200819724 九、發明說明： 【發明所屬技術領域】 【0001】 本發明係有關用以進行撓性印刷電路板之丨PC彎曲 試驗的高速彎曲試驗裝置者。 【先前技術】 【0002] 隹頁關挽性tp刷電路板的彎曲試驗方面，可知有一種 邊挪動彎曲部位邊進行的IPCf曲試驗。在光拾取頭等所 使用之撓性印刷電路板，有必要在一定的行程進行1〇8 次以上f曲次數的試驗。但是具有所謂需要太長的時間， 而且會有因試驗裝置本身作動單元的磨耗等之壽命、變曲 次數增加也就是具有觸與高速化呈反比而壽命縮短的問 題0 【0003】 因此，自以往就提案出多種需要在所需的行程下高速 地運轉（㈣）’且亦考慮了試驗裝置自體耐久性 f曲試驗裝置。例如在專利文獻丨中，藉由在可動艘（可 動板）上下各自安裝彈簧並使之與振動器結合，而成為可 放大振動器的振幅並以高速進行弩曲試驗。 [0004] 又，例如在專利文獻2中，係建構成於框架上之事先 200819724 取有間隔的二個部位上將振動體（可動板）各自以減振器 (Damper)支承於同一振動體的軸線方向上，伴隨著電流 在磁場中的線圈流動，因應於該電流強度的機械力係作用 於線圈而引發運動。依此，振動體係振動軸線的擺動受到 抑制並以高速振動，振動體的固定部所連接之試驗片（撓 性印刷電路板）也被以同速度彎曲或振動者。 【專利文獻1】日本國專利實開昭57 — 205049號公報 【專利文獻2】日本國專利特公平6 —63955號公報 【發明内容】 【發明欲解決之課題】 【0005】 專利文獻1所記載的發明，因為是利用上下的彈簧來 挾持並固定可動體，所以支撐力弱，而具有可動體在振動 方向以外有大幅擺動之虞。又，專利文獻2所記載的發明 因為是以線圈的電磁力來支撐振動體，所以具有振動體在 振動方向以外有大幅擺動之虞。 【0006】 特別是，專利文獻2中因為有必要將振動體輕量化， 所以不得不將振動體及固定部予以薄化，而若未在固定部 的兩1則設以完全相同的試驗片的話，則會造成固定部翹 曲。若會振動的固定部翹曲lmm以上的話則對試驗結果也 會有报大影響。再者，若縮小f曲半徑，則固定部的擺動 會依試驗片的f曲應力而變得更大，要進行超過21_的 订程之振動變得有限制。特別是，要在所謂的3_cpm 200819724 之尚速域中進行長行程振動是有困難的。 【0007】 又，在習知的彎曲試驗裝置中，是有為了滑動支撐可 ，板的軸而使用鉬等之耐磨耗材或機械式軸承的方法。但 疋’在1¾速振動時會因摩擦而產生磨耗，而且，因摩擦熱 的，膨脹而使磨耗變大，所以成為未達到108次以上 曲次數、或是有必要交換軸支撐部，使得在維護上花 間，運轉成本亦上昇。 【0008】 於是，本發明之目的為提供一種高速f曲試驗裝置， ，係I減低在所需的行程作高速振動之可動板的滑動阻 7並消除擺動，且使試驗裝置自體的耐久性提升，同時可 ===調整屬試驗片的撓性印刷電路板之安裝姿 【解決課題之手段】 【0009】 1項戶===上述目的而提案者，申請專利範圍第 載的發明係提供—種高料曲試驗裝置，係 性ί==電路板之一端部固定於固定板，且將前述撓 作部固/在是對該固定板以既定間隔 地高速振動對前述111定板平行 部支以H 絲料妨動板之一端 振動么:=，可動板的他端部安裝保持具並與 體連接I利用流體轴承將該保持具支 。 200819724 【0010】 依據此構成，可動板的一端部係被流體軸承所支樓， 而可動板的他端部也是隔著保持具而被流體軸承所支撑 著，所以可動板在高速振動時的滑動阻力極少，也座低因 滑動所引起的發熱現象。又，可動板在振動方向也變得幾 乎沒有擺動。 【0011】 申請專利範圍第2項所記載的發明係提供如申請專 利範圍第1項所記載的高速彆曲試驗裝置，其中，上述固 定板係設置成可藉差動螺旋機構調整對上述可動板之間 隔。 a 【0012】 依據此構成，差動螺旋機構係被設置在分厘卡上而相 對於陽螺紋之旋轉角之軸向變位微小，所以固定板係藉差 動螺旋機構而以微小的尺寸單位對可動板進行移動。因 此，可極正確地調整固定板與可動板之間隔。 【0013】 申請專利範ϋ第3項所記載的發明係提供如 利範圍第1項或第2項所記狀錢了高料曲試驗敦^ 的尚速f曲試驗方法，其中，將複數片撓性印刷電路板平 行地裝設於安裝治具’且在該安裝治具上將前』 電路板朝前述©歧以既定的安裝姿勢作 雷射變位制定前賴定板與可動板之間隔， 螺旋機構調整固定板的位置。 【0014】 200819724 依據此構成’因為是利用安裝治具將屬試驗片的撓性 印刷電路板朝固定板固定，所以撓性印刷電路板被以正確 的安裝姿勢固定。又，利用差動螺旋機構而能以微小的尺 寸單位來調整固定板與可動板之間隔，再以雷射變位計作 測定，而可容易且高精度地調整彎曲試驗半徑。 【發明效果】 【0015】 本發明乃如同上述，係以流體軸承將高速振動的可動 板支撐成可滑動，所以滑動阻力極少，可動板在振動方向 幾乎沒有擺動。因此，就算是高速振動也可不受行程的限 制下持續地振動，而成為在108次以上的彆曲次數以前不 需要父換零件之耐久性咼的試驗裝置。而且，因為壓低因 滑動所引起的發熱，所以可成為試驗室的恆溫環境。 【0016】 又，屬試驗片的撓性印刷電路板，係透過安裝治具而 正確且容易地固定於可動板的振動方向，同時藉由差動螺 旋機構可正確地調整固定板與可動板之間隔且容易調整 彎曲試驗半徑等而可圖謀提升f曲試驗的精度及試驗之 容易性。 【實施方式】 【發明最佳實施形態】 【0017】 以下，茲舉出適當的實施例，針對本發明所涉及的高 200819724 速振動的可I板π減低在所需的行程進行高 _敎性，同時;==動= :::路本板發之明安_與安_二== 成可滑動，^ f藉由將可動板的―端部以流體轴承支揮 同時將該保持具以流趙軸承支擇成可滑動的方式 【實施例1】 【0018】 成：二=置7二二驗=;： ==板11之—端部;可動板丨3,係在:右: 以固定 圖中的下端部）13b;空氣軸承16，將該 1 (二 成可滑動，·振動體17,連接於保持具15。、、支樓 【0019】 ' ，前述固定板】2與可動板13之間料 印刷電路板1!係被收納於值溫槽18之中，在= 的上部固定有空氣抽承14用以將前述可動板13的二端部 200819724 13a支律成可滑動。χ，值溫槽18被固定於 之上’而下部框㈣的内部安裝有前述振_ 17。而架且 19 下部框架19係隔著防振橡膠2G而被固定於 =體上丨:被建構在受電動馬達(未圖示)驅動的曲Ξ 【0020】 示曲柄機構22的要部，該曲柄機構以係由 朝Ιί 的曲柄滑輪22a，以及從曲柄滑輪咖 杆22b所構成，杆22b的兩端部係各 =金連屬接轴著承24以銷結合的方式與曲柄滑輪心 【0021】 板的圖二：4:、顯Γ可動板13之支揮部分，前述可動 :====嫩讓藉由空 【0022】 :。該保持以 而如同前述般，透過金m的下卿找有銷25， 拖接。 1_承24而與曲柄機構的杆22b 【0023】 接著’利用被安裝於前述p 轴承16,前述保持具15的圓筒部二1=;:; 200819724 方向滑動σ 【0024】 圖5係顯示固定板12與可動板13之間隔調整機構， 茲一邊參照圖1的全體構成圖一邊作說明。恆溫槽18的 内部包含：固定在下部枢架Η)的支禕部26 ;可透過差動 螺旋機構27朝水平方向移動地設置於該支撐部26上的滑 動部28 ;安裝在此滑動部28上的固定板12。 【0025】 前述差動螺旋機構27係被設置在分厘卡上而相對於 陽螺紋之旋轉肖之軸向變位微小，所以當旋轉差動螺旋機 構27時，則固定板丨2係極少地一點一點移動。因此，能 以微小的尺寸單位來調整固定板12與可動板13之間隔， 成為可對橈性印刷電路板11之f曲試驗半徑進行微調 整。 【0026】 又，在前述固定板12的側方（與可動板13疏離的方 向），設置有與固定板丨2 —胱的托架29，在欲調整固定 板12與可動板13的間隔之際，在此托架29裴設雷射變 位計30。該雷射變位計30係被正確地裝設於距離固定板 12表面之既定的尺寸位置上。 【0027】 雷射變位計30係籍雷射光31之照射而測定裁至可動 板13為止的距離者，且當前述固定板12移動時，裝設在 托架29上的雷射變位計30也與固定板12 —體移動。因 此，若利用由該雷射變位計30所照射的雷射光31來測定 12 200819724 截至可動板13為止的距雜夕纖儿士 【0028】 仅固疋板12與可動板13之間隔。 如此一來’藉由利用前述差動 的尺寸單位之㈣，及_#^螺=構27進订微小 U疋，可極正確地調整固定板12與可動板13 可容易且正確地調整彎曲試驗半徑。 【0029】 射變料30的Λ 在托架29之上部位1安裝有雷 射：= 及在托架29的下部位置安裝有雷 況之雙方的狀態。又，符號32係檢查用 + 6 =子*裝部’在本實闕巾，並設有魏個接點端 【if 32而得以同時檢查複數片挽性印刷電路板U。 =6制以將撓性印刷電路板丨丨朝固定板丨2裝設的 二J = t 35。在本實施例中係以可同時檢查複數個試驗 x使3片的撓性印刷電路板11並列於既定位置， 個端部（關中的上端部）以雙面膠帶朝試驗片定 ，屬件36暫時固定。其次，於未圖示之灸頭保持器， 距離3片撓性印刷電路板η之試驗片定位金屬件36 3的蠕部所任意決定的尺寸之場所上將夾頭37定位，再 $雙面膠帶將該夾頭37貼附於撓性印刷電路板η。然 ^ ’移動失頭保持器，從安裝治具35卸下被貼附在夾頭 11 、4驗片定位金屬件36上之3片的撓性印刷電路板 13 【003】】 【003】】200819724 向固圖5所示，係將撓性印刷電路板11朝 成妨礙的方’此際係以接點端子安裝部32不會造 自可動成為朝向托架29側回倒的狀態。首先， 翻反側插人試驗片導引金屬件38的銷並使 入％二導^1突/ ’對前述試驗^位金屬件36的孔插 導引金屬件38的銷並正確地定位，並將撓性印 附於可動板(試驗R位金屬件36側的端部）貼 1Q /動板】3°而在將撓性印刷電路板11貼附於可動板 後，卸下試驗片導引金屬件38。 【0032】 其次，將夾頭37裝設於固定板丨2側，並以夾頭固定 螺絲39 。而在將夾頭37固定於固定板12之後，卸 下試驗片定位金屬彳36。接著，使前述接點端子安裝部 32立起並以调整螺絲即作固定。如此，複數片撓性印刷 電路板11的一端部被正確地固定於固定板12,同時撓性 印刷電路板π的他端部被正確地固定於可動板13，可容 易且正確地調整試驗片的固定方向並提升檢查的精度。 【0033】 其次，依據圖1〜圖6，針對使用本發明所涉及的高 速驚曲試驗裝置1〇的高速彎曲試驗方法作說明。 【0034】 首先’將複數片撓性印刷電路板11平行地裝設於安 裝治具35，並將試驗片定位金屬件36與夾頭37貼附於 撓性印刷電路板11的既定位置。接著，從安裝治具35 200819724 貼附在試驗片定位金属件36和爽頭37上的挽性印 山路板11，並以前述的次序，將撓性印刷電路板11的 W連同失頭37 -起固^在固定板12。又，將挽性印 刷電路板11的他端部@定在可動板13。 [0035] 接著，一邊以雷射變位計30正確地測定固定板12 與可動板13之間隔，一邊使差動螺旋機搆27的旋鈕旋轉 並移動固定板12，將固定板丨2與可動板13之問隔調整 成預先設定的尺寸並將固定板丨2固定。在此狀態下，屬 試驗片的複數片撓性印刷電路板11係以被設定之既定安 裝姿勢朝向試驗装置10正確地設置。 【0036】 在朝向試驗裝置10設定撓性印刷電路板U之後，旋 轉電動馬達以驅動曲柄機構22而開始振動體17的運轉。 當振動雜17被運轉時’則被安裝於保持具15的可動板 13係朝上下方向高速振動。 【0037】 如前述般，可動板13的一端部（上端部）被空氣軸 承14所支撐，可動板13之他端部（下端部）係隔著保持 具15而被空氣軸承16所支撐，所以可動板13在高速振 動時的滑動阻力極少，依滑動所引起的發熱也受到抑制而 變低，同時可動板13在振動方向也幾乎沒有搋動。又， 因為振動體Π是由曲柄機搆22所構成，所以能使之以大 的行程進行高速振動。 15 【0038】 【0038】 200819724 的高速振動，且 種： 【圖式簡單說明] 【0040】 【圖1】係本發明所涉及的高速料試驗裝置之全趙構成 圖。 【圖2】係圖1所示之曲柄裝置的要部說明圖。 【圖3】係圖1所示之可動板與保持具之支撐部分的說明 圖。 【圖4】（a)係圖3的A~A線箭頭方向視圖。（b)係圖4 (a)的B—B線箭頭方向視圖。 【圖5】係圊1所示之固定板11與可動板13之間隔調整 機構的說明圖。 【圖6】係顯示撓性印刷電路板之安裝治具的說明圖。 200819724 【主要元件符號說明】 【0041】 10 高速f曲試驗裝置 11 撓性印刷電路板 12 固定板 13 可動板 13a， 13b 可動板13的一 -端部 14 空氣軸承 15 保持具 15a 裂縫 15b 板 16 空氣軸承 17 振動體 18 恆溫槽 19 下部框架 20 防振橡膠 21 台座 22 曲柄機構 22a 曲柄滑輪 22b 杆 23 驅動軸 24 金屬軸承 25 銷 26 支撐部 27 差動螺旋機構 28 滑動部 29 托架 30 雷射變位計 31 雷射光 32 安裝部 33 調整螺絲 35 安裝治具 36 定位金屬件 37 夾頭 38 導引金屬件 39 螺絲 17200819724 IX. Description of the Invention: [Technical Field] [0001] The present invention relates to a high-speed bending test apparatus for performing a PC bending test of a flexible printed circuit board. [Prior Art] [0002] In the bending test of the pull-off tp brush circuit board, it is known that there is an IPCf curve test performed while moving the curved portion. In a flexible printed circuit board used for an optical pickup head or the like, it is necessary to perform a test of the number of times of the f-curve of 1 to 8 or more times in a certain stroke. However, it takes a long time, and there is a problem that the life of the operating unit of the test device itself is worn, and the number of times of the change is increased, that is, the contact with the high speed is inversely proportional and the life is shortened. [0003] Therefore, since There are a number of proposals that require high-speed operation at the required stroke ((4))' and also consider the self-durability test of the test device. For example, in the patent document, by mounting a spring on the upper and lower sides of the movable boat (movable plate) and coupling it to the vibrator, the amplitude of the vibrator can be amplified and the bending test can be performed at a high speed. Further, for example, in Patent Document 2, the vibrating body (movable plate) is supported by the damper (Damper) on the same vibrating body at two locations which are formed in the frame in advance in 200819724. In the axial direction, the coil current flows in the magnetic field, and the mechanical force corresponding to the current intensity acts on the coil to cause motion. According to this, the oscillation of the vibration axis of the vibration system is suppressed and vibrated at a high speed, and the test piece (flexible printed circuit board) to which the fixed portion of the vibrating body is connected is also bent or vibrated at the same speed. [Patent Document 1] Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. Hei. No. Hei. In the invention, since the movable body is held and fixed by the upper and lower springs, the supporting force is weak, and the movable body has a large swing outside the vibration direction. Further, in the invention described in Patent Document 2, since the vibrating body is supported by the electromagnetic force of the coil, the vibrating body has a large swing in the vibration direction. In particular, in Patent Document 2, since it is necessary to reduce the weight of the vibrating body, it is necessary to thin the vibrating body and the fixing portion, and if the two test pieces are not provided in the fixed portion, the same test piece is provided. Will cause the fixed part to warp. If the vibration of the fixed part is warped by more than lmm, the test result will also be greatly affected. Further, when the radius of the f-curve is reduced, the swing of the fixed portion becomes larger depending on the f-bend stress of the test piece, and the vibration for the course of exceeding 21_ is limited. In particular, it is difficult to perform long-stroke vibration in the so-called 3_cpm 200819724 speed domain. Further, in the conventional bending test apparatus, there is a method of using a wear-resistant consumable such as molybdenum or a mechanical bearing for slidingly supporting the shaft of the plate. However, when the vibration is at 13⁄4 speed, it will be worn by friction, and the friction will increase due to the frictional heat. Therefore, it is not necessary to reach the number of times of 108 or more times, or it is necessary to exchange the shaft support portion. Maintenance costs are also increased when the upper flower room is maintained. Accordingly, it is an object of the present invention to provide a high-speed f-curve test apparatus which is capable of reducing the sliding resistance 7 of a movable plate which is subjected to high-speed vibration at a desired stroke and eliminating the wobble, and the durability of the test device itself. At the same time, it is possible to adjust the mounting posture of the flexible printed circuit board that belongs to the test piece [means for solving the problem] [0009] 1 household === the above proposal, the invention of the patent application section provides - High-stitch test device, the ί== one end of the circuit board is fixed to the fixed plate, and the above-mentioned flexing portion is fixed/high-speed vibration at the predetermined interval of the fixed plate to the aforementioned 111 fixed plate parallel portion Is the H-wire damper plate vibrating at one end: =, the other end of the movable plate is mounted with a holder and connected to the body I to support the holder with a fluid bearing. 200819724 [0010] According to this configuration, one end portion of the movable plate is supported by the fluid bearing, and the other end portion of the movable plate is supported by the fluid bearing via the holder, so that the movable plate slides at high speed vibration. The resistance is extremely low, and the seat is also low due to the heat caused by sliding. Further, the movable plate also becomes almost non-swing in the vibration direction. [0011] The invention according to claim 2, wherein the fixed plate is provided to be adjustable by the differential screw mechanism to the movable plate. The interval. According to this configuration, the differential screw mechanism is disposed on the centimeter card and the axial displacement relative to the rotation angle of the male screw is minute, so that the fixed plate is in a minute size unit by the differential screw mechanism. Move the movable plate. Therefore, the distance between the fixed plate and the movable plate can be adjusted extremely accurately. [0013] The invention described in claim 3 of the patent application provides a method for testing the high-speed test of the high-order test, as described in item 1 or item 2 of the profit range, wherein a plurality of pieces are tested. The flexible printed circuit board is mounted in parallel on the mounting jig 'and the front panel of the mounting jig is laser-displaced in a predetermined mounting posture on the mounting jig. The screw mechanism adjusts the position of the fixing plate. [0014] According to the configuration of 200819724, since the flexible printed circuit board of the test piece is fixed to the fixing plate by the mounting jig, the flexible printed circuit board is fixed in the correct mounting posture. Further, by using the differential screw mechanism, the distance between the fixed plate and the movable plate can be adjusted in a small size unit, and the measurement can be performed by a laser displacement meter, and the bending test radius can be easily and accurately adjusted. [Effect of the Invention] As described above, the present invention supports a movable plate that is vibrated at a high speed by a fluid bearing so as to be slidable, so that the sliding resistance is extremely small, and the movable plate hardly oscillates in the vibration direction. Therefore, even in the case of high-speed vibration, it is possible to continuously vibrate without being restricted by the stroke, and it is a test device that does not require the durability of the replacement parts of the workpiece before the number of times of the warping of 108 times or more. Moreover, since the depression is caused by the heat generated by the sliding, it can be a constant temperature environment of the test chamber. [0016] Further, the flexible printed circuit board belonging to the test piece is correctly and easily fixed to the vibration direction of the movable plate by the mounting jig, and the fixed plate and the movable plate can be correctly adjusted by the differential screw mechanism. The accuracy of the test and the ease of the test can be improved by adjusting the bending test radius and the like at intervals. [Embodiment] BEST MODE FOR CARRYING OUT THE INVENTION [0017] Hereinafter, a suitable embodiment will be described, and the high-initial π reduction of the high-speed 200819724 speed vibration according to the present invention is high in the required stroke. , at the same time; == move = ::: The road plate sends the Ming _ _ and _ _ = = = into a slidable, ^ f by holding the "end" of the movable plate as a fluid bearing while holding the holder The flow bearing is selected to be slidable [Embodiment 1] [0018] into: two = set 7 two two test =;: = = plate 11 - end; movable plate 丨 3, tied in: right: The lower end portion 13b of the fixed figure; the air bearing 16, the 1 (two slidable, vibrating body 17, connected to the holder 15, , the branch [0019] ', the fixed plate 2 and the movable plate The 13 printed circuit board 1 is housed in the value temperature bath 18, and an air suction 14 is fixed to the upper portion of the = to slid the two end portions 200819724 13a of the movable plate 13. The value temperature groove 18 is fixed to the upper portion, and the vibration plate 17 is attached to the inside of the lower frame (four). The frame 19 and the lower frame 19 are fixed to each other via the vibration-proof rubber 2G. = Body 丨: Constructed in a crank that is driven by an electric motor (not shown) [0020] The main part of the crank mechanism 22 is shown, which is a crank pulley 22a that is attached to the Ιί, and a crank pulley 22b, the two ends of the rod 22b are each = the gold joint shaft bearing 24 is pin-bonded and the crank pulley core [0021] panel Figure 2: 4: the branch portion of the movable plate 13 The above movable: ==== tender to let by [0022]: The hold is as above, through the gold m's lower Qing looking for a pin 25, dragging. 1_ bearing 24 and the crank mechanism rod 22b [0023] Next, the cylindrical portion of the holder 15 is attached to the p-bearing 16, and the sliding portion of the holder 15 is rotated. [0024] FIG. 5 shows the interval adjustment between the fixed plate 12 and the movable plate 13. The mechanism will be described with reference to the overall configuration of Fig. 1. The inside of the thermostatic chamber 18 includes a support portion 26 fixed to the lower pivot frame, and is movably provided in the horizontal direction by the differential screw mechanism 27. A sliding portion 28 on the support portion 26; a fixing plate 12 mounted on the sliding portion 28. [0025] The differential screw mechanism 27 is disposed on the centimeter card and has a slight axial displacement relative to the rotation axis of the male screw. Therefore, when the differential screw mechanism 27 is rotated, the fixed plate 2 is rarely Move a little bit. Therefore, the distance between the fixed plate 12 and the movable plate 13 can be adjusted in a small size unit, and the radius of the test curve of the flexible printed circuit board 11 can be finely adjusted. Further, on the side of the fixing plate 12 (the direction away from the movable plate 13), a bracket 29 that is fixed to the fixing plate 2 is provided, and the space between the fixing plate 12 and the movable plate 13 is to be adjusted. At this bracket 29, a laser displacement gauge 30 is provided. The laser displacement gauge 30 is correctly mounted at a predetermined size position from the surface of the fixed plate 12. [0027] The laser displacement gauge 30 measures the distance to the movable plate 13 by the irradiation of the laser beam 31, and the laser displacement gauge mounted on the bracket 29 when the fixed plate 12 moves. 30 also moves integrally with the fixed plate 12. Therefore, the laser light 31 irradiated by the laser displacement meter 30 is used to measure the distance from the movable plate 13 to the end of the movable plate 13. [0028] Only the distance between the solid plate 12 and the movable plate 13 is determined. In this way, by using the above-mentioned differential size unit (4), and _#^ screw=configuration 27 to order the micro U疋, the fixing plate 12 and the movable plate 13 can be adjusted extremely accurately, and the bending test can be easily and correctly adjusted. radius. The Λ of the morph 30 is attached to the upper portion 1 of the bracket 29 with a laser: = and a state in which both of the lightning conditions are attached to the lower portion of the bracket 29. Further, the symbol 32 is checked by the + 6 = sub-package portion 'in the actual wipe, and the Wei-shaped contact end is provided. [if 32, it is possible to simultaneously check the plurality of sheets of the printed circuit board U. The =6 system is used to mount the flexible printed circuit board 固定 toward the fixed plate 丨2 by two J = t 35. In the present embodiment, the plurality of test pieces x can be simultaneously inspected so that the three flexible printed circuit boards 11 are juxtaposed at a predetermined position, and the ends (the upper end portions of the closed portions) are set to the test piece by double-sided tape, and the member 36 is attached. Temporarily fixed. Next, in the moxibustion head holder (not shown), the chuck 37 is positioned at a position arbitrarily determined by the creeping portion of the test piece positioning metal member 36 3 of the three flexible printed circuit boards η, and then the double-sided The tape attaches the chuck 37 to the flexible printed circuit board η. Then, 'moving the head holder, the three pieces of the flexible printed circuit board 13 attached to the chuck 11 and the 4 piece positioning metal member 36 are detached from the mounting jig 35. [003] [003] 200819724 As shown in FIG. 5, the flexible printed circuit board 11 is in a state of being obstructed. In this case, the contact terminal mounting portion 32 is not movable and is tilted toward the bracket 29 side. First, the pin of the test piece guiding metal piece 38 is inserted into the reverse side, and the pin of the test piece metal piece 36 is inserted into the pin of the metal piece 38 of the test piece and correctly positioned. The flexible printed circuit is attached to the movable plate (the end on the side of the test R-position metal member 36), and the 1Q/moving plate is attached to the movable plate. After the flexible printed circuit board 11 is attached to the movable plate, the test piece guide is removed. Lead metal member 38. Next, the chuck 37 is attached to the side of the fixed plate 丨 2, and the screw 39 is fixed by a chuck. After the chuck 37 is fixed to the fixing plate 12, the test piece positioning metal cymbal 36 is removed. Next, the contact terminal mounting portion 32 is raised and fixed by the adjusting screw. Thus, one end portion of the plurality of flexible printed circuit boards 11 is correctly fixed to the fixed plate 12, and the other end portion of the flexible printed circuit board π is correctly fixed to the movable plate 13, and the test piece can be easily and correctly adjusted. The fixed direction and the accuracy of the inspection. Next, a high-speed bending test method using the high-speed shock test apparatus 1 according to the present invention will be described with reference to Figs. 1 to 6 . First, a plurality of flexible printed circuit boards 11 are mounted in parallel to the mounting jig 35, and the test piece positioning metal member 36 and the chuck 37 are attached to a predetermined position of the flexible printed circuit board 11. Next, from the mounting jig 35 200819724 attached to the test piece positioning metal member 36 and the smoothing head 37 on the slider board 11, and in the foregoing order, the flexible printed circuit board 11 together with the missing head 37 - Lifting on the fixing plate 12. Further, the other end portion of the printed circuit board 11 is set to the movable plate 13. [0035] Next, while accurately measuring the distance between the fixed plate 12 and the movable plate 13 by the laser displacement gauge 30, the knob of the differential screw mechanism 27 is rotated and the fixed plate 12 is moved, and the fixed plate 2 and the movable plate are fixed. The spacing of 13 is adjusted to a predetermined size and the fixing plate 丨 2 is fixed. In this state, the plurality of flexible printed circuit boards 11 belonging to the test piece are correctly disposed toward the test apparatus 10 in the predetermined mounting posture set. After the flexible printed circuit board U is set toward the testing device 10, the electric motor is rotated to drive the crank mechanism 22 to start the operation of the vibrating body 17. When the vibration noise 17 is operated, the movable plate 13 attached to the holder 15 vibrates at a high speed in the vertical direction. As described above, one end portion (upper end portion) of the movable plate 13 is supported by the air bearing 14, and the other end portion (lower end portion) of the movable plate 13 is supported by the air bearing 16 via the holder 15 so that The sliding resistance of the movable plate 13 at the time of high-speed vibration is extremely small, the heat generation by the sliding is also suppressed, and the movable plate 13 is hardly shaken in the vibration direction. Further, since the vibrating body is constituted by the crank mechanism 22, it is possible to perform high-speed vibration with a large stroke. [0038] [0038] High-speed vibration of 200819724, and: [Simplified description of the drawings] [0040] Fig. 1 is a diagram showing the entire structure of the high-speed material testing device according to the present invention. Fig. 2 is an explanatory view of a main part of the crank device shown in Fig. 1. Fig. 3 is an explanatory view showing a supporting portion of the movable plate and the holder shown in Fig. 1. Fig. 4 (a) is a view taken along the line A to A of Fig. 3 in the direction of the arrow. (b) A view of the direction of the arrow B-B of Fig. 4 (a). Fig. 5 is an explanatory view showing a mechanism for adjusting the interval between the fixed plate 11 and the movable plate 13 shown in Fig. 1. Fig. 6 is an explanatory view showing a mounting jig of a flexible printed circuit board. 200819724 [Description of main component symbols] [0041] 10 High-speed f-curve test device 11 Flexible printed circuit board 12 Fixed plate 13 Removable plate 13a, 13b One-end portion 14 of movable plate 13 Air bearing 15 Holder 15a Crack 15b Plate 16 Air bearing 17 Vibrating body 18 Thermostatic bath 19 Lower frame 20 Anti-vibration rubber 21 Pedestal 22 Crank mechanism 22a Crank pulley 22b Rod 23 Drive shaft 24 Metal bearing 25 Pin 26 Support 27 Differential screw mechanism 28 Slide 29 Bracket 30 Laser Displacement gauge 31 Laser light 32 Mounting section 33 Adjusting screw 35 Mounting fixture 36 Positioning metal part 37 Chuck 38 Guide metal part 39 Screw 17