200814878 — 九、發明說明： 【發明所屬之技術領域】 —本發明係關於一種對應於高密度化之電子零件之安壯 密度且折曲使用之撓性印刷線路基板及半導體裝置。更: 細而言，本發明係關於安裝用以驅動液晶顯示震置、帝: 顯示裝置等平面顯示面板之電子零件（IC晶片等），且、= =使用之撓性印刷線路基板及安裝有電子零件的半 【先前技術】 如眾所周知，用㈣動電子機器之電子零件 二 =:由絕緣_、及形成在該絕緣薄膜表面：線： ㈤木斤構成之線路基板的狀態，組裝於 基板係可藉由例如在絕緣璋膜之矣；范：成-该線路 社、巴緣/專膜之表面配置銅落等導電性全 二：二用光微影技術選擇性對導電性金屬蕩進行钱刻 "此作為導電性金屬箱所使用之銅縞有輥乾甸 Μ、電解裝}猪，相ώ μ細^ 平把乳鋼 —由純軋銅#比電解銅荡昂貴等理由， 口此ν電性金屬箔通常係使用電解銅箔。 極盘=銅落係藉由使含有銅之電解液流動在旋轉鼓之陰 門”沿者該陰極而形成的陽極之間，並將錢施加在^ 間’使崎出在雜鼓狀之陰極表面而$造者。 如上所4，在翁電解㈣時作為陰極 的表面係以例如鈦所形成，且研 面疋^ 面。因并，妞二 适^丁唧居便具表面成為鏡 §Λ紋轉鼓狀之陰極表面的銅之析出 面，係將旋轉鼓壯险托—* 啊出開始 疋轉豉狀陰極之表面狀態予以轉印而成為鏡面， 318829 5 200814878 ’表面粗度（Rz)非常低，通常被稱為光澤面）。另 方面，銅所析出之面，由於從電解液析出銅而使銅結晶 成長，因此通常表面粗度（Rz)比S面粗，相對於光澤面（§ 面）稱之為無光澤（mat)面（M面）。 製造線路基板時，通常以電解銅羯之M面與絕緣薄膜 之表面相對向之方式配置電解銅箔，並積層電解銅箔與絕 緣薄膜而衣造基材薄膜，並且在形成該基材薄膜之電解銅 箔的S面表面形成感光性樹脂層，將該感光性樹脂層予以 ⑩曝光、顯影，而形成由感光性樹脂之硬化體構成之圖案， 以該圖案作為遮罩材選擇性蝕刻電解銅箔，而形成線路圖 案。 關於如以上方式形成之線路基板，係期望絕緣薄膜與 形成在該絕緣薄膜上之線路圖案的密接性高，而該絕緣薄 膜與線路圖案之密接性係取決於形成線路圖案之電解銅落 之Μ面的表面粗度，因此電解銅箱之M面的表面粗度較 #佳料某種程度之高粗度。因此，為了提高所製造之電解 銅荡之Μ面的表面粗度，係進行突粒形成處理等粗化處 理，亦進行提高電解銅箱之Μ面的表面粗度而提升與 溥膜之密接性的處理。 如上所述’使電解銅箱之Μ面表面粗面化的方法，係 在使所形成之線路圖案與絕緣薄膜之密接性提升的方 常理想，但在選擇性钱刻電解銅箱而形成線路圖孝時 面粗度高之Μ面不4有利。例如’欲形成間距寬度窄: 極精細線路圖案時，無法將使用之電解銅荡的厚度設定為 318829 6 200814878 比欲形成之線路的寬度厚，因此必須減短用以形成線路圖 案之蝕刻時間，但Μ面之表面粗度高的話，埋設在絕緣薄 膜内之銅的數量亦會變多，在短時間之蝕刻中，難以將埋 6又在絶緣薄膜内之銅完全去除，且欲將所埋設之銅完全去 除時，容易產生所形成之線路圖案過度被蝕刻且變細等問 題。 、 ^然而，使用上述電解銅箔來形成時，所使用之電解銅 f必須使用與欲形成之線路圖案之最細線寬相等或比該線 覓更薄之電解銅箔，例如在製造一般精細間距朽伙… 之印刷線路基板的内部引線之線路間距寬度為(内 部引線寬度通常為35/zm左右）的印刷線路基板時，係使 用35至40//m之電解銅箔-。 然而，最近電子零件變得更高密度化，必須使形成在 該電子零件安裝所使狀印㈣路基板線路圖案更加 化。 然而，可在使用上述電解㈣之製造方法中製造之印 刷線路基板的線路間距寬度，係以4G#m為㈣ 造線路間距寬度比卿m更㈣印㈣路基板，I法直ς 知用習知之印刷線路基板的製造方法，必 條件、形成所❹之電解㈣之純料疋钱刻 .r, 饤氐寻綠路圖案的全條件。 '，在絕緣薄膜之表面形成線路圖案時 :距寬度未達4。,m之條件形成線路圖案的情況下，：： =電解㈣必須使用比形成的線路寬度更薄者， 讀鋼辖…之表面粗度係成為比所使用之電解鋼 318829 7 200814878 —之厚度大的値。因此，為了藉由蝕刻完全去除埋設在絕緣 薄f表面之電解銅羯的M面之突起而增長與蝕刻液之接 觸日寸間時，會發生所形成之線路被蝕刻液浸蝕而變細的問 題，而热法形成預定之精細間距的線路圖案。如此，為了 衣&線路間距見度未達4Q # m之印刷線路基板，必須重新 選定所使用之電解銅箔、蝕刻方法等。 在七h況下"J开》成線路間距寬度未達# m之線路 圖案的電解銅落’有以下專利文獻所記載之低剖面(L〇w Profile)電解銅f|，例如日本㈣平9_i43785號公報（專利 文獻1)、日本特開2002-32586號公報（專利文獻2)、日本 特開2_-162144號公報（專利文獻3)、日本特開細心 35州號公報（專利文獻4)、彻勘舰π號公報（專利 ^獻5)、日本特開2〇〇4·1〇7786號公報（專利文獻〇、日本 ㈣2_-137588號公報（專利文獻7)、日本特開綱_ 4 9號公報（專利文獻8)、日本特開2004-3396558號公 10)(^利^丨9)、日本特開2005·150265號公報（專利文獻 、天。二_ 〇1|、面電解銅荡係在溶解有銅之電解液添加各種 者片二而減低所形成之電解銅箔的Μ面表面粗度(Rz) 添加劑之種類，可使所獲得之電解銅謂之Μ面的 义"且又(Rz)比S面之表面粗度㈣更低。如此所形成之 低剖面電解銅箔係在使 物，於銅析出時遍中調配各種添加 將所詩之^將析出銅之粒子徑減小，以 、二亍二解銅治的表面之剖面抑制為較低者。 …、而。己载在上述專利文獻的低剖面電解銅落，由於 318829 8 200814878 所形成之銅的結晶粒子徑小，因此電解銅箔本身之引拉強 度等機械特性容易變低。 在安裝有驅動例如液晶顯示裝置、電漿顯示拿置等平 面顯示器的電子零件之撓性印刷線路基板中，在枝面板 7背面側配置硬f之電路基板，將安裝有電子零件之印刷 =基板：曲來使用，並連接該硬質電路 面面板之透明電極。在如此折曲使用之印刷在： 加有非常大之f曲應力於折土板 解錮嚐斛氺士 + & 巧囬丨刀就由機械特性低之電 力的=形成之線路而言，會有無法抵抗如此大之彎曲應BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible printed wiring board and a semiconductor device which are used in accordance with the density and density of electronic components of high density. More specifically, the present invention relates to an electronic component (IC chip, etc.) for mounting a flat display panel such as a liquid crystal display, a display device, and the like, and == used flexible printed circuit substrate and mounted thereon Half of the electronic component [Prior Art] As is well known, the electronic component of the (4) electro-optical device is used: in the state of the insulating substrate, and on the surface of the insulating film: the wire: (5) the circuit board composed of the wooden pin, assembled in the substrate system For example, in the insulating ruthenium film; Fan: Cheng - the line of the line, the edge of the edge of the film / the surface of the film is equipped with copper and other conductive two: two light lithography technology selective exchange of conductive metal Engraved "This copper bead used as a conductive metal box has a roll of dry enamel, electrolytic equipment} pig, phase ώ μ fine ^ flat put the milk steel - from pure copper # expensive than electrolytic copper, etc. The ν electrical metal foil is usually made of electrolytic copper foil. The pole plate = copper drop is caused by flowing a copper-containing electrolyte between the anodes of the rotating drum and the cathode formed by the cathode, and applying money to the cathode surface of the drum. As shown in the above 4, in the electrolysis of electrolysis (4), the surface of the cathode is formed of, for example, titanium, and the surface of the surface is 疋^. Because of the combination, the Niu Ershi ^ Ding Yuju has a surface that becomes a mirror § Λ The surface of the copper on the drum-shaped cathode surface is transferred to the surface of the cathode and transferred to the mirror surface. 318829 5 200814878 'The surface roughness (Rz) is very high. Low, usually referred to as a glossy surface. On the other hand, in the surface where copper is precipitated, since copper crystals are grown by depositing copper from the electrolytic solution, the surface roughness (Rz) is generally thicker than the S surface, relative to the shiny surface (§ The surface is called a mat surface (M surface). When manufacturing a circuit board, the electrolytic copper foil is usually placed so that the M surface of the electrolytic copper crucible faces the surface of the insulating film, and the electrolytic copper foil is laminated and insulated. Film-forming a substrate film, and forming the substrate film A photosensitive resin layer is formed on the surface of the S surface of the copper foil, and the photosensitive resin layer is exposed and developed to form a pattern of a cured resin of a photosensitive resin, and the electrolytic copper is selectively etched using the pattern as a mask. In the case of the wiring substrate formed as described above, it is desirable that the insulating film has high adhesion to the wiring pattern formed on the insulating film, and the adhesion between the insulating film and the wiring pattern depends on the formation of the wiring. The surface roughness of the surface of the electrolytic copper of the pattern is such that the surface roughness of the M surface of the electrolytic copper box is somewhat higher than that of the #good material. Therefore, in order to improve the surface of the electrolytic copper produced The surface roughness is a roughening treatment such as a grain formation treatment, and the surface roughness of the surface of the electrolytic copper box is increased to improve the adhesion to the ruthenium film. The method of roughening the surface is ideal for improving the adhesion between the formed line pattern and the insulating film, but the surface is thick when the electrolytic copper box is selectively formed. It is not advantageous to have a high surface. For example, 'the width of the pitch to be formed is narrow: When the pattern is extremely fine, the thickness of the electrolytic copper to be used cannot be set to 318829 6 200814878. The width of the line to be formed is thicker, so it must be shortened. In order to form the etching time of the wiring pattern, if the surface roughness of the surface is high, the amount of copper buried in the insulating film is also increased, and in a short etching time, it is difficult to embed the copper in the insulating film. When it is completely removed, and the copper to be buried is completely removed, the formed wiring pattern is likely to be excessively etched and thinned. However, when the above-mentioned electrolytic copper foil is used for forming, the electrolytic copper f used must be used. An electrolytic copper foil which is equal to or thinner than the thinnest line width of the line pattern to be formed, for example, a line pitch width of an inner lead of a printed wiring board in which a general fine pitch is formed is (internal lead width is usually In the case of a printed wiring board of about 35/zm, an electrolytic copper foil of 35 to 40/m is used. However, recently, electronic components have become more dense, and it has been necessary to make the wiring pattern of the printed circuit board formed on the electronic component mounting. However, the line pitch width of the printed circuit board which can be manufactured in the manufacturing method using the above electrolysis (4) is 4G#m (4). The line pitch width is more than the (4) printing (four) road substrate. Knowing the manufacturing method of the printed circuit board, it is necessary to form the conditions of the pure electrolysis (4) of the electrolysis (4), and to find the full condition of the green road pattern. 'When a line pattern is formed on the surface of the insulating film: the width is less than four. In the case where the condition of m forms a line pattern, :: = electrolysis (4) must be used to be thinner than the formed line width, and the surface roughness of the steel is ... is greater than the thickness of the electrolytic steel used 318829 7 200814878 Hey. Therefore, in order to completely remove the contact between the etching liquid and the etching liquid by the protrusion of the M surface of the electrolytic copper crucible embedded in the surface of the insulating thin f, the formed line is etched and thinned by the etching liquid. And the thermal method forms a predetermined fine pitch line pattern. Thus, in order to obtain a printed circuit board having a line spacing of less than 4Q #m, it is necessary to reselect the electrolytic copper foil to be used, the etching method, and the like. In the case of seven hours, "J open" is a low-profile (L〇w Profile) electrolytic copper f|, such as the Japanese (four) flat, which has a line spacing width of less than #m. Japanese Laid-Open Patent Publication No. Hei. No. 2002-32586 (Patent Document 2), JP-A-2002-32144 (Patent Document 3), Japanese Patent Laid-Open Publication No. 35-1995 (Patent Document 4)彻 勘 π π π 专利 专利 专利 专利 专利 π π π π π π π π π π π π π π π π π π π π π π π π π π π π π π π π π π π π π π π π π π π π π π Japanese Patent Publication No. 9 (Patent Document 8), Japanese Patent Laid-Open No. 2004-3396558, No. 10) (^利^丨9), Japanese Patent Laid-Open No. 2005-150265 (Patent Literature, Day. II_〇1|, Surface Electrolytic Copper By adding various kinds of electrolytes to the electrolyte in which copper is dissolved, and reducing the type of surface roughness (Rz) additive of the formed electrolytic copper foil, the obtained electrolytic copper can be said to have the same meaning. And (Rz) is lower than the surface roughness (four) of the S surface. The low profile electrolytic copper foil thus formed is used as a material to precipitate copper. In the middle of all kinds of additions, the particle diameter of the precipitated copper is reduced, and the surface profile of the surface treated by the second bismuth solution is lower. ..., the low profile electrolysis described in the above patent document. In the copper drop, since the crystal particle diameter of copper formed by 318829 8 200814878 is small, the mechanical properties such as the tensile strength of the electrolytic copper foil itself are likely to be low. A flat panel display such as a liquid crystal display device or a plasma display device is mounted on the drive. In the flexible printed circuit board of the electronic component, a circuit board of a hard f is placed on the back side of the branch panel 7, and a printed circuit of the electronic component is mounted, and the transparent electrode of the hard circuit panel is connected. The printing used for such flexing is: Adding a very large f-curvature to the folding board to solve the gentleman + & The returning knives are based on the electric line with low mechanical characteristics = Unable to resist such a big bend
高佥:::之ΐ最近，伴隨著往地面數位播放之轉變，因 同旦貝衫像之導入而使平面顯示面板大 U 面顯示面板逐漸大型化，但驅動該 1然平 件卻小型化且高密度化.，以1個 ^1反之電子零 係在增加令。例如u ^子々件所驅動之通道數 例如，為了驅動128〇χ1〇2 衣置，現在使用之液晶顯示裳置係在液晶素藏示 側配置8個每1個電子零件之有效通道數為^之源極 子零件，以驅動該液晶顯示褒置，為彻通道的電 裝置普及而降低成本之一環，係堂^為，了使液晶顯示 之有效通道數，以減少配 ^ θ加母1個電子零件 ^ 子零件數。 在安裝此種經小型化且每 多之電子零件的印刷線路基板中有效通道數 線之線路間距寬度會小於仂 衣^子令件之内部％ 須細線化為20 # m左右。 内邛引線之引線寬度必 318829 9 200814878 為了形成如此經細線化之線路 線路間距貧声盘7n 丄 〇水 备然無法使用在 难田 ㈣左右時所使用之電解射^里土 使用上述低剖面泰妒加# 〜电解銅治’如果未 Λη 面电解銅蕩，則無法形成線路間距嘗 40#m之線路圖案。 * &峪間距見度未達 二、、'而，由上述低剖面電解銅箔所 玫 結晶粒子小，因并古杯Aμ m 乂成之線路，由於銅 之__ j ㈣錢時該折曲部分Gao Wei::: ΐ Recently, with the change of the digital display to the ground, the large U-side display panel of the flat display panel has been gradually enlarged due to the introduction of the same jersey, but the miniaturization of the flat panel is driven. And high density., with 1 ^ 1 and vice versa, the electronic zero system is increasing. For example, the number of channels driven by the u ^ sub-assembly is, for example, in order to drive the 128〇χ1〇2 clothes, the number of effective channels for each of the eight electronic components is set on the liquid crystal display side. ^The source part of the source, in order to drive the liquid crystal display device, to reduce the cost of the channel for the popularization of the electric device, the system is to make the number of effective channels of the liquid crystal display to reduce the number of θ plus 母Electronic parts ^ Number of sub parts. In the printed circuit board on which such a miniaturized and various electronic parts are mounted, the line pitch width of the effective channel number line is smaller than the internal % of the package, which must be thinned to about 20 #m. The lead width of the inner lead wire must be 318829 9 200814878 In order to form such a thin line, the line spacing is poor. The sound plate 7n can not be used in the difficult field (four) or so.妒加# ~ Electrolytic copper treatment 'If you do not Λ surface electrolytic copper sway, you can not form a line pattern of 40#m line spacing. * & 峪 见 见 未 见 见 见 ' ' ' ' ' 而 由 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低section
Si 情形多之問題。為了使由該低剖面電解銅；There are many problems with Si. In order to make electrolytic copper from the low profile;
/成之線路不會在折曲部分斷裂下ρ 因應’即例如對低剖面電解㈣之MJ=;:手段來 升盥絕緣每蹬夕〜/ 進订粗化處理，提 、告：之：： 與絕緣薄膜共同防止因折曲部分 = 、、、’但若如上述低剖面電解銅箔一 =距之線路圖案，且電解銅荡本身具有可抵抗= ==強度的話’則即使在折曲使用印刷線路基‘ 可實現更進ΐ 本身之強度變高，而 J貝現更進一步之細線化。 ⑩（專利文獻U日本特開平9-143785號公報 (專利文獻2)日本特開2002-32586號公報 (專利文獻3)日本特開2004· 162144號公報 (專利文獻4)日本特開2004-35918號公報 (專利文獻5)W〇20〇3/〇96776號公報 (專利文獻6)日本特開2004-107786號公報 (專利文獻7)日本特開2〇〇‘ 137588號公報 (專利文獻8)日本特開2004-263289號公報 (專利文獻9)曰本特開2004-3396558號公報 318829 10 200814878 -(專利文獻l〇)曰本特開2005-150265號公報 【發明内容】 (發明所欲解決之課題） 本發明之目的在於提供一種儘管為非常精細間距，但 亦具有引拉強度及耐折性等良好之特性的撓性印刷線路基 板。 再者，本發明之目的在於提供一種最窄部之内部引線 之線路間距寬度未達4 〇 # m之非常精細間距的挽性印刷線 修路基板，其所形成之線路本身之機械強度高，即使例如折 曲使用時折曲部分及連接端子附近之線路也不容易斷線。 此外，本發明之目的在於提供一種用以驅動在上述撓 性印刷線路基板安裝有電子零件之顯示裝置的半導體装 置。 、 (解決課題之手段） ，本發明之撓性印刷線路基板係具有將電解銅箔層之表 Φ 形成有水^亞胺層之基材薄膜之電解銅箔層予以選擇性 蝕刻而形成之線路圖案，並使該線路圖案與聚醯亞胺層一 2折曲使用之撓性印刷線路基板，而該線路圖案係由··包 ^具有3/zni以上之長徑長度之柱狀的銅結晶粒子、且由 厚度15Mm以下、在25ΐ下之伸展率為5%以上之電解銅 箔所形成。 力再者，較佳為本發明之印刷線路基板十，形成上述電 解鋼癌之柱狀的銅結晶粒子之至少一部分，係具有比線路 圖案之厚度更長之長徑，具體而言，更佳為，上述線路圖 318829 11 200814878 Λ案之剖面之銅結晶粒子的至少50% (面積比率），係為具有 比線路圖案之厚度更長之長徑的銅結晶粒子。μ… 具有由具備該銅結晶粒子之電解銅箱所形成之線路圖 案的撓性印刷線路基板，係具有非常高之耐折性，以彎曲 半徑0.8mm、彎曲角度±135度、彎曲速度1?5rpm、:加 負載100gf/10mmw之條件，在25。〇下進行測量時，至少一 部分之線路圖案至斷線為止之耐折性通常為1〇〇次以上。 ^再者，本發明之撓性印刷線路基板，較佳為在電解銅 ⑩vl之Μ面塗布聚醯亞胺前驅體（precurs〇r)，並且在該電解 銅箔上形成聚醯亞胺層，如此形成之聚醯亞胺層的光線穿 透率較佳為超過67%、95%以下。 該聚醯亞胺層之露出面之表面粗度係取決於所使用之 電解銅箔之Μ面的表面粗度（Rz)，一般而言係轉印所使用 之電解銅箔之Μ面的表面狀態、或經粗化處理之M面的 表面狀態。因此，本發明中，所使用之電解銅箔之M面的 ⑩表面粗度（Rz)為5//m以下，因此將該電解銅箔積層而轉 印有其表面狀態之聚醯亞胺層之表面的表面粗度（Rz)成為 5/zm以下。如此形成之聚醯亞胺層的光穿透率會變高，在 將電子零件安裝在本發明之撓性印刷線路基板時等，可從 本發明之撓性印刷線路基板之聚醯亞胺面侧照射光，並且 了將CCD知相機專檢測裝置配置在撓性印刷線路基板之 承it亞胺面側’當從本發明之撓性印刷線路基板之聚醯亞 胺面側照射之光線穿透未形成線路圖案之聚醯亞胺層後， 才双測反射於半導體晶片而返回之光線，藉此可正確地進行 12 318829 200814878 配置在撓性印刷線路基板之圖案面側的半導體晶片之定 位。 此外本發明之半導體裝置係在上述撓性印刷線路基 板安裝有640至l280ch/IC之電子零件而構成，且為LCD 等顯示裝置之驅動半導體裝置。 該半導體裝置之每1個電子零件之有效通道數多，因 此可減少配置在平面顯示器(Flat Panel Disp㈣面板之源 極側的印刷線路基板之數量。而且，即使折曲使用該换性 印刷線路基板’線路亦不會在撓性印刷線路基板之折曲位 置及連接端子附近斷裂。 (發明之效果） 形成在本發明之撓性印刷線路基板的線路圖案，厚肩 為15㈣以下’在25t下的伸展率為祝以上，主要由^ 解銅落所形成、而該電解㈣係由具有〜m以上之長和 ^度之柱狀㈣結晶粒子所構成。如此本發明之撓性印刷 ^路基板與習知之低剖面電解㈣不同，形成電解銅箱之 ，粒子_常大’而藉由如此增大銅結晶粒子，即可形成 圖案的細線化技術，係藉由使二：至目前為止之線路 減小，而使用低剖面電：=解㈣之銅結晶粒子 叫电鲆硐'，白而成者，但在本發明 =良路基板係根據以下的發現㈣成者，# =反地，藉由使形成電解銅落之銅結晶比形成習知之 ^㈣的^日^子更大’即可形成線路間距寬度小於 # m之非常精細_間距的線路圖案。 、 318829 13 200814878 — #者’ ％此形成本發明之歧印刷線路基板之線路圖 木的粒子係以大型之柱狀之銅結晶作為主成分，因此該線 路圖案之引拉強度變高’且該線路圖案之伸展率變高。而 ^ ’具有該大型銅結晶之電解銅面雖具有與s面同 寻或比s面更低之表面粗度（Rz)，但藉由對該％面均質地 進行粗化處理，則會在與聚醯亞胺層之間顯現出非之 密接性。 口此，藉由使用該銅之粒子徑大之電解銅箔，即可形 籲成線路間距寬度小於· m之非常精細間距的線路圖案， 而且以上述方式形成之線路圖案本身具有非常高之引拉強 度及伸展率。再者，藉由對該電解銅羯之表面均質地進行 粗=處理，在經粗化處理之電解銅落的表面形成由聚酿亞 胺賴體構成之層，並在該電解銅落之表面進行聚酸亞胺 之閉環合（ring 〇1〇印代）反應以積層聚醯亞胺層，而在該電 解銅荡與聚醯亞胺層之間顯現出非常高之密接性。使用 •該電解銅箱與聚醯亞胺層構成之基材薄膜而對電解鋼荡選 5钱刻而形成之線路’其線路本身之機械性強度及伸展 率尚，且與聚醯亞胺層之密接強度亦高。因此，即使形成 線路間距寬度小於40/zm之非常精細間距的撓性印刷線路 基板，形成在該撓性印刷線路基板之線路本身的機械性強 度亦高，即使在折曲使用該撓性印刷線路基板等非常嚴酷 之t卞件下使用，線路圖案亦不會在折曲部等從聚酸亞胺層 剝離’且線路圖案不會斷裂。具體而言，就具有以上述: 解銅簿形成之線路圖案的撓性印刷線路基板來說，以彎: 318829 14 200814878 ，半徑o.、彎曲角度±35度、彎曲速度、施加負 載1〇〇gf/1〇mm W之條件，在坑下進行測量時，至少」 部分之線路圖案至斷線為正之而#折性通常為ι〇〇次以上， 具有非常高之耐折性。 再者，使用該銅結晶粒子徑大之電解鋼荡來形成線路 圖案時，藉由將钱刻液、钱刻條件等設定在適當範圍，可 使所形成之線路圖案之剖面形狀極接近理想剖面形狀之矩 形。 φ 而且該心十生印刷線路基板係可使作為絕緣薄膜之聚 酿亞胺層的光穿透率變高。例如，從該撓性印刷線路基板 =聚酿亞胺面侧照射光，並以配置在該線路基板之聚酿亞 胺面側之檢測裝置來檢測穿透該撓性印刷線路基板後、反 射於半導體晶片而返回之光線，而對所檢測之晝像進行圖 案辨識，藉由上述方式能以高精密度進行本發明之捷性印 刷線路基板的定位。因此，即使在本發明之撓性印刷線路 鲁基板並未形成特別之定位手段’利用所形成之整體線路圖 案亦可正確地進行印刷線路基板之定位，可以更高之精密 度安裝電子零件。 如此，本發明之撓性印刷線路基板係為在習知之光微 影技術法中實質上無法製造者，而為最窄部之線路間距寬 度小於40 之極精細間距的撓性印刷線路基板。而且， 如此形成之線路圖案本身之引拉強度、伸展率等機械特性 亦仏，且線路圖案與作為絕緣薄膜之聚醯亞胺層的密接性 非常鬲，因此作為用在折曲使用之用途、及施加來自外部 318829 15 200814878 ’之應力之用途的極精細間距之撓性印刷線路基板，其有 性非常高。 ^ 【實施方式】 接著，具體說明本發明之撓性印刷線路基板。 本發明之撓性印刷線路基板係為，間距^度最窄之内 部引線的線路間距寬度（P)為小於…m之非常精細間距 化的撓性印刷線路基板，為了達成上述精細間距化， =利用大柱狀之銅結晶粒子佔了大部分之料的電解鋼 所積層之聚醯亞胺層的積層體，形成撓性印刷線路其 板。 1 撓性印刷線路基板係具有最窄部分之線路間 距見度係如上所述小於40# m之 解銅箔的厚度為15"m以丁 s 口木考所使用之電 子度為15#m以下’更佳為5至…以。亦即， =光微影技術法製造撓性印刷線路基板時，所使 =銅落的厚度係根據最窄部分之線路圖 40 “ m時，最細部之線路寬度、、、、見又、於 成適當之線路圖案，電解銅;以下，為了形 路寬度同等或該寬度以下。厂子度係故為與最細部之線 低剖㈡Si用之電解軸系與…咖 丨-、口J m包解銅箔不同，i报 鋼結晶粒子，而且在柱狀夕數個粒子徑大之柱狀的 3㈣以上較柱狀之銅結晶粒子中，存在有具有 第1ΗΛ 的多數個銅結晶粒子。 圖係為了將使用上述電解銅“形成之内部引線 318829 16 200814878 (經去除聚醯亞胺層)之剖面按照各姓 晶粒子而攝影的電子顯” ；°曰曰予乂月確“銅結 drawing) 〇 ，、肩锨鏡知片及其循跡圖（trace :目所不’本發明所使用之 T。’峨銅荡中，存在有長徑以心一、=為 Η子= 示之柱狀的多數個物 二ΓΓ之厚度τ。同等或比τ❶明顯更長，因此形成： 之f生印刷線路基板之線路圖案中，包含具有長徑比 、’、圖案之厚度更長之柱狀的多數個銅結晶粒子。 y成在本fx明之撓性印刷線路基板的線路 有與該電解銅箔之厚产（〜綠,々T 具 予度（~線路圖案之厚度）丁〇同等或比Τ〇 率、雨^ = Γ柱狀結晶粒子在線路圖案之剖面中之面積比 率通吊為佔有50%以上，更佳為佔有7挪以上。 因此，本發明所使用之電解銅落中，長徑未 ==子在旦剖面比率為佔有輸下之量，較佳“ 、…〇以下之里’該等長徑未達3 // m之銅結晶粒子，通 吊舞以填埋長径3/Zm以上之柱狀銅結晶粒子之間隙的方 式存在。 7本發明所使用之電解銅落係如上所述，以高的比率含 有長仅3/zm以上之柱狀的銅結晶粒子者，藉由以高的比 卞3有汶大的柱狀銅結晶粒子，該電解銅箔之M面的表面 粗度⑽)非常低，通常為0.8/zm以下，較佳為（U至、〇·6 Am之範圍内。而且，該電解銅箔之Μ面係非常平滑，沿 318829 17 200814878 者該電解銅箔之流動方向（MD方向），以入射角6〇。將測量 光照射至該電解銅箱之表面，測量以反射角6〇。反射回來 之光的強度，並測置光澤度[Ga(60。）]時，該電解銅箔之光 澤度係顯示600至780之値。該電解銅箔之M面（析出面） 的光澤度[Ga(60 )]之値，大多顯示比電解銅箔之§面（與製 造電解銅時所使用之鼓型電極之表面接觸的面）更高之 値，而顯示出非常高之平滑性。 由於本發明所使用之電解銅箔係含有高比率的長徑之 書柱狀粒子，因此結合力低之粒子界面變少，該電解銅箱呈 有高=引拉強度。在本發明所使用之電解銅箱中，在25^ 下測量之引拉強度通常為33kgf/mm2以上，較佳為％至 kgf/mm。再者’在18(rc加熱6〇分鐘後所測量之引拉 強度通常為3〇kgfW以上，較佳為33至術gfw。亦 P’本發明所使用之電解銅錢如上所述主要由具有3/zm =亡之長徑的柱狀銅結晶粒子所構成，因此具有非常高之 W拉強度。 =’該電解㈣之在坑下的伸展率為冰以上， t為1〇至⑽，且在18代加熱6〇分鐘後之伸展率通 常為8%以上，較佳為1〇 r展手通 ^ '，、、 /°。亦即，如上所述構成本 ^月所使狀電解結晶粒子係具有隸為挪以 ^柱狀結晶粒徑及形態，因此在常溫下呈現非常高之伸 展^而且在加熱至高溫後之伸展率亦顯示非常高的値。 =，在本發明所使用之電解銅落具有非常高之伸展 強度的理由，係由於形成該電解銅謂之鋼的結晶 318829 18 200814878 粒子為柱狀結晶，且其大部分 狀結晶之故。為長么3㈣以上的大型柱 如上所述，由於本㈣所❹之形成铸_之銅粒 狀為大型柱狀結晶，因此引拉強度及伸展率合變 =，故使用該電解銅荡而形成之線路圖案，即使折曲使用 說性印刷線路基板，形成在折曲部分等之線路圖案亦不合 從聚醯亞胺層剝離，且線路圖案不會在折曲部分等斷線。曰 如上所述本發明所使用之電解銅荡係可藉 •酸系銅電解液析出而製造者，而該硫酸系鋼電解液例如^ 有.具有一稀丙基二甲基銨氯化物之類的環狀構造之4級 銨迄聚合物；3-疏基+丙磺酸（pr〇panesulf〇nate)等有機錯 :物„二再者，此時之具有環狀構造之4級銨塩聚 口 =之辰度通常為i至5Gppm之範圍内，有機磺酸之濃度 j常為3至50ppm之範圍内’氯濃度通常為5至5〇ppm之 範圍内。此外，該硫酸系銅電解液之銅濃度通常為％至 • 120g/升之範圍内’自由硫酸濃度通常為6〇至25㈣升之範 圍内。藉由將該硫酸系銅電解液之液溫設定在2〇至6〇1 之範圍内，將電流密度設定為通常之3〇至9〇A/dm2之範 圍内’並使崎出，即可製造本發明所使用之電解銅荡。 利用具有上述組成之硫酸系銅電解液，在上述條件下使銅 析出時，析出銅之大部分會成為具有3#m以上之長徑的 柱狀銅結晶粒子，且析出終了面（析出面二％面）之表 常平滑。 相對於此，習知之低剖面電解銅箱係在使銅析出時所 318829 19 200814878 -= 銅電解液中添加用以形成銅及錯合 =::Γ子變小，使所製造之電解鋼㈣面i 銅結晶粒子的ί低剖面電解銅箱中粒子捏小故存在多數之 ' "、1面，因此所獲得之銅箔之引拉強度、伸展 率專不會像本發明所使用之電解銅箱那様容易變高。： 之表面亦由非常微細之粒子所構成，因二： =面粗度雖會變低，但光澤度[Ga⑽。）]通常顯示未達 600之値’通常光澤度[Ga(6()。)]不會超過⑽。 在本查明中，雖係使用上述電解銅箱與聚 _體的基材薄膜來製造撓性印刷線路基板，但在該= 打係在上述電解銅箔之表面形成聚酿亞胺層 Γ電解銅荡係如上所述，可使％面之平滑性與S面同Ϊ 或該程度以上，因此亦可在電解鋼箱之m面或§面之任一 面形成聚酿亞胺層，但通常係在Μ面之表面形成聚醯亞胺 層。在電解銅落之Μ面形成聚酸亞胺層時，較佳為在表面 處理電解銅箔後形成聚酸亞胺層。在此表面處理之例可列 舉：由在電解銅箱之例如Μ面使銅微細粒子析出附著之所 謂無光澤析出物（burnt depos_覆處理、及用以固定所附 著之銅微細粒子之被覆鑛覆處理所構成之粗化處理；防銹 處理；及耦合劑處理等。 .其中，粗化處理係由無光澤析出物鍍覆處理及被覆鐘 覆處理所構成，無光澤析自物㈣處理係使關濃度為$ 至12g/升左右、自由硫酸濃度為5〇至2〇〇g/升左右之銅濃 度低的鍍覆液’並使用例如驗酉昆、糊精、膠、硫脲等 318829 20 200814878 作為添加劑，通常在液溫15至40°C、電流密度1〇至 50A/dm2之條件下使銅之微細粒子附著在電解銅落之μ面 的處理。再者，被覆鍍覆處理係以上述方式使附著有銅的 微細粒子固定在電解銅落的Μ面之處理，且通常係利用銅 密度50至80g/升左右、自由硫酸濃度5〇至l5〇g/升左右 之銅鍍覆液，在液溫40至5(TC、電流密度〗〇至5〇A/^m2 之條件下以銅鍍覆層覆蓋附著有銅微細粒子之電解銅箔的 析出面之處理。 〆 ► 如上所述進行表面處理，將上述電解銅箔之析出面的 表面粗度（Rz)調整在5/zm以下、較佳為〇1至3#仿之範 圍内、更佳為0.1至2/zm之範圍内。如此藉由進行表面 處理，電解銅箔與聚醯亞胺層之密接性會變高。特別是， 在將本《明之撓性印刷線路基板使用在用以驅動平面 器面板之電子零件的安裝時，必須折曲使用本發明之撓性 印刷線路基板，如上所述藉由進行粗化處理，所形成之線 路即不會從聚酿亞胺層剝離’可防止線路在折曲部分或連 接端子附近斷裂，而且，如上 〆 理，銅亦不會殘留在因蝕刻處理 仃祖化處 路出之聚fe亞胺層的表面。 触明:’雖係、使用上述電解銅fl與聚醯亞胺唇之 積層體的基材薄膜來制；生挺Μ ^ 醯亞胺層亦可將預先作成薄膜 ^ ^ 噶浐屏卢币初 .、、狀之來酼亞胺溥膜與電解銅 體，if 斤出面的表面塗布聚醯亞胺前驅/ The line will not break under the flexion part ρ "that is, for example, the low profile electrolysis (4) MJ =;: means to upgrade the insulation every day ~ / book roughing process, mention:::: Together with the insulating film to prevent the bent portion = , ,, 'but if the low-profile electrolytic copper foil as described above = the line pattern of the distance, and the electrolytic copper sway itself has resistance to = = = strength, then even if used in bending The printed circuit base can achieve a higher level of strength, and the J-be is now further thinned. (Patent Document 3) Japanese Laid-Open Patent Publication No. 2002-32586 (Patent Document 3) Japanese Laid-Open Patent Publication No. 2004-162144 (Patent Document 4) Japanese Patent Laid-Open No. 2004-35918 Japanese Laid-Open Patent Publication No. 2004-107786 (Patent Document 7) Japanese Laid-Open Patent Publication No. Hei. No. 137588 (Patent Document 8) Japanese Laid-Open Patent Publication No. 2004-263289 (Patent Document 9) 曰本开开2004-3396558号 318829 10 200814878 - (Patent Document 1) 曰本开开 2005-150265 [Abstract] (Invented to solve SUMMARY OF THE INVENTION An object of the present invention is to provide a flexible printed wiring board which has excellent characteristics such as tensile strength and folding resistance even in a very fine pitch. Further, it is an object of the present invention to provide a narrowest portion. The wiring of the inner lead having a line pitch width of less than 4 〇# m is a very fine pitch of the printed circuit board, and the formed circuit itself has high mechanical strength, even if it is bent, for example, in the vicinity of the connecting terminal. No line Further, an object of the present invention is to provide a semiconductor device for driving a display device in which an electronic component is mounted on the flexible printed circuit board. (Resolution of the problem), the flexible printed circuit board of the present invention A circuit pattern formed by selectively etching an electrolytic copper foil layer of a substrate film in which a surface of the electrolytic copper foil layer is formed with a water imine layer, and a 20% fold of the wiring pattern and the polyimide layer The flexible printed circuit board used in the curved line, and the line pattern is composed of columnar copper crystal particles having a long diameter of 3/zni or more and having a thickness of 15 Mm or less and an elongation of 5 at 25 ΐ. More preferably, the electrolytic copper foil is formed by a thickness of at least a portion of the columnar copper crystal particles of the electrolytic steel cancer, which is longer than the thickness of the wiring pattern. The long diameter, specifically, more preferably, at least 50% (area ratio) of the copper crystal particles of the cross section of the above-mentioned circuit diagram 318829 11 200814878 is longer than the thickness of the line pattern Long-diameter copper crystal particles. μ... A flexible printed circuit board having a wiring pattern formed by an electrolytic copper box having the copper crystal particles, which has a very high folding resistance with a bending radius of 0.8 mm and a bending angle ± 135 degrees, bending speed of 1?5 rpm, and load of 100gf/10mmw, when measuring under 25 〇, the folding resistance of at least part of the line pattern to the broken line is usually 1 〇〇 or more. Preferably, in the flexible printed circuit board of the present invention, a polyimide precursor is coated on the surface of the electrolytic copper 10vl, and a polyimine layer is formed on the electrolytic copper foil, thus forming The light transmittance of the polyimide layer is preferably more than 67% and 95% or less. The surface roughness of the exposed surface of the polyimide layer depends on the surface roughness (Rz) of the surface of the electrodeposited copper foil used, and is generally the surface of the surface of the electrodeposited copper foil used for transfer. The state of the surface, or the surface of the M surface that has been roughened. Therefore, in the present invention, the surface roughness (Rz) of the M surface of the electrodeposited copper foil used is 10/m or less, so that the electrolytic copper foil is laminated and the polyimide layer of the surface state is transferred. The surface roughness (Rz) of the surface is 5/zm or less. The light transmittance of the polyimide layer thus formed becomes high, and when the electronic component is mounted on the flexible printed wiring board of the present invention, the polyimine surface of the flexible printed wiring substrate of the present invention can be obtained. The side illuminates the light, and the CCD camera-specific detecting device is disposed on the side of the flexible imprinted substrate. When the light is irradiated from the side of the polyimide surface of the flexible printed circuit board of the present invention After the polyimine layer of the line pattern is not formed, the light reflected back on the semiconductor wafer is double-measured, whereby the positioning of the semiconductor wafer disposed on the patterned surface side of the flexible printed circuit board can be correctly performed. Further, the semiconductor device of the present invention is characterized in that the flexible printed circuit board is mounted with electronic components of 640 to 280 ch/IC, and is a driving semiconductor device of a display device such as an LCD. Since the number of effective channels per electronic component of the semiconductor device is large, the number of printed circuit boards disposed on the source side of the flat panel display (Flat Panel Disp (four) panel can be reduced. Moreover, even if the flexible printed circuit substrate is used for bending The line does not break at the bent position of the flexible printed circuit board and the vicinity of the connection terminal. (Effect of the Invention) The line pattern formed on the flexible printed wiring board of the present invention has a thick shoulder of 15 (four) or less 'at 25t' The stretching ratio is mainly composed of copper droplets, and the electrolysis (4) is composed of columnar (four) crystal particles having a length of ~m or more. Thus, the flexible printed circuit board of the present invention The conventional low-profile electrolysis (four) is different, forming an electrolytic copper box, the particle _Chang', and by increasing the copper crystal particles in this way, the pattern thinning technique can be formed by making the line of the second: up to now Small, while using low profile electricity: = solution (four) of the copper crystal particles called electric 鲆硐 ', white, but in the present invention = good road substrate based on the following findings (four) into the adult, # = anti-ground, by By making the copper crystals forming the electrolytic copper larger than the conventional ones (4), a very fine-pitch line pattern having a line pitch width smaller than #m can be formed. 318829 13 200814878 — #者'% The particles of the wiring pattern forming the printed circuit board of the present invention have a large columnar copper crystal as a main component, so that the tensile strength of the wiring pattern becomes high and the stretching rate of the wiring pattern becomes high. 'The electrolytic copper surface with this large copper crystal has a surface roughness (Rz) lower than that of the s surface or lower than the s surface, but by coarsening the % surface homogeneously, it will Between the bismuth imide layers, non-adhesiveness is exhibited. Thus, by using the electrolytic copper foil having a large diameter of the copper particles, a very fine pitch line pattern having a line pitch width smaller than · m can be formed, and The line pattern formed in the above manner has a very high tensile strength and elongation. Further, by uniformly roughening the surface of the electrolytic copper crucible, it is formed on the surface of the roughened electrolytic copper falling surface.聚亚亚赖赖a layer composed of a body, and a ring closure of a polyimine (ring 〇1〇 printing) reaction on the surface of the electrolytic copper falling to laminate a layer of polyimine, and the layer of the electrolytic copper is fused to the polyimide layer There is a very high degree of closeness between the two. The use of the electrolytic copper box and the polyimide film layer formed by the substrate film and the electrolytic steel spliced for 5 money to form the line 'the mechanical strength and extension of the line itself The rate is good, and the adhesion strength to the polyimide layer is also high. Therefore, even a very fine pitch flexible printed circuit board having a line pitch width of less than 40/zm is formed on the line itself of the flexible printed circuit board. The mechanical strength is also high, and even if it is used under a very severe t-bend such as flexographic printed circuit board, the line pattern is not peeled off from the polyimide layer in the bent portion or the like, and the line pattern does not fracture. Specifically, in the case of the flexible printed circuit board having the above-described circuit pattern formed by the copper book, the bending is 318829 14 200814878, the radius o., the bending angle is ±35 degrees, the bending speed, and the load is applied. The condition of gf/1〇mm W, when measuring under the pit, at least the part of the line pattern to the broken line is positive and the fold is usually more than 〇〇 times, which has a very high folding endurance. Further, when the wiring pattern is formed by using the electrolytic steel having a large diameter of the copper crystal particles, the cross-sectional shape of the formed wiring pattern is extremely close to the ideal profile by setting the money engraving liquid, the money engraving conditions, and the like in an appropriate range. The rectangle of the shape. φ and the core printed circuit board can increase the light transmittance of the polyimine layer as the insulating film. For example, the light is irradiated from the surface of the flexible printed circuit board=polyimide surface, and the detection device disposed on the side of the polyimide surface of the circuit substrate detects the penetration of the flexible printed circuit board and reflects it. By returning the light from the semiconductor wafer and patterning the detected artifacts, the positioning of the elegant printed circuit board of the present invention can be performed with high precision by the above method. Therefore, even if the flexible printed circuit board of the present invention does not form a special positioning means, the positioning of the printed circuit board can be accurately performed by using the formed overall wiring pattern, and the electronic parts can be mounted with higher precision. As described above, the flexible printed wiring board of the present invention is a flexible printed wiring board having a fine pitch of less than 40 in the narrowest portion, which is substantially impossible to manufacture in the conventional photolithography method. Further, since the mechanical characteristics such as the tensile strength and the elongation of the circuit pattern formed as described above are also excellent, and the adhesion between the wiring pattern and the polyimide layer as the insulating film is extremely high, it is used for the purpose of bending, And the extremely fine pitch flexible printed circuit board from which the stress of external 318829 15 200814878' is applied is very high. [Embodiment] Next, a flexible printed wiring board of the present invention will be specifically described. In the flexible printed circuit board of the present invention, the line pitch width (P) of the inner lead having the narrowest pitch is a very fine pitch flexible printed circuit board of less than ... m, in order to achieve the above fine pitching, A laminate of a polyimine layer in which a large columnar copper crystal particle occupies a majority of the material of the electrolytic steel layer is formed to form a flexible printed wiring board. 1 The flexible printed circuit board has the narrowest part, and the line pitch is less than 40# m. The thickness of the copper foil is 15"m. The electronic degree used by the Ding Shoumu test is 15#m or less. 'More preferably 5 to... In other words, when the flexible printed circuit board is manufactured by the photolithography method, the thickness of the copper drop is based on the line of the narrowest portion of FIG. 40 "m, the line width of the most detailed portion, and Into the appropriate line pattern, electrolytic copper; below, in order to equal the width of the path or below the width. The factory degree system is the line with the most detailed line (2) electrolytic shaft system for Si and ... curry -, mouth J m solution In the copper foil, a plurality of copper crystal particles having the first enthalpy are present in the columnar copper crystal particles having a columnar shape of 3 (four) or more and having a large particle diameter in the columnar shape. The electrons photographed by the above-mentioned electrolytic copper "formed internal lead 318829 16 200814878 (with the polyimide layer removed) are photographed according to the electrons of each of the surnames; "曰曰 曰曰 乂 确 确 " " " " " " , shoulder mirror and its tracking map (trace: the purpose of the T used in the invention. In the copper sway, there is a long diameter to the heart, = is the scorpion = columnar majority The thickness of the object is τ. It is equal or longer than τ❶, so the shape The circuit pattern of the printed circuit board includes a plurality of copper crystal particles having a columnar shape with a long aspect ratio and a longer thickness. The y is formed on the line of the flexible printed circuit board of the present invention. The electrolytic copper foil is thickly produced (~green, 々T with degree (~ thickness of line pattern), equivalent or specific ratio, rain^ = area ratio of columnar crystal particles in the cross section of the line pattern The hanging is 50% or more, and more preferably 7 or more. Therefore, in the electrolytic copper used in the present invention, the long diameter is not == the sub-denier ratio is the amount of the occupied, preferably ", ... In the following, the copper crystal particles having a length of less than 3 // m are used to fill the gap between the columnar copper crystal particles having a long diameter of 3/Zm or more. 7 Electrolytic copper used in the present invention As described above, when the columnar copper crystal particles having a length of only 3/zm or more are contained in a high ratio, the columnar copper crystal particles having a large ratio of 卞3 are large, and the M of the electrolytic copper foil is The surface roughness (10) of the surface is very low, usually 0.8/zm or less, preferably (U to 〇·6 Am) Moreover, the surface of the electrolytic copper foil is very smooth, along the flow direction (MD direction) of the electrolytic copper foil at 318829 17 200814878, at an incident angle of 6 〇. The measuring light is irradiated onto the surface of the electrolytic copper box. , measured at a reflection angle of 6 〇. The intensity of the reflected light, and measured gloss [Ga (60.)], the gloss of the electrolytic copper foil shows 600 to 780. The electrolytic copper foil M The gloss (Ga(60)] of the surface (precipitation surface) is often higher than that of the surface of the electrolytic copper foil (the surface in contact with the surface of the drum electrode used in the production of electrolytic copper), and Since the electrolytic copper foil used in the present invention contains a high ratio of long-length columnar particles, the interface of the particles having a low bonding force is reduced, and the electrolytic copper box has a high height = pull strength. In the electrolytic copper case used in the present invention, the tensile strength measured at 25 ° is usually 33 kgf/mm 2 or more, preferably % to kgf / mm. Furthermore, the tensile strength measured at 18 (the rc is heated for 6 minutes is usually 3 〇 kgfW or more, preferably 33 to gfw. Also P' the electrolytic copper used in the present invention is mainly composed of 3 as described above. /zm = columnar copper crystal particles of long diameter, so it has a very high W tensile strength. = 'The electrolysis (4) has a stretch rate below the pit, and t is 1〇 to (10), and The elongation rate after heating for 18 minutes in the 18th generation is usually 8% or more, and preferably 1 〇r is extended by ^ ', , , / °. That is, the electrolysis crystal particle system of the present invention is formed as described above. It has a columnar crystal grain size and morphology, so it exhibits a very high elongation at normal temperature, and the elongation after heating to a high temperature also shows a very high enthalpy. =, electrolytic copper used in the present invention The reason for the very high tensile strength is that the crystals which form the steel of the electrolytic copper are 318829 18 200814878. The particles are columnar crystals, and most of them crystallize. The large column of 3 (four) or more is as described above. Because of the large columnar crystals formed by the copper granules formed in this (4), Since the tensile strength and the elongation ratio are changed, the wiring pattern formed by the electrolytic copper is used, and even if the printed circuit board is bent, the wiring pattern formed in the bent portion or the like does not conform to the polyimide layer. The stripping is performed, and the wiring pattern is not broken at the bent portion or the like. As described above, the electrolytic copper swaying system used in the present invention can be produced by depositing an acid-based copper electrolytic solution, for example, There is a 4-stage ammonium-to-polymer with a cyclic structure such as monopropyl dimethylammonium chloride; an organic error such as 3-sulfanyl-propanesulfonic acid (pr〇panesulf〇nate): At this time, the 4-stage ammonium sulfonate having a ring structure is usually in the range of i to 5 Gppm, and the concentration j of the organic sulfonic acid is usually in the range of 3 to 50 ppm. The chlorine concentration is usually 5 to In addition, the copper concentration of the sulfuric acid-based copper electrolyte is usually in the range of % to 120 g/liter, and the free sulfuric acid concentration is usually in the range of 6 to 25 (four) liters. The liquid temperature of the copper electrolyte is set in the range of 2 〇 to 6 〇 1, and the current density is set to In the range of 3 〇 to 9 〇A/dm2, the electrolytic copper swell used in the present invention can be produced by using the sulfuric acid-based copper electrolytic solution having the above composition, and copper is precipitated under the above conditions. Most of the precipitated copper becomes columnar copper crystal particles having a long diameter of 3 #m or more, and the surface of the precipitation end surface (the second surface of the precipitation surface) is often smooth. In contrast, the conventional low profile electrolytic copper box When the copper is precipitated, 318829 19 200814878 -= copper electrolyte is added to form copper and the mismatch =:: the scorpion becomes smaller, so that the fabricated electrolytic steel (four) surface i copper crystal particles of low profile copper Since the particles in the box are pinched, there are a large number of '", one side, and therefore the tensile strength and elongation of the obtained copper foil are not as high as those of the electrolytic copper box used in the present invention. : The surface is also composed of very fine particles, because two: = the surface roughness will be lower, but the gloss [Ga (10). )] usually shows less than 600 通常' usual gloss [Ga(6().)] will not exceed (10). In the present invention, although the flexible printed circuit board is manufactured by using the above-mentioned electrolytic copper box and the base film of the poly-body, the polyamine layer is formed on the surface of the electrolytic copper foil. As described above, the smoothness of the % surface can be made equal to or higher than the S surface. Therefore, the polyimide layer can be formed on either the m side or the § side of the electrolytic steel box, but usually A polyimine layer is formed on the surface of the kneading surface. When the polyimide layer is formed on the surface of the electrolytic copper, it is preferred to form a polyimide layer after the surface treatment of the electrolytic copper foil. Examples of the surface treatment include a so-called matte precipitate in which copper fine particles are deposited and adhered on, for example, a tantalum surface of an electrolytic copper box (burnt depos_coated treatment, and coated ore to fix the adhered copper fine particles). The roughening treatment consisting of the coating treatment; the anti-rust treatment; and the couplant treatment, etc. Among them, the roughening treatment is composed of the matte precipitate plating treatment and the coating bell coating treatment, and the matte precipitation material (4) treatment system A plating solution having a concentration of low to about 12 g/liter and a free sulfuric acid concentration of 5 〇 to 2 〇〇g/liter and having a low copper concentration, and using, for example, 酉 酉, dextrin, glue, thiourea, etc. 318829 20 200814878 As an additive, the fine particles of copper are attached to the surface of the electrode of electrolytic copper at a liquid temperature of 15 to 40 ° C and a current density of 1 to 50 A/dm 2 . In the above manner, the fine particles to which the copper is adhered are fixed to the surface of the electrolytic copper falling, and usually copper plating having a copper density of about 50 to 80 g/liter and a free sulfuric acid concentration of from about 5 to about 15 g/liter is used. Liquid, at liquid temperature 40 to 5 (TC, current density 〇 处理 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 析 析 析 析 析 析 析 析 析 析 析 析 析 析 析 析The surface roughness (Rz) is adjusted to be in the range of 5/zm or less, preferably in the range of 〇1 to 3#, more preferably in the range of 0.1 to 2/zm. Thus, by surface treatment, electrolytic copper foil and The adhesiveness of the polyimide layer becomes high. In particular, when the flexible printed circuit board of the present invention is used for mounting electronic parts for driving a flat panel, it is necessary to bend the flexible printing using the present invention. The circuit substrate, as described above, is subjected to roughening treatment, and the formed line is not peeled off from the polyimide layer. This prevents the line from being broken in the bent portion or the connection terminal. Moreover, as described above, copper is not It will remain on the surface of the polyfeline layer which is formed by the etching process. The touch: "Although, the base film of the laminate of the above-mentioned electrolytic copper fl and polyimine lip is used; The 醯 醯 imide layer can also be pre-formed into a film ^ ^ 噶浐First Lu credits. ,, Hai imine to form the film and the electrolytic copper Pu body, if the surface of the coating come out pounds polyimide precursor
，亚將亞胺前驅體與電解鋼I 式亦可使聚醯亞胺前驅體在電 _…猎此方 私鮮銅泊表面環閉合而形成。 318829 21 200814878 ' 如此形成之聚醯亞胺層之厚度通常為12.5至75/Zm、 較佳為20至75 Am、更佳為20至50/zmi範圍内。本來， 聚醯亞胺樹脂就不是透光性高的樹脂，但藉由以上述厚度 形成聚醯亞胺層，聚醯亞胺層之光線穿透率會超過67%而 在95%之範圍内，因此從本發明之撓性印刷線路基板^聚 醯亞胺面侧照射光時，照射光會穿透未形成線路之部分， 形成有線路圖案之部分並未由照射光所穿透，以ccd照相 機等檢測裝置辯識穿透該撓性印刷線路基板之穿透光線， 籲而可辯識線路圖案之’配置及欲搭載之半導體晶片之位置 等，而使定位精確度顯著提升。 如此從撓性印刷線路基板之聚醯亞胺面側使用ccd 照相機等檢測裝置進行圖案辯識時，較佳為調整聚酿亞胺 層之厚度，俾使聚醯亞胺層之光線穿透率超過、％% 以下、較佳為70%至90%之範圍内。 在本發明之撓性印刷線路基板的形成中，如上所述藉 _由在電解銅箔之表面流延聚醯亞胺前驅體並使之加熱硬化 而形成聚醯亞胺層時，在聚醯亞胺層並未形成元件孔 (device hole) ’因此如上所述形成聚醯亞胺層之薄膜載體係 成為未具有元件孔之C〇F等印刷線路基板。 ★在上述說明中，係例示使用聚醯亞胺前驅體形成聚醯 亞，，之例，但本發明並未限定於此，亦可預先形成聚醯 ，，薄膜，在該聚醯亞胺薄膜形成元件孔等後，與電解銅 /白和層’在如此形成之薄膜載體可形成元件孔，並且可形 成例如TAB带等。 318829 22 200814878 在以JL述^方十 v 的基材薄膜之電之電解銅箱與聚酸亞胺層之積層體 感光性樹脂層曝先β &的表面形成感光性樹脂層’並使該 成之圖案，二^ =影，藉此形成由感光性樹脂硬化體構 形成線路圖案〜案為遮罩材並對電解銅箱進行钱刻，而 部八之繞性印刷線路基板係為如第3圖所示，最窄 口 P刀之内部引線之線 丨取乍 該線路間距寬度(曰讀（P)未達40㈣者，較佳為 在且右兮娩又 以上、未達40/zm之範圍内。 幸間距寬度(P)之捷性印刷線路基… …線見度(w)通常可設為8至2—之寬度。 之法中無法以線路間距寬度（P)小於40 形成续跋^"今線路圖案’但藉由使用上述電解銅落，可 圖案、、。 寬度(P)未達40㈣之非常精細間距的線路 之電述線路間距寬度（P)之線路圖案，係在基材薄膜 哕片5 '白之表面(通常為S面)形成感光性樹脂層，並對 該感光性樹脂層進行曝光、顧 _ 硬化精此形成由感光性樹脂 =化體構叙_，縣以上財切叙_作為 材亚對上述電解銅落進行蝕刻，從而形成者。 端邻方式形成之線路圖案，較佳為以線路圖案之上 二々見度、與線路圖案之下端部(即與聚醯 2圖案的下端部）之寬度間的差變小之方式形成。亦即， 弟3圖所示’較佳為線路圖案之頂部寬度（叫與線路圖 木之底部寬度（ILB)之差小。 318829 23 200814878 如此，為了使線路圖案之頂部寬度（ILT)與線路 底部寬度咖)之差變小，較佳為對上述電解銅荡使用含有 蝕刻抑制效果高之化合物的姓刻液。在此姓刻抑制效果高 ^化σ物可列舉：具㈣基或縣之雜環式化合物、具有 =鍵二二醇類或在具有三鍵之乙二醇類的活性氫上加成 :乳、元之化合物、烷基肌胺酸或烷基肌胺 盘、由芳香族緩酸肝所構成之組群選出之至少 j =或該等的衍生物、如胺基三唾等含有氮原子之三唾系： 其衍生物、缓基笨并 ::ί:合：吏用。藉由在兹刻液調配上述蝕刻抑制效果高之 化合物，即可在經蝕刻而新 口之 上述钱刻抑制效果高之化合物，===銅優先地鍵結 劑被進一步蝕刻的产形 十制"、斤路出之銅因蝕刻 被钱刻，所开二I 圖案之頂部不會過度地 底部寬度卿)之差會變小，可开^ ^(ILT)與線路圖案之 狀的線路圖案。 '成正體剖面接近矩形之形 再者，在此使用之蝕刻劑1 氯化鐵或氯化鋼之蝕刻液。/、刀’較佳為使用含有 以上述方式形成之撓性印 ，部寬度（ILT)與線路圖案之下端部:板’線路圖案之上 第5圖所示可將所形成之線路圖安=广β)之差小，如 矩形。 S木之剖面形狀形成為大略 如第4圖所示將以上述方式形成之線路圖案的剖面形 318829 24 200814878 ’狀形成為矩形時，可將盥z 寬廣，並且可更確垂.壯 笔極的接觸面積確保為 、_ J更確貝地安裝電子零件。 上述係關於主要盥雷心 根據上述方法，外内部引線的記载， 成為大致矩形。之剖面形狀亦可與上述同様地形 再者’如第5圖所干 形成之線路圖案的剖面二方式進純刻，所 路圖案係直線形成。帛5圖# =:二:形成之線 P之線路圖幸的顯心日f/』不線路間距見度⑺為20 線路圖安夕P/、^/放鏡a片之例。在線路圖案與隣接之 酉在呑脸层沾主工 兄妝層之表面。在該露出之聚 ^電解’通常轉印有配置在該聚醯亞胺層之表面 粗产面的表面狀態’因此’聚酿亞胺層之表面The sub-imine precursor and the electrolytic steel type I can also form the polyimine precursor in the electric _... hunting the private copper berth surface ring to form. 318829 21 200814878 The thickness of the polyimine layer thus formed is usually in the range of 12.5 to 75/Zm, preferably 20 to 75 Am, more preferably 20 to 50/zmi. Originally, the polyimide resin is not a resin having high light transmittance, but by forming a polyimide layer with the above thickness, the light transmittance of the polyimide layer exceeds 67% and is within 95%. Therefore, when the light is irradiated from the side of the flexible printed circuit board of the present invention, the irradiated light penetrates the portion where the line is not formed, and the portion where the line pattern is formed is not penetrated by the irradiated light, so that ccd The detecting device such as a camera recognizes the transmitted light that penetrates the flexible printed circuit board, and can recognize the position of the circuit pattern and the position of the semiconductor wafer to be mounted, etc., so that the positioning accuracy is remarkably improved. When pattern identification is performed from a polyimide surface of a flexible printed circuit board using a detection device such as a ccd camera, it is preferred to adjust the thickness of the polyimide layer to illuminate the light transmittance of the polyimide layer. Exceeding, %% or less, preferably 70% to 90%. In the formation of the flexible printed wiring board of the present invention, as described above, the polyimine layer is formed by casting a polyimide precursor on the surface of the electrolytic copper foil and heat-hardening it to form a polyimide layer. The imide layer does not form a device hole. Therefore, the film carrier forming the polyimide layer as described above is a printed circuit board such as C〇F having no element holes. In the above description, the polyimine precursor is used to form a polyfluorene, for example, but the present invention is not limited thereto, and a polyfluorene, a film, and a polyimide film may be formed in advance. After the element holes or the like are formed, the film holes thus formed can be formed with the electrolytic copper/white and layer ', and a TAB tape or the like can be formed, for example. 318829 22 200814878 A photosensitive resin layer is formed on the surface of the laminated photosensitive resin layer of the electrolysis copper box and the polyimide layer of the substrate film of JL, which is described as JL, and the photosensitive resin layer is formed. Formed into a pattern, two ^ shadow, thereby forming a line pattern formed by a photosensitive resin hardened body ~ the case is a mask material and the electrolytic copper box is engraved, and the part of the winding printed circuit board is as As shown in Fig. 3, the line of the inner lead of the narrowest P-knife is taken to the width of the line (the reading (P) is less than 40 (four), preferably it is more than 40/zm. Within the range. Fortunately, the width of the pitch (P) is good for the printed circuit. The line visibility (w) can usually be set to a width of 8 to 2. The method cannot be formed by the line pitch width (P) less than 40. ^"The current line pattern', but by using the above-mentioned electrolytic copper drop, the line pattern of the line pitch width (P) of the line of the very fine pitch of the width (P) which is less than 40 (four) is based on The film of the film 5' white surface (usually the S surface) forms a photosensitive resin layer, and the photosensitive resin layer Exposure, _ hardening, formation by photosensitive resin = chemical body _, the county or above _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Preferably, the difference between the width of the line pattern and the width of the lower end portion of the line pattern (ie, the lower end portion of the pattern of the poly 2) is reduced. The width of the top of the line pattern is smaller than the width of the bottom line (ILB) of the circuit diagram. 318829 23 200814878 Thus, in order to make the difference between the top width (ILT) of the line pattern and the width of the line bottom, It is preferred that the above-mentioned electrolytic copper swells a compound with a high etching-inhibiting effect, and the inhibitory effect is high. The sigma compound can be exemplified by a heterocyclic compound having a (four) group or a county, and having a bond of two or two. An alcohol or an active hydrogen addition to an ethylene glycol having a triple bond: a milk, a compound of a compound, an alkyl creatinine or an alkyl myosamine disk, and a group consisting of aromatic acid-lowering liver At least j = or such derivatives, such as amines, saliva, etc. a tri-salt containing a nitrogen atom: a derivative thereof, a buffer base, and a compound having a high etching inhibition effect in the etching solution, which can be etched and newly opened. The compound with high suppression effect of the money, === copper preferentially is further etched by the bonding agent, and the copper of the copper is etched by the money, and the top of the pattern is not excessively The difference between the bottom width and the width will be smaller, and the line pattern of ^^(ILT) and the line pattern can be opened. 'The shape of the positive body is close to the shape of the rectangle. Further, the etchant 1 is an etchant of ferric chloride or chlorinated steel. /, the knife 'is preferably used to contain the flexible printing formed in the above manner, the width of the portion (ILT) and the lower end of the line pattern: the board's line pattern shown in Figure 5 can be formed on the line diagram = The difference between the wide β) is small, such as a rectangle. The cross-sectional shape of the S-wood is formed to be roughly as shown in FIG. 4, and the cross-sectional shape of the line pattern formed in the above manner is 318829 24 200814878', and the 盥z is wide and can be more sure. The contact area ensures that the electronic components are installed in a more secure manner. The above is mainly about the center of the thunder. According to the above method, the description of the outer inner lead is substantially rectangular. The cross-sectional shape may also be purely engraved with the cross-sectional pattern of the above-mentioned homogenous topography and the line pattern formed as shown in Fig. 5, and the road pattern is formed linearly.帛5图# =: 2: The line of formation P The circuit diagram of the P diagram of the fascinating day f / "Do not line spacing visibility (7) for the 20 line diagram An Xi P /, ^ / put a mirror example. On the surface of the line and the adjoining layer, the surface of the main workman's makeup layer is on the face. The exposed polyelectrolyte is usually transferred to a surface state of the surface of the surface of the polyimine layer.
^1；Ψ ^印所使用之電解㈣的Μ面之表面I態1 以該鉻出之聚醯亞胺層的表面粗度（R 下，較佳為在0.1至之範圍内。 ，、、、㈣以 而且，藉由採用上述餘刻法，如第5圖所示形成之線 =案會成為非常直線性。以習知方法形成之撓性印刷線 路基板係如第6圖所示，其剖面形成為梯形，且所形成之 線路圖案的直線性會變低。此外，如上所述在習知之方法 中，由於線路間距寬度⑺不會小於4〇心，因此第6圖所 不之線路圖案之線路間距寬度（1>)為45#m。 ^如此藉由設定適當蝕刻條件，即可形成具有更接近矩 形之剖面形狀的線路圖案。如此進行蝕刻後，所使用之遮 罩材係可猎由驗洗浄等容易地去除。 “' 318829 25 200814878 •、如此形成之線路圖案係如第2 * 所被覆’俾使作為連接端；都 /、由保濩樹脂層 ’ 丁口之輸入侧外 内部引線、輸出側内部引線、輪出側外部;:、線、輸入側 出。該樹脂保護層亦可為利 為等引線部露 之硬化之阻鮮層，亦可為將在薄膜Z技術塗布樹脂並使 性樹脂層之積層體穿孔成所希望之形=方的面形成有接著 附在線路圖案之預定部位的覆蓋層π/丨亚將該積層體貼 如上所述，由阻銲層或覆蓋層霖: 處理。在此採用之錄覆處理有_處理、鍍:广系被鑛覆 金處理、鍍鎳處理、鍍銲錫卢 、’又土处理、鍍鎳_ #理、获納卢理供^、免 '’又热錯銲錫處理、鑛鋅 :理：銅處理、鐘銀處理等。該等 辛 亦可組合複數個錢覆處理來進行。再者 ^J獨進订 銲層及覆蓋層被覆線路圖荦 :亦可在以上述阻 後，形成阻銲層或貼附覆蓋層^的進订上述錢覆處理之 内。如此形成之鏡覆層的厚度通常在〇1至1〇㈣之範圍 所干如彻阻鲜層或覆蓋層後 即可獲得半導體裝置。于”子令件進仃樹脂封裝， 構成本發明之撓性印刷線路基板之聚醯亞胺層係形成 ί吊涛’因此光穿透率高’藉由從撓性印刷線路基板之聚 =胺面侧照射光時之穿透光，可辨識形成於撓性印刷線 路基板之線路圖案的形狀，藉此方式能以非常高之精密度 進仃定位’並安裝電子零件以製造本發明之半導體襄置。 318829 26 200814878 安裝在本發明之撓性印刷線路基板的電子零件，較佳 為配置在LCD顯示裝置、？0卩顯示裝置之類的顯示裝置之 驅動器。此種顯示裝置之驅動器的通道數係逐漸增多為每 一個電子零件之通道數為 128ch/lIC、256ch/lIC、 512ch/lIC，本發明之撓性印刷線路基板係適用於安裝具有 640ch/lIC至1280ch/lIC之有效通道數的電子零件的情 形。特別是，本發明之撓性印刷線路基板係適用於安裝像 素為100萬以上之顯示裝置的驅動器1C之情形。^1; 表面 印 电解 电解 电解 电解 电解 电解 电解 电解 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面And (4) and by using the above-described residual method, the line formed as shown in Fig. 5 becomes very linear. The flexible printed circuit board formed by a conventional method is as shown in Fig. 6, The cross section is formed in a trapezoidal shape, and the linearity of the formed line pattern becomes low. Further, as described above, in the conventional method, since the line pitch width (7) is not less than 4 〇, the line pattern of the sixth figure is not provided. The line pitch width (1 >) is 45 #m. ^ By setting appropriate etching conditions, a line pattern having a cross-sectional shape closer to a rectangle can be formed. After etching, the mask material used can be hunted. It is easily removed by inspection, etc. "' 318829 25 200814878 • The line pattern thus formed is as covered by the 2nd *' as the connection end; both /, by the resin layer, the input side of the input side Lead wire, output side inner lead, wheel exit side outer;; The resin protective layer may be a hardened protective layer for the hardening of the lead portion, or may be formed by coating the resin in the film Z technology and perforating the laminated body of the resin layer into a desired shape. The face of the square is formed with a cover layer attached to a predetermined portion of the line pattern. The layer is attached to the layer as described above, and is treated by a solder resist layer or a cover layer. , plating: wide system is treated by gold-coated gold, nickel-plated, tin-plated, 'soil-treated, nickel-plated _ #理, get Nalui for ^, free '' and hot-waste solder treatment, mine zinc: : copper treatment, clock silver treatment, etc. These symplectic can also be combined with a plurality of money processing. In addition, ^J uniquely ordered welding layer and cover layer covered circuit diagram: can also form a resistance after the above resistance The solder layer or the attaching cover layer is disposed within the above-mentioned carbon coating treatment. The thickness of the mirror coating layer thus formed is usually obtained after the dry etching layer or the covering layer is dry in the range of 〇1 to 1〇(4). a semiconductor device in which a "subsequent member" is encapsulated in a resin package to constitute a flexible printed circuit board of the present invention The polyimine layer is formed to form a light-transmissive layer, so that the light transmitted from the poly-amine side of the flexible printed circuit board can be recognized and formed on the flexible printed circuit substrate. The shape of the line pattern, by which the positioning can be performed with very high precision and electronic components are mounted to manufacture the semiconductor device of the present invention. 318829 26 200814878 Electronic components mounted on the flexible printed circuit board of the present invention, It is preferably a driver for a display device such as an LCD display device or a display device. The number of channels of the driver of such a display device is gradually increased to 128ch/l IC and 256ch/l IC for each electronic component. The 512ch/l IC, the flexible printed circuit board of the present invention is suitable for the case of mounting an electronic component having an effective number of channels of 640ch/l IC to 1280ch/l IC. In particular, the flexible printed wiring board of the present invention is suitable for the case where the driver 1C of a display device having a pixel of 1,000,000 or more is mounted.
如此驅動平面顯示器之驅動器，其1個電子零件所處 理之資訊量雖會逐漸增多，但電子零件本身係軽量且小型 化。因此，在與電子零件之間形成電性連接點的内部引線 之線路間距寬度，亦必須對應於小型且形成高密度之凸塊 電極設為較狹窄。 本發明之挽性印刷線路基板係具有上述構成’在該挽 性印刷線路基板安裝用以驅動平面顯示器之電子零件時， 如第2圖所示，係在撓性印刷線路基板的安裝有電子零件 於線路基板之位置與輸出侧外部引線之間折曲使用撓性印 刷線路基板。如此折曲使用撓性印刷線路基板時，對該折 曲部之線路圖案施加有大的彎曲應力，且當應力集中在連 接端子附近，該折曲部分等之線路基板之銅結晶粒子小 時，容易產生裂痕，折曲部等之線路圖案之斷線大多是從 該裂痕開始。 然而，當藉由使用本發明所使用之大部分結晶徑為3 /zm以上之柱狀結晶的電解銅箔時，折曲部分不容易產生 27 318829 200814878 裂痕，因此在折曲部分等不容易發生斷線。再者，本發明 所使用之電解銅箔係藉由採用上述結晶構造，其引拉強度 及伸展率高’因此即使在施加有大的彎曲應力之折曲部 为，亦可吸収彎曲應力及反覆應力以防止斷裂。 關於本發明之撓性印刷線路基板，在使用撓性印刷線 路基板之耐折性試驗機（MIT試驗機），以彎曲半俨 〇.8mm、彎曲角度土135度、彎曲速度n5rpm、施加負^ l〇〇gf/10mm之條件，在25t：下測量耐折性時，形成在折 _曲之線路圖案至斷線為止之耐折性為至少⑽二欠，即使 如此反覆折曲也非常難發生斷裂’通常即使反覆折曲ι〇〇 次線路圖案也不容易斷裂。 如此優越之耐折性之原因可考慮為，由於在使用於 路圖案之形成的電解銅落中，以顯現如上述具有高的引拉 強度及延伸率的方式由具有以上之長長徑的柱狀銅 結晶粒子所形成，且該柱狀銅結晶粒子中之至少一部分係 具有比所形成之線路圖案之厚度更長之長徑的銅結：粒 子因此所形成之線路圖案具有非常高之機械特性，且所 =成之線路㈣與作為支持體的聚醯亞胺層可共同防止因 幫曲應力所造成之線路圖案的破裂。 本發明之撓性印刷線路基板係可適用於安裝電子零件 =斤曲使狀騎。目此，特料本發明之純印刷線路 基，’較佳為配置於LCD《清之平面顯示器，並使用 在女裝用以驅動該平面顯示器之電子零件時。 (實施例） 318829 28 200814878 接著，更詳細說明本發明之實施例，但本發明並非由 該等實施例所限定者。 (實施例1)In such a drive for driving a flat panel display, the amount of information processed by one electronic component is gradually increased, but the electronic component itself is quantitative and miniaturized. Therefore, the line pitch width of the inner leads forming the electrical connection points with the electronic parts must also be narrower corresponding to the small and high-density bump electrodes. In the printed circuit board of the present invention, when the electronic component for driving the flat panel display is mounted on the flexible printed circuit board, as shown in FIG. 2, the electronic component is mounted on the flexible printed circuit board. A flexible printed wiring board is used to bend between the position of the circuit board and the output side external lead. When the flexible printed wiring board is used in such a manner, a large bending stress is applied to the line pattern of the bent portion, and when stress is concentrated in the vicinity of the connection terminal, the copper crystal particles of the circuit substrate such as the bent portion are small, and it is easy. Most of the broken lines of the line pattern in which the crack is generated, the bent portion, and the like start from the crack. However, when the electrolytic copper foil having a columnar crystal having a crystal diameter of 3 /zm or more or more used in the present invention is used, the bent portion is less likely to generate a crack of 27 318829 200814878, and thus it is not easy to occur in a bent portion or the like. Broken line. Further, the electrolytic copper foil used in the present invention has a high tensile strength and elongation by using the above-described crystal structure. Therefore, even when a bent portion to which a large bending stress is applied is used, the bending stress can be absorbed and repeated. Stress to prevent breakage. In the flexible printed wiring board of the present invention, a folding endurance tester (MIT tester) using a flexible printed wiring board is used to bend a half of a file of 8 mm, a bending angle of 135 degrees, and a bending speed of n5 rpm. L〇〇gf/10mm condition, when measuring the folding endurance under 25t:, the folding resistance formed at the folding line pattern to the broken line is at least (10) two owes, even if it is repeatedly folded, it is very difficult to occur. The fracture 'usually does not easily break even if the pattern is repeatedly folded. The reason for such superior folding endurance is considered to be that the column having the above-mentioned long diameter is exhibited in such a manner that it exhibits high tensile strength and elongation as described above in the electrolytic copper drop used for formation of the road pattern. Formed by the copper crystal particles, and at least a part of the columnar copper crystal particles have a long diameter copper junction longer than the thickness of the formed line pattern: the particles thus formed have a very high mechanical characteristic And the line (4) and the polyimide layer as a support can prevent the crack of the line pattern caused by the bending stress. The flexible printed circuit board of the present invention can be suitably used for mounting electronic parts. Accordingly, the pure printed circuit board of the present invention is preferably disposed on a flat panel display of the LCD and used in electronic components for driving the flat panel display. (Embodiment) 318829 28 200814878 Next, an embodiment of the present invention will be described in more detail, but the present invention is not limited by the embodiments. (Example 1)
使用銅濃度80g/升、自由硫酸濃度140g/升、1，3-巯 基-1-丙磺酸濃度4ppm、二烯丙基二曱基銨氯化物 (SENKA(股）製、商品名：YUNISENCE FPA100L)3ppm、 氯濃度lOppm之硫酸系銅電解液，在液溫50°C、電流密度 60A/dm2之條件下製造厚度12/zm之電解銅箔。該電解銅 箔之S面的表面粗度（Rz)係1.2//m，Μ面之表面粗度係0.6 // m，Μ面之光澤度[Gs(60°)]係650。 對該電解銅箔之Μ面進行由鍍覆處理、覆蓋鍍覆處理 所構成之粗化處理，並將Μ面之表面粗度（Rz)調整為1·5 // m。如此在經粗化處理之電解銅箔的無光澤面塗布包含 市售之聚醯胺酸之聚醯亞胺前驅體清漆，並對其加熱且進 行環閉合醯亞胺化反應，以形成聚醯亞胺層。如此所獲得 之基材薄膜層的聚醯亞胺層之厚度為40 // m，所獲得之基 材薄膜係為電解銅箔的厚度為12//m、聚醯亞胺層之厚度 為40 /z m的二層積層體。此外，在此所使用之粗化處理前 的電解銅箔，依據通常之方法，在25°C下測量之伸展率為 8%，在180°C下保持60分鐘後所測量之伸展率為12%， 其係非常具柔軟性的電解銅箔。關於該電解銅箔，依據通 常之方法，在25°C下測量之引拉強度為39kgf/mm2,在180 °C下保持60分鐘後所測量之引拉強度為35kgf/mm2。 進行蝕刻使以上述方式形成之基材薄膜的電解銅箔層 29 318829 200814878 戶 1整Γ厚度成為8/zm後’在表面塗布感紐樹脂，並對 ^ /成之感7b性㈣層進行曝光顯影。經顯影之圖案的内 :引:：線Γ間距苋度(p)為20…引線寬度(靖1〇" 以上述方式形成之圖案作為遮罩材，使 氯化銅系的卿。選擇性將銅二: =去除，而該吼咯環係僅具有氮原子作為位在環内之異原 接著刻之基材薄膜進行驗洗淨，去除遮罩材， 塗布阻鮮劑並使之乾燥而形成t層出。’利用網版印刷技術 成厚Γ〇=銲Γ出之咖線部及外部引線部形 刷線路基板。“解制層，Μ得本發明之撓性印 在如此獲得之撓性印刷 ⑶㈣/加之電子零件，其安=基板的内部㈣安裝 波，且予以加熱而製』二=咖叫並施加超音 如上所述進行製造時，、從=零t之半導體裝置。 刷線路基板切取内部引線部分。=;%鐘錫前之挽性印 部引線之部分的電子顯微鏡W 如此形成之内 之剖面形狀。 各们線路係形成為矩形 以上述方式形成之内部幻綠的底部寬度卿）係… 318829 30 200814878 線之頂部寬度(iLT)係10 # m。 成之2 = 之聚Μ胺’並取出由電解銅落所構 該電子顯微鏡昭片1=鏡觀察其剖面。第1圖係顯示 亦顯示在第將该電子顯微鏡照片予以循跡後之圖 ::1圖所示’該内部引線之厚度丁。係 圖之循跡後的圖式巾， 昂1 之厚产ΤΓ==δ 至D8顯然係具有比該内部引線 、岛只又° ㈣)更長之長徑的銅柱狀結晶。該剖面中超 ^ # m之銅柱狀結晶的佔有面積為60%。 路圖上述方式^之換性印刷線路基板中’在線 面::日形成線路圖案的部分之聚醒亞胺層的表面之表 率：二3。.一’未形成該線路圖案之部分的光穿透 ./ TAB接合器（bonder)中’在該撓性印刷線路 C土CD^r亞胺面側配置光源，並在㈣亞胺面側配置 CCD，相機’以檢測穿透該撓性印刷線路基板之光，而可 、仃半導體晶片與撓性印刷線路基板之定位。在此， 透率係利用吸光光度計所測量者，亦即將絲刻過導體之 ㈣亞胺層）切取為適當之大小，並以相對於光源 =先口度計以呈垂直之方式組裝測量。此外’彻該光穿透 卞’只要具有在安裝1C晶片等時進行圖像處理之際所使用 之光源的波長區域即可，但一般而言係使用可見光區域、 例如波長彻至_細左右的區域。然而，當絕緣層係由 列如具有聚酿亞胺之雙重鍵結之材料所構成時，由於在波 長500麵以下具有大的吸収，因此一般係以_至·_ 318829 31 200814878 之波長的光為主，而以CCD照相機等檢測光穿透率以進行 圖像辨識處理。 利用作為耐折性試驗裝置之Μ ί T試驗機，對以上述方 式製造之撓性印刷線路基板施加1 QOgiy 1 之負載，並 以彎曲半徑0.8mm、彎曲角度±135度、彎曲速度n5rpm 之條件，在25t：下測量線路阻力變化時，在13〇次斷線。 如f 1圖所#，形成在本發明之撓性印刷線路基板的 線路圖案之剖面的銅粒子，與適用在形成習知之挽性印刷 線路基板時所廣泛使用之f 7圖所示的構成電解銅箱之銅 粒子相比較，本發明之銅粒子的形狀非常大，且該粒子徑 大之柱狀銅粒子係多數存在於線路圖案中，該等柱狀銅粒 子在線路圖案中係與其他柱狀銅粒子共同地對大致矩形之 線路圖案賦予非常優良之财折性、伸展率等之特性。 相對於此，於使用如習知技術之析出粒子徑小，並密 集地塞滿該小的銅粒.子之㈣的情形下，係如第7圖所 :，引線本身成為小的鋼結晶之集合，鋼粒子之粒界之數 =多，_液越容諸該交界侵人，因此在藉由姓刻形 、、、*之間’亦會進行業經似彳之部分的㈣刻，矩 路圖案不容易形成，如第6圖所示，其剖面形狀容 约形成梯形之線路圖案。 板，It在本發明之實施例1形成之撓性印刷線路基 社曰嫌Ϊ將形成線路圖案之銅結晶粒子的大部分以柱狀 線路間距寬声去、去W ^ 、又（）未達40从瓜，亦可形成剖面大致矩形之線 318829 32 200814878 路圖案’並由於含有長徑之銅柱狀粒子，因此所形成之線 路圖案本身顯不出非常優的耐折性等機械性特性。 (比較例1) 使用超低粗度電解銅箔（三井金屬礦業（股）製），並在該 電解銅箔之S面塗布聚醯亞胺前驅體清漆並予以加熱，以 製作二層積層體之電解銅箔。 該電解銅箔之在25。〇下測量之伸展率係4%，引拉強 度33kgf/mm2 ’ S面之表面粗度（Rz)為，光澤度 • [Gs(60。)]為 370。 除使用5亥電解銅箔之外，與實施例1相同地形成線路 圖案’在所獲得之線路圖案的引線部分形成0.5/zm之益 電解鍍錫層。 乂 口引線之厚度係m，観察剖面時，緣μ邯〜咏 係由成乎100%之粒徑未達之銅粒狀結晶所形成。 在x述方式製造之撓性印刷線路基板中，在線路圖案 中未形成線路圖案的部分之㈣亞胺層的表面之表面粗度 )為l’〇/Zm，未形成該線路圖案之光穿透率為65%。 續驗Γ於!^上述方式製造之挽性印刷線路基板，使用贿 ^機進行耐折性試驗時，在60次斷線。 (產業上之利用可能性） 發明之撓性印刷線路基板，儘管其為最窄部分之線 耐丄 1:!線之間距寬度(p)為未達4〇”之精細間距，其 '、么’即使折曲使用該撓性印刷線路基板，形成在 該折曲部分之線路也不容易產生斷線。而且，本發 318829 33 200814878 性印刷線路基板由於形成絕緣層之聚醯亞胺層的光穿透率 雨’因此藉由辯識穿透本發明之撓性印刷線路基板的光之 圖案，即可進行撓性印刷線路基板之定位。再者，本發明 之撓性印刷線路基板係可將線路圖案之剖面形狀形成為大 略矩形，因此在本發明之撓性印刷線路基板，能以非常高 之密度形成線路。 一本鲞月之半導體裝置係在上述撓性印刷線路基板安農 包子令件而成者，並作為平面顯示器之源極側驅動半導體 裝置，特別適合使用在折曲使用時之用途。 【圖式簡單說明】 、第1圖係顯不從本發明之撓性印刷線路基板溶解去除 作為絶緣基板之聚醯亞胺層的線路圖案之剖面銅結晶粒子 之例的電子顯微鏡照片及循跡該照片之示意圖。 第2圖係本發明之撓性印刷線路基板及半導體裝置之 剖面一例的模式圖。 • 弟3目縣發明之撓性印職路基板之㈣引線之部 分的剖視圖。 弟4圖係將電子零件絲在本發明之撓性印刷線路基 板知2内部引線及凸塊電極之部分的放大圖。 ^ 5圖之左側的照片係上述撓性印刷線路基板之間距 =又〇#m之内部引線的平面照片’右側的照片係上述捷 =刷線路基板之形成為間距寬度如㈣之㈣㈣ 線之部分剖視圖。 第 6圖係利用以往所使用 之電解銅箔而形成之線路圖 318829 34 200814878 案之平面照片及剖面照片。 廿第7圖係利用以往製造撓性印刷線路基板時最適合之 廣泛地使用的電解銅箔而形成之内部引線的習知例，且為 去除XK 亞胺層之内部引線的電子顯微鏡照片之例。 【主要元件符號說明】 D1至D8銅柱狀結晶 電解銅之厚度 318829 35Use copper concentration 80g / liter, free sulfuric acid concentration 140g / liter, 1,3-mercapto-1-propane sulfonic acid concentration 4ppm, diallyl decyl ammonium chloride (SENKA (stock), trade name: YUNISENCE FPA100L A sulfuric acid-based copper electrolytic solution having a chlorine concentration of 10 ppm and a chlorine concentration of 10 ppm was used to produce an electrolytic copper foil having a thickness of 12/zm at a liquid temperature of 50 ° C and a current density of 60 A/dm 2 . The surface roughness (Rz) of the S surface of the electrolytic copper foil was 1.2 / / m, the surface roughness of the kneading surface was 0.6 / m, and the gloss of the kneading surface [Gs (60 °)] was 650. The kneading surface of the electrolytic copper foil was subjected to a roughening treatment consisting of a plating treatment and a plating treatment, and the surface roughness (Rz) of the crucible surface was adjusted to 1·5 // m. Thus, a commercially available polyaminic acid-containing polyimine precursor varnish is coated on the matte side of the roughened electrolytic copper foil, and heated and subjected to a ring closure oxime imidization reaction to form a polyfluorene. The imine layer. The thickness of the polyimide layer of the base film layer thus obtained is 40 // m, and the obtained base film is such that the thickness of the electrolytic copper foil is 12/m, and the thickness of the polyimide layer is 40. /zm two-layer laminate. Further, the electrolytic copper foil before the roughening treatment used herein has an elongation of 8% measured at 25 ° C according to a usual method, and an elongation ratio of 12 measured at 60 ° C for 60 minutes. %, which is a very flexible electrolytic copper foil. With respect to the electrolytic copper foil, the tensile strength measured at 25 ° C was 39 kgf / mm 2 according to the usual method, and the tensile strength measured after holding at 180 ° C for 60 minutes was 35 kgf / mm 2 . Etching to make the electrodeposited copper foil layer of the base film formed in the above manner 29 318829 200814878 After the thickness of the whole body is 8/zm, 'the surface is coated with a sensitizing resin, and the 7b (four) layer of the sensitization is exposed. development. The inside of the developed pattern: 引:: Γ spacing 苋 degree (p) is 20... lead width (Jing 1〇" The pattern formed in the above manner is used as a masking material to make the copper chloride system. The copper bismuth: = is removed, and the fluorene ring system has only a nitrogen atom as a substrate film which is located in the ring, followed by etching, removing the masking material, coating the freshening agent and drying it. Forming a t-layer. 'Using screen printing technology to form thick Γ〇 = soldered yoke line and external lead-shaped brush circuit board. "Solution layer, won the flexibility of the invention printed in this way Printing (3) (4) / Adding electronic parts, the internals of the substrate (4) are mounted with waves, and are heated to produce a second semiconductor device. When the manufacturing is performed as described above, the semiconductor device from = zero t. The substrate is cut out of the inner lead portion. =; % electron beam of the portion of the lead printed portion of the lead before the tin is formed in the cross-sectional shape thus formed. Each of the lines is formed into a rectangular shape in the above-described manner. Department... 318829 30 200814878 Line top width (iLT) 10 # m. 成之2 = Polyamide' and take it out by electrolysis of copper. The electron microscope shows the cross section of the electron microscope. The first picture shows that the electron micrograph is also recorded. The following figure:: 1 shows the thickness of the inner lead. The pattern of the pattern after the tracking, the thick ang of the ang 1 = δ to D8 obviously has more than the inner lead, the island only ° (4)) Longer-length copper columnar crystals. The area occupied by copper columnar crystals of super ^ # m in this section is 60%. The above-mentioned method of the above-mentioned type of printed circuit board in the 'online surface:: day The surface of the surface of the layer of the polyamidide layer forming the portion of the line pattern: two 3: a 'light penetration of the portion of the line pattern not formed. / TAB bonder' in the flexible printed circuit C The light source is arranged on the surface of the CD^r imine, and a CCD is arranged on the (iv) imine side, and the camera is used to detect the light penetrating the flexible printed circuit substrate, and the positioning of the semiconductor wafer and the flexible printed circuit substrate can be performed. Here, the transmittance is measured by an absorbance photometer, which is also about to inscribe the (tetra) imine layer of the conductor) Take the appropriate size and assemble the measurement in a vertical manner with respect to the light source = the first mouth. In addition, the 'passing through the light' is used as long as the image processing is performed when the 1C wafer or the like is mounted. The wavelength region of the light source may be, but generally, a visible light region, for example, a region having a wavelength as close as a thinner is used. However, when the insulating layer is composed of a material such as a double bond having a polyacrylonitrile bond, Since there is a large absorption below the wavelength of 500 or less, it is generally based on the wavelength of _ to _ 318829 31 200814878, and the light transmittance is detected by a CCD camera or the like for image recognition processing.性 T test machine, applying a load of 1 QOgiy 1 to the flexible printed circuit board manufactured in the above manner, and having a bending radius of 0.8 mm, a bending angle of ±135 degrees, and a bending speed of n5 rpm at 25t: When measuring the line resistance change, it is broken at 13 times. The copper particles which are formed in the cross section of the wiring pattern of the flexible printed wiring board of the present invention, and the constituent electrolysis shown in Fig. 7 which is widely used in forming a conventional printed circuit board substrate, as shown in Fig. Compared with the copper particles of the copper box, the shape of the copper particles of the present invention is very large, and the columnar copper particles having a large particle diameter are mostly present in the line pattern, and the columnar copper particles are in the line pattern and other columns. The copper particles collectively impart very excellent properties such as financial flexibility, elongation, and the like to the substantially rectangular wiring pattern. On the other hand, in the case where the particle diameter of the precipitated particles is small as in the prior art and is densely packed with the small copper particles. In the case of (4), as shown in Fig. 7, the lead itself becomes a small steel crystal. Collection, the number of grain boundaries of steel particles = more, _ liquid is more tolerant of the border invading people, so in the name of the name, between, * between the 'will also carry out the part of the (4) engraved, the way The pattern is not easily formed, and as shown in Fig. 6, its cross-sectional shape accommodates a trapezoidal line pattern. In the flexible printed circuit based on the first embodiment of the present invention, the majority of the copper crystal particles which form the line pattern are widened by the column line pitch, and W ^ and () are not reached. 40 From the melon, it can also form a line with a substantially rectangular cross section. 318829 32 200814878 The road pattern 'and because of the long column diameter of the copper columnar particles, the formed line pattern itself does not exhibit mechanical properties such as excellent folding resistance. (Comparative Example 1) An ultra-low-thickness electrolytic copper foil (manufactured by Mitsui Mining & Mining Co., Ltd.) was used, and a polyamidene precursor varnish was coated on the S surface of the electrolytic copper foil and heated to prepare a two-layer laminate. Electrolytic copper foil. The electrolytic copper foil is at 25. The extension ratio measured under the armpit is 4%, the surface roughness (Rz) of the pull strength of 33 kgf/mm2 'S surface is, and the glossiness [Gs(60.)] is 370. A wiring pattern was formed in the same manner as in Example 1 except that the 5 gal electrolytic copper foil was used, and a 0.5/zm beneficial electrolytic tin plating layer was formed in the lead portion of the obtained wiring pattern. The thickness of the 引线 lead is m, and when the profile is observed, the edge 邯 咏 咏 is formed by a copper granule which is less than 100% of the particle size. In the flexible printed wiring board manufactured by the above-described method, the surface roughness of the surface of the (iv) imine layer in the portion where the line pattern is not formed in the line pattern is 1'〇/Zm, and the light pattern of the line pattern is not formed. The penetration rate is 65%. After the test of the above-mentioned method, the printed circuit board manufactured by the above method was broken for 60 times when the folding resistance test was carried out using a bribe machine. (Industrial Applicability) The flexible printed circuit board of the invention, although it is the narrowest part of the line, the line width of the line is (p) is less than 4" fine pitch, which is ' 'Even if the flexible printed circuit board is bent, the line formed in the bent portion is less likely to be broken. Moreover, the light of the polyimide layer forming the insulating layer is 318829 33 200814878. The transmittance of the rain 'is thus able to position the flexible printed circuit board by discriminating the pattern of light that penetrates the flexible printed circuit board of the present invention. Further, the flexible printed circuit board of the present invention can The cross-sectional shape of the line pattern is formed into a substantially rectangular shape, so that the flexible printed circuit board of the present invention can form a line at a very high density. A semiconductor device of the moon is attached to the flexible printed circuit board. As a master, it is used as a source side drive semiconductor device for flat panel displays, and is particularly suitable for use in flexing. [Simplified description of the drawings], Fig. 1 shows the flexibility of the present invention. An electron micrograph of an example of a cross-sectional copper crystal particle in which a printed circuit board dissolves and removes a wiring pattern of a polyimide layer as an insulating substrate, and a schematic view of the photograph. FIG. 2 is a flexible printed circuit board and a semiconductor of the present invention. A schematic view of an example of a cross section of the device. • A cross-sectional view of a portion of the lead wire of the flexible printed circuit board invented by the 3rd Miyazaki. The younger part 4 shows the inner lead of the electronic component wire in the flexible printed circuit board of the present invention. And an enlarged view of a portion of the bump electrode. The photo on the left side of the figure is the plane photo of the inner lead of the flexible printed circuit board. It is a partial cross-sectional view of the line width (4) and (4). The figure 6 is a plan view and a cross-sectional photograph of the circuit diagram 318829 34 200814878 formed by using the electrolytic copper foil used in the past. A conventional example of an internal lead formed by electrolytic copper foil which is most suitable for printing a circuit board, and is an internal lead for removing the XK imine layer. Examples of the electron micrograph. The main element symbols D8 DESCRIPTION copper electroless copper to the thickness D1 of the columnar crystals of 31,882,935