200825328 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種照明燈，特別是有關於一種具有 散熱、防水結構之發光二極體照明燈。 【先前技術】 發光二極體（Light Emitting Diode，LED)由於具有體積200825328 IX. Description of the Invention: [Technical Field] The present invention relates to an illumination lamp, and more particularly to a light-emitting diode illumination lamp having a heat dissipation and waterproof structure. [Prior Art] Light Emitting Diode (LED) has a volume
小、效率高、省電等優點，因此逐漸取代耗電量大、使用 寿命短的鎢絲燈及具有污染性的水銀燈，廣泛應用於新一 代的照明設備。 目W，隨著磊晶技術的提升，單顆LED的功率已經從 1瓦提升至3瓦甚至5瓦。然而，高功率LED於發光的同 時，亦產生較高的熱量。尤其，在一高功率照明燈，由於 led密集地設置在照明燈中心位置，造成led之溫度大幅 升高，因而降低LED之發光效率及其使用壽命。 此外供戶外使用之LED照明燈通常具有一防水外 罩，將所有LED容置在一個密閉空間内，此防水外罩對於 照明燈的散熱，實具有不良的影響。因為防水外罩使 得LED照明燈不易透過對流作用進行散熱，因而大幅降低 其散熱效率。雖然移除防水外罩，可以提升其散熱效率: 然而，不具有防水外罩之㈣照明燈，必須具有其他防水 設計，以_LED免於受到料錢的影響。 j上所述，如何提供-種LED照明燈，可以具有有效 =熱如水設計，使哪„燈之發光效率及使用 增加’疋使用者所企盼的。 200825328 【發明内容】 本發明之目的就是在提供一種LED照明燈，可以有六文 地降低LED之溫度，進而增加LED照明燈之發光效率及使 用壽命。 本發明之另一目的就是在提供一種LED照明燈，具有 有效的防水設計，因此可以不需安裝防水外罩，進而提高 LED照明燈的散熱效率。Small, high efficiency, power saving, etc., it gradually replaces tungsten lamps with low power consumption and short service life and mercury lamps with pollution, which are widely used in new generation lighting equipment. Head, with the advancement of epitaxial technology, the power of a single LED has been increased from 1 watt to 3 watts or even 5 watts. However, high-power LEDs also generate higher heat while emitting light. In particular, in a high-powered illuminating lamp, since the LED is densely disposed at the center of the illuminating lamp, the temperature of the LED is greatly increased, thereby reducing the luminous efficiency of the LED and its service life. In addition, LED lighting for outdoor use usually has a waterproof cover that houses all the LEDs in a confined space, which has a bad influence on the heat dissipation of the lamps. Because the waterproof cover makes it difficult for the LED light to dissipate heat through convection, it greatly reduces its heat dissipation efficiency. Although the waterproof cover is removed, the heat dissipation efficiency can be improved: However, the (4) illumination lamp without the waterproof cover must have other waterproof design to protect the _LED from the money. As described above, how to provide an LED lighting lamp can have an effective = heat as water design, which illuminate the luminous efficiency and use of the lamp, which is desired by the user. 200825328 [Invention] The object of the present invention is Providing an LED lighting lamp can reduce the temperature of the LED in a six-fold manner, thereby increasing the luminous efficiency and the service life of the LED lighting. Another object of the present invention is to provide an LED lighting lamp with an effective waterproof design, thereby There is no need to install a waterproof cover to improve the heat dissipation efficiency of the LED lighting.
根據以上所述之目的，提出一種LED照明燈，包括有 一基板、至少一發光二極體及至少一防水裝置。基板具有 一正面及一背面，基板具有至少一第一空氣對流孔，第一 空氣對流孔由正面貫穿至背面。發光二極體設置於正面。 防水裝置對應發光二極體設置於正面，防水裝置遮蓋發光 二極體，用以防止外界水氣損壞發光二極體。 根據以上所述之目的，更提出一種LED照明燈，包括 有一基板、一散熱背板、至少一發光二極體及至少一防水 裝置。基板具有一正面及一背面，基板具有至少一第一空 氣對流孔，第一空氣對流孔由正面貫穿至背面。散熱背板 設置於背面，散熱背板具有至少一第二空氣對流孔，第二 空氣對流孔貫穿散熱背板，第二空氣對流孔與第一空氣對 ML孔連通。發光二極體設置於正面。防水裝置對應發光二 極體A置於正面，防水裝置與基板係利用一對螺紋結構連 接，防水裳置遮蓋發光二極體，用以防止外界水氣損壞發 光二極體。其中基板具有至少一第一凹部、至少一第二凹 部及至少一⑽，第—凹部設置於正面上，用以設置防水 200825328 裝置’第二凹部設置於第—凹部…用以設置發光二極體， 凹槽對應第二凹部設置於背面上。 根據本發明一較佳實施例所述之LED照明燈，基板具 有至少一第一空氣對流孔，散熱背板具有至少一第二空氣 對抓孔，第一空氣對流孔與第一空氣對流孔連通。因此可 ‘ 以有效地降低LED之溫度，進而增加LED照明燈之發光效 率及使用壽命。 根據本發明一較佳實施例所述之LED照明燈，防水裝 ^對應發光二極體設置，防水裝置遮蓋發光二極體，防水 裝置與基板係利用-對螺紋結構連接，用以防止外界水氣 損壞發光二極體，因此可以不需安裝防水外罩，以提高LED 戶、?、明燈的散熱效率。 根據本發明一較佳實施例所述之LED照明燈，基板具 有至y凹槽，因此導電線材可以隱藏地設置於凹槽内， 措以k供導電線材較佳的防護。 〇 【實施方式】 參照第1圖，其緣示依照本發明一較佳實施例之LED 照明燈之結構分解示意圖。此LED照明燈1〇〇至少包括有 一基板200、至少一發光二極體6〇〇及至少一防水裝置 3〇〇。基板200之材料可以採用高導熱材料，例如是鋁或銅。 發光二極體600設置於基板2〇〇之正面2〇1。防水裝置3〇〇 亦設置於基板200之正面2〇1，且對應發光二極體6〇〇設 置防水I置300遮蓋發光二極體6〇〇，用以保護發光二極 體600,使其免於受到外界水氣或沙塵的影響。值得一提的 200825328 是，基板200具有第一空氣對流孔220，第一空氣對流孔 220貫穿基板200，因此冷卻氣流可以流經第一空氣對流孔 220，使基板200上的熱量可以更有效地移除，進而有效地 降低發光二極體600之溫度。此外，每一發光二極體600 具有其個別的防水裝置300，因此LED照明燈100可以不 需安裝防水外罩。如此，基板200可以有更大的表面積（例 如85%以上）暴露於外界環境，發光二極體600所產生的 熱能可以更容易透過基板200進行散熱。 繼續參照第1圖，LED照明燈100可以更包括一散熱 背板400，設置於基板200之背面。基板200與散熱背板 400可以利用複數個螺絲緊密鎖合，以增加二者之間的導熱 效率。散熱背板400之材料可以採用高導熱材料，例如是 鋁或銅。散熱背板400具有至少一第二空氣對流孔402，第 二空氣對流孔402貫穿散熱背板400，且第二空氣對流孔 402可以與第一空氣對流孔220連通。如此，基板200與散 熱背板400可以有更大的表面積暴露於外界環境，並且外 界環境的冷卻氣流可以貫穿第一空氣對流孔220及第二空 氣對流孔402，使得基板200的熱量可以更有效地移除，進 而降低發光二極體600之溫度。再者，散熱背板400具有 複數個散熱鰭片404設置於其上，散熱鰭片404之材質可 以採用南導熱材料5例如是銘或銅’猎以提南散熱背板4 0 0 的散熱效果。值得一提的是，散熱鰭片404可以具有不同 高度，例如，可以依據基板200表面的溫度分佈，在溫度 較高的區域，對應設置高度較高的散熱鰭片404。使得基板 200表面的溫度可以更均勻地分佈，降低基板200之中心區 200825328 域與邊緣區域之溫度差，避免基板200局部的高溫降低發 光二極體600的發光效率。 繼續參照第1圖，貫穿基板200之第一空氣對流孔220 可以具有不同的尺寸，且貫穿散熱背板400之第二空氣對 流孔402亦可以具有不同的尺寸，例如，第一空氣對流孔 220a與第一空氣對流孔220b具有不同的尺寸，第一空氣對 流孔220b之尺寸較小，其均勻分佈於基板200上。第一空 氣對流孔220a之尺寸較大，其設置於基板200溫度容易蓄 ( 積的中間區域。並且，亦可以於基板200及散熱背板400 的中心區域設置較多數量的空氣對流孔。如此，可以進一 步降低基板200之中心區域與邊緣區域之溫度差。此外， 第二空氣對流孔402之尺寸與位置可以對應第一空氣對流 孔220設置，使更多的冷卻氣流可以貫穿基板200及散熱 背板400，以獲得較佳的散熱效果，進而大幅降低發光二極 體600的溫度。 值得一提的是，LED照明燈100更包括有一邊框700 C. 及一鎖固裝置500。其中邊框700圍繞基板200設置，用以 固定基板200及散熱背板400。邊框700之材質可以採用高 導熱材料，例如是鋁或銅，以增加LED照明燈100之散熱 效率。此外，邊框700可以避免外界環境之水氣與沙塵透 過基板200與散熱背板400之間的空隙進入LED照明燈100 内部。鎖固裝置500可以藉由散熱背板400之安裝孔406， 將LED照明燈100設置於一燈桿（圖中未示）。 第2圖繪示第1圖中基板200之結構示意圖，同時參 照第1圖及第2圖，基板200具有至少一第一凹部212及 200825328 一第二凹部214,第一凹部212設置於基板200之正面201， 第二凹部214設置於第一凹部212内，用以容置發光二極 體600。防水裝置300具有一透明上蓋302設置於其上。發 光二極體600發出的光線可以穿過透明上蓋3〇2向外照 射。防水裝置300之側面304與第一凹部212之側面218 緊密貼合。如此，防水裝置300可以避免外界環境的水氣 損壞發光二極體600。According to the above, an LED illumination lamp is provided, comprising a substrate, at least one light emitting diode and at least one waterproof device. The substrate has a front surface and a back surface, and the substrate has at least one first air convection hole, and the first air convection hole extends from the front surface to the back surface. The light emitting diode is disposed on the front side. The waterproof device is disposed on the front side of the light-emitting diode, and the waterproof device covers the light-emitting diode to prevent the external moisture from damaging the light-emitting diode. According to the above, an LED illumination lamp further includes a substrate, a heat dissipation backplane, at least one light emitting diode, and at least one waterproof device. The substrate has a front surface and a back surface, and the substrate has at least one first air convection hole, and the first air convection hole extends from the front surface to the back surface. The heat dissipation back plate is disposed on the back surface, the heat dissipation back plate has at least one second air convection hole, the second air convection hole penetrates the heat dissipation back plate, and the second air convection hole communicates with the first air to the ML hole. The light emitting diode is disposed on the front side. The waterproof device is disposed on the front side of the light-emitting diode A, and the waterproof device and the substrate are connected by a pair of screw structures, and the waterproof skirt covers the light-emitting diode to prevent the external moisture from damaging the light-emitting diode. The substrate has at least one first recess, at least one second recess and at least one (10). The first recess is disposed on the front surface for providing waterproofing. The device is provided with a second concave portion disposed on the first recessed portion for arranging the light emitting diode. The groove corresponds to the second recess and is disposed on the back surface. According to a preferred embodiment of the present invention, the substrate has at least one first air convection hole, the heat dissipation back plate has at least one second air pair catching hole, and the first air convection hole is connected to the first air convection hole. . Therefore, it can be used to effectively reduce the temperature of the LED, thereby increasing the luminous efficiency and service life of the LED lighting. According to a preferred embodiment of the present invention, the LED lighting device has a waterproof device corresponding to the light emitting diode, the waterproof device covers the light emitting diode, and the waterproof device and the substrate are connected by a threaded structure to prevent external water. The gas damages the light-emitting diode, so it is not necessary to install a waterproof cover to improve the heat dissipation efficiency of the LED, the light, and the light. According to a preferred embodiment of the present invention, in an LED illumination lamp, the substrate has a recess to the y, so that the conductive wire can be concealed in the recess, and k is provided for better protection of the conductive wire. [Embodiment] Referring to Figure 1, there is shown a schematic exploded view of an LED illumination lamp in accordance with a preferred embodiment of the present invention. The LED illumination lamp 1A includes at least a substrate 200, at least one light emitting diode 6〇〇, and at least one waterproof device 3〇〇. The material of the substrate 200 may be a highly thermally conductive material such as aluminum or copper. The light emitting diode 600 is disposed on the front surface 2〇1 of the substrate 2〇〇. The waterproof device 3 is also disposed on the front surface 2〇1 of the substrate 200, and the waterproof diode 300 is disposed corresponding to the light-emitting diode 6 to cover the light-emitting diode 6〇〇 to protect the light-emitting diode 600. Free from external moisture or dust. It is worth mentioning that 200825328, the substrate 200 has a first air convection hole 220, and the first air convection hole 220 penetrates through the substrate 200, so that the cooling airflow can flow through the first air convection hole 220, so that the heat on the substrate 200 can be more effectively The removal, thereby effectively reducing the temperature of the light-emitting diode 600. In addition, each of the light-emitting diodes 600 has its own waterproof device 300, so that the LED light 100 does not require the installation of a waterproof cover. Thus, the substrate 200 can have a larger surface area (for example, 85% or more) exposed to the external environment, and the heat generated by the LED 600 can be more easily dissipated through the substrate 200. Continuing to refer to FIG. 1, the LED illuminator 100 can further include a heat dissipation backplane 400 disposed on the back side of the substrate 200. The substrate 200 and the heat dissipation backplane 400 can be tightly locked by a plurality of screws to increase the heat transfer efficiency between the two. The material of the heat dissipation backing plate 400 may be a highly thermally conductive material such as aluminum or copper. The heat dissipation backplane 400 has at least one second air convection hole 402 through which the second air convection hole 402 passes, and the second air convection hole 402 can communicate with the first air convection hole 220. In this way, the substrate 200 and the heat dissipation backplane 400 can have a larger surface area exposed to the external environment, and the cooling airflow of the external environment can penetrate the first air convection hole 220 and the second air convection hole 402, so that the heat of the substrate 200 can be more effective. The ground is removed, thereby lowering the temperature of the light-emitting diode 600. In addition, the heat dissipation backplane 400 has a plurality of heat dissipation fins 404 disposed thereon, and the heat dissipation fins 404 can be made of a south heat conductive material 5 such as a Ming or a copper hunter to relieve the heat dissipation effect of the heat dissipation backplane 400. . It is worth mentioning that the heat dissipation fins 404 may have different heights. For example, depending on the temperature distribution of the surface of the substrate 200, the heat dissipation fins 404 having a higher height may be correspondingly arranged in a higher temperature region. The temperature of the surface of the substrate 200 can be more uniformly distributed, and the temperature difference between the central region of the substrate 200 and the edge region of the region of the substrate 200 can be reduced, and the high temperature of the substrate 200 can be prevented from lowering the luminous efficiency of the light-emitting diode 600. Continuing to refer to FIG. 1 , the first air convection holes 220 penetrating the substrate 200 may have different sizes, and the second air convection holes 402 penetrating the heat dissipation back plate 400 may also have different sizes, for example, the first air convection holes 220a. The first air convection hole 220b has a different size, and the first air convection hole 220b has a smaller size, which is evenly distributed on the substrate 200. The first air convection hole 220a has a large size, and is disposed in an intermediate portion where the temperature of the substrate 200 is easily stored. Further, a larger number of air convection holes may be provided in the central portion of the substrate 200 and the heat dissipation back plate 400. The temperature difference between the central region and the edge region of the substrate 200 can be further reduced. Further, the size and position of the second air convection hole 402 can be set corresponding to the first air convection hole 220, so that more cooling airflow can penetrate the substrate 200 and dissipate heat. The backplane 400 is used to obtain a better heat dissipation effect, thereby greatly reducing the temperature of the LED assembly 600. It is worth mentioning that the LED illumination lamp 100 further includes a frame 700 C. and a locking device 500. The substrate 200 is disposed to fix the substrate 200 and the heat dissipation back plate 400. The material of the frame 700 can be made of a high thermal conductive material, such as aluminum or copper, to increase the heat dissipation efficiency of the LED illumination lamp 100. In addition, the frame 700 can avoid the external environment. The moisture and dust enter the interior of the LED illumination lamp 100 through the gap between the substrate 200 and the heat dissipation backplane 400. The locking device 500 can be cooled by the back The mounting hole 406 of the 400 is disposed on a light pole (not shown). The second drawing shows the structure of the substrate 200 in FIG. 1 , and referring to FIG. 1 and FIG. 2 , the substrate 200 The first concave portion 212 is disposed on the front surface 201 of the substrate 200, and the second concave portion 214 is disposed in the first concave portion 212 for accommodating the light emitting diode 600. The device 300 has a transparent upper cover 302 disposed thereon. Light emitted by the LEDs 600 can be radiated outward through the transparent upper cover 3〇 2. The side surface 304 of the waterproof device 300 closely fits the side surface 218 of the first recess 212. As such, the waterproof device 300 can prevent the moisture of the external environment from damaging the light emitting diode 600.
第3圖繪示第2圖中基板200之背面結構示意圖，同 日守參知、弟2圖及弟3圖，基板2 0 0具有至少一線孔216，設 置於第一凹部212内，線孔216貫穿基板2〇〇，用以設置發 光一極體600之驅動線路。此外，基板2〇〇具有至少一凹 槽240，位於基板2〇〇之背面202，凹槽24〇例如是沿著複 數個第二凹部214設置。如此，LED照明燈1〇〇之導電線 材可以隱藏地設置於凹槽240内，藉以提供導電線材較佳 的防護。此外，當導電線材設置於凹槽24〇内，可以對於 凹乜240進行適當的防水處理，例如，以防水材料覆蓋凹 槽240,如此，可以防止外界環境的水氣損壞導電線材。 本發明亦揭露一種防水型反射杯，此防水型反射杯不 但具有反射LED光線的功能，同時可以提供咖照明燈防 水功能。以防水型反射杯取代第i圖中之防水裝置3〇〇，可 二進步提而LED照明燈之亮度。第4圖緣示依照本發明 -較佳實施例之防水型反射杯結構示意圖。第5圖繪示第4 圖中防水型反射杯與基板結合之剖面圖。參照“圖及第5 基板20〇a具有至少—第—㈣仙及至少—第二凹 WUa ’第二凹部214a設置於第一凹部2⑵内，第二凹 10 200825328 口Ρ 214a用以谷置發光二極體6〇〇。防水型反射杯包括 有：體8丨〇、一透明上盍820及一杯體830。其中管體81〇 ΓFIG. 3 is a schematic view showing the structure of the back surface of the substrate 200 in FIG. 2 , and the same as the Japanese Guardian, 2 and 3, the substrate 200 has at least one hole 216 disposed in the first recess 212 and the hole 216. Through the substrate 2A, a driving circuit for the light-emitting body 600 is disposed. In addition, the substrate 2 has at least one recess 240 located on the back surface 202 of the substrate 2, and the recess 24 is disposed, for example, along a plurality of second recesses 214. In this way, the conductive wire of the LED illuminator can be concealed in the recess 240 to provide better protection of the conductive wire. Further, when the conductive wire is disposed in the recess 24, the recess 240 can be suitably subjected to a water repellent treatment, for example, covering the recess 240 with a waterproof material, so that moisture of the external environment can be prevented from damaging the conductive wire. The invention also discloses a waterproof reflective cup, which not only has the function of reflecting LED light, but also provides the waterproof function of the coffee lighting. Replacing the waterproof device 3〇〇 in the i-th picture with a waterproof reflective cup can improve the brightness of the LED lighting. Figure 4 is a schematic view showing the structure of a waterproof reflecting cup in accordance with the present invention - a preferred embodiment. Fig. 5 is a cross-sectional view showing the combination of the waterproof reflecting cup and the substrate in Fig. 4. Referring to "the figure and the fifth substrate 20A have at least - the fourth (four) cents and at least - the second recess WUa 'the second recess 214a is disposed in the first recess 2 (2), the second recess 10 200825328 port 214a is used for valley illumination The diode 6 〇〇. The waterproof reflective cup comprises: a body 8 丨〇, a transparent upper 盍 820 and a cup body 830. The tube body 81〇Γ
=二端分別具有一第一開口 812及一第二開口 814。透明上 皿82〇甘欠入第二開口 814，透明上蓋820與第二開口 814 可以利用防水膠黏合，藉以封閉第二開口 814。值得一提的 是，管_體81〇於鄰近第一開口 812處具有一第一螺紋結構 816第凹部212a之側面具有一第二螺紋結構2丨9。第一 累、、文、、、口構816與第二螺紋結構219可以相互齧纟，使防水 型反射杯800可以緊密地與第一凹部212&結合，並於管體 8一 10内部形成一密閉空間，以避免外界環境的水氣損壞發光 一極體600。並且，當發光二極體6〇〇故障時，可以輕易地 打開防水5L反射杯800進行維修。此夕卜，第一螺紋結構8工$ 與^二螺紋結構219之間可以塗佈一防水膠，使得管體810 與第-凹部212a之接合可以達到完全氣密的效果。 繼績參照第4圖，透明上蓋82〇之材料可以是有機玻 璃或無機玻璃等高透光率材料，透明上蓋82〇可以是具有 曲面之光學透鏡，例如，透明上1 820可以是具有集光作 用之凸透鏡，藉以集中發光二極體_所發出的光線。杯 體請設置於管體81〇内且與管體81〇連接，杯體㈣呈 有一第一杯口 834及一第二杯口 836，第一杯口 834及第二 杯836主中空，且分別朝向第一開口 812及第二開口 8Η第杯口 834與第二凹部以鈍對應設置，發光二極 體:〇〇發出之光線可以由第二凹部214&穿過第一杯口咖 口第杯836妝射。杯體83〇之材質可以是塑膠材料戋 金屬材料，杯體請之内側具有一光反射面832。例如，杯 11 200825328 體830之内側可以設置一反射膜，或是經過拋光處理，以 反射發光二極體600發出之光線，使更多的光線可以由第 二杯口 836射出。 參照第4圖，管體810與杯體830可以利用一體成形 的方式製造。管體810之材質可以是塑膠材料或金屬材料， 並且管體810之材質可以採用高導熱材料，例如鋁或銅， 使得發光二極體600產生的熱可以透過杯體830傳導至管 體810 ’並且散發至外界環境。如此，防水型反射杯8⑼ f 不但可以提供防水功能，並且可以反射、集中發光二極體 600餐出之光線’同時可以對於發光二極體6〇〇進行散熱。 由上述本發明較佳實施例可知，本發明具有以下優點： 1.本發明一較佳實施例所述之LED照明燈，基板具有 至少一第一空氣對流孔，散熱背板具有至少一第二空氣對 流孔，第二空氣對流孔與第一空氣對流孔連通，冷卻氣流 可以貫穿第一空氣對流孔及第二空氣對流孔。因此可以有 效地降低LED之溫度，進而增加LED照明燈之發光效率及 I, 使用哥命。 2·本發明一較佳實施例所述之LED照明燈，防水裝置 對應發光二極體設置，防水裝置與基板係利用一對螺紋結 構連接’防水裝置可以有效地隔絕外界環境的水氣，因此 可以不需安裝防水外罩，藉以提高LED照明燈的散熱效率。 3·本發明一較佳實施例所述之LED照明燈，基板具有 至少一凹槽’因此導電線材可以隱藏地設置於凹槽内，防 止外界環境的水氣損壞導電線材。 雖然本發明已以一較佳實施例揭露如上，然其並非用 12 200825328 以限疋本發明’任何孰習 Ί…、白此技藝者，在不脫離本發明之精 神和範圍内，當可作久插夕苗& ^ ^ 作各種之更動與潤飾，因此本發明之保 4範圍當視後附之申士主直丨μ I甲。月專利乾圍所界定者為準。 【圖式簡單說明】 為讓本發明之上述和其他目的、特徵、優點與實施例 能更明顯易懂，所附圖式之詳細說明如下： 第圖、、、3示依照本發明一較佳實施例之i^ED照明燈之 結構分解示意圖。 =2圖繪示第i圖中基板之結構示意圖。 =3圖繪不第2圖中基板之背面結構示意圖。 第4圖繪示依照本發明一較佳實施例之防水型反射杯 結構示意圖。 第5圖繪不第4圖中防水型反射杯與基板結合之剖面 圖0 【主要元件符號說明】 4〇4 :散熱鰭片 4〇6 ··安裝孔 500 :鎖固裝置 6〇〇 :發光二極體 7 0 0 :邊框 800 :防水型反射杯 810 :管體 8 12 ··第一開 口 1〇〇 :發光二極體照明燈 200 ·基板 201 :正面 202 ·背面 212 :第一凹部 214 :第二凹部 216 :線孔 218 :第一凹部之側面 13 200825328 219 :第二螺紋結構 814 : 220、220a、220b :第一空氣 816 : 對流孔 820: 240 :凹槽 830 ： 300 :防水裝置 832 ： 302 ··透明上蓋 834 ： 304 :防水裝置之側面 836 : 400 :散熱背板 p 402、402a、402b ··第二空氣The two ends have a first opening 812 and a second opening 814, respectively. The transparent plate 82 is owed into the second opening 814, and the transparent upper cover 820 and the second opening 814 can be bonded by waterproof glue to close the second opening 814. It is worth mentioning that the tube body 81 has a first thread structure 816 adjacent to the first opening 812. The side of the recess portion 212a has a second thread structure 2丨9. The first squeegee, the stencil, and the second thread structure 219 can be interlocked with each other, so that the waterproof reflective cup 800 can be tightly combined with the first recess 212& and form a inside of the tube body 8-10. The confined space prevents the moisture of the external environment from damaging the light-emitting body 600. Further, when the light-emitting diode 6 is defective, the waterproof 5L reflector cup 800 can be easily opened for maintenance. Further, a waterproof glue may be applied between the first thread structure 8 and the second thread structure 219, so that the joint of the tube body 810 and the first recess 212a can achieve a completely airtight effect. According to Fig. 4, the material of the transparent upper cover 82〇 may be a high transmittance material such as plexiglass or inorganic glass, and the transparent upper cover 82〇 may be an optical lens having a curved surface. For example, the transparent upper cover 820 may have a light collection. The convex lens acts to concentrate the light emitted by the LED. The cup body is disposed in the tube body 81〇 and connected to the tube body 81〇, the cup body (4) has a first cup mouth 834 and a second cup mouth 836, and the first cup mouth 834 and the second cup cup 836 are hollow, and The first cup opening 812 and the second opening 8 are respectively arranged in a blunt correspondence with the second recessed portion 834, and the light emitting diode can emit light from the second concave portion 214& Cup 836 makeup shot. The material of the cup body 83 can be a plastic material 戋 metal material, and the inside of the cup body has a light reflecting surface 832. For example, the inner side of the cup 11 200825328 body 830 may be provided with a reflective film or polished to reflect the light emitted by the light emitting diode 600 so that more light can be emitted from the second cup opening 836. Referring to Fig. 4, the tubular body 810 and the cup body 830 can be manufactured by integral molding. The material of the tube body 810 may be a plastic material or a metal material, and the material of the tube body 810 may be a high thermal conductive material such as aluminum or copper, so that the heat generated by the light emitting diode 600 can be transmitted to the tube body 810 through the cup body 830. And distributed to the outside world. In this way, the waterproof reflector cup 8(9)f can not only provide a waterproof function, but also can reflect and concentrate the light emitted by the LEDs 600 while dissipating heat to the LEDs. According to the preferred embodiment of the present invention, the present invention has the following advantages: 1. The LED illumination lamp according to the preferred embodiment of the present invention, the substrate has at least one first air convection hole, and the heat dissipation back plate has at least a second The air convection hole communicates with the first air convection hole, and the cooling airflow may penetrate the first air convection hole and the second air convection hole. Therefore, the temperature of the LED can be effectively reduced, thereby increasing the luminous efficiency of the LED lighting and the use of the life. 2 . The LED lighting lamp according to a preferred embodiment of the present invention, the waterproof device is disposed corresponding to the light emitting diode, and the waterproof device and the substrate are connected by a pair of screw structures. The waterproof device can effectively isolate the moisture of the external environment, so It is not necessary to install a waterproof cover to improve the heat dissipation efficiency of the LED lighting. 3. The LED illumination lamp of the preferred embodiment of the present invention, wherein the substrate has at least one recess' so that the conductive wire can be hiddenly disposed in the recess to prevent moisture from the external environment from damaging the conductive wire. Although the present invention has been disclosed above in a preferred embodiment, it is not intended to limit the invention to any of the teachings of the present invention, which may be made without departing from the spirit and scope of the invention. For a long time, the seedlings & ^ ^ make a variety of changes and retouching, so the scope of the invention 4 of the invention is attached to the Shen Shi main 丨 μ I A. The definition of the monthly patent stipulations shall prevail. BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features, advantages and embodiments of the present invention will become more <RTIgt; A schematic exploded view of the i^ED illumination lamp of the embodiment. FIG. 2 is a schematic view showing the structure of the substrate in FIG. The graph of the back side of the substrate in Fig. 2 is not shown in Fig. 3. Figure 4 is a schematic view showing the structure of a waterproof reflector according to a preferred embodiment of the present invention. Figure 5 is a cross-sectional view of the waterproof reflector cup combined with the substrate in Fig. 4. [Main component symbol description] 4〇4: Heat sink fin 4〇6 · Mounting hole 500: Locking device 6〇〇: Illumination Diode 7 0 0 : frame 800 : waterproof reflector cup 810 : tube 8 12 · first opening 1 : light emitting diode illumination 200 · substrate 201 : front side 202 · back surface 212 : first recess 214 : second recess 216 : wire hole 218 : side face 13 of first recess 200825328 219 : second thread structure 814 : 220, 220a, 220b : first air 816 : convection hole 820 : 240 : groove 830 : 300 : waterproof device 832 : 302 ··Transparent top cover 834 : 304 : side of the waterproof device 836 : 400 : heat dissipation back plate p 402, 402a, 402b · · second air
對流子L 第二開口 第一螺紋結構 透明上蓋 杯體 光反射面 第一杯口 第二杯口 14Convection L second opening first thread structure transparent upper cover cup body light reflecting surface first cup mouth second cup mouth 14