/an umbrella) end, so that the substrate 2 can be electrically connected to an external device (not shown), for example, by the surface «_Surfaee M_t TeehnQk) gy, SMT). The array package structure is connected to a structure of a P_d Circuit Board (PCB) (not shown). Following the above process, the second surface 1G has a plurality of second recesses exposing the distribution line 4, and the plurality of pads 12 are disposed in the second recesses and exposing the second surface 1〇, which causes the solder bumps 12 and the wiring 4 to be electrically The solder connection 12 is composed of _ layer nickel (10) 14 and - layer gold (10))%, wherein the nickel 14 is disposed on the surface of the wiring 4, and the gold 16 is disposed on the nickel 14; the soldering ring 12 is electrically connected The function of the bonding wire (not shown) is to connect one of the wafers (not shown) and the wiring 4 in the package structure, thereby electrically connecting the substrate to the substrate. 2, and _ can be connected to the outside device (not shown in the external device (10)), such as a printed circuit board (not shown). 2A to 2B are schematic diagrams of a method of a conventional ball grid array package ball _ _, the steps of which include providing a ball grid _ package substrate 2, the substrate 2 having a - surface-surface 6 ' and - the surface 6 has a plurality of grooves, the substrate 2 has a wiring 4 inside, and the groove exposes a portion of the wiring 4, and a plurality of solder ball pads 8 are provided in the recess and expose the first surface 6', wherein the solder ball pad 8 and the wiring 4 are electrically Sexual connection, and the solder ball pad 8 is an organic bright protective pad _-transfer, on the surface of the solder ball pad 8; the planting buckle mechanism) a plurality of solder balls 2G on the welding _ux) 18; and reflow (4) (4), the plurality of solder balls % are electrically connected to the wiring 4. However, such a ball grid array package substrate using an organic solderability pad as a solder ball has several disadvantages. 'The copper under the solder ball pad will undergo copper oxidation (Cu 〇 ( (4) phenomenon and solder ball migration (ball) Fig. 3 is a schematic cross-sectional view of another conventional ball grid array package substrate. The substrate 22 has a first surface 26 and a second surface 34, and the substrate 22 has a wiring (t·) i made of copper ( Cu), wherein the first surface 26 has a plurality of 6 200828547 first grooves that expose a portion of the wiring %; a plurality of solder ball pads 28 are disposed on the first groove and expose the first surface %, wherein the solder ball pads 28 are The wiring 24 is electrically connected, and any Tan ball 塾 28 is composed of a layer of recording % and a sound of gold 32, wherein nickel 3 〇 is disposed on the surface of the wiring 24, and the gold % is set on the recording 3 ^ ^ table 30 / gold 32 usually It is made by electroplating (platlng) or electroless recording of impregnated gold (chest M-made leg (10), leg G); solder ball 塾 28 for electrically connecting plural ba_ not shown), solder ball as an input The person ____, the kiss end' borrows the substrate 22 to be electrically connected to an external device (the above is not shown in the figure) The second surface 34 has a plurality of second recesses exposing a portion of the wiring 24. The plurality of pads 36 are disposed in the second recess and expose the second surface 34. The soldering 36 is electrically connected to the wiring 24 in the basin. The bonding pad 36 is composed of a layer (4) and a layer of gold, wherein the 'chain 38 is disposed on the surface of the wiring 24, and the gold 4G is disposed on the recording 38; the solder % is used to electrically connect the bonding wire (bonding wire) (not shown), the function of the bonding wire is to electrically connect the wafer (not shown) and the wiring 24 in the package structure, thereby electrically connecting the wafer to the substrate 22, and thus electrically Connection-outside (not shown), such as a printed circuit board (not shown in the figure, however, the disadvantage of this type of use-layer recording and a layer of gold as a solder ball mat ball grid array package substrate is that the material cost is high, Moreover, the solder ball on the metallized ._r.Metallle IMC is prone to cracking (glazing) phenomenon. [Disclosed] In order to solve the conventional technique, the organic solderability is light and the soldering is generated as a solder ball. For the purpose of migration, etc., the object of the present invention is to provide a kind of organically identifiable protective pad for the scaly reduction. Structure and ball placement method. ^In order to solve the problem of solder ball rupture caused by the gold/nickel solder ball pad of the prior art, one of the purposes of the present invention is to provide a tin/organic solderability protection pad as a ball. The substrate structure of the pad and the ball placement method thereof. 200828547 The ball joint bridge line is arranged inside the substrate, wherein there is a groove=two=plural groove; the cloth is disposed in the groove and exposes the surface, wherein the second wire卜球塾, The mat includes a layer of tin, and is set on the _ n product n-line connection, any solder ball on the tin. 〃, cloth 4 surface; and a layer of organic solderability protection 塾, its ball: The package of the present invention - the ball grid array of the embodiment is implanted and the surface has a Wei number _: ~ base money - surface, and a layer of organic which is a layer of tin tan Tiitr etch flux on the surface of the solder ball; The plurality of solder balls are assisted and returned to electrically connect the solder balls to the wiring. Easy =: ΓΓΓ * _ map details to explain, when the purpose of the more convenient 'technical content, characteristics and the effects achieved. [Embodiment] It is to be understood that the following description The fourth embodiment of the present invention is a schematic diagram of a ball grid array substrate, a j 42 having a first surface 46 and a second surface 54, and the substrate 42 has a "trace" 44' therein. The first surface 46 has a plurality of second recesses exposing a portion of the wiring correction. The plurality of solder ball pads 48 are disposed in the first recess and expose the first surface 46. wherein the four bulbs 48 are electrically connected to the wiring 44. A solder ball mat is composed of a layer of tin (four)% and a 200828547 machine I soldering pad 52, wherein tin 5 is set to _ line 44 surface, and broken rH is made of 塾52 on tin 5 ;; solder ball Pad 48 is used to electrically connect the plurality of solders, not shown in the derballX diagram. The solder balls serve as input/output (-o, ι/〇) ends, and the substrate 42 can be electrically connected to the external device (not shown) Show). In the embodiment, the substrate 42 may be a clothing 4 (also known as a frustrated f(10)) base, a FR5 (Fire ret_nt _ Gf G11) substrate or a Βτ_-substrate, and 'become is a plexiglass fiber, an epoxy resin. Or a combination of the above; the wiring 44 ^ copper (four), and the thickness of the tin 50 may be equal to or less than 3 〇 = the thickness of the protective pad 52 may be equal to or less than 2 〇 micrometers. In addition to the above description, the second surface 34 has a plurality of second recesses that expose portions of the wiring corrections. The plurality of pads 56 are disposed in the second recesses and expose the second surface 34. The pad 56 is electrically connected to the wiring 44. Any of the pads is composed of a nickel and a layer of gold 60. The recording 58 is disposed on the surface of the wiring 44, and the gold (9) is disposed on the recording body. Electrically connecting a plurality of bonding wires ((6) ton from (4) (not shown), the function of the soldering is to electrically connect the wafers (not shown) and the wiring 44 of the package structure towel, thereby enabling the wafer to be electrically The substrate 42 is electrically connected to an external device (not shown), such as a printed circuit board (not shown). * Therefore, one of the features of the ball grid array package substrate of the present invention is The tin/organic solderability protection pad is used as a scaly ball pad, so it can avoid the knowledge of the fine organic solderability of the 知 塾 塾 知 知 知 知 知 知 知 知 知 知 知 知 知 知 知 知 知 知 知 知 知 知 知 知 知The problem of cracking the ball of the dry ball is lower than that of the gold/nickel solder ball. ~~' Figure 5A 5B_ is a schematic diagram of the steps of the ball placement method of the ball grid array package of the present invention-embodiment, the steps comprising: providing a ball grid array package substrate 42, the substrate G having the first surface 46, and the first surface 46 having a plurality of grooves The inside of the substrate 42 has a wiring 44, and the recess exposes a portion of the wiring 44. The plurality of solder ball pads are disposed in the recess to expose the first surface 46. The solder ball pad 48 is electrically connected to the wiring 44. And the solder ball 塾' = consists of a layer of tin 50 and a layer of organic solderability protection pad 52, wherein the tin % is set on the surface of the 9 200828547 wiring 44, the organic solderability is on the surface of the solder ball 塾 48; And coating a flux 62 on the tin foil (planting a plurality of solder balls 64 on the flux 48; electrically connecting the solder balls 64 to the wiring 44 with a, _ noisy, and reflowing in an embodiment, The material of the solder ball 64 may include a tin-transferable soldering pad ball. The earth plate and its ball-carrying method have advantages such as high product f and low cost. The embodiments are merely illustrative of the present invention. : :: The person who is familiar with the art can understand the invention: too = to (4) The scope of the patent of the present invention, that is, the equivalent variation or modification made by God, should be covered by the patent of the present invention. 4 [Simple Description of the Drawing] FIG. 1 is a conventional ball grid array. 2A to 2B ® are schematic diagrams of steps of a ball bonding method of a conventional ball grid array package; ~ FIG. 3 is a schematic cross-sectional view of a conventional ball grid array package substrate; FIG. 4 is a schematic view of the present invention A schematic cross-sectional view of a ball grid array package substrate according to an embodiment, and FIGS. 5A to 5B are schematic diagrams of steps of a ball placement method of a ball grid array package according to an embodiment of the present invention. [Description of main component symbols] 2'22, 42 Substrate 4, 24, 44 Wiring 10 200828547 6, 26, 46 First surface 8, 28, 48 Solder balls 10, 34, 54 Second surface 12, 36, 56 Solder pads 14, 30, 38, 58 Nickel 16 , 32, 40, 60 gold 18, 48, 62 flux 20, 64 solder balls 50 tin 52 organic solderability protection pad