CN110501228A - Wiring board solder joint bending stress experimental provision - Google Patents
Wiring board solder joint bending stress experimental provision Download PDFInfo
- Publication number
- CN110501228A CN110501228A CN201910899562.7A CN201910899562A CN110501228A CN 110501228 A CN110501228 A CN 110501228A CN 201910899562 A CN201910899562 A CN 201910899562A CN 110501228 A CN110501228 A CN 110501228A
- Authority
- CN
- China
- Prior art keywords
- wiring board
- bending stress
- clamp system
- solder joint
- experimental provision
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 title claims abstract description 43
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 22
- 230000007246 mechanism Effects 0.000 claims abstract description 58
- 238000005259 measurement Methods 0.000 claims abstract description 33
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 32
- 238000006073 displacement reaction Methods 0.000 claims abstract description 30
- 238000013519 translation Methods 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 2
- 238000012360 testing method Methods 0.000 abstract description 9
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000000691 measurement method Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012806 monitoring device Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/08—Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/20—Investigating strength properties of solid materials by application of mechanical stress by applying steady bending forces
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
Abstract
The invention discloses a kind of wiring board solder joint bending stress displacement measuring devices, it includes pedestal and two clamp systems matched for clamping wiring board, one of clamp system is fixed on the base, and the side of another clamp system is connect with the power mechanism that a drive clamp system translates；The other side lower end of power mechanism is fixed on the base；It is held on the displacement measurement mechanism for being equipped with deflection of the measurement wiring board under bending stress above and below the wiring board of two clamp systems by mounting rack, mounting rack can horizontally slip with respect to pedestal.This programme clamps wiring board by two clamp systems, and wiring board holding can be made horizontal and will not be wriggled；It is driven by a power mechanism one of clamp system movement, applies deformation force to wiring board to realize, to realize wiring board bending deformation, and deflection is measured by displacement measurement mechanism, rapidly realizes the test of wiring board bending property to reach easy.
Description
Technical field
The present invention relates to wiring board deformation monitoring devices, and in particular to a kind of wiring board solder joint bending stress experimental provision.
Background technique
With the continuous development of science and technology, electronic product is high towards micromation, low-power consumption, integration density
Direction is developed, also increasing for the demand of electronic product, and the reliability of electronic product is all concerned all the time.In electricity
Influence reliability in sub- product encapsulation process is greatly to receive mechanical load because being known as, such as bending deformation, torsion
The series of factors such as deformation, random vibration occur failure deformation so as to cause solder joint, will further will lead to entire component
Reliability consideration when failing, therefore carrying out BGA solder joint by bending load is very necessary.
At present on engineering field, no matter National 863 plan or the projects such as National Nature fund project or military project, have
It is related to the subject study of solder joint bending stress, but when carrying out related scientific research, also lacks and how accurately to clamp tested production
Product make it generate the device of bending deformation.
Summary of the invention
For above-mentioned deficiency in the prior art, the present invention provides one kind can measure wiring board under bending stress
The wiring board solder joint bending stress experimental provision of deflection.
In order to achieve the above object of the invention, the technical solution that the present invention uses are as follows:
There is provided a kind of wiring board solder joint bending stress experimental provision comprising pedestal and two pairings are for clamping wiring board
Clamp system, one of clamp system is fixed on the base, the side of another clamp system and a drives folder
The power mechanism connection of tight mechanism translation；The other side lower end of power mechanism is fixed on the base；It is held on two clamp systems
Wiring board above and below the displacement measurement of deflection of the measurement wiring board under bending stress is installed by mounting rack
Mechanism, mounting rack can horizontally slip with respect to pedestal.
The invention has the benefit that clamping by two clamp systems to wiring board, wiring board can be made to keep
It is horizontal and will not wriggle；When being tested, since one of clamp system is fixed, another clamp system and engine
Structure connection is fixed on the base when giving clamp system applied force due to power mechanism side, can be towards in elongation
It is mobile with clamp system connecting side, to drive clamp system towards another clutch mechanism slip, so that it is curved to generate wiring board
Song deformation.
Before displacement measurement mechanism is used for wiring board deformation test, is contacted using it with wiring board, obtain displacement measurement machine
The initial displacement of structure；Assist side occurs bending and deformation and then Mobile mounting rack connects displacement measurement mechanism with wiring board
Touching obtains measurement displacement, obtains the deflection of wiring board by initial displacement and measurement displacement, is rapidly realized with reaching easy
The test of wiring board bending property.
Detailed description of the invention
Fig. 1 is the perspective view of wiring board solder joint bending stress experimental provision.
Fig. 2 is the perspective view of pedestal.
Fig. 3 is the perspective view for the clamp system being fixed on the base.
Fig. 4 is the perspective view that the clamp system connecting with power mechanism and power mechanism link together.
Fig. 5 is the perspective view of mounting rack.
Wherein, 1, pedestal；11, panel is supported；12, support leg；13, mounting groove；14, bar shaped guide groove；15, connecting rod；
16, sliding block；2, graduated scale；3, clamp system；31, connecting lugs；311, straight trough mouth；32, support frame；321, gripping block；322,
Latch segment；323, square groove；324, card slot；325, strip groove；33, clamping frame；
4, power mechanism；41, fixed plate；42, expansion bracket；421, connection frame；422, link block；423, screw rod；5, it installs
Frame；51, top cover；511, sliding rail；52, connecting plate；521, middle plate；522, strip-shaped hole；523, extension board；6, displacement measurement machine
Structure；61, threaded connector；62, height gauge；621, bar shaped sliding slot；63, measuring scale；7, wiring board.
Specific embodiment
A specific embodiment of the invention is described below, in order to facilitate understanding by those skilled in the art this hair
It is bright, it should be apparent that the present invention is not limited to the ranges of specific embodiment, for those skilled in the art,
As long as various change is in the spirit and scope of the present invention that the attached claims limit and determine, these variations are aobvious and easy
See, all are using the innovation and creation of present inventive concept in the column of protection.
As shown in Figure 1, the wiring board solder joint bending stress experimental provision of this programme includes pedestal 1 and two pairings for pressing from both sides
The clamp system 3 of tight wiring board 7；The pedestal 1 of this programme provides when being mainly used for other component and test stablizes support, such as schemes
Shown in 2, pedestal 1 includes support panel 11 and at least one support leg 12 being connected as one with support panel 11；In pedestal 1
Length direction offers the mounting groove 13 of a placement graduated scale 2, which connects
Touching can be in order to accurately controlling the moving distance of clamp system 3 in this way by the mutual cooperation of graduated scale 2 and power mechanism 4.
One of clamp system 3 is fixed on pedestal 1, the side of another clamp system 3 and a drive clamping machine
The power mechanism 4 that structure 3 translates connects, and power mechanism 4 can be motor and the fit structure of feed screw nut, be also possible to an electricity
Dynamic push rod, in addition can also be one it is extraneous to its downward power when, it is flexible to drive clamp system 3 to translate with respect to pedestal 1
Structure.
As shown in figure 3, clamp system 3 lower end fixed with pedestal 1 is provided with connecting lugs 31, opened up in connecting lugs 31
There is straight trough mouth 311；As shown in figure 4,3 side of clamp system connecting with power mechanism 4 offers and is used for through its width direction
The strip groove 325 of power mechanism 4 is installed.
The other side lower end of power mechanism 4 is fixed on pedestal 1；Be held on two clamp systems 3 the top of wiring board 7 and
Lower section is equipped with the displacement measurement mechanism 6 of deflection of the measurement wiring board 7 under bending stress, mounting rack 5 by mounting rack 5
It can horizontally slip with respect to pedestal 1.
As shown in Figure 3 and Figure 4, clamp system 3 includes support frame 32 and clamping frame 33, and connecting lugs 31 are disposed therein one
The lower end of a support frame 32, strip groove 325 are provided on another support frame 32；It is provided on support frame 32 and clamping frame 33
Cooperate the latch segment 322 for clamping the gripping block 321 of 7 side of wiring board and being mutually paired；
The upper end of support frame 32 offers square groove 323, offers sliding slot on the two sidewalls of square groove 323；Clamping frame 33
It is mounted in sliding slot, so that two gripping blocks 321 is clamped wiring board 7 by the locking member installed on two latch segments 322.
If the thickness that clamping frame 33 is located at side wall at square groove 323 is less than trough width, can be by the side of clamping frame 33
Wall is directly placed at sliding slot, can also be if the thickness that clamping frame 33 is located at side wall at square groove 323 is greater than trough width
A piece sliding block 16 is respectively installed on the side wall of clamping frame 33.
Wherein, after latch segment 322 being arranged on clamping frame 33, shape can be L-shaped, can also be in zigzag, when L-shaped
When, the top surface of the latch segment 322 on support frame 32 is flushed with the lower surface of square groove 323；When being in zigzag, it is located at branch
The top surface of latch segment 322 on support 32 and the following table distance between the surface of square groove 323 are less than the length of zigzag intermediate arm.
The clamping structure of this programme is not limited to above structure, can also be using the machinery of comparative maturity in the prior art
Pawl clamps the side of wiring board 7 by gripper, and gripper passes through a support construction again and is fixed on pedestal 1.
This programme power mechanism 4 is preferentially selected when subject to downward force, flexible to drive clamp system 3 with respect to pedestal 1
The structure of translation.As shown in figure 4, this kind of power mechanism 4 includes fixed plate 41 and expansion bracket 42, offers and run through in fixed plate 41
The strip groove 325 of its width direction, 42 two sides lower end of expansion bracket/upper end are fixed on the bar shaped in fixed plate 41 and clamp system 3
In slot 325；It is moved downward along strip groove 325 so that expansion bracket 42 extends when the expansion bracket 42 is subject to downward force.
When implementation, the preferred expansion bracket 42 of this programme includes the connection frame 421 that at least one is made of at least two scissors framves,
When for a connection frame 421, link block 422 is installed two scissors frame junctions；When at least two connection frames 421
When, it is connected by installing link block 422 in the scissors frame junction for being located at same row between connection frame 421.
Specifically, all connection frames 421 being arranged side by side, the width direction with the arrangement of multiple connection frames 421 is to arrange, one
421 length direction of connection frame is column, and connection frame 421 is mounted on the scissors frame junction of same row.
The mounting hole passed through for screw rod 423 is mounted on two link blocks 422 on same vertical plane；Screw rod
1 length direction of pedestal immediately below 423 offers the bar shaped guide groove 14 passed through for screw rod.
Mounting hole herein can be non-threaded through-hole, or threaded hole, if be non-threaded through-hole,
When carrying out 7 bend test of wiring board, downwards to after 423 applied force of screw rod, if do not terminate test cannot remove it is corresponding
Power, therefore the mounting hole on the preferred link block 422 of this programme be threaded hole.
The power mechanism 4 of this programme after adopting the above structure, in the realization for driving clamp system 3 connected to it mobile
Journey are as follows:
Downward turn screw rod 423, is gradually reduced the distance between two pieces of link blocks 422 for installing same screw rod 423, by
In connection frame 421 only upper end or lower end be it is fixed, the other end is mounted in strip groove 325, can make to connect so by force
It connects 421 one end of frame to slide with respect to strip groove 325, so that the length of entire connection frame 421,41 side of fixed plate is solid in addition
It is scheduled on pedestal 1, then connection frame 421 will naturally drive clamp system 3 connected to it towards another folder
Tight mechanism 3 is mobile.
In one embodiment of the invention, displacement measurement mechanism 6 is two, is mounted on route by mounting rack 5
The upper and lower of plate 7；Displacement measurement mechanism 6 includes being threadedly secured on mounting rack 5 for 7 bending direction of control circuit board
Threaded connector 61 and the height gauge 62 that is fixed on mounting rack 5, offer bar shaped sliding slot 621 on height gauge 62, bar shaped is sliding
Measuring scale 63 with 61 conjunction measuring wiring board of threaded connector, 7 deflection is installed in slot 621.
The process that first can control 7 bending direction of wiring board to threaded connector 61 below is illustrated:
When carrying out the test of 7 bending stress of wiring board, 7 both ends of wiring board are first fixed on to the gripping block 321 of clamp system 3
On, if wanting to be bent downwardly wiring board 7, the threaded connector of the displacement measurement mechanism 6 of 7 top of adjustable wiring board at this time
61, contact it with wiring board 7, since threaded connector 61 and mounting rack 5 are threadably secured connection, at this moment wiring board
The threaded connector 61 of the displacement measurement mechanism 6 of 7 tops is the equal of fixed；For another displacement measurement machine
The threaded connector 61 of structure 6 is adjusted to far from wiring board 7；
Later under the action of power mechanism 4, the clamp system 3 that connect with power mechanism 4 is towards another clamp system 3
When movement, the deformation force of wiring board 7 is formed by the extruding force of clamp system 3；Since there is threaded connector in the top of wiring board 7
61 blocking, and blocking of the lower section without any part, wiring board 7 be bent upwards be it is relatively difficult, can be bent downwardly naturally,
To be finally reached the bending direction of 61 control circuit board 7 of threaded connector by displacement measurement mechanism 6.
As shown in figure 5, mounting rack 5 includes top cover 51 and connecting plate 52, the upper end of connecting plate 52 is fixedly connected with top cover 51,
Top cover 51 and 3 tip contact of clamp system, and supported by clamp system 3；The lower end of connecting plate 52 is installed on bottom
On seat 1, and it can be slided with respect to pedestal 1；The middle part of connecting plate 52 is provided with plate 521 in one piece, and middle plate 521 and top cover 51 distinguish position
In the following above and of wiring board 7；Liang Ge displacement measurement mechanism 6 is separately mounted on middle plate 521 and top cover 51.
The threaded connector 61 and height gauge 62 for being wherein located at 7 top of wiring board are installed on top cover 51, are located at wiring board 7
The threaded connector 61 and height gauge 62 of top are installed on middle plate 521.
When implementation, the structure that the opposite pedestal 1 of the preferred connecting plate 52 of this programme slides includes being provided with 52 lower end of connecting plate
At least one strip-shaped hole 522, the body of rod being fixed on 1 side of pedestal, the body of rod pass through strip-shaped hole 522.
It, can by Mobile mounting rack 5 when clamp system 3 clamps the wiring board 7 of different length after strip-shaped hole 522 is set
So that Liang Ge displacement measurement mechanism 6 is located at the middle position of 7 length direction of wiring board as far as possible；It simultaneously can be with position easy to remove
Move the deflection measured at measurement 7 different location of wiring board of measuring mechanism 6.
Then displacement measurement mechanism 6 is illustrated the measurement of the deflection of wiring board 7:
The first measurement method: after assist side 7 is clamped, the displacement of 7 bending direction of control circuit board is first adjusted
The threaded connector 61 for measuring measuring mechanism 6, adjusts another 6 threaded connector 61 of displacement measurement mechanism and wiring board later
7 contacts, and the mobile measuring scale 63 for being located at bar shaped sliding slot 621, contact its whorl brace rod 15, are recorded just by height gauge 62
Begin height；
The threaded rod is adjusted later, makes it away from wiring board 7, after wiring board 7 is bent, by adjusting threaded connector
61 and Mobile mounting rack 5, contact threaded connector 61 with 7 convex surface of wiring board, after the deformation at 7 different location of record circuit plate
Highly, by height after elemental height and last deformation, the deflection at a position of wiring board more than 7 is obtained.
Second of measurement method: after assist side 7 is clamped, the displacement of 7 bending direction of control circuit board is first adjusted
The threaded connector 61 for measuring measuring mechanism 6, adjusts another 6 threaded connector 61 of displacement measurement mechanism later and makes it away from
Wiring board 7；The mobile measuring scale 63 cooperated with fixed thread connector 61 records elemental height by height gauge 62；
After wiring board 7 is bent, connected by Mobile mounting rack 5 and adjustment for 7 bending direction screw thread of control circuit board
Fitting 61 contacts it with 7 concave surface of wiring board, height after the deformation at 7 different location of record circuit plate, by elemental height and
Height, obtains the deflection at a position of wiring board more than 7 after last deformation.
Referring again to FIGS. 2, being equipped with a connecting rod 15 between two support legs 12 immediately below mounting rack 5, connect
The two sides that plate 52 extends at the connecting rod 15 of pedestal 1 are provided with the extension board 523 extended towards connecting rod 15, in extension board
The mounting hole passed through for connecting rod 15 is offered on 523.
The lower end of mounting rack 5 further passes through extension board 523 and connect with the connecting rod 15 on pedestal 1, pacifies in this way mobile
When shelving 5, pass through the mutual cooperation of connecting rod 15 and strip-shaped hole 522 and clamp system, it is ensured that mounting rack 5 is with two
The mobile stationarity of displacement measurement mechanism 6.
As depicted in figs. 1 and 2, it is connected at least one sliding rail 511 and/or pedestal 1 and is equipped with and power on top cover 51
The sliding block 16 that the card slot 324 for the clamp system lower end that mechanism 4 connects cooperates, the upper end of two clamp systems is mounted on sliding rail 511
It is interior；Specifically, it is opposite in the width of the support frame 32 of direction slot two sides after the support frame 32 of clamp system opens up square groove 323
Smaller, clamp system can be mounted in sliding rail 511 by the structure of 32 two sides of support frame.
This programme is arranged sliding rail 511 and/or with after the card slot 324 of 1 top shoe 16 of pedestal cooperation, drives in power mechanism 4
When clamp system moves, it is ensured that the stationarity and the frictional force in reduction motion process of clamp system movement；Meanwhile sliding rail
511 can also be oriented to the movement of mounting rack 5, and guarantee the mobile stationarity of mounting rack 5.
When implementation, the preferred 7 solder joint bending stress experimental provision of wiring board of this programme further includes pasting answering in assist side 7
Become flower, the bending stress of strain rosette measurement inputs computer with serial mode by circuit and connect；Testing crew can be according to defeated
The deflection for entering the bending strain power of computer and the wiring board 7 of record carries out relevant testing research to wiring board 7.
Claims (10)
1. wiring board solder joint bending stress experimental provision, which is characterized in that including pedestal and two pairings for clamping wiring board
Clamp system, one of clamp system is fixed on the base, the side of another clamp system and a drives folder
The power mechanism connection of tight mechanism translation；The other side lower end of the power mechanism is fixed on the base；It is held on two
The position of deflection of the measurement wiring board under bending stress is installed above and below the wiring board of clamp system by mounting rack
It moves and measures measuring mechanism, the mounting rack can horizontally slip with respect to pedestal.
2. wiring board solder joint bending stress experimental provision according to claim 1, which is characterized in that the fixed folder with pedestal
Tight mechanism lower end is provided with connecting lugs, and straight trough mouth is offered in the connecting lugs；The clamp system being connect with power mechanism
Side offers the strip groove for being used to install power mechanism through its width direction.
3. wiring board solder joint bending stress experimental provision according to claim 2, which is characterized in that the clamp system packet
Include support frame and clamping frame, be provided on support frame as described above and clamping frame cooperate clamp wiring board side gripping block and
The latch segment being mutually paired；
The upper end of support frame as described above offers square groove, offers sliding slot on the two sidewalls of the square groove；The clamping frame peace
In the sliding slot, two gripping blocks are made to clamp wiring board by the locking member installed on two latch segments.
4. wiring board solder joint bending stress experimental provision according to claim 2, which is characterized in that the power mechanism packet
Fixed plate and expansion bracket are included, offers the strip groove through its width direction in the fixed plate, expansion bracket two sides lower end/
Upper end is fixed in the strip groove in fixed plate and clamp system；When the expansion bracket is subject to downward force its along strip groove to
It is lower to move so that expansion bracket extends.
5. wiring board solder joint bending stress experimental provision according to claim 4, which is characterized in that the expansion bracket includes
At least one connection frame being made of at least two scissors framves is installed when for a connection frame two scissors frame junctions
Upper link block；When at least two connection frames, by installing connection in the scissors frame junction for being located at same row between connection frame
Block connection；
The mounting hole passed through for screw rod is mounted on two link blocks on same vertical plane；Immediately below the screw rod
Base length direction offers the bar shaped guide groove passed through for screw rod.
6. wiring board solder joint bending stress experimental provision according to claim 4, which is characterized in that the displacement measurement
Mechanism is two, and the upper and lower of assist side is installed by mounting rack；The displacement measurement mechanism includes solid by screw thread
It is scheduled on mounting rack for the threaded connector of control circuit board bending direction and the height gauge being fixed on mounting rack, the height
Bar shaped sliding slot is offered on degree ruler, the survey with threaded connector conjunction measuring wiring board deflection is installed in the bar shaped sliding slot
Gage.
7. wiring board solder joint bending stress experimental provision according to claim 5, which is characterized in that the mounting rack includes
The upper end of top cover and connecting plate, the connecting plate is fixedly connected with top cover, top cover and clamp system tip contact, and passes through clamping
Mechanism supports；The lower end of connecting plate is mounted on the base, and can be slided with respect to pedestal；It is set in the middle part of the connecting plate
It is equipped with plate in one piece, the middle plate and top cover are located at the following above and of wiring board；Liang Ge displacement measurement mechanism difference
It is mounted on plate and top cover.
8. wiring board solder joint bending stress experimental provision according to claim 7, which is characterized in that connecting plate is with respect to pedestal
The structure of sliding includes being provided at least one strip-shaped hole of connecting plate lower end, the body of rod being fixed on base side, the bar
Body passes through strip-shaped hole.
9. -8 any wiring board solder joint bending stress experimental provision according to claim 1, which is characterized in that the top cover
On be connected be equipped at least one sliding rail and/or pedestal the clamp system lower end being connect with power mechanism card slot cooperation
Sliding block, the upper end of two clamp systems are mounted in the sliding rail.
10. -8 any wiring board solder joint bending stress experimental provision according to claim 1, which is characterized in that further include
Strain rosette in the circuit board is pasted, the bending stress of the strain rosette measurement inputs computer by circuit and serial mode and connects
It connects.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910899562.7A CN110501228A (en) | 2019-09-23 | 2019-09-23 | Wiring board solder joint bending stress experimental provision |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910899562.7A CN110501228A (en) | 2019-09-23 | 2019-09-23 | Wiring board solder joint bending stress experimental provision |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110501228A true CN110501228A (en) | 2019-11-26 |
Family
ID=68592516
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910899562.7A Pending CN110501228A (en) | 2019-09-23 | 2019-09-23 | Wiring board solder joint bending stress experimental provision |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110501228A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005315691A (en) * | 2004-04-28 | 2005-11-10 | Matsushita Electric Ind Co Ltd | Bending testing device and bending test method |
| CN101165467A (en) * | 2006-10-19 | 2008-04-23 | 日本梅克特隆株式会社 | High speed bend test device |
| US20100131236A1 (en) * | 2005-10-05 | 2010-05-27 | Centre De Recherche Industrielle Du Quebec | Apparatus and Method for Measuring Deflection of a Printed Circuit Board |
| JP2011089862A (en) * | 2009-10-22 | 2011-05-06 | Mitsubishi Heavy Ind Ltd | Bending fatigue testing device |
| CN107991198A (en) * | 2017-12-21 | 2018-05-04 | 吉林大学 | Stretch bending turns round the compound extensometer of three-dimensional |
| CN110196009A (en) * | 2019-06-21 | 2019-09-03 | 桂林电子科技大学 | A kind of measurement of wiring board solder joint bending Stress displacement and positioning auxiliary device |
| CN210719962U (en) * | 2019-09-23 | 2020-06-09 | 成都航空职业技术学院 | Circuit board solder joint bending stress experimental apparatus |
-
2019
- 2019-09-23 CN CN201910899562.7A patent/CN110501228A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005315691A (en) * | 2004-04-28 | 2005-11-10 | Matsushita Electric Ind Co Ltd | Bending testing device and bending test method |
| US20100131236A1 (en) * | 2005-10-05 | 2010-05-27 | Centre De Recherche Industrielle Du Quebec | Apparatus and Method for Measuring Deflection of a Printed Circuit Board |
| CN101165467A (en) * | 2006-10-19 | 2008-04-23 | 日本梅克特隆株式会社 | High speed bend test device |
| JP2008102022A (en) * | 2006-10-19 | 2008-05-01 | Nippon Mektron Ltd | High-speed bend testing equipment |
| JP2011089862A (en) * | 2009-10-22 | 2011-05-06 | Mitsubishi Heavy Ind Ltd | Bending fatigue testing device |
| CN107991198A (en) * | 2017-12-21 | 2018-05-04 | 吉林大学 | Stretch bending turns round the compound extensometer of three-dimensional |
| CN110196009A (en) * | 2019-06-21 | 2019-09-03 | 桂林电子科技大学 | A kind of measurement of wiring board solder joint bending Stress displacement and positioning auxiliary device |
| CN210719962U (en) * | 2019-09-23 | 2020-06-09 | 成都航空职业技术学院 | Circuit board solder joint bending stress experimental apparatus |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100396430C (en) | Installation method of linear guide rail and installation structure thereof | |
| CN210719962U (en) | Circuit board solder joint bending stress experimental apparatus | |
| CN207798993U (en) | USB plugs measurement jig | |
| CN110095216A (en) | A kind of two dimension prestress application device and its working method | |
| CN103399176A (en) | Test system for acceleration sensor | |
| CN110501228A (en) | Wiring board solder joint bending stress experimental provision | |
| CN201569623U (en) | Device for testing maximum static friction coefficient on surface of rod piece | |
| CN105823421A (en) | Car dashboard crossbeam automatic detection device | |
| US20080122468A1 (en) | Probe holder for a probe for testing semiconductor components | |
| US7859278B2 (en) | Probe holder for a probe for testing semiconductor components | |
| CN208488085U (en) | A kind of linear guide mounting hole spacing cumulative measurement mechanism | |
| CN210180812U (en) | Mechanical property test device for anti-dazzle plate | |
| CN201945507U (en) | Micro-welding micro-tensile meter | |
| CN105651438A (en) | Relay spring load characteristic testing device | |
| CN114427928A (en) | Multi-direction disturbance force testing device and testing method for cable | |
| CN102128746A (en) | Microscopic welding micro-tensile measuring instrument | |
| CN201615857U (en) | Fatigue tester with reading microscope | |
| CN204988247U (en) | Work piece height finding device | |
| CN209182156U (en) | Knob three-dimensional pressure test machine | |
| CN211477846U (en) | Special clamp for tensile testing machine | |
| KR20080088905A (en) | A tensile tester | |
| CN209372561U (en) | A kind of pcb board tensile test auxiliary apparatus for leveling | |
| CN200989909Y (en) | Vernier adjustable PCB test device | |
| CN209327401U (en) | A kind of gauge head bracket of flying probe tester | |
| CN2754107Y (en) | Needle-mounted carriage for electronic circuit board measuring machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |