CN110595913A - Device and method for measuring bending vibration stress of circuit board welding spot - Google Patents
Device and method for measuring bending vibration stress of circuit board welding spot Download PDFInfo
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- CN110595913A CN110595913A CN201910972103.7A CN201910972103A CN110595913A CN 110595913 A CN110595913 A CN 110595913A CN 201910972103 A CN201910972103 A CN 201910972103A CN 110595913 A CN110595913 A CN 110595913A
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- 238000005452 bending Methods 0.000 title claims abstract description 71
- 238000003466 welding Methods 0.000 title claims abstract description 22
- 238000000034 method Methods 0.000 title claims abstract description 9
- 230000007246 mechanism Effects 0.000 claims abstract description 177
- 238000006073 displacement reaction Methods 0.000 claims abstract description 37
- 238000001125 extrusion Methods 0.000 claims abstract description 17
- 230000005540 biological transmission Effects 0.000 claims abstract description 16
- 238000004458 analytical method Methods 0.000 claims description 4
- 238000004364 calculation method Methods 0.000 claims description 4
- 238000011056 performance test Methods 0.000 claims description 3
- 238000011160 research Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/04—Analysing solids
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/02—Details
- G01N3/04—Chucks
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/20—Investigating strength properties of solid materials by application of mechanical stress by applying steady bending forces
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/0014—Type of force applied
- G01N2203/0023—Bending
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/003—Generation of the force
- G01N2203/0032—Generation of the force using mechanical means
- G01N2203/0037—Generation of the force using mechanical means involving a rotating movement, e.g. gearing, cam, eccentric, or centrifuge effects
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/02—Details not specific for a particular testing method
- G01N2203/026—Specifications of the specimen
- G01N2203/0296—Welds
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/02—Details not specific for a particular testing method
- G01N2203/04—Chucks, fixtures, jaws, holders or anvils
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/02—Details not specific for a particular testing method
- G01N2203/06—Indicating or recording means; Sensing means
- G01N2203/067—Parameter measured for estimating the property
- G01N2203/0676—Force, weight, load, energy, speed or acceleration
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/02—Details not specific for a particular testing method
- G01N2203/06—Indicating or recording means; Sensing means
- G01N2203/067—Parameter measured for estimating the property
- G01N2203/0682—Spatial dimension, e.g. length, area, angle
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/028—Material parameters
- G01N2291/02827—Elastic parameters, strength or force
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/26—Scanned objects
- G01N2291/267—Welds
- G01N2291/2672—Spot welding
Abstract
The invention discloses a device and a method for measuring bending vibration stress of a welding spot of a circuit board, wherein the device comprises the circuit board, a base, a graduated scale, a battery module, an extrusion mechanism, a first clamping mechanism, a second clamping mechanism, a vibration mechanism and a bending displacement measuring mechanism; the first clamping mechanism and the second clamping mechanism are symmetrically arranged on the base; the extrusion mechanism is fixed at one end of the base and is in transmission connection with the second clamping mechanism; a vibration mechanism, a circuit board and a bending displacement measuring mechanism are sequentially arranged between the first clamping mechanism and the second clamping mechanism from bottom to top, two ends of the vibration mechanism are respectively connected with the first clamping mechanism and the second clamping mechanism, the circuit board is fixed between the two clamping mechanisms, and the bending displacement measuring mechanism is connected with the two clamping mechanisms through a screw rod; the graduated scale is arranged on the upper surface of the base and used for measuring the distance between the two clamping mechanisms; the battery module is fixed on the base and is connected with the vibration mechanism through a lead. The device can be accurate the tight product of being surveyed of clamp, measures more accurately.
Description
Technical Field
The invention relates to the technical field of laboratory instruments and equipment, in particular to a device and a method for measuring bending vibration stress of a circuit board welding spot.
Background
With the continuous development of scientific technology, electronic products have been developed towards miniaturization, low power consumption and high integration density, the demand for electronic products is also increasing, and the reliability of electronic products has been concerned all the time. In the packaging process of electronic products, a large part of factors influencing the reliability are influenced by mechanical loads, such as a series of factors of bending deformation, torsional deformation, random vibration and the like, so that the welding spot is subjected to failure deformation, and further the whole component is subjected to failure, and therefore, the reliability research on the random vibration of the BGA welding spot on the basis of the bending deformation is necessary. In the engineering field, no matter the national 863 plan or the national natural foundation project or the military project, the subject research related to the bending vibration stress of the welding spot exists, but in the related research, how to accurately clamp the tested product to vibrate on the basis of the bending deformation is not seen, and the auxiliary device required in the experimental operation is not seen at present.
Disclosure of Invention
The invention aims to overcome the problems in the background art and provide a device and a method for measuring bending vibration stress of a welding spot of a circuit board.
The technical scheme for realizing the purpose of the invention is as follows:
a device for measuring bending vibration stress of a welding spot of a circuit board comprises the circuit board, a base, a graduated scale, a battery module, an extrusion mechanism, a first clamping mechanism, a second clamping mechanism, a vibration mechanism and a bending displacement measuring mechanism; the base is horizontally arranged; the first clamping mechanism and the second clamping mechanism are symmetrically arranged on the base; the extrusion mechanism is fixed at one end of the base and is in transmission connection with the second clamping mechanism; a vibration mechanism, a circuit board and a bending displacement measuring mechanism are sequentially arranged between the first clamping mechanism and the second clamping mechanism from bottom to top, two ends of the vibration mechanism are respectively connected with the first clamping mechanism and the second clamping mechanism, the circuit board is fixed between the two clamping mechanisms, and the bending displacement measuring mechanism is connected with the two clamping mechanisms through a screw rod; the graduated scale is arranged on the upper surface of the base and used for measuring the distance between the two clamping mechanisms; the battery module is fixed on the base and connected with the vibration mechanism through a lead to supply power for the vibration mechanism.
The base, be equipped with rectangular channel, the slide rail and a plurality of screw hole of two symmetries on the base, the scale is established in the rectangular channel, first clamping mechanism passes through screw hole and base fixed connection, second clamping mechanism and slide rail sliding connection.
First clamping mechanism, second clamping mechanism, including the backup pad, first clamping mechanism's backup pad bottom is fixed on the base, second clamping mechanism's backup pad bottom is equipped with the spout, through spout and base go up slide rail sliding connection, the backup pad lower part is equipped with the screw hole, well upper portion is equipped with anchor clamps, is equipped with rotatory screw rod in the backup pad of anchor clamps top, still is equipped with the screw rod hole in the backup pad, still is equipped with the rectangle mouth in first clamping mechanism's the backup pad.
The extrusion mechanism comprises a connecting frame, a worm gear, a first rocker, a transmission shaft and a rack, wherein the bottom of the connecting frame is fixed on a threaded hole of the base; the first rocker is rotated to drive the worm gear to rotate, the worm gear drives the gear to rotate through the transmission shaft, the rack drives the first clamping mechanism to move, and then force for enabling the circuit board to bend and deform is generated.
The vibration mechanism comprises two supports, the two supports are provided with oval sliding grooves, screws penetrate through the oval sliding grooves and are connected with threaded holes in a supporting plate of the clamping mechanism, the two supports are connected through two lower-layer screw rods, a second rocker is further arranged between the two lower-layer screw rods, a lower-layer supporting seat is arranged on the lower-layer screw rods and the second rocker, two upper-layer screw rods are arranged on the lower-layer supporting seat, a third rocker is arranged between the two upper-layer screw rods, upper-layer supporting seats are arranged on the upper-layer screw rods and the third rocker, a vibrator is arranged on the upper-layer supporting seat, a rotating handle for clamping the vibrator is arranged on the vibrator; the vibrator can move back and forth, left and right by rotating the second rocker and the third rocker.
The bending displacement measuring mechanism comprises a supporting screw rod and a supporting frame, wherein the supporting frame is arranged on the supporting screw rod, two ends of the supporting screw rod are respectively arranged on screw rod holes of a supporting plate of the clamping mechanism, a worm gear is arranged on the supporting frame, one end of the worm gear is in transmission connection with a fourth rocker, the other end of the worm gear is connected with an ejector pin through a gear, a rotatable graduated scale used for measuring upward or downward movement displacement of the ejector pin is further arranged on the supporting frame, and then the bending displacement of the circuit board is obtained.
A measuring method of a circuit board welding spot bending vibration stress measuring device comprises the following steps:
1) firstly, placing a circuit board welding spot bending vibration stress measuring device on a horizontal desktop;
2) adjusting the positions of the two clamping mechanisms according to the size of the circuit board to be measured, and reading the distance between the two clamping mechanisms through a graduated scale;
3) the circuit board to be tested is fixed through the two clamping mechanisms, so that the circuit board to be tested does not creep, and the first clamping mechanism is driven to move by adjusting the extrusion mechanism, so that the circuit board is bent and deformed to generate a certain bending displacement;
4) the position of the bending displacement measuring mechanism is adjusted to enable the thimble to be located at the middle position of the circuit board to be measured, and the bending displacement of the circuit board can be read out through a graduated scale on the bending displacement measuring mechanism;
5) the battery module is positioned on the base, is connected with the vibration mechanism through a lead, and enables the vibration source to be tightly attached to the tested circuit board by adjusting the position of a vibrator in the vibration mechanism;
6) the circuit board can vibrate under the bending loading condition by opening a switch on the battery module;
7) the tested circuit board is adhered with a three-phase strain gauge and connected with a dynamic strain gauge through a wire, and the change data of the bending vibration stress is input into a computer for calculation and analysis through a circuit and a serial port mode, so that the bending vibration performance test of the circuit board is realized.
Compared with the prior art, the invention has the beneficial effects that:
the tested circuit board is clamped through the clamping mechanism to be kept horizontal and cannot creep, the first clamping mechanism is fixed on the base, the second clamping mechanism is connected with the extrusion mechanism, the worm and gear drives the gear to rotate through rotating the first rocker in the extrusion mechanism, the second clamping mechanism is further driven to move through the rack, so that the circuit board generates different degrees of bending deformation, the bending displacement of the circuit board can be accurately measured through the bending displacement measuring mechanism, the vibrator is enabled to be tightly attached to the circuit board through adjusting the rocker in the vibration mechanism, the circuit board generates random vibration on the basis of the bending deformation, then the bending vibration stress magnitude change data is input into a computer through a circuit and serial port mode, calculation and analysis are started, and experimental research requirements are met. The device is simple and convenient to operate in the using process, the experimental efficiency can be further improved, and more time is saved.
Drawings
FIG. 1 is a schematic structural diagram of a device for measuring bending vibration stress of a solder joint of a circuit board;
FIG. 2 is a schematic structural diagram of a base;
FIG. 3 is a schematic structural view of a first clamping mechanism;
FIG. 4 is a schematic structural view of a second clamping mechanism;
FIG. 5 is a schematic structural view of the pressing mechanism;
FIG. 6 is a schematic structural view of a vibration mechanism;
FIG. 7 is a schematic structural view of a bending displacement measuring mechanism;
in the figure: 1. the device comprises a base 2, a graduated scale 3, a battery module 4, an extrusion mechanism 5, a second clamping mechanism 6, a vibration mechanism 7, a bending displacement measuring mechanism 8, a circuit board 9, a first clamping mechanism 1-1, a rectangular groove 1-2, a threaded hole 1-3, a sliding rail 4-1, a connecting frame, a first rocker 4-3, a rack 4-4, a gear 4-5, a transmission shaft 4-6, a worm gear 5-1, a sliding groove 5-2, a threaded hole 5-3, a first clamping mechanism supporting plate 5-5, a clamp 5-6, a screw rod hole 5-7, a rotating screw rod 6-1, a support 6-2, an oval sliding groove 6-3, an upper screw rod 6-4, a second rocker 6-5, a lower layer supporting seat 6-6, an upper layer screw rod 6 7, a third rocker 6-8, an upper layer supporting seat 6-9, a vibrator 6-10, a rotating handle 7-1, a gear 7-2, a thimble 7-3, a fourth rocker 7-4, a graduated scale 7-5, a worm gear 7-6, a supporting screw 7-7, a long chute 7-8, a supporting frame 9-1, a straight chute opening 9-2, a threaded hole 9-3, a clamp 9-4, a threaded hole 9-5, a rotating screw 9-6, a first clamping mechanism supporting plate 9-7 and a rectangular opening.
Detailed Description
The invention will be further elucidated with reference to the drawings and examples, without however being limited thereto.
Example (b):
as shown in fig. 1, a device for measuring bending vibration stress of a circuit board welding spot comprises a circuit board 8, a base 1, a graduated scale 2, a battery module 3, an extrusion mechanism 4, a first clamping mechanism 9, a second clamping mechanism 5, a vibration mechanism 6 and a bending displacement measuring mechanism 7; the base 1 is horizontally arranged; the first clamping mechanism 9 and the second clamping mechanism 5 are symmetrically arranged on the base 1; the extrusion mechanism 4 is fixed at one end of the base 1 and is in transmission connection with the second clamping mechanism 4; a vibration mechanism 6, a circuit board 8 and a bending displacement measuring mechanism 7 are sequentially arranged between the first clamping mechanism 9 and the second clamping mechanism 4 from bottom to top, two ends of the vibration mechanism 6 are respectively connected with the first clamping mechanism 9 and the second clamping mechanism 5, the circuit board 8 is fixed between the two clamping mechanisms, and the bending displacement measuring mechanism 7 is connected with the two clamping mechanisms through a screw rod; the graduated scale 2 is arranged on the upper surface of the base 1 and is used for measuring the distance between the two clamping mechanisms; the battery module 3 is fixed on the base 1 and connected with the vibration mechanism 6 through a lead to supply power for the vibration mechanism 6.
As shown in figure 2, the base 1 is provided with a rectangular groove 1-1, two symmetrical slide rails 1-3 and a plurality of threaded holes 1-2, the graduated scale 2 is arranged in the rectangular groove 1-1, the first clamping mechanism 9 is fixedly connected with the base 1 through the threaded holes 1-2, and the second clamping mechanism 5 is slidably connected with the slide rails 1-3.
As shown in fig. 3 and 4, the first clamping mechanism 9 and the second clamping mechanism 5 comprise supporting plates 5-3/9-6, the supporting plate 9-6 of the first clamping mechanism 9 slides to a proper position through a bottom straight notch 9-1 and then is fixed on the base 1 through a bolt, the bottom of the supporting plate 5-3 of the second clamping mechanism 5 is provided with a sliding chute 5-1 which is connected with a sliding rail 1-3 on the base 1 through the sliding chute 5-1 in a sliding manner, the lower part of the supporting plate 5-3/9-6 is provided with a threaded hole 5-2/9-2, the middle upper part is provided with a clamp 5-5/9-3, the supporting plate 5-3/9-6 above the clamp 5-5/9-3 is provided with a rotating screw 5-7/9-5, the support plate 5-3/9-6 is also provided with a screw hole 5-6/9-4, and the support plate 9-6 of the first clamping mechanism 9 is also provided with a rectangular opening 9-7.
As shown in fig. 5, the extrusion mechanism 4 comprises a connecting frame 4-1, a worm gear 4-6, a first rocker 4-2, a transmission shaft 4-5 and a rack 4-3, the bottom of the connecting frame 4-1 is fixed on a threaded hole of the base 1, one end of the connecting frame 4-1 is provided with the worm gear 4-6, the worm gear 4-6 is connected with the first rocker 4-2 and is also connected with the rack 4-3 through a gear 4-4 on the transmission shaft 4-5, and the rack 4-3 is connected with a supporting plate 5-3 of the second clamping mechanism 5; the first rocker 4-2 is rotated to drive the worm gear 4-6 to rotate, the worm gear 4-6 drives the gear 44 to rotate through the transmission shaft 4-5, so that the rack 4-3 drives the first clamping mechanism 5 to move, and force for bending and deforming the circuit board 8 is generated.
The vibrating mechanism 6 comprises two supports 6-1, wherein the two supports 6-1 are provided with oval sliding grooves 6-2, screws penetrate through the oval sliding grooves 6-2 to be connected with threaded holes 5-2/9-2 in clamping mechanism supporting plates 5-3/9-6, the vibrating mechanism 6 can freely move up and down by adjusting the positions of the screws on the oval sliding grooves 6-2, the two supports 6-1 are connected through two lower-layer screw rods 6-6, a second rocker 6-4 is arranged between the two lower-layer screw rods 6-3, and the lower-layer screw rods 6-3 and the second rocker 6-4 can penetrate through rectangular openings 9-7 in the supporting plates 9-6 of a first clamping mechanism 9; a lower layer support seat 6-5 is arranged on the lower layer screw 6-3 and the second rocker 6-4, two upper layer screws 6-6 are arranged on the lower layer support seat 6-5, a third rocker 6-7 is arranged between the two upper layer screws 6-6, an upper layer support seat 6-8 is arranged on the upper layer screw 6-6 and the third rocker 6-7, a vibrator 6-9 is arranged on the upper layer support seat 6-8, a rotating handle 6-10 for clamping the vibrator 6-9 is arranged on the vibrator 6-9, and the vibrator 6-9 is connected with the battery module 3 through a lead; the vibrator 6-9 can move back and forth, left and right by rotating the second rocker 6-4 and the third rocker 6-7.
The bending displacement measuring mechanism 7 comprises a supporting screw 7-6 and a supporting frame 7-8, wherein the supporting frame 7-8 is arranged on the supporting screw 7-6, the supporting frame 7-8 can freely slide on the supporting screw 7-6, the bottom of the supporting frame 7-8 is provided with a long chute 7-7, after the supporting frame 78 slides to a proper position, the supporting frame 7-8 is fixed on a threaded hole 1-2 of the base 1 by penetrating a screw through the long chute 7-7, the two ends of the supporting screw 7-6 are respectively arranged on screw holes of a supporting plate of the clamping mechanism, the supporting frame 7-8 is provided with a worm gear 7-5, one end of the worm gear 7-5 is in transmission connection with a fourth rocker 7-3, the other end of the worm gear 7-5 is connected with a thimble 7-2 through a gear 7-1, the support frame 7-8 is also provided with a rotatable graduated scale 7-4 for measuring the upward or downward movement displacement of the thimble 7-2, so as to obtain the bending displacement of the circuit board 8.
A measuring method of a circuit board welding spot bending vibration stress measuring device comprises the following steps:
1) firstly, placing a circuit board welding spot bending vibration stress measuring device on a horizontal desktop;
2) adjusting the positions of the two clamping mechanisms according to the size of the circuit board to be measured, and reading the distance between the two clamping mechanisms through a graduated scale;
3) the circuit board to be tested is fixed through the two clamping mechanisms, so that the circuit board to be tested does not creep, and the first clamping mechanism is driven to move by adjusting the extrusion mechanism, so that the circuit board is bent and deformed to generate a certain bending displacement;
4) the position of the bending displacement measuring mechanism is adjusted to enable the thimble to be located at the middle position of the circuit board to be measured, and the bending displacement of the circuit board can be read out through a graduated scale on the bending displacement measuring mechanism;
5) the battery module is positioned on the base, is connected with the vibration mechanism through a lead, and enables the vibration source to be tightly attached to the tested circuit board by adjusting the position of a vibrator in the vibration mechanism;
6) the circuit board can vibrate under the bending loading condition by opening a switch on the battery module;
7) the tested circuit board is adhered with a three-phase strain gauge and connected with a dynamic strain gauge through a wire, and the change data of the bending vibration stress is input into a computer for calculation and analysis through a circuit and a serial port mode, so that the bending vibration performance test of the circuit board is realized.
Claims (7)
1. A device for measuring bending vibration stress of a welding spot of a circuit board is characterized by comprising the circuit board, a base, a graduated scale, a battery module, an extrusion mechanism, a first clamping mechanism, a second clamping mechanism, a vibration mechanism and a bending displacement measuring mechanism; the base is horizontally arranged; the first clamping mechanism and the second clamping mechanism are symmetrically arranged on the base; the extrusion mechanism is fixed at one end of the base and is in transmission connection with the second clamping mechanism; a vibration mechanism, a circuit board and a bending displacement measuring mechanism are sequentially arranged between the first clamping mechanism and the second clamping mechanism from bottom to top, two ends of the vibration mechanism are respectively connected with the first clamping mechanism and the second clamping mechanism, the circuit board is fixed between the two clamping mechanisms, and the bending displacement measuring mechanism is connected with the two clamping mechanisms through a screw rod; the graduated scale is arranged on the upper surface of the base and used for measuring the distance between the two clamping mechanisms; the battery module is fixed on the base and connected with the vibration mechanism through a lead to supply power for the vibration mechanism.
2. The device for measuring the bending vibration stress of the welding spot of the circuit board as claimed in claim 1, wherein the base is provided with a rectangular groove, two symmetrical slide rails and a plurality of threaded holes, the graduated scale is arranged in the rectangular groove, the first clamping mechanism is fixedly connected with the base through the threaded holes, and the second clamping mechanism is slidably connected with the slide rails.
3. The device for measuring the bending vibration stress of the welding spot of the circuit board according to claim 1, wherein the first clamping mechanism and the second clamping mechanism comprise supporting plates, the bottom of the supporting plate of the first clamping mechanism is fixed on the base, the bottom of the supporting plate of the second clamping mechanism is provided with a sliding groove, the sliding groove is in sliding connection with a sliding rail on the base, the lower portion of the supporting plate is provided with a threaded hole, the middle upper portion of the supporting plate is provided with a clamp, the supporting plate above the clamp is provided with a rotating screw, the supporting plate is further provided with a screw hole, and the supporting plate of the first clamping mechanism is further provided with a rectangular opening.
4. The device for measuring the bending vibration stress of the welding spot of the circuit board according to claim 1, wherein the extrusion mechanism comprises a connecting frame, a worm gear, a first rocker, a transmission shaft and a rack, the bottom of the connecting frame is fixed on a threaded hole of the base, the worm gear is arranged at one end of the connecting frame, the worm gear is connected with the first rocker and is also connected with the rack through a gear on the transmission shaft, and the rack is connected with the supporting plate of the second clamping mechanism; the first rocker is rotated to drive the worm gear to rotate, the worm gear drives the gear to rotate through the transmission shaft, the rack drives the first clamping mechanism to move, and then force for enabling the circuit board to bend and deform is generated.
5. The device for measuring the bending vibration stress of the welding spot of the circuit board according to claim 1, wherein the vibrating mechanism comprises two brackets, the two brackets are provided with oval chutes, screws penetrate through the oval chutes to be connected with threaded holes in the supporting plate of the clamping mechanism, the two brackets are connected through two lower-layer screws, a second rocker is further arranged between the two lower-layer screws, lower-layer supporting seats are arranged on the lower-layer screws and the second rocker, two upper-layer screws are arranged on the lower-layer supporting seats, a third rocker is arranged between the two upper-layer screws, upper-layer supporting seats are arranged on the upper-layer screws and the third rocker, a vibrator is arranged on the upper-layer supporting seat, a rotating handle for clamping the vibrator is arranged on the vibrator, and the vibrator is connected with the; the vibrator can move back and forth, left and right by rotating the second rocker and the third rocker.
6. The device for measuring the bending vibration stress of the welding spot of the circuit board according to claim 1, wherein the bending displacement measuring mechanism comprises a supporting screw rod and a supporting frame, the supporting frame is arranged on the supporting screw rod, two ends of the supporting screw rod are respectively arranged on screw rod holes of a supporting plate of the clamping mechanism, a worm gear is arranged on the supporting frame, one end of the worm gear is in transmission connection with a fourth rocker, the other end of the worm gear is connected with an ejector pin through a gear, and a rotatable scale used for measuring the upward or downward movement displacement of the ejector pin is further arranged on the supporting frame, so that the bending displacement of the circuit board is obtained.
7. A measuring method of a circuit board welding spot bending vibration stress measuring device is characterized by comprising the following steps:
1) firstly, placing a circuit board welding spot bending vibration stress measuring device on a horizontal desktop;
2) adjusting the positions of the two clamping mechanisms according to the size of the circuit board to be measured, and reading the distance between the two clamping mechanisms through a graduated scale;
3) the circuit board to be tested is fixed through the two clamping mechanisms, so that the circuit board to be tested does not creep, and the first clamping mechanism is driven to move by adjusting the extrusion mechanism, so that the circuit board is bent and deformed to generate a certain bending displacement;
4) the position of the bending displacement measuring mechanism is adjusted to enable the thimble to be located at the middle position of the circuit board to be measured, and the bending displacement of the circuit board can be read out through a graduated scale on the bending displacement measuring mechanism;
5) the battery module is positioned on the base, is connected with the vibration mechanism through a lead, and enables the vibration source to be tightly attached to the tested circuit board by adjusting the position of a vibrator in the vibration mechanism;
6) the circuit board can vibrate under the bending loading condition by opening a switch on the battery module;
7) the tested circuit board is adhered with a three-phase strain gauge and connected with a dynamic strain gauge through a wire, and the change data of the bending vibration stress is input into a computer for calculation and analysis through a circuit and a serial port mode, so that the bending vibration performance test of the circuit board is realized.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910972103.7A CN110595913A (en) | 2019-10-14 | 2019-10-14 | Device and method for measuring bending vibration stress of circuit board welding spot |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910972103.7A CN110595913A (en) | 2019-10-14 | 2019-10-14 | Device and method for measuring bending vibration stress of circuit board welding spot |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110595913A true CN110595913A (en) | 2019-12-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910972103.7A Pending CN110595913A (en) | 2019-10-14 | 2019-10-14 | Device and method for measuring bending vibration stress of circuit board welding spot |
Country Status (1)
| Country | Link |
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| CN (1) | CN110595913A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112665980A (en) * | 2020-12-16 | 2021-04-16 | 航天科工微电子系统研究院有限公司 | Mechanical loading device for board-level packaging structure |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112665980B (en) * | 2020-12-16 | 2024-03-26 | 航天科工微电子系统研究院有限公司 | Mechanical loading device for board-level packaging structure |
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