TW200746470A - Luminescence element - Google Patents

Luminescence element

Info

Publication number
TW200746470A
TW200746470A TW096110699A TW96110699A TW200746470A TW 200746470 A TW200746470 A TW 200746470A TW 096110699 A TW096110699 A TW 096110699A TW 96110699 A TW96110699 A TW 96110699A TW 200746470 A TW200746470 A TW 200746470A
Authority
TW
Taiwan
Prior art keywords
luminescence element
indicates
light
luminescence
chip
Prior art date
Application number
TW096110699A
Other languages
English (en)
Other versions
TWI424586B (zh
Inventor
Sadanori Yamanaka
Yoshinobu Ono
Kazumasa Ueda
Original Assignee
Sumitomo Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Co filed Critical Sumitomo Chemical Co
Publication of TW200746470A publication Critical patent/TW200746470A/zh
Application granted granted Critical
Publication of TWI424586B publication Critical patent/TWI424586B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H01L33/22—Roughened surfaces, e.g. at the interface between epitaxial layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Devices (AREA)
  • Led Device Packages (AREA)
  • Luminescent Compositions (AREA)
TW096110699A 2006-03-30 2007-03-28 發光元件 TWI424586B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006093733A JP2007273506A (ja) 2006-03-30 2006-03-30 化合物半導体発光素子

Publications (2)

Publication Number Publication Date
TW200746470A true TW200746470A (en) 2007-12-16
TWI424586B TWI424586B (zh) 2014-01-21

Family

ID=38609398

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096110699A TWI424586B (zh) 2006-03-30 2007-03-28 發光元件

Country Status (8)

Country Link
US (1) US8097887B2 (zh)
JP (1) JP2007273506A (zh)
KR (1) KR101348470B1 (zh)
CN (1) CN101449398B (zh)
DE (1) DE112007000750T5 (zh)
GB (1) GB2451365A (zh)
TW (1) TWI424586B (zh)
WO (1) WO2007119633A1 (zh)

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JP2008108952A (ja) * 2006-10-26 2008-05-08 Matsushita Electric Ind Co Ltd 半導体発光装置および半導体発光装置の製造方法
WO2010027648A1 (en) 2008-09-04 2010-03-11 3M Innovative Properties Company I i-vi mqw vcsel on a heat sink optically pumped by a gan ld
CN102197500A (zh) * 2008-09-04 2011-09-21 3M创新有限公司 具有高纵横比的单色光源
WO2010027581A1 (en) 2008-09-04 2010-03-11 3M Innovative Properties Company Monochromatic light source
EP2356701A2 (en) * 2008-11-13 2011-08-17 3M Innovative Properties Company Electrically pixelated luminescent device incorporating optical elements
WO2011007816A1 (ja) * 2009-07-15 2011-01-20 三菱化学株式会社 半導体発光素子、半導体発光装置、半導体発光素子の製造方法、および半導体発光装置の製造方法
US9293644B2 (en) 2009-09-18 2016-03-22 Soraa, Inc. Power light emitting diode and method with uniform current density operation
US10581020B2 (en) 2011-02-08 2020-03-03 Vitro Flat Glass Llc Light extracting substrate for organic light emitting diode
CN103180974A (zh) 2011-06-27 2013-06-26 松下电器产业株式会社 氮化物类半导体发光元件
CN104969371A (zh) * 2013-02-11 2015-10-07 皇家飞利浦有限公司 具有波长转换材料的密闭密封的led模块
WO2016002359A1 (ja) * 2014-07-03 2016-01-07 ソニー株式会社 発光素子及び発光素子組立体
JP6622009B2 (ja) * 2015-06-11 2019-12-18 浜松ホトニクス株式会社 紫外光発生用ターゲット及びその製造方法
US9905466B2 (en) * 2016-06-28 2018-02-27 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer partitioning method and device formed
CN108538784B (zh) * 2018-06-19 2023-12-01 南通中铁华宇电气有限公司 一种图形化外延结构激光剥离装置

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JP4410391B2 (ja) * 2000-06-22 2010-02-03 ダイセル化学工業株式会社 積層フィルム
JP2002223000A (ja) * 2001-01-25 2002-08-09 Ricoh Co Ltd 光プリンタヘッド及びその製造方法
JP2002319704A (ja) * 2001-04-23 2002-10-31 Matsushita Electric Works Ltd Ｌｅｄチップ
JP2002319705A (ja) * 2001-04-23 2002-10-31 Matsushita Electric Works Ltd Ｌｅｄ装置
JP4075321B2 (ja) * 2001-04-24 2008-04-16 日亜化学工業株式会社 集積型窒化物半導体発光素子
WO2002099474A1 (fr) * 2001-06-01 2002-12-12 Daicel Chemical Industries, Ltd. Film de diffusion de lumiere, dispositif d'eclairage de surface et dispositif d'affichage a cristaux liquides
WO2003005509A1 (fr) * 2001-07-02 2003-01-16 Furukawa Electric Co.,Ltd Module laser a semiconducteur, amplificateur de lumiere et procede de production de module laser a semiconducteur
US20030118750A1 (en) * 2001-12-14 2003-06-26 Eastman Kodak Company Microvoided light diffuser containing optical contact layer
US20030224303A1 (en) * 2002-05-07 2003-12-04 Fuji Photo Film Co., Ltd. Solid dispersion, process of producing solid dispersion, and heat developable photosensitive material
US6900941B2 (en) * 2002-05-16 2005-05-31 Eastman Kodak Company Light diffuser with colored variable diffusion
JP4046118B2 (ja) * 2002-05-28 2008-02-13 松下電工株式会社 発光素子、それを用いた発光装置及び面発光照明装置
JP2004095765A (ja) * 2002-08-30 2004-03-25 Nichia Chem Ind Ltd 発光装置およびその製造方法
US6869812B1 (en) * 2003-05-13 2005-03-22 Heng Liu High power AllnGaN based multi-chip light emitting diode
EP1658642B1 (en) * 2003-08-28 2014-02-26 Panasonic Corporation Semiconductor light emitting device, light emitting module, lighting apparatus, display element and manufacturing method of semiconductor light emitting device
JP4160881B2 (ja) * 2003-08-28 2008-10-08 松下電器産業株式会社 半導体発光装置、発光モジュール、照明装置、および半導体発光装置の製造方法
JP2006019459A (ja) * 2004-07-01 2006-01-19 Hitachi Cable Ltd 発光ダイオード用エピタキシャルウェハ
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JP4685386B2 (ja) 2004-08-31 2011-05-18 株式会社リコー 画像表示装置、プロジェクタ装置、及び画像観察装置
US7170100B2 (en) * 2005-01-21 2007-01-30 Luminus Devices, Inc. Packaging designs for LEDs
US7692207B2 (en) * 2005-01-21 2010-04-06 Luminus Devices, Inc. Packaging designs for LEDs
CN102585810A (zh) * 2005-02-28 2012-07-18 电气化学工业株式会社 荧光体及其制造方法及使用了该荧光体的发光元件
US7598518B2 (en) * 2005-03-07 2009-10-06 Ricoh Company, Ltd. Organic transistor with light emission, organic transistor unit and display device incorporating the organic transistor
JP4837297B2 (ja) * 2005-03-09 2011-12-14 富士フイルム株式会社 遮光画像付き基板及び遮光画像の形成方法、転写材料、カラーフィルター、並びに表示装置
US20060204745A1 (en) * 2005-03-14 2006-09-14 Jones Clint L Light management films with zirconia particles
WO2006101218A1 (en) * 2005-03-22 2006-09-28 Fujifilm Corporation Antireflection film, polarizing plate, and image display device
US7391059B2 (en) * 2005-10-17 2008-06-24 Luminus Devices, Inc. Isotropic collimation devices and related methods
CN101326053A (zh) * 2005-12-05 2008-12-17 3M创新有限公司 超吸收性纳米粒子组合物
KR20080106402A (ko) * 2006-01-05 2008-12-05 일루미텍스, 인크. Ｌｅｄ로부터 광을 유도하기 위한 개별 광학 디바이스

Also Published As

Publication number Publication date
CN101449398B (zh) 2011-02-02
WO2007119633A1 (ja) 2007-10-25
DE112007000750T5 (de) 2009-01-29
JP2007273506A (ja) 2007-10-18
KR20080112312A (ko) 2008-12-24
CN101449398A (zh) 2009-06-03
KR101348470B1 (ko) 2014-01-06
GB0818659D0 (en) 2008-12-03
US20100059772A1 (en) 2010-03-11
TWI424586B (zh) 2014-01-21
GB2451365A (en) 2009-01-28
US8097887B2 (en) 2012-01-17

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees