CN117054229B - Fixing device and method for testing reliability of circuit board of logging while drilling instrument - Google Patents
Fixing device and method for testing reliability of circuit board of logging while drilling instrument Download PDFInfo
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- CN117054229B CN117054229B CN202311316027.7A CN202311316027A CN117054229B CN 117054229 B CN117054229 B CN 117054229B CN 202311316027 A CN202311316027 A CN 202311316027A CN 117054229 B CN117054229 B CN 117054229B
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- 238000012360 testing method Methods 0.000 title claims abstract description 53
- 238000000034 method Methods 0.000 title claims abstract description 20
- 238000005553 drilling Methods 0.000 title claims abstract description 19
- 238000006243 chemical reaction Methods 0.000 claims description 19
- 238000004088 simulation Methods 0.000 claims description 13
- 238000006073 displacement reaction Methods 0.000 claims description 4
- 230000001133 acceleration Effects 0.000 claims description 3
- 238000010998 test method Methods 0.000 claims description 2
- 238000004364 calculation method Methods 0.000 description 11
- 238000010586 diagram Methods 0.000 description 8
- 238000003825 pressing Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000005303 weighing Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 239000000084 colloidal system Substances 0.000 description 2
- 238000004590 computer program Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/02—Details
- G01N3/04—Chucks
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/08—Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/22—Investigating strength properties of solid materials by application of mechanical stress by applying steady torsional forces
Abstract
The invention discloses a device and a method for testing reliability of a circuit board of a logging while drilling instrument, wherein the device comprises a bottom plate, at least one group of fixing bodies and at least one clamping body; the clamping body clamps the fixing body through the clamping screw, and the clamping body and the clamping screw jointly act to enable the contact surface between one group of fixing bodies and the side edge of the circuit board to form friction force. The testing method comprises the following steps: applying different torques to the clamping screw by a torque wrench, and calculating the compressive strength of the side edge of the circuit board according to the current torque when the size of the clamped area of the circuit board changes; simulating and calculating the clamping compressive stress of the circuit board to be tested under the vibration and high temperature conditions; the clamping compressive stress is compared with the compressive strength to verify whether the clamping compressive stress under the corresponding conditions meets the requirements.
Description
Technical Field
The invention relates to the field of equipment testing, in particular to a fixing device and a testing method for testing the reliability of a circuit board of a logging while drilling instrument.
Background
Logging while drilling refers to the simultaneous logging of a logging instrument and a drilling tool, and the measurement of engineering parameters and geological parameters in the well during drilling. Is subjected to vibration and high temperature during drilling operations. Vibration and high temperature testing of the circuit board is therefore required to ensure reliability of the circuit board in operation downhole. The circuit board of the logging while drilling instrument is typically integrally encapsulated with a gel, as shown in fig. 3, and then secured by an interference fit between the gel encapsulated on the exterior of the circuit board and the backbone recess, as shown in fig. 4. The packaged circuit board is conveniently fixed on a test bench for testing. If the packaged circuit board fails during testing, the colloid bare leakage components need to be removed during positioning and checking of failure reasons. The method of removing the gel is generally to cut the gel small pieces to be peeled off by using a relatively sharp cutter or a screwdriver. The method is not easy to damage components and even to lose the service function of the whole board due to improper operation. Reliability tests should be considered before the circuit board package is placed, so it is necessary to consider how to secure the unencapsulated circuit board to the test bench.
Disclosure of Invention
In view of the above problems, the present invention is provided to provide a fixing device and a testing method for testing reliability of a circuit board of a logging while drilling instrument, which overcome the problem of poor testing effect of the circuit board.
According to one aspect of the present invention, there is provided a logging-while-drilling instrument circuit board reliability test fixture comprising: a base plate, at least one set of fixing bodies and at least one clamping body;
the bottom plate is fixedly arranged on the test table top, the bottom plate is provided with parallel long grooves, one group of fixing bodies are fixedly arranged on the parallel long grooves of the bottom plate, and the length and the width of the parallel long grooves are matched with the size of the circuit board;
any clamping body clamps a group of fixing bodies through the clamping screw, and the clamping body and the clamping screw jointly act to enable the contact surface between the group of fixing bodies and the side edge of the circuit board to form friction force so as to limit the relative movement between the circuit board and the bottom plate.
In an alternative mode, the group of fixing bodies are fixedly arranged on the parallel long grooves of the bottom plate through fixing screws.
According to another aspect of the present invention, there is provided a test method for a logging-while-drilling instrument circuit board reliability test fixture, the method comprising:
applying different torques to the clamping screw through a torque wrench, and measuring the dimensional change of the clamped area of the circuit board;
when the size of the clamped area of the circuit board is reduced, recording the current torque, and calculating the compressive strength of the side edge of the circuit board according to the current torque;
the method comprises the steps of carrying out actual clamping on a circuit board to be tested, simulating and calculating the axial force of the clamping screw according to the mass, vibration magnitude and friction coefficient of the circuit board to be tested, simulating and calculating the temperature load conversion force according to the temperature coefficient, and calculating the clamping compressive stress according to the axial force and the temperature load conversion force;
comparing the clamping compressive stress with the compressive strength to determine whether the clamping compressive stress meets a test requirement.
In an alternative manner, the calculation formula for calculating the compressive strength of the side edge of the circuit board according to the current torque is as follows:
σ pressing = F 0 /(L×S)
Wherein sigma Pressing Is compressive strength, L is clamping length, S is circuit board thickness, F 0 To clamp the axial force of the screw, F 0 T/0.2d, T being the applied torque value and d being the nominal diameter of the clamping screw.
In an optional manner, the calculation formula for calculating the axial force of the clamping screw in a simulation manner according to the mass, the vibration magnitude and the friction coefficient of the circuit board to be tested is as follows:
F 0 = mG/3ƒ
wherein F is 0 For the axial force of the clamping screw, m is the value to be measuredThe mass of the circuit board, G is the vibration magnitude and ƒ is the coefficient of friction.
In an optional manner, the calculation formula for calculating the axial force of the clamping screw in a simulation manner according to the mass, the vibration magnitude and the friction coefficient of the circuit board to be tested is as follows:
F 0 = mK/3ƒ
wherein F is 0 For the axial force of the clamping screw, m is the mass of the circuit board to be tested, K is the dynamic load factor, k= 1+G/G, G is the vibration magnitude, G is the gravitational acceleration, and ƒ is the friction coefficient.
In an alternative manner, the calculating the temperature load conversion force according to the temperature coefficient simulation further includes:
according to the thermal expansion coefficient, the width and the temperature coefficient of the circuit board to be tested, the size variation of the circuit board to be tested after high-temperature expansion is simulated and calculated;
and loading the displacement solution of the size variation by using finite element software to obtain a counter force, and further obtaining the temperature load conversion force.
In an optional manner, the calculation formula for calculating the dimension variation of the circuit board to be tested after high-temperature expansion in a simulation manner according to the thermal expansion coefficient, the width and the temperature coefficient of the circuit board to be tested is:
△L=L 1 δT 0
wherein DeltaL is the size change after expansion at high temperature, L 1 For the width of the circuit board to be tested, delta is the thermal expansion coefficient, T 0 Is a temperature coefficient.
In an alternative manner, the calculating the clamping compressive stress from the axial force and the temperature load transfer force further comprises:
and summing the axial force and the temperature load conversion force to obtain the clamping compressive stress.
In an alternative manner, the comparing the clamping compressive stress with the compressive strength to determine whether the clamping compressive stress meets test requirements further comprises:
if the clamping compressive stress is smaller than or equal to the compressive strength, and the clamping compressive stress can ensure that the circuit board to be tested moves along with the bottom plate, the clamping compressive stress is determined to meet the test requirement.
According to the scheme provided by the invention, the testing and fixing device comprises a bottom plate, at least one group of fixing bodies and at least one clamping body; the bottom plate is fixedly arranged on the test table top, the bottom plate is provided with parallel long grooves, one group of fixing bodies are fixedly arranged on the parallel long grooves of the bottom plate, and the length and the width of the parallel long grooves are matched with the size of the circuit board; any clamping body clamps a group of fixing bodies through the clamping screw, and the clamping body and the clamping screw jointly act to enable the contact surface between the group of fixing bodies and the side edge of the circuit board to form friction force so as to limit the relative movement between the circuit board and the bottom plate. And measuring a change in the clamped area of the circuit board based on the test fixture applying different torques to the clamping screw by a torque wrench; when the size of the clamped area of the circuit board is reduced, recording the current torque, and calculating the compressive strength of the side edge of the circuit board according to the current torque; the method comprises the steps of actually clamping a circuit board, simulating and calculating the axial force of a clamping screw according to the mass, vibration magnitude and friction coefficient of the circuit board to be tested, simulating and calculating the temperature load conversion force according to the temperature coefficient, and calculating the clamping compressive stress according to the axial force and the temperature load conversion force; comparing the clamping compressive stress with the compressive strength to determine whether the clamping compressive stress meets a test requirement. According to the invention, the circuit board to be tested is actually clamped through the fixing device, the clamping compressive stress under the vibration and high temperature conditions is calculated in a simulation mode, and the clamping compressive stress is compared with the compressive strength, so that whether the clamping compressive stress under the corresponding conditions meets the test requirement can be verified. The fixing device is used for clamping the side edges of the circuit board, so that the circuit board can be avoided from being clamped by the adjusting position, components are prevented from being damaged, the fixing device is good in universality, and is suitable for circuit boards of instruments while drilling with different sizes, and meanwhile, the circuit boards are not damaged.
The foregoing description is only an overview of the present invention, and is intended to be implemented in accordance with the teachings of the present invention in order that the same may be more clearly understood and to make the same and other objects, features and advantages of the present invention more readily apparent.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to designate like parts throughout the figures. In the drawings:
FIG. 1 shows a schematic diagram of a circuit board reliability test fixture for a logging-while-drilling instrument in accordance with an embodiment of the present invention;
FIG. 2 is a flow chart of a testing method suitable for a logging-while-drilling instrument circuit board reliability testing fixture according to an embodiment of the present invention;
FIG. 3 shows a schematic diagram of a prior art potted circuit board;
FIG. 4 shows a prior art circuit board mounting schematic;
FIG. 5 shows a clamping torque test schematic of an embodiment of the present invention;
FIG. 6 shows a load diagram corresponding to the deformation amount of an embodiment of the present invention;
FIG. 7 illustrates a schematic weighing diagram of a circuit board in accordance with an embodiment of the present invention;
FIG. 8 shows a schematic representation of an analytical model of an embodiment of the present invention;
FIG. 9 shows a stress cloud schematic of an embodiment of the invention;
FIG. 10 shows a schematic diagram of a hole deformation cloud according to an embodiment of the present invention;
FIG. 11 shows a schematic diagram of an X-Ray inspection photograph of an embodiment of the present invention;
fig. 12 shows a schematic diagram of an actual test photograph of an embodiment of the present invention.
Reference numerals: 1. a circuit board; 2. a bottom plate; 3. a clamping screw; 4. a fixed body; 5. a fixing screw; 6. and a clamping body.
Detailed Description
Exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present invention are shown in the drawings, it should be understood that the present invention may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.
The circuit board of the logging while drilling instrument is limited by the structural size of the instrument, the size design is compact, and the circuit board and the framework are mounted together through the colloid after encapsulation. Other instruments or devices for other purposes fix the circuit board through reserved screw holes or a hold-down area left on the board surface, and then hold down the circuit board at a designated position by screws or other means. The part of the current circuit board which can be clamped only leaves the side edge of the circuit board, and in the embodiment, the side edge of the circuit board is selected as a clamping area.
FIG. 1 shows a schematic diagram of a circuit board reliability test fixture for a logging-while-drilling instrument in accordance with an embodiment of the present invention. Comprising the following steps: a base plate 2, at least one set of fixing bodies 4 and at least one clamping body 6. The bottom plate 2 is fixed on the test table, for example, the bottom plate 2 and the test table are fixed together through screws, the rest parts are fixed on the bottom plate 2, and the fixed circuit board 1 can vibrate along with the test table. In order to make the fixing device adaptable to circuit boards 1 with different lengths and/or different widths, a long groove is designed on the bottom plate 2, and the positions of the fixing body and the clamping body are adjusted to adapt to circuit boards 1 with different sizes. Specifically, the bottom plate 2 is provided with a plurality of parallel long grooves, wherein one set of fixing bodies 4 is fixedly arranged on the parallel long grooves of the bottom plate 2, for example, one fixing body in the set of fixing bodies is fixedly arranged on one parallel long groove, the other fixing body is fixedly arranged on the other parallel long groove, and the two parallel long grooves are adjacent. The length and width of the parallel long grooves are adapted to the size of the circuit board 1. Any clamping body 6 clamps a group of fixing bodies 4 through the clamping screw 3, and the clamping body 6 and the clamping screw 3 work together to enable the contact surface between the group of fixing bodies 4 and the side edge of the circuit board 1 to form friction force so as to limit the relative movement between the circuit board 1 and the bottom plate 2.
In some embodiments, a set of fixtures 4 are secured to the base plate 2 over parallel elongated slots by set screws 5.
The device applies pressure to the side edge of the circuit board 1 through the fixing body 4, and the fixing body 4 is connected with the bottom plate through a screw (fixing screw 5). One circuit board 1 restricts translation of the circuit board 1 in two directions parallel to the bottom surface by the fixing body 4 (e.g., three sets). The contact surface of the fixing body 4 and the circuit board 1 forms friction force through the coaction of the clamping body 6 and the clamping screw 3, so that the movement of the circuit board 1 in the direction vertical to the bottom surface is limited. After the preliminary scheme is developed, necessary calculation needs to be performed to determine whether the circuit board 1 can be firmly fixed without being damaged. The device is suitable for circuit boards with different widths through clamping the side edges of the circuit boards, can avoid the position where the circuit boards cannot be clamped by adjusting the positions so as to avoid damaging components, has good universality, is suitable for circuit boards of instruments with different sizes, and does not damage the circuit boards.
FIG. 2 is a flow chart illustrating a method for testing a circuit board reliability test fixture for a logging-while-drilling instrument according to an embodiment of the present invention. Specifically, as shown in fig. 2, the method comprises the following steps:
in step S201, different torques are applied to the clamping screw by the torque wrench, and the dimensional change of the clamped area of the circuit board is measured.
As shown in fig. 1 and 5, the two sides of the circuit board are clamped by the fixing body and the clamping body, different torques are applied to the clamping screw by the torque wrench, and then the width dimension change of the clamped area of the circuit board is measured.
In step S202, when the clamped area of the circuit board becomes smaller, the current torque is recorded, and the compressive strength of the side edge of the circuit board is calculated according to the current torque.
In this embodiment, the board material of the circuit board is ARLON85N, its elastic modulus E is 3Gpa, poisson's ratio μ is 0.15, and since the strength index, especially the compressive strength of the required side edge, is not found in the data, it is necessary to obtain the compressive strength value through the test. The test can be carried out by selecting a few circuit boards from the circuit boards made of the same material for actual measurement.
When the clamped area of the circuit board becomes smaller in size, for example, it is judged that plastic deformation of the circuit board occurs at the current torque when the width becomes smaller in size. In this embodiment, the thread of the clamping screw is M6, the original width of the clamping area of the circuit board is 28.18mm, the initial torque is applied to 5Nm, the clamping screw is loosened after the torque is applied, then the width dimension of the clamping area of the circuit board is measured, if the dimension value does not change, the torque is continuously applied to the clamping screw again by increasing 0.5Nm until the original width changes. When the torque was increased to 12Nm, the plate width became 28.16mm, and plastic deformation was considered to occur at this time. Recording the current torque, converting the current torque value into the axial force of the screw, and then combining the area of the clamping area to estimate the lateral compressive strength value of the circuit board.
In an alternative manner, the calculation formula for calculating the compressive strength of the side edge of the circuit board according to the current torque is as follows:
σ pressing = F 0 /(L×S)（1）
Wherein sigma Pressing Is compressive strength, L is clamping length, S is circuit board thickness, F 0 To clamp the axial force of the screw, F 0 T/0.2d, T being the applied torque value and d being the nominal diameter of the clamping screw.
For example, according to F 0 Calculation of axial force F when M6 screw is subjected to 12Nm by means of pressure T/0.2d 0 10000N, clamping length l=20 mm, circuit board thickness s=2.1 mm. Obtaining compressive strength sigma according to formula (1) Pressing =119 Mpa. This value is small because it does not take into account the effect of holes in the cross section for soldering components.
And step S203, the circuit board to be tested is clamped actually, the axial force of the clamping screw is calculated in a simulation mode according to the mass, the vibration magnitude and the friction coefficient of the circuit board to be tested, the temperature load conversion force is calculated in a simulation mode according to the temperature coefficient, and the clamping compressive stress is calculated according to the axial force and the temperature load conversion force.
This practice isIn the embodiment, the board material of the circuit board to be tested is a composite material, the lower limit value which is relatively conservative in the selection reference document of the friction coefficient f is about 0.11, and the thermal expansion coefficient delta is 16.0 mu m/m/DEG C. The mass of the circuit board is m, the vibration level is G, and the high temperature T 0 150 ℃. At a certain vibration level G, the circuit board is subjected to force F in the direction vertical to the bottom surface, one circuit board is clamped by 3 groups of fixing bodies, and the clamping screw is still used as the screw of M6.
In an optional manner, the calculation formula for calculating the axial force of the clamping screw in a simulation manner according to the mass, the vibration magnitude and the friction coefficient of the circuit board to be tested is as follows:
F 0 = mG/3ƒ（2）
wherein F is 0 For the axial force of the clamping screw, m is the mass of the circuit board to be tested, G is the vibration magnitude, and ƒ is the friction coefficient.
Equation (2) can be derived from the force balance, specifically equation (2) is derived from the static equilibrium relationship. Equation (2) does not take into account the effect of the dynamic load factor.
Since the load of the vibration process is variable, in practical application, the influence of the dynamic load factor should also be considered, specifically, in another alternative manner, the calculation formula for calculating the axial force of the clamping screw in a simulation manner according to the mass, the vibration magnitude and the friction coefficient of the circuit board to be tested is as follows:
F 0 = mK/3ƒ（3）
wherein F is 0 For the axial force of the clamping screw, m is the mass of the circuit board to be tested, K is the dynamic load factor, k= 1+G/G, G is the vibration magnitude, G is the gravitational acceleration, and ƒ is the friction coefficient.
K= 1+G/g is a relation of dynamic load factors, and k= 1+G/g is substituted into formula (3) to obtain F 0 = m（1+G/g）/3ƒ。
In an alternative manner, the calculating the temperature load conversion force according to the temperature coefficient simulation further includes:
according to the thermal expansion coefficient, the width and the temperature coefficient of the circuit board to be tested, the size variation of the circuit board to be tested after high-temperature expansion is simulated and calculated;
and loading the displacement solution of the size variation by using finite element software to obtain a counter force, and further obtaining the temperature load conversion force.
In an optional manner, the calculation formula for calculating the dimension variation of the circuit board to be tested after high-temperature expansion in a simulation manner according to the thermal expansion coefficient, the width and the temperature coefficient of the circuit board to be tested is:
△L=L 1 δT 0 （4）
wherein DeltaL is the size change after expansion at high temperature, L 1 For the width of the circuit board to be tested, delta is the thermal expansion coefficient, T 0 Is a temperature coefficient.
For example, a conventional circuit board has a width L 1 =28 mm, plate thickness S 1 =2.5 mm, and the dimensional change Δl after high-temperature expansion was calculated according to formula (4), resulting in a size of 0.067mm.
In this embodiment, the local substrate of the circuit board is taken as an analysis object, and the finite element software is used to load and displace by 0.067mm, as shown in fig. 6, and the branch reaction force is 416.8N, so as to obtain the temperature load conversion force 416.8N.
In an alternative manner, the calculating the clamping compressive stress from the axial force and the temperature load transfer force further comprises:
and summing the axial force and the temperature load conversion force to obtain the clamping compressive stress.
In this embodiment, stress and displacement analysis is performed using a circuit board with a large mass and a typical size as a test object. Determining vibration magnitude g=30g, high temperature T 0 150 ℃. The circuit board weighing was performed as shown in fig. 7, weighing 0.172Kg. Modeling and simplifying a local clamping area of the circuit board, wherein the model is shown in fig. 8, 3 holes with the diameter of 1mm are respectively formed in the position close to the clamping edge and the middle area, and a quarter of an original model is selected for analysis by utilizing a symmetry principle.
Above mentioned, the temperature load is converted into force F 1 416.8N according to F 0 =m (1+G/g)/3 ƒ can give a screw axial force F 0 62.5N, clamping areaThe load is 479.3N (clamping compressive stress) as the sum of the two.
And S204, comparing the clamping compressive stress with the compressive strength to determine whether the clamping compressive stress meets the test requirement.
In an alternative manner, if the clamping compressive stress is less than or equal to the compressive strength, and the clamping compressive stress can ensure that the circuit board to be tested moves along with the bottom plate, then determining that the clamping compressive stress meets the test requirement.
By the testing method, whether clamping compressive stress under corresponding conditions (vibration and high temperature conditions) meets the requirements or not can be verified, and the testing method is used for supporting further reliability testing of the circuit board.
The finite element analysis results are shown in FIG. 9 and FIG. 10, and the maximum stress is 27.4MPa, which is far less than the compressive strength 119MPa calculated before. From the deformation cloud image of the hole, the maximum deformation of the hole is 0.041mm, and the deformation amount is small. The calculation result shows that the clamping force does not damage the substrate of the circuit board, the influence on the welding pins of the components is small, and the next step of actual installation and clamping verification can be performed.
In this example, the circuit board is actually clamped, then heated to 150 ℃, and after a period of time, inspected for damage. The checking means is X-Ray, and the important point is to check whether cracks exist near the welding pins. Fig. 11 is a photograph of an X-Ray inspection showing that loading calculates clamping torque and does not damage the circuit board under the effect of an actual temperature rise of 150 ℃.
Further, the circuit board is tested for temperature and vibration simultaneously to determine if the clamping force meets the requirements. The circuit board and the fixing device are subjected to 30g of vibration, and the vibration sensor is arranged on the circuit board, so that the sensor data shows that the vibration of the circuit board and the test bench are well synchronized, and the fixing device is firmly fixed on the circuit board. The device is used for testing the reliability of hundreds of circuit boards, and fig. 12 is a practical test photograph.
According to the scheme provided by the embodiment of the invention, different torques are applied to the clamping screw through the torque wrench, and the dimensional change of the clamped area of the circuit board is measured; when the size of a clamped area of the circuit board is reduced, recording the current torque, and calculating the compressive strength of the side edge of the circuit board according to the current torque; according to the mass, vibration magnitude and friction coefficient of the circuit board, simulating and calculating the axial force of the clamping screw, simulating and calculating the temperature load conversion force according to the temperature coefficient, and calculating the clamping compressive stress according to the axial force and the temperature load conversion force; the clamping compressive stress is compared with the compressive strength to verify whether the clamping compressive stress under the corresponding conditions meets the requirements. The testing method provided by the invention can avoid the clamping force from damaging the substrate of the circuit board, has little influence on the welding pins of components and parts, and does not damage the circuit board.
The algorithms or displays presented herein are not inherently related to any particular computer, virtual system, or other apparatus. Various general-purpose systems may also be used with the teachings herein. The required structure for a construction of such a system is apparent from the description above. In addition, embodiments of the present invention are not directed to any particular programming language. It will be appreciated that the teachings of the present invention described herein may be implemented in a variety of programming languages, and the above description of specific languages is provided for disclosure of enablement and best mode of the present invention.
In the description provided herein, numerous specific details are set forth. However, it is understood that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures and techniques have not been shown in detail in order not to obscure an understanding of this description.
Similarly, it should be appreciated that in the above description of exemplary embodiments of the invention, various features of the embodiments of the invention are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the disclosure and aiding in the understanding of one or more of the various inventive aspects. However, the disclosed method should not be construed as reflecting the intention that: i.e., the claimed invention requires more features than are expressly recited in each claim. Rather, as the following claims reflect, inventive aspects lie in less than all features of a single foregoing disclosed embodiment. Thus, the claims following the detailed description are hereby expressly incorporated into this detailed description, with each claim standing on its own as a separate embodiment of this invention.
Those skilled in the art will appreciate that the modules in the apparatus of the embodiments may be adaptively changed and disposed in one or more apparatuses different from the embodiments. The modules or units or components of the embodiments may be combined into one module or unit or component and, furthermore, they may be divided into a plurality of sub-modules or sub-units or sub-components. Any combination of all features disclosed in this specification (including any accompanying claims, abstract and drawings), and all of the processes or units of any method or apparatus so disclosed, may be used in combination, except insofar as at least some of such features and/or processes or units are mutually exclusive. Each feature disclosed in this specification (including any accompanying claims, abstract and drawings), may be replaced by alternative features serving the same, equivalent or similar purpose, unless expressly stated otherwise.
Furthermore, those skilled in the art will appreciate that while some embodiments herein include some features but not others included in other embodiments, combinations of features of different embodiments are meant to be within the scope of the invention and form different embodiments. For example, in the following claims, any of the claimed embodiments can be used in any combination.
Various component embodiments of the invention may be implemented in hardware, or in software modules running on one or more processors, or in a combination thereof. Those skilled in the art will appreciate that some or all of the functionality of some or all of the components according to embodiments of the present invention may be implemented in practice using a microprocessor or Digital Signal Processor (DSP). The present invention can also be implemented as an apparatus or device program (e.g., a computer program and a computer program product) for performing a portion or all of the methods described herein. Such a program embodying the present invention may be stored on a computer readable medium, or may have the form of one or more signals. Such signals may be downloaded from an internet website, provided on a carrier signal, or provided in any other form.
It should be noted that the above-mentioned embodiments illustrate rather than limit the invention, and that those skilled in the art will be able to design alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The word "comprising" does not exclude the presence of elements or steps not listed in a claim. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The invention may be implemented by means of hardware comprising several distinct elements, and by means of a suitably programmed computer. In the unit claims enumerating several means, several of these means may be embodied by one and the same item of hardware. The use of the words first, second, third, etc. do not denote any order. These words may be interpreted as names. The steps in the above embodiments should not be construed as limiting the order of execution unless specifically stated.
Claims (1)
1. A method of testing a circuit board reliability test fixture for a logging-while-drilling instrument, the apparatus comprising: a base plate, at least one set of fixing bodies and at least one clamping body; the bottom plate is fixedly arranged on the test table top, the bottom plate is provided with parallel long grooves, one group of fixing bodies are fixedly arranged on the parallel long grooves of the bottom plate through fixing screws, and the length and the width of the parallel long grooves are matched with the size of the circuit board; any clamping body clamps a group of fixing bodies through the clamping screw, and the clamping body and the clamping screw jointly act to enable the contact surface between the group of fixing bodies and the side edge of the circuit board to form friction force so as to limit the relative movement between the circuit board and the bottom board;
the method comprises the following steps:
applying different torques to the clamping screw through a torque wrench, and measuring the dimensional change of the clamped area of the circuit board;
when the size of the clamped area of the circuit board is reduced, recording the current torque, and calculating the compressive strength of the side edge of the circuit board according to the current torque;
the circuit board to be tested is clamped in practice, and the axial force F of the clamping screw is calculated in a simulation mode according to the mass m, the vibration magnitude G and the friction coefficient ƒ of the circuit board to be tested 0 ，F 0 =mg3/ƒ or F 0 =mk/3 ƒ, where k= 1+G/g, g is gravitational acceleration;
according to the thermal expansion coefficient delta and the width L of the circuit board to be tested 1 Temperature coefficient T 0 Calculating the size change delta L after the high-temperature expansion of the circuit board to be tested in a simulation mode, wherein delta L=L 1 δT 0 The method comprises the steps of carrying out a first treatment on the surface of the Loading the displacement solution of the size variation by finite element software to obtain a support reaction force, and further obtaining a temperature load conversion force;
for the axial force F 0 Summing the temperature load conversion force to obtain clamping compressive stress;
if the clamping compressive stress is smaller than or equal to the compressive strength, and the clamping compressive stress can ensure that the circuit board to be tested moves along with the bottom plate, the clamping compressive stress is determined to meet the test requirement.
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Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2101337A (en) * | 1981-06-25 | 1983-01-12 | Schenck Ag Carl | Clamping device for a machine for testing materials |
| US4603587A (en) * | 1985-02-19 | 1986-08-05 | Kimball Industries, Inc. | High productivity vibration test fixture suited for testing printed circuit boards |
| KR20020096271A (en) * | 2001-06-19 | 2002-12-31 | 한호석 | Bending method for Electromagnetics waves interception shield and its apparatus |
| JP2004346562A (en) * | 2003-05-21 | 2004-12-09 | Takenaka Komuten Co Ltd | Passive type two-stage vibration control device |
| US7677094B1 (en) * | 2008-09-30 | 2010-03-16 | Nissan Technical Center North America, Inc. | Method and system for testing road load durability of truck rear bed |
| CN207366211U (en) * | 2017-10-12 | 2018-05-15 | 苏州泰斯特测控科技有限公司 | The high-temperature high-frequency fatigue life test fixture of clipping blade of aviation engine |
| CN208091662U (en) * | 2018-04-08 | 2018-11-13 | 东莞市三方标策检测技术有限公司 | Circuit board vibration test fixture |
| CN110146243A (en) * | 2019-06-05 | 2019-08-20 | 陕西陕航环境试验有限公司 | A kind of high cycle fatigue test method of integral blade disk |
| JP2020091098A (en) * | 2018-12-03 | 2020-06-11 | 群馬県 | Unit type vibration test jig |
| CN112379286A (en) * | 2020-08-05 | 2021-02-19 | 万向一二三股份公司 | Device and method for measuring stability of soft package lithium ion battery |
| CN113719269A (en) * | 2021-07-08 | 2021-11-30 | 华中科技大学 | On-line monitoring method for circuit working state of logging-while-drilling instrument |
| CN114080517A (en) * | 2019-08-06 | 2022-02-22 | 舍弗勒技术股份两合公司 | Centrifugal pendulum for a drive train having a rotational axis |
| CN216247093U (en) * | 2021-11-15 | 2022-04-08 | 武汉华中天易星惯科技有限公司 | Circuit board three-dimensional random vibration screening clamp |
| CN114720123A (en) * | 2022-03-11 | 2022-07-08 | 中国航发沈阳发动机研究所 | Novel vertical combustion engine main shaft static force and fatigue test device |
| CN115859747A (en) * | 2023-02-13 | 2023-03-28 | 中海油田服务股份有限公司 | Calculation method, device and equipment for interference coupling transmission load and storage medium |
| CN219675408U (en) * | 2023-05-04 | 2023-09-12 | 安徽天光传感器有限公司 | PCB vibration clamp |
-
2023
- 2023-10-12 CN CN202311316027.7A patent/CN117054229B/en active Active
Patent Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2101337A (en) * | 1981-06-25 | 1983-01-12 | Schenck Ag Carl | Clamping device for a machine for testing materials |
| US4603587A (en) * | 1985-02-19 | 1986-08-05 | Kimball Industries, Inc. | High productivity vibration test fixture suited for testing printed circuit boards |
| KR20020096271A (en) * | 2001-06-19 | 2002-12-31 | 한호석 | Bending method for Electromagnetics waves interception shield and its apparatus |
| JP2004346562A (en) * | 2003-05-21 | 2004-12-09 | Takenaka Komuten Co Ltd | Passive type two-stage vibration control device |
| US7677094B1 (en) * | 2008-09-30 | 2010-03-16 | Nissan Technical Center North America, Inc. | Method and system for testing road load durability of truck rear bed |
| CN207366211U (en) * | 2017-10-12 | 2018-05-15 | 苏州泰斯特测控科技有限公司 | The high-temperature high-frequency fatigue life test fixture of clipping blade of aviation engine |
| CN208091662U (en) * | 2018-04-08 | 2018-11-13 | 东莞市三方标策检测技术有限公司 | Circuit board vibration test fixture |
| JP2020091098A (en) * | 2018-12-03 | 2020-06-11 | 群馬県 | Unit type vibration test jig |
| CN110146243A (en) * | 2019-06-05 | 2019-08-20 | 陕西陕航环境试验有限公司 | A kind of high cycle fatigue test method of integral blade disk |
| CN114080517A (en) * | 2019-08-06 | 2022-02-22 | 舍弗勒技术股份两合公司 | Centrifugal pendulum for a drive train having a rotational axis |
| CN112379286A (en) * | 2020-08-05 | 2021-02-19 | 万向一二三股份公司 | Device and method for measuring stability of soft package lithium ion battery |
| CN113719269A (en) * | 2021-07-08 | 2021-11-30 | 华中科技大学 | On-line monitoring method for circuit working state of logging-while-drilling instrument |
| CN216247093U (en) * | 2021-11-15 | 2022-04-08 | 武汉华中天易星惯科技有限公司 | Circuit board three-dimensional random vibration screening clamp |
| CN114720123A (en) * | 2022-03-11 | 2022-07-08 | 中国航发沈阳发动机研究所 | Novel vertical combustion engine main shaft static force and fatigue test device |
| CN115859747A (en) * | 2023-02-13 | 2023-03-28 | 中海油田服务股份有限公司 | Calculation method, device and equipment for interference coupling transmission load and storage medium |
| CN219675408U (en) * | 2023-05-04 | 2023-09-12 | 安徽天光传感器有限公司 | PCB vibration clamp |
Non-Patent Citations (6)
| Title |
|---|
| Effect of Bit Wear on Hammer Drill Handle Vibration and Productivity;Andrea Antonucci;《Journal of Occupational and Environmental Hygiene》;1-27 * |
| Magnetic field analysis of Primary Permanent Magnet Linear Motor Based on Halbach Distribution;Xiuping Wang;《E3S Web of Conferences》;1-9 * |
| 井下振动实时测量存储系统设计;姚文彬;李辉;尚捷;;电子测量技术(第03期);112-115 * |
| 振动试验夹具在可靠性试验中的应用;金玫, 林峰, 李德峰, 金有刚;航空标准化与质量(第05期);40-44 * |
| 空间光学遥感器振动夹具的设计与研究;李威;;光机电信息(第09期);22-28 * |
| 高温高压深井试油井下管柱力学分析及其应用;窦益华;张福祥;;钻采工艺(第05期);6、31-34、40 * |
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