200823365 九、發明說明： 【發明所屬之技術領域】 本發明係有關一種包括一氣密電氣外殼導通裝置的真 空泵。 【先前技術】 真空泵通常於真空密封外殻內部包含有電氣元件，例 如電動馬達、電感測器、磁軸承等。真空側的電氣元件須 經由電線與外殼的外部連接。爲達到此目的，電線須經由 一氣密電氣導通裝置，自外殼內部導至外殼之外部。 已知有由一接觸板構成的習知導通裝置，其包括貫通 延伸的接觸銷，並封閉一對應外殼開口。接觸板藉一密封 件朝外殻開口的邊緣密封。當接觸銷受到機械應力時，接 觸銷的密封困難且不可靠。 【發明內容】 本發明之一目的在於提供一種包括一氣密外殻電氣導 通裝置的真空泵。 根據本發明，真空泵包括一真空密封外殼以及一在該 外殼內的電氣元件。用來於電氣元件與外殼外部間確立一 電連接的氣密電氣導通裝置由以下構件構成：一外殼開 口； 一封裝化合物本體，係置於該外殼開口上’並於外殼 內部與外殼外部之間包括有一電線；一密封環，係配置於 該外殼開口之開口邊緣與封裝化合物本體間；以及一固定 裝置，係用來將封裝化合物本體緊固於外殼。因此，導通 裝置主要由三個構件構成，即封裝所有電線的封裝化合物 200823365 本體、確保封裝化合物本體與開口邊緣間之氣密及真空密 封的密封環以及一用於封裝化合物本體的固定裝置，藉助 於該裝置，將封裝化合物本體不變地壓在外殼開口的開口 邊緣上。 封裝化合物具有某一程度的撓性，其容許一或多條電 線以確保氣密及真空密封的方式通過封裝化合物本體。較 佳地，一或多條電線於遠端及近端均伸出一小段距離，俾 電連接線可連接至該電線。在封裝化合物本體與開口邊緣 •間的間隙藉一密封環可靠地密封。 封裝化合物本體的厚度應至少爲5mm，較佳地至少爲 1 0mm，以確保在電線與封裝化合物間有夠長的密封距離。 將所有電線封裝於一整體彈性封裝化合物本體內容許 即使在多數線通過該導通裝置時，仍以較簡單的方式實現 真空密封的導通裝置。這對包括一磁軸承的真空泵特別重 要，其原因在於，於此情況下，通常有5 0條或更多條電線 通過真空密封外殼。 ® 根據一較佳實施例，自外部將封裝化合物本體置於外 殼開口的開口邊緣上。於操作期間內，封裝化合物本體會 ^ 因自外部作用於該本體的大氣壓力與瀰漫於外殼內的真空 間的壓力差而壓在外殼開口的邊緣上。因此，於真空泵的 操作期間內，進一步增加封裝化合物本體與外殼開口的邊 緣間的密封效果。 較佳地，固定裝置係一封裝化合物外殻，該外殼幾乎 收容整個封裝化合物，並將其壓抵於外殼開口的邊緣。封 200823365 裝化合物外殻僅包括用於一或多條地電線之一近端及一遠 端開口。封裝化合物外殼主要固定封裝化合物本體，且不 用來作爲密封件。惟，封裝化合物外殼亦可具有一密封效 果。 根據一較佳實施例，電線可包括一配置於封裝化合物 內的電路板。因此，電線有一部分配置成導線電路板上之 一導線。電線可進一步包括一延伸至外殼內部的電插頭， 以及一延伸至外殼之外部的電插頭，二插頭自封裝化合物 本體突出。此二電插頭可經由導線電路板相互連接，惟亦 可以不同方式相互電連接。 根據一較佳實施例，導線電路板包括電子元件。可能 的電子元件係可用於放大、干擾壓制或其他電氣訊之操 縱’諸如放大器、干擾壓制扼流圈及電容器、用於訊號處 理的積體電路等所有電子元件。 較佳地’電子元件係一可讀取泵資料記憶體，其中儲 存可在任何時候取出的泵特定功能參數，例如相關真空泵 的故障經歷。 較佳地’封裝化合物係一環氧樹脂。環氧樹脂爲真空 密封，有彈性，並可在一較低溫度下鑄注，於該溫度，電 氣元件不會被破壞。 【實施方式】 圖式示意顯示一真空泵10，其可配置成一排量泵，惟 特別配置成一包括磁軸承的高真空渦輪分子泵。 真空泵1 0包括一真空密封金屬外殼i 2，該外殼1 2具 •200823365 有一外殼壁13,其中配置有複數電氣元件14，16，18，即一電 動馬達14、一磁軸承16及一泵感測器18。電動馬達14經 由一軸1 7驅動渦輪分子泵的泵轉子。 真空泵10包括一氣密電氣導通裝置20,用來於電氣元 件1 4、1 6、1 8與外殼外部之間確立一電氣連接。導通裝置 20基本上由以下構件構成：一在外殼壁1 3中之外殼開口 22 ; —封裝化合物本體24，係自外部置於外殼開口 22上； 一彈性密封環26，係配置於外殼開口 22之一開口邊緣28 # 與封裝化合物本體24之間；一固定裝置32，係配置成一 封裝化合物外殼3 0 ;以及一電線3 4。密封環2 6配置於一 設在封裝化合物本體24內的環形槽27中。 電線34由一近端電插頭40、一遠端電插頭42以及一 包括導線和電氣元件46,47.，48的電路板44構成。電氣元件 46-4 8係積體電路46及被動元件47,48。各插頭40,42包括 5 〇根以上的插腳，各插腳個別與電路板44上的導線連接。 於積體電路46中儲存真空泵1 0的功能參數及資料。 • 功能參數係泵特定參數，並含有真空泵1 0的故障經歷，可 藉助於一適當讀取裝置5 0，經由遠端電插頭42並經由一 可連接到該插頭42的資料線5 2讀取。 所有電線3 4構件氣密封裝於封裝化合物本體24內。 封裝化合物係環氧樹脂。可將細粒掺合物添加於環氧樹脂， 掺合物造成熱膨脹、熱導率及/或其他參數的積極變化。 界定一固定於，例如螺固於外殼3 0外部之固定裝置 32的封裝化合物外殼3〇會將封裝化合物本體24壓在開口 200823365 的邊緣2 8上，從而，於開口的邊緣2 8與封裝化合物本體 24之間確立一氣密及真空密封。 雖然參考特定之說明性實施例說明並解說本發明，惟 本發明不限於此等說明性實施例。熟於此技藝人士咸認爲， 在不悖離隨後申請專利範圍所界定本發明真正範疇下’可 進行改變及修正。因此，欲將所有此種改變及修正包含在 所附申請專利範圍及均等物的範疇內。 【圖式簡單說明】200823365 IX. Description of the Invention: [Technical Field] The present invention relates to a vacuum pump including a gas-tight electrical housing conduction device. [Prior Art] A vacuum pump usually contains electrical components such as an electric motor, an inductor, a magnetic bearing, etc. inside a vacuum sealed casing. The electrical components on the vacuum side must be connected to the outside of the enclosure via wires. To achieve this, the wires must be routed from the inside of the enclosure to the outside of the enclosure via a hermetic electrical conduction device. A conventional conduction device consisting of a contact plate is known which includes a contact pin extending therethrough and enclosing a corresponding housing opening. The contact plate is sealed to the edge of the housing opening by a seal. When the contact pin is subjected to mechanical stress, the sealing of the contact pin is difficult and unreliable. SUMMARY OF THE INVENTION One object of the present invention is to provide a vacuum pump including an airtight housing electrical conduction device. In accordance with the present invention, a vacuum pump includes a vacuum sealed enclosure and an electrical component within the enclosure. The hermetic electrical conduction means for establishing an electrical connection between the electrical component and the exterior of the housing is comprised of: a housing opening; a package compound body disposed on the housing opening 'and between the interior of the housing and the exterior of the housing The utility model comprises a wire; a sealing ring disposed between the opening edge of the opening of the casing and the body of the packaging compound; and a fixing device for fastening the body of the sealing compound to the casing. Therefore, the conduction device is mainly composed of three components, namely, a package compound 200823365 body encapsulating all wires, a hermetic and vacuum-sealed sealing ring between the package compound body and the opening edge, and a fixing device for encapsulating the compound body. In the apparatus, the body of the encapsulating compound is invariably pressed against the open edge of the opening of the casing. The encapsulating compound has a degree of flexibility that allows one or more wires to pass through the encapsulating compound body in a manner that ensures a hermetic and vacuum tight seal. Preferably, one or more wires extend a short distance from the distal end and the proximal end, and the electrical connection wire can be connected to the wire. The gap between the package compound body and the opening edge is reliably sealed by a sealing ring. The thickness of the potting compound body should be at least 5 mm, preferably at least 10 mm, to ensure a long enough sealing distance between the wire and the potting compound. Encapsulating all of the wires in a unitary elastomeric encapsulating compound allows the vacuum-sealed conduction device to be implemented in a relatively simple manner even when most of the wires pass through the conducting means. This is particularly important for vacuum pumps that include a magnetic bearing because, in this case, typically 50 or more wires are sealed through the vacuum. ® According to a preferred embodiment, the body of the potting compound is placed on the open edge of the opening of the housing from the outside. During operation, the bulk of the encapsulating compound is pressed against the edge of the opening of the housing due to the pressure difference between the atmospheric pressure acting on the body from the outside and the vacuum diffusing within the housing. Therefore, the sealing effect between the package compound body and the edge of the opening of the casing is further increased during the operation of the vacuum pump. Preferably, the fixture is a packaged compound housing that houses the entire encapsulating compound and presses against the edge of the housing opening. The 200823365 compound housing includes only one of the proximal ends and one distal opening for one or more of the wires. The encapsulating compound shell primarily holds the body of the encapsulating compound and is not used as a seal. However, the encapsulating compound shell can also have a sealing effect. According to a preferred embodiment, the electrical wire can include a circuit board disposed within the encapsulating compound. Therefore, a portion of the wire is configured as a wire on the wire circuit board. The wire may further include an electrical plug extending into the interior of the housing, and an electrical plug extending to the exterior of the housing, the two plugs projecting from the body of the package compound. The two electrical plugs can be connected to each other via a conductor circuit board, but can also be electrically connected to each other in different ways. According to a preferred embodiment, the wire circuit board comprises electronic components. Possible electronic components can be used to amplify, interfere with the operation of the press or other electrical signals, such as amplifiers, interference suppression chokes and capacitors, integrated circuits for signal processing, and other electronic components. Preferably, the electronic component is a readable pump data memory in which the pump-specific functional parameters that can be taken out at any time, such as the failure experience of the associated vacuum pump, are stored. Preferably, the encapsulating compound is an epoxy resin. The epoxy resin is vacuum sealed, flexible, and can be cast at a lower temperature at which the electrical components are not destroyed. [Embodiment] The diagram schematically shows a vacuum pump 10 which can be configured as a displacement pump, but is specifically configured as a high vacuum turbomolecular pump including a magnetic bearing. The vacuum pump 10 includes a vacuum-sealed metal casing i 2 having a casing wall 13 in which a plurality of electrical components 14, 16, 18 are disposed, that is, an electric motor 14, a magnetic bearing 16, and a pumping sensation Detector 18. The electric motor 14 drives the pump rotor of the turbomolecular pump via a shaft 17 . The vacuum pump 10 includes a hermetic electrical conduction device 20 for establishing an electrical connection between the electrical components 14, 4, 18 and the exterior of the housing. The conducting device 20 consists essentially of a housing opening 22 in the housing wall 13; a packaging compound body 24 that is externally placed on the housing opening 22; an elastomeric sealing ring 26 disposed in the housing opening 22 One of the opening edges 28 # is interposed between the package compound body 24; a fixing device 32 configured as a package compound casing 30; and a wire 34. The seal ring 26 is disposed in an annular groove 27 provided in the body of the package compound 24. The wire 34 is comprised of a proximal electrical plug 40, a distal electrical plug 42 and a circuit board 44 including wires and electrical components 46, 47. Electrical components 46-4 8 are integrated circuits 46 and passive components 47,48. Each of the plugs 40, 42 includes more than 5 pins, each of which is individually connected to a wire on the circuit board 44. The function parameters and data of the vacuum pump 10 are stored in the integrated circuit 46. • The functional parameter is a pump specific parameter and contains the fault experience of the vacuum pump 10, which can be read via a remote electrical plug 42 via a suitable reading device 50 and via a data line 52 that can be connected to the plug 42 . All of the wires 34 are hermetically sealed within the package compound body 24. The encapsulating compound is an epoxy resin. The fine particle blend can be added to the epoxy resin, and the blend causes a positive change in thermal expansion, thermal conductivity, and/or other parameters. Defining a potting compound housing 3 affixed to, for example, a fixture 32 that is threaded to the exterior of the outer casing 30, presses the potting compound body 24 against the edge 28 of the opening 200823365, thereby, at the edge of the opening 28 and the encapsulating compound An airtight and vacuum seal is established between the bodies 24. Although the invention has been illustrated and described with respect to the specific illustrative embodiments, the invention is not limited to the illustrative embodiments. It will be appreciated by those skilled in the art that changes and modifications may be made without departing from the true scope of the invention as defined by the scope of the appended claims. Therefore, all such changes and modifications are intended to be included within the scope of the appended claims. [Simple description of the map]
現在參考圖式，詳細說明本發明之一實施例。 第1圖示意顯示一真空泵以及一包括一氣密外殼電導 通裝置之真空泵的剖視圖。 【主要元件符號說明】 10 真空泵> 12 真空密封外殻 13 外殼壁 14 電動馬達 16 磁軸承 17 軸 18 泵感測器 20 導通裝置 22 外殻開口 24 封.裝化合物本體 26 密封環 200823365An embodiment of the present invention will now be described in detail with reference to the drawings. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic cross-sectional view showing a vacuum pump and a vacuum pump including an airtight outer casing electrical conduction means. [Main component symbol description] 10 Vacuum pump> 12 Vacuum sealed casing 13 Housing wall 14 Electric motor 16 Magnetic bearing 17 Shaft 18 Pump sensor 20 Conductor 22 Housing opening 24 Sealing compound body 26 Sealing ring 200823365
27 環形槽 28 開口邊緣 30 封裝化合物外殼 32 固定裝置 34 電線 40 近端電插頭 42 遠端電插頭 44 電路板 46 積體電路 47 > 4 8 被動元件 50 讀取裝置 52 資料線27 Ring groove 28 Opening edge 30 Package compound housing 32 Fixing device 34 Wire 40 Near-end electrical plug 42 Remote power plug 44 Circuit board 46 Integrated circuit 47 > 4 8 Passive component 50 Reader 52 Data line