TW200804153A - Housing for electronic components - Google Patents

Abstract

A housing is formed in such a way that a plurality of chip trays each holding a plurality of semiconductor chips are stored in a storage tray, wherein the chip tray is formed by vertically connecting an upper unit and a lower unit, both of which have the same structure. The semiconductor chips are held between the upper unit and the lower unit of the chip tray, thus preventing two-dimensional movement thereof. When a plurality of housings each having the aforementioned structure are vertically combined together, a plurality of semiconductor chips can be further held between the upper unit of one housing and the lower unit of another housing. This makes it possible to simultaneously transport numerous semiconductor chips, whereby the semiconductor chips are each encapsulated in a surface mount chip package.

Description

200804153 IX. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a package for holding electronic parts such as semiconductor wafers therein. v This application claims priority to Japanese Patent Application No. 2006-771, the disclosure of which is incorporated herein by reference. ^ [Prior Art] • Traditionally, various types of packaging boxes have been used to hold and transport electronic components, such as semiconductor wafers. A typical example of a conventional package is designed to include a plurality of wafer trays holding a plurality of semiconductor wafers, respectively, and a size greater than the wafer tray in size and thickness for storing semiconductor wafers. The storage tray has a plurality of cavities whose upper ends are enemies and stores the wafer disc. Forming a plurality of protrusions on the upper surface of the wafer disc to define a plurality of regions to hold the plurality of semiconductor wafers in a manner on the plurality of regions to be held tightly and by the protrusions The object is not stored along the two-dimensional square 4 from the ## holding a plurality of semiconductor wafer wafer discs stored in the cavity of the storage tray; then the private storage wheel is used to transport the plurality of discs. This allows the plurality of semiconductor discs to be transported simultaneously. In the above, each semi-conducting 髀曰μ 曰曰 7 7 只是 固 固 固 固 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 This leads to the deviation or tilt of the position of the love. This will benefit the semiconductor wafer storage conditions. ^Wind + [Summary] One object of the present invention is to provide a package which can prevent the semi-conductor by preventing the semi-conductor 114832.doc 200804153 The wafer has been accidentally moved during transportation, and the body wafer is one of the semiconductor wafers, and one of the wafers of the white stone is wafer-packed, and two of them are used to hold a plurality of semiconductors. Vertically connected to an upper part - ^ 髀曰Μ 髀曰Μ 髀曰Μ 髀曰Μ 一下 一下 一下 一下 一下 一下 一下 固 固 固 固 固 固 固 固 固 固 固 固 固 固 固 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体And occupying the inside of the storage tray at 70. In addition, the storage tray and the squeezing toothed portion are used to achieve the crystal and the upper unit 盥 the lower portion _ 唧u and maintain the 邛 邛 邛a vertical connection state. The lower unit has both a phase m/upper port P and a lower unit. 1 is earlier than the above, when the package is further held by a plurality of semiconductor wafers = When the two units are combined, the door unit of the lower part of the package is in the package... the upper unit and the above, as described above, the invention allows simultaneous storage of (4) storage of a plurality of wafer trays, and The upper unit is lower than the lower unit f π. The blank is between the discs. This prevents the semiconductor crystal from moving during the position; therefore, the #Μ曰曰 is on the transport L1 even when the package is in transit. It can also prevent the position of the vibration between the semi-conductive amp & yd Shifting, thereby maintaining stable storage conditions of the wafer. The thousand conductors are completely stored in the reservoir in a possible range within a range of 可, /, 厗, 适当 适当 内部 内部 适当 适当 适当 适当 适当 适当 适当 适当 适当 适当 适当 适当 适当 适当 适当 适当 适当 适当 适当 适当 适当 适当 适当 适当 适当 适当 适当 适当This prevents the total thickness of the dreamer e A γ and (4) from being stored in the storage tray when it is stored in the storage tray; the total thickness; that is, it can reach H4832 relative to the package. Doc 200804153 The size of the compaction. In particular, when the combination is at the beginning, the 哕, etc. can be reduced: & the total space of the box is set vertically. After that, the wafer tray can be attached to the storage tray in a detachable manner. This will prevent the wafer tray from being accidentally stored in the museum, and this also maintains the upper single knife and the Ancient state. That is, the semi-conducting memory condition can be stabilized by means of a wafer-disc storage disk. Storage

Since the upper unit and the lower single-shirt are of the same structure, the components can be utilized for a total of ten. This will reduce the number of different parts in the upper and lower parts. When a plurality of packages having the above-described structure are assembled in a straight line, together, a plurality of semiconductor wafers may be further held in one package 2, between the upper unit and the lower unit of the other package; At the same time, the total number of the celestial celestial tablets of the semiconductor crystal moon of the shipping wheel is set. Incidentally, the semiconductor wafer cutter is encapsulated in, for example, a surface mount wafer package. [Embodiment] The present invention will now be described in detail by way of example with reference to the accompanying drawings. Figure 1 is a plan view showing a package according to a preferred embodiment of the present invention; Figure 2 is a front view of the package; Figure 3 is an enlarged view of the basic components of the package; & Figures from 4C show an enlarged perspective view of the main components of the package. The package 10 includes a plurality of wafer trays 11 holding a plurality of wafers C, respectively, and a storage tray 12 for holding the wafer trays 11. This embodiment does not specifically define the type of wafer C; however, these patterns show that the wafer c is encapsulated H4832.d. 200804153 in, for example, bga (ball grid array) package and csp (wafer scale bonded wafer) In the package, each of the wafers c has, for example, a two-dimensional square y-liter shape in which a plurality of terminals are arranged on one side of the stone. As shown in the secret and 4B, the upper unit 14 can be combined together and = early ...5 forming a wafer disk U. Both the upper unit 14 and the lower unit 形成 are formed by the same disk member having the same structure, which is allowed to be mounted thereon. Since the role of the pound θ ^ is due to this reason, mainly according to the upper unit The following description is given, in which the same components as those of the upper unit are denoted by the same reference numerals '. Therefore, the detailed description thereof will be omitted as needed. The use - the integral molded component composed of a resin forms the upper unit Μ. 3, as shown in Figures 4A-4C, 5 and 6, and 7a-7c, the upper unit μ contains a main part 17' which is in plan view and the right 1: has a square shape with Q ;; Lifting 18 'per-first-protrusion Having a rectangular shape in plan view, the surface of the autonomous part j 7 is convex upward and arranged in a two-dimensional manner with a prescribed distance therebetween (see FIG. 3); a plurality of second protrusions 19' In the plan view, there is a cross shape and the back of the autonomous part 17 is convex downward (Mc. 5); and a plurality of square ribs have a square shape and a self-zero (four) back surface. The peripheral area of the main zero (four) shown in 7Α and 7Β 低 is lower than the other areas of the main part 17 by a step portion Ι7Β. A plurality of grooves 22 are formed at predetermined positions on the left and right sides and the upper and lower sides (see the figure). For example, in the four corners of the main part, one corner κ (that is, the lower left corner in Figure 3) has a tapered shape. This allows the operator or worker to recognize the upper single 1 H832.doc 200804153 The circumferential direction of the crucible 4. The first protrusions 18 are arranged on the surface of the main part 17 in a two-dimensional manner to arrange the wafers C at a prescribed interval so that the four first protrusions = one wafer C Four side positioning....per-single-wafer C-port In the wafer holding area defined by the four first protrusions positioned adjacent to each other, thereby preventing the two-dimensional movement of the wafer C. The second protrusion 19 shown in the two figures is in two dimensions. The manner is arranged on the moon surface of the main zero... with a prescribed spacing therebetween. Specifically, each second protrusion 19 having a cross shape is positioned on the back side of the wafer holding area to hold each UC to the main part 17 On the surface, as shown in Fig. 7A 2, the height of the second protrusion (4) which protrudes downward from the back surface of the autonomous part 17 = H, the first protrusion which protrudes upward on the surface of the autonomous part 17 (four) degree h2 〇 lower unit The 15 series is formed similarly to the upper unit 14; that is, as shown in the figure, a plurality of first protrusions 18 are formed on the surface of the main part 17, and a plurality of second protrusions 19 are formed on the main part 17. On the back. When the upper unit 14 and the lower unit 15 are roughly combined as shown in FIG. 6, the tip end of the first protrusion 18 of the lower unit 15 contacts the back of the upper part of the main part 17; and the upper part is single-centered The second protrusion &-end contacts the surface of the main part 17 of the lower unit 15. This makes it possible to firmly hold the wafer C between the upper unit 14 and the lower unit 15 by means of the first two objects 18 and the second protrusions 19. The square rib 20 projects downwardly at the back periphery of the self-contained part in such a manner that its inner side is slightly positioned outwardly toward the step portion 17β. That is, when the upper IM832.doc 200804153 7 7L 14 and the lower unit 15 are vertically When combined, the square rib 20 of the upper unit engages the step portion 17β and the adjacent step portion positions the projections 18. This makes it possible to reliably connect the upper unit 14 and the lower unit 15 together.

The structure of the storage tray 12 is not specially applied; however, the present embodiment is designed such that the storage tray 12 is formed as an integrally molded member composed of a suitable resin (e.g., abs resin). As shown in FIG. 8, the storage tray 12 includes a disk 24 having an elongated rectangular shape, an absorbing portion formed at the center of the disk 24, and eight reservoirs 26 for storing the wafer disk respectively ((4), formed in The four storage spaces on the left side and the four storage spaces formed on the right side, and a frame 27 that is formed in the periphery of the disk 24 are formed. The damper portion 25 is surrounded by a frame-shaped rib 29 defining a square area and is damped by a damper grid for transporting the package. The upper end of the rib 29 is positioned substantially in the same plane as the upper surface of the disk 24, whereby the absorbing portion 25 is positioned below the upper surface of the disk 24 and flattened. Further, a plurality of grid ribs 30 having the same height as the height of the frame-shaped ribs 29 are formed in the peripheral region of the frame-shaped ribs 29. As shown in Figure 4C, the reservoir 26 includes an inlet/outlet recess 32 having a rectangular shape that is slightly larger than the upper unit 14. This allows the wafer to be attached to or detached from the reservoir by means of the opening of the inlet/outlet groove 32. The reservoir 26 also includes four circumferential walls 33 extending from the opening to the bottom of the inlet/outlet groove 32 to define a rectangular space therebetween; a plurality of flanges 34 of the toothed portion, from the circumferential wall The lower end of the 33 protrudes inward; the plurality of locking elements forming the engaging portions arranged along the two circumferential walls 33, ^4832. (100 • 10 - 200804153) are opposed to each other in the inlet/outlet groove 32 in plan view. (See Fig. 3); and a plurality of locating projections 37' are positioned along the other two circumferential walls in the inlet/outlet recess 32. Here, the inside of the flange 34 is open. & The wall 33 forms a plurality of slits 38 that connect the locking elements %. As shown in Figure 4C, each slit 38 is straightened from the upper surface of the disk 24 to the convex, 彖 34 and shaped to an appropriate size to lock The component % is in it.'

The locking element % is disposed inside the slit % as shown in Fig. 9C. As shown in FIGS. 6 and 7C, the 'locking elements % are respectively placed in a vertical standing position, wherein the small protrusions 4 projecting inward into the space of the inlet/outlet groove 32 are formed in the upper part. The upper end is called, and the protrusion is formed in a cross-sectional shape to form a semicircular shape; therefore, when the wafer disc u is stored in the reservoir %: the two small protrusions 40 and the main part 17 of the upper unit 14 are peripherally engaged. . A plurality of interconnect & members 41 extend horizontally from the lower end of the locking member 36 and interconnect to the inner surface of the slit 38. Here, due to the elastic deformation of the interconnection member 41 and the elastic deformation of the locking member 36, the upper portion of the lock U member 36 can be slightly two pairs of the positioning projections 37 in the two circumferential turns 33 of the inlet/outlet groove 32. Each of them is positioned. The positioning projections 37 are positioned in such a manner that when the wafer tray 11 is stored in the reservoir (10), the projections are received in the recesses 22 of the tabs = 11. Therefore, even when the wafer disk u is speared from Fig. 3, the position is rotated by 9 turns in the circumferential direction. When pushed into the reservoir %, the projections 37 also interfere with the peripheral area of the main part 17 of the wafer reel 11 by 17 A', thereby preventing the wafer tray 11 from being inserted into the reservoir 26. That is, the wafer should be "stored" in the reservoir 26 of the storage disk 12. in a manner such that the positioning projection 37 does not interfere with the peripheral region 17A in a manner such that the wafer disk u is at a prescribed position (in the case of H4832.doc 200804153) Here, the tapered corner K is positioned as shown in FIG. 3 or at another position (here, the wafer disk η is rotated 18 相 compared to the illustration of FIG. 3) precisely positioned inside the reservoir 26. As shown in FIG. 6, the depth of the reservoir 26 is determined in a manner such that the wafer tray (where the upper unit 14 and the lower unit 15 are vertically connected together) is completely stored in the thickness of the storage tray 12 for storage. In the figure (1), the shape of the first protrusion 18 of the upper unit 14 is substantially defined (4) in the same plane as the surface of the disk 24 and the tip of the square rib 2 of the lower unit 15 is It is positioned above the lower portion of the frame 27 and does not extend outward from the frame (four). The frame 27 is elongated downward from the periphery of the disk 24, and a step portion 27 of a height smaller than the height of the upper surface of the disk 24 is formed on the upper end of the frame 27. When a plurality of packages ns are directly combined as shown in FIG. - At the beginning, the lower end of the frame 27 of the storage tray 12 of one of the packaging boxes 1 is fixed to the step portion 27 of the frame 27 of the storage tray 12 of the other packaging box 1 as shown in Fig. 2 The recess 43 is formed on the back surface of the frame 27. In addition, a pair of hooks 44 are interconnected to both sides of the frame 27. The wafer c is stored in the package 1 ,, each wafer c is fixed to the main part (10) of the lower unit 15 in a manner such that its four sides are positioned opposite to the corresponding four first protrusions 18 of the lower unit 7015. Next, the upper unit 14 and the lower part The unit 15 is vertically connected in a manner such that the step portion 17 is placed along the step portion η of the lower unit 15 and the first rib is placed along the square rib 2 of the upper unit 14 (4). Thereby, the second protrusion 19 of the upper portion 14 is accurately positioned above the cymbal C stored in the lower unit 15. This will prevent the position of the wafer c from moving; that is, by the upper unit Η Covering and enclosing the lower unit 15. precisely in one way: placing: the disc is composed of the upper unit 14 and containing crystals Under unit cell c. Group / _ reservoir so that the reservoir 12 of the disc 26 is positioned to receive the projection on the hundred

In the recess 22 of the second and lower units 15, the wafer tray (four) is then placed into the storage state 26. At this time, the peripheral portion of the upper unit 14 and the lower unit 15 stores the small projection 4G of the locking member 36 of $26 to slide so that the lock a cow 6 is slightly inclined outward due to its elasticity. When the lower surface of the peripheral region 17A of the lower unit 15 is fixed on and in contact with the flange % of the reservoir %, the lock & 7C member 36 is reset to the initial position, thereby causing the projection 40 of the locking member 36 It engages the upper surface of the peripheral region i7A of the upper unit 14 in a kneading manner. The 曰P is also used to secure the temple phoenix 11 by means of the flange 34 and the small protrusions (10) of the locking member 36. This prevents the wafer tray 11 from moving vertically. Therefore, the wafer tray U can be securely stored in the reservoir (10) of the storage tray 12 while maintaining the vertical connection state of the upper unit 14 and the lower unit 15. Similarly, 'the other wafer discs u holding the wafer c are stored in the storage tray 12', in the memory 26; as a result, each of the 1 (> full load states as shown in the figure) can be achieved. In the lower unit 15, a plurality of wafers can be held by the upper unit 14. When the two packages 101 are directly combined together as shown in FIG. 10, the lower unit 15 covers the wafer C held in the upper unit 14. When a package in which the wafer C is held in the upper unit 14 is 〇114832.doc 200804153, a package 1G is vertically combined or covered with another package; 〇, another; The second projection of the unit 15 is operatively positioned on the wafer 1 held in the upper unit 14 of a package 10. The wafer tray 1 is held in the reservoir % of the storage tray 12 of the package 10. The wafer 10 is taken out, and an external force is forcibly applied to the wafer tray η to release: the wafer disc 11 is sold with a macro pin & / raw q < meshing member 36. The opening of the inlet/outlet groove 32 takes out the wafer tray n. Then, the upper portion is separated from the lower unit 15 Each wafer c. The outgoing wafer C' can be separately taken out as explained above. 'This embodiment is designed to hold the wafer C between the upper unit m unit 15. This allows the plurality of borrowing = storage trays 12 to be transported (4). The held wafer tray (1) prevents the wafer C from being accidentally moved and dropped during transportation. Further, the wafer 34 can be prevented from moving by the flange 34 of the reservoir 26 and the weir element 36. 12 and 2 are taken out from the storage unit 26. This makes it possible to speed up the film C on the top of the wafer C, for example, a charge check. When a plurality of packages are directly combined at the start, the package is The wafer C held by the upper unit 14 is covered by the lower portion of the other-in-box 10 70; therefore, the wafer C can be reliably held. The present invention is not necessarily limited to the embodiment; therefore, the above may be The present invention is modified in terms of the shape, position and orientation of the parts and components, and does not depart from the scope of the invention as defined by the appended claims. For example, the storage 26 formed in the storage tray 12 can be increased or decreased. Number 114832. In doc -14· 200804153, 'as long as each storage 26 is designed to store at least one wafer disc n. For improved visual recognition', the disc tray storage disc (4) can be covered with different colors. This enables smooth crystals. The disc η is attached to the slidable self-displacement memory. (4) The wafer disc is detached. Of course, the upper unit 14 and the lower unit 15 can be modified according to the number of the wafer c: the inch and the cymbal C. In addition, the lock can be appropriately changed. The number of elements 36 and the position of the weir element 36 are as long as the vertical movement of the wafer disc (4) held in the storage tray 26 can be reliably ensured. The locking member 36 is not necessarily designed to have small projections 4 at its upper end. . That is, the locking member 36 can be modified in such a manner that small projections are formed on both the upper end and the lower end of the locking member 36. In this modification, the upper and lower units 15 of the upper and lower ends of the cymbal member 36 are respectively sprayed. This will ensure stable storage conditions. Further, even when only the upper unit 14 is held in the reservoir 26, the engagement between the upper unit 14 and the small projections 40 of the locking member 36 can be reliably performed, thereby preventing the vertical movement of the upper unit 14 . BRIEF DESCRIPTION OF THE DRAWINGS These and other objects, aspects, and embodiments of the present invention have been described in detail hereinabove with reference to the accompanying drawings in which: FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A plan view of a package of a wafer tray and a storage tray; FIG. 2 is a front view of one of the packaging boxes; FIG. 3 is an enlarged view showing the basic components of the wafer tray; 114832.doc -15- 200804153 4A is an enlarged perspective view showing the upper unit of the wafer disc; FIG. 4B is an enlarged perspective view showing the unit below the wafer disc; FIG. 4C is an enlarged perspective view showing the storage disc; Figure 6 is a cross-sectional view taken along line A_A of Figure 3, showing the upper unit being directly connected to the lower portion to form the wafer disk; Figure 7A is a diagram A cross-sectional view of the line 3·Α intercepted in 3, which shows:

Sectional unit; section - a cross-sectional view taken along line Α _ 图 in Fig. 3, which shows a cross-sectional view of the Α Δ 沿 沿 沿 沿 沿 沿 沿 沿 沿 沿 沿 沿 沿 沿 沿 沿 沿 沿Figure 8 is a plan view showing a storage disk of the wafer disk shown in Figure i. Figure 9A is a cross-sectional view taken along line B_B of Figure 3, a unit; α Figure 9B-- Figure 3C is a cross-sectional view taken along line B_B of Figure 3; / ^^ Figure 9C is a cross-sectional view taken along line Β Β in Figure 3, ▲ Saved; and • Item not included in the package Figure 10 is a display will contain A cross-sectional view of two wafer disks and a storage disk vertically combined. [Main component symbol description] 10 Packing box 11 Chip tray 114832.doc •16- 200804153

12 Storage tray 14 Upper unit 15 Lower unit 17 Main part 17A Peripheral area 17B Stepped portion 18 First projection 19 Second projection 20 Square rib 22 Groove 24 Disk 25 Absorbing portion 26 Reservoir 27 Frame 27A Step portion 29 Frame rib 30 Grid rib 32 Inlet/outlet groove 33 Circumferential wall 34 Flange 36 Locking element 37 Positioning projection 38 Cutting 40 Small projection 114832.doc -17 200804153

41 Interconnect Components 43 Grooves 44 Hooks 114832.doc -18-

Claims (1)

200804153, the scope of the patent application: a packaging box comprising: 1. two at least one wafer disc holding a plurality of semiconductor wafers; and/or a storage tray for storing the at least one wafer disc. The loading element and the lowering element form a plurality of semiconductor wafers to form the wafer disk.巧不项1的包# Each Ganshan shape, in J: thick production \ eight /, ... " 曰 盘 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 尽 尽 尽 尽 ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” The package I box ‘where the storage disk has a plurality of quarantines such as the quarantines and the like 4 is merged with the platter to maintain the state of the upper==amp; ::: The package of item 1 or 2 wherein the upper unit has the same structure as the lower unit I_ to cover the lower portion using the upper unit. 5. The package of claim _ wherein the plurality of semiconductor wafers are further held between the upper unit and the lower unit of the other package when assembled in tandem with the other package. 6. The package of claim 1 or 2 wherein the plurality of semiconductor wafers are individually encapsulated in a surface mount wafer package. 114832.doc