TW200801860A - Drawing system - Google Patents

Drawing system

Info

Publication number
TW200801860A
TW200801860A TW096121152A TW96121152A TW200801860A TW 200801860 A TW200801860 A TW 200801860A TW 096121152 A TW096121152 A TW 096121152A TW 96121152 A TW96121152 A TW 96121152A TW 200801860 A TW200801860 A TW 200801860A
Authority
TW
Taiwan
Prior art keywords
pair
sides
deformation
rectangle
dmd
Prior art date
Application number
TW096121152A
Other languages
Chinese (zh)
Other versions
TWI430052B (en
Inventor
Hisaji Miyoshi
Original Assignee
Orc Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Orc Mfg Co Ltd filed Critical Orc Mfg Co Ltd
Publication of TW200801860A publication Critical patent/TW200801860A/en
Application granted granted Critical
Publication of TWI430052B publication Critical patent/TWI430052B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70091—Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
    • G03F7/70116—Off-axis setting using a programmable means, e.g. liquid crystal display [LCD], digital micromirror device [DMD] or pupil facets
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70283—Mask effects on the imaging process
    • G03F7/70291—Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

The invention is to form a drawing pattern with high accuracy by appropriately correcting a drawing position according to deformation of a drawing object such as a substrate. In a drawing device using an optical modulation element such as a DMD (digital micromirror device), positions of four alignment holes are measured by using a CCD. Position coordinates of drawing data, that is, a drawing position is shifted along X and Y directions with respect to a pair of sides TA1, TA2 and a pair of sides TB1, TB1 of a rectangle Z after deformation while keeping the distance ratios (m:n and M:N) of the position from a pair of sides TA1, TA2 and from a pair of sides TB1, TB1 of a reference rectangle Z0.
TW096121152A 2006-06-26 2007-06-12 A drawing system, a correction device for a tracing data, a method of manufacturing the substrate, a computer program product TWI430052B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006174884A JP5336036B2 (en) 2006-06-26 2006-06-26 Drawing system

Publications (2)

Publication Number Publication Date
TW200801860A true TW200801860A (en) 2008-01-01
TWI430052B TWI430052B (en) 2014-03-11

Family

ID=39007853

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096121152A TWI430052B (en) 2006-06-26 2007-06-12 A drawing system, a correction device for a tracing data, a method of manufacturing the substrate, a computer program product

Country Status (4)

Country Link
JP (1) JP5336036B2 (en)
KR (1) KR101446484B1 (en)
CN (1) CN101097407B (en)
TW (1) TWI430052B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI579649B (en) * 2011-04-05 2017-04-21 尼康股份有限公司 Exposure method, exposure apparatus and device manufacturing method

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8271919B2 (en) 2009-10-30 2012-09-18 Ibiden Co., Ltd. Method for correcting image rendering data, method for rendering image, method for manufacturing wiring board, and image rendering system
JP2012008243A (en) * 2010-06-23 2012-01-12 Hitachi High-Technologies Corp Exposure device and exposure method, display panel board manufacturing apparatus, and display panel board manufacturing method
KR101137446B1 (en) * 2010-07-22 2012-04-20 주식회사 이오테크닉스 method for real-time correction of digital lithographic pattern and apparatus thereof
JP5496041B2 (en) * 2010-09-30 2014-05-21 大日本スクリーン製造株式会社 Displacement calculation method, drawing data correction method, drawing method, and drawing apparatus
JP5731864B2 (en) * 2011-03-18 2015-06-10 株式会社Ｓｃｒｅｅｎホールディングス Drawing data correction device and drawing device
JP2015184315A (en) * 2014-03-20 2015-10-22 株式会社Ｓｃｒｅｅｎホールディングス Data correction device, drawing device, data correction method, and drawing method
CN106773547B (en) * 2017-01-13 2019-07-12 西安电子科技大学 It is a kind of based on the full-automatic maskless lithography method calibrated automatically

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55154740A (en) * 1979-05-23 1980-12-02 Hitachi Ltd Wire bonding device
JP2001168013A (en) * 1999-12-10 2001-06-22 Nec Corp Electron beam exposing method
JP4505270B2 (en) * 2003-07-02 2010-07-21 富士フイルム株式会社 Image recording apparatus, image recording method, and program
JP2005157326A (en) * 2003-10-29 2005-06-16 Fuji Photo Film Co Ltd Image recording apparatus and method
JP2005221806A (en) * 2004-02-06 2005-08-18 Fuji Photo Film Co Ltd Image recording apparatus, and method for manufacturing board
CN1766738A (en) * 2004-09-30 2006-05-03 富士胶片株式会社 Method and apparatus for recording images on deformed image-recordable object

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI579649B (en) * 2011-04-05 2017-04-21 尼康股份有限公司 Exposure method, exposure apparatus and device manufacturing method

Also Published As

Publication number Publication date
CN101097407A (en) 2008-01-02
KR101446484B1 (en) 2014-10-30
TWI430052B (en) 2014-03-11
JP5336036B2 (en) 2013-11-06
KR20070122369A (en) 2007-12-31
JP2008003441A (en) 2008-01-10
CN101097407B (en) 2011-01-26

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