TW200801803A - Negative photosensitive resin composition, method of forming pattern and electronic part - Google Patents

Negative photosensitive resin composition, method of forming pattern and electronic part

Info

Publication number
TW200801803A
TW200801803A TW95121989A TW95121989A TW200801803A TW 200801803 A TW200801803 A TW 200801803A TW 95121989 A TW95121989 A TW 95121989A TW 95121989 A TW95121989 A TW 95121989A TW 200801803 A TW200801803 A TW 200801803A
Authority
TW
Taiwan
Prior art keywords
resin composition
photosensitive resin
negative photosensitive
electronic part
forming pattern
Prior art date
Application number
TW95121989A
Other languages
Chinese (zh)
Other versions
TWI477906B (en
Inventor
Tomonori Minegishi
Original Assignee
Hitachi Chem Dupont Microsys
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chem Dupont Microsys filed Critical Hitachi Chem Dupont Microsys
Priority to TW095121989A priority Critical patent/TWI477906B/en
Publication of TW200801803A publication Critical patent/TW200801803A/en
Application granted granted Critical
Publication of TWI477906B publication Critical patent/TWI477906B/en

Links

Landscapes

  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Materials For Photolithography (AREA)

Abstract

A negative photosensitive resin composition having fine efficiency of sensitivity and resolution, a pattern-forming method having fine efficiency of sensitivity, resolution, heat resistance and good patterns are provided; and further, an electronic part having good patterns and high reliability is provided. A crosslinking agent produced by performing a crosslinking or a polymerization with acid reaction in the negative photosensitive resin composition is a compound which contains at least a methylol group or an alkoxy alkyl group in a molecular. In a preferred embodiment of the present invention, the crosslinking agent is a compound which is represented by the below formula (1): In the formula (1), "X" represents a single bond or a 1 to 4 valence organic group; "R1" and "R2" respectively represent a H atom or 1 valence organic group; "n" is an integer of 1 to 4, and "p" and "q" are integers of 0 to 4 respectively.
TW095121989A 2006-06-20 2006-06-20 Negative photosensitive resin composition, method of forming pattern and electronic part TWI477906B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW095121989A TWI477906B (en) 2006-06-20 2006-06-20 Negative photosensitive resin composition, method of forming pattern and electronic part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095121989A TWI477906B (en) 2006-06-20 2006-06-20 Negative photosensitive resin composition, method of forming pattern and electronic part

Publications (2)

Publication Number Publication Date
TW200801803A true TW200801803A (en) 2008-01-01
TWI477906B TWI477906B (en) 2015-03-21

Family

ID=44765198

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095121989A TWI477906B (en) 2006-06-20 2006-06-20 Negative photosensitive resin composition, method of forming pattern and electronic part

Country Status (1)

Country Link
TW (1) TWI477906B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111217999A (en) * 2020-02-20 2020-06-02 哈尔滨工程大学 Environment-friendly preparation method and product of flexible polyimide heat insulation foam

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002169286A (en) * 2000-11-30 2002-06-14 Hitachi Chemical Dupont Microsystems Ltd Photosensitive polymer composition, method for manufacturing pattern and electronic parts
JP2003121998A (en) * 2001-10-11 2003-04-23 Hitachi Chemical Dupont Microsystems Ltd Photosensitive polymer composition, method for producing pattern and electronic parts
JP4464396B2 (en) * 2003-06-06 2010-05-19 フジフィルム・エレクトロニック・マテリアルズ・ユーエスエイ・インコーポレイテッド Novel photosensitive resin composition
US8871422B2 (en) * 2005-09-22 2014-10-28 Hitachi Chemical Dupont Microsystems Ltd. Negative-type photosensitive resin composition, pattern forming method and electronic parts

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111217999A (en) * 2020-02-20 2020-06-02 哈尔滨工程大学 Environment-friendly preparation method and product of flexible polyimide heat insulation foam
CN111217999B (en) * 2020-02-20 2022-07-26 哈尔滨工程大学 Environment-friendly preparation method of flexible polyimide heat insulation foam and product

Also Published As

Publication number Publication date
TWI477906B (en) 2015-03-21

Similar Documents

Publication Publication Date Title
TW200702916A (en) Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring board
PT2221666E (en) Positive-type photosensitive resin composition, method for production of resist pattern, and semiconductor device
TWI266147B (en) Novel photosensitive resin compositions
MY148552A (en) Photosensitive resin composition, photosensitive element comprising the same, method of forming resist pattern, and process for producing printed wiring board
DE602006002808D1 (en) HARDENABLE SILICONE COMPOSITION AND ELECTRONIC DEVICE MANUFACTURED THEREFROM
EP1806618A4 (en) Positive photosensitive insulating resin composition and cured product thereof
TW200725186A (en) Hardmask compositions for resist underlayer film and method for producing semiconductor integrated circuit device using the same
TW200734375A (en) Organosilane polymers, hardmask compositions including the same and methods of producing semiconductor devices using organosilane hardmask compositions
TW200801049A (en) Lactone-containing compound, polymer, resist composition, and patterning process
TW200700912A (en) Negative resist composition
ATE523562T1 (en) CURDABLE COMPOSITION
ATE444980T1 (en) ELECTRICALLY CONDUCTIVE POLYMERS AND METHOD FOR PRODUCING ELECTRICALLY CONDUCTIVE POLYMERS
TW200834240A (en) Positive photosensitive resin composition
WO2003010603A1 (en) Positive type radiosensitive composition and method for forming pattern
EP2078983A4 (en) Composition for formation of upper layer film, and method for formation of photoresist pattern
DE60116121D1 (en) IMIDATE-CONTAINING FLUOROPOLYMER COMPOSITIONS
TW200619239A (en) Positive resist composition and method for forming resist pattern
TW200611886A (en) New compound, polymer compound, resist composition and method for forming resist pattern
TW200500384A (en) Novel thiol compound, copolymer and method for producing the copolymer
TW200720328A (en) A phenol novolac resin having low softing point, method for producing the same and an epoxy resin composition using the phenol novolac resin
TW200634432A (en) Photosensitive resin composition for interplayer insulating film
TW200617034A (en) Polymer for resist, method of forming the same, resist composition and method of fabricting substrate formed pattern
ATE397576T1 (en) NEW PHENOLIC COMPOUNDS PRODUCED FROM DIALKOXYETHANALS, PROCESS FOR THEIR PRODUCTION AND THEIR APPLICATIONS
TW200628979A (en) Positive resist composition and manufacturing method of resist pattern
WO2008105138A1 (en) Polymerization catalyst for polythiourethane optical material, polymerizable composition containing the catalyst, optical material obtained from the composition, and method for producing the optical material