TW200802922A - Substrate for mounting light emitting element and manufacturing method thereof, light emitting element module and manufacturing method thereof, display apparatus, illumination apparatus, and traffic signal device - Google Patents

Substrate for mounting light emitting element and manufacturing method thereof, light emitting element module and manufacturing method thereof, display apparatus, illumination apparatus, and traffic signal device

Info

Publication number
TW200802922A
TW200802922A TW095119604A TW95119604A TW200802922A TW 200802922 A TW200802922 A TW 200802922A TW 095119604 A TW095119604 A TW 095119604A TW 95119604 A TW95119604 A TW 95119604A TW 200802922 A TW200802922 A TW 200802922A
Authority
TW
Taiwan
Prior art keywords
light emitting
emitting element
manufacturing
substrate
mounting
Prior art date
Application number
TW095119604A
Other languages
English (en)
Other versions
TWI304659B (en
Inventor
Masakazu Ohashi
Ken-Ichi Uruga
Masanori Ito
Original Assignee
Fujikura Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Ltd filed Critical Fujikura Ltd
Publication of TW200802922A publication Critical patent/TW200802922A/zh
Application granted granted Critical
Publication of TWI304659B publication Critical patent/TWI304659B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
TW095119604A 2004-11-19 2006-06-02 Substrate for mounting light emitting element and manufacturing method thereof, light emitting element module and manufacturing method thereof, display apparatus, illumination apparatus, and traffic signal device TWI304659B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004336132A JP4037404B2 (ja) 2004-11-19 2004-11-19 発光素子実装用基板とその製造方法

Publications (2)

Publication Number Publication Date
TW200802922A true TW200802922A (en) 2008-01-01
TWI304659B TWI304659B (en) 2008-12-21

Family

ID=36627197

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095119604A TWI304659B (en) 2004-11-19 2006-06-02 Substrate for mounting light emitting element and manufacturing method thereof, light emitting element module and manufacturing method thereof, display apparatus, illumination apparatus, and traffic signal device

Country Status (2)

Country Link
JP (1) JP4037404B2 (zh)
TW (1) TWI304659B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI398026B (zh) * 2010-04-28 2013-06-01 Advanced Optoelectronic Tech 發光元件及其模組
TWI501373B (zh) * 2012-06-06 2015-09-21 Cmsc Inc 具線路佈局之預注成形模穴式立體封裝模組

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7866853B2 (en) 2004-11-19 2011-01-11 Fujikura Ltd. Light-emitting element mounting substrate and manufacturing method thereof, light-emitting element module and manufacturing method thereof, display device, lighting device, and traffic light
JP4037423B2 (ja) * 2005-06-07 2008-01-23 株式会社フジクラ 発光素子実装用ホーロー基板の製造方法
JP4091063B2 (ja) 2005-06-07 2008-05-28 株式会社フジクラ 発光素子実装用基板および発光素子モジュール
EP1890343A4 (en) 2005-06-07 2014-04-23 Fujikura Ltd SUBSTRATE ON ILLUMINATING ELEMENT INSTALLATION, ILLUMINATING ELEMENT MODULE, ILLUMINATION DEVICE, DISPLAY AND TRAFFIC SIGNALING DEVICE
JP5054331B2 (ja) * 2005-06-30 2012-10-24 パナソニック株式会社 Ｌｅｄを用いた照明器具
CN100565948C (zh) 2005-06-30 2009-12-02 松下电工株式会社 发光装置
CN101501870B (zh) * 2006-05-31 2012-10-31 株式会社藤仓 发光元件安装用基板、发光元件模块以及显示装置
TW200843135A (en) * 2007-04-23 2008-11-01 Augux Co Ltd Method of packaging light emitting diode with high heat-dissipating efficiency and the structure thereof
JP2009038202A (ja) * 2007-08-01 2009-02-19 Fujikura Ltd 発光素子実装用基板、発光素子モジュール、照明装置、表示装置及び交通信号機
TW201110430A (en) * 2009-09-04 2011-03-16 yi-zhang Chen Heat dissipation substrate of light-emitting diode and its manufacturing method thereof
KR100986397B1 (ko) 2010-02-08 2010-10-08 엘지이노텍 주식회사 발광 장치
TWI412163B (zh) * 2010-10-18 2013-10-11 Advanced Optoelectronic Tech 發光二極體封裝結構及其製造方法
TWI490426B (zh) * 2011-07-29 2015-07-01 Light emitting device
KR101309255B1 (ko) * 2012-04-06 2013-10-14 유트로닉스주식회사 자동차 라이트용 엘이디 어레이 모듈의 제조방법
CN110010741A (zh) * 2019-03-13 2019-07-12 惠州市长方照明节能科技有限公司 一种新型的高流明led支架

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI398026B (zh) * 2010-04-28 2013-06-01 Advanced Optoelectronic Tech 發光元件及其模組
TWI501373B (zh) * 2012-06-06 2015-09-21 Cmsc Inc 具線路佈局之預注成形模穴式立體封裝模組

Also Published As

Publication number Publication date
TWI304659B (en) 2008-12-21
JP4037404B2 (ja) 2008-01-23
JP2006147865A (ja) 2006-06-08

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees