TW200802663A - Inspection method, inspection device, and control program - Google Patents

Inspection method, inspection device, and control program

Info

Publication number
TW200802663A
TW200802663A TW096105496A TW96105496A TW200802663A TW 200802663 A TW200802663 A TW 200802663A TW 096105496 A TW096105496 A TW 096105496A TW 96105496 A TW96105496 A TW 96105496A TW 200802663 A TW200802663 A TW 200802663A
Authority
TW
Taiwan
Prior art keywords
electrode
inspection
control program
probes
prescribed value
Prior art date
Application number
TW096105496A
Other languages
English (en)
Other versions
TWI333679B (zh
Inventor
Takanori Hyakudomi
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200802663A publication Critical patent/TW200802663A/zh
Application granted granted Critical
Publication of TWI333679B publication Critical patent/TWI333679B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
TW096105496A 2006-02-24 2007-02-14 Inspection method, inspection device, and control program TW200802663A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006048024A JP5108238B2 (ja) 2006-02-24 2006-02-24 検査方法、検査装置及び制御プログラム

Publications (2)

Publication Number Publication Date
TW200802663A true TW200802663A (en) 2008-01-01
TWI333679B TWI333679B (zh) 2010-11-21

Family

ID=38437247

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096105496A TW200802663A (en) 2006-02-24 2007-02-14 Inspection method, inspection device, and control program

Country Status (5)

Country Link
US (1) US7679387B2 (zh)
JP (1) JP5108238B2 (zh)
KR (1) KR101019238B1 (zh)
TW (1) TW200802663A (zh)
WO (1) WO2007097207A1 (zh)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4841737B2 (ja) 2000-08-21 2011-12-21 東京エレクトロン株式会社 検査方法及び検査装置
JP2002071718A (ja) * 2000-08-25 2002-03-12 Hitachi Ltd 半導体検査装置および半導体装置の製造方法
JP2004093451A (ja) * 2002-09-02 2004-03-25 Tokyo Electron Ltd プローブ方法及びプローブ装置
JP4456325B2 (ja) * 2002-12-12 2010-04-28 東京エレクトロン株式会社 検査方法及び検査装置
JP4387125B2 (ja) * 2003-06-09 2009-12-16 東京エレクトロン株式会社 検査方法及び検査装置
JP2005037199A (ja) * 2003-07-18 2005-02-10 Yamaha Corp プローブユニット、導通試験方法及びその製造方法
JPWO2006106876A1 (ja) * 2005-03-31 2008-09-11 株式会社オクテック 微小構造体のプローブカード、微小構造体の検査装置、検査方法およびコンピュータプログラム

Also Published As

Publication number Publication date
KR20080085224A (ko) 2008-09-23
JP2007227714A (ja) 2007-09-06
KR101019238B1 (ko) 2011-03-04
JP5108238B2 (ja) 2012-12-26
WO2007097207A1 (ja) 2007-08-30
US7679387B2 (en) 2010-03-16
US20090002008A1 (en) 2009-01-01
TWI333679B (zh) 2010-11-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees