TW200746486A - Method and apparatus for repairing wire of circuit board - Google Patents

Method and apparatus for repairing wire of circuit board

Info

Publication number
TW200746486A
TW200746486A TW096100031A TW96100031A TW200746486A TW 200746486 A TW200746486 A TW 200746486A TW 096100031 A TW096100031 A TW 096100031A TW 96100031 A TW96100031 A TW 96100031A TW 200746486 A TW200746486 A TW 200746486A
Authority
TW
Taiwan
Prior art keywords
wire
circuit board
plasma
gas
particles
Prior art date
Application number
TW096100031A
Other languages
Chinese (zh)
Inventor
Masato Ikeda
Katsumi Tanaka
Original Assignee
Nihon Micronics Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Micronics Kk filed Critical Nihon Micronics Kk
Publication of TW200746486A publication Critical patent/TW200746486A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/161—Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nanotechnology (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Composite Materials (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Operations Research (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

To provide a method capable of easily repairing a wire of a wiring board by means of atmospheric plasma treatment. Fine metallic particles are supplied to a wire defective part of a circuit board to be repaired. Plasma gas from an atmospheric plasma generator employing oxidation gas as plasma generation gas is blown to the supplied particles. The blowing of the plasma gas applies annealing treatment to the metallic particles to integrate the particles with a wire.
TW096100031A 2006-03-20 2007-01-02 Method and apparatus for repairing wire of circuit board TW200746486A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006076738A JP4950532B2 (en) 2006-03-20 2006-03-20 Circuit board wiring repair method and apparatus

Publications (1)

Publication Number Publication Date
TW200746486A true TW200746486A (en) 2007-12-16

Family

ID=38632183

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096100031A TW200746486A (en) 2006-03-20 2007-01-02 Method and apparatus for repairing wire of circuit board

Country Status (3)

Country Link
JP (1) JP4950532B2 (en)
KR (1) KR100817567B1 (en)
TW (1) TW200746486A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010027660A (en) * 2008-07-15 2010-02-04 Micronics Japan Co Ltd Method and apparatus for repairing wire of circuit board
CN101646308B (en) * 2008-08-05 2011-09-21 富葵精密组件(深圳)有限公司 Circuit compensation system of circuit board and method for circuit compensation thereby
KR101055507B1 (en) * 2009-04-09 2011-08-08 삼성전기주식회사 Repair structure and repair method of pattern part

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63139756A (en) * 1986-12-02 1988-06-11 Alps Electric Co Ltd Manufacture of thermal head
JP2677086B2 (en) * 1991-11-22 1997-11-17 三菱電機株式会社 Defect repair method for phase shift mask
JP3312703B2 (en) * 1993-04-15 2002-08-12 大日本印刷株式会社 How to fix a phase shift photomask
JPH09181319A (en) * 1995-12-25 1997-07-11 Kyocera Corp Manufacture of thin film transistor
JPH09321413A (en) * 1996-05-30 1997-12-12 Hitachi Ltd Correction method of wiring on electronic circuit board and device therefor
JPH10270843A (en) * 1997-03-28 1998-10-09 Vacuum Metallurgical Co Ltd Method and device for repairing conductive pattern
JPH11145148A (en) * 1997-11-06 1999-05-28 Tdk Corp Apparatus and method for heat plasma annealing
CN1286349C (en) * 2002-02-20 2006-11-22 松下电工株式会社 Plasma processing device and plasma processing method
JP4932150B2 (en) * 2003-10-21 2012-05-16 株式会社半導体エネルギー研究所 Manufacturing method of semiconductor element

Also Published As

Publication number Publication date
KR100817567B1 (en) 2008-03-27
JP2007258213A (en) 2007-10-04
KR20070095183A (en) 2007-09-28
JP4950532B2 (en) 2012-06-13

Similar Documents

Publication Publication Date Title
ATE429799T1 (en) DEVICE FOR GENERATING A PLASMA JET
WO2011100322A3 (en) Laser-driven light source
WO2007120521A3 (en) Lazer-driven light source
WO2009063755A1 (en) Plasma processing apparatus and method for plasma processing semiconductor substrate
ES2616015T3 (en) Ozone production by adsorption using a noble gas additive
TW200719983A (en) Lithographic apparatus comprising an electrical discharge generator and method for cleaning an element of a lithographic apparatus
TW200616061A (en) Laser beam processing apparatus for processing semiconductor wafer in production of semiconductor devices, laser beam processing method executed therein, and such semiconductor wafer processed thereby
TW200746486A (en) Method and apparatus for repairing wire of circuit board
TW201130032A (en) Plasma processing apparatus and plasma processing method
TW200509246A (en) Plasma apparatus, gas distribution assembly for a plasma apparatus and processes therewith
WO2009044693A1 (en) Plasma processing apparatus and plasma processing method
WO2010022871A8 (en) Non-thermal plasma for wound treatment and associated apparatus and method
WO2009126910A3 (en) Laser scribe inspection methods and systems
MY139985A (en) Gas shower plate for plasma processing apparatus
GB2453302B (en) Electron beam generating apparatus and methods of forming an emitter
TW200801224A (en) Apparatus and method for synthesizing carbon nanotube film
GB2464802B (en) Apparatus for breathing having a circuit for breathing gas and method of regulating such an apparatus
TW200746295A (en) Etching apparatus and etching method for substrate bevel
TW200630505A (en) Apparatus for producing carbon film and production method therefor
NL1036272A1 (en) Radiation source, lithographic apparatus and device manufacturing method.
MX336459B (en) Method and device for generating electricity and gypsum from waste gases containing hydrogen sulfide.
TW200729285A (en) Gas-removal processing device
UA48850U (en) apparatus for processing gases, particularly for drying natural or biogas
TW200643179A (en) Method and apparatus for the recovery of the secondary metallurgy (LF) slag and its recycling in the steel production process by means of electric arc furnace
TW200701346A (en) Plasma processing apparatus