TW200801803A - Negative photosensitive resin composition, method of forming pattern and electronic part - Google Patents
Negative photosensitive resin composition, method of forming pattern and electronic partInfo
- Publication number
- TW200801803A TW200801803A TW95121989A TW95121989A TW200801803A TW 200801803 A TW200801803 A TW 200801803A TW 95121989 A TW95121989 A TW 95121989A TW 95121989 A TW95121989 A TW 95121989A TW 200801803 A TW200801803 A TW 200801803A
- Authority
- TW
- Taiwan
- Prior art keywords
- resin composition
- photosensitive resin
- negative photosensitive
- electronic part
- forming pattern
- Prior art date
Links
Landscapes
- Materials For Photolithography (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
A negative photosensitive resin composition having fine efficiency of sensitivity and resolution, a pattern-forming method having fine efficiency of sensitivity, resolution, heat resistance and good patterns are provided; and further, an electronic part having good patterns and high reliability is provided. A crosslinking agent produced by performing a crosslinking or a polymerization with acid reaction in the negative photosensitive resin composition is a compound which contains at least a methylol group or an alkoxy alkyl group in a molecular. In a preferred embodiment of the present invention, the crosslinking agent is a compound which is represented by the below formula (1): In the formula (1), "X" represents a single bond or a 1 to 4 valence organic group; "R1" and "R2" respectively represent a H atom or 1 valence organic group; "n" is an integer of 1 to 4, and "p" and "q" are integers of 0 to 4 respectively.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW095121989A TWI477906B (en) | 2006-06-20 | 2006-06-20 | Negative photosensitive resin composition, method of forming pattern and electronic part |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW095121989A TWI477906B (en) | 2006-06-20 | 2006-06-20 | Negative photosensitive resin composition, method of forming pattern and electronic part |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200801803A true TW200801803A (en) | 2008-01-01 |
TWI477906B TWI477906B (en) | 2015-03-21 |
Family
ID=44765198
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095121989A TWI477906B (en) | 2006-06-20 | 2006-06-20 | Negative photosensitive resin composition, method of forming pattern and electronic part |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI477906B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111217999A (en) * | 2020-02-20 | 2020-06-02 | 哈尔滨工程大学 | Environment-friendly preparation method and product of flexible polyimide heat insulation foam |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002169286A (en) * | 2000-11-30 | 2002-06-14 | Hitachi Chemical Dupont Microsystems Ltd | Photosensitive polymer composition, method for manufacturing pattern and electronic parts |
JP2003121998A (en) * | 2001-10-11 | 2003-04-23 | Hitachi Chemical Dupont Microsystems Ltd | Photosensitive polymer composition, method for producing pattern and electronic parts |
EP1636649B1 (en) * | 2003-06-06 | 2014-08-13 | FujiFilm Electronic Materials USA, Inc. | Novel photosensitive resin compositions |
US8871422B2 (en) * | 2005-09-22 | 2014-10-28 | Hitachi Chemical Dupont Microsystems Ltd. | Negative-type photosensitive resin composition, pattern forming method and electronic parts |
-
2006
- 2006-06-20 TW TW095121989A patent/TWI477906B/en active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111217999A (en) * | 2020-02-20 | 2020-06-02 | 哈尔滨工程大学 | Environment-friendly preparation method and product of flexible polyimide heat insulation foam |
CN111217999B (en) * | 2020-02-20 | 2022-07-26 | 哈尔滨工程大学 | Environment-friendly preparation method of flexible polyimide heat insulation foam and product |
Also Published As
Publication number | Publication date |
---|---|
TWI477906B (en) | 2015-03-21 |
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