200826215 九、發明說明： 【發明所屬之技術領域】 本發明乃關於一種應用於在晶片製造過程中， 可快速及正確抓取晶片的方法與裝置，本發明尤指 一種利用影像比對技術，根據晶片數量與中心位置 加以補償，以擷取晶片正確座標資料的晶片定位的 檢測方法與裝置。 【先前技術】 近年來’隨著科技日新月異，發光二極體（Light Emitting Diode，LED)的應用也越來越廣泛，舉凡 生活中常見的交通燈號、液晶螢幕所使用的背光模 組，甚至是可隨身攜帶的照明裝置等等，所以說LED 與人類的生活真的是越來越密不可分；LED主要係 由一正極引腳、一負極引腳、晶片及環氧樹脂所構 成，其正極引腳上又成型有一反射杯座，將晶片放 置於此反射杯座後，利用金線打線以使晶片與負極 引腳私性連接，再以環氧樹脂加以包覆成型後製 成，而晶片的製作係利用磊晶技術製成晶圓，再經 過切割後，形成一片片的晶片，為了將切割後的晶 圓加以分開，以便後續的抓取裝置抓取晶片，通常， 經過切割後的晶片會放置於一具有彈性的藍膜上， 以方便後製加工時，以一機器手臂抓取（吸取），由 於機器手臂是以藍膜上的晶片的座標作為依據，但 5 200826215 疋’貼覆於藍膜上的諸多晶片，往往因為藍膜的材 貝、弹力等因素，因而造成晶片排列不平均，甚至 有時候會發生晶片空缺或各晶片間的間隙過小，造 成系統判斷座標資料時發生錯誤，因為造成後續加 工時的問題，例如··機器手臂於抓取晶片時未對應 於晶片的正中央位置，如此，固晶時，即可能造成 晶片偏移的現象，嚴重影響製成品的良率。 【發明内容】 有4α於上述的問題’本發明人爰精心研究，並 積個人多年從事影像比對技術的經驗，終研發出一 種勒新的晶片定位的檢測方法與裝置。 、，本毛月之主要·目的，旨在提供一種可減少誤 是，進而達到精確擷取晶片的座標資料之晶片定位 的檢測方法與裝置。 、此叼懷測方 裝置，其係將平面上載有諸多晶片的一藍膜， 於一移動平台上，此移動平台可移動整片1藍膜， 在移動平台的上方又設置有一影像 、 早凡，透過 平σ的動作’可將晶片移動至可清枯 疋辨識的位200826215 IX. Description of the Invention: [Technical Field] The present invention relates to a method and apparatus for quickly and correctly grasping a wafer during a wafer manufacturing process, and more particularly to an image comparison technique. A method and apparatus for detecting wafer position by compensating for the number of wafers and the center position to capture the correct coordinate data of the wafer. [Prior Art] In recent years, with the rapid development of technology, the application of Light Emitting Diode (LED) has become more and more extensive, including the traffic lights commonly used in life, the backlight modules used in LCD screens, and even It is a lighting device that can be carried around, etc., so LED and human life are really more and more inseparable; LED is mainly composed of a positive lead, a negative lead, a wafer and an epoxy resin, and its positive electrode A reflective cup holder is formed on the pin, and after the wafer is placed on the reflector cup holder, the gold wire is used to make the wafer and the negative electrode pin are privately connected, and then formed by epoxy resin coating, and the wafer is formed. The fabrication process uses epitaxial technology to make wafers, which are then diced to form a wafer of wafers, in order to separate the diced wafers for subsequent capture devices to grab wafers, typically, after dicing Will be placed on a flexible blue film to facilitate the post-processing, grabbed (absorbed) by a robotic arm, because the robot arm is the coordinates of the wafer on the blue film According to the report, however, 5 200826215 诸多 诸多 many wafers attached to the blue film, often due to factors such as the blue film material, elastic force, etc., resulting in uneven wafer alignment, and sometimes wafer vacancies or gaps between wafers are too small. Causes the system to make an error in judging the coordinate data, because it causes problems in subsequent processing, for example, the robot does not correspond to the center position of the wafer when the wafer is grasped, so that when the crystal is fixed, the wafer may be offset. Phenomenon, seriously affecting the yield of finished products. SUMMARY OF THE INVENTION There has been a problem in the above-mentioned problems. The inventors have carefully studied and accumulated experience in image matching technology for many years, and finally developed a new method and apparatus for detecting wafer positioning. The main purpose of this month is to provide a method and apparatus for detecting wafer positioning that can reduce errors and achieve accurate acquisition of coordinate data of the wafer. The 叼 测 测 装置 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , Through the action of the flat σ, the wafer can be moved to a position that can be identified
且影像單元的攝影鏡頭可擷取一鉬 & 说野範圍（F 〇i View，F0V)的影像晝面，因為| 〜像單元的特 可以將整個放置晶片的藍膜，區p ^ ⑺戍複數塊笔 的F0V，其F0V具有下列特性，因 u此，可作為 6 的指 標 5 如 畫 面 中 片的 數 量 5 以 及 移 動 而利 用 此 — 特 性 可 F0V 的 晶 片 數 量 Λ 相 F0V 的 中 心 位 置 而 列步 驟 ·· 第 一 步 驟 • 於前 述 栽 有 複 數 片 晶 焦距 以 使 影 像 單 元 第二 步 驟 • 取 得 F0V 置後 j 再 經 過 一 運 算 量及 中 心 位 置 第 二 晶片 數 量 之 差 異 j 及 片位 置 之 差 異 y 第 四 置與 — 預 設 晶 片 的 中 驟： 度 補 償 利 用 據， 作 為 抓 取 裝 置 作 運算 凡 畢 後 會 藉 由 200826215 心位置、晶片排列的間 至下一個F 0 V的距離值 先在一運算單元中定義 鄰兩晶片位置間的距離 本發明進行定位時，係 進行取像，利用影像單 片的藍膜，並調整影像 可擷取位於藍膜上的一 的晶片數量及各晶片的 單元的運算，以記錄其 步驟：比對晶片數量與 比對每一晶片位置與一 步驟··比對每一晶片之 心位置之差距值；以及 上述各項取得後及分析 動時的高度補償；對此 移動平台的作動，使影 對應下一個F0V，五壬⑹ 十 再重新進行定位運鼻的程 過本發明的定位檢浪丨古i ^ ^ ^ ^ 々双列方法，可供一抓取裝置 準確抓取晶片。 為使貴審查委員能清楚了解本發明之内 下列說明搭配圖示，敬請參閱。 【實施方式】 隔、晶 等等， 出一個 ，以及 經過下 元對應 單元的 F0V ； 中心位 晶片數 一預設 預設晶 中心位 第五步 後的數 F0V的 像單元 序，經 快速並 容，僅 以 7 200826215 請參閱「第i圖」，為本發明之結構示意圖，如 圖中所不’本發明係應用於—種定位晶片μ之儀器 1 〇上，由於晶片20係將一晶圓經過切割後所得的 成品，所以其體積相當小，為了方便—抓取裝置3〇 絲而進行後續加工，在製造的過程中就會先在一 孤膜上進行擴張的工序，以增加相鄰兩晶片2 〇間的 間隙，使抓取裝置30進行抓取時’不容易產生抓取 的誤差，本發明所使用的是一種影像比對的技術， 首先’係將藍膜固設於一移動平台4〇1上，再由影 像單元402擷取到藍膜上晶片的影像晝面，經過一 運算單元403的運算，將影像單元4〇2所得的資料 與預設的資料進行逐一比對’以獲得影像範圍内晶 片2 0數量與預設晶片2 0數量之差異，每一晶片 位置與預設位置之差異，以及該每一晶片2〇之中心 位置’與預設中心位置之差距，並進行補償，甚至 可針對影像範圍内的晶片20有空缺時，在空缺位置 補上一預設位置的假想晶片2 〇的影像，而影像範圍 内的晶片2 0有多餘時，則依據預設位置，將多餘晶 片2 0的影像刪除掉，並利用上述各項取得後及分析 後的影像數據，作為抓取裝置3 0作動時的高产補 傾’以供其精嫁抓取晶片2 0 ’而此抓取裝置3 〇係 由一真空吸頭301及一氣壓動力源302所組成，可 產生真空吸力抓取晶片20，以避免晶片20被抓取 時受到損壞。 8 200826215 請參閱「第2圖」，為本發明之硬體方塊圖，如 圖中所示，本發明的檢測裝置4〇係包括··一移動平 台401，其係用來放置前述的晶片20及藍膜，旅玎 帶動前述的晶片2 0及藍膜進行平面移動，以及升降 移動’以便调整影像單元4 〇 2的焦距，使影像單元 40 2所擷取到的F0V更清晰度，以及調整影像畫面 的比例（Scale ); —影像單元402，係組設於移動 平台401的上方，其影像單元4〇2主要係透過〆攝 影鏡頭4 0 21 ’由於攝影鏡頭4 〇 21的影像畫面有限 疋範圍’在進行擷取晶圓上的影像畫面時，一次僅 能獲得一視野範圍（Fielci0fView，FOV)内的影像 晝面’以將整個位於藍膜上的晶圓影像晝面分割為 複數個FOV ;以及一運算單元4〇3，其運算單元4〇3 又包括了一暫存器4031、一資料庫4032及一中央 處理器4033，當前述的F0V的影像資料被輸入運算 單元403的暫存器403 1後，可經過中央處理器 4 〇 3 3與一資料庫4 0 3 2内部所預設的影像資料作比 對運算，且其資料庫4032内的資料可以隨時重新輸 ^變更，或使以經驗法則進行學習，以累積足夠的 芩考資料，並利用上述各項取得後及分析後的影像 資料，作為前述抓取裝置30作動時的高度補償，以 供其精確抓取晶片2 0。 圖 如圖中所示，本發明運作時，主 " 土要係經過下列 9 200826215 步驟：第一步騍5 01 :放料’係將一藍膜連同經過 切割並加以擴張的晶圓固設於一移動平台上，以使 藍膜及晶圓町藉由移動平台作平面移動，以及升降 移動；第二梦雜5 0 2 ··取像’藉由影像單元的一攝 影鏡頭對應於前述藍膜上’經過移動平台調整焦距 後，可使影像單元掏取到清晰的影像晝面，但由於 影像鏡頭的取像範圍有限’因此，一次僅能擷取到 一 F0V，故整個藍膜的影像必須由複數個F0V才能 完整組成；第三步驟5 0 3 :運算，再將前一步驟中 所擷取F0V的影像資料，輸入處理單元中之暫存器 中，於内建於資料庫中預設的影像資料，透過一中 央處理器進行運异’以計算出F 〇 V内晶片數量與預 設數量之差異，每一晶片位置與預設位置之差異， 與預設中心位置之差 以及該每一晶片之中心位置， 距，並進行補償，第四步驟5 〇 4 ··抓料，利用上述And the photographic lens of the image unit can capture the image of a molybdenum & field (F Vi View, F0V), because the image unit can place the entire blue film of the wafer, the area p ^ (7)戍F0V of a plurality of pens, the F0V has the following characteristics, because it can be used as the index of 6 as the number of slices in the picture 5 and the movement uses this - the number of wafers of the characteristic F0V 中心 the center position of the phase F0V ········································································································ Set and - the middle of the preset wafer: the degree of compensation is used as the grabbing device. After the calculation, the distance between the heart position and the wafer arrangement to the next F 0 V will be first in an arithmetic unit. Defining the distance between the positions of the adjacent wafers, when the positioning is performed by the present invention, the image is taken. Using the blue film of the image and adjusting the image, the number of wafers on the blue film and the operation of the cells of each wafer can be retrieved to record the steps: comparing the number of wafers and comparing each wafer position with a step · Compare the difference between the heart position of each wafer; and the height compensation after the above and after the analysis; for the action of the mobile platform, the shadow corresponds to the next F0V, and the five (6) ten re-position The method of transporting the nose passes through the positioning and checking method of the present invention, and the double-column method can be used for picking up the device to accurately grasp the wafer. In order to enable your review board to clearly understand the following description of the invention, please refer to it. [Embodiment] Separation, crystal, etc., one out, and the F0V passing through the corresponding unit of the lower element; the number of center wafers is a preset pixel number of the F0V after the fifth step of the preset crystal center position, and is quickly combined , only 7 200826215, please refer to the "figure i", which is a schematic structural view of the present invention. The present invention is applied to an apparatus 1 for positioning a wafer μ, since the wafer 20 is a wafer. After the cutting, the finished product is so small that it is processed for the convenience of the picking device 3, and the expansion process is performed on an isolated film in the manufacturing process to increase the adjacent two. The gap between the turns of the wafer 2 makes the grasping device 30 not easy to produce the error of grasping when grasping. The present invention uses a technique of image comparison, firstly, the blue film is fixed on a mobile platform. 4〇1, and then the image unit 402 captures the image surface of the wafer on the blue film, and through an operation unit 403, the data obtained by the image unit 4〇2 is compared with the preset data one by one. obtain The difference between the number of wafers 20 in the range and the number of preset wafers, the difference between each wafer position and the preset position, and the difference between the center position of each wafer and the preset center position, and compensation Even if there is a vacancy in the wafer 20 in the image range, the image of the imaginary wafer 2 预设 at a predetermined position is added to the vacant position, and when the wafer 20 in the image range is redundant, according to the preset position, The image of the excess wafer 20 is deleted, and the image data obtained after the above and after the analysis is used as the high-yield replenishment when the gripping device 30 is actuated, so that it can grasp the wafer 2 0 ' The pick-up device 3 is composed of a vacuum suction head 301 and a pneumatic power source 302, which can generate vacuum suction to grasp the wafer 20 to avoid damage when the wafer 20 is grasped. 8 200826215 Please refer to FIG. 2, which is a hardware block diagram of the present invention. As shown in the figure, the detecting device 4 of the present invention includes a mobile platform 401 for placing the aforementioned wafer 20. And the blue film, the traveler drives the aforementioned wafer 20 and the blue film to perform planar movement, and the lifting movement 'to adjust the focal length of the image unit 4 〇 2, so that the F0V captured by the image unit 40 2 is more sharp and adjusted. The scale of the image frame (Scale); the image unit 402 is set above the mobile platform 401, and the image unit 4〇2 mainly passes through the 〆 photographic lens 4 0 21 ' because the image of the photographic lens 4 〇 21 is limited. Scope 'When capturing an image on a wafer, only one image area within a field of view (FOF) can be obtained at a time to divide the entire wafer image on the blue film into a plurality of FOVs. And an operation unit 4〇3, the operation unit 4〇3 further includes a register 4031, a database 4032 and a central processing unit 4033, when the image data of the aforementioned F0V is input to the temporary storage unit 403 403 1 It can be compared with the image data preset in the database 4 3 3 3 and a database 4 0 3 2, and the data in the database 4032 can be re-transformed at any time, or the rule of thumb can be changed. The learning is performed to accumulate sufficient reference data, and the obtained and analyzed image data are used as the height compensation of the grasping device 30 when it is actuated, so that it can accurately grasp the wafer 20. As shown in the figure, in the operation of the present invention, the main " soil system passes the following 9 200826215 steps: the first step 骒 5 01 : the discharge ' is a blue film together with the cut and expanded wafer fixed On a mobile platform, the blue film and the wafer town are moved by the mobile platform in a plane, and the movement is moved up and down; the second dream is used to correspond to the blue image by a photographic lens of the image unit. On the film, after adjusting the focal length through the moving platform, the image unit can be captured to a clear image surface, but since the image lens has a limited image capturing range, only one F0V can be captured at a time, so the image of the entire blue film is obtained. It must be composed of a plurality of F0Vs; the third step is 5 0 3: the operation, and then the image data of the F0V captured in the previous step is input into the temporary memory in the processing unit, and built in the database. The image data is set by a central processing unit to calculate the difference between the number of wafers in the F 〇V and the preset number, the difference between each wafer position and the preset position, and the difference between the preset center position and the Each wafer Center position, distance, and compensation, the fourth step 5 〇 4 ··grabbing, using the above
整個藍膜的影像晝面分割為 複數個F0V，而針 10 200826215 對圖中所顯示的F0V中，係具有行數為5，列數為3 的晶片2 0 ’所以其晶片2 0的數量就是5乘以3等 於15個，計算出f0v中的晶片2〇數量，又，本發 明以F0V内每個晶片20的中心位置，將晶片2〇在 行與行間的間隔設為d 1，列與列間的間隔為d2，不 v ^风ί六j r心 位置的基本座標，以便與前述運算單元的資料庫之 預設2料作逐一比對，運算出其差值，並進行補償， 以供前述之抓取裝置30精確抓取晶片2〇。 、…明麥閱「第5圖」’為本發明進行運算時的步驟 流程圖’如圖中所示’當本發明進行定位時，係經 i下列/驟.第一步驟6〇1 :進行取像，首先，係 =載有複“日日日片的藍膜㈣於-移動平台上，再 利用影傻枭- I 口丄丹 整H早7^對應於此藍膜，透過移動平台作動調 上I J的焦距，以使影像單元可擷取位於藍膜 牛 的清晰晝面丨第二步驟6〇2 :在 一步驟F〇V的影像畫面中，立曰片赵曰Μ 後，再經過-運算單元的運算，可將晶片 内里第二：位置的資料’暫存於運算單元的暫存器 比對位：二驟。6°3:利用運算單元的中央處理器， 片數量之：存器中的晶片數量，與資料庫中預設晶 片位置，及比對暫存器中的影像資料每一晶 差里.第…庫中的影像資料所預設晶片位置之 四步驟6°4:再利用運算單元的中央處理 11 200826215 器，比對每一晶片之中心位置與—預設晶片的中心 位置之差距值；第五步驟605 :高度補償，利用^ 算單元取得後及分析後的各項數據，作為抓取裝置 作動時的高度補償，以使抓取裝置可快速並準確抓 取晶片；且對單一 F0V的運算完畢後，會藉由移： 平台的作動，使影像單元對應下—個F〇v，再重新 進行定位運算的程彳，以形成一個完整的循環。 如上所述，本發明其據以實施後，可使抓取裂 置快速且精確地抓取晶片，確實提供一種以影像比 對的技術，作為晶片定位的檢測方法與裝置^而達 到減少誤差，並精確運算晶片的定位之目的。 唯，以上所述者’僅為本發明之較佳之實施例 而已，並非用以限定本發明實施之範圍；任何熟習 此技蟄者，在不脫離本發明之精神與範圍下所作之 均等變化與修飾，皆應涵蓋於本發明之專利範圍内。 表 T、上所述，本發明晶片定位的檢測方法與裝置 之功效，係具有發明之「新穎性」、「進步性」與「產 業可利用性」等專利要件；因此，中請人爰依專利 法之規定’向鈞局提起發明專利之申請。 12 200826215 【圖式簡單說明】 第1圖，為本發明之結構示意圖。 第2圖，為本發明之硬體方塊圖。 第3圖，為本發明運作時的流程示意圖。 第4圖，為本發明影像單元取像之F0V示意圖。 第5圖，為本發明進行運算時的步驟流程圖。 【主要元件符號說明】 10 儀 器 20 晶 片 3 0 抓取 裝 置 301 真 空 吸 頭 302 氣 壓 動 力源 40 檢 測 裝 置 401 移 動 平 台 402 影 像 單 元 402 1 攝 影 鏡 頭 403 運 算 單 元 403 1 暫 存 器 4032 資 料 庫 40 33 中 央 處 理器 501 第 — 步 驟 502 第 二 步 驟 503 第 二 步 驟 13 200826215 504 第四步驟 601 第一步驟 602 第二步驟 603 第三步驟 604 第四步驟 605 第五步驟The image of the entire blue film is divided into a plurality of F0Vs, and the needle 10 200826215 has a row number of 5 and a number of columns of 3 in the F0V shown in the figure. Therefore, the number of wafers 20 is 5 is multiplied by 3 to be equal to 15, and the number of wafers 2 in f0v is calculated. Further, in the present invention, the interval between the rows and rows of the wafer 2 is set to d 1, with the center position of each wafer 20 in the F0V. The interval between the columns is d2, not the basic coordinates of the position of the jr heart, so as to be compared with the preset materials of the database of the aforementioned arithmetic unit, and the difference is calculated and compensated for The aforementioned gripping device 30 accurately grasps the wafer 2〇. , "Ming Mai read "5th figure" - the flow chart of the steps for the calculation of the present invention as shown in the figure 'When the present invention is positioned, the following is the following steps / step 1. First step 6〇1: Take the image, first of all, the system = the blue film (4) carrying the complex "day and day film" on the mobile platform, and then use the shadow silly - I mouth 整 整 整 整 早 早 早 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 Adjust the focal length of the IJ so that the image unit can capture the clear surface of the blue film cow. The second step is 6〇2: in the image of the F〇V in a step, after the film is taken, then - The operation of the arithmetic unit can temporarily store the second: position data in the wafer in the register of the arithmetic unit: the second step. 6°3: using the central processing unit of the arithmetic unit, the number of slices: The number of wafers in the device, the preset wafer position in the database, and the per crystal difference in the image data in the register. The four steps of the preset wafer position in the image data in the library are 6°4: Reusing the central processing unit of the computing unit 11 200826215, comparing the center position of each wafer with the center of the preset wafer The difference value of the position; the fifth step 605: height compensation, using the calculation unit to obtain the data after the analysis and the analysis, as the height compensation when the grasping device is actuated, so that the grasping device can quickly and accurately grasp the wafer; After the operation of the single F0V is completed, the image unit is corresponding to the next F〇v by moving the platform, and then the positioning operation is performed again to form a complete loop. As described above, After the invention is implemented, the grasping crack can quickly and accurately grasp the wafer, and indeed provides a technique for image alignment, which is used as a method and device for detecting wafer positioning, thereby reducing the error and accurately calculating the wafer. The purpose of the present invention is to be construed as a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention; Equivalent changes and modifications should be included in the scope of the patent of the present invention. Table T, the above description, the method and device for detecting the wafer positioning of the present invention have the effect The patent requirements such as “novelty”, “progressiveness” and “industry availability” are used; therefore, the applicant has filed an application for invention patents to the bureau in accordance with the provisions of the Patent Law. 12 200826215 [Simplified description of the drawings] Fig. 1 is a schematic view showing the structure of the present invention. Figure 2 is a hardware block diagram of the present invention. Figure 3 is a schematic flow chart of the operation of the present invention. Fig. 4 is a schematic view showing the F0V of the image unit of the present invention. Figure 5 is a flow chart showing the steps in the calculation of the present invention. [Main component symbol description] 10 Instrument 20 Chip 3 0 Grab device 301 Vacuum nozzle 302 Pneumatic power source 40 Detection device 401 Mobile platform 402 Image unit 402 1 Photo lens 403 Operation unit 403 1 Register 4032 Library 40 33 Central Processor 501 - Step 502 Second Step 503 Second Step 13 200826215 504 Fourth Step 601 First Step 602 Second Step 603 Third Step 604 Fourth Step 605 Fifth Step