TW200810655A - Flexible printed wiring board and electrical connection apparatus - Google Patents

Flexible printed wiring board and electrical connection apparatus Download PDF

Info

Publication number
TW200810655A
TW200810655A TW96110992A TW96110992A TW200810655A TW 200810655 A TW200810655 A TW 200810655A TW 96110992 A TW96110992 A TW 96110992A TW 96110992 A TW96110992 A TW 96110992A TW 200810655 A TW200810655 A TW 200810655A
Authority
TW
Taiwan
Prior art keywords
conductive material
material layer
layer
wiring substrate
probe
Prior art date
Application number
TW96110992A
Other languages
English (en)
Chinese (zh)
Inventor
Kazuhito Hamada
Takashi Akiniwa
Satoshi Narita
Original Assignee
Nihon Micronics Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Micronics Kk filed Critical Nihon Micronics Kk
Publication of TW200810655A publication Critical patent/TW200810655A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW96110992A 2006-04-14 2007-03-29 Flexible printed wiring board and electrical connection apparatus TW200810655A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006111812A JP2007285800A (ja) 2006-04-14 2006-04-14 フレキシブル配線基板および電気的接続装置

Publications (1)

Publication Number Publication Date
TW200810655A true TW200810655A (en) 2008-02-16

Family

ID=38609401

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96110992A TW200810655A (en) 2006-04-14 2007-03-29 Flexible printed wiring board and electrical connection apparatus

Country Status (4)

Country Link
JP (1) JP2007285800A (ko)
KR (1) KR20080098429A (ko)
TW (1) TW200810655A (ko)
WO (1) WO2007119637A1 (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4902248B2 (ja) 2006-04-07 2012-03-21 株式会社日本マイクロニクス 電気的接続装置
JP4884821B2 (ja) 2006-04-14 2012-02-29 株式会社日本マイクロニクス プローブシートおよび電気的接続装置
JP4841298B2 (ja) 2006-04-14 2011-12-21 株式会社日本マイクロニクス プローブシートの製造方法
JP2008082912A (ja) 2006-09-28 2008-04-10 Micronics Japan Co Ltd 電気的接続装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1144708A (ja) * 1997-07-24 1999-02-16 Mitsubishi Materials Corp コンタクトプローブおよびその製造方法
JP3458684B2 (ja) * 1997-11-28 2003-10-20 三菱マテリアル株式会社 コンタクトプローブ
JP4004241B2 (ja) * 2001-04-16 2007-11-07 株式会社日本マイクロニクス 電気的接続装置

Also Published As

Publication number Publication date
JP2007285800A (ja) 2007-11-01
WO2007119637A1 (ja) 2007-10-25
KR20080098429A (ko) 2008-11-07

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