200824512 IPD060594TW 22414twf.doc/n 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種生產線平衡方法，且特別是有關 於一種表面黏著技術（Surface Mounting Technology，SMT ) 生產線平衡方法及電腦可讀取儲存媒體。 【先前技術】 Γ 表面黏著技術（SMT)是一種將元件焊接在印刷電路 板表面的技術。圖i所繪示為傳統的表面黏著技術生產流 程示意圖。請參照圖1，首先由送板機（L〇ader) 1〇1將印 刷電路板（Printed Circuit Board，PCB )的其中一面朝上而 載置於生產線上。之後，藉由印刷機（Screenprinter) 1〇2 來對生產線上的印刷電路板進行錫膏印刷。基於一些較大 元件，是製程上的考量，為了避免在元件在取放至印刷電 路板時導致不良狀況（例如裂缝）的發生，因此在印刷上 錫㈢後，會使用點膠機（Dispenser) 103於印刷電路板表 面異形元件或是較重的元件的位置上點膠。 接著，便利用表面黏著元件取放（pickandplace)設 備將表面黏著元件（Surface Mounting Device，SMD )放置 在印刷電路板上。表面黏著元件取放設備大都為高速機 (High speed) 1〇4 搭配泛用機（Multi-purpose) 105 使用。 而藉由先前印刷於印刷電路板上的錫膏，表面黏著元件可 以黏附於印刷電路板表面。然後經由迴焊爐（R e fl 〇 w oven) 106將印刷電路板之環境提升至一定溫度後，使錫膏融化 4 200824512 IPD060594TW 22414twf.doc/n 以完全附著於表面黏著元件之連接端與印刷電路板之焊 墊。最後’利用收板機（Unloader) 107將印刷電路板下載。 接著再使用送板機108將印刷電路板的另一面上載，而後 續生產流程自印刷機109、高速機11〇、泛用機I〗〗、迴焊 爐112至收板機113亦與上述相同，以進行另一面的表面 黏著元件組裝。 +其中高速機（104及11〇) -般是用來組農較小的表 面黏著元件（例如電容及電阻等）。泛用機（1〇5及 則是用來組裝異形元件（例如接線座及中央處理 北橋晶片之類的大型元件等），因此泛用機⑽及; =組裝速度會比高速機（104及11〇)來得慢。以筆記型電 腦之母板為例，-般由於印刷電路板# 私 放在背面，所以正面及背二 ^寸授g不-k。在元件組裝過程中，便會因為印刷 ==較快速’使得整個生產線的效能受限在 以接ΐί產^上’必須使各工作站的作#時_略相等， 技 片印刷雷政把的& 〜μ呼间马2分鐘 ^路板的一面，因此會在工作站203形成一 板的-面，而工作皆為1分鐘組裝一片印刷電路 =，20!之工作週期時間為2分鐘組裝- 個瓶頸。 。 。 。 。 。 。 The storage medium can be read. [Prior Art] Γ Surface Adhesion Technology (SMT) is a technique for soldering components to the surface of printed circuit boards. Figure i is a schematic diagram showing the production process of a conventional surface mount technology. Referring to Fig. 1, firstly, one side of a printed circuit board (PCB) is placed on the production line by a sheet feeder (L〇ader) 1〇1. Thereafter, the printed circuit board on the production line is solder-printed by a printer (Screenprinter) 1〇2. Based on some large components, it is a process consideration. In order to avoid the occurrence of bad conditions (such as cracks) when the components are picked up and placed on the printed circuit board, the Dispenser will be used after printing the tin (3). 103 dispenses at the location of the profiled component or the heavier component on the surface of the printed circuit board. Next, it is convenient to place a surface mounting device (SMD) on the printed circuit board with a surface mount component pick-and-place device. Most of the surface-adhesive component pick-and-place devices are High Speed 1〇4 for use with the Multi-purpose 105. The surface mount component can be adhered to the surface of the printed circuit board by solder paste previously printed on the printed circuit board. Then, after the environment of the printed circuit board is raised to a certain temperature via a reflow oven (R e fl 〇w oven) 106, the solder paste is melted. 4 200824512 IPD060594TW 22414twf.doc/n is completely attached to the connection end of the surface adhesive component and printed Circuit board pads. Finally, the printed circuit board is downloaded using an Unloader 107. Then, the other side of the printed circuit board is loaded by the plate feeder 108, and the subsequent production process is the same as the above from the printing machine 109, the high speed machine 11, the general machine I, the reflow furnace 112, and the retractor 113. To carry out the assembly of the surface adhesive component on the other side. + Among them, high-speed machines (104 and 11〇) are generally used to form smaller surface adhesive components (such as capacitors and resistors). Universal machines (1〇5 and then used to assemble odd-shaped components (such as terminal blocks and large-scale components such as central processing Northbridge chips), so the general-purpose machine (10) and; = assembly speed will be faster than high-speed machines (104 and 11) 〇) Come slow. Take the motherboard of the notebook computer as an example. Generally, because the printed circuit board # is placed on the back side, the front and back sides are not g-k. In the component assembly process, it will be printed. == Faster 'make the performance of the entire production line limited to the connection ΐ 产 ^ ' must must make each workstation's _ _ slightly equal, the technology printed Lei Zheng put & ~ μ 呼 间 2 minutes ^ road One side of the board will form a board-surface on the workstation 203, and the work will be 1 minute to assemble a printed circuit = 20, the work cycle time is 2 minutes assembly - a bottleneck
200824512 IPD060594TW 22414twf.doc/n 站（Bottleneck)。而原本一小時可 板的一面（即60 /小時），由於工、、且裝60片印刷電路 間較久，因而使得生產率降為3(^作^。203之工作週期時 為了達到生產線平衡，傳統n °3 路板正面元件所需高速機Π04 /更疋調整組裝印刷電 ⑴）搭配之數量，以及調整組農印刷m機及 高速機（104及110)與泛用機（1 „板:面兀件所需 以使生產效能騎目為某—倾_ 數量， 工作站203)而受限。_ 2B 如 生產線平衡之各工作站週期_示咅閉a表面4者技術 作站205、906 «如〇 、心圖。明茶照圖2B，工 二電=ΓΓ之工作週期時間皆為1分鐘組裝-片 厂糾電路板的一面，而工作站2〇7菸 為2/分鐘組裝—片印刷電路㈣1 期時間 ，工作站（207及208)以使作業能夠平行 >理 ;:電=尚在工作站207進行組裝時，工作站二二 、下^ Ρ刷電路板送往工作站’而不需等待工作站 成後ΐ送下—片，以提高各工作站的使用效率 ,。但疋，如此一來也必須暫停生產線以調整工 作站（往往需花費2_3天），亦耗費成本。 【發明内容】 本發明提供一種生產線平衡方法與電腦可讀取儲存 媒體，使得在佈局階段能夠適度地調配元件配置到基板的 位置，並自動提示使用者，使各工作站達到最佳使用率。 200824512 IPD060594TW 22414twf.doc/n 本發明提出 基板之第-表面及第二:面元件配置至 卜f期及第二表面之元件之= 弟一表面之元件的第一組裝時間與第二表面之元件的第一 組裝時間作-平衡演算，調整元件 牛的= 之配置結果。 叫/、罘一表面 體，用一二儲她1程式之電腦可讀取儲存媒 統執行上述之1產線腦系統中’並且使得電腦系 本發明因於佈局階段便可評估基板之第—表面及第 -表面之7G件的第-組裝時間與第二 ;此若第-組裝時間與第二組裝時間之時心 不生早在佈局階段重新決定元件之分佈，而 不而暫停生產線與變更/調整生產線之工作站。 財發明之上述特徵和優點能更明顯易懂，下文特 牛較“關，並配合所附圖式，作詳細說明如下。 【實施方式】 物製::;藉由調整生產線中元件取放 、衡此白知技術在调整生產線平衡的過 即/泰不僅’良費時間且耗費成本。下述本發明之諸實施例 件的段中二藉著分別計算出基板第-表面之元 曰、、且1日守間及第二表面之元件的第二組裝時間，判 疋否重新配置it件，以提高在製造階段巾生產線上各工 200824512 IPD060594TW 224l4twf.d〇c/n 作站的效能。為了使本發明之内容更為明瞭，以下特舉實 施例作為本發明確實能夠據以實施的範例。而為了方 明，以下均以「正面」來做為「第一表面」之描述，並以 「背面」來做為「第二表面」之描述，且分別以「正面的 元件組裝時間」與「背面的元件組裝時間」來取代「第丄 表面之元件的第一組裝時間」與「第二表面之元件的第二 組裝時間」的描述。 一 ο200824512 IPD060594TW 22414twf.doc/n Station (Bottleneck). On the one side of the original one-hour board (ie, 60 / hour), the productivity is reduced to 3 due to the long time between the work and the 60 printed circuits, so that in order to achieve the balance of the production line during the work cycle of 203, The traditional n °3 board front panel requires high-speed machine Π 04 / more 疋 adjust assembly printed electricity (1)) the number of matching, as well as adjustment group printing m machine and high-speed machine (104 and 110) and general purpose machine (1 „ board: The face piece is required to make the production performance of the horsepower a certain amount - the number of the work station 203) is limited. _ 2B such as the balance of each line of the work line _ show a closed surface 4 technical station 205, 906 « 〇, 心图. Ming tea according to Figure 2B, work two electricity = ΓΓ work cycle time is 1 minute assembly - the side of the chip factory to correct the circuit board, while the workstation 2 〇 7 smoke is 2 / minute assembly - film printed circuit (four) 1 Period, workstations (207 and 208) to enable the operation to be parallel>: electricity = still in the assembly of the workstation 207, the workstation 22, the next ^ brush circuit board to the workstation ' without waiting for the workstation to become Send the next film to improve the efficiency of each workstation. Therefore, it is also necessary to suspend the production line to adjust the workstation (which often takes 2 to 3 days), which is also costly. [Invention] The present invention provides a production line balancing method and a computer readable storage medium, so that it can be appropriately allocated in the layout stage. The components are arranged to the position of the substrate, and the user is automatically prompted to achieve optimal use of each workstation. 200824512 IPD060594TW 22414twf.doc/n The present invention proposes the first surface of the substrate and the second: the surface element is configured to the f phase and the The component of the two surfaces = the first assembly time of the component of the surface of the second surface and the first assembly time of the component of the second surface are balanced-balanced, and the configuration result of the component of the component is adjusted. One or two computer readable storage media can execute the above-mentioned 1 line brain system' and enable the computer to evaluate the 7G surface of the first surface and the first surface of the substrate due to the layout stage. First-assembly time and second; if the first-assembly time and the second assembly time are not born, the distribution of components is re-determined in the layout stage, instead of Stopping the production line and changing / adjusting the production line workstation. The above features and advantages of the invention can be more financial comprehensible, more cattle hereinafter "off, and with the accompanying drawings, described in detail below. [Embodiment] Material system:: By adjusting the component pick-and-place in the production line, it is not only good time and costly to adjust the balance of the production line. In the following section of the embodiment of the present invention, the second assembly time of the element of the first surface of the substrate and the element of the first and second surfaces is calculated, and the device is reconfigured. To improve the performance of the 200824512 IPD060594TW 224l4twf.d〇c/n station in the manufacturing stage. In order to clarify the content of the present invention, the following specific examples are given as examples in which the present invention can be implemented. For the sake of Fang Ming, the following descriptions of "front surface" are used as "first surface", and "back surface" is used as "second surface" description, and "front component assembly time" and " The component assembly time on the back side replaces the description of the "first assembly time of the element of the second surface" and the "second assembly time of the element of the second surface". One o
圖3是依照本發明實施例之一種生產線平衡方法流程 圖。請參照圖3，首先依據在製造階段中生產線上各 件組裝至基板所需的時間來建立一個資料庫（步驟3〇1)。 於本實施例中所述之基板例如是印刷電路板，此領域具有 通常知識者亦可以視其需求而將本發明實施於各種類型基 板（例如軟性基板、玻璃基板等）。 、土 另外，本實施例中所述之元件包含表面黏著元件。上 述資料庫中之元件組裝時間可根據元件取放設備將元件組 板4所測量之時間而設定，亦可憑著累積的經驗來 旦开、70件組裝時間，然在此並不限定元件組裝時間之測 ▼方法。 Ρ =進t Ϊ路佈局。於電路佈局階段，轉302依據 格、機=條件與電器特性等條件將各個元件配置到 基板的正面及背面上。缺接 件組裝時間（步驟303Γ牛ί分別計算正面及背面的元 板的正面及背面後（例如執可在元件Γ置到基 別去累加正面及背面的元件矣且裝時=佈件」功此），再刀 8 200824512 IPD060594TW 224l4twf.doc/n 或者，則在一邊配置元件的同時（例如執行「人工佈 件」功旎），一邊累加正面及背面的元件組裝時間。然在 此並不限制計算元件組裝時間的方式。另外在進行元;牛配 置時，更可適時地在螢幕上顯示目前正面及背面的元件數 及^元件組裝時間，以供使用者瞭解是否會使各工作站達 到最佳使用率。當然，步驟303所累加正面及背面的元件 組裝時間亦可以提供給佈件（Placement)演算法，作為進 p 行「自動佈件」時之演算參數之一。 隶後，判斷基板正面及背面的元件組裝時間差是否在 一個容忍值内（步驟304)。意即基板在依據步驟3〇2之 佈件結果而於製造階段進行元件組裝（例如將表面黏著元 件組裝於印刷電路板）時，是否能夠使生產線平衡，而不 需變更生產線之工作站。步驟304即是為了使生產線平 衡，在兀件配置完畢後，去計算出基板正面及背面的元件 組裝時間差，並與一個容忍值比對。 若超出容忍值便需重新配置元件（重複進行步驟 G 306、307、302與3〇3)，直到正面及背面的元件組裝時間 差在容忍值範圍内，方可繼續執行佈局之其餘作業（步驟 305)。然容忍值可依照元件取放設備之速度或是過去^積 的經驗來訂定，在此並不限制其範圍。 ’、貝 由於高速機與泛用機在元件組裝上之速度有相當大 差異，因此泛用機往往會成為生產線中的一個瓶頸站:因 為泛用機是用來組裝異形元件，故當判斷需重新配置元件 時，步驟306便將基板正面及/或背面之異形元件列出。例 9 200824512 IPD060594TW 22414twf.doc/n 如，若基板背面之元件組裝時間大於基板正面之元壯 %間，使用者便可財慮將原本配置於背面部分異形元二 移至基板正面去。 另外，由於有些元件有其固定位置（例如個人 機板上PCI槽的位置），因此步驟3〇7根據 而從步驟綱所列出之異形元件中，將不能移動 除’以列出可自由配置在任-面的異形元件。目此 Γ t進行步驟搬，而根據步驟3G7列出的S件去 =整，重新配置部分元件位置。例如，電腦執行佈件^ 法，而從步驟307列出的it件清單中選擇部分或全 去進行「顏佈件」（例如將元件由原先配置板 面改配置到另一面）。 、土攸又一 或者’可以將步驟3〇7列出的S件清單列示於 上，使用者便可根制㈣元件絲配置元件位置。 來說，以電腦主機板而言，當列出所有異形元件後^ 主機板設計規則將記憶體插槽、中央處理器及 1 =定位置之元件從列表中扣除後，使用者二2 可私動至任一面的元件來進行調配。 、 另外，於步驟306之後可省略步驟3〇7， 置元件（步驟302)。或是省略步驟3〇6而執 3 -己 以重新配置元件（步驟观）ι或使用者可根據自= ==配置元件（步驟302)，而不需列 件 或疋可自由配置之元件’然以上麵配置辑 ^ 視使用者情況來決定。 200824512 IPD060594TW 22414twf.doc/n 令貝她例間早术况，即是在佈局的時候，先 放置於正面及背面的元件分別為哪些，當元# = 後，便自動計算出正面的元件組裝時間以 的ς ，間。接著判斷正面與#面的元件喊組 谷忍值内，使得在進行表面黏著製程 =用率。若判斷之結果會降低工作站使用1產= ;將某；元件移動至另-面，以重新配置元件。而重2 曰ίΓΐ成後再去計算元件組裝時間差，以判斷如此配置 ^内 產線平衡’直到元件組裝時間差在容忍值範 提的是，本實施例可於電腦系統上來執行，將 〔=^*例°又5十為一電腦程式’利用電腦可讀取儲存婢體 如光碟或硬碟)來儲存此電腦程式，並且將其= 於一個模擬環境==是=發—套電腦軟體讓使用者可 妙時Η 兀件，並由軟體自動計算出元件 及且可任意變動元件配置位置來調整基板正面 及月面之70件組裝時間差。 存媒生產線平衡方法及電腦可讀取儲 正面執行表面黏著製程前，可於佈局階段來設計基板 時間，元件’以調整正面及背面之元件組裝 1计异正面及背面的元件組料間，以提高各工作站 200824512 IPD060594TW 22414twf.doc/n 使用效率，進而加快生產速度並提升實際產出量。 3·不需調整硬體設備即可使生產線平衡，使得生 不需停擺，節省成本。 ' 雖然本發明已以較佳實施例揭露如上，然其並非用以 限定本發明，任何所屬技術領域中具有通常知識者，在 脫離本發明之精神和範圍内，當可作些許之更動與潤飾， 因此本發明之保護範圍當視後附之申請專利範圍所界定者 為準。 【圖式簡單說明】 圖1所繪不為傳統的纟面黏著技術生產流程示意圖。 一圖2A所緣示為傳統的表面黏著技術各工作站週期時 間不意圖。 工作统的表面黏著技術生產線平衡之各3 is a flow chart of a line balancing method in accordance with an embodiment of the present invention. Referring to Figure 3, a database is first created based on the time required to assemble the components to the substrate on the production line during the manufacturing phase (step 3〇1). The substrate described in this embodiment is, for example, a printed circuit board, and those skilled in the art can also implement the present invention on various types of substrates (e.g., flexible substrates, glass substrates, etc.) depending on the needs thereof. Soil Additionally, the elements described in this embodiment comprise surface mount elements. The assembly time of the components in the above-mentioned database can be set according to the time measured by the component pick-and-place device for the component group board 4, and can be opened by the accumulated experience and 70 assembly times, but the component assembly is not limited herein. Time measurement method. Ρ = enter t Ϊ layout. In the circuit layout phase, the transition 302 is placed on the front and back sides of the substrate according to conditions such as cell, machine=condition and electrical characteristics. Missing assembly time (Step 303: Γ牛ί calculates the front and back of the front and back panels, respectively (for example, the components can be placed on the base to accumulate the front and back components, and the installation time = cloth) This), then knife 8 200824512 IPD060594TW 224l4twf.doc/n Or, while arranging the components on one side (for example, performing the "manual cloth" function), while accumulating the component assembly time of the front and back sides, it is not limited here. Calculate the assembly time of the components. In addition, when the configuration is performed, the number of components on the front and back and the assembly time of the components can be displayed on the screen in time for the user to know whether the workstations will be optimal. The usage rate. Of course, the assembly time of the front and back components added in step 303 can also be provided to the Placement algorithm as one of the calculation parameters when the "automatic cloth" is inserted into the line. And whether the component assembly time difference of the back surface is within a tolerance value (step 304), that is, the substrate is subjected to the manufacturing phase in accordance with the result of the fabric of step 3〇2. When assembling (for example, assembling a surface-adhesive component on a printed circuit board), it is possible to balance the production line without changing the workstation of the production line. Step 304 is to balance the production line and calculate the front side of the substrate after the assembly is completed. And the components on the back are assembled for a short time and compared with a tolerance value. If the tolerance is exceeded, the components need to be reconfigured (steps G 306, 307, 302 and 3〇3 are repeated) until the component assembly time difference between the front and back components is tolerated. Within the range of values, the remaining operations of the layout can be continued (step 305). However, the tolerance value can be determined according to the speed of the component pick-and-place device or the experience of the previous product, and the scope is not limited herein. Because the speed of component assembly between high-speed and general-purpose machines is quite different, general-purpose machines often become a bottleneck in the production line: because the general-purpose machine is used to assemble the odd-shaped components, when it is judged that the components need to be reconfigured At step 306, the shaped components on the front side and/or the back side of the substrate are listed. Example 9 200824512 IPD060594TW 22414twf.doc/n When the component assembly time is greater than the front of the substrate, the user can move the original configuration to the front surface of the substrate. In addition, some components have their fixed positions (for example, on the personal board). The position of the PCI slot), therefore step 3〇7 from the profiled elements listed in the step outline, will not be able to move except 'to list the freely-configurable elements in the face-to-face. And according to the S piece listed in step 3G7, the partial component position is reconfigured. For example, the computer executes the cloth method, and selects part or all of the list of the parts listed in step 307 to perform the "pig cloth piece". (For example, the component is changed from the original configuration board to the other side). , or the soil can be listed on the list of S items listed in step 3〇7, and the user can configure the position of the component wire (4). In the case of a computer motherboard, when all the odd-shaped components are listed, the motherboard design rule divides the memory slot, the central processing unit, and the component of the fixed position from the list. Move to the component on either side to make the adjustment. In addition, after step 306, step 3〇7 may be omitted, and the component is placed (step 302). Either omit step 3〇6 and perform 3 - to reconfigure the component (step view) or user can configure the component according to === (step 302) without column or freely configurable component' However, the above configuration is determined by the user's situation. 200824512 IPD060594TW 22414twf.doc/n The early case of her case, that is, the components placed on the front and the back at the time of layout, when the element # =, the front component assembly time is automatically calculated. With ς, between. Then judge the front side and #面 component shouting group valley tolerance, so that the surface adhesion process = use rate. If the result of the judgment is reduced, the workstation uses 1 production =; move a component to the other side to reconfigure the component. After the weight is 2 曰ίΓΐ, the component assembly time difference is calculated to judge the configuration of the internal line balance. Until the component assembly time difference is in the tolerance value, the embodiment can be executed on the computer system, and [=^ *Example °50 is a computer program 'Using a computer to read a storage cartridge such as a CD or a hard disk) to store the computer program and convert it to an analog environment == Yes = Hair - Set of computer software for use It is possible to adjust the components automatically, and the components are automatically calculated by the software, and the component placement position can be arbitrarily changed to adjust the 70 assembly time difference between the front side and the moon surface of the substrate. Before the storage line balancing method and the computer-readable front surface performing the surface sticking process, the substrate time can be designed in the layout stage, and the component is assembled by adjusting the front and back components to the front and back component sets. Improve the efficiency of each workstation 200824512 IPD060594TW 22414twf.doc/n, thereby speeding up production and increasing actual output. 3. The production line can be balanced without adjusting the hardware equipment, so that no need to stop the swing and save costs. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the invention, and those skilled in the art can make some modifications and refinements within the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims. [Simple description of the diagram] Figure 1 is not a schematic diagram of the production process of the traditional surface adhesion technology. Figure 2A shows the conventional surface mount technology for each workstation cycle time. Work surface bonding technology production line balance
圖 圖3是依财㈣實施狀—種生錄平衡方法流程 【主要元件符號說明】 10卜108 :送板機 102、109 :印刷機 103 :點膠機 104、 11〇 :高速機 105、 111 :泛用機 12 200824512 IPD060594TW 22414twf.doc/n 106、 112 :迴焊爐 107、 113 :收板機 201〜209 :工作站 301〜307 :本發明實施例之一種生產線平衡方法各步Figure 3 is a flow chart of the implementation method of the financial (four) method. [Main component symbol description] 10 Bu 108: Plate feeder 102, 109: Printing machine 103: Dispenser 104, 11: High speed machine 105, 111 :Universal machine 12 200824512 IPD060594TW 22414twf.doc/n 106, 112: reflow furnace 107, 113: capping machines 201 to 209: workstations 301 to 307: one step of the production line balancing method of the embodiment of the present invention
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